CN114265243B - Backlight module and display device - Google Patents
Backlight module and display device Download PDFInfo
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- CN114265243B CN114265243B CN202210195912.3A CN202210195912A CN114265243B CN 114265243 B CN114265243 B CN 114265243B CN 202210195912 A CN202210195912 A CN 202210195912A CN 114265243 B CN114265243 B CN 114265243B
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Abstract
The utility model belongs to the display field, concretely relates to backlight unit and display device, backlight unit includes backplate, optics diaphragm and light source board, the light source board with optics diaphragm all install in the backplate, just optics diaphragm is located the light-emitting side of light source board, backlight unit is still including the heat dissipation supporting part, the heat dissipation supporting part is located the light source board is kept away from one side of optics diaphragm, the heat dissipation supporting part has first holding surface and second holding surface, first holding surface with the local region of backplate contacts, the second holding surface with the local region of light source board contacts, so that be used for supporting the light source board makes the light source board with distance between the optics diaphragm satisfies predetermined optical distance. In this application, the heat of light source board can conduct backplate isotructure through the heat dissipation supporting part, and heat dissipation supporting part and backplate isotructure are big and the heat exchange is fast with air area of contact, can help the heat dissipation of light source board.
Description
Technical Field
The application belongs to the display field, and particularly relates to a backlight module and a display device.
Background
Micro/Mini LED (Mini light emitting diode) belongs to one of LCD (liquid crystal display) backlight technologies, and improves the control capability of a backlight module and reduces the optical distance of backlight through the introduction of packaging, size reduction and mass transfer technologies, thereby realizing ultrathin and high dynamic contrast.
Along with the increase of the resolution and the brightness of the Micro/Mini LED, the number of the LEDs in unit area is increased continuously, the distance between the LEDs is reduced continuously, the driving current of a single LED is increased more and more, and the display has the requirement of working for a long time, so that the heat of the single LED is increased, the heat is accumulated on a lamp panel bearing the LED, and if the heat is not dissipated effectively, the display effect of the display device is influenced.
Disclosure of Invention
An object of the application is to provide a backlight module and a display device, so as to enhance the heat dissipation performance of the backlight module and improve the display effect of the display device.
In order to achieve the above object, the present application provides a backlight module, including backplate, optics diaphragm and light source board, the light source board with the optics diaphragm all install in the backplate, just the optics diaphragm is located the light-emitting side of light source board, backlight module still includes:
the heat dissipation supporting part is located the light source board is kept away from one side of optical film piece, the heat dissipation supporting part has first holding surface and second holding surface, first holding surface with the local area of backplate contacts, the second holding surface with the local area of light source board contacts, in order to be used for supporting the light source board makes the light source board with optical distance is predetermine to distance between the optical film piece satisfies, the heat dissipation supporting part is the heat conduction material structure.
Optionally, the back plate comprises a bottom plate, and a placement groove with a notch facing the optical film is formed in the middle area of the bottom plate;
the light source board with the heat dissipation supporting part is located in the standing groove, first holding surface with the second holding surface is two relative holding surfaces on the thickness direction of heat dissipation supporting part, first holding surface with the tank bottom of standing groove contacts, the thickness of heat dissipation supporting part or the position in the light-emitting direction can be adjusted, make the light source board with optical distance between the optical film piece can be adjusted.
Optionally, the heat dissipation support portions are provided in plurality and arranged at intervals in the width direction thereof.
Optionally, a vent hole is formed in a wall of the placing groove, the vent hole is communicated with the inside of the placing groove, and the vent hole is located on one side, away from the optical diaphragm, of the light source plate.
Optionally, the backlight module further includes a sealing plate, the sealing plate is disposed in the placing groove, the sealing plate is located on one side of the light source plate away from the optical film, and the sealing plate, the light source plate and the bottom of the placing groove are both spaced apart; the heat dissipation supporting part penetrates through the sealing plate, and the ventilation hole is located on one side, far away from the light source plate, of the sealing plate.
Optionally, the backlight module further comprises a heat dissipation device, and the heat dissipation device is disposed on the back plate or the light source plate;
the heat dissipation device comprises a heat dissipation fan, and the heat dissipation fan is arranged on the outer side of the back plate and opposite to the ventilation holes.
Optionally, the light source board includes a light source substrate and a plurality of light sources disposed on the light source substrate at intervals, the light sources are located on one side of the light source substrate close to the optical film, and a distance between the light sources and the optical film is the preset optical distance;
the second supporting surface is bonded with the light source substrate, and the first supporting surface is bonded with the back plate; or
The light source substrate and the back plate are connected through a threaded structure.
Optionally, when the light source substrate and the back plate are connected by the thread structure, the backlight module further includes a heat conducting gasket;
wherein the thermal pad is disposed between the second support surface and the light source substrate; and/or
The heat conducting gasket is arranged between the first supporting surface and the back plate.
Optionally, the heat dissipation support portion includes a heat conductive resin structure or a heat conductive metal structure; and/or
The back plate is of a heat-conducting metal structure, and the back plate is of an integrated structure.
The present application also provides a display device, including:
a backlight module;
and the display panel is arranged on the light emergent side of the backlight module.
The application discloses backlight unit and display device has following beneficial effect:
in this application, the heat dissipation supporting part supports between backplate and light source board, and the heat dissipation supporting part adopts the heat conduction material preparation, and the heat of light source board can conduct backplate isotructure through the heat dissipation supporting part, and heat dissipation supporting part and backplate isotructure are big and the heat exchange is fast with air area of contact, can help the heat dissipation of light source board, and the design has strengthened backlight unit's heat dispersion like this for display device can improve display device's display effect.
Other features and advantages of the present application will be apparent from the following detailed description, or may be learned by practice of the application.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic structural diagram of a backlight module according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a backlight module with a middle frame according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a heat dissipation support portion in an embodiment of the present application.
Fig. 4 is a top view of the heat dissipation support portion in fig. 3.
Fig. 5 is a schematic structural diagram of a display device according to a second embodiment of the present application.
Description of reference numerals:
100. a backlight module;
110. a back plate; 111. a base plate; 112. a side plate; 113. a containing groove; 114. a placement groove; 115. a vent hole; 116. a heat radiation fan;
120. an optical film;
130. a light source plate; 131. a light source substrate; 132. a light source; 133. a screw;
140. a heat dissipation support part; 150. a reflective sheet; 160. a thermally conductive gasket; 170. a sealing plate;
180. a middle frame; 181. a limiting part;
200. a display panel.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.
Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the application. One skilled in the relevant art will recognize, however, that the embodiments of the present application can be practiced without one or more of the specific details, or with other methods, components, devices, steps, and so forth. In other instances, well-known methods, devices, implementations, or operations have not been shown or described in detail to avoid obscuring aspects of the application.
The present application will be described in further detail with reference to the following drawings and specific examples. It should be noted that the technical features mentioned in the embodiments of the present application described below may be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.
Example one
Fig. 1 is a schematic structural diagram of a backlight module according to an embodiment of the present application, and referring to fig. 1, the backlight module according to the embodiment includes: a back plate 110, an optical film 120, a light source plate 130, and a heat dissipation support part 140.
The light source board 130 and the optical film 120 are both mounted on the back plate 110, and the optical film 120 is located on the light emitting side of the light source board 130. The heat dissipation support portion 140 is located on a side of the light source board 130 away from the optical film 120, the heat dissipation support portion 140 has a first support surface and a second support surface, the first support surface contacts with a local area of the back plate 110, and the second support surface contacts with a local area of the light source board 130 to support the light source board 130, so that a distance between the light source 132 of the light source board 130 and the optical film 120 satisfies a predetermined optical distance. The heat dissipation support 140 is a heat conductive material structure for heat conduction and heat dissipation.
It should be noted that the optical film 120 may include a diffusion sheet, but is not limited thereto, and the optical film 120 may further include a prism sheet, a light homogenizing sheet, and the like, as the case may be.
The first supporting surface of the heat dissipation supporting portion 140 contacts with a local area of the back plate 110, the second supporting surface contacts with a local area of the light source plate 130, and the two supporting surfaces and the corresponding structures thereof may be in direct contact, but are not limited thereto, or may be in indirect contact, as the case may be. The heat dissipation support portion 140 is made of a heat conductive material, and the specific shape thereof is not limited and may be any shape, but two support surfaces thereof contact with the corresponding structures thereof, so that the heat of the light source board 130 can be conducted to the back plate 110 and other structures through the heat dissipation support portion 140. The heat dissipation support part 140, the back plate 110, and other structures have a large contact area with air and fast heat exchange, and can help the light source plate 130 dissipate heat.
In this embodiment, the heat dissipation supporting portion 140 is supported between the back plate 110 and the light source plate 130, the heat dissipation supporting portion 140 is made of a heat conducting material, the heat of the light source plate 130 can be conducted to the structures such as the back plate 110 through the heat dissipation supporting portion 140, the structures such as the heat dissipation supporting portion 140 and the back plate 110 are large in contact area with air and fast in heat exchange, and can help the light source plate 130 to dissipate heat, so that the heat dissipation performance of the backlight module is enhanced, and the display effect of the display device can be improved.
Illustratively, the back plate 110 includes a bottom plate 111 and a side plate 112, the bottom plate 111 has a middle region and an edge region disposed around the middle region, the side plate 112 is disposed on the edge region and encloses a receiving groove 113 with the bottom plate 111, and the middle region forms a receiving groove 114 with a notch facing the optical film 120. The optical film 120 is located in the receiving groove 113, and an edge of the optical film 120 overlaps the edge region and covers the notch of the receiving groove 114. The light source board 130 and the heat dissipation support portion 140 are located in the placement groove 114, the first support surface and the second support surface of the heat dissipation support portion 140 are two opposite support surfaces in the thickness direction of the heat dissipation support portion 140, and the first support surface of the heat dissipation support portion 140 is in contact with the groove bottom of the placement groove 114, that is, the heat dissipation support portion 140 is mounted on the groove bottom of the placement groove 114. The thickness or the position of the heat dissipation support part 140 in the light emitting direction can be adjusted, so that the optical distance between the light source board 130 and the optical film 120 can be adjusted.
It should be noted that the first supporting surface and the second supporting surface of the heat dissipation supporting portion 140 are two supporting surfaces opposite to each other in the thickness direction of the heat dissipation supporting portion 140, but the present invention is not limited thereto, the first supporting surface of the heat dissipation supporting portion 140 may also be a supporting surface in the width direction of the heat dissipation supporting portion 140, the first supporting surface of the heat dissipation supporting portion 140 is in contact with the slot sidewall of the placement slot 114, that is, the heat dissipation supporting portion 140 is mounted on the slot sidewall of the placement slot 114, the second supporting surface of the heat dissipation supporting portion 140 is a supporting surface in the thickness direction of the heat dissipation supporting portion 140, and the second supporting surface is in contact with a local region of the light source plate 130.
The backlight module may use different types of light source boards 130, and the optical distances of the different types of light source boards 130 are different. In this embodiment, the optical film 120 is disposed on the edge region of the back plate 110, the position of the optical film is relatively fixed, the heat dissipation support portion 140 is disposed on the bottom of the placement groove 114, the light source board 130 is supported on the heat dissipation support portion 140, and when it is necessary to be compatible with different types of light source boards 130, the distance between the light source board 130 and the optical film 120 can be adjusted by replacing the heat dissipation support portion 140 or the raised heat dissipation support portion 140, so that the distance between the light source 132 and the optical film 120 satisfies the preset optical distance. By the design, the backlight module can be compatible with different types of light source plates 130, redesign and mold opening are avoided when the light source plates 130 are replaced, so that the product development period is shortened, and the product development cost is reduced.
In addition, the optical film 120 is disposed on the edge region of the back plate 110, the heat dissipation support portion 140 is disposed on the groove bottom of the placement groove 114, and the light source plate 130 is supported on the heat dissipation support portion 140, so that a support column between the optical film 120 and the light source plate 130 is omitted, and the support column can be prevented from blocking light rays to form shadows of the support column, thereby affecting optical quality. The supporting column between the optical film 120 and the light source plate 130 is omitted, and the supporting column can be prevented from falling off in the using process and remaining in the light mixing cavity between the optical film 120 and the light source plate 130 to influence the optical quality.
Fig. 2 is a schematic structural diagram of a backlight module with a middle frame in an embodiment of the present application, and referring to fig. 1 and fig. 2, the backlight module further includes a middle frame 180, and the optical film 120 is located between the middle frame 180 and the bottom plate 111. The middle frame 180 has a limiting portion 181 extending inward, a display panel and other structures can be mounted above the limiting portion 181, and the optical film 120 is located between the limiting portion 181 and the bottom plate 111.
The heat dissipation support portion 140 is disposed on the bottom of the placement groove 114 to support the light source board 130, the optical film 120 is supported by the bottom plate 111, the bottom plate 111 has a middle region and an edge region disposed around the middle region, the middle region is the placement groove 114, the edge region may be a ring surface, and the optical film 120 is supported on the edge region, so as to avoid the situation that the middle of the optical film 120 is recessed toward the placement groove 114 after the support pillar between the optical film 120 and the light source board 130 is omitted.
In addition, the middle frame 180 has a limiting portion 181 extending inward, the optical film 120 is located between the limiting portion 181 and the bottom plate 111, and the edge position of the optical film 120 is pressed by the limiting portion 181, so that the recess of the middle of the optical film 120 towards the placing groove 114 can be reduced.
The optical film 120 may be sandwiched between the limiting portion 181 and the bottom plate 111, but is not limited thereto, and the edge regions of the optical film 120 and the bottom plate 111 may be connected by bonding, so that the optical film 120 is subjected to a tensile force in the circumferential direction, and the recess of the optical film 120 in the middle of the placement groove 114 may be reduced.
Referring to fig. 1, the light source board 130 includes a light source substrate 131 and a plurality of light sources 132 spaced apart from the light source substrate 131, the light sources 132 are disposed on a side of the light source substrate 131 close to the optical film 120, and a distance between the light sources 132 and the optical film 120 is a predetermined optical distance.
It should be noted that the light source 132 may include a Mini LED/Micro LED (Mini light emitting diode) light source 132, but is not limited thereto. The Mini LED light sources 132 have the size of 50-200 microns, and the gap between every two adjacent light sources 132 is 0.3-1.2 mm. The Micro LED light sources 132 have a size of less than 50 microns, and a gap between two adjacent light sources 132 is less than 0.3 mm.
The Mini LED/Micro LED light sources 132 have small size, the gaps among the light sources 132 are small, and the number of the light sources 132 integrated on the light source substrate 131 is large, so that more fine backlight partitions can be divided, and the contrast of the screen is greatly improved.
Referring to fig. 1 and 2, the heat dissipation support 140 is elongated, for example: the orthographic projection of the heat dissipation support part on the bottom plate 111 can be rectangular, but is not limited to the rectangle, the whole orthographic projection can be similar to a Z-shaped long strip, an S-shaped long strip, a square long strip and the like, and the width and the thickness of the heat dissipation support part 140 are both smaller than the length of the heat dissipation support part. The first supporting surface and the second supporting surface of the heat dissipation supporting portion 140 are rectangular surfaces, that is, the heat dissipation supporting portion 140 may be a long strip with a rectangular cross section.
It should be noted that the first supporting surface and the second supporting surface of the heat dissipation supporting portion 140 may also have other shapes, as the case may be.
The width and thickness of the heat dissipation support portion 140 are both smaller than the length thereof, that is, the heat dissipation support portion 140 is in surface contact with the light source substrate 131, and compared with the scheme that the support column is used to support between the optical film 120 and the light source substrate 131, the area of the second support surface between the heat dissipation support portion 140 and the light source substrate 131 is significantly increased, and the light source substrate 131 is prevented from being damaged due to uneven stress.
In some embodiments, the heat dissipation support 140 is a rectangular parallelepiped pillar, and the heat dissipation support 140 is disposed in a plurality and arranged at intervals in the width direction thereof. In the length direction of the heat dissipation support 140, the length of the heat dissipation support 140 is smaller than the length of the placement groove 114, that is, the heat dissipation support 140 has a gap with the groove sidewall of the placement groove 114.
When the plurality of heat dissipation support parts 140 are arranged at intervals in the width direction thereof, air can circulate between the heat dissipation support parts 140, so that the temperature difference between different parts of the light source substrate 131 can be reduced. In addition, the area of the second supporting surface between the heat dissipation supporting portion 140 and the light source substrate 131 is increased, the number of the heat dissipation supporting portions 140 supporting the light source substrate 131 can be reduced, and when the heat dissipation supporting portion 140 is replaced or the heat dissipation supporting portion 140 is heightened by the heat conductive gasket 160, the height uniformity of different heat dissipation supporting portions 140 is easily ensured, and the light source substrate 131 is prevented from being inclined to affect the optical quality.
It should be noted that the plurality of heat dissipation support portions 140 are not limited to be arranged at intervals in the width direction thereof, and may be combined into the aforementioned zigzag shape or square shape, as the case may be.
Referring to fig. 1 and 2, the wall of the placement groove 114 is provided with a vent hole 115, the vent hole 115 communicates with the inside of the placement groove 114, and the vent hole 115 is located on the side of the light source substrate 131 away from the optical film 120. The groove wall of the placement groove 114 includes a groove bottom and a groove side wall, and the vent holes 115 are opened on the groove side wall of the placement groove 114.
It should be noted that the vent hole 115 may be opened on the groove side wall of the placing groove 114, but is not limited thereto, and may be opened on the groove bottom of the placing groove 114 as the case may be. The ventilation holes 115 may be provided as a plurality of closely spaced small holes to reduce dust from entering the placement tank 114.
The wall of the placement tank 114 is provided with a vent hole 115, and the vent hole 115 communicates the inside and outside of the placement tank 114. The heat of the light source substrate 131 and the heat dissipation support 140 is conducted to the air, and the inside and outside of the placement groove 114 are circulated to accelerate the exchange of cold and hot air, so that the light source substrate 131 can be quickly dissipated.
Referring to fig. 1 to 2, the backlight module further includes a reflective sheet 150, the reflective sheet 150 is disposed on a side of the light source substrate 131 close to the optical film 120, the reflective sheet 150 covers the light source substrate 131 and the side plate 112, and at least a light emitting surface of the light source 132 is located on a side of the reflective sheet 150 close to the optical film 120.
The light can be reflected by the reflection sheet 150, and the light utilization rate is improved. In addition, the reflective sheet 150 can prevent dust, and prevent the dust from blocking the light source 132.
In some embodiments, the backlight module further includes a heat dissipation device disposed on the back plate 110 or the light source plate 130. For example, the heat dissipation device includes a heat dissipation fan 116, and the heat dissipation fan 116 is disposed on the outer side of the back plate 110 and opposite to the ventilation holes 115. The vent holes 115 are opened on the tank side wall of the placement tank 114, and the heat radiation fan 116 is correspondingly disposed outside the tank side wall of the placement tank 114.
When the vent holes 115 are opened in the bottom of the placement tank 114, the heat dissipation fan 116 may be disposed outside the bottom of the placement tank 114. The heat sink may include a heat dissipation fan 116, but is not limited thereto, and the heat sink may further include a semiconductor heat sink, a water cooling device, and the like, as the case may be. The heat sink may be a semiconductor heat sink or a water cooling device, and may be connected to the light source board 130.
The heat dissipation fan 116 is disposed outside the back plate 110 and opposite to the ventilation holes 115, so that hot air in the placement groove 114 can be discharged outwards through the heat dissipation fan 116, thereby accelerating exchange of hot air and cold air inside and outside the placement groove 114, and enabling the light source substrate 131 to dissipate heat rapidly. In addition, the middle area of the bottom plate 111 protrudes away from the optical film 120 to form a placement groove 114, and the heat dissipation fan 116 is disposed outside the groove sidewall of the placement groove 114, so that the thickness and width of the backlight module are not increased, and the layout of the backlight module is more compact.
Fig. 3 is a schematic structural diagram of a heat dissipation support portion in an embodiment of the present application, fig. 4 is a schematic top view of the heat dissipation support portion in fig. 3, and as shown in fig. 1 to 4, the backlight module further includes a sealing plate 170, the sealing plate 170 is disposed in the placement groove 114, the sealing plate 170 is located on a side of the light source substrate 131 away from the optical film 120, and the sealing plate 170, the light source substrate 131 and a groove bottom of the placement groove 114 are both disposed at an interval. The heat dissipation support 140 penetrates the sealing plate 170, and the ventilation hole 115 is located on a side of the sealing plate 170 away from the light source substrate 131.
The sealing plate 170 has a size corresponding to the size of the placement groove 114, and the sealing plate 170 separates the ventilation hole 115 and the light source substrate 131. The heat dissipation support 140 may penetrate the sealing plate 170, but is not limited thereto, and the heat dissipation support 140 may be disposed at both sides of the sealing plate 170. When the heat dissipation support 140 is disposed on both sides of the sealing plate 170, the sealing plate 170 may be made of a heat conductive material in order to prevent the sealing plate 170 from blocking heat conduction.
When dust enters the placement groove 114 through the ventilation hole 115, the sealing plate 170 separates the ventilation hole 115 from the light source substrate 131, thereby preventing the dust from contaminating the light source substrate 131 and blocking light, which affects optical quality. The sealing plate 170, the light source substrate 131 and the bottom of the placement groove 114 are spaced apart from each other, so that the heat dissipation support parts 140 at both ends of the sealing plate 170 can be in air contact with each other, the light source substrate 131 can also be in air contact with each other, and the light source substrate 131 and the heat dissipation support parts 140 can be configured to dissipate heat by heat exchange with air. In addition, the sealing plate 170 can connect the plurality of heat dissipation support parts 140 into a whole, and when the heat dissipation support parts 140 are heightened by the heat conduction gasket 160, the height uniformity of different heat dissipation support parts 140 is easily ensured, and the optical quality is prevented from being influenced by the inclination of the light source substrate 131.
Referring to fig. 1 to 4, the second supporting surface of the heat dissipation supporting part 140 is adhered to the light source substrate 131, and the first supporting surface of the heat dissipation supporting part 140 is adhered to the bottom of the groove 114, thereby mounting the light source substrate 131 to the back plate 110.
The heat-conducting glue can be used for bonding the heat-dissipating support portion 140, and fills the gap between the two support surfaces of the heat-dissipating support portion 140 and the corresponding structure while connecting and fixing the light source board 130, thereby improving the heat-conducting performance of the heat-dissipating support portion 140.
When the second supporting surface of the heat dissipation supporting portion 140 is adhered to the light source substrate 131 and the first supporting surface of the heat dissipation supporting portion 140 is adhered to the bottom of the placing groove 114, the bottom of the placing groove 114 is movably connected to the groove sidewall of the placing groove 114, so that the distance between the light source 132 and the optical film 120 satisfies the predetermined optical distance.
It should be noted that the bottom of the placement groove 114 is movably connected to the groove sidewall of the placement groove 114, that is, the bottom of the placement groove 114 can slide in the groove sidewall of the placement groove 114, and is far away from or close to the optical film 120, so that the distance between the light source 132 and the optical film 120 satisfies the preset optical distance, and after the distance is adjusted, the bottom of the placement groove 114 and the groove sidewall of the placement groove 114 are fixed by a screw structure.
The groove bottom of the placing groove 114 is movably connected with the groove side wall of the placing groove 114, when the distance between the light source 132 and the optical film 120 is adjusted, the limitation of the depth of the placing groove 114 is avoided, meanwhile, the groove bottom of the placing groove 114, the heat dissipation supporting part 140 and the light source substrate 131 can be bonded together, the heat dissipation supporting part 140 is prevented from being replaced or heightened, the heights of different heat dissipation supporting parts 140 are not uniform, and the light source substrate 131 is inclined to influence the optical quality.
In some embodiments, the light source substrate 131 and the groove bottom of the placement groove 114 may also be connected by a screw structure. For example, the screw structure includes a screw 133 and a screw hole provided on the light source substrate 131, the screw hole is located at an edge position of the light source substrate 131, the screw 133 is screwed into the screw hole on the light source substrate 131 through a groove bottom of the placement groove 114, and the light source substrate 131 and the back plate 110 are connected.
The threaded hole on the light source substrate 131 is covered by the reflective sheet 150, so that the light absorption of the screw 133 extending out of the threaded hole is avoided, and the optical quality is not affected.
The light source substrate 131 and the back plate 110 are connected through a threaded structure, so that the light source substrate 131 can be conveniently disassembled and assembled to replace the heat dissipation support part 140 or heighten the heat dissipation support part 140, and the distance between the light source plate 130 and the optical membrane 120 is adjusted to enable the distance between the light source 132 and the optical membrane 120 to meet the preset optical distance.
Referring to fig. 1 to 4, when the light source substrate 131 and the back plate 110 are connected by a screw structure, the backlight assembly further includes a thermal pad 160. The thermal pad 160 is disposed between the second supporting surface and the light source substrate 131, but the disclosure is not limited thereto, and the thermal pad 160 may also be disposed between the first supporting surface of the heat dissipation supporting portion 140 and the back plate 110 as the case may be.
It should be noted that the heat conductive pad 160 is made of a heat conductive material, and the material of the heat conductive pad 160 and the heat dissipation support portion 140 can be made of the same material, so as to reduce the production cost, but is not limited thereto. In addition, a heat-conducting glue or a heat-conducting silicone grease can be applied between the heat-conducting pad 160 and the heat-dissipating support portion 140 to fill the gap, so as to enhance the heat-conducting performance of the heat-dissipating support portion 140.
The height of the heat dissipation support 140 can be adjusted by the heat conductive pad 160, so that the distance between the light source 132 and the optical film 120 satisfies the predetermined optical distance. The preset optical distance can be adjusted by combining the heat-conducting gasket 160 and the heat-dissipating support portion 140, and the heat-dissipating support portion 140 does not need to correspond to the light source plate 130 one by one, so that the specification and variety of the heat-dissipating support portion 140 can be reduced, and the production cost can be reduced.
In some embodiments, the heat dissipation support 140 includes a thermally conductive resin structure or a thermally conductive metal structure; the back plate 110 is a heat-conducting metal structure, and the back plate 110 is an integrated structure.
The heat dissipation support portion 140 is made of heat conductive resin, which has light weight and good heat conductivity, and can conduct heat of the light source substrate 131 to the back plate 110 to accelerate heat dissipation of the light source substrate 131. The back plate 110 is of an integrated structure and can be formed by adopting a stamping process, so that the production cost is low; the back plate 110 is made of a heat conductive metal, which has a fast heat exchange with air, and the heat transferred from the heat dissipation support 140 can be dissipated into air quickly, so that the light source substrate 131 can dissipate heat quickly.
Example two
Fig. 5 is a schematic structural diagram of a display device according to a second embodiment of the present application, and referring to fig. 5, the display device includes: backlight unit 100 and display panel 200, display panel 200 sets up the light-emitting side at backlight unit 100. The backlight module 100 includes the backlight module 100 disclosed in the first embodiment, and the display panel 200 includes a liquid crystal display panel (i.e., LCD). The lcd panel includes a counter substrate, an array substrate, and a liquid crystal layer sandwiched between the counter substrate and the array substrate, and the backlight module 100 may be disposed at a side close to the array substrate.
It should be noted that the display device includes other necessary components and components besides the display panel 200 and the backlight module 100, taking a display as an example, the display device may further include a housing, a main circuit board, a power line, and the like, and those skilled in the art may perform corresponding supplementation according to the specific use requirements of the display device, and details are not repeated herein.
The terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly and include, for example, fixed connections, removable connections, or integral connections; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.
In the description herein, references to the description of the terms "some embodiments," "exemplary," etc. mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or exemplary is included in at least one embodiment or exemplary of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present application have been shown and described, it is understood that the above embodiments are illustrative and should not be construed as limiting the present application and that various changes, modifications, substitutions and alterations can be made therein by those skilled in the art within the scope of the present application, and therefore all changes and modifications that come within the meaning of the claims and the description of the invention are to be embraced therein.
Claims (10)
1. The utility model provides a backlight unit, includes backplate, optics diaphragm and light source board, the light source board with the optics diaphragm all install in the backplate, just the optics diaphragm is located the light-emitting side of light source board, its characterized in that, backlight unit still includes:
the heat dissipation support part is located on one side, far away from the optical diaphragm, of the light source plate, the heat dissipation support part is of a long strip structure, the length of the heat dissipation support part is larger than the height of the heat dissipation support part, the heat dissipation support part is provided with a first support surface and a second support surface, the first support surface is a support surface in the height direction of the heat dissipation support part, the first support surface is in contact with a local area of the back plate, the second support surface is in contact with a local area of the light source plate and used for supporting the light source plate and enabling the distance between the light source plate and the optical diaphragm to meet a preset optical distance, the heat dissipation support part is a heat conduction material structural part, the thickness or the position in the light emitting direction of the heat dissipation support part can be adjusted, and the optical distance between the light source plate and the optical diaphragm can be adjusted;
the back plate comprises a bottom plate, the bottom plate is provided with a middle area and an edge area arranged around the middle area, the middle area is provided with a placing groove with a notch facing the optical film, the light source plate and the heat dissipation supporting part are positioned in the placing groove, and the edge of the optical film is lapped on the edge area;
the optical film is bonded with the edge area and is subjected to tension towards the periphery.
2. The backlight module according to claim 1, wherein the first supporting surface and the second supporting surface are two supporting surfaces opposite to each other in a thickness direction of the heat dissipation supporting portion, and the first supporting surface is in contact with a groove bottom of the placing groove.
3. The backlight module as claimed in claim 2, wherein the heat dissipation support part is provided in plurality and arranged at intervals in a width direction thereof.
4. The backlight module according to claim 2, wherein a wall of the placement groove is provided with a vent hole, the vent hole communicates with an inside of the placement groove, and the vent hole is located on a side of the light source board away from the optical film.
5. The backlight module according to claim 4, further comprising a sealing plate disposed in the placement groove, wherein the sealing plate is disposed on a side of the light source plate away from the optical film, and the sealing plate is spaced apart from the light source plate and the bottom of the placement groove;
the heat dissipation supporting part penetrates through the sealing plate, and the ventilation hole is located on one side, far away from the light source plate, of the sealing plate.
6. The backlight module according to claim 4, further comprising a heat sink disposed on the back plate or the light source plate;
the heat dissipation device comprises a heat dissipation fan, and the heat dissipation fan is arranged on the outer side of the back plate and opposite to the vent hole.
7. The backlight module according to claim 1, wherein the light source board comprises a light source substrate and a plurality of light sources spaced apart from the light source substrate, the light sources are disposed on a side of the light source substrate close to the optical film, and a distance between the light sources and the optical film is the predetermined optical distance;
the second supporting surface is bonded with the light source substrate, and the first supporting surface is bonded with the back plate; or
The light source substrate and the back plate are connected through a threaded structure.
8. The backlight module according to claim 7, wherein when the light source substrate and the back plate are connected by the screw structure, the backlight module further comprises a thermal pad;
wherein the thermal pad is disposed between the second support surface and the light source substrate; and/or
The heat conducting gasket is arranged between the first supporting surface and the back plate.
9. The backlight module according to any one of claims 1 to 8, wherein the heat-dissipating support comprises a heat-conducting resin structure or a heat-conducting metal structure; and/or
The back plate is of a heat-conducting metal structure, and the back plate is of an integrated structure.
10. A display device, comprising:
a backlight module according to any one of claims 1 to 9;
and the display panel is arranged on the light emergent side of the backlight module.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210195912.3A CN114265243B (en) | 2022-03-02 | 2022-03-02 | Backlight module and display device |
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| CN202210195912.3A CN114265243B (en) | 2022-03-02 | 2022-03-02 | Backlight module and display device |
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| CN114265243A CN114265243A (en) | 2022-04-01 |
| CN114265243B true CN114265243B (en) | 2022-07-12 |
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| CN115209705B (en) * | 2022-07-28 | 2023-06-16 | 惠科股份有限公司 | Backlight module and display device |
| CN114967240B (en) * | 2022-08-02 | 2022-12-23 | 惠科股份有限公司 | Backlight module and display device |
| CN115113439B (en) * | 2022-08-23 | 2022-12-23 | 惠科股份有限公司 | Backlight module and display device |
| CN116609975B (en) * | 2023-07-19 | 2023-10-20 | 惠科股份有限公司 | Display module and display device |
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| CN114265243A (en) | 2022-04-01 |
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