CN114267701A - Display panel, manufacturing method thereof and display device - Google Patents

Display panel, manufacturing method thereof and display device Download PDF

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Publication number
CN114267701A
CN114267701A CN202010962620.9A CN202010962620A CN114267701A CN 114267701 A CN114267701 A CN 114267701A CN 202010962620 A CN202010962620 A CN 202010962620A CN 114267701 A CN114267701 A CN 114267701A
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Prior art keywords
layer
light
display panel
color film
substrate base
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CN202010962620.9A
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Inventor
陈鹏
孙阔
赵梓汝
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN202010962620.9A priority Critical patent/CN114267701A/en
Priority to US17/789,390 priority patent/US20230031404A1/en
Priority to PCT/CN2021/110670 priority patent/WO2022052686A1/en
Publication of CN114267701A publication Critical patent/CN114267701A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

The embodiment of the disclosure provides a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises: a substrate base plate; a plurality of light emitting devices on the substrate base; the packaging layer is positioned on one side of the light-emitting device, which is far away from the substrate and is used for packaging the plurality of light-emitting devices; the photosensitive sensor is positioned on one side of the light-emitting device, which is far away from the packaging layer; the color film layer is positioned on one side of the packaging layer, which is far away from the substrate; the color film layer comprises a plurality of color film units, and the orthographic projection of the color film units on the substrate and the orthographic projection of the light-emitting device on the substrate have an overlapped area; the light shielding layer is positioned on one side of the packaging layer, which is far away from the substrate; the light-shielding layer includes: a plurality of first openings, and a plurality of second openings; the second opening is filled with a light filtering unit; the second opening is used for transmitting the light reflected by the finger to the photosensitive sensor so as to image the light reflected by the finger at the position of the photosensitive sensor.

Description

Display panel, manufacturing method thereof and display device
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device.
Background
With the rapid development of display technology, the requirements of Organic Light-Emitting diodes (OLEDs) on the appearance are gradually increased in addition to the functions of traditional information display, and the larger screen occupation ratio is the trend of the future market, so the under-screen fingerprint identification technology is popular with consumers.
However, for a display with an underscreen fingerprint identification function, the transmittance needs to reach more than 2.5% to meet the requirement of mass production, thereby increasing the reflectivity of the screen and affecting the display effect.
Disclosure of Invention
The display panel provided by the embodiment of the disclosure, wherein, include:
a substrate base plate;
a plurality of light emitting devices on the substrate base plate;
the packaging layer is positioned on one side of the light-emitting device, which is far away from the substrate and is used for packaging the light-emitting devices;
the photosensitive sensor is positioned on one side of the light-emitting device, which is far away from the packaging layer;
the color film layer is positioned on one side of the packaging layer, which is far away from the substrate base plate; the color film layer comprises a plurality of color film units, and the orthographic projection of the color film units on the substrate and the orthographic projection of the light-emitting device on the substrate have an overlapping region;
the light shielding layer is positioned on one side of the packaging layer, which is far away from the substrate; the light-shielding layer includes: a plurality of first openings, and a plurality of second openings; an overlapping region is formed between the orthographic projection of the first opening on the substrate and the orthographic projection of the color film unit on the substrate, and a filtering unit is filled in the second opening; the second opening is used for enabling light reflected by the finger to penetrate through and emit to the photosensitive sensor, so that the light reflected by the finger is imaged at the position of the photosensitive sensor.
Optionally, in an embodiment of the present disclosure, the color film layer includes the color film unit of at least three colors; the color film units of different colors can transmit light rays of different colors;
the material of the light filtering unit is the same as that of the color film unit with at least one color.
Optionally, in an embodiment of the present disclosure, the color film units include a green color film unit capable of transmitting green light;
and the material of the light filtering unit is the same as that of the green color film unit.
Optionally, in an embodiment of the present disclosure, the photosensitive sensor is located on a side of the substrate base plate facing away from the light emitting device.
Optionally, in an embodiment of the present disclosure, the light emitting device includes: the first electrode, the second electrode located on the side of the first electrode departing from the substrate base plate, and the light-emitting layer located between the first electrode and the second electrode;
the display panel further includes: the light blocking layer is positioned between the substrate base plate and the light emitting layer;
the light blocking layer comprises a plurality of third openings, and the orthographic projection of the third openings on the substrate base plate and the orthographic projection of the second openings on the substrate base plate have an overlapping area.
Optionally, in an embodiment of the present disclosure, the method further includes: a pixel defining layer;
the pixel defining layer is used for defining the area of each light emitting device;
the pixel defining layer comprises a material that is opaque to light, the pixel defining layer being multiplexed as the light blocking layer;
the pixel defining layer also includes a plurality of fourth openings having an overlapping area of an orthographic projection of the fourth openings on the substrate base plate and an orthographic projection of the first electrodes on the substrate base plate.
Optionally, in this disclosure, the material of the pixel defining layer is black photosensitive organic matter.
Optionally, in an embodiment of the present disclosure, the method further includes: a first conductive layer between the substrate base and the light emitting device, a second conductive layer between the substrate base and the first conductive layer, and a third conductive layer between the first conductive layer and the second conductive layer;
the first conducting layer comprises a plurality of fifth openings, and the orthographic projection of the fifth openings on the substrate base plate and the orthographic projection of the second openings on the substrate base plate have an overlapping area;
the orthographic projection of the pattern of the second conducting layer on the substrate base plate and the orthographic projection of the second opening on the substrate base plate are not overlapped;
the orthographic projection of the pattern of the third conducting layer on the substrate base plate and the orthographic projection of the second opening on the substrate base plate are not overlapped.
Optionally, in an embodiment of the present disclosure, the method further includes: a thin film transistor;
the first conductive layer includes a conductive connection portion;
the input end of the thin film transistor is electrically connected with the first electrode through the conductive connecting part.
Optionally, in an embodiment of the present disclosure, the method further includes: and the touch detection layer is positioned between the packaging layer and the color film layer.
Optionally, in an embodiment of the present disclosure, an aperture size of the third opening is smaller than an aperture size of the second opening.
Optionally, in an embodiment of the present disclosure, a pore size of the third opening is in a range of 5 μm to 6 μm, and a pore size of the second opening is in a range of 6 μm to 8 μm.
Optionally, in an embodiment of the present disclosure, an orthogonal projection of the plurality of second openings on the substrate base plate is located within a range of an orthogonal projection of the photosensitive sensor on the substrate base plate.
Correspondingly, this disclosed embodiment also provides a display device, wherein, includes: the display panel is provided.
Correspondingly, the embodiment of the present disclosure further provides a manufacturing method of the display panel, where the manufacturing method includes:
forming a plurality of light emitting devices over a base substrate;
forming an encapsulation layer over the plurality of light emitting devices to encapsulate the plurality of light emitting devices;
forming a color film layer on the packaging layer, and patterning the color film layer to obtain a plurality of color film units;
forming a light shielding layer on the packaging layer, and patterning the light shielding layer to obtain a plurality of first openings and a plurality of second openings; filling a filtering unit in the second opening;
and attaching the manufactured photosensitive sensor to one side of the substrate base plate, which is far away from the light-emitting device.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of a display panel according to an embodiment of the disclosure;
fig. 2 is a schematic top view of a display panel according to an embodiment of the disclosure;
fig. 3 is a second schematic cross-sectional view illustrating a display panel according to an embodiment of the disclosure;
fig. 4 is a flowchart of a manufacturing method of the display panel according to the embodiment of the disclosure.
Detailed Description
The embodiment of the disclosure provides a display panel, a manufacturing method thereof and a display device, aiming at the problem of high screen reflectivity of a display in the related art.
Embodiments of a display panel, a method for manufacturing the display panel, and a display device according to embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The thicknesses and shapes of the various film layers in the drawings are not to be considered true proportions, but are merely illustrative of the present disclosure.
An embodiment of the present disclosure provides a display panel, as shown in fig. 1, including:
a base substrate 10;
a plurality of light emitting devices 11 on the base substrate 10;
an encapsulation layer 12, located on a side of the light emitting device 11 away from the substrate base plate 10, for encapsulating the plurality of light emitting devices 11;
a photosensor 16 located on a side of the light emitting device 11 facing away from the encapsulation layer 12;
the color film layer is positioned on one side of the packaging layer 12, which is far away from the substrate base plate 10; the color film layer comprises a plurality of color film units 131; the orthographic projection of the color film unit 131 on the substrate 10 and the orthographic projection of the light emitting device 11 on the substrate 10 have an overlapping region, for example, a plurality of color film units in the color film layer may be set to respectively correspond to the light emitting devices 11;
a light shielding layer 14 positioned on a side of the encapsulation layer 12 facing away from the substrate 10; the light-shielding layer 14 includes: a plurality of first openings U1, and a plurality of second openings U2; an overlapping region exists between an orthographic projection of the first opening U1 on the substrate 10 and an orthographic projection of the color film unit 131 on the substrate 10, for example, a plurality of first openings U1 may be set to correspond to each color film unit 131, and the second opening U2 is filled with the filter unit 132; the second opening U2 is used to transmit and direct light reflected by the finger F toward the photosensor 16 so that the light reflected by the finger F is imaged at the position of the photosensor 16.
The embodiment of the disclosure provides an among the display panel, through set up a plurality of second trompils in the light shield layer, the second trompil can regard as the formation of image aperture that realizes fingerprint identification, make the light of finger reflection see through and directive photosensitive sensor, so that the light of finger reflection images in photosensitive sensor's position department, thereby realize the fingerprint identification function, through set up the second trompil as formation of image aperture in the light shield layer, adopt the mode of aperture formation of image to realize fingerprint identification, need not to set up intensive trompil, thereby reduce the total area of trompil, reduce display panel's reflectivity. And, through pack the filtering unit in the second opening, can filter some light and further reduce the reflectivity of display panel.
And, one side through deviating from the substrate base plate at the encapsulated layer sets up various rete and light shield layer, because various rete and light shield layer all have the light absorption effect to can utilize various rete and light shield layer to absorb ambient light, with the reflectivity that further reduces display panel.
The encapsulating layer 12 can encapsulate each light emitting device 11, and prevent moisture and oxygen from entering the inside of the display panel, thereby preventing moisture and oxygen from damaging the light emitting devices 11. Specifically, the encapsulation layer 12 may include an inorganic film layer 121 and an organic film layer 122 stacked.
The color film layer includes a plurality of color film units 131, and each color film unit 131 corresponds to each light emitting device 11, specifically, the color film layer may include color film units 131 of at least three colors, for example, may include a red color film unit, a green color film unit, and a blue color film unit, and the color film units may allow light rays of corresponding colors to pass through and filter light rays of other colors, so as to enable the display panel to realize color display. Specifically, the main material of the color film unit 131 is a photosensitive resin material, pigments of different colors are dispersed in the photosensitive resin material, so that the color film unit 131 of different colors can be obtained, in the manufacturing process, the photosensitive resin material containing the pigments can be coated on the encapsulation layer, a color film unit of the same color can be obtained through the processes of exposure, development and the like, and a plurality of color film units 131 of at least three colors can be obtained through the processes of repeated exposure, development and the like. In a specific implementation, other photosensitive organic matters may also be used to manufacture the color film unit, for example, a polyimide material may be used to manufacture the color film unit, which is not limited herein.
The light shielding layer 14 includes a plurality of first openings U1 and a plurality of second openings U2, where the first opening U1 corresponds to a position of the color film unit 131, so that light emitted from the light emitting device 11 can be emitted through the corresponding first opening U1 after passing through the color film unit 131, thereby implementing a picture display function, and the second opening U2 corresponds to a position between adjacent color film units 131, that is, the second opening U2 is located in a pixel non-opening area of the display panel. In addition, one second opening U2 may be provided for every 8 to 10 pixels, and the distance between adjacent second openings U2 is large, so that the total area of the openings in the light-shielding layer 14 is small, thereby reducing the reflectivity of the display panel. Specifically, the plurality of second openings U2 in the light-shielding layer 14 may be arranged in a matrix manner, or may be arranged in other manners, which is not limited herein.
Specifically, the photosensor 16 may be located on a side of the substrate 10 away from the light emitting device 11, the photosensor is disposed on the whole surface, and an Optical Clear Adhesive (OCA) may be used to attach the photosensor to the lower side of the substrate 10, so that the photosensor 16 does not affect the normal display of the display panel. Specifically, the light sensor 16 may include a plurality of light sensing elements and a control circuit, where the light sensing elements may be Photodiodes (PINs), the control circuit may include a plurality of thin film transistors (tfts), signal lines, and the like, and in an actual application process, the plurality of light sensing elements and the control circuit may be fabricated on a silicon-based substrate, and then the obtained light sensor is attached to a side of the substrate away from the light emitting device. Specifically, the size of the photo sensor may be set between 1cm × 1cm and 4cm × 4cm so as to be able to detect the fingerprint of the entire finger. Fig. 2 is a schematic top view of the display panel, and as shown in fig. 2, the light sensor may be disposed at a position corresponding to the fingerprint identification area C. The figure illustrates the fingerprint identification area C disposed at a position below the screen, and in a specific implementation, the fingerprint identification area C may be disposed at other positions, which is not limited herein.
In practical implementation, the light emitted from the light emitting devices 11 around the second opening U2 is emitted to the finger F, the reflected light a is obtained by the reflection of the finger F, the reflected light a passes through the second opening U2 and then is emitted to the photosensor 16, and the photosensor 16 can receive the image formed by the plurality of second openings U2, so that the image received by the photosensor 16 is a circular pattern arranged in a matrix, and the circular patterns are combined into one pattern by image processing, thereby obtaining the fingerprint pattern of the finger.
Further, in the display panel provided in the embodiment of the present disclosure, as shown in fig. 1, the second opening U2 is filled with the filtering unit 132. The filtering unit 132 may filter a part of light, and may filter a part of light reflected by the reflected light a of the finger F, so as to further reduce the reflectivity of the screen, for example, the transmittance of the filtering unit 132 is about 50%, the reflectivity of the second electrode 112 in the light emitting device 11 is about 50%, when the filtering unit 132 is not provided, the reflectivity of the reflected light a after being emitted to the second electrode 112 is 50%, after the filtering unit 132 is provided, the reflected light a passes through the filtering unit 132, and after being reflected by the second electrode 112, passes through the filtering unit 132 again, so that the reflectivity may be reduced by 25%, thereby greatly reducing the reflectivity of the display panel.
In specific implementation, as shown in fig. 1, the color film layer of the display panel provided in the embodiment of the disclosure includes color film units of at least three colors, and the color film units of different colors can transmit light rays of different colors, for example, the display panel may include a red color film unit, a green color film unit, and a blue color film unit;
the material of the filter unit 132 is the same as that of the color film unit 131 of at least one color, and specifically, the material of the filter unit 132 may be a photosensitive resin material containing a pigment. Since the color film unit 131 has a strong absorption effect on light, for example, the color film unit 131 is a red color film unit, white light can only transmit red light after passing through the color film unit, and light of other colors can be filtered out, so the color film layer can play the same role as the filter unit, the material of the filter unit 132 can be set to be the same as the material of the color film unit 131 of at least one color, and in the manufacturing process, the filter unit 132 and the color film unit 131 can be manufactured by using the same composition process, so that the process steps can be reduced, and the manufacturing cost can be saved. In practical applications, the filter unit 132 may also be made of a material different from that of the color filter unit 131, for example, the material of the filter unit 132 may be a photosensitive resin material containing a pigment with a color different from that of the color filter unit, or may be other filter materials, which is not limited herein.
In practical application, in the above-mentioned display panel that this disclosed embodiment provided, the color of the light that filtering unit 132 can see through is the color of the light that photosensor 16 can respond to avoid reverberation a to pass filtering unit 132 back, the light of directive photosensor 16 can't be corresponding by photosensor 16, thereby guarantee the fingerprint identification effect. Specifically, the color film units comprise green color film units capable of transmitting green light; the material of the filter unit is the same as that of the green color film unit, for example, the material of the filter unit may be a photosensitive resin material containing a green pigment. In general, the photosensor 16 responds to the best light with green color, and the color of the light that can be transmitted by the filter unit 132 is green by setting the material of the filter unit 132 to be the same as the color of the green color film unit, so that the detection effect of the photosensor 16 is better. In addition, the filter unit 132 may be configured to transmit light of other colors according to the light sensitivity of the light sensor 16, and is not limited herein.
Specifically, in the display panel provided in the embodiment of the present disclosure, as shown in fig. 1, the light emitting device 11 may include: a first electrode 111, a second electrode 112 located on a side of the first electrode 111 facing away from the substrate 10, and a light-emitting layer 113 located between the first electrode 111 and the second electrode 112, that is, the light-emitting device 11 may be an organic electroluminescent device, specifically, the first electrode 111 may be an anode, and the second electrode 112 may be a cathode; alternatively, the first electrode 111 may be a cathode, the second electrode 112 may be an anode, and the disclosure is not limited thereto, and in the embodiment, the first electrode 111 is taken as an anode, and the second electrode 112 is taken as a cathode, and specifically, the first electrode 111 may be made of a transparent conductive material such as Indium Tin Oxide (ITO), and the first electrode 111 may further include a metal reflective layer, and the second electrode 112 is a semi-transparent metal film layer and may be made of a material such as magnesium, silver, or magnesium-silver alloy. The light emitting layer 113 may include an organic light emitting layer and an organic functional layer, wherein the organic functional layer may include a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and other film layers. In fig. 1, the light-emitting layer 113 is illustrated as an example of the entire surface, and in a specific implementation, the light-emitting layer 113 may be provided only in the first opening U1, which is not limited herein.
Referring also to fig. 1, the display panel may further include: a light blocking layer between the base substrate 10 and the light emitting layer 113;
the light blocking layer includes a plurality of third openings U3, and an orthogonal projection of the third opening U3 on the substrate base plate 10 and an orthogonal projection of the second opening U2 on the substrate base plate 10 have an overlapping area, for example, the plurality of third openings U3 may be disposed to correspond to the respective second openings U2.
In practical application, a part of light emitted by the light emitting device 11 may pass through the color film unit 131 to be emitted, and another part of the light may return to the inside of the display panel after being reflected by the film layer to form interference light, for example, light b in fig. 1, and the light b continues to be transmitted and finally emits to the photosensor 16, thereby affecting fingerprint identification effect. Further, the light blocking layer is provided with a plurality of third openings U3 corresponding to the second openings U2, respectively, so that the reflected light a can be ensured to pass through the light blocking layer to be directed to the photosensor 16.
In specific implementation, as shown in fig. 1, the display panel provided in the embodiment of the present disclosure may further include: a pixel defining layer 15;
the pixel defining layer 15 serves to define an area of the light emitting device;
the pixel defining layer 15 includes a material which is opaque to light, and the pixel defining layer 15 is multiplexed as a light blocking layer;
the pixel defining layer 15 may further include a plurality of fourth openings U4, an orthogonal projection of the fourth opening U4 on the substrate base plate 10 has an overlapping area with an orthogonal projection of the first electrode 111 on the substrate base plate 10, for example, the plurality of fourth openings U4 may be disposed to respectively correspond to the first electrodes 111.
In a specific implementation, the pixel defining layer 15 may be made of an opaque material, specifically, the material of the pixel defining layer 15 may be a black photosensitive organic material, for example, a black polyimide material may be used to make the pixel defining layer 15, or the material of the pixel defining layer 15 may also be a black photoresist material, and in addition, the pixel defining layer 15 may also be made of other opaque materials, which is not limited herein. The pixel defining layer 15 is made of a lightproof material, so that the pixel defining layer can be used as a light blocking layer to absorb interference light, and the pixel defining layer is used as the light blocking layer, so that the process steps are not increased, the process cost is not increased, the manufacturing process is simple, mass production is easy to realize, the pixel defining layer can be manufactured by adopting the processes of exposure, development and the like in the actual process, the manufacturing process is simple, and the manufacturing cost is low. Also, the pixel defining layer is provided therein with fourth openings U4 corresponding to the respective first electrodes 111, and the fourth openings U4 may expose the corresponding first electrodes 111, thereby ensuring electrical connection between the first electrodes 111 and the light emitting layer 113. Specifically, the thickness of the pixel defining layer 15 may be set to about 1 μm.
It should be noted that, in the embodiment of the present disclosure, the positions of the film layers are determined by the manufacturing sequence of the film layers, and in the manufacturing process, the pixel defining layer 15 is manufactured first, and then the light emitting layer 113 is manufactured, so that the light emitting layer 112 is located on the side of the pixel defining layer 15 away from the substrate 10, that is, the light emitting layer 112 is disposed as a whole layer, or the light emitting layer 112 only has a pattern in the fourth opening U4 in the pixel defining layer 15, and the positions of the light emitting layer 112 are both on the side of the pixel defining layer 15 away from the substrate 10, so that the pixel defining layer 15 can be reused as the light blocking layer by manufacturing the pixel defining layer 15 with a material that is opaque.
In addition, the display panel may further include a driving film layer 20, and the driving film layer 20 may include film layers such as a first conductive layer 201, a second conductive layer 202, and a third conductive layer 203, specifically, the first conductive layer 201 is located between the substrate 10 and the light emitting device 11, the second conductive layer 202 is located between the substrate 10 and the first conductive layer 201, and the third conductive layer 203 is located between the first conductive layer 201 and the second conductive layer 202. The first conductive layer 201 may include a data signal line, the second conductive layer 202 is located on one side of the first conductive layer 201 close to the substrate 10, the second conductive layer 202 may include a gate, a first pole of a storage capacitor, and the like, the third conductive layer 203 is located between the first conductive layer 201 and the second conductive layer 202, the third conductive layer 203 may include a second pole of the storage capacitor, and the like, and in addition, the driving film layer 20 may further include other film layers, which are not described in detail herein. In a specific implementation, since the first conductive layer 201 is a metal film layer, the first conductive layer 201 may also be used as a light blocking layer, or another film layer having a light absorption function may also be used as a light blocking layer, which is not limited herein.
Specifically, the first conductive layer 201 includes a plurality of fifth openings U5, the fifth opening U5 has an overlapping region in the above-mentioned orthographic projection of the substrate base plate 10 and the orthographic projection of the second opening U2 on the substrate base plate 10, for example, a plurality of fifth openings U5 may be provided to correspond to the respective second openings U2;
an orthographic projection of the pattern of the second conductive layer 202 on the substrate base plate 10 and an orthographic projection of the second opening U2 on the substrate base plate 10 do not overlap;
the orthographic projection of the pattern of the third conductive layer 203 on the base substrate 10 and the orthographic projection of the second opening U2 on the base substrate 10 do not overlap each other.
In a specific implementation, the first conductive layer 201, the second conductive layer 202, and the third conductive layer 203 may be made of a metal material, so that the first conductive layer 201, the second conductive layer 202, and the third conductive layer 203 are opaque, and in order to avoid affecting the reflected light a to irradiate the photosensor 16 and affecting the fingerprint identification effect, the fifth opening U5 is disposed in the first conductive layer 201, and the pattern of the second conductive layer 202 and the pattern of the third conductive layer 203 are kept away from the second opening U2, so that the reflected light a can be ensured to irradiate the photosensor 16 smoothly. In addition, if the display panel includes other opaque films, the position of the second opening U2 needs to be avoided to ensure the fingerprint identification effect.
In practical applications, as shown in fig. 1, the display panel provided in the embodiment of the present disclosure may further include: a thin film transistor TFT;
the first conductive layer 201 may include a conductive connection portion LB;
the input terminal S of the thin film transistor TFT is electrically connected to the first electrode 111 through a conductive connection portion LB.
In practical applications, a driving signal may be provided to the first electrode 111 through the thin film transistor TFT to control the light emitting device 11 to emit light, and in addition, other thin film transistors and signal lines may be further included in the driving film layer 20, which is not described herein again.
In addition, the display panel provided in the embodiment of the present disclosure may further have a touch function, and specifically, the display panel provided in the embodiment of the present disclosure may further include: the touch detection layer 17 is located between the encapsulation layer 12 and the color film layer, wherein the touch detection layer 17 may include a plurality of mutually independent self-capacitance electrodes, and the touch position is detected by using a self-capacitance principle, or the touch detection layer 17 may also include a plurality of first capacitance electrodes and a plurality of second capacitance electrodes, and the touch position is detected by using a mutual capacitance principle, where a specific detection mode is not limited. In specific implementation, the touch detection layer 17 may be made of a transparent conductive material, or the touch detection layer 17 is configured to be a metal grid structure, so as to prevent the reflected light a from affecting the finger from being emitted to the photosensor 16. In addition, if the touch detection layer 17 includes a metal electrode that is opaque, the metal electrode needs to be located away from the second opening U2 to avoid affecting the fingerprint recognition effect.
In practical implementation, in the display panel provided in the embodiment of the present disclosure, as shown in fig. 1, the aperture size of the third opening U3 is smaller than the aperture size of the second opening U2, and the reflected light a of the finger F converges at the position of the third opening U3, so that the aperture size of the third opening U3 is smaller than the aperture size of the second opening U2, and the reflected light a can smoothly pass through, specifically, the aperture size of the third opening U3 may be in a range of 5 μm to 6 μm, the aperture size of the second opening U2 may be in a range of 6 μm to 8 μm, and the aperture size of the opening in the metal film layer in the pixel defining layer 15 close to the substrate 10 (for example, the opening corresponding to the third opening U3 is provided in the metal film layer (for example, the first conductive layer 201) may be larger than the aperture size of the third opening U3, so as to adapt to the divergence degree of the reflected light a, and the divergent light a can smoothly pass through, and directed to the photosensor 16 to provide high fingerprint recognition accuracy.
Furthermore, as shown in fig. 3, the reflected light a of the finger F can also be converged at the position of the second opening U2, so that the aperture size of the imaging aperture gradually increases in the direction of the light shielding layer 14 toward the substrate 10, for example, the aperture size of the third opening U3 is larger than that of the second opening U2, specifically, the aperture size of the second opening U2 can be in the range of 6 μm to 8 μm, the aperture size of the third opening U3 can be in the range of 8 μm to 10 μm, and the aperture size of the corresponding opening in the metal film layer (e.g., the first conductive layer 201) is larger than that of the third opening U3, so as to adapt to the divergence degree of the reflected light a, so that the divergent light a can pass through smoothly and be emitted to the photosensor 16, so that the accuracy of fingerprint identification is high.
In the embodiment of the present disclosure, the reflected light a of the finger F is collected at the position of the second opening U2 or the third opening U3, for example, in a specific implementation, the reflected light a may also be collected at other positions, which may be determined according to the thickness of each film layer in the display panel and a required imaging viewing angle, and the aperture size of the imaging aperture in each film layer may be determined according to the position where the reflected light a is collected, the object-image relationship of the imaging aperture, the thickness of each film layer of the display panel, the pixel density of the display panel, and other factors, which are not limited herein.
Specifically, in the display panel provided by the embodiment of the present disclosure, the orthographic projection of the plurality of second openings U2 on the substrate base plate 10 is located within the orthographic projection range of the photosensor 16 on the substrate base plate 10, so that the reflected light of the finger F can be emitted to the photosensor 16 through the second opening U2 to realize fingerprint identification, and in practical implementation, the size of the photosensor 16 can be set to be larger than the area of the area where each second opening U2 is located to ensure that the reflected light of the finger passing through each second opening U2 can be emitted to the photosensor 16.
Based on the same inventive concept, the embodiment of the present disclosure further provides a display device, which includes the above display panel, and the display device can be applied to any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like. Since the principle of the display device to solve the problem is similar to that of the display panel, the display device can be implemented by the display panel, and repeated descriptions are omitted.
Based on the same inventive concept, the embodiment of the present disclosure further provides a manufacturing method of the display panel, and as the principle of the manufacturing method for solving the problem is similar to that of the display panel, the implementation of the manufacturing method can refer to the implementation of the display panel, and repeated details are not repeated.
As shown in fig. 4, the method for manufacturing the display panel according to the embodiment of the present disclosure includes:
s301, forming a plurality of light-emitting devices on a substrate;
s302, forming an encapsulation layer on the plurality of light-emitting devices to encapsulate the plurality of light-emitting devices;
s303, forming a color film layer on the packaging layer, and patterning the color film layer to obtain a plurality of color film units;
s304, forming a light shielding layer on the packaging layer, and patterning the light shielding layer to obtain a plurality of first openings and a plurality of second openings; filling a filtering unit in the second opening;
and S305, attaching the manufactured photosensitive sensor to one side of the substrate base plate, which is far away from the light-emitting device.
In the above-mentioned manufacturing method that this disclosed embodiment provided, through carrying out the graphics to the light shield layer and obtaining a plurality of second trompils, the second trompil can be regarded as the formation of image aperture that realizes fingerprint identification, make the light that the finger reflects permeate through and directive photosensitive sensor, so that the light that the finger reflects images in photosensitive sensor's position department, thereby realize the fingerprint identification function, through set up the second trompil as the formation of image aperture in the light shield layer, adopt the mode of aperture formation of image to realize fingerprint identification, need not to set up intensive trompil, thereby reduce the total area of trompil, reduce display panel's reflectivity.
In a specific implementation, referring to fig. 1, before step S301, the method may further include: each of the driving film layers 20 is formed over the base substrate 10, for example, a first conductive layer 201, a second conductive layer 202, a third conductive layer 203, and each insulating layer are formed. The step S301 may include: a first electrode 111, a light-emitting layer 113, and a second electrode 112 are formed.
The step S302 may include: the inorganic film layer 121 and the organic film layer 122 are formed in this order.
In the step S303, the color film layer may be made of a photosensitive resin material containing a pigment, specifically, the photosensitive resin material containing the pigment may be coated on the encapsulation layer, and a color film unit of the same color is obtained through processes such as exposure and development, and a plurality of color film units 131 of at least three colors are obtained through processes such as repeated exposure and development. In a specific implementation, other photosensitive organic matters may also be used to manufacture the color film unit, for example, a polyimide material may be used to manufacture the color film unit, which is not limited herein.
In a specific implementation, the step S304 may be executed before the step S303, or the step S304 may be executed after the step S304. In addition, the step S304 is executed before the step S303, and the second opening may be filled with the optical filter material by using the same process as that of the color film unit of at least one color, so that a one-time composition process may be saved, and the manufacturing cost is low.
In the step S305, a plurality of photosensitive elements and a control circuit may be fabricated on a silicon substrate to form a photosensitive sensor, and then the obtained photosensitive sensor is attached to a side of the substrate away from the light emitting device, and the step S305 may be performed before the step S301, or the step S305 may be performed after the step S304, or the step S305 may be performed between the steps S301 to S304, which is not limited herein. Further, before the above step S301, a photosensor may be formed over the substrate to integrate the photosensor inside the display panel.
The above-mentioned display panel that this disclosed embodiment provided, its manufacturing method and display device, through set up a plurality of second trompils in the light shield layer, the second trompil can be regarded as the formation of image aperture that realizes fingerprint identification, make the light that the finger reflects permeate through and directive photosensitive sensor, so that the light that the finger reflects images in photosensitive sensor's position department, thereby realize the fingerprint identification function, through set up the second trompil as the formation of image aperture in the light shield layer, adopt the mode of aperture formation of image to realize fingerprint identification, need not to set up intensive trompil, thereby reduce the total area of trompil, reduce display panel's reflectivity.
It will be apparent to those skilled in the art that various changes and modifications can be made in the present disclosure without departing from the spirit and scope of the disclosure. Thus, if such modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include such modifications and variations as well.

Claims (15)

1. A display panel, comprising:
a substrate base plate;
a plurality of light emitting devices on the substrate base plate;
the packaging layer is positioned on one side of the light-emitting device, which is far away from the substrate and is used for packaging the light-emitting devices;
the photosensitive sensor is positioned on one side of the light-emitting device, which is far away from the packaging layer;
the color film layer is positioned on one side of the packaging layer, which is far away from the substrate base plate; the color film layer comprises a plurality of color film units, and the orthographic projection of the color film units on the substrate and the orthographic projection of the light-emitting device on the substrate have an overlapping region;
the light shielding layer is positioned on one side of the packaging layer, which is far away from the substrate; the light-shielding layer includes: a plurality of first openings, and a plurality of second openings; an overlapping region is formed between the orthographic projection of the first opening on the substrate and the orthographic projection of the color film unit on the substrate, and a filtering unit is filled in the second opening; the second opening is used for enabling light reflected by the finger to penetrate through and emit to the photosensitive sensor, so that the light reflected by the finger is imaged at the position of the photosensitive sensor.
2. The display panel according to claim 1, wherein the color film layer comprises the color film units of at least three colors; the color film units of different colors can transmit light rays of different colors;
the material of the light filtering unit is the same as that of the color film unit with at least one color.
3. The display panel according to claim 1, wherein the color film units include a green color film unit capable of transmitting green light;
and the material of the light filtering unit is the same as that of the green color film unit.
4. The display panel of claim 1, wherein the photosensor is located on a side of the substrate base plate facing away from the light emitting device.
5. The display panel according to any one of claims 1 to 4, wherein the light emitting device comprises: the first electrode, the second electrode located on the side of the first electrode departing from the substrate base plate, and the light-emitting layer located between the first electrode and the second electrode;
the display panel further includes: the light blocking layer is positioned between the substrate base plate and the light emitting layer;
the light blocking layer comprises a plurality of third openings, and the orthographic projection of the third openings on the substrate base plate and the orthographic projection of the second openings on the substrate base plate have an overlapping area.
6. The display panel of claim 5, further comprising: a pixel defining layer;
the pixel defining layer is used for defining the area of each light emitting device;
the pixel defining layer comprises a material that is opaque to light, the pixel defining layer being multiplexed as the light blocking layer;
the pixel defining layer also includes a plurality of fourth openings having an overlapping area of an orthographic projection of the fourth openings on the substrate base plate and an orthographic projection of the first electrodes on the substrate base plate.
7. The display panel of claim 6, wherein the material of the pixel defining layer is black photosensitive organic.
8. The display panel of claim 5, further comprising: a first conductive layer between the substrate base and the light emitting device, a second conductive layer between the substrate base and the first conductive layer, and a third conductive layer between the first conductive layer and the second conductive layer;
the first conducting layer comprises a plurality of fifth openings, and the orthographic projection of the fifth openings on the substrate base plate and the orthographic projection of the second openings on the substrate base plate have an overlapping area;
the orthographic projection of the pattern of the second conducting layer on the substrate base plate and the orthographic projection of the second opening on the substrate base plate are not overlapped;
the orthographic projection of the pattern of the third conducting layer on the substrate base plate and the orthographic projection of the second opening on the substrate base plate are not overlapped.
9. The display panel of claim 8, further comprising: a thin film transistor;
the first conductive layer includes a conductive connection portion;
the input end of the thin film transistor is electrically connected with the first electrode through the conductive connecting part.
10. The display panel of claim 8, further comprising: and the touch detection layer is positioned between the packaging layer and the color film layer.
11. The display panel according to any one of claims 1 to 4, wherein an aperture size of the third opening is smaller than an aperture size of the second opening.
12. The display panel of claim 11, wherein the aperture size of the third opening is in a range of 5 μm to 6 μm, and the aperture size of the second opening is in a range of 6 μm to 8 μm.
13. The display panel according to any one of claims 1 to 4, wherein an orthogonal projection of the plurality of second openings on the substrate base is located within a range of an orthogonal projection of the photosensor on the substrate base.
14. A display device, comprising: the display panel according to any one of claims 1 to 13.
15. A method of manufacturing a display panel according to any one of claims 1 to 13, comprising:
forming a plurality of light emitting devices over a base substrate;
forming an encapsulation layer over the plurality of light emitting devices to encapsulate the plurality of light emitting devices;
forming a color film layer on the packaging layer, and patterning the color film layer to obtain a plurality of color film units;
forming a light shielding layer on the packaging layer, and patterning the light shielding layer to obtain a plurality of first openings and a plurality of second openings; filling a filtering unit in the second opening;
and attaching the manufactured photosensitive sensor to one side of the substrate base plate, which is far away from the light-emitting device.
CN202010962620.9A 2020-09-14 2020-09-14 Display panel, manufacturing method thereof and display device Pending CN114267701A (en)

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