CN114281128A - Flexible multi-point temperature control device and method based on electric arc material increase inside thin-wall cylinder - Google Patents
Flexible multi-point temperature control device and method based on electric arc material increase inside thin-wall cylinder Download PDFInfo
- Publication number
- CN114281128A CN114281128A CN202111590861.6A CN202111590861A CN114281128A CN 114281128 A CN114281128 A CN 114281128A CN 202111590861 A CN202111590861 A CN 202111590861A CN 114281128 A CN114281128 A CN 114281128A
- Authority
- CN
- China
- Prior art keywords
- temperature
- unit
- thin
- control unit
- wall cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
A flexible multi-point temperature control device based on arc material increase inside a thin-wall cylinder comprises: the temperature control circuit comprises an inverter main circuit (1), a temperature control circuit (2), a plurality of semiconductor refrigeration pieces (3), a flexible heat conduction plate (4) and a temperature sensor (5); the inverter main circuit (1) is connected with an AC 220V alternating current power supply and a semiconductor refrigeration sheet (3) to form a loop; the surfaces of the plurality of semiconductor refrigeration pieces (3) are in close contact with the flexible heat conducting plate (4) through heat conducting silicone grease; the invention realizes real-time monitoring of the temperature of the cylinder wall through the temperature sensor, adopts the flexible heating plate to enable the semiconductor refrigeration piece to be tightly attached to the workpiece, and realizes real-time control of the temperature of the cylinder wall in the process of electric arc additive manufacturing through heating and refrigeration of the working surface of the semiconductor refrigeration piece.
Description
Technical Field
The invention relates to the technical field of electric arc fuse material increase manufacturing, in particular to a flexible multi-point temperature control device and method based on electric arc material increase inside a thin-wall cylinder.
Background
The Arc fuse Additive Manufacturing technology (Wire + Arc Additive Manufacturing, WAAM) is an advanced Manufacturing process for forming a metal solid component by adopting a layer-by-layer stacking mode by taking a welding Arc as a heat source and a metal Wire as a filling material; the method has the characteristics of high deposition speed, high material utilization rate and the like, and is suitable for quickly forming large-size complex structural parts.
The cabin type structural part is a thin-wall cylinder structure, when the characteristics of lugs, reinforcing ribs and the like are formed in the cylinder by adopting an electric arc additive manufacturing technology, if the current is too small, the metal is difficult to melt and form, and the bonding interface strength is low; if the current is too large, the heat input is too large, resulting in serious deformation of the cylinder wall. Therefore, how to control the temperature of the cylinder wall so as to ensure the quality of the electric arc additive forming and the mechanical property of the bonding interface is a technical problem to be solved urgently in the field.
Disclosure of Invention
The invention aims to provide a flexible multi-point temperature control device and method based on electric arc additive manufacturing inside a thin-wall cylinder, so that the temperature of the cylinder wall in the electric arc additive manufacturing process inside the thin-wall cylinder can be adjusted in real time, and the temperature field and deformation in the electric arc additive manufacturing process can be controlled.
A flexible multi-point temperature control device based on arc material increase inside a thin-wall cylinder comprises: the device comprises an inverter main circuit 1, a temperature control circuit 2, a plurality of semiconductor chilling plates 3, a flexible heat conducting plate 4 and a temperature sensor 5; the inverter main circuit 1 is connected with an AC 220V alternating current power supply and a semiconductor refrigerating sheet 3 to form a loop; the surfaces of the plurality of semiconductor refrigeration pieces 3 are in close contact with the flexible heat conducting plate 4 through heat conducting silicone grease; the temperature sensor 5 is closely contacted with the flexible heat conducting plate 4 through heat conducting silicone grease, and the temperature sensor 5 is connected with the temperature control circuit 2 through a lead; the temperature control circuit 2 is connected with the inverter main circuit 1 through a lead;
the main inverter circuit 1 includes a rectifying and filtering unit 101 and a full-bridge inverter unit 102.
The input end of the rectifying and filtering unit 101 is connected with an AC 220V power supply, and the AC 220V alternating current is converted into DC12V direct current; the input end of the full-bridge inversion unit 102 is connected with the rectification filter unit 101, and the output end of the full-bridge inversion unit is connected with the semiconductor chilling plate 3, and the full-bridge inversion unit is used for current commutation and power control, so that heating/chilling and power of the working surface of the semiconductor chilling plate 3 are controlled.
The temperature control circuit 2 comprises a control system 201, a liquid crystal display 202 and a key 203.
The control system 201 is composed of an STC89C52 single chip microcomputer and peripheral circuits thereof, and includes a single chip microcomputer control unit 2011, a temperature sampling unit 2012, an output driving unit 2013, a setting control unit 2014, and a display control unit 2015.
The single-chip microcomputer control unit 2011 is connected with the temperature sampling unit 2012, the output driving unit 2013, the setting control unit 2014 and the display control unit 2015 through leads; the temperature sampling unit 2012 is connected with the temperature sensor 5 and the single chip microcomputer control unit 2011, and converts a temperature signal acquired by the temperature sensor 5 into an electric signal to be input to the single chip microcomputer control unit 2011; the output driving unit 2013 is connected with the single-chip microcomputer control unit 2011 and the full-bridge inversion unit 102, receives an output control signal output by the single-chip microcomputer control unit 2011, and outputs and drives the full-bridge inversion unit 102; the setting control unit 2014 is connected with the single chip microcomputer control unit 2011 and the key 203, receives a setting temperature control signal given by the key 203, and inputs the setting temperature control signal to the single chip microcomputer control unit 2011; display control unit 2015 links to each other with single chip microcomputer control unit 2011, liquid crystal display 202, receives the display control signal of single chip microcomputer control unit 2011 output to liquid crystal display 202, the real-time display settlement temperature and actual temperature.
The single chip microcomputer control unit 2011 compares the set temperature signal input by the setting control unit 2014 with the actual temperature signal input by the temperature sampling unit 2012; if the actual temperature value is higher than the set temperature value, the full-bridge inverter unit 102 is controlled to output forward current, so that the working surface of the semiconductor refrigerating sheet 3 is refrigerated; if the actual temperature value is lower than the set temperature value, the full-bridge inverter unit 102 is controlled to output negative current, so that the working surface of the semiconductor chilling plate 3 is heated.
The temperature control circuit 2 comprises a control system 201, a liquid crystal display 202 and a key 203, wherein the liquid crystal display 202 is an LCD liquid crystal display and is used for displaying a measured temperature value and a set temperature value.
The semiconductor refrigerating piece 3 is a semiconductor refrigerating piece with rated voltage of DC 12V; the flexible heat conducting plate 4 is made of heat conducting silica gel sheets, the semiconductor refrigerating sheet 3 and the temperature sensor 5 are uniformly distributed at different positions of the flexible heat conducting plate 4, and the flexible heat conducting plate 4 is in close contact with the thin-wall cylinder workpiece 6; and the temperature sensor 5 is used for sampling the temperature of the thin-wall cylinder workpiece 6 in real time.
A flexible multi-point temperature control method based on arc material increase inside a thin-wall cylinder realizes real-time temperature control by using a temperature control device, and comprises the following steps:
step one, a flexible heat conducting plate is coated on the outer side of a thin-wall cylinder workpiece and is in close contact with the workpiece;
setting a preheating temperature before additive manufacturing, locally heating the forming position of the thin-wall cylinder, and starting additive processing of the support lug or the reinforcing rib after the preheating temperature is reached;
after deposition of each layer is finished, local refrigeration is carried out on the thin-wall cylinder, and the next layer of deposition is carried out after the set interlayer temperature is reached;
and step four, repeating the step three until the manufacturing is finished.
Advantages and effects of the invention
The invention realizes real-time monitoring of the temperature of the cylinder wall through the temperature sensor, adopts the flexible heating plate to enable the semiconductor refrigeration piece to be tightly attached to the workpiece, and realizes real-time control of the temperature of the cylinder wall in the process of electric arc additive manufacturing through heating and refrigeration of the working surface of the semiconductor refrigeration piece.
Drawings
The present invention will be described in further detail with reference to the drawings and the detailed description.
FIG. 1 is a schematic view of the structure of the apparatus of the present invention;
fig. 2 is a schematic diagram showing the distribution of components on the flexible heat-conducting plate 4 according to the present invention;
FIG. 3 is a schematic block diagram of a part of the structure of the present invention.
In the figure:
the device comprises an inverter main circuit 1, a temperature control circuit 2, a semiconductor refrigerating sheet 3, a flexible heat conducting plate 4, a temperature sensor 5 and a thin-wall cylinder workpiece 6.
101 is a rectifying and filtering unit, and 102 is a full-bridge inverter unit.
201 is a control system, 202 is a liquid crystal display screen, and 203 is a key.
2011 is a single chip microcomputer control unit, 2012 is a temperature sampling unit, 2013 is an output driving unit, 2014 is a setting control unit, and 2015 is a display control unit.
Detailed Description
In order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows:
a flexible multi-point temperature control device based on arc material increase inside a thin-wall cylinder comprises: the temperature control circuit comprises an inverter main circuit, a temperature control circuit, a semiconductor refrigeration piece, a flexible heat conducting plate and a temperature sensor. The positional connection relationship between them is: the inverter main circuit is connected with an AC 220V alternating current power supply and a semiconductor refrigerating sheet to form a loop; the surface of the semiconductor refrigerating sheet is in close contact with the flexible heat conducting plate through heat conducting silicone grease; the temperature sensor is closely contacted with the flexible heat conducting plate through heat conducting silicone grease and is connected with the temperature control circuit through a lead; the temperature control circuit is connected with the inverter main circuit through a lead.
The inverter main circuit comprises a rectification filter unit and a full-bridge inverter unit;
further, the input end of the rectifying and filtering unit is connected with an AC 220V power supply, and the AC 220V alternating current is converted into DC12V direct current;
furthermore, the input end of the full-bridge inversion unit is connected with the rectification filter unit, and the output end of the full-bridge inversion unit is connected with the semiconductor refrigerating sheet and used for current commutation and power control, so that the heating/refrigerating and power of the working surface of the semiconductor refrigerating sheet are controlled;
the temperature control circuit comprises a control system, a liquid crystal display screen and a key;
furthermore, the control system is composed of an STC89C52 single chip microcomputer and peripheral circuits thereof, and comprises a single chip microcomputer control unit, a temperature sampling unit, an output driving unit, a setting control unit and a display control unit.
Furthermore, the single chip microcomputer control unit is connected with the temperature sampling unit, the output driving unit, the setting control unit and the display control unit through leads.
Furthermore, the temperature sampling unit is connected with the temperature sensor and the single chip microcomputer control unit, and converts the temperature signals collected by the temperature sensor into electric signals to be input into the single chip microcomputer control unit.
Furthermore, the output driving unit is connected with the single chip microcomputer control unit and the full-bridge inversion unit, receives an output control signal output by the single chip microcomputer control unit, and outputs and drives the full-bridge inversion unit.
Furthermore, the setting control unit is connected with the single chip microcomputer control unit and the keys, receives a setting temperature control signal given by the keys and inputs the setting temperature control signal to the single chip microcomputer control unit.
Furthermore, the display control unit is connected with the single chip microcomputer control unit and the liquid crystal display screen, receives the display control signal output by the single chip microcomputer control unit, outputs the display control signal to the liquid crystal display screen, and displays the set temperature and the actual temperature in real time.
Furthermore, the singlechip control unit compares a set temperature signal input by the set control unit with an actual temperature signal input by the temperature sampling unit. If the actual temperature value is higher than the set temperature value, controlling the full-bridge inverter unit to output forward current so as to refrigerate the working surface of the semiconductor refrigerating sheet; if the actual temperature value is lower than the set temperature value, the full-bridge inverter unit is controlled to output negative current, so that the working surface of the semiconductor refrigerating sheet is heated.
Further, the LCD screen is selected from an LCD screen and is used for displaying the measured temperature value and the set temperature value;
further, the key is a contact key used for inputting a temperature set value;
the semiconductor refrigeration piece with rated voltage of DC12V is selected;
the flexible heat conducting plate is made of heat conducting silica gel sheets, the semiconductor refrigerating sheet and the temperature sensor are uniformly distributed at different positions of the flexible heat conducting plate, and the flexible heat conducting plate is in close contact with a workpiece;
and the temperature sensor is used for sampling the temperature of the thin-wall cylinder workpiece in real time.
A flexible multi-point temperature control method based on arc material increase inside a thin-wall cylinder realizes real-time temperature control by using a temperature control device, and comprises the following steps:
(1) the flexible heat conducting plate is wrapped on the outer side of the thin-wall cylinder workpiece and is in close contact with the workpiece;
(2) before additive manufacturing, setting preheating temperature, locally heating the forming position of the thin-wall cylinder, and after the preheating temperature is reached, starting forming the characteristics of the support lug or the reinforcing rib;
(3) in the additive manufacturing process, interlayer temperature is set, after deposition of each layer is finished, local refrigeration is carried out on the thin-wall cylinder, the next layer of deposition is carried out after the set interlayer temperature is reached, and the process is circulated until the manufacturing is finished.
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
A flexible multi-point temperature control device based on arc material increase inside a thin-wall cylinder body is shown in figure 1 and comprises: the device comprises an inverter main circuit 1, a temperature control circuit 2, a semiconductor refrigerating sheet 3, a flexible heat conducting plate 4, a temperature sensor 5 and a thin-wall cylinder workpiece 6.
Referring to fig. 1, an inverter main circuit 1 is connected with an AC 220V AC power supply and a semiconductor cooling plate 3 to form a loop. The flexible heat conducting plate 4 is made of heat conducting silica gel sheets, and the semiconductor refrigerating sheets 3 and the temperature sensors 5 are uniformly distributed at different positions of the flexible heat conducting plate 4 and are in direct contact with the thin-wall cylinder workpiece 6. The temperature sensor 5 is connected with the temperature control circuit 2 through a lead to acquire the real-time temperature of the workpiece.
Referring to fig. 2, the semiconductor refrigerating plate 3 and the temperature sensor 5 are in close contact with the flexible heat conducting plate 4 through heat conducting silicone grease, are uniformly distributed on the flexible heat conducting plate 4 at multiple points, and the flexible heat conducting plate 4 is in direct contact with the thin-wall cylinder workpiece 6 and is locked through a spring fastener.
Referring to fig. 3, the main inverter circuit 1 includes a rectifying and filtering unit 101 and a full-bridge inverter unit 102. And the rectifying and filtering unit 101 converts the AC 220V alternating current into DC12V direct current. The full-bridge inversion unit 102 is connected with the semiconductor refrigeration chip 3, and the direction and the power of the output current of the full-bridge inversion unit 102 are controlled through the temperature control circuit 2, so that the heating/refrigeration and the power of the working surface of the semiconductor refrigeration chip 3 are controlled.
Referring to fig. 3, the temperature control circuit 2 includes a control system 201, a liquid crystal display 202 and buttons 203. The control system 201 is composed of an STC89C52 single chip microcomputer and peripheral circuits thereof, and includes a single chip microcomputer control unit 2011, a temperature sampling unit 2012, an output drive unit 2013, a setting control unit 2014, and a display control unit 2015.
Referring to fig. 3, the single chip microcomputer control unit 2011 is connected to the temperature sampling unit 2012, the output driving unit 2013, the setting control unit 2014, and the display control unit 2015.
Referring to fig. 3, the temperature sampling unit 2012 is connected to the temperature sensor 5 and the single chip microcomputer control unit 2011, and converts the temperature signal collected by the temperature sensor 5 into an electrical signal, which is input to the single chip microcomputer control unit 2011.
Referring to fig. 3, the output driving unit 2013 is connected to the single-chip microcomputer control unit 2011 and the full-bridge inverter unit 102, receives an output control signal output by the single-chip microcomputer control unit 2011, and outputs and drives the full-bridge inverter unit 102.
Referring to fig. 3, the setting control unit 2014 is connected to the single chip microcomputer control unit 2011 and the key 202, receives a setting temperature control signal given by the key 202, and inputs the setting temperature control signal to the single chip microcomputer control unit 2011.
Referring to fig. 3, the display control unit 2015 is connected to the single-chip microcomputer control unit 2011 and the liquid crystal display screen 203, receives the display control signal output by the single-chip microcomputer control unit 2011, outputs the display control signal to the liquid crystal display screen 203, and displays the set temperature and the actual temperature in real time.
Referring to fig. 3, the mcu 2011 compares the set temperature signal from the set controller 2014 with the actual temperature signal from the temperature sampler 2012. If the actual temperature value is higher than the set temperature value, controlling the full-bridge inverter unit 102 to output forward current, so that the working surface of the semiconductor refrigerating sheet is refrigerated; if the actual temperature value is lower than the set temperature value, the full-bridge inverter unit 102 is controlled to output negative current, so that the working surface of the semiconductor chilling plate is heated.
Example 2
A flexible multi-point temperature control method based on arc additive manufacturing inside a thin-wall cylinder utilizes a flexible multi-point temperature control device based on arc additive manufacturing inside the thin-wall cylinder in embodiment 1 to realize real-time control of the temperature of the cylinder wall in the arc additive manufacturing process.
The method comprises the following specific steps:
(1) the flexible heat conducting plate is wrapped on the outer side of a 7A09 aluminum alloy thin-wall cylinder (the outer diameter is 200mm, the length is 450mm), is in close contact with the cylinder wall and is locked by a spring fastener;
(2) before additive manufacturing, setting a preheating temperature (200 ℃), locally heating a forming position (the range of an angle of 60 degrees and 450mm along the axial length of a cylinder) of the thin-wall cylinder reinforcing rib characteristic, and starting forming of the reinforcing rib characteristic after the preheating temperature is reached;
(3) in the additive manufacturing process, interlayer temperature (150 ℃) is set, after deposition of each layer is finished, local refrigeration is carried out on the thin-wall cylinder, after the set interlayer temperature is reached, deposition of the next layer is carried out until the manufacturing of the reinforcing rib characteristics is finished;
(4) setting a preheating temperature (200 ℃), locally heating a forming position (within a range of 50mm from the end face of the cylinder and at an angle of 360 ℃) of the lug characteristic of the thin-wall cylinder, and starting forming the lug characteristic after the preheating temperature is reached;
(5) in the additive manufacturing process, interlayer temperature (150 ℃) is set, after deposition of each layer is finished, local refrigeration is carried out on the thin-wall cylinder, after the set interlayer temperature is reached, deposition of the next layer is carried out until the manufacturing of the support lug characteristics is finished.
Although specific embodiments of the present invention have been described above, it will be appreciated by those skilled in the art that these are merely examples and that many variations or modifications may be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims.
Claims (9)
1. A flexible multi-point temperature control device based on arc material increase inside a thin-wall cylinder comprises: the temperature control circuit comprises an inverter main circuit (1), a temperature control circuit (2), a plurality of semiconductor refrigeration pieces (3), a flexible heat conduction plate (4) and a temperature sensor (5); the inverter main circuit (1) is connected with an AC 220V alternating current power supply and a semiconductor refrigeration sheet (3) to form a loop; the surfaces of the plurality of semiconductor refrigeration pieces (3) are in close contact with the flexible heat conducting plate (4) through heat conducting silicone grease; the temperature sensor (5) is in close contact with the flexible heat conducting plate (4) through heat conducting silicone grease, and the temperature sensor (5) is connected with the temperature control circuit (2) through a lead; the temperature control circuit (2) is connected with the inverter main circuit (1) through a lead; the main inverter circuit (1) comprises a rectifying and filtering unit (101) and a full-bridge inverter unit (102).
2. The flexible multi-point temperature control device based on arc additive inside the thin-wall cylinder body according to claim 1, characterized in that the input end of the rectifying and filtering unit (101) is connected with an AC 220V power supply to convert AC 220V alternating current into DC12V direct current; the input end of the full-bridge inversion unit (102) is connected with the rectification filter unit (101), and the output end of the full-bridge inversion unit is connected with the semiconductor refrigerating sheet (3) and used for current commutation and power control, so that heating/refrigerating and power of the working surface of the semiconductor refrigerating sheet (3) are controlled.
3. A flexible multi-point temperature control device based on arc additive inside a thin-walled cylinder according to claim 1 or 2, characterized in that the temperature control circuit (2) comprises a control system (201), a liquid crystal display (202) and a key (203).
4. The flexible multi-point temperature control device based on the arc additive inside the thin-wall cylinder according to claim 3, wherein the control system (201) is composed of an STC89C52 single chip microcomputer and peripheral circuits thereof, and comprises a single chip microcomputer control unit (2011), a temperature sampling unit (2012), an output drive unit (2013), a setting control unit (2014) and a display control unit (2015).
5. The flexible multi-point temperature control device based on the arc additive inside the thin-wall cylinder according to claim 4, wherein the single-chip microcomputer control unit (2011) is connected with the temperature sampling unit (2012), the output driving unit (2013), the setting control unit (2014) and the display control unit (2015) through wires; the temperature sampling unit (2012) is connected with the temperature sensor (5) and the single chip microcomputer control unit (2011), and converts a temperature signal acquired by the temperature sensor (5) into an electric signal to be input into the single chip microcomputer control unit (2011); the output driving unit (2013) is connected with the single-chip microcomputer control unit (2011) and the full-bridge inversion unit (102), receives an output control signal output by the single-chip microcomputer control unit (2011), and outputs and drives the full-bridge inversion unit (102); the setting control unit (2014) is connected with the single chip microcomputer control unit (2011) and the key (203), receives a setting temperature control signal given by the key (203), and inputs the setting temperature control signal to the single chip microcomputer control unit (2011); display control unit (2015) links to each other with single chip microcomputer control unit (2011), liquid crystal display (202), receives the display control signal of single chip microcomputer control unit (2011) output to liquid crystal display (202), real-time demonstration settlement temperature and actual temperature.
6. The flexible multi-point temperature control device based on the arc additive inside the thin-wall cylinder according to claim 5, wherein the single-chip microcomputer control unit (2011) compares a set temperature signal input by the set control unit (2014) with an actual temperature signal input by the temperature sampling unit (2012); if the actual temperature value is higher than the set temperature value, controlling the full-bridge inverter unit (102) to output forward current so as to refrigerate the working surface of the semiconductor refrigerating sheet (3); if the actual temperature value is lower than the set temperature value, the full-bridge inverter unit (102) is controlled to output negative current, so that the working surface of the semiconductor refrigerating sheet (3) is heated.
7. The flexible multipoint temperature control device based on the arc additive inside the thin-wall cylinder according to claim 6, wherein the temperature control circuit (2) comprises a control system (201), a liquid crystal display (202) and a button (203), and the liquid crystal display (202) is selected from an LCD for displaying the temperature measured value and the temperature set value.
8. The flexible multipoint temperature control device based on the arc additive manufacturing inside the thin-wall cylinder body according to the claim 7 is characterized in that the semiconductor refrigeration piece (3) is a semiconductor refrigeration piece with rated voltage DC 12V; the flexible heat conducting plate (4) is made of heat conducting silica gel sheets, the semiconductor refrigerating sheet (3) and the temperature sensor (5) are uniformly distributed at different positions of the flexible heat conducting plate (4), and the flexible heat conducting plate (4) is in close contact with the thin-wall cylinder workpiece (6); and the temperature sensor (5) is used for sampling the temperature of the thin-wall cylinder workpiece (6) in real time.
9. A flexible multipoint temperature control method based on arc material increase inside a thin-wall cylinder, which utilizes the flexible multipoint temperature control device based on arc material increase inside the thin-wall cylinder according to claim 1 to realize real-time temperature control of a workpiece of the thin-wall cylinder, and comprises the following steps:
step one, a flexible heat conducting plate is coated on the outer side of a thin-wall cylinder workpiece and is in close contact with the workpiece;
setting a preheating temperature before additive manufacturing, locally heating the forming position of the thin-wall cylinder, and starting additive processing of the support lug or the reinforcing rib after the preheating temperature is reached;
after deposition of each layer is finished, local refrigeration is carried out on the thin-wall cylinder, and the next layer of deposition is carried out after the set interlayer temperature is reached;
and step four, repeating the step three until the manufacturing is finished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111590861.6A CN114281128B (en) | 2021-12-23 | 2021-12-23 | Flexible multi-point temperature control device and method based on electric arc material increase inside thin-wall cylinder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111590861.6A CN114281128B (en) | 2021-12-23 | 2021-12-23 | Flexible multi-point temperature control device and method based on electric arc material increase inside thin-wall cylinder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114281128A true CN114281128A (en) | 2022-04-05 |
| CN114281128B CN114281128B (en) | 2023-04-11 |
Family
ID=80874599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111590861.6A Active CN114281128B (en) | 2021-12-23 | 2021-12-23 | Flexible multi-point temperature control device and method based on electric arc material increase inside thin-wall cylinder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114281128B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110073166A (en) * | 2009-12-21 | 2011-06-29 | 한국전자통신연구원 | Flexible thermoelectric generator and wireless sensor node comprising the same |
| CN206646146U (en) * | 2016-12-19 | 2017-11-17 | 德阳新升机电有限责任公司 | Heat-treatment furnace temperature control system |
| CN108618888A (en) * | 2018-06-19 | 2018-10-09 | 武汉工程大学 | A kind of cold and hot patch of distributed temperature control |
| CN109317793A (en) * | 2018-11-27 | 2019-02-12 | 西安增材制造国家研究院有限公司 | A kind of plasma-arc fuse increasing material manufacturing device and method |
| CN209751345U (en) * | 2018-11-19 | 2019-12-10 | 庆阳欧维机电设备有限公司 | electronic cold compress device |
-
2021
- 2021-12-23 CN CN202111590861.6A patent/CN114281128B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110073166A (en) * | 2009-12-21 | 2011-06-29 | 한국전자통신연구원 | Flexible thermoelectric generator and wireless sensor node comprising the same |
| CN206646146U (en) * | 2016-12-19 | 2017-11-17 | 德阳新升机电有限责任公司 | Heat-treatment furnace temperature control system |
| CN108618888A (en) * | 2018-06-19 | 2018-10-09 | 武汉工程大学 | A kind of cold and hot patch of distributed temperature control |
| CN209751345U (en) * | 2018-11-19 | 2019-12-10 | 庆阳欧维机电设备有限公司 | electronic cold compress device |
| CN109317793A (en) * | 2018-11-27 | 2019-02-12 | 西安增材制造国家研究院有限公司 | A kind of plasma-arc fuse increasing material manufacturing device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114281128B (en) | 2023-04-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101774079B (en) | Method and device for controlling residual stress on stir friction welding surface | |
| CN102781129B (en) | Self-adaptive electro-magnetic induction heating controller | |
| CN114281128B (en) | Flexible multi-point temperature control device and method based on electric arc material increase inside thin-wall cylinder | |
| CN109352160A (en) | A kind of preparation method of high-frequency impulse connection aluminum/magnesium alloy composite material | |
| CN109728750A (en) | A kind of thermoelectric conversion device and its working method | |
| CN206405671U (en) | A kind of digital air-cooled dismounting hot charging equipment | |
| CN109871049B (en) | Multi-zone temperature control system of hot forming equipment | |
| CN105127561B (en) | A kind of welding controller | |
| CN212357379U (en) | Portable temperature-changing sample stage device | |
| CN116422710A (en) | Medium frequency induction heating type temperature roller device control system and algorithm | |
| CN202496095U (en) | High-frequency machine capacitor cooling device | |
| CN214054148U (en) | Tooling mechanism for welding civil air defense door frame | |
| CN108239784A (en) | Zone melting furnace system | |
| CN210367776U (en) | Automatic high-frequency induction quenching device | |
| CN206890911U (en) | A kind of heat abstractor of vehicle-mounted charge module | |
| CN209183632U (en) | A kind of tab shaping mechanism and tab molding equipment | |
| CN210387891U (en) | Welding machine power supply | |
| CN111501002A (en) | Portable temperature-changing sample stage device | |
| CN206116110U (en) | Hot repairing equipment of silane crosslinked polyethylene insulated cable | |
| CN201500849U (en) | Inversion type copper-aluminium pipe butt welder | |
| CN219483781U (en) | Medium frequency induction heating type control system for warm roller device | |
| CN105364248B (en) | High frequency brazing machine plc control device | |
| CN106222389B (en) | A kind of clamping tooling for heating and solid solution heat treatment device | |
| CN220711736U (en) | Solder resist positioning tool and solder resist positioning equipment for circuit board processing | |
| WO2019033606A1 (en) | Welding machine with remote diagnosis function and system thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |