CN114280079A - Improvement method of AOI test process for printed circuit board production - Google Patents
Improvement method of AOI test process for printed circuit board production Download PDFInfo
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- CN114280079A CN114280079A CN202111612946.XA CN202111612946A CN114280079A CN 114280079 A CN114280079 A CN 114280079A CN 202111612946 A CN202111612946 A CN 202111612946A CN 114280079 A CN114280079 A CN 114280079A
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- 238000012360 testing method Methods 0.000 title claims abstract description 82
- 238000000034 method Methods 0.000 title claims abstract description 45
- 230000008569 process Effects 0.000 title claims abstract description 30
- 230000006872 improvement Effects 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 238000012216 screening Methods 0.000 claims abstract description 75
- 210000001503 joint Anatomy 0.000 claims abstract description 13
- 230000007547 defect Effects 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 12
- 238000005476 soldering Methods 0.000 claims description 11
- 230000000007 visual effect Effects 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000004973 liquid crystal related substance Substances 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000007689 inspection Methods 0.000 description 6
- 230000008439 repair process Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004886 process control Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
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- 238000012544 monitoring process Methods 0.000 description 1
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Abstract
The invention discloses an improvement method of an AOI test process for producing a printed circuit board, which comprises an AOI test machine, a screening machine, a centralized control center module, a signal wire and an automatic board collecting machine, wherein the AOI test machine is connected with the screening machine; the screening machine is connected with the AOI testing machine in a butt joint mode, and the testing process improving step is further included. According to the invention, the screening machine, the signal line, the centralized control center software and the board collecting machine are designed and assembled at the rear of the AOI testing machine, when the screening machine works, whether the products are transmitted to the board collecting machine or not is controlled by the signal line according to the judgment information (OK or NG) acquired by the centralized control center software (OK is transmitted, NG is transmitted into the screening machine to be confirmed by personnel), and finally, the products of two lines can be tested by only one testing person and one testing computer during testing.
Description
Technical Field
The invention belongs to the technical field of improvement of a circuit board testing process, and particularly relates to an improvement method of an AOI testing process for producing a printed circuit board.
Background
AOI (automated Optical inspection) is called automatic Optical inspection, and is equipment for detecting common defects encountered in welding production based on an Optical principle, AOI is a new emerging testing technology, but the AOI is developed rapidly, and a plurality of manufacturers provide AOI testing equipment; various different mounting errors and welding defects on the PCB are automatically detected by using a high-speed high-precision vision processing technology. The PCB board can range from a fine pitch high density board to a low density large size board, and can provide an on-line inspection scheme to improve production efficiency, and soldering quality. By using AOI as a defect reduction tool, errors are located and eliminated early in the assembly process to achieve good process control. Early detection of defects will avoid sending a bad board to a subsequent assembly stage, AOI will reduce repair costs and will avoid scrapping an unrepairable circuit board.
In the AOI test process for producing the printed circuit board, one production line is provided with an AOI tester to follow the line to test products in the current stage, the tester has fragment free time, but the spare time cannot be fully utilized, so that the labor cost cannot be reduced, and therefore the AOI test process improvement method for producing the printed circuit board is provided for solving the problems in the prior art.
Summary of the invention
The invention aims to provide an improved AOI test method for producing a printed circuit board, which is characterized in that a screening machine, a signal wire and centralized control center software are automatically designed and assembled behind an AOI test machine, the plate collecting machine controls whether the rail transmits the product to the plate collecting machine or not through the signal line according to the judgment information (OK or NG) acquired by the centralized control center software when the screening machine works (OK is transmitted, NG is transmitted into the screening machine to be confirmed by personnel), finally, the product of two lines can be tested only by one testing personnel and one testing computer when the test is carried out, the centralized control center software which is designed and developed by self integrates the screening machine and the plate collecting machine into a set of control system, the operation mode is optimized, the purpose that one testing personnel tests the product produced by the two production lines to reduce manpower and reduce cost is achieved, and the problems in the prior art are solved.
In order to achieve the purpose, the invention adopts the following technical scheme:
an improvement method of an AOI test process for producing a printed circuit board comprises the following steps:
the system comprises an AOI testing machine, a screening machine, a centralized control center module, a signal wire and an automatic plate collecting machine;
the screening machine is in butt joint with the AOI testing machine, the automatic plate receiving machine is in butt joint with the screening machine, the automatic plate receiving machine is in butt joint with the AOI testing machine through the screening machine, and the centralized control center module controls the screening machine through a signal line;
the AOI testing machine is used for carrying out automatic optical detection on the printed circuit board on the circuit board production line, the screening machine is used for receiving a control signal of the screening machine through a signal line and judging whether a product is transmitted to the board receiving machine through a signal line control track or not according to control information of the screening machine, the centralized control center module is used for carrying out NG secondary screening on the product and outputting the control signal to the screening machine through the signal line, the signal line is used for transmitting a signal from the centralized control center module to the track, and the automatic board receiving machine is used for receiving the OK product according to judgment information;
also comprises the following steps:
firstly, designing and assembling a screening machine, a signal line, centralized control center software and a board collecting machine at the rear of an AOI testing machine table; when the screening machine works, judging information acquired by centralized control center software comprises two groups of OK or NG;
in addition, the screening machine controls whether the track transmits the product to the board receiving machine or not through the signal line, if the judgment information is OK, the product is transmitted to the board receiving machine, and if the judgment information is NG, the product enters the screening machine to be confirmed by personnel; finally, the product with two line bodies can be tested by only one tester and one testing computer in the test process, so that the purposes of reducing manpower and reducing cost are achieved.
Preferably, the system further comprises a centralized management judgment system and an MES management system, the centralized control center module is arranged inside the centralized management judgment system, and the centralized management judgment system and the screening machine are both connected to the MES management system.
Preferably, the AOI testing machine is in butt joint with reflow soldering equipment, and the reflow soldering equipment is set to be a lead-free intelligent reflow soldering machine with an upper independent heating module, a lower independent heating module and independent hot air circulation.
Preferably, conveying rails are arranged among the screening machine, the automatic plate collecting machine and the AOI testing machine, a plurality of groups of conveying rails are arranged on the conveying rails and are controlled by the centralized control center module through signal lines, and the plurality of groups of conveying rails correspond to the screening machine and the plate collecting machine.
Preferably, the AOI testing machines, the screening machines and the automatic board collecting machines of the plurality of circuit board production lines correspond to a centralized management determination system and an MES management system, and the screening machines of the plurality of circuit board production lines are all connected to the centralized management determination system and the MES management system.
Preferably, the AOI tester is set as an AOI tester with a high-speed line array camera and the resolution is at least 13 μm/PIXEL, and a circuit board of the AOI tester can detect defect types including open circuit, short circuit, notch, concave-convex copper, pinhole, residual copper and line width and line distance violation.
Preferably, the centralized management judgment system is provided with a centralized control computer, the centralized control computer is provided with a basic input device and a basic output device, and the centralized management judgment system is provided with a control station for a worker to observe the centralized control computer.
Preferably, the basic input device comprises a keyboard and a mouse, the basic output device comprises a high-definition liquid crystal display screen and an audible and visual alarm, the high-definition liquid crystal display screen is used for displaying the AOI detection images of the circuit boards of the circuit board production lines of the centralized control center module and judgment signals of the AOI detection images, and the audible and visual alarm is used for sending different audible and visual alarm signals when NG signals and OK signals are output.
The invention has the technical effects and advantages that: compared with the prior art, the AOI testing process improving method for producing the printed circuit board has the following advantages that:
according to the invention, the screening machine, the signal line, the centralized control center software and the board collecting machine are designed and assembled at the rear of the AOI testing machine, when the screening machine works, whether the products are transmitted to the board collecting machine or not is controlled by the signal line according to the judgment information (OK or NG) acquired by the centralized control center software (OK is transmitted, NG is transmitted into the screening machine to be confirmed by personnel), and finally, the products of two lines can be tested by only one testing person and one testing computer during testing.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
FIG. 1 is a schematic diagram of the testing process of the present invention before the AOI testing process is improved;
FIG. 2 is a schematic diagram of the actual operation of the AOI testing process of the present invention;
FIG. 3 is a schematic diagram of the testing process after AOI testing process improvement of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The specific embodiments described herein are merely illustrative of the invention and do not delimit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The present invention provides embodiments as shown in fig. 1-3:
an improvement method of an AOI test process for producing a printed circuit board comprises the following steps:
the system comprises an AOI testing machine, a screening machine, a centralized control center module, a signal wire and an automatic plate collecting machine;
the screening machine is in butt joint with the AOI testing machine, the automatic plate receiving machine is in butt joint with the screening machine, the automatic plate receiving machine is in butt joint with the AOI testing machine through the screening machine, and the centralized control center module controls the screening machine through a signal line;
the AOI testing machine is used for carrying out automatic optical detection on the printed circuit board on the circuit board production line, the screening machine is used for receiving a control signal of the screening machine through a signal line and judging whether a product is transmitted to the board receiving machine through a signal line control track or not according to control information of the screening machine, the centralized control center module is used for carrying out NG secondary screening on the product and outputting the control signal to the screening machine through the signal line, the signal line is used for transmitting a signal from the centralized control center module to the track, and the automatic board receiving machine is used for receiving the OK product according to judgment information;
also comprises the following steps:
firstly, designing and assembling a screening machine, a signal line, centralized control center software and a board collecting machine at the rear of an AOI testing machine table; when the screening machine works, judging information acquired by centralized control center software comprises two groups of OK or NG; the centralized management system comprises a centralized management judgment system and an MES management system, wherein the centralized control center module is arranged inside the centralized management judgment system, and the centralized management judgment system and the screening machine are both connected with the MES management system.
In addition, the screening machine controls whether the track transmits the product to the board receiving machine or not through the signal line, if the judgment information is OK, the product is transmitted to the board receiving machine, and if the judgment information is NG, the product enters the screening machine to be confirmed by personnel; finally, the purpose that only one tester needs one testing computer to test the products of the two wire bodies during testing is achieved, so that the manpower is reduced, and the cost is reduced;
during automatic detection, the machine automatically scans the PCB through the camera, acquires an image, compares the tested welding spot with qualified parameters in the database, inspects the defects on the PCB through image processing, and displays/marks the defects through a display or an automatic mark for repair personnel to repair; various different mounting errors and welding defects on the PCB are automatically detected by using a high-speed high-precision vision processing technology. The PCB board can range from a fine pitch high density board to a low density large size board, and can provide an on-line inspection scheme to improve production efficiency, and soldering quality. By using AOI as a defect reduction tool, errors are located and eliminated early in the assembly process to achieve good process control. Early detection of defects will avoid sending a bad board to a subsequent assembly stage, AOI will reduce repair costs and will avoid scrapping an unrepairable circuit board.
In the production process of a specific printed circuit board, there are two main types of targets for implementing AOI:
final quality: and monitoring the final state of the product when the product is moved off the production line. This goal is preferred when production problems are well understood, product mix is high, quantity and speed are critical factors. The AOI is typically placed at the very end of the production line. At this location, the device may generate a wide range of process control information;
process tracking: inspection equipment is used to monitor the production process. Typically including detailed defect classification and component placement offset information. Manufacturers prefer this goal when product reliability is important, high volume manufacturing with low mix, and stable supply of components. This often requires that inspection equipment be placed at several locations on the production line, that the particular production conditions be monitored on-line, and that necessary basis be provided for the adjustment of the production process.
The AOI testing machine is in butt joint with reflow soldering equipment, and the reflow soldering equipment is set to be a lead-free intelligent reflow soldering machine with an upper independent heating module, a lower independent heating module and independent hot air circulation; the AOI tester is set to be an AOI tester with a high-speed linear array camera and the resolution of at least 13 mu m/PIXEL, and a circuit board of the AOI tester can detect defect types including open circuit, short circuit, notch, concave-convex copper, pinhole, residual copper and line width and line distance violation.
Conveying rails are arranged among the screening machine, the automatic plate collecting machine and the AOI testing machine, a plurality of groups of conveying rails are arranged on the conveying rails and are controlled by a centralized control center module through signal lines, and the plurality of groups of conveying rails correspond to the screening machine and the plate collecting machine; the AOI testing machines, the screening machines and the automatic board collecting machines of the circuit board production lines correspond to a centralized management judging system and an MES management system, and the screening machines of the circuit board production lines are all connected with the centralized management judging system and the MES management system.
The centralized management judging system is provided with a centralized control computer, the centralized control computer is provided with basic input equipment and basic output equipment, and a control station for workers to observe the centralized control computer is arranged; the basic input equipment comprises a keyboard and a mouse, the basic output equipment comprises a high-definition liquid crystal display screen and an audible and visual alarm, the high-definition liquid crystal display screen is used for displaying AOI detection images of circuit boards of a plurality of circuit board production lines of the centralized control center module and judgment signals of the AOI detection images, and the audible and visual alarm is used for sending different audible and visual alarm signals when NG signals and OK signals are output.
In summary, the method for improving the AOI testing process for producing the printed circuit board according to the present invention automatically designs and assembles the screening machine, the signal line, the centralized control center software and the board receiving machine behind the AOI testing machine, when the screening machine works, the screening machine controls whether the product is transmitted to the board receiving machine through the signal line control track according to the judgment information (OK or NG) acquired by the centralized control center software (OK is transmitted, NG is transmitted to the screening machine for confirmation by the personnel), and finally, the product of two lines can be tested only by one testing personnel and one testing computer during the testing, and the automatically designed and developed centralized control center software integrates the screening machine and the board receiving machine into a set of control system, thereby optimizing the operation mode, and realizing the purpose that one testing personnel tests the products produced by two production lines to reduce labor and cost.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (8)
1. An improvement method of an AOI test process for producing a printed circuit board is characterized by comprising the following steps:
the system comprises an AOI testing machine, a screening machine, a centralized control center module, a signal wire and an automatic plate collecting machine;
the screening machine is in butt joint with the AOI testing machine, the automatic plate receiving machine is in butt joint with the screening machine, the automatic plate receiving machine is in butt joint with the AOI testing machine through the screening machine, and the centralized control center module controls the screening machine through a signal line;
the AOI testing machine is used for carrying out automatic optical detection on the printed circuit board on the circuit board production line, the screening machine is used for receiving a control signal of the screening machine through a signal line and judging whether a product is transmitted to the board receiving machine through a signal line control track or not according to control information of the screening machine, the centralized control center module is used for carrying out NG secondary screening on the product and outputting the control signal to the screening machine through the signal line, the signal line is used for transmitting a signal from the centralized control center module to the track, and the automatic board receiving machine is used for receiving the OK product according to judgment information;
also comprises the following steps:
firstly, designing and assembling a screening machine, a signal line, centralized control center software and a board collecting machine at the rear of an AOI testing machine table; when the screening machine works, judging information acquired by centralized control center software comprises two groups of OK or NG;
in addition, the screening machine controls whether the track transmits the product to the board receiving machine or not through the signal line, if the judgment information is OK, the product is transmitted to the board receiving machine, and if the judgment information is NG, the product enters the screening machine to be confirmed by personnel; finally, the product with two line bodies can be tested by only one tester and one testing computer in the test process, so that the purposes of reducing manpower and reducing cost are achieved.
2. The improvement method of AOI test process for producing printed circuit board according to claim 1, wherein: the centralized management system comprises a centralized management judgment system and an MES management system, wherein the centralized control center module is arranged inside the centralized management judgment system, and the centralized management judgment system and the screening machine are both connected with the MES management system.
3. The improvement method of AOI test process for producing printed circuit board according to claim 1, wherein: the AOI testing machine is in butt joint with reflow soldering equipment, and the reflow soldering equipment is set to be a lead-free intelligent reflow soldering machine with an upper independent heating module, a lower independent heating module and independent hot air circulation.
4. The improvement method of AOI test process for producing printed circuit board according to claim 1, wherein: conveying rails are arranged among the screening machine, the automatic plate collecting machine and the AOI testing machine, a plurality of groups of conveying rails are arranged on the conveying rails and are controlled by a centralized control center module through signal lines, and the plurality of groups of conveying rails correspond to the screening machine and the plate collecting machine.
5. The improvement method of AOI test process for producing printed circuit board according to claim 2, wherein: the AOI testing machines, the screening machines and the automatic board collecting machines of the circuit board production lines correspond to a centralized management judging system and an MES management system, and the screening machines of the circuit board production lines are all connected with the centralized management judging system and the MES management system.
6. The improvement method of AOI test process for producing printed circuit board according to claim 1, wherein: the AOI tester is set to be an AOI tester with a high-speed linear array camera and the resolution of at least 13 mu m/PIXEL, and a circuit board of the AOI tester can detect defect types including open circuit, short circuit, notch, concave-convex copper, pinhole, residual copper and line width and line distance violation.
7. The improvement method of AOI test process for producing printed circuit board according to claim 2, wherein: the centralized management judging system is provided with a centralized control computer, the centralized control computer is provided with a basic input device and a basic output device, and a control station for workers to observe the centralized control computer is arranged.
8. The improvement method of AOI test process for producing printed circuit board according to claim 7, wherein: the basic input equipment comprises a keyboard and a mouse, the basic output equipment comprises a high-definition liquid crystal display screen and an audible and visual alarm, the high-definition liquid crystal display screen is used for displaying AOI detection images of circuit boards of a plurality of circuit board production lines of the centralized control center module and judgment signals of the AOI detection images, and the audible and visual alarm is used for sending different audible and visual alarm signals when NG signals and OK signals are output.
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| CN202111612946.XA CN114280079A (en) | 2021-12-27 | 2021-12-27 | Improvement method of AOI test process for printed circuit board production |
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| WO2021027184A1 (en) * | 2019-08-09 | 2021-02-18 | 苏州康代智能科技股份有限公司 | Pcb maintenance system and maintenance method based on false point defect detection |
| CN112415973A (en) * | 2020-11-24 | 2021-02-26 | 广州广合科技股份有限公司 | Intelligent control method and system for inner layer AOI (automated optical inspection) process |
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2021
- 2021-12-27 CN CN202111612946.XA patent/CN114280079A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107396538A (en) * | 2017-07-21 | 2017-11-24 | 泓辉电子（重庆）有限公司 | A kind of mainboard production line automation production management method |
| CN107817774A (en) * | 2017-11-21 | 2018-03-20 | 吉安市满坤科技有限公司 | A kind of printed circuit board intelligence manufacture technique |
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Application publication date: 20220405 |