CN114284858B - Micro-channel water cooling structure of VCSEL chip with coplanar electrodes - Google Patents
Micro-channel water cooling structure of VCSEL chip with coplanar electrodes Download PDFInfo
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- CN114284858B CN114284858B CN202111641969.3A CN202111641969A CN114284858B CN 114284858 B CN114284858 B CN 114284858B CN 202111641969 A CN202111641969 A CN 202111641969A CN 114284858 B CN114284858 B CN 114284858B
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Abstract
The invention discloses a micro-channel water cooling structure of a VCSEL chip with a coplanar electrode, wherein a P electrode and an N electrode of the VCSEL chip with the coplanar electrode are positioned on the same side of a substrate and are separated by an isolation channel; a microchannel water-cooling structure comprising: the first heat sink, the insulating layer and the second heat sink; one end of the first heat sink is communicated with the P electrode, and the other end of the first heat sink is provided with a first binding post; one end of the second heat sink is communicated with the N electrode, and the other end of the second heat sink is provided with a second binding post; an insulating layer is arranged between the first heat sink and the second heat sink, and one end of the insulating layer is inserted into the isolation channel; be equipped with the cooling channel of intercommunication in first heat sink, insulating layer and the second heat sink, be equipped with water inlet and delivery port on the second heat sink, water inlet and delivery port setting are at the both ends of cooling channel. The invention combines the micro-channel water-cooling heat sink structure with the flip-chip bonding, and can simultaneously realize the water-cooling heat dissipation and the power supply of the VCSEL chip with the same-surface electrode.
Description
Technical Field
The invention relates to the technical field of semiconductor laser chip packaging, in particular to a micro-channel water cooling structure of a VCSEL chip with a coplanar electrode.
Background
Compared with other light sources such as a Light Emitting Diode (LED), a Laser Diode (LD), an edge-emitting semiconductor laser and the like, the VCSEL light source has the advantages of small size, low threshold current, low power consumption, high modulation bandwidth, circular light beam, easiness in coupling with an optical fiber, on-chip test, reduction in test cost, two-dimensional array arrangement, low cost, high light emitting efficiency and the like.
VCSEL lasers have two basic structures, one top emitting and one bottom emitting. For a bottom emission structure, the active region and the DBR are located at the bottom of the substrate, and pumping the VCSEL chip using the opposite surface electrode generates unnecessary joule heat due to the thickness of the substrate, and causes thermal stress due to non-uniform current distribution.
In order to reduce joule heating, a coplanar electrode power supply is used, i.e. a coplanar electrode VCSEL chip 10 as shown in fig. 1, with the P-electrode 11 and the N-electrode 12 on the same side of the substrate and separated by an isolation channel 13. The VCSEL chip with the same-surface electrode is in a flip-chip packaging mode, and the VCSEL chip and the heat sink are directly connected through welding or bonding, so that the heat sink mode can be specially designed according to the structure of the VCSEL chip with the same-surface electrode.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a micro-channel water cooling structure of a VCSEL chip with a coplanar electrode.
The invention discloses a micro-channel water cooling structure of a VCSEL chip with a coplanar electrode, wherein a P electrode and an N electrode of the VCSEL chip with the coplanar electrode are positioned on the same side of a substrate and are separated by an isolation channel; the microchannel water-cooling structure comprises: the first heat sink, the insulating layer and the second heat sink;
one end of the first heat sink is communicated with the P electrode, and the other end of the first heat sink is provided with a first binding post;
one end of the second heat sink is communicated with the N electrode, and the other end of the second heat sink is provided with a second binding post;
the insulating layer is arranged between the first heat sink and the second heat sink, and one end of the insulating layer is inserted into the isolation channel;
the first heat sink, the insulating layer and the second heat sink are internally provided with communicated cooling channels, the second heat sink is provided with a water inlet and a water outlet, and the water inlet and the water outlet are arranged at two ends of the cooling channels.
As a further improvement of the present invention, the first heat sink is a cylindrical heat sink, and the second heat sink is a cylindrical heat sink or a cylindrical heat sink.
As a further improvement of the invention, the first heat sink and the second heat sink are Cu heat sinks or Cu-based alloy heat sinks.
As a further improvement of the invention, the size of the end part of the first heat sink is not smaller than the size of the P electrode, the size of the isolation channel is not smaller than 100 μm, and the thickness of the insulating layer is matched with the width of the isolation channel.
As a further improvement of the invention, the first heat sink is arranged between the second heat sinks, and the first heat sink, the insulating layer and the second heat sinks are tightly attached.
As a further improvement of the present invention, the cooling channel is in a U-shaped structure with a horizontal opening in the longitudinal direction, the water inlet and the water outlet are located on the same side of the second heat sink, and each transverse channel of the cooling channel passes through the first heat sink, the insulating layer and the second heat sink.
As a further development of the invention, each transverse channel of the cooling channels has a helical structure in the horizontal direction.
As a further improvement of the present invention, cooling water enters from the water inlet of the second heat sink, passes through the insulating layer, the first heat sink, the insulating layer, and the second heat sink in sequence, and then is discharged through the water outlet of the second heat sink.
Compared with the prior art, the invention has the beneficial effects that:
the invention combines the micro-channel water-cooling heat sink structure with the flip-chip bonding, and can simultaneously realize the water-cooling heat dissipation and the power supply of the VCSEL chip with the same-surface electrode.
Drawings
FIG. 1 is a schematic structural diagram of a VCSEL chip with coplanar electrodes;
FIG. 2 is a schematic structural diagram of a micro-channel water-cooling structure of a VCSEL chip with coplanar electrodes according to an embodiment of the invention;
FIG. 3 is a schematic top view of a micro-channel water-cooled heat sink of FIG. 2;
fig. 4 is a schematic top view of another microchannel water-cooled heat sink of fig. 2.
In the figure:
10. a VCSEL chip with a coplanar electrode; 11. a P electrode; 12. an N electrode; 13. isolating the channel; 20. a first heat sink; 30. an insulating layer; 40. a second heat sink; 50. a water inlet; 60. a water outlet; 70. a first terminal post; 80. a second terminal; 90. a cooling channel.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The invention is described in further detail below with reference to the attached drawing figures:
as shown in fig. 1 and 2, the invention provides a micro-channel water-cooling structure of a VCSEL chip with coplanar electrodes, wherein a P electrode 11 and an N electrode 12 of the VCSEL chip with coplanar electrodes 10 are located on the same side of a substrate, the P electrode 11 is located in the middle of the N electrode 12 and is separated by an isolation trench 13, and the width of the isolation trench 13 is not less than 100 μm; this microchannel water-cooling structure sets up at the electrode side of coplanar electrode VCSEL chip and closely laminates with coplanar electrode VCSEL chip, and it includes: a first heat sink 20, an insulating layer 30, and a second heat sink 40; wherein the content of the first and second substances,
one end (top end) of a first heat sink 20 is communicated with a P electrode 11, the other end (bottom end) of the first heat sink is provided with a first wiring terminal 70, one end (top end) of a second heat sink 40 is communicated with an N electrode 12, the other end (bottom end) of the second heat sink is provided with a second wiring terminal 80, and the first wiring terminal 70 and the second wiring terminal 80 are respectively connected with a positive electrode and a negative electrode to realize power supply of a VCSEL chip with a same-surface electrode; an insulating layer 30 is arranged between the first heat sink 20 and the second heat sink 40, the first heat sink 20 and the second heat sink 40 are insulated and isolated by the insulating layer 30, and one end (top end) of the insulating layer 30 is inserted into the isolation channel 13.
On the basis of the above structure, the first heat sink 20 of the present invention is a cylindrical heat sink, the second heat sink 40 is a cylindrical heat sink as shown in fig. 3 or a cylindrical heat sink as shown in fig. 4, the cylindrical heat sink 40 is sleeved on the outer side of the cylindrical heat sink 20, and the cylindrical heat sink 40 is tightly attached to the outer side of the cylindrical heat sink 20. The first heat sink 20 and the second heat sink 40 are Cu heat sinks or Cu-based alloy heat sinks prepared by a 3D printing technology, the size of the end part of the first heat sink 20 is not smaller than that of the P electrode 11, the thickness of the insulating layer 30 is matched with the width of the isolation channel 13, and the first heat sink 20, the insulating layer 30 and the second heat sink 40 are tightly attached.
According to the invention, the first heat sink 20, the insulating layer 30 and the second heat sink 40 are internally provided with the communicated cooling channel 90, the second heat sink 40 is provided with the water inlet 50 and the water outlet 60, the water inlet 50 and the water outlet 60 are arranged at two ends of the cooling channel 90, water or other cooling media is fed into the cooling channel 90 through the water inlet 50, heat exchange and temperature reduction are carried out on the first heat sink 20 and the second heat sink 40 through the cooling channel 90, and the heated water flows out through the water outlet 60.
On the basis of the above structure, as shown in fig. 1, the cooling channel 90 of the present invention is in a "U" shape structure with horizontal opening in the longitudinal direction, the water inlet 50 and the water outlet 60 are located on the same side of the second heat sink 40, and each lateral channel of the cooling channel 90 passes through the first heat sink 20, the insulating layer 30 and the second heat sink 40, and the two lateral channels are communicated up and down in the second heat sink 40. When the heat sink is used, cooling water enters from the water inlet 50 of the second heat sink 40, sequentially passes through the reciprocating circulation of the insulating layer 30, the first heat sink 20, the insulating layer 30 and the second heat sink 40, and then is discharged from the water outlet 60 of the second heat sink 40. Further, the cooling channel 90 of the present invention may also be provided with a plurality of layers of transverse channels in communication in the longitudinal direction, so as to achieve uniform heat dissipation in the longitudinal direction. Further, each transverse channel of the cooling channel 90 of the present invention is a linear channel, or each transverse channel of the cooling channel 90 is in a spiral structure in the horizontal direction, so as to achieve uniform heat dissipation in the transverse direction; namely, as shown by a broken line segment in fig. 3 and 4, the right side is connected with a water inlet or a water outlet, and the left side is communicated with the transverse channel of the upper layer or the lower layer through a vertical channel; further, the inner walls of the cooling channel 90 may be coated with an insulating and thermally conductive layer.
On the basis of the structure, the invention can further increase an external water circulation system, namely, an external water tank is connected with the water inlet 50 through a water inlet pipe, the external water tank is connected with the water outlet 60 through a water return pipe, a temperature sensor and a refrigerator with a control chip are arranged in the external water tank, the temperature sensor is connected with the control chip, and when the temperature of water in the water tank is detected to be higher than a threshold value, the control chip drives the refrigerator to work to refrigerate the water in the water tank, so that the continuous and stable heat dissipation efficiency can be ensured in the water circulation process.
The invention has the advantages that:
the invention combines the micro-channel water-cooling heat sink structure with the flip-chip bonding, can simultaneously realize the water-cooling heat dissipation and the power supply of the VCSEL chip with the same-surface electrode, and has high heat dissipation efficiency.
The present invention has been described in terms of the preferred embodiment, and it is not intended to be limited to the embodiment. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A microchannel water-cooling structure of a VCSEL chip with a coplanar electrode is characterized in that a P electrode and an N electrode of the VCSEL chip with the coplanar electrode are positioned on the same side of a substrate and are separated by an isolation channel; it is characterized in that the micro-channel water cooling structure comprises: the first heat sink, the insulating layer and the second heat sink;
one end of the first heat sink is communicated with the P electrode, and the other end of the first heat sink is provided with a first binding post;
one end of the second heat sink is communicated with the N electrode, and the other end of the second heat sink is provided with a second binding post;
the insulating layer is arranged between the first heat sink and the second heat sink, and one end of the insulating layer is inserted into the isolation channel;
the first heat sink, the insulating layer and the second heat sink are internally provided with communicated cooling channels, the inner walls of the cooling channels are coated with insulating heat-conducting layers, the second heat sink is provided with a water inlet and a water outlet, and the water inlet and the water outlet are arranged at two ends of the cooling channels; the cooling channel is in a U-shaped structure with a horizontal opening in the longitudinal direction, the water inlet and the water outlet are positioned on the same side of the second heat sink, and each transverse channel of the cooling channel passes through the first heat sink, the insulating layer and the second heat sink; each transverse channel of the cooling channel is in a spiral structure in the horizontal direction;
the external water tank is connected with the water inlet through a water inlet pipe, the external water tank is connected with the water outlet through a water return pipe, a temperature sensor and a refrigerator with a control chip are arranged in the external water tank, and the temperature sensor is connected with the control chip; when the water temperature in the water tank is detected to be higher than the threshold value, the control chip drives the refrigerator to work to refrigerate the water in the water tank.
2. The micro-channel water cooling structure of claim 1, wherein the first heat sink is a cylindrical heat sink and the second heat sink is a cylindrical heat sink or a cylindrical heat sink.
3. The micro-channel water cooling structure of claim 1, wherein the first and second heat sinks are Cu heat sinks or Cu-based alloy heat sinks.
4. The micro-channel water-cooling structure as claimed in claim 1, wherein the end size of the first heat sink is not smaller than the size of the P-electrode, the size of the isolation channel is not smaller than 100 μm, and the thickness of the insulating layer matches with the width of the isolation channel.
5. The micro-channel water cooling structure as claimed in any one of claims 1 to 4, wherein the first heat sink is arranged between the second heat sinks, and the first heat sink, the insulating layer and the second heat sinks are closely attached.
6. The micro-channel water cooling structure of claim 1, wherein cooling water enters from the water inlet of the second heat sink, passes through the insulating layer, the first heat sink, the insulating layer and the second heat sink in sequence, and then is discharged through the water outlet of the second heat sink.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111641969.3A CN114284858B (en) | 2021-12-29 | 2021-12-29 | Micro-channel water cooling structure of VCSEL chip with coplanar electrodes |
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| CN202111641969.3A CN114284858B (en) | 2021-12-29 | 2021-12-29 | Micro-channel water cooling structure of VCSEL chip with coplanar electrodes |
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| CN114284858A CN114284858A (en) | 2022-04-05 |
| CN114284858B true CN114284858B (en) | 2022-10-14 |
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| CN100576663C (en) * | 2007-03-14 | 2009-12-30 | 中国科学院半导体研究所 | Manufacture the method for thermal sediment for GaN laser |
| CN101097978A (en) * | 2007-06-26 | 2008-01-02 | 上海大学 | Copper inter-linkage flip-chip LED and its preparing process |
| CN103531702A (en) * | 2012-07-03 | 2014-01-22 | 深圳市蓝科电子有限公司 | LED structure of flip chip |
| US10192814B2 (en) * | 2016-11-18 | 2019-01-29 | Toyota Motor Engineering & Manufacturing North America, Inc. | Electronic assemblies having a cooling chip layer with fluid channels and through substrate vias |
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