CN114289884A - Laser-induced plasma processing device and method by utilizing bimetal alloy target - Google Patents
Laser-induced plasma processing device and method by utilizing bimetal alloy target Download PDFInfo
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- CN114289884A CN114289884A CN202111675160.2A CN202111675160A CN114289884A CN 114289884 A CN114289884 A CN 114289884A CN 202111675160 A CN202111675160 A CN 202111675160A CN 114289884 A CN114289884 A CN 114289884A
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Abstract
The invention discloses a processing device and a method for laser-induced plasma by utilizing a bimetallic alloy target, wherein the processing device comprises a laser, a lens assembly, the bimetallic alloy target, a workbench and a liftable clamp; the transparent workpiece and the bimetal alloy target material are arranged in an up-down spaced manner; a laser beam emitted by the laser is radiated and focused on the bimetal alloy target through the lens component and the transparent workpiece and interacts with the bimetal alloy target to generate plasma, the bimetal alloy target comprises inert metal and active metal, the plasma corresponding to the inert metal etches and processes the transparent workpiece material through a physical process, and the plasma corresponding to the active metal etches and processes the transparent workpiece material through a physical process and a chemical reaction. It has the following advantages: the method has great application prospect in the field of micro-nano manufacturing, can meet the requirement of high precision machining quality in industry, and can solve the problem of machining of special-shaped workpieces made of transparent hard and brittle materials.
Description
Technical Field
The invention relates to the technical field of precision machining methods, in particular to a device and a method for machining plasma by utilizing laser induction of a bimetallic alloy target.
Background
Due to the special requirements of the industrial field on some high-precision parts, some parts often have irregular shapes and various sizes, a plurality of working procedures are needed by using the traditional cutter cutting method, the processing efficiency is low due to excessive processing steps, the material deformation is easily caused by repeated clamping, and the requirements on the size and shape precision cannot be met.
The transparent hard and brittle material has the characteristics of high hardness, high brittleness, low fracture toughness and the like, the elastic limit and the strength of the material are very close, the material belongs to a difficult-to-machine material, the machined surface of the material is easy to generate micro cracks, a subsurface damaged layer and other defects, the heat conductivity of the transparent hard and brittle material is poor, the temperature gradient of a heat affected zone is high, and the heat cracks are easy to generate in the machining process. The traditional processing method of the transparent hard and brittle material, such as cutting, grinding and polishing, can generate cracks and pits on the surface of a workpiece, has low processing precision and efficiency, and can not meet the requirement of high-precision processing of the material.
With the continuous development of lasers, the generation technology of ultrashort pulse laser is mature, ultrafine micromachining (submicron to nanometer scale) can be realized, precise three-dimensional machining inside transparent materials can be realized, the thermal influence is small, and the range of the machined materials is wide. Compared with long pulse laser, the processing quality of the microstructure processed by the ultrashort pulse laser is greatly improved, but the processing cost is high.
Focused ion beam processing technology has been regarded as the most potential micro-nano processing means due to its high resolution processing characteristics. However, the low processing efficiency of the single-point processing mode seriously hinders the development, and the processing process needs a vacuum environment, so that the cost is high, the quality of the processed surface is limited, the process is expensive, and the time consumption is high, so that the method is not widely applied to the industry as a micro-nano processing means at the present stage.
CN201110120841.2 discloses a method and an apparatus for implanting metal ions into a surface layer of a substrate by separating metal ions in a high-energy pulse laser-induced plasma, which can effectively achieve metal ion implantation, but requires a vacuum environment and a complex workpiece system in the processing process, has high processing cost, and is not easy to achieve material removal processing.
CN201710850262.0 discloses a method for processing a non-metallic material by laser-induced plasma, which can effectively obtain relatively high quality of the processed surface of the non-metallic material, but the method can only be used for processing microgrooves and microchannels, can not realize profiling processing of special parts, has low processing efficiency, and is not easy to realize high-efficiency removal of the material.
Disclosure of Invention
The invention provides a processing device and a processing method for laser-induced plasma by using a bimetallic alloy target, which overcome the defects in the background technology.
One of the technical schemes adopted by the invention for solving the technical problems is as follows: the processing device is used for processing a transparent workpiece (6) by utilizing laser induction plasma of the bimetal alloy target, and comprises a laser (2), a lens component, the bimetal alloy target (7), a workbench (8) and a lifting clamp (9); the bimetal alloy target (7) is fixedly arranged on a workbench (8), the lifting fixture (9) is arranged on the workbench (8) and is connected with the transparent workpiece (6) to drive the transparent workpiece (6) to lift, and the transparent workpiece (6) and the bimetal alloy target (7) are arranged in a vertically spaced manner; a laser beam (3) emitted by the laser (2) is radiated and focused on a bimetal alloy target (7) through a lens component and a transparent workpiece (6) and interacts with the bimetal alloy target (7) to generate plasma, the bimetal alloy target (7) comprises inert metal and active metal, the plasma corresponding to the inert metal etches and processes the material of the transparent workpiece (6) through a physical process, and the plasma corresponding to the active metal etches and processes the material of the transparent workpiece (6) through a physical process and a chemical reaction.
In one embodiment: the lens assembly comprises a scanning galvanometer (4) and a focusing lens (5), and a laser beam (3) emitted by the laser (2) passes through the scanning galvanometer (4) and the focusing lens (5) and then reaches a transparent workpiece (6).
In one embodiment: the laser device is characterized by further comprising a computer control system (1), wherein the computer control system (1) is connected with the laser device (2) and the lifting clamp (9).
In one embodiment: the distance between the transparent workpiece (6) and the bimetal alloy target (7) is 0.05-0.5 mm.
In one embodiment: the inert metal does not react chemically with the material of the transparent workpiece (6), and the active metal reacts chemically with the material of the transparent workpiece (6).
In one embodiment: the interaction is that laser beams (3) are radiated and focused on the upper surface of a bimetal alloy target (7), the bimetal alloy target (7) absorbs laser energy, the upper surface of the bimetal alloy target (7) is heated and vaporized, vaporized particles continue to absorb the laser energy, when the laser energy is larger than the breakdown threshold of the bimetal alloy target (7) material, the bimetal alloy target (7) is broken down to form plasma, and the plasma continues to absorb the laser energy to generate local explosion and etch or deposit on the lower surface of a transparent workpiece (6).
The second technical scheme adopted by the invention for solving the technical problems is as follows: the processing method of laser-induced plasma by using the bimetal alloy target comprises the following steps:
installing a transparent workpiece (6) on a lifting clamp (9), and installing a bimetal alloy target (7) on a workbench (8), wherein the bimetal alloy target (7) comprises inert metal and active metal;
the laser (2) emits a laser beam (3), the laser beam (3) emitted by the laser (2) is radiated and focused on the bimetal alloy target (7) through the lens component and the transparent workpiece (6) and interacts with the bimetal alloy target (7) to generate plasma, the plasma corresponding to the inert metal etches and processes the material of the transparent workpiece (6) through a physical process, and the plasma corresponding to the active metal etches and processes the material of the transparent workpiece (6) through a physical process and a chemical reaction.
Compared with the background technology, the technical scheme has the following advantages:
a laser beam emitted by a laser device is radiated and focused on the bimetal alloy target through the lens component and the transparent workpiece and interacts with the bimetal alloy target to generate plasma, the plasma corresponding to the inert metal etches the transparent workpiece material through a physical process, and the plasma corresponding to the active metal etches the transparent workpiece material through a physical process and a chemical reaction.
Drawings
The invention is further described with reference to the following figures and detailed description.
Fig. 1 is a schematic structural diagram of a laser-induced plasma processing apparatus using a bimetal alloy target.
FIG. 2 is a diagram showing the actual processing effect of micro-grooves in an example of the application of the laser-induced plasma processing apparatus using the bimetal alloy target.
Detailed Description
Referring to fig. 1, the device for processing a transparent workpiece 6 made of a hard and brittle transparent material by utilizing laser-induced plasma of a bimetal alloy target comprises a computer control system 1, a laser 2, a lens assembly, a bimetal alloy target 7, a workbench 8 and a liftable clamp 9, wherein the lens assembly comprises a scanning galvanometer 4 and a focusing lens 5, the workbench 8 is a liftable workbench, the computer control system 1 is connected with the laser 2 and the liftable clamp 9, the bimetal alloy target 7 comprises an inert metal and an active metal, the inert metal cannot chemically react with the material of the transparent workpiece 6, and the active metal can chemically react with the material of the transparent workpiece 6; the bimetal alloy target 7 is fixedly arranged on a workbench 8, the lifting clamp 9 is arranged on the workbench 8 and is connected with the transparent workpiece 6 to drive the transparent workpiece 6 to lift, the lifting clamp 9 comprises a linear motor to drive the transparent workpiece 6 to lift through the linear motor, the transparent workpiece 6 and the bimetal alloy target 7 are arranged in a vertically spaced mode, the vertical spacing is a fixed value, and the spacing is 0.05-0.5 mm; a laser beam 3 emitted by the laser 2 is radiated and focused on a bimetal alloy target 7 through a scanning galvanometer 4, a focusing lens 5 and a transparent workpiece 6 and interacts with the bimetal alloy target 7 to generate plasma, the plasma corresponding to inert metal etches and processes the material of the transparent workpiece 6 through a physical process, and the plasma corresponding to active metal etches and processes the material of the transparent workpiece 6 through a physical process and a chemical reaction. The active metal plasma can react with the material of the transparent workpiece 6 chemically to modify the material of the transparent workpiece 6, so that the subsequent material removal is facilitated, and physical processes such as impact, thermal ablation and the like are generated to remove the processed material; the inert metal target material mainly plays a role in mechanical auxiliary removal through a physical process.
The transparent workpiece 6 has a good laser transmittance in all bands or in a specific band, such as diamond, sapphire, glass, etc. If the processed transparent material has better laser transmittance in a certain specific wave band, selecting a laser of the laser in the specific wave band range to enable the laser energy to reach the target material without loss, thereby efficiently generating plasma; meanwhile, the size of the laser spot is matched with the characteristic geometric dimension of the processed part, and preferably, when the characteristic geometric dimension of the processed part is 100 microns, the size of the laser spot is controlled to be below 10 microns.
The bimetal alloy target 7 can be a free curved surface or a block, and the surface normal direction of the bimetal alloy target points to the outside of the target so as to ensure better plasma emission capability.
The bimetal alloy target 7 is a solid product with metal property obtained by mixing, melting and cooling inert metal and active metal, and can be a binary alloy or a mixture formed by mixing in other forms. One of the metals is inert metal, namely the metal does not react with the processed material chemically, and the generated plasma realizes the removal of the processed material by physical processes such as impact, thermal ablation and the like; the other metal is active metal, namely, the metal reacts with the processed material chemically, and the generated plasma is subjected to chemical removal while being removed by impact and thermal ablation, so that the removal efficiency is further improved. Preferably, the material of the alloy target material should be composed of elements with high atomic numbers, so that the formed plasma has larger kinetic energy, and the material removal can be better realized through impact.
The shape of the transparent workpiece 6 is complementary with that of the target material, the shape precision of the target material is guaranteed, the target material is prepared by using an ultra-precision machining technology, and preferably, the non-ferrous metal target material is machined by using single-point diamond ultra-precision cutting; the ferrous metal target material is processed by single-point ultra-precision grinding, and preferably, a material with good processability is selected as the target material. The laser which is irradiated on the target material through the transparent processed material can be in various forms, preferably, the laser comprises point laser, line laser and surface laser, wherein the point laser can achieve higher processing precision, and the line laser and the surface laser can achieve higher processing efficiency.
The processing method of laser-induced plasma by using the bimetal alloy target comprises the following steps:
installing a transparent workpiece 6 on a lifting clamp 9, and installing a bimetal alloy target 7 on a workbench 8, wherein the bimetal alloy target 7 comprises inert metal and active metal;
the laser 2 emits a laser beam 3, the laser beam 3 emitted by the laser 2 is radiated and focused on the bimetal alloy target 7 through the lens component and the transparent workpiece 6 and interacts with the bimetal alloy target 7 to generate plasma, the plasma corresponding to the inert metal etches and processes the material of the transparent workpiece 6 through a physical process, and the plasma corresponding to the active metal etches and processes the material of the transparent workpiece 6 through a physical process and a chemical reaction. The interaction is in particular: the laser beam 3 is radiated and focused on the upper surface of the bimetal alloy target 7, the bimetal alloy target 7 absorbs a large amount of laser energy, so that a layer of thin area surface of the upper surface of the bimetal alloy target 7 is heated and vaporized, the vaporized particles continuously absorb the laser energy, when the laser energy is greater than the breakdown threshold of the material of the bimetal alloy target 7, the bimetal alloy target 7 is broken down to generate avalanche type ionization so as to form high-temperature and high-pressure plasma, the plasma continuously absorbs the laser energy to generate local explosion and carry out etching or deposition on the lower surface of the transparent workpiece 6, and the plasma consists of non-ionized neutral particles, electrons and ions; the physical process comprises the following steps: the generated plasma realizes the removal of the processed material by physical processes such as impact, thermal ablation and the like; the chemical reaction is as follows: the generated plasma and the processed material are subjected to chemical reaction, and the generated plasma is subjected to impact and thermal ablation removal and chemical removal simultaneously.
Examples of applications of the present embodiment are: the diamond microgrooves are processed by utilizing a laser-induced bimetallic plasma processing technology, the bimetallic target material adopts a pure copper and pure iron mixed metal target material, and the laser adopts a 1064nm infrared laser. Copper is an inert metal for diamond materials, while iron is an active metal for diamond materials. The laser generates laser beams which are focused on the bimetal target, wherein copper plasma is generated to reversely bombard the back surface of the diamond, the plasma plays roles of deposition and injection at the moment, partial diamond material is amorphized so as to generate modification, when the generated iron plasma reversely bombards the back surface of the diamond, the plasma plays a role of bonding at the moment, the plasma and the diamond material generate chemical reaction to generate iron carbide, and therefore the chemical property of the material is changed so as to be beneficial to material removal. At the moment, the subsequent laser pulse thermal ablation and plasma thermal ablation have combined action, so that ablation and vaporization effects are generated, and the diamond material is efficiently removed. The laser pulse power is 12W, the laser scanning speed is 0.1mm/s, the laser pulse frequency is 1000KHz, and the laser pulse width is 1 nm. The actual machining results of the micro grooves are shown in fig. 2.
The above description is only a preferred embodiment of the present invention, and therefore should not be taken as limiting the scope of the invention, which is defined by the appended claims and their equivalents.
Claims (7)
1. Utilize bimetal alloy target laser induction plasma processingequipment for processing transparent work piece (6), its characterized in that: the processing device comprises a laser (2), a lens assembly, a bimetallic alloy target (7), a workbench (8) and a lifting clamp (9); the bimetal alloy target (7) is fixedly arranged on a workbench (8), the lifting fixture (9) is arranged on the workbench (8) and is connected with the transparent workpiece (6) to drive the transparent workpiece (6) to lift, and the transparent workpiece (6) and the bimetal alloy target (7) are arranged in a vertically spaced manner; a laser beam (3) emitted by the laser (2) is radiated and focused on a bimetal alloy target (7) through a lens component and a transparent workpiece (6) and interacts with the bimetal alloy target (7) to generate plasma, the bimetal alloy target (7) comprises inert metal and active metal, the plasma corresponding to the inert metal etches and processes the material of the transparent workpiece (6) through a physical process, and the plasma corresponding to the active metal etches and processes the material of the transparent workpiece (6) through a physical process and a chemical reaction.
2. The laser-induced plasma processing apparatus using a bimetal alloy target according to claim 1, wherein: the lens assembly comprises a scanning galvanometer (4) and a focusing lens (5), and a laser beam (3) emitted by the laser (2) passes through the scanning galvanometer (4) and the focusing lens (5) and then reaches a transparent workpiece (6).
3. The laser-induced plasma processing apparatus using a bimetal alloy target according to claim 1, wherein: the laser device is characterized by further comprising a computer control system (1), wherein the computer control system (1) is connected with the laser device (2) and the lifting clamp (9).
4. The laser-induced plasma processing apparatus using a bimetal alloy target according to claim 1, wherein: the distance between the transparent workpiece (6) and the bimetal alloy target (7) is 0.05-0.5 mm.
5. The laser-induced plasma processing apparatus using a bimetal alloy target according to claim 1, wherein: the inert metal does not react chemically with the material of the transparent workpiece (6), and the active metal reacts chemically with the material of the transparent workpiece (6).
6. The laser-induced plasma processing apparatus using a bimetal alloy target according to claim 1, wherein: the interaction is that laser beams (3) are radiated and focused on the upper surface of a bimetal alloy target (7), the bimetal alloy target (7) absorbs laser energy, the upper surface of the bimetal alloy target (7) is heated and vaporized, vaporized particles continue to absorb the laser energy, when the laser energy is larger than the breakdown threshold of the bimetal alloy target (7) material, the bimetal alloy target (7) is broken down to form plasma, and the plasma continues to absorb the laser energy to generate local explosion and etch or deposit on the lower surface of a transparent workpiece (6).
7. The processing method of laser-induced plasma by using the bimetal alloy target is characterized by comprising the following steps: the method comprises the following steps:
installing a transparent workpiece (6) on a lifting clamp (9), and installing a bimetal alloy target (7) on a workbench (8), wherein the bimetal alloy target (7) comprises inert metal and active metal;
the laser (2) emits a laser beam (3), the laser beam (3) emitted by the laser (2) is radiated and focused on the bimetal alloy target (7) through the lens component and the transparent workpiece (6) and interacts with the bimetal alloy target (7) to generate plasma, the plasma corresponding to the inert metal etches and processes the material of the transparent workpiece (6) through a physical process, and the plasma corresponding to the active metal etches and processes the material of the transparent workpiece (6) through a physical process and a chemical reaction.
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