CN114266222A - Method, medium, and apparatus for generating parametric bonding data based on bond line model - Google Patents
Method, medium, and apparatus for generating parametric bonding data based on bond line model Download PDFInfo
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Abstract
The invention provides a method, a medium and equipment for generating parameterized bonding data based on a bonding wire model, wherein the method for generating the parameterized bonding data based on the bonding wire model comprises the following steps: acquiring matching parameters in an integrated circuit design file; according to the matching parameters, a bonding wire model which meets a preset matching range is screened from a bonding wire model library; carrying out interference simulation inspection on the screened bonding wire model; parametric bonding data is generated using a bond wire model that is inspected by interferometric simulation. According to the invention, manual operation is replaced by data learning and optimization judgment, so that the working efficiency and quality are greatly improved, and the production cost of enterprises is further reduced.
Description
Technical Field
The invention belongs to the technical field of integrated circuit packaging, relates to a method for generating bonding data, and particularly relates to a method, a medium and equipment for generating parameterized bonding data based on a bonding wire model.
Background
With the development of electronic products such as mobile phones and notebook computers toward miniaturization, portability, ultra-thinning, multimedia and low cost meeting the public demands, the packaging form and the assembly technology thereof with high density, high performance, high reliability and low cost are correspondingly and rapidly developed. Among them, wire bonding technology has been widely used in the modern semiconductor industry as a key process of integrated circuit packaging. The main purpose is to realize the electrical connection between the chip and the external circuit and between the chip and the chip. With the development of systematization and integration of device packaging, the number of bonding wires inside the packaging is increased, and therefore, the packaging bonding procedure required in production and manufacturing becomes very important.
At present, the mode of manually setting various parameters is mostly adopted in the manufacturing and packaging bonding procedure in the industry, and the method has low efficiency on one hand, poor accuracy and adaptability on the other hand and depends on experience more. In addition, there is a method for automatically generating a bonding program by using coordinate data of a bonding point through formula calculation in the prior art, and the method has some problems in practical application: for example, when some objective conditions of the bonding apparatus change, the accuracy of the bonding data is reduced because the bonding data generated by calculation cannot be changed accurately and adaptively. The objective condition change refers to changes in working range, working mode and the like. For example, the working range, i.e., the working head, is changed, different devices have different working modes, some devices have one working mode, some devices have two working modes, and some devices have three working modes.
Therefore, how to provide a method, medium, and apparatus for generating parameterized bonding data based on a bonding wire model to solve the defects that the prior art cannot replace manual operation to generate parameterized bonding data with high accuracy, and the like, is a technical problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present invention is to provide a method, a medium, and an apparatus for generating parametric bonding data based on a bonding wire model, so as to solve the problem that the prior art cannot replace manual operation to generate parametric bonding data with high accuracy.
To achieve the above and other related objects, an aspect of the present invention provides a method for generating parametric bonding data based on a bonding wire model, wherein the method for generating parametric bonding data based on a bonding wire model comprises: acquiring matching parameters in an integrated circuit design file; according to the matching parameters, a bonding wire model which meets a preset matching range is screened from a bonding wire model library; carrying out interference simulation inspection on the screened bonding wire model; parametric bonding data is generated using a bond wire model that is inspected by interferometric simulation.
To achieve the above and other related objects, another aspect of the present invention provides a computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, implements the method for generating parametric bonding data based on a bond wire model.
To achieve the above and other related objects, a final aspect of the present invention provides an electronic device, comprising: a processor and a memory; the memory is configured to store a computer program, and the processor is configured to execute the computer program stored in the memory to cause the electronic device to perform the method for generating parametric bonding data based on a bond wire model.
As described above, the method, medium, and apparatus for generating parameterized bonding data based on a bonding wire model according to the present invention have the following advantages:
the invention screens the bonding wire model from the bonding wire model library by utilizing the matching parameters of the design file, generates parametric bonding data after carrying out interference simulation check on the bonding wire model, and further leads the parametric bonding data into different bonding devices for different bonding scenes. According to the invention, manual operation is replaced by data learning and optimization judgment, so that the working efficiency and quality are greatly improved, and the production cost of enterprises is further reduced. On one hand, the defects that a manual operation mode is too low in efficiency, poor in accuracy and adaptability and more dependent on experience are overcome, and on the other hand, compared with the existing bonding program generation method, when some objective conditions or environments of bonding equipment change, accurate adaptability change can be achieved, and therefore the accuracy of bonding data is improved.
Drawings
Fig. 1 is a schematic flow chart illustrating a method for generating parametric bonding data based on a bonding wire model according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of wire bonding in an embodiment of the method for generating parametric bonding data based on a bond wire model according to the present invention.
Fig. 3 is a schematic flow chart of a method for generating parametric bonding data based on a bonding wire model according to another embodiment of the present invention.
Fig. 4 is a flowchart illustrating model library optimization iteration of a method for generating parameterized bonding data based on a bond wire model according to an embodiment of the present invention.
Fig. 5 is a flow chart illustrating bonding data generation in an embodiment of a method for generating parameterized bonding data based on a bonding wire model according to the present invention.
Fig. 6 is a schematic diagram illustrating an interference simulation of the method for generating parametric bonding data based on a bonding wire model according to an embodiment of the present invention.
Fig. 7 is a schematic structural connection diagram of an electronic device according to an embodiment of the invention.
Description of the element reference numerals
7 electronic device
71 processor
72 memory
S10-S15
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
The method, the medium and the equipment for generating the parameterized bonding data based on the bonding wire model replace manual operation by data learning and optimized judgment, greatly improve the working efficiency and quality, and further reduce the production cost of enterprises.
The principles and embodiments of a method, a medium, and an apparatus for generating parameterized bonding data based on a bonding wire model according to the present embodiment will be described in detail below with reference to fig. 1 to 7, so that those skilled in the art can understand the method, the medium, and the apparatus for generating parameterized bonding data based on a bonding wire model without creative work.
Referring to fig. 1, a schematic flow chart of a method for generating parametric bonding data based on a bonding wire model according to an embodiment of the invention is shown. As shown in fig. 1, the method for generating parameterized bonding data based on a bonding wire model specifically includes the following steps:
and S11, acquiring the matching parameters in the integrated circuit design file.
In one embodiment, the matching parameters include: the height difference between the first bonding pad and the second bonding pad, the length of a connecting line between projection points of the first bonding pad and the second bonding pad on a horizontal plane, the type of a bonding wire and the diameter of the bonding wire.
In another embodiment, the matching parameters further include: and (4) pad parameters.
Specifically, the design files include, but are not limited to: an Allegro SIP design file, a Mentor Expedition PCB design file, or a bond point location file (dxf, dwg, txt), etc.
Referring to fig. 2, a wire bonding diagram of an embodiment of a method for generating parametric bonding data based on a bonding wire model is shown.As shown in fig. 2, the length of the connection line between the projected points of the first and second pads D1 and D2 on the horizontal plane is calculated based on the coordinates (x, y) of the first pad D1 and the coordinates (x1, y1) of the second pad D2
The height z of the first pad D1 and the height z1 of the second pad D2 were determined according to the mounting manner, and a height difference z-z1 between the first pad D1 and the second pad D2 was obtained.
Note that, when the point P and the point P1 represent pads, L represents the length of a line between projected points on a horizontal plane. Point P and point P1 represent bond points, z-z1 represents the difference in height between the first bond point D1 'and the second bond point D2', and L represents the length of the line between the projected points on the horizontal plane.
And S12, according to the matching parameters, screening the bonding wire model which accords with a preset matching range from the bonding wire model library.
Specifically, the obtained matching parameters are: the height difference (which can be extracted and needs to be set if not) between the first bonding pad D1 and the second bonding pad D2, the length of a connecting line between the projection points of the first bonding pad D1 and the second bonding pad D2 on the horizontal plane, the type of a bonding wire and the diameter of the bonding wire are used as correlation conditions, and corresponding bonding wire models are automatically screened out from a bonding wire model library according to a preset matching range +/-5%.
It should be noted that ± 5% is one embodiment of the preset matching range, and other reasonably set numerical ranges outside ± 5% are also within the protection scope of the present invention.
In an embodiment, after step S12 and before step S13, the method for generating parametric bonding data based on a bonding wire model further includes: and analyzing the number of the screened bonding wire models.
And performing interference simulation check on the screened bonding wire models in response to the number being one.
In response to the number of the bonding wire models being at least two, determining an optimal bonding wire model by using the priority parameters, and carrying out interference simulation check on the optimal bonding wire model; the priority parameters include: at least one of frequency of use, update time, or set priority.
Specifically, if the priority parameter is the use frequency, selecting the bonding wire model with the highest use frequency as the preferred bonding wire model; if the priority parameter is the updating time, selecting the bonding wire model with the latest updating time as the preferred bonding wire model; and if the priority level is set as priority, selecting the bonding wire model with the highest priority level as the preferred bonding wire model.
In response to the number being zero, a new bondwire model is created. Specifically, the creation mode may be manual creation or model algorithm creation.
And S13, performing interference simulation check on the screened bonding wire model.
In one embodiment, S13 specifically includes the following steps:
(1) and obtaining a simplified model of the bonding wire according to the wire arc track parameters, and obtaining a simplified track of the bonding wire according to the simplified model. Through the simplified track of the bonding wires, whether the height of the frame packaging body and the highest point of the bonding wires meet the standard or not and whether the distance between the bonding wires meets the requirement of the minimum distance or not can be judged.
(2) And judging whether the simplified track of the bonding wires simultaneously meets the requirements of bonding wire diameter with the distance between the bonding wires being more than or equal to two times, height limit being less than or equal to preset packaging height, bonding pad size being more than or equal to 4 times of the bonding wire diameter, arc length being less than or equal to 100 times of the bonding wire diameter, and special inspection for a double-wire bonding process during double-wire bonding. Specifically, the specific inspection process of the double-wire bonding process comprises the following steps: judging whether the bonding wires are in double-wire bonding according to the number of coordinates on the same bonding pad, and particularly when the number of coordinates on the same bonding pad is greater than 1, determining that the double-wire bonding exists, and if the double-wire bonding exists, regarding special inspection of a double-wire bonding process, taking the two bonding wires as a whole, and judging whether the distance between the two adjacent bonding wires is within a range; if no double wire bond is present, no special inspection for the double wire bonding process is required.
(3) If yes, judging that the interference simulation check is passed; and if not, carrying out interference simulation check on the other bonding wire model.
Specifically, if each parameter judged based on the simplified trajectory of the bonding wire is in the corresponding range, the judgment is that the parameter passes the interference simulation inspection, and the parametric bonding data is generated by further utilizing the bonding wire model passing the interference simulation inspection.
If at least one parameter is not in the range, performing interference simulation check on the other bonding wire model; and if only one bonding wire model is screened out before interference simulation check, and at least one parameter obtained by the simulation interference check is not in a corresponding range, sending an alarm and outputting an abnormal report to inform related personnel that the bonding wire model which can be used for outputting parametric bonding data is not found.
And S14, generating parameterized bonding data by using the bonding wire model checked by the interference simulation. The parameterized bonding data can be imported into bonding equipment of different models for different bonding scenes. Different bonding scenarios refer to different materials (specifically, different materials and diameters of bonding wires), different bonding precision requirements, and the like.
Referring to fig. 3, a schematic flow chart of a method for generating parametric bonding data based on a bonding wire model according to another embodiment of the invention is shown. As shown in fig. 3, in an embodiment, before step S11, the method for generating parameterized bonding data based on a bonding wire model further includes:
and S10, creating a bonding wire model library. The method specifically comprises the following steps:
(1) and extracting characteristic parameters and machine parameters from the bonding program.
Specifically, the characteristic parameters include: the height difference between the first bonding point and the second bonding point, the length of a connecting line between projection points of the first bonding point and the second bonding point on a horizontal plane, the type of a bonding line, the diameter of the bonding line, and pad parameters corresponding to the first bonding point and the second bonding point.
It should be noted that, in different embodiments, the pad parameters may not be a requirement for the bond wire model to screen the matching.
In practical application, the bonding procedure includes coordinate parameters, and in conjunction with fig. 2, the length of the connection line between the projected points of the first bonding point and the second bonding point on the horizontal plane is calculated according to the coordinates (x1, y1, z1) of the first bonding point (x, y, z) and the second bonding point (x1, y1, z1)
And a height difference z-z1 between the first bond site and the second bond site.
The machine parameters include: ultrasonic mode, power, welding time, welding pressure, bonding temperature and size of a welding ball of the first bonding point; the ultrasonic mode, power, welding time, welding pressure and bonding temperature of the second bonding point; and a wire arc trajectory parameter.
(2) And generating a bonding wire model according to the characteristic parameters and the machine parameters. Specifically, according to the characteristic parameters and the machine parameters of each pair of bonding points, a bonding line model corresponding to the pair of bonding points can be generated.
(3) Creating the library of bondwire models based on the generated bondwire model.
Further, a priority parameter may also be extracted in the bonding procedure. Any parameter value that can characterize the priority order, such as the frequency of use of each machine parameter, the update time or preferred priority level of each machine parameter, etc. In different embodiments, the priority parameters may be used in combination or individually.
In practical application, one characteristic parameter in the bonding wire model library may correspond to a plurality of machine parameters, and the machine parameters are selected and used according to preset priority parameters. For example: if the preset priority parameter is that the use frequency is prior, directly selecting the machine parameter with the highest use frequency; or if the preset priority parameter is the update time, directly selecting the machine parameter with the latest update time; or the preferred priority level is selected as the priority level, the machine parameter with the highest priority level is directly selected.
Referring to fig. 4, a flowchart of a model library optimization iteration of a method for generating parameterized bonding data based on a bonding wire model according to an embodiment of the present invention is shown. As shown in fig. 4, in an embodiment, after step S14, the method for generating parametric bonding data based on the bonding wire model further includes:
s15, based on the characteristic parameters of the produced bonding program, selecting a bonding wire model which meets a preset matching range from the bonding wire model library, and updating the machine parameters of the selected bonding wire model; and/or updating machine parameters and characteristic parameters of the screened bonding wire model according to the pad parameters. The practical application includes the following two aspects of process change and pad parameter updating:
in terms of visitation, particularly, bonding wire model library iteration needs to be performed continuously because parameters of a bonding machine are continuously corrected along with process changes such as equipment upgrading and welding material upgrading in the production process. Firstly, determining a produced bonding program, extracting characteristic parameters, screening a bonding wire model which meets a preset range in a bonding wire model library according to the characteristic parameters, and updating the searched bonding machine parameters in the bonding wire model. Wherein, the upgrading of welding materials means that the composition or the proportion of the material of the bonding wire changes; the bonding procedure description that has already been produced is that which has been put into service.
Subjectively, in practice, parameters after trial production verification and adjustment in actual production of parameterized bonding data output by the interference simulation can be returned to a bonding wire model library for updating, and machine parameters and characteristic parameters of a bonding wire model are updated; and returning the parameters which are not required to be adjusted in the actual production through trial production verification to the bonding wire model library to update the use frequency of the parameters.
Specifically, for the pad parameters, if the searched bonding wire model already includes the pad parameters (the material of the pad and the shape of the pad pattern), or the bonding program includes the pad parameters, all the changed parameters and characteristic parameters of the bonding machine are updated. If the searched bonding wire model and the bonding program do not contain the pad parameters (the pad material and the pad graph shape), finding a corresponding design file, obtaining the pad parameters, adding the pad parameters into the corresponding bonding characteristic parameters, and updating all the changed bonding machine parameters and characteristic parameters.
Referring to fig. 5, a bonding data generation flow chart of a method for generating parameterized bonding data based on a bonding wire model according to an embodiment of the invention is shown. As shown in fig. 5, a specific implementation process of generating parameterized bonding data based on a bonding wire model according to the present invention is described by taking a K & S device as an example.
First, based on pad information in a design file, matching parameters are extracted.
Reading Bonding data In a SiP (System In a Package) design file (the SiP design file is one of integrated circuit design files), and acquiring first pad information and second pad information of each Bonding wire from the Bonding data, wherein the pad information comprises: component name, pin name, pad center coordinate (X, Y coordinate), pad pattern shape, and pad height. Wherein, the height of the bonding pad: calculating the accumulated height of the component according to the component type, the component physical size and the assembling mode in the vertical direction to be used as the height of the bonding pad; and calculating the length L of a connecting line between projection points on the horizontal plane of the bonding pad and the height difference of the bonding pad according to the coordinates of the bonding pad and the height of the bonding pad of each pair of welding points. The unit of data not shown in the following data is μm.
For a first pair of solder joints:
(1) first pad information: name of the element: DIE2, pin name: p2, pad pattern shape: 90 x 90um, pad coordinates (4800.0, 7206.0). DIE2 is a chip, thickness: 90, the assembly mode is stacking, and the obtained height of the first bonding pad is as follows: 180.
(2) second pad information: name of the element: DIE1, pin name: p1, pad pattern shape: 90 x 90um, pad coordinates (4800.0, 7911.0). DIE1 is a chip, thickness: 90, the assembly mode is stacking, and the obtained height of the second bonding pad is as follows: 90.
the matching parameters are extracted as follows:
(3) the height difference between the first and second pads D1 and D2 is 180-90.
(4) Table of length L of connection line between projected points of the first and second pads D1 and D2 on the horizontal planeShown as follows:
(5) setting a bonding wire type: gold alloy, bonding wire diameter 0.8mil (20.32 μm).
(6) The pad parameters are that the pad material is nickel gold, and the pad pattern shape is 90 x 90.
And then, searching matching in the bonding wire model library by using the matching parameters so as to obtain a bonding wire model in a correlation manner.
Through the height difference of the first bonding pad and the second bonding pad: 90, the length L of a connecting line between the projection points of the first pad and the second pad on the horizontal plane is 705.0, and the type of a bonding wire is as follows: gold alloy, bonding wire diameter: searching the bonding wire model library according to the matching range +/-5% by taking 0.8mil (20.32 mu m) as a condition to obtain two bonding wire models as follows:
the characteristic parameters of the first bonding wire model are as follows: a height difference 90; the length of a connecting line between projection points on a horizontal plane is 705.0; bond wire type: gold alloy, bonding wire diameter 0.8mil, (20.32 μm); first bond pad parameters: the pad material is nickel gold, pad figure shape: 90 by 90; second bond pad parameters: the pad material is nickel gold, pad figure shape: 90*90.
The machine parameters of the first bond wire model are: first bond site bonding parameters: an ultrasonic mode: a power mode; the power output is 400 mW; welding and sticking time: 7 ms; welding adhesion pressure: 35g of a soybean milk powder; bonding temperature: 240 ℃; size of solder ball: 48.8 um. Second bond site bonding parameters: an ultrasonic mode: a power mode; the power output is 400 mW; welding and sticking time: 6 ms; welding adhesion pressure: 85 g; bonding temperature: at 240 ℃. The current machine arc trajectory parameters are: a. arc-shaped: a standard arc; b. height of the wire neck: 3 mil; c. reverse shift: 3 mil; d. reverse movement angle: 90 °, etc.
Priority parameters of the first bonding wire model: the frequency of use is highest: 50, parameter updating time 2021-10-2016: 00.
The characteristic parameters of the second bonding wire model are: a height difference 90; the length of a connecting line between projection points on a horizontal plane is 705.0; obtaining the type of a bonding wire: gold alloy, bonding wire diameter 0.8mil, (20.32 μm); first bond pad parameters: none; second bond pad parameters: none. Further, the second bonding line model has no pad parameters, so that when the subsequent bonding line model library is optimized and iterated, the pad parameters in the first pair of pad matching parameters can be filled into the pad parameters of the second bonding line model, and the second bonding line model is updated.
The machine parameters of the second bond wire model were: first bond site bonding parameters: an ultrasonic mode: a power mode; the power output is 400 mW; welding and sticking time: 7 ms; welding adhesion pressure: 37g of a soybean milk powder; bonding temperature: 240 ℃; size of solder ball: 49.0 um. Second bond site bonding parameters: an ultrasonic mode: a power mode; the power output is 400 mW; welding and sticking time: 6 ms; welding adhesion pressure: 85 g; bonding temperature: at 240 ℃. The current machine arc trajectory parameters are: a. arc-shaped: a standard arc; b. height of the wire neck: 3 mil; c. reverse shift: 3 mil; d. reverse movement angle: 90 °, etc.
The priority parameters of the second bonding wire model are: the frequency of use is highest: 45, parameter updating time 2021-9-209: 00.
If the priority parameter is preset to be that the use frequency is prior, the use frequency of the first bonding wire model is 50 highest, and the use frequency of the second bonding wire model is 45 highest, the first bonding wire model is selected as the bonding wire model M1.
Aiming at the second pair of welding points:
(1) first pad information: name of the element: DIE2, pin name: p2, pad pattern shape: 85 × 85um, pad coordinates (4930.0, 7206.0). DIE2 is a chip, thickness: 90, the assembly mode is stacking, and the obtained height of the first bonding pad is as follows: 180.
(2) second pad information: name of the element: DIE1, pin name: p1, pad pattern shape: 85 × 85um, pad coordinates (4890.0, 7911.0), DIE1 is chip thickness: 90, the assembly mode is stacking, and the obtained height of the second bonding pad is as follows: 90.
the matching parameters are extracted as follows:
(3) the height difference between the first and second pads D1 and D2 is 180-90.
(4) The length L of the connection line between the projected points of the first and second pads D1 and D2 on the horizontal plane is represented as:
(5) setting a bonding wire type: gold alloy, bonding wire diameter 0.8mil (20.32 μm).
(6) The pad parameters are nickel gold, pad pattern shape 85 x 85.
And then, searching matching in the bonding wire model library by using the matching parameters so as to obtain a bonding wire model in a correlation manner.
Through the height difference of the first bonding pad and the second bonding pad: and 90, the length L of a connecting line between the projection points of the first bonding pad and the second bonding pad on the horizontal plane is 706.1, and the bonding wire type: gold alloy, bonding wire diameter: 0.8mil (20.32 μm) was used as a condition to search within ± 5% of the match range in the bond wire model library, and only one bond wire model was obtained as follows:
the characteristic parameters of the bonding wire model are as follows: a height difference 90; length 706.1 of the line between the projected points on the horizontal plane; bond wire type: gold alloy, bonding wire diameter 0.8mil, (20.32 μm); first bond pad parameters: the pad material is nickel gold, pad figure shape: 85, 85 by one; second bond pad parameters: the pad material is nickel gold, pad figure shape: 85*85.
The machine parameters of the wire bonding model were: first bond site bonding parameters: an ultrasonic mode: a power mode; the power output is 400 mW; welding and sticking time: 7 ms; welding adhesion pressure: 35g of a soybean milk powder; bonding temperature: 240 ℃; size of solder ball: 48.8 um. Second bond site bonding parameters: an ultrasonic mode: a power mode; the power output is 400 mW; welding and sticking time: 6 ms; welding adhesion pressure: 85 g; bonding temperature: at 240 ℃. The current machine arc trajectory parameters are: a. arc-shaped: a standard arc; b. height of the wire neck: 3 mil; c. reverse shift: 3 mil; d. reverse movement angle: 90 °, etc.
The prior parameters of the bonding wire model are as follows: the frequency of use is highest: 100, parameter updating time 2021-10-2016: 02.
Since only one bonding model is selected from the pair of pads, the bonding wire model is directly used as the bonding wire model M2.
And performing bonding wire model matching operation of the subsequent pairs of welding points one by one until all pairs of welding points are matched.
Then, an interference simulation check is performed.
Fig. 6 is a schematic diagram showing an interference simulation of the method for generating parametric bonding data based on a bonding wire model according to an embodiment of the present invention. As shown in fig. 6, a simplified model of the bonding wire can be obtained according to the arc, the wire diameter height, the reverse shift, and the like in the wire arc trajectory parameters, and a simplified trajectory of the bonding wire is obtained according to the simplified model simulation, taking the arc as a standard arc as an example, the simplified model of the bonding wire obtained according to the above is: taking STEP1 as an example, the abscissa is the horizontal displacement of the first-segment trajectory STEP1(0, b), the second-segment trajectory STEP2(c, c), and the third-segment trajectory STEP3(c × 2, 0), and the ordinate is the vertical displacement of the first-segment trajectory; the fourth segment trajectory is a straight line from STEP3 to the second bond site.
A simplified trajectory of the bonding wire is obtained from the arc being a standard arc, the wire diameter being 3mil (75 μm) in height and being shifted in reverse by 3mil (75 μm), etc.: the first-stage trajectory STEP1(0.0, 75.0), the second-stage trajectory STEP2(75.0 ), and the third-stage trajectory STEP3(150.0, 0.0).
And performing interference simulation check according to whether the requirements that the distance between bonding wires is more than or equal to two times of the diameter of the bonding wires, the height limit is less than or equal to the preset packaging height, the size of a bonding pad is more than or equal to 4 times of the diameter of the bonding wires, and the arc length is less than or equal to 100 times of the diameter of the bonding wires are met.
(1) Performing interference simulation inspection on the distance between the bonding wires, which is specifically as follows:
obtaining each key point of the space curve corresponding to the simplified track according to the simplified track, determining a line segment corresponding to the simplified track according to the key points, wherein the algorithm of the shortest distance between two line segments in the space is as follows: the length of the common perpendicular line between the two line segments (1 value), the perpendicular distance from each end point to the other line segment (4 values), and the distance between the four end points (4 values) are calculated to obtain 9 values, and the minimum value is selected as the minimum distance between the two line segments in the space. The shortest distance between the two bonding wires is 90 through calculation.
As can be seen from the above-mentioned paired pad matching, the diameter of the bonding wire is 20.32 μm, and the shortest distance 90 between two bonding wires is greater than 2 times the diameter of the bonding wire: 20.32 x 2-40.64, so the inter-wire bond spacing simulation check passed.
(2) Interference simulation check is carried out on the height limit, and the method specifically comprises the following steps:
judging whether the highest point of the bonding wire is less than or equal to a preset packaging height or not; the height of the package can be obtained according to the type of the device and the design standard as follows: 900 μm.
The arc height (H) is determined according to the data of three traces, STEP1, STEP2 and STEP3 respectively: STEP1(0.0, 75.0), STEP2(75.0 ), STEP3(150.0, 0.0), the values of the calculated arc height, i.e. the vertical displacement, are added (calculated in this example with reference to the first bonding point): 75.0+75.0+0.0 ═ 150.
The highest point of the bonding line is as follows: the frame base 300+ first bond site height 180+ arc height 150+ bond wire radius 10.16-640.16, which is less than the package height 900, i.e., the height limit simulation check passes.
(3) And carrying out interference simulation inspection on the size of the bonding pad, wherein the interference simulation inspection is as follows:
the pad size of the bonding wire model M1 is 90 × 90, and the bonding wire diameter is 4 times 20.32 × 4 — 81.28, so that the pad size is larger than 4 times the bonding wire diameter.
The pad size of the bonding wire model M2 is 85 × 85, and the bonding wire diameter is 4 times 20.32 × 4 — 81.28, so that the pad size is larger than 4 times the bonding wire diameter.
Therefore, the pad size simulation checks of the bond wire model M1 and the bond wire model M2 pass.
(4) And carrying out interference simulation check on the arc length, which comprises the following steps:
the judgment criterion is whether the arc length is less than or equal to 100 times the diameter of the bonding wire.
The height difference between the first bonding pad D1 and the second bonding pad D2 is 180-90 (H1), the projection length on the horizontal plane is 705(L), STEP1(0.0, 75.0), STEP2(75.0 ), and STEP3(150.0, 0.0), and the arc lengths corresponding to the three-segment trajectories are calculated according to the respective coordinates of STEP1, STEP2, and STEP3 as follows:
the length of the bonding wire corresponding to STEP4 of the bonding wire model M1 is:
the length of the bonding wire corresponding to STEP4 of the bonding wire model M2 is:
thus, the total arc length of the bonding wire model M1 is 331.1+536.7 is 867.8;
the total arc length of the bonding wire model M2 is 331.1+537.6 is 868.7.
As can be seen from the above-mentioned paired pad matching, the bond wire diameter is 20.32 μ M, and the comparative analysis shows that the arc length of the bond wire model M1 (867.8) and the arc length of the bond wire model M2 (868.7) are both less than or equal to 100 times the bond wire diameter (20.32 × 100 — 2032), so the arc length simulation check is passed.
It should be noted that, because the embodiments of the present disclosure are single bonding wires, interference simulation inspection of the double-wire bonding process is not involved.
And finally, generating and outputting parameterized bonding data based on the bonding wire model subjected to interference simulation inspection, and importing different bonding equipment for different bonding scenes. Generating parameterized bonding data based on a bonding wire model subjected to interference simulation inspection, performing format conversion on the bonding data according to a bonding data format required by current equipment, and importing the bonding data into the current bonding equipment to generate a bonding program for current production after the format conversion is completed. The different bonding scenarios include, but are not limited to: different materials (material of the bonding wire), different precision requirements of bonding, etc.
Generating corresponding parametric bonding data based on the bonding wire model passing the interference simulation inspection, wherein the parametric bonding data are as follows: and (4) coordinates and machine parameters of a bonding point corresponding to the bonding wire model which is checked through simulation. And performing list management on the parameterized bonding data to form a parameterized bonding data table of table 1.
TABLE 1 parameterized bonding data sheet
The protection scope of the method for generating parameterized bonding data based on a bonding wire model according to the present invention is not limited to the execution sequence of the steps listed in this embodiment, and all the solutions implemented by adding, subtracting, and replacing steps in the prior art according to the principles of the present invention are included in the protection scope of the present invention.
The present embodiment provides a computer-readable storage medium having stored thereon a computer program which, when being executed by a processor, carries out the method for generating parametric bonding data based on a bond wire model.
Those of ordinary skill in the art will understand that: all or part of the steps for implementing the above method embodiments may be performed by hardware associated with a computer program. The aforementioned computer program may be stored in a computer readable storage medium. When executed, the program performs steps comprising the method embodiments described above; and the aforementioned computer-readable storage media comprise: various computer storage media that can store program codes, such as ROM, RAM, magnetic or optical disks.
Please refer to fig. 7, which is a schematic structural connection diagram of an electronic device according to an embodiment of the present invention. As shown in fig. 7, the present embodiment provides an electronic device 7, which specifically includes: a processor 71 and a memory 72; the memory 72 is configured to store a computer program, and the processor 71 is configured to execute the computer program stored in the memory 72 to enable the electronic device 7 to perform the steps of the method for generating parameterized bonding data based on a bonding wire model.
The Processor 71 may be a general-purpose Processor, and includes a Central Processing Unit (CPU), a Network Processor (NP), and the like; the Integrated Circuit may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic device, or discrete hardware components.
The Memory 72 may include a Random Access Memory (RAM), and may further include a non-volatile Memory (non-volatile Memory), such as at least one disk Memory.
In practice, the electronic device may be a computer including all or some of the components of memory, memory controller, one or more processing units (CPUs), peripheral interfaces, RF circuits, audio circuits, speakers, microphones, input/output (I/O) subsystems, display screens, other output or control devices, and external ports; the computer includes, but is not limited to, a Personal computer such as a desktop computer, a notebook computer, a tablet computer, a smart phone, a Personal Digital Assistant (PDA for short), and the like, and the electronic device may also be a server, and the server may be arranged on one or more physical servers according to various factors such as functions, loads, and the like, or may also be a cloud server formed by a distributed or centralized server cluster, which is not limited in this embodiment.
In summary, the method, medium, and device for generating parameterized bonding data based on a bonding wire model provided by the present invention utilize matching parameters of a design file to screen a bonding wire model from a bonding wire model library, perform interference simulation inspection on the bonding wire model to generate parameterized bonding data, and then import the parameterized bonding data into different bonding devices for different bonding scenarios. According to the invention, manual operation is replaced by data learning and optimization judgment, so that the working efficiency and quality are greatly improved, and the production cost of enterprises is further reduced. On one hand, the defects that a manual operation mode is too low in efficiency, poor in accuracy and adaptability and more dependent on experience are overcome, and on the other hand, compared with the existing bonding program generation method, when some objective conditions or environments of bonding equipment change, accurate adaptability change can be achieved, and therefore the accuracy of bonding data is improved. The invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A method for generating parametric bonding data based on a bond wire model, the method comprising:
acquiring matching parameters in an integrated circuit design file;
according to the matching parameters, a bonding wire model which meets a preset matching range is screened from a bonding wire model library;
carrying out interference simulation inspection on the screened bonding wire model;
parametric bonding data is generated using a bond wire model that is inspected by interferometric simulation.
2. The method of generating parametric bonding data based on a bond wire model of claim 1, wherein:
the matching parameters include: the height difference between the first bonding pad and the second bonding pad, the length of a connecting line between projection points of the first bonding pad and the second bonding pad on a horizontal plane, the type of a bonding wire and the diameter of the bonding wire.
3. The method of claim 1, wherein after the step of selecting the bonding wire model meeting the preset matching range from the bonding wire model library according to the matching parameters, and before the step of performing the interference simulation check on the selected bonding wire model, the method of generating the parametric bonding data based on the bonding wire model further comprises:
analyzing the number of the screened bonding wire models;
in response to the number being one, performing a step of performing interference simulation inspection on the screened bonding wire models;
in response to the number of the bonding wire models being at least two, determining an optimal bonding wire model by using the priority parameters, and carrying out interference simulation check on the optimal bonding wire model; the priority parameters include: at least one of a frequency of use, an update time, or a set priority level;
in response to the number being zero, a new bondwire model is created.
4. The method of claim 3, wherein the step of determining a preferred bonding wire model using a priority parameter comprises:
if the priority parameter is the use frequency, selecting the bonding wire model with the highest use frequency as the preferred bonding wire model;
if the priority parameter is the updating time, selecting the bonding wire model with the latest updating time as the preferred bonding wire model;
and if the priority level is set as priority, selecting the bonding wire model with the highest priority level as the preferred bonding wire model.
5. The method of claim 1, wherein the step of performing interferometric simulation inspection on the screened bond wire model comprises:
obtaining a simplified model of the bonding wire according to the wire arc track parameters, and obtaining a simplified track of the bonding wire according to the simplified model;
judging whether the simplified track of the bonding wires simultaneously meets the requirements of bonding wire diameter with the distance between the bonding wires being more than or equal to two times, height limit being less than or equal to preset packaging height, bonding pad size being more than or equal to 4 times of the bonding wire diameter, arc length being less than or equal to 100 times of the bonding wire diameter, and special inspection for a double-wire bonding process during double-wire bonding;
if yes, judging that the interference simulation check is passed; and if not, carrying out interference simulation check on the other bonding wire model.
6. The method of generating parametric bonding data based on a bond wire model according to any of claims 1 to 5, wherein the method of generating parametric bonding data based on a bond wire model further comprises, prior to the step of obtaining matching parameters in an integrated circuit design file:
extracting characteristic parameters and machine parameters from a bonding program;
generating a bonding wire model according to the characteristic parameters and the machine parameters;
creating the library of bondwire models based on the generated bondwire model.
7. The method of generating parametric bonding data based on a bond wire model of claim 6, wherein:
the characteristic parameters comprise: the height difference between the first bonding point and the second bonding point, the length of a connecting line between projection points of the first bonding point and the second bonding point on a horizontal plane, the type of a bonding line, the diameter of the bonding line, and pad parameters corresponding to the first bonding point and the second bonding point;
the machine parameters include: ultrasonic mode, power, welding time, welding pressure, bonding temperature and size of a welding ball of the first bonding point; the ultrasonic mode, power, welding time, welding pressure and bonding temperature of the second bonding point; and a wire arc trajectory parameter.
8. The method of claim 6, wherein after the step of generating parametric bonding data using the wire model inspected by interferometric simulation, the method of generating parametric bonding data based on the wire model further comprises:
based on the characteristic parameters of the produced bonding program, selecting a bonding wire model which meets a preset matching range from the bonding wire model library, and updating the machine parameters of the selected bonding wire model; and/or updating machine parameters and characteristic parameters of the screened bonding wire model according to the pad parameters.
9. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the method for generating parametric bonding data based on a bond wire model according to any one of claims 1 to 8.
10. An electronic device, comprising: a processor and a memory;
the memory is configured to store a computer program, and the processor is configured to execute the computer program stored by the memory to cause the electronic device to perform the method of generating parameterized bonding data based on a wire bond model according to any one of claims 1 to 8.
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| CN114741999A (en) * | 2022-06-09 | 2022-07-12 | 武汉飞恩微电子有限公司 | Digital twinning technology-based lead bonding online monitoring method |
| WO2023098122A1 (en) * | 2021-11-30 | 2023-06-08 | 上海望友信息科技有限公司 | Method for generating parameterized bonding data on basis of bonding wire model, and medium and device |
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| CN107330184B (en) * | 2017-06-29 | 2020-03-24 | 南通大学 | Simulation test method for bonding wire in electrical component, storage medium and device |
| CN108363825A (en) * | 2017-12-01 | 2018-08-03 | 长芯半导体有限公司 | A kind of encapsulation bonding line design method of impedance matching, electronic equipment and storage medium |
| CN110197019B (en) * | 2019-05-20 | 2021-09-10 | 上海望友信息科技有限公司 | Process design method, system, medium and equipment based on system packaging technology |
| JP7336294B2 (en) * | 2019-07-26 | 2023-08-31 | キヤノンマシナリー株式会社 | BONDING WIRE INSPECTION DEVICE, BONDING WIRE INSPECTION METHOD, AND BONDING WIRE INSPECTION PROGRAM |
| CN111651955B (en) * | 2020-04-17 | 2023-08-22 | 上海望友信息科技有限公司 | Automatic generation method and device of package bonding program, storage medium and electronic equipment |
| CN114266222A (en) * | 2021-11-30 | 2022-04-01 | 上海望友信息科技有限公司 | Method, medium, and apparatus for generating parametric bonding data based on bond line model |
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| WO2023098122A1 (en) * | 2021-11-30 | 2023-06-08 | 上海望友信息科技有限公司 | Method for generating parameterized bonding data on basis of bonding wire model, and medium and device |
| CN114741999A (en) * | 2022-06-09 | 2022-07-12 | 武汉飞恩微电子有限公司 | Digital twinning technology-based lead bonding online monitoring method |
| CN114741999B (en) * | 2022-06-09 | 2022-09-02 | 武汉飞恩微电子有限公司 | Digital twinning technology-based lead bonding online monitoring method |
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