CN114286269A - Infrasonic wave microphone - Google Patents
Infrasonic wave microphone Download PDFInfo
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- CN114286269A CN114286269A CN202111607817.1A CN202111607817A CN114286269A CN 114286269 A CN114286269 A CN 114286269A CN 202111607817 A CN202111607817 A CN 202111607817A CN 114286269 A CN114286269 A CN 114286269A
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- microphone
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- 239000003990 capacitor Substances 0.000 claims abstract description 31
- 238000001914 filtration Methods 0.000 claims abstract description 16
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- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 5
- 229920006351 engineering plastic Polymers 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
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Abstract
The invention relates to an infrasonic microphone which comprises a capacitor microphone, a low-pass filtering module connected with the capacitor microphone, an amplifying module connected with the low-pass filtering module, and a signal recording module connected with the amplifying module, wherein the pickup part of the capacitor microphone is in an annular cylindrical shape; by adopting the annular cylindrical capacitor microphone structure, infrasound can be received at 360 degrees, so that higher infrasound pickup sensitivity is obtained, and the volume of the microphone is not excessively increased while a larger vibration sound pickup area and sensitivity are obtained. In addition, by adopting the infrasonic wave microphone structure, the low-pass filtering module can filter other sound signals with the frequency higher than that of the infrasonic waves, and the infrasonic wave signals are amplified by the amplifying module and recorded by the signal recording module, so that relatively pure infrasonic wave signals are obtained.
Description
Technical Field
The invention relates to the technical field of microphones, in particular to an infrasonic microphone.
Background
Infrasonic waves are sound waves with a frequency of less than 20 Hz. In nature, offshore storms, volcanic eruptions, falling of large meteorites, tsunamis, lightning, wave bank-striking, underwater vortexes, air turbulence, tornadoes, magnetic storms, aurora, earthquakes and the like are all accompanied by the occurrence of infrasonic waves; in human activities such as nuclear explosion, missile flight, artillery launching, ship navigation, automobile racing, high-rise and bridge shaking, even if the automobiles such as a blower, a stirrer, bass music, even a bus and a car run at high speed, infrasonic waves are generated, researches show that the full frequency band of the infrasonic waves has different degrees of harm to human bodies, but the frequency of the infrasonic waves can not be heard by human ears, so that the test of the infrasonic waves is very important. A Microphone, i.e. a Microphone (Microphone), is a transducer that converts sound into an electrical signal. However, due to the structure, the common microphone is mainly used for collecting the sound audible by human ears in the range of 20-20000Hz, and the receiving sensitivity is very low for the frequency below 20Hz, so that the infrasonic wave cannot be accurately and quantitatively tested. At present, no special infrasonic microphone is available in China.
Disclosure of Invention
Therefore, it is necessary to provide an infrasonic microphone capable of efficiently measuring infrasonic waves, in order to solve the problem that the infrasonic waves cannot be accurately measured at present.
An infrasonic microphone comprises a capacitor microphone, a low-pass filtering module connected with the capacitor microphone, an amplifying module connected with the low-pass filtering module, and a signal recording module connected with the amplifying module, wherein the pickup part of the capacitor microphone is in an annular cylindrical shape.
In one embodiment, the capacitor microphone comprises a diaphragm frame, the diaphragm frame comprises an upper ring and a lower ring, the upper ring and the lower ring are both horizontally arranged, the circle centers of the upper ring and the lower ring are located on the same vertical line, diaphragms are arranged on the outer surfaces of the two rings, polar plates opposite to the diaphragms are arranged on the inner surfaces of the two rings, the diaphragms and the polar plates are both annular and cylindrical, and mesh enclosures are sleeved on the outer portions of the diaphragm frame and the diaphragms.
In one embodiment, the pole plate is made by coating a layer of electret material on the outer side of a metal plate, and a plurality of acoustic through holes are uniformly formed in the pole plate.
In one embodiment, the diaphragm is made by evaporating a layer of gold film on the outer side of an engineering plastic film.
In one embodiment, the diaphragm frame is an insulator.
In one embodiment, the infrasonic microphone further comprises a shell connected with one end of the capacitor microphone, and a power supply and a circuit board are arranged in the shell; the low-pass filtering module, the amplifying module and the signal recording module are arranged in the circuit board; the power supply is connected with the circuit board and used for supplying power to the low-pass filtering module, the amplifying module and the signal recording module.
In one embodiment, the infrasonic microphone further comprises a switch, the switch is arranged on the outer side of the shell and connected with the circuit board, and the switch is used for controlling whether the power supply supplies power for each module in the circuit board.
In one embodiment, the longitudinal length of the condenser microphone is greater than 1/2 of the total length of the infrasonic microphone.
In one embodiment, the amplification module includes an integrated chip RF 2324.
The infrasonic wave microphone adopts the annular cylindrical capacitor microphone structure, can receive infrasonic waves at 360 degrees, and can obtain enough infrasonic wave pickup sensitivity according to the principle that the pickup area is larger than that of a common microphone and is more beneficial to picking up lower frequencies according to the principle that the pickup area is larger, so that the volume of the microphone is not excessively increased while the larger vibration sound pickup area and sensitivity are obtained. In addition, by adopting the infrasonic wave microphone structure, the low-pass filtering module can filter other sound signals with the frequency higher than that of the infrasonic waves, and the infrasonic wave signals are amplified by the amplifying module and recorded by the signal recording module, so that relatively pure infrasonic wave signals are obtained. The infrasonic wave microphone fills the blank of the infrasonic wave detection field.
Drawings
FIG. 1 is a schematic diagram of the circuit of an infrasonic microphone of the present invention;
fig. 2 is a schematic view of the overall structure of the infrasonic microphone of the present invention;
FIG. 3 is a schematic view of a partial cross-sectional structure of an infrasonic microphone of the present invention;
the device comprises a polar plate 1, a vibrating diaphragm 2, a vibrating diaphragm frame 3, an upper circular ring 31, a lower circular ring 32, a mesh enclosure 4, an acoustic through hole 5, a shell 6, a power supply 7, a circuit board 8 and a switch 9.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. As used herein, the terms "vertical," "horizontal," "left," "right," "side," "other side," "end," "other end," and the like are used for descriptive purposes only and not for purposes of limitation as to the particular orientation of the components in the product or device.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The basic components of the capacitor microphone comprise a vibrating diaphragm and a polar plate, wherein the vibrating diaphragm and the polar plate are respectively conductors corresponding to two areas of a capacitor, and the polar plate containing the electret material is charged in advance to enable the capacitor to become a capacitor with charges; when the diaphragm vibrates under the action of external sound pressure, the distance between the two conductors is changed, so that the induction quantity of charges in the capacitor is changed, and the conversion process of sound power transformation is realized.
As shown in fig. 1 to 3, an infrasonic microphone of the present invention includes a capacitor microphone, a low pass filter module connected to the capacitor microphone, an amplifier module connected to the low pass filter module, and a signal recording module connected to the amplifier module, wherein a sound pickup portion of the capacitor microphone is in a shape of a circular cylinder.
The low-pass filtering module is a low-pass filter and filters other frequencies higher than infrasonic waves; the amplification module comprises a novel micro-power consumption IC chip, particularly, an integrated chip RF2324 is preferred, and the amplification module has the functions of signal amplification, impedance conversion and built-in anti-interference filter; the signal recording module is a microprocessor, but is not limited thereto.
The infrasonic wave microphone is a capacitor microphone, according to the acoustic principle, the infrasonic wave frequency is ultralow, the vibrating diaphragm area of the microphone is larger, and the low-frequency response is better, so that the pickup part of the capacitor microphone is arranged to be in an annular cylindrical shape and can receive infrasonic waves for 360 degrees, so that enough large receiving energy is obtained, the larger vibration sound pickup area and sensitivity are obtained, and meanwhile, the volume of the microphone is not excessively increased; in addition, the low-pass filtering module is adopted, so that other frequencies higher than infrasonic waves can be filtered; the acquired infrasonic wave signals are amplified through the amplifying module and processed and recorded by the signal recording module.
Further, referring to fig. 3, the capacitor microphone includes a diaphragm frame, the diaphragm frame includes an upper ring and a lower ring, the upper ring and the lower ring are both horizontally disposed, the centers of circles of the upper ring and the lower ring are located on the same vertical line, diaphragms are disposed on the outer surfaces of the two rings, polar plates opposite to the diaphragms are disposed on the inner surfaces of the two rings, the diaphragms and the polar plates are both annularly cylindrical, and mesh enclosures (not shown) are respectively sleeved outside the diaphragm frame and the diaphragms.
In the application, the vibrating diaphragm and the polar plate are both in annular cylindrical shapes, which form one of the basic components of the invention: cylindrical capacitance pickup pole head. In addition, the vibrating diaphragm frame is an insulator, so that the vibrating diaphragm and the polar plate are ensured to be opposite but not connected, and the definition of capacitance is met; the diaphragm frame may be made of plastic with certain strength, but is not limited thereto.
In this application, the polar plate is made for coating a layer electret material in the metal sheet outside, has evenly seted up a plurality of acoustics through-hole in the polar plate.
In the application, the material of the metal plate in the pole plate can be copper or aluminum alloy, and is preferably copper; the electrode plate is used as one electrode of a capacitor, the electret material layer is electrically polarized through direct-current high-voltage discharge to form a charged body, and the electrode plate is a permanently charged electrode plate at the moment. In addition, the effect of acoustics through-hole is the atmospheric pressure damping that produces when reducing the membrane vibration to guarantee its low frequency acoustics characteristic, if do not have these acoustics through-holes, will form an "air spring" when the vibrating diaphragm vibrates and influence the maximum amplitude of vibrating diaphragm between vibrating diaphragm and polar plate, can reduce the sensitivity of low frequency pickup.
In this application, the vibrating diaphragm is made for evaporating a layer gold film in the engineering plastic film outside, and this layer gold film is the gold film that a layer thickness is extremely thin, and the engineering plastic film material in the vibrating diaphragm can be PPS or PTEF, and preferred PPS. The vibrating diaphragm has double functions, namely receiving external sound waves to generate vibration, and serving as an electrode to form a capacitor with the polar plate.
In the application, the polar plate forms an electret board tube-shape electrode that can store electric charge, charges this tube-shape electrode polar plate in the preparation, makes it become electrified body, and the tube-shape electric capacity utmost point head that nature and tube-shape vibrating diaphragm constitute has a electric capacity utmost point head that has electric charge to store.
The capacitor microphone in the infrasonic wave microphone can receive infrasonic waves by 360 degrees by setting the vibrating diaphragm and the polar plate to be annular cylindrical.
In the present application, the mesh enclosure may be composed of two parts, or may be an integral part, a part of the mesh enclosure located outside the sound pickup part of the capacitor microphone is cylindrical, and a part (not shown in fig. 3) located above the sound pickup part of the capacitor microphone may be a common hemisphere (as shown in fig. 2) or may be in other shapes; the screen panel can be convenient for the pickup, also can protect polar plate, vibrating diaphragm frame and vibrating diaphragm.
In addition, the infrasonic microphone also comprises a shell connected with one end of the capacitor microphone, and a power supply and a circuit board are arranged in the shell; the low-pass filtering module, the amplifying module and the signal recording module are arranged in the circuit board; the power supply is connected with the circuit board and used for supplying power to the low-pass filtering module, the amplifying module and the signal recording module. Wherein the power source is a battery.
In addition, still include the switch among the infrasonic microphone, the switch sets up in the casing outside, the switch is connected with the circuit board for whether the power supplies power for each module in the circuit board.
In addition, it is preferable that the longitudinal length of the condenser microphone is greater than 1/2 of the total length of the infrasonic microphone, whereby the area of the condenser microphone pickup portion in the infrasonic microphone can be further increased to improve the sensitivity thereof.
The working principle of the infrasonic microphone of the application is as follows: first, when needs use infrasonic wave microphone test infrasonic wave, open the switch of infrasonic wave microphone, the vibrating diaphragm produces the vibration during external sound, thereby change the distance between vibrating diaphragm and the polar plate, thereby change the response of electric charge, the signal of telecommunication output of this kind of change is for low pass filter module, when having infrasonic wave signal, low pass filter module will filter the infrasonic wave signal after give the amplifier module and amplify it, and then send signal recording module to, thereby obtain the infrasonic wave signal of relative pureness.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. An infrasonic microphone is characterized by comprising a capacitor microphone, a low-pass filtering module connected with the capacitor microphone, an amplifying module connected with the low-pass filtering module, and a signal recording module connected with the amplifying module, wherein the pickup part of the capacitor microphone is in an annular cylindrical shape.
2. The infrasonic microphone of claim 1, wherein the capacitor microphone comprises a diaphragm frame, the diaphragm frame comprises an upper ring and a lower ring, the upper ring and the lower ring are both horizontally arranged, the centers of the upper ring and the lower ring are located on the same vertical line, a diaphragm is arranged on the outer surfaces of the two rings, a polar plate opposite to the diaphragm is arranged on the inner surfaces of the two rings, the diaphragm and the polar plate are both in the shape of a circular cylinder, and a mesh enclosure is sleeved outside the diaphragm frame and the diaphragm.
3. The infrasonic microphone of claim 2, wherein the pole plate is made by coating a layer of electret material on the outer side of the metal plate, and a plurality of acoustic through holes are uniformly formed in the pole plate.
4. The infrasonic microphone of claim 2, wherein the diaphragm is formed by evaporating a gold film on the outer side of an engineering plastic film.
5. The infrasonic microphone of claim 2, wherein the diaphragm frame is an insulator.
6. The infrasonic microphone of claim 1, further comprising a case connected to one end of the condenser microphone, wherein a power supply and a circuit board are disposed in the case; the low-pass filtering module, the amplifying module and the signal recording module are arranged in the circuit board; the power supply is connected with the circuit board and used for supplying power to the low-pass filtering module, the amplifying module and the signal recording module.
7. The infrasonic microphone of claim 6, further comprising a switch disposed outside the housing, the switch being connected to the circuit board for controlling whether the power supply supplies power to the modules in the circuit board.
8. The infrasonic microphone of claim 1, wherein the longitudinal length of the condenser microphone is greater than 1/2 of the total length of the infrasonic microphone.
9. The infrasonic microphone of claim 1, wherein the amplification module comprises an integrated chip RF 2324.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111607817.1A CN114286269A (en) | 2021-12-27 | 2021-12-27 | Infrasonic wave microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111607817.1A CN114286269A (en) | 2021-12-27 | 2021-12-27 | Infrasonic wave microphone |
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| Publication Number | Publication Date |
|---|---|
| CN114286269A true CN114286269A (en) | 2022-04-05 |
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| CN202111607817.1A Pending CN114286269A (en) | 2021-12-27 | 2021-12-27 | Infrasonic wave microphone |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030103639A1 (en) * | 1999-12-09 | 2003-06-05 | Rittersma Zacharias M. | Miniature microphone |
| CN2924985Y (en) * | 2006-06-27 | 2007-07-18 | 王胜平 | Low-frequency sound pressure sensor |
| CN101403635A (en) * | 2008-10-22 | 2009-04-08 | 中国矿业大学 | Infrasonic wave detection apparatus |
| CN201422161Y (en) * | 2009-05-31 | 2010-03-10 | 北京龙峰经典科技有限公司 | capacitor microphone |
| US20110132095A1 (en) * | 2009-10-27 | 2011-06-09 | United States of America as represented by the Administrator of the National Aeronautics and | Sub-Surface Windscreen for Outdoor Measurement of Infrasound |
| US20200209044A1 (en) * | 2017-05-22 | 2020-07-02 | Stream DX, Inc | Capacitive measurement device with minimized sensitivity to manufacturing variability and environmental changes |
| US20210099793A1 (en) * | 2019-09-27 | 2021-04-01 | United States Of America As Represented By The Administrator Of Nasa | Extreme low frequency microphone/hydrophone for exploration of oceanic and atmospheric dynamics |
-
2021
- 2021-12-27 CN CN202111607817.1A patent/CN114286269A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030103639A1 (en) * | 1999-12-09 | 2003-06-05 | Rittersma Zacharias M. | Miniature microphone |
| CN2924985Y (en) * | 2006-06-27 | 2007-07-18 | 王胜平 | Low-frequency sound pressure sensor |
| CN101403635A (en) * | 2008-10-22 | 2009-04-08 | 中国矿业大学 | Infrasonic wave detection apparatus |
| CN201422161Y (en) * | 2009-05-31 | 2010-03-10 | 北京龙峰经典科技有限公司 | capacitor microphone |
| US20110132095A1 (en) * | 2009-10-27 | 2011-06-09 | United States of America as represented by the Administrator of the National Aeronautics and | Sub-Surface Windscreen for Outdoor Measurement of Infrasound |
| US20200209044A1 (en) * | 2017-05-22 | 2020-07-02 | Stream DX, Inc | Capacitive measurement device with minimized sensitivity to manufacturing variability and environmental changes |
| US20210099793A1 (en) * | 2019-09-27 | 2021-04-01 | United States Of America As Represented By The Administrator Of Nasa | Extreme low frequency microphone/hydrophone for exploration of oceanic and atmospheric dynamics |
Non-Patent Citations (1)
| Title |
|---|
| 曹碧生: "基于PVDF的次声波传感器设计", 《知网硕士电子期刊出版》, pages 1 - 62 * |
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