CN114260145B - Efficient glue dispensing device and method for power management chip - Google Patents
Efficient glue dispensing device and method for power management chip Download PDFInfo
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- CN114260145B CN114260145B CN202210011282.XA CN202210011282A CN114260145B CN 114260145 B CN114260145 B CN 114260145B CN 202210011282 A CN202210011282 A CN 202210011282A CN 114260145 B CN114260145 B CN 114260145B
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- conveying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The invention relates to a high-efficiency glue dispensing device and a glue dispensing method for a power management chip, belongs to the technical field of glue dispensing processing, and provides the high-efficiency glue dispensing device and the glue dispensing method for the power management chip. Have transport mechanism through the top mid-mounting at the base, and transport mechanism installs the strip conveyer in the base both sides for the symmetry, and drive conveyer belt and second motor through first electric putter and remove at the middle part of base, it is convenient for carry out the transmission to the chip of the width of difference to change the transmission width between two transport mechanism, be convenient for improve device's conveying efficiency, and carry out marginal protection through the positioning mechanism on the transport mechanism, avoid the chip skew to appear in the in-process of conveying, guarantee the stable transmission of chip, be convenient for carry out accurate efficient point and glue work.
Description
Technical Field
The invention relates to an efficient glue dispensing device and method for a power management chip, and belongs to the technical field of glue dispensing processing.
Background
Chip on the PCB board need adhesive deposite device to carry out the point to chip position on the PCB board and glue fixedly before carrying out weldment work, guarantees that chip on the PCB board is adding man-hour by the welding, and the position is more accurate, firm, and makes the adaptation degree of chip and PCB plate body better.
The existing glue dispensing device for chips on the PCB still has many defects when in use, the chips are easy to shake in the process of conveying on the conveying belt, the chips are required to be repositioned after the conveying is finished, and then the glue can be dispensed, so that the glue dispensing efficiency is low.
Although the chinese utility model patent with publication number CN213727485U can realize dispensing on the conveyer belt, in the dispensing process, the conveyer belt needs to stop running, and the workpiece can be continuously conveyed after dispensing is finished, and the conveyer belt still keeps working in the process that dispensing cannot be realized, which seriously affects the processing efficiency.
Therefore, we improve this and propose a high-efficient glue dispensing device and glue dispensing method for power management chip.
Disclosure of Invention
In order to achieve the purpose, the invention provides a high-efficiency glue dispensing device for a power management chip, which comprises a base, wherein a guide frame is arranged above the base, a glue dispensing mechanism is arranged in the middle of the guide frame, the glue dispensing mechanism is arranged in the guide frame through a first support frame, the bottom of the first support frame is connected with a glue outlet mechanism, a conveying mechanism which is symmetrically arranged is arranged above the base, and a positioning mechanism is connected onto the conveying mechanism.
The dispensing mechanism comprises a glue storage cylinder, a glue outlet head is mounted at the bottom of the glue storage cylinder, a glue inlet pipe is connected to the upper end of the glue storage cylinder, a heating spiral is arranged inside the glue storage cylinder, and a first motor is connected to a gear above the heating spiral.
Wherein, transport mechanism includes the conveyer belt, the axis of rotation is installed at the both ends of conveyer belt, and first gear is installed to one side of axis of rotation, the second gear is installed to the below of first gear, the second motor is installed to one side of second gear, the second support frame is installed in the outside of axis of rotation and second motor, the first electric putter of middle part fixedly connected with of second support frame, first electric putter's the other end is fixed on the base.
The positioning mechanism comprises a connecting frame, the connecting frame is sleeved on one side of the rotating shaft, the upper end of the connecting frame is connected with two second electric push rods, the positioning plate is located between the two second electric push rods, and the end portions of the two second electric push rods are connected with the positioning plate.
One side of link still is connected with the backing plate, the backing plate is installed at the upper surface of base and is filled up the bottom of putting the conveyer belt for the U font, just the bottom both sides of conveyer belt are rotated and are connected with the roller bearing, the length value of backing plate is unanimous with the length value of conveyer belt.
The glue outlet mechanism comprises a supporting barrel, a third supporting frame is fixedly mounted on the outer side of the supporting barrel and connected to the first supporting frame through the third supporting frame, a spring is mounted inside the supporting barrel, the bottom end of the spring is connected with a telescopic rod, one side of the telescopic rod is connected with a glue guiding needle, an end cap is mounted at the upper end of the glue guiding needle, the end cap is mounted inside the glue outlet head, and the upper end of the spring is connected with a third electric push rod.
The conveying belt is a narrow-strip-shaped conveying belt with an L-shaped section, and the conveying belt and the positioning plate are installed in a embedded mode.
Wherein, the locating plate is installed in one side of conveyer belt for the U font, just the inside lower surface of locating plate is parallel and level with the upper surface of conveyer belt, just the length value of locating plate is unanimous with the length value of conveyer belt.
The efficient glue dispensing method for the power management chip adopts the efficient glue dispensing device for the power management chip, and comprises the following steps of:
the method comprises the following steps that S1, firstly, a device is started, a first electric push rod drives a second support frame, a second motor, a conveyor belt and a positioning mechanism to move on a base, the distance between a conveying mechanism and the positioning mechanism on two sides of the base is adjusted, the conveying width between the conveying mechanisms is approximately consistent with the width of a chip, the chip is placed on the conveying mechanism and is transmitted through the conveying mechanism, meanwhile, the edges of two sides of the chip are limited by a positioning plate on the conveying mechanism, the chip is guaranteed to move linearly in the transmission process on the conveying mechanism, when the chip moves to the center position of the device, the second electric push rod at the bottom of the positioning plate drives the positioning plate and the chip in the middle of the positioning plate to move upwards, the chip is separated from the conveyor belt to be suspended and fixed, at the moment, a guide frame controls a dispensing mechanism to move to the position above the chip, and dispensing is prepared;
s2, the guide frame drives the glue dispensing mechanism to move in a numerical control three-axis mode, the glue dispensing mechanism is moved to a position right above a target chip, the glue outlet head is aligned to a chip glue dispensing track and slowly approaches to the chip, in the process, the chip firstly contacts a telescopic rod on one side of the glue dispensing mechanism, and drives a plug and a glue guiding needle to move upwards in the process that the telescopic rod extrudes upwards, so that the plug is separated from the glue outlet head, the glue outlet head sprays glue, the glue is covered on the surface of the chip under the guidance of the glue guiding needle, and glue dispensing is completed;
and S3, finally, the second electric push rod drives the positioning plate and the chip to fall down, so that the chip is in contact with the conveyor belt, the conveyor belt continuously transmits the chip, and the operations are repeated to finish dispensing.
The invention provides a high-efficiency glue dispensing device and a glue dispensing method for a power management chip, which have the beneficial effects that:
1. have transport mechanism through the top mid-mounting at the base, and transport mechanism installs the strip conveyer in the base both sides for the symmetry, and drive conveyer belt and second motor through first electric putter and remove at the middle part of base, it is convenient for carry out the transmission to the chip of the width of difference to change the transmission width between two transport mechanism, be convenient for improve device's conveying efficiency, also improve transport device's adaptability, and carry out marginal protection through the positioning mechanism on the transport mechanism, avoid the chip skew to appear at the in-process of conveying, guarantee the stable transmission of chip, be convenient for carry out accurate efficient point and glue work.
2. The positioning mechanism is connected and installed on the conveying mechanism, the chip cannot shake in the conveying process, the positioning precision is improved, the base plate and the rolling shaft in the positioning mechanism are padded at the bottom of the conveying belt and are convenient to support the conveying belt, the rolling shaft installed at the bottom of the base plate is convenient to increase the sliding motion of the conveying mechanism in the left-right moving process, the conveying belt is prevented from deforming in the moving process, the linear advancing state of the conveying belt is guaranteed, and the chip is guaranteed to be stably conveyed, the positioning plate is U-shaped, the inner bottom surface of the positioning plate is horizontally consistent with the upper surface of the conveying belt, the chip is convenient to convey, a second electric push rod is connected between the positioning plate and the connecting frame, when the second electric push rod drives the positioning plate to move upwards, the positioning plate can be clamped to move upwards, the chip is separated from the conveying belt to be fixed, the chip is convenient to carry out stable glue dispensing processing, the chip can be carried out in the conveying process, the chip is not required to convey the chip to a specific position and then glue dispensing, namely, the glue dispensing device and the conveying device are arranged in a three-dimensional space, the area of a workbench is reduced, and the occupied area is saved; in addition, in the dispensing process, the chip is separated from the conveyor belt, dispensing can be achieved without stopping the conveyor belt, the conveyor belt can still convey other workpieces in the dispensing process, conveying efficiency is not delayed, and processing efficiency can be greatly improved.
3. Install out gluey mechanism through the one side of mechanism of gluing in some, go out the end cap in gluey mechanism and install the inside of gluing the head in a play, carry out on-off control to the play jiao kou of gluing the head, and the bottom of end cap installs the rubber guide needle of taper, and be connected with the telescopic link, the bottom of telescopic link is provided with the muffjoint and is drawn gluey needle upper end, can adjust earlier out gluey mechanism and glue the distance between mechanism and the drive belt with gluing, thereby the control point volume of gluing, the telescopic link at first touches the chip, and the in-process that shifts up presses down to the end cap and makes the end cap shift up and release the rubber guide head, store up a packing element and go out gluey head and glue this moment, and scribble the glue solution on the chip surface through drawing the rubber guide needle in the orbit of gluing mechanism and leading the guide frame removal, guarantee device's processingquality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an efficient dispensing device and a dispensing method for a power management chip according to the present application;
fig. 2 is a schematic diagram of a dispensing mechanism of an efficient dispensing device and dispensing method for a power management chip according to the present application;
fig. 3 is a cross-sectional view of a dispensing mechanism of an efficient dispensing device and dispensing method for a power management chip according to the present application;
fig. 4 is a schematic diagram of a glue dispensing mechanism of the high-efficiency glue dispensing device and the glue dispensing method for a power management chip according to the present application;
FIG. 5 is a schematic diagram of a transfer mechanism of an efficient dispensing apparatus and a dispensing method for a power management chip according to the present disclosure;
fig. 6 is a bottom view of a transfer mechanism of an efficient dispensing device and dispensing method for a power management chip according to the present disclosure;
fig. 7 is an exploded view of a transfer mechanism of an efficient dispensing apparatus and dispensing method for power management chips according to the present application;
fig. 8 is a schematic view of a positioning mechanism of an efficient dispensing device and a dispensing method for a power management chip according to the present application.
1. A base; 2. a guide frame; 3. a glue dispensing mechanism; 31. a glue storage cylinder; 32. discharging the rubber head; 33. heating the spiral; 34. a first motor; 35. feeding a rubber tube; 36. a first support frame; 4. a transport mechanism; 41. a conveyor belt; 42. a rotating shaft; 43. a first gear; 44. a second gear; 45. a second motor; 46. a second support frame; 47. a first electric push rod; 5. a positioning mechanism; 51. a connecting frame; 52. a base plate; 53. a roller; 54. a second electric push rod; 55. positioning a plate; 6. a glue discharging mechanism; 61. a support cylinder; 62. a spring; 63. a telescopic rod; 64. a plug; 65. a glue introducing needle; 66. a third electric push rod; 67. and a third support frame.
Detailed Description
The following detailed description of the embodiments of the present invention is made with reference to the drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
As shown in fig. 1, fig. 2, fig. 5, fig. 7, and fig. 8, the present embodiment provides a high-efficiency glue dispensing device for power management chips, which includes a base 1, a guide frame 2 is installed above the base 1, a glue dispensing mechanism 3 is installed in the middle of the guide frame 2, the glue dispensing mechanism 3 is installed inside the guide frame 2 through a first support frame 36, and a glue dispensing mechanism 6 is connected to the bottom of the first support frame 36, a conveying mechanism 4 symmetrically installed is arranged above the base 1, a positioning mechanism 5 is connected to the conveying mechanism 4, after the chips are conveyed and fixed through the conveying mechanism 4 and the positioning mechanism 5, the glue dispensing mechanism 3 is used for dispensing the chips, thereby facilitating the improvement of the quick positioning and conveying of the chips in the glue dispensing operation, performing effective glue dispensing, and increasing the working quality and the working efficiency of the device.
As shown in fig. 2, fig. 3, fig. 4 and fig. 6, the glue dispensing mechanism 3 includes a glue storage cylinder 31, a glue outlet head 32 is installed at the bottom of the glue storage cylinder 31, a glue inlet pipe 35 is connected to the upper end of the glue storage cylinder 31, a heating screw 33 is arranged inside the glue storage cylinder 31, a first motor 34 is connected to the upper gear of the heating screw 33, a heating pipe is arranged inside the heating screw 33 and continuously heats the heating pipe, the fluidity of glue liquid inside the glue storage cylinder 31 is ensured, the glue liquid is prevented from solidifying, and the quality of the glue liquid in the glue dispensing process is ensured.
The positioning mechanism 5 comprises a connecting frame 51, the connecting frame 51 is sleeved on one side of the rotating shaft 42, the upper end of the connecting frame 51 is connected with two second electric push rods 54, the positioning plate 55 is located between the two second electric push rods 54, and the end parts of the two second electric push rods 54 are connected with the positioning plate 55. Locating plate 55 is installed in the conveyer belt 41 side, and the edge to the driven chip on conveyer belt 41 carries on spacingly and supports, and the chip rectilinear movement of being convenient for avoids the chip to shift in the data send process and drops, guarantees the machining efficiency of device, and the in-process that second electric putter 54 drove locating plate 55 rebound carries out the rebound to the chip, drives chip and conveyer belt 41 and separates, makes the chip fixed, and the chip of being convenient for is fixed and is glued.
One side of link 51 still is connected with backing plate 52, backing plate 52 is installed at the upper surface of base 1 for the U font and fills up the bottom of putting conveyer belt 41, and the bottom both sides of conveyer belt 41 are rotated and are connected with roller 53, the length value of backing plate 52 is unanimous with the length value of conveyer belt 41, backing plate 52 pad is put in the bottom of conveyer belt 41, carry out the appearance to conveyer belt 41 and correct, be convenient for guarantee the level and the parallel of the conveyer belt 41 of both sides, make conveyer belt 41 carry out stable transmission, be convenient for conveyer belt 41 along with second support frame 46 carries out stable removal.
Go out gluey mechanism 6 and include the outside fixed mounting that a supporting cylinder 61 supported a section of thick bamboo 61 has third support frame 67, and connect on first support frame 36 through third support frame 67, the internally mounted of a supporting cylinder 61 has spring 62, spring 62's bottom is connected with telescopic link 63, one side of telescopic link 63 is connected with draws gluey needle 65, draw gluey upper end of needle 65 and install end cap 64, end cap 64 installs the inside at a gluey head 32, spring 62's upper end is connected with third electric putter 66, it is convenient for go out gluey mouthful position of play of gluey head 32 and control to go out the setting up of gluey mechanism 6, it just carries out the point glue to go out gluey head 32 when going out gluey head 32 apart from the chip to a certain position, and prescribe a limit to the distance between a gluey head 32 and the chip, it moves down and appears the extrusion collision with the chip to avoid a gluey head 32, cause the chip to damage.
The conveyor belt 41 is a narrow-strip-shaped conveyor belt with an L-shaped section, the conveyor belt 41 and the positioning plate 55 are installed in an embedded mode, the conveyor belt 41 and the positioning plate 55 are used in a splicing mode to stably convey and fix the chips, the chips are conveniently and quickly positioned on the device, and the chip processing efficiency is improved.
The locating plate 55 is installed in one side of conveyer belt 41 for the U font, and the inside lower surface of locating plate 55 and the upper surface parallel and level of conveyer belt 41, and the length value of locating plate 55 is unanimous with the length value of conveyer belt 41, and the opening part of locating plate 55 contains the chip edge to make the chip control at the intermediate position of the locating plate 55 of both sides, avoid the chip at the skew of removal in-process and drop, guarantee the stability of chip.
The invention also provides an efficient dispensing method for the power management chip, which comprises the following steps:
s1, firstly, starting the device, driving a second support frame 46, a second motor 45, a conveyor belt 41 and a positioning mechanism 5 to move on a base 1 through a first electric push rod 47, adjusting the distance between a conveying mechanism 4 and the positioning mechanism 5 on two sides of the base 1, enabling the conveying width between the conveying mechanisms 4 to be approximately consistent with the width of a chip, placing the chip on the conveying mechanism 4, transmitting through the conveying mechanism 4, simultaneously limiting two side edges of the chip through a positioning plate 55 on the conveying mechanism 4, ensuring that the chip keeps linear movement in the transmission process on the conveying mechanism 4, and when the chip moves to the central position of the device, driving the positioning plate 55 and the chip in the middle of the positioning plate 55 to move upwards through a second electric push rod 54 at the bottom of the positioning plate 55, enabling the chip to be separated from the conveyor belt 41 for suspension fixing, controlling a dispensing mechanism 3 to move to the position above the chip through a guide frame 2, and preparing for dispensing;
s2, the guide frame 2 drives the glue dispensing mechanism 3 to move in a numerical control three-axis mode, the glue dispensing mechanism 3 is moved to a position right above a target chip, the glue outlet head 32 is aligned with a chip glue dispensing track line and slowly approaches to the chip, in the process, the chip firstly contacts a telescopic rod 63 on one side of the glue dispensing mechanism 3, and drives a plug 64 and a glue guiding needle 65 to move upwards in the process of upwards extruding the telescopic rod 63, so that the plug 64 is separated from the glue outlet head 32, the glue outlet head 32 sprays glue, the glue is covered on the surface of the chip under the guide of the glue guiding needle 65, and glue dispensing is completed;
and S3, finally, the second electric push rod 54 drives the positioning plate 55 and the chip to fall down, so that the chip is contacted with the conveyor belt 41, the conveyor belt 41 continuously transmits the chip, and the operations are repeated to finish dispensing.
The above embodiments are only for illustrating the present invention and are not to be construed as limiting the present invention. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that various combinations, modifications or equivalents may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention, and the technical solution of the present invention is covered by the claims of the present invention.
Claims (1)
1. A high-efficiency glue dispensing method for a power management chip is based on a high-efficiency glue dispensing device, the high-efficiency glue dispensing device comprises a base (1), a guide frame (2) is mounted above the base (1), a glue dispensing mechanism (3) is mounted in the middle of the guide frame (2), the glue dispensing mechanism (3) is mounted inside the guide frame (2) through a first support frame (36), the bottom of the first support frame (36) is connected with a glue outlet mechanism (6), a conveying mechanism (4) which is symmetrically mounted is arranged above the base (1), and a positioning mechanism (5) is connected onto the conveying mechanism (4);
the dispensing mechanism (3) comprises a glue storage cylinder (31), a glue outlet head (32) is mounted at the bottom of the glue storage cylinder (31), a glue inlet pipe (35) is connected to the upper end of the glue storage cylinder (31), a heating screw (33) is arranged inside the glue storage cylinder (31), and a first motor (34) is connected to a gear above the heating screw (33);
the conveying mechanism (4) comprises a conveying belt (41), rotating shafts (42) are installed at two ends of the conveying belt (41), a first gear (43) is installed on one side of each rotating shaft (42), a second gear (44) is installed below each first gear (43), a second motor (45) is installed on one side of each second gear (44), second supporting frames (46) are installed on the outer sides of the rotating shafts (42) and the outer sides of the second motors (45), a first electric push rod (47) is fixedly connected to the middle of each second supporting frame (46), and the other end of each first electric push rod (47) is fixed on the base (1);
the positioning mechanism (5) comprises a connecting frame (51), the connecting frame (51) is sleeved on one side of the rotating shaft (42), the upper end of the connecting frame (51) is connected with two second electric push rods (54), the positioning plate (55) is positioned between the two second electric push rods (54), and the end parts of the two second electric push rods (54) are connected with the positioning plate (55);
one side of the connecting frame (51) is also connected with a backing plate (52), the backing plate (52) is installed on the upper surface of the base (1) in a U shape and used for cushioning the bottom of the conveyor belt (41), two sides of the bottom of the conveyor belt (41) are rotatably connected with rolling shafts (53), and the length value of the backing plate (52) is consistent with that of the conveyor belt (41);
the glue discharging mechanism (6) comprises a supporting cylinder (61), a third supporting frame (67) is fixedly mounted on the outer side of the supporting cylinder (61) and connected to the first supporting frame (36) through the third supporting frame (67), a spring (62) is mounted inside the supporting cylinder (61), a telescopic rod (63) is connected to the bottom end of the spring (62), a glue guiding needle (65) is connected to one side of the telescopic rod (63), a plug (64) is mounted at the upper end of the glue guiding needle (65), the plug (64) is mounted inside the glue discharging head (32), and a third electric push rod (66) is connected to the upper end of the spring (62);
the conveyor belt (41) is a narrow-strip-shaped conveyor belt with an L-shaped section, and the conveyor belt (41) and the positioning plate (55) are installed in a jogged mode;
the positioning plate (55) is arranged on one side of the conveyor belt (41) in a U shape, the lower surface of the inside of the positioning plate (55) is flush with the upper surface of the conveyor belt (41), and the length value of the positioning plate (55) is consistent with that of the conveyor belt (41);
the method is characterized in that: the method comprises the following steps:
s1, firstly, starting the device, driving a second support frame (46), a second motor (45), a conveyor belt (41) and a positioning mechanism (5) to move on a base (1) through a first electric push rod (47), adjusting the distance between a conveying mechanism (4) and the positioning mechanism (5) on two sides of the base (1), enabling the conveying width between the conveying mechanisms (4) to be approximately consistent with the width of a chip, placing the chip on the conveying mechanism (4), transmitting through the conveying mechanism (4), limiting two side edges of the chip by a positioning plate (55) on the conveying mechanism (4), ensuring that the chip keeps linear movement in the transmission process on the conveying mechanism (4), and when the chip moves to the central position of the device, driving the positioning plate (55) and the chip in the middle of the positioning plate (55) to move upwards by a second electric push rod (54) at the bottom of the positioning plate (55), enabling the chip to be separated from the conveyor belt (41) to be suspended and fixed, and preparing for dispensing when the chip moves to the center position above the dispensing mechanism (3) under the control of a guide frame (2);
s2, the guide frame (2) drives the glue dispensing mechanism (3) to move in a numerical control three-axis mode, the glue dispensing mechanism (3) is moved to the position right above a target chip, the glue outlet head (32) is aligned to a chip glue dispensing track line and slowly approaches to the chip, in the process, the chip firstly contacts a telescopic rod (63) on one side of the glue dispensing mechanism (3), and drives a plug (64) and a glue guiding needle (65) to move upwards in the process that the telescopic rod (63) extrudes upwards, so that the plug (64) is separated from the glue outlet head (32), the glue outlet head (32) sprays glue, the glue is covered on the surface of the chip under the guide of the glue guiding needle (65), and glue dispensing is completed;
and S3, finally, the second electric push rod (54) drives the positioning plate (55) and the chip to fall down, so that the chip is in contact with the conveyor belt (41), the conveyor belt (41) continuously transmits the chip, and the operations are repeated to finish dispensing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210011282.XA CN114260145B (en) | 2021-11-16 | 2021-11-16 | Efficient glue dispensing device and method for power management chip |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210011282.XA CN114260145B (en) | 2021-11-16 | 2021-11-16 | Efficient glue dispensing device and method for power management chip |
| CN202111355770.4A CN113798132B (en) | 2021-11-16 | 2021-11-16 | Efficient glue dispensing method for power management chip |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111355770.4A Division CN113798132B (en) | 2021-11-16 | 2021-11-16 | Efficient glue dispensing method for power management chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114260145A CN114260145A (en) | 2022-04-01 |
| CN114260145B true CN114260145B (en) | 2023-03-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210011282.XA Active CN114260145B (en) | 2021-11-16 | 2021-11-16 | Efficient glue dispensing device and method for power management chip |
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| CN114505204B (en) * | 2022-02-22 | 2023-12-19 | 广东中光科技实业有限公司 | Novel LED lamp processing is with glue dispensing device of adjustable node gluey length |
| CN114944355B (en) * | 2022-07-27 | 2022-10-11 | 成都汉芯国科集成技术有限公司 | High-efficient packaging hardware is used in integrated circuit chip design |
| CN117861952A (en) * | 2024-03-12 | 2024-04-12 | 苏州福斯特万电子科技有限公司 | Dispensing equipment of dispensing machine |
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| JP2002246799A (en) * | 2001-02-15 | 2002-08-30 | Matsushita Electric Ind Co Ltd | Method for transferring plate-like member and apparatus therefor, circuit-forming body holding apparatus, and adhesive-applying apparatus and component-mounting apparatus |
| JP3159020U (en) * | 2010-01-28 | 2010-05-06 | 全方位自動化股▲ふん▼有限公司 | Automatic dispenser mechanism |
| CN104148241A (en) * | 2014-08-26 | 2014-11-19 | 昆山迈致治具科技有限公司 | PCB dispensing device |
| CN108014961B (en) * | 2016-10-31 | 2020-01-24 | 富准精密模具(嘉善)有限公司 | Glue dispensing device |
| CN108940740B (en) * | 2018-08-29 | 2020-06-09 | 江苏铁锚玻璃股份有限公司 | Glass gluing device for automobile accessory processing |
| CN109092628A (en) * | 2018-09-18 | 2018-12-28 | 广东九联科技股份有限公司 | Automatic dispensing machine |
| CN209680463U (en) * | 2018-12-26 | 2019-11-26 | 深圳市轴心自控技术有限公司 | The PCB product clamping device of dispenser |
| CN209502149U (en) * | 2019-01-24 | 2019-10-18 | 江苏途瑞光电有限公司 | A kind of glue applying mechanism and bonder |
| CN110756391B (en) * | 2019-09-20 | 2021-03-30 | 深圳华海达科技有限公司 | Online double-track high-speed jet dispenser |
| CN110773382A (en) * | 2019-11-06 | 2020-02-11 | 台州隆达科技有限公司 | Automatic oil dripping device for surface of bearing |
| CN212018385U (en) * | 2020-04-21 | 2020-11-27 | 威海今凯电子科技有限公司 | Dispensing and curing device |
| CN213051313U (en) * | 2020-08-21 | 2021-04-27 | 浙江雅迪新能源科技有限公司 | High-efficient automatic point gum machine |
| CN112120354A (en) * | 2020-09-27 | 2020-12-25 | 徐浩源 | Rubber coating device for shoemaking without replacing rubber tube |
| CN112221876B (en) * | 2020-09-28 | 2022-06-21 | 苏州天准科技股份有限公司 | Conveying equipment and dispensing system |
| CN112427233A (en) * | 2020-11-06 | 2021-03-02 | 宁波灵凡智远电子设备有限公司 | Multi-specification automatic compatible continuous operation dispensing robot complete machine |
| CN214682620U (en) * | 2020-12-31 | 2021-11-12 | 上海艾靳智能科技有限公司 | Adhesive deposite device is used in electronic equipment processing |
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| CN113798132A (en) | 2021-12-17 |
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