CN114267607B

CN114267607B - Carrying device, wafer processing equipment and wafer concentricity adjusting method

Info

Publication number: CN114267607B
Application number: CN202210191923.4A
Authority: CN
Inventors: 高阳; 葛凡; 张宁宁; 周鑫; 蔡国庆
Original assignee: Jiangsu Jingchuang Advanced Electronic Technology Co Ltd
Current assignee: Jiangsu Jingchuang Advanced Electronic Technology Co Ltd
Priority date: 2022-03-01
Filing date: 2022-03-01
Publication date: 2022-05-24
Anticipated expiration: 2042-03-01
Also published as: CN114267607A

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a conveying device, wafer processing equipment and a wafer concentricity adjusting method. The carrying device comprises a carrying assembly, a plurality of groups of energy detection assemblies and a plurality of groups of centering adjustment assemblies, the carrying assembly can carry the wafer after ring cutting to the degumming worktable from an upstream station, the plurality of groups of energy detection assemblies are arranged above the degumming worktable at intervals of a circle by taking the degumming worktable as the circle center, the circumference enclosed by the plurality of groups of energy detection assemblies is the same as the circumference size of the wafer ring-shaped cutting channel, the energy detection assemblies are used for detecting UV energy irradiated by UV lamps, the plurality of groups of centering adjustment assemblies are arranged on the carrying assembly at intervals of the circumference around the wafer, the centering adjustment assemblies can push the wafer to move relative to the degumming worktable, so that each energy detection assembly can detect the UV energy, and the wafer and the degumming worktable are concentric. The wafer processing equipment and the wafer concentricity adjusting method apply the carrying device to ensure that the wafer and the debonding worktable are concentric.

Description

Carrying device, wafer processing equipment and wafer concentricity adjusting method

Technical Field

The invention relates to the technical field of semiconductor manufacturing, in particular to a conveying device, wafer processing equipment and a wafer concentricity adjusting method.

Background

In semiconductor manufacturing, wafers are often thinned to improve device performance, and the support rings at the edges of the wafers are cut to remove the thinned wafers. The wafer thinning process comprises a Taiko (Taiko) thinning process, the Taiko thinning process is used for thinning the middle area of a wafer, the edge area of the wafer is not thinned and serves as a support ring, after the middle area of the wafer is thinned, the support ring needs to be cut on the wafer, an annular cutting channel is formed between the support ring and the wafer, due to the fact that a UV film is attached to the back face of the wafer, the support ring can be still adhered to the UV film after being circularly cut, the wafer after being circularly cut needs to be conveyed to a glue-removing workbench from an upstream station by utilizing a conveying device on wafer processing equipment, glue-removing is conducted on the support ring adhered to the UV film, and the support ring is conveniently separated from the UV film.

The below of the debonding work table is provided with the UV lamp, when handling device placed the wafer on the debonding work table, the debonding work table only bore the regional wafer of middle attenuate, and annular cutting way and support ring on the wafer periphery all stretch out the debonding work table for the UV lamp of debonding work table below can shine annular cutting way and the UV membrane that the support ring position pasted just, thereby reduces the viscidity of UV membrane, is convenient for realize the separation of support ring and UV membrane. The process of carrying the wafer of the existing carrying device, because the abrasion error after the equipment error of the machine or long-term work, when the carrying device places the wafer after the ring cutting on the dispergation workbench, it is difficult to ensure that the wafer and the dispergation workbench are concentric, so that the UV film pasted on the part of the annular cutting channel and the support ring part is shielded by the dispergation workbench, the irradiation of a UV lamp cannot be accepted, the dispergation cannot be realized, the dispergation effect on the support ring is reduced, the subsequent separation of the support ring on the UV film is influenced, and the support ring is easy to damage in the process of separating the support ring.

Therefore, it is desirable to provide a transportation apparatus, a wafer processing apparatus and a method for adjusting wafer concentricity to solve the above problems.

Disclosure of Invention

The invention aims to provide a carrying device, wafer processing equipment and a wafer concentricity adjusting method, so that a ring-cut wafer is accurately placed on a dispergation workbench, the wafer and the dispergation workbench are concentric, and the dispergation effect on a support ring is improved.

In order to achieve the purpose, the invention adopts the following technical scheme:

a handling device comprising:

the carrying assembly can carry the ring-cut wafer to a degumming worktable from an upstream station;

the energy detection assemblies are arranged above the debonding workbench, the energy detection assemblies are circumferentially arranged at intervals by taking the debonding workbench as a circle center, the circumference surrounded by the energy detection assemblies is the same as the circumference of the annular cutting channel of the wafer after circular cutting, and the energy detection assemblies are configured to detect UV energy irradiated by a UV lamp below the debonding workbench through the annular cutting channel; and

the plurality of groups of centering adjusting assemblies are arranged on the carrying assembly, the plurality of groups of centering adjusting assemblies are circumferentially arranged at intervals around the circularly cut wafer, and the plurality of groups of centering adjusting assemblies can push the circularly cut wafer to move relative to the degumming worktable according to the energy detection result of each energy detection assembly, so that each energy detection assembly can detect the UV energy.

Preferably, the centering adjustment assembly includes:

the connecting plate is arranged on the carrying assembly;

the first driving piece is arranged on the connecting plate; and

and the first driving piece can drive the adjusting clamping jaw to push the wafer after circular cutting to move relative to the degumming worktable so that the wafer after circular cutting is concentric with the degumming worktable.

As a preferred scheme, the centering adjusting assembly is positioned above the dispergation workbench, and a plurality of groups of energy detection assemblies are correspondingly arranged on each connecting plate; or

The multiple groups of energy detection assemblies are arranged on the cover plate above the degumming worktable.

Preferably, the carrying device further includes:

the pressure detection assembly is arranged on each group of the adjusting clamping jaws and is configured to detect a pressure value between the adjusting clamping jaws and the horizontal carrying platform; and

the horizontal adjusting assemblies are arranged on each group of the first driving pieces and can adjust the distance between the adjusting clamping jaws and the horizontal carrying platform according to the pressure value detected by the pressure detecting assembly, so that the working surfaces where the multiple groups of adjusting clamping jaws are located are parallel to the carrying surface of the horizontal carrying platform.

Preferably, the level adjustment assembly includes:

the mounting plate is arranged on the first driving piece;

the second driving piece is arranged on the mounting plate, the output end of the second driving piece is connected with the adjusting clamping jaw, and the second driving piece can drive the adjusting clamping jaw to move towards the direction close to or far away from the horizontal carrying platform according to the pressure value detected by the pressure detection assembly.

Preferably, the level adjustment assembly further comprises:

the guide piece, the guide piece includes sliding connection's guide rail and slider, the guide rail sets up on the mounting panel, and follow the drive of second driving piece the direction that the regulation jack catch removed extends, the slider sets up adjust on the jack catch.

Preferably, the handling assembly comprises:

the centering adjusting assembly is arranged on the carrying piece; and

and the sucker is arranged on the carrying piece, and the carrying piece can drive the sucker to move so that the sucker adsorbs the wafers after circular cutting and is carried to the degumming workbench from the upstream station.

A wafer processing apparatus comprising a handling device as described above.

A method for adjusting the concentricity of a wafer, which is used for adjusting the concentricity of the ring-cut wafer on a debonding worktable by using the carrying device, comprises the following steps:

turning on a UV lamp;

judging whether each energy detection assembly can detect UV energy emitted by the UV lamp;

if the energy detection assemblies which do not detect the UV energy exist, the multiple groups of centering adjustment assemblies push the circularly cut wafer to move relative to the dispergation workbench according to the energy detection results of the energy detection assemblies until the energy detection assemblies can detect the UV energy.

Preferably, if each of the energy detection modules is capable of detecting the UV energy, the UV lamp is turned off.

The invention has the beneficial effects that:

the invention provides a carrying device which comprises a carrying assembly, a plurality of groups of energy detection assemblies and a plurality of groups of centering adjustment assemblies, wherein the carrying assembly can carry a ring-cut wafer from an upstream station to a dispergation workbench, the plurality of groups of energy detection assemblies are arranged above the dispergation workbench at intervals of circumference by taking the dispergation workbench as a circle center, the circumference enclosed by the plurality of groups of energy detection assemblies is the same as the circumference of a wafer ring-shaped cutting channel, the energy detection assemblies are used for detecting UV energy irradiated by a UV lamp positioned below the dispergation workbench through the ring-shaped cutting channel, the plurality of groups of centering adjustment assemblies are arranged on the carrying assembly at intervals of circumference around the wafer, the centering adjustment assemblies can push the wafer to move relative to the dispergation workbench so that each energy detection assembly can detect the UV energy, thereby ensuring that the wafer and the dispergation workbench are concentric and ensuring that each part of a support ring can realize dispergation, the glue dissolving effect of the UV lamp is improved, the support ring is convenient to separate in the subsequent process, and the support ring is prevented from being damaged in the separation process.

The invention also provides wafer processing equipment, and by applying the carrying device, the concentricity of the wafer and the dispergation workbench is ensured, dispergation of each part of the support ring can be ensured, the dispergation effect of the UV lamp is improved, the support ring can be conveniently separated in the subsequent process, and the support ring is prevented from being damaged in the separation process.

The invention also provides an application of the wafer concentricity adjusting method, the wafer after ring cutting is concentrically adjusted on the degumming worktable by applying the carrying device, the concentricity of the wafer and the degumming worktable is ensured, each part of the support ring can realize degumming, the degumming effect of the UV lamp is improved, the support ring is convenient to separate in the subsequent process, and the support ring is prevented from being damaged in the separating process.

Drawings

FIG. 1 is a top view of a portion of a handling apparatus provided in accordance with an embodiment of the present invention;

FIG. 2 is a schematic view of a centering adjustment assembly for adjusting the concentricity of a wafer and a debonding station according to an embodiment of the present invention;

fig. 3 is a schematic structural view of the horizontal adjustment assembly according to the embodiment of the present invention, in which the working surface where the adjustment claw is located is parallel to the carrying surface of the horizontal carrier;

fig. 4 is a flowchart of a wafer concentricity adjustment method according to an embodiment of the present invention.

In the figure:

100. a carrying device; 200. a wafer; 201. an annular cutting path; 202. a support ring; 300. a dispergation workbench; 400. a UV lamp; 500. a horizontal stage; 600. a UV film;

1. a handling assembly; 2. a centering adjustment assembly; 21. a connecting plate; 22. a first driving member; 221. a motor; 222. a lead screw; 223. a nut; 23. adjusting the clamping jaw; 3. an energy detection assembly; 4. a pressure detection assembly; 5. a level adjustment assembly; 51. mounting a plate; 52. a second driving member; 53. a guide member; 531. a guide rail; 532. a slide block.

Detailed Description

In order to make the technical problems solved, the technical solutions adopted and the technical effects achieved by the present invention clearer, the technical solutions of the present invention are further described below by way of specific embodiments with reference to the accompanying drawings.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used based on the orientations and positional relationships shown in the drawings only for convenience of description and simplification of operation, and do not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

As shown in fig. 1 to 3, the present embodiment provides a conveying apparatus 100 capable of conveying a ring-cut wafer 200 from an upstream station to a debonding station 300, so as to debond between a support ring 202 and a UV film 600 on the ring-cut wafer 200 on the debonding station 300, so as to separate the support ring 202 and the UV film 600. However, the transfer apparatus 100 is not limited to this, and can also perform a transfer operation of the wafer 200 between the remaining stations.

It should be noted that, the UV lamp 400 is disposed below the debonding station 300, when the carrying device 100 carries the ring-cut wafer 200 from an upstream station onto the debonding station 300, the debonding station 300 only carries the wafer 200 in the middle thinning region, and both the ring-shaped cutting street 201 and the support ring 202 on the outer periphery of the wafer 200 extend out of the debonding station 300, so that the UV lamp 400 below the debonding station 300 can just irradiate the UV film 600 adhered to the ring-shaped cutting street 201 and the support ring 202, thereby reducing the viscosity of the UV film 600, and facilitating the separation of the support ring 202 and the UV film 600.

In the process of carrying the wafer 200 by the existing carrying device, due to machine assembly errors or abrasion errors after long-term work, when the carrying device places the ring-cut wafer 200 on the debonding workbench 300, it is difficult to ensure that the wafer 200 and the debonding workbench 300 are concentric, so that the UV film 600 adhered to the part of the partial annular cutting street 201 and the part of the support ring 202 is shielded by the debonding workbench 300, cannot be irradiated by the UV lamp 400, and cannot be debonded, the debonding effect of the UV lamp 400 on the support ring 202 is reduced, the subsequent separation of the support ring 202 on the UV film 600 is affected, and the support ring 202 is easily damaged in the process of separating the support ring 202.

In order to solve the above problem, as shown in fig. 1 to 3, a carrying device 100 provided in this embodiment includes a carrying assembly 1, a plurality of sets of energy detecting assemblies 3 and a plurality of sets of centering adjusting assemblies 2, wherein the carrying assembly 1 can carry a circular-cut wafer 200 from an upstream station to a debonding station 300, the plurality of sets of energy detecting assemblies 3 are all located above the debonding station 300, the plurality of sets of energy detecting assemblies 3 are circumferentially arranged at intervals around the debonding station 300, a circumference defined by the plurality of sets of energy detecting assemblies 3 is the same as a circumference of a circular cutting street 201 of the circular-cut wafer 200, the energy detecting assemblies 3 are configured to detect UV energy irradiated by a UV lamp 400 located below the debonding station 300 through the circular cutting street 201, the plurality of sets of centering adjusting assemblies 2 are all disposed on the carrying assembly 1, the plurality of sets of centering adjusting assemblies 2 are circumferentially arranged at intervals around the circular-cut wafer 200, the multiple groups of centering adjusting assemblies 2 can push the ring-cut wafer 200 to move relative to the debonding workbench 300 according to the energy detection results of the energy detection assemblies 3, so that the energy detection assemblies 3 can detect UV energy, thereby ensuring that the wafer 200 is concentric with the debonding workbench 300 on the debonding workbench 300, ensuring that the annular cutting channel 201 and the support ring 202 on the periphery of the wafer 200 extend out of the debonding workbench 300, ensuring that each part of the support ring 202 can realize debonding, ensuring the debonding effect of the UV lamp 400 on the support ring 202, facilitating the separation of the support ring 202 from the UV film 600 in the subsequent process, and avoiding the damage of the support ring 202 in the separation process. In addition, the concentric adjustment of the wafer 200 on the debonding workbench 300 is realized by arranging a plurality of groups of energy detection assemblies 3 and a plurality of groups of centering adjustment assemblies 2, so that the operation is convenient and fast, and the realization is convenient.

Specifically, when the energy detection assemblies 3 which do not detect UV energy exist, the centering adjustment assembly 2 corresponding to the energy detection assembly 3 which detects UV energy pushes the wafer 200 to move relative to the debonding station 300 towards the energy detection assembly 3 which does not detect UV energy until each energy detection assembly 3 can detect UV energy.

It should be noted that, in this embodiment, as shown in fig. 1, three sets of energy detection assemblies 3 are provided, three sets of centering adjustment assemblies 2 are correspondingly provided, the three sets of energy detection assemblies 3 are circumferentially and uniformly arranged at intervals around the debonding station 300, and the three sets of centering adjustment assemblies 2 are circumferentially and uniformly arranged at intervals around the ring-cut wafer 200. The energy detection unit 3 is a UV energy sensor, and the UV energy sensor can detect the presence of UV energy when irradiated by the UV lamp 400. When one of the energy detection assemblies 3 does not detect UV energy, the centering adjustment assemblies 2 corresponding to the other two energy detection assemblies 3 push the wafer 200 to move relative to the debonding worktable 300 towards the energy detection assemblies 3 which do not detect UV energy until the three energy detection assemblies 3 can detect UV energy. Similarly, when no UV energy is detected by any of the two sets of energy detection assemblies 3, the set of energy detection assemblies 3 that detect UV energy pushes the wafer 200 in relative to the debonding station 300 until all three sets of energy detection assemblies 3 detect UV energy.

In this embodiment, the handling assembly 1 includes handling piece and sucking disc, and wherein, centering adjusting part 2 and sucking disc all set up on the handling piece, and the handling piece can drive the sucking disc motion to make the sucking disc adsorb wafer 200 after the circular cutting and carry to the workstation 300 that debonds from the upper reaches station, and handling assembly 1 can also drive centering adjusting part 2 motion simultaneously, guarantees that centering adjusting part 2 is located the top of wafer 200, realizes wafer 200 position control on the workstation 300 that debonds. It should be noted that, be provided with the handling dish on the handling piece, three sets of centering adjusting component 2 are evenly spaced along the circumference of handling dish and are arranged.

Referring to fig. 2 and 3, a specific structure of the centering adjustment assembly 2 is described, as shown in fig. 2 and 3, the centering adjustment assembly 2 includes a connection plate 21, a first driving member 22, and an adjustment claw 23, wherein the connection plate 21 is disposed on the carrying assembly 1, the first driving member 22 is disposed on the connection plate 21, and the first driving member 22 can drive the adjustment claw 23 to push the ring-cut wafer 200 to move relative to the debonding table 300 according to the energy detection result of the energy detection assembly 3, so that the ring-cut wafer 200 is concentric with the debonding table 300.

Specifically, as shown in fig. 2 and fig. 3, the first driving member 22 includes a motor 221, a lead screw 222, and a nut 223, wherein the motor 221 is disposed on the connecting plate 21, an output end of the motor 221 is in transmission connection with the lead screw 222, the lead screw 222 extends along a radial direction of the wafer 200, the nut 223 is in threaded connection with the lead screw 222, and when the output end of the motor 221 drives the lead screw 222 to rotate, the nut 223 can move along the lead screw 222, so that the nut 223 drives the adjusting claw 23 to move toward or away from the wafer 200, so that the adjusting claw 23 adjusts and pushes the wafer 200 to move relative to the debonding table 300.

It should be noted that, in this embodiment, the centering adjustment assembly 2 is located above the debonding station 300, the three sets of energy detection assemblies 3 are correspondingly disposed on the three connection plates 21, and the three sets of adjustment claws 23 are driven by the corresponding first driving members 22 to move relative to the connection plates 21 to push the wafer 200 to move until the energy detection assemblies 3 on the three connection plates 21 can detect UV energy, which proves that the wafer 200 is concentric with the debonding station 300. In other embodiments, three sets of energy detection assemblies 3 may also be disposed on the cover plate above the dispergation station 300.

It should be noted that, due to an assembly error of the machine or a wear error after long-term operation, an inclination deviation occurs between the adjusting working surfaces of the groups of adjusting claws 23 on the carrying assembly 1 and the carrying surface of the horizontal carrier 500 for carrying the wafer 200, that is, an inclination deviation occurs between the working surfaces where the three groups of adjusting claws 23 are located and the carrying surface of the horizontal carrier 500, so that when the groups of adjusting claws 23 push the position of the adjusted wafer 200 on the horizontal carrier 500, a positioning deviation is likely to occur, and even a fragment of the wafer 200 is likely to be caused.

In order to solve the above problem, as shown in fig. 3, the carrying device 100 provided in this embodiment further includes a pressure detecting assembly 4 and a horizontal adjusting assembly 5, where each group of adjusting claws 23 is provided with the pressure detecting assembly 4, the pressure detecting assembly 4 is used for detecting a pressure value between the adjusting claws 23 and the horizontal carrier 500, each group of first driving members 22 is provided with the horizontal adjusting assembly 5, and the horizontal adjusting assembly 5 can adjust a distance between the adjusting claws 23 and the horizontal carrier 500 according to the pressure value detected by the pressure detecting assembly 4, so that a working surface where the groups of adjusting claws 23 are located is parallel to a carrying surface of the horizontal carrier 500, and when the positions of the groups of adjusting claws 23 on the horizontal carrier 500 are pushed inward to adjust the positions of the wafers 200, the positions are more accurate, and the wafers 200 are prevented from being damaged. It should be noted that the horizontal carrier 500 may be the debonding table 300, or may be a table for performing other processing on the wafer 200, as long as the working surfaces of the groups of adjusting claws 23 can be adjusted according to the table, so as to ensure that the working surfaces of the groups of adjusting claws 23 are parallel to the wafer 200 in the process of pushing the adjusting wafer 200 and the debonding table 300 to be concentric. In this embodiment, the pressure detecting component 4 may be a pressure sensor, and the pressure sensor can detect the pressure value between the adjusting claw 23 and the horizontal carrier 500, and has the advantages of sensitive detection and convenient installation.

It should be noted that, in this embodiment, the carrying member simultaneously drives the three sets of centering adjustment assemblies 2 to descend, if an inclination deviation occurs between the working surface where the three sets of adjustment jaws 23 are located and the bearing surface of the horizontal carrier 500, then the three sets of adjustment jaws 23 cannot be in contact with the bearing surface of the horizontal carrier 500 at the same time, that is, one or two adjustment jaws 23 that are in contact with the horizontal carrier 500 first must be present, after the adjustment jaws 23 are in contact with the horizontal carrier 500, the pressure detection assembly 4 can detect pressure therebetween, and when the pressure value is greater than the preset value, the horizontal adjustment assembly 5 drives the adjustment jaws 23 to move upward until the pressure value is in the preset value. The other adjusting claws 23 and the pressure detecting assemblies 4 have the same adjusting process, and a required relatively parallel posture can be obtained until the pressure values detected by the three groups of pressure detecting assemblies 4 are consistent (namely, the pressure values are all in a preset value state), then, the three groups of horizontal adjusting assemblies 5 drive the three groups of adjusting claws 23 to slightly move upwards, so that the three groups of adjusting claws 23 are separated from the contact with the horizontal carrying platform 500, the heights of the three groups of adjusting claws 23 are ensured to be flush with the height of the wafer 200, and then the wafer 200 is subjected to inner-pushing concentric adjustment on the debonding workbench 300.

Referring to fig. 3, a specific structure of the horizontal adjustment assembly 5 is described, as shown in fig. 3, the horizontal adjustment assembly 5 includes a mounting plate 51 and a second driving member 52, wherein the mounting plate 51 is connected to the nut 223, the second driving member 52 is disposed on the mounting plate 51, an output end of the second driving member 52 is connected to the adjustment claw 23, and the second driving member 52 can drive the adjustment claw 23 to move toward or away from the horizontal stage 500 according to a pressure value detected by the pressure detection assembly 4, so as to ensure that the pressure values of the adjustment claw 23 and the horizontal stage 500 are a preset value. Specifically, the second driving member 52 may be a lead screw motor, which is stable in driving and convenient to install.

Preferably, as shown in fig. 3, the horizontal adjusting assembly 5 further comprises a guiding member 53, the guiding member 53 comprises a guiding rail 531 and a sliding block 532 which are slidably connected, wherein the guiding rail 531 is arranged on the mounting plate 51 and extends along the direction in which the second driving member 52 drives the adjusting jaw 23 to move, and the sliding block 532 is arranged on the adjusting jaw 23. Through the arrangement of the guide rail 531 and the slider 532, a guiding effect is provided for the second driving piece 52 to drive the adjusting claw 23 to move, and the adjusting claw 23 is ensured to move more stably and stably.

The embodiment further provides a wafer processing device, and by applying the carrying device 100, the wafer 200 and the glue-releasing workbench 300 are concentric, and the glue-releasing effect of the UV lamp 400 on the support ring 202 is improved.

As shown in fig. 4, the embodiment further provides a method for adjusting the concentricity of a wafer, in which the above-mentioned handling apparatus 100 is used to adjust the concentricity of the ring-cut wafer 200 on the debonding station 300, and the method includes the following steps:

turning on the UV lamp 400;

judging whether each energy detection assembly 3 can detect the UV energy emitted by the UV lamp 400;

if the energy detection assemblies 3 which do not detect the UV energy exist, the multiple groups of centering adjustment assemblies 2 push the ring-cut wafer 200 to move relative to the debonding workbench 300 according to the energy detection results of the energy detection assemblies 3 until the energy detection assemblies 3 can detect the UV energy.

In addition, if each energy detection assembly 3 is capable of detecting UV energy, the UV lamp 400 is turned off, thereby completing the centering adjustment of the wafer 200 on the debonding station 300.

It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A handling device, comprising:

a carrying assembly (1), wherein the carrying assembly (1) can carry the ring-cut wafer (200) to a degumming worktable (300) from an upstream station;

the energy detection assemblies (3) are positioned above the debonding workbench (300), the energy detection assemblies (3) are circumferentially arranged at intervals by taking the debonding workbench (300) as a circle center, the circumference surrounded by the energy detection assemblies (3) is the same as the circumference of the annular cutting channel (201) of the wafer (200) after circular cutting, and the energy detection assemblies (3) are configured to detect UV energy irradiated by UV lamps (400) positioned below the debonding workbench (300) through the annular cutting channel (201); and

the plurality of groups of centering adjusting assemblies (2) are arranged on the carrying assembly (1), the plurality of groups of centering adjusting assemblies (2) are circumferentially arranged at intervals around the circularly cut wafer (200), and the plurality of groups of centering adjusting assemblies (2) can push the circularly cut wafer (200) to move relative to the debonding worktable (300) according to the energy detection result of each energy detection assembly (3), so that each energy detection assembly (3) can detect the UV energy;

the centering adjustment assembly (2) comprises:

a connecting plate (21) arranged on the handling assembly (1);

a first driving member (22) provided on the connecting plate (21); and

the adjusting clamping jaw (23) is arranged on a working surface of the adjusting clamping jaw (23) and is parallel to a bearing surface of a horizontal carrying platform (500) for bearing the wafer (200), and the first driving piece (22) can drive the adjusting clamping jaw (23) to push the circularly cut wafer (200) to move relative to the degumming worktable (300), so that the circularly cut wafer (200) and the degumming worktable (300) are concentric.

2. The handling device according to claim 1, characterized in that the centering and adjusting assemblies (2) are located above the dispergation worktable (300), and a plurality of groups of the energy detection assemblies (3) are correspondingly arranged on each connecting plate (21); or

The multiple groups of energy detection assemblies (3) are arranged on the cover plate above the dispergation workbench (300).

3. The handling device according to claim 1, characterized in that it further comprises:

the pressure detection assembly (4) is arranged on each group of the adjusting clamping jaws (23), and the pressure detection assembly (4) is configured to detect a pressure value between each group of the adjusting clamping jaws (23) and the horizontal carrying platform (500); and

the horizontal adjusting assemblies (5) are arranged on each group of the first driving pieces (22), the horizontal adjusting assemblies (5) can adjust the distance between the adjusting clamping jaws (23) and the horizontal carrying platform (500) according to the pressure value detected by the pressure detecting assembly (4), and therefore the working surfaces where the groups of adjusting clamping jaws (23) are located are parallel to the carrying surface of the horizontal carrying platform (500).

4. Handling device according to claim 3, characterised in that said level adjustment assembly (5) comprises:

a mounting plate (51) provided on the first driving member (22);

the second driving piece (52) is arranged on the mounting plate (51), the output end of the second driving piece (52) is connected with the adjusting claw (23), and the second driving piece (52) can drive the adjusting claw (23) to move towards the direction close to or far away from the horizontal carrying platform (500) according to the pressure value detected by the pressure detection assembly (4).

5. Handling device according to claim 4, characterised in that said level adjustment assembly (5) further comprises:

a guide member (53), the guide member (53) comprises a guide rail (531) and a sliding block (532) which are connected in a sliding way, the guide rail (531) is arranged on the mounting plate (51) and extends along the direction of the second driving member (52) driving the adjusting claw (23) to move, and the sliding block (532) is arranged on the adjusting claw (23).

6. Handling device according to any of claims 1 to 5, characterised in that the handling assembly (1) comprises:

a handling member on which the centering adjustment assembly (2) is arranged; and

the sucking disc is arranged on the carrying piece, and the carrying piece can drive the sucking disc to move so that the sucking disc adsorbs the wafers (200) subjected to circular cutting and is carried to the glue-removing workbench (300) from the upstream station.

7. A wafer processing apparatus comprising the carrying device according to any one of claims 1 to 6.

8. A method for adjusting the concentricity of a wafer (200) after ring cutting by using the handling apparatus of any one of claims 1 to 6, on the debonding station (300), comprising the steps of:

turning on a UV lamp (400);

judging whether each energy detection assembly (3) can detect UV energy emitted by the UV lamp (400);

if the energy detection assemblies (3) which do not detect the UV energy exist, the multiple groups of centering adjustment assemblies (2) push the circularly cut wafer (200) to move relative to the dispergation workbench (300) according to the energy detection results of the energy detection assemblies (3) until the energy detection assemblies (3) can detect the UV energy.

9. The wafer concentricity adjustment method according to claim 8, wherein the UV lamp (400) is turned off if each of the energy detection modules (3) is capable of detecting the UV energy.