CN209502149U - A kind of glue applying mechanism and bonder - Google Patents
A kind of glue applying mechanism and bonder Download PDFInfo
- Publication number
- CN209502149U CN209502149U CN201920126635.4U CN201920126635U CN209502149U CN 209502149 U CN209502149 U CN 209502149U CN 201920126635 U CN201920126635 U CN 201920126635U CN 209502149 U CN209502149 U CN 209502149U
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- glue
- interconnecting piece
- drop
- applying mechanism
- tube body
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Abstract
The utility model provides a kind of glue applying mechanism and bonder, belong to LED light production technical field, this glue applying mechanism, it includes point sebific duct and Glue dripping head, Glue dripping head includes interconnecting piece and the first drop glue portion being connected with interconnecting piece and the second drop glue portion, interconnecting piece is movably set in a sebific duct, first drop glue portion and the second drop glue portion can protrude under the driving of interconnecting piece or stretch out some sebific ducts, since the first drop glue portion of setting and the second drop glue portion can protrude under the driving of interconnecting piece or stretch out some sebific ducts, and point applies glue on rectangular chip, to improve the quality of product.This bonder comprising rack and above-mentioned glue applying mechanism, glue applying mechanism are set in rack.This bonder is due to being provided with above-mentioned glue applying mechanism, so that the wafer quality of this bonder production is further improved.
Description
Technical field
The utility model relates to LED light production technical fields, in particular to a kind of glue applying mechanism and bonder.
Background technique
Light emitting diode (Light Emitting Diode, LED) is a kind of to convert electrical energy into shining for luminous energy
Element.With the maturation of LED technology, LED product is gradually applied to the fields such as illumination, display.
LED bonder is a kind of equipment that can be fixed on LED wafer on LED support.Existing LED bonder is generally only
It designs the jig platform having one for fixing LED support and one is used to carry out die bond to the LED support on jig platform
The die bond mechanism of processing.After supply part is completed to feed, jig platform cooperates die bond mechanism to carry out the operation of LED wafer bonding,
After the completion of a LED support die bond, receiving part can just receive die bond completion LED support, and supply part just can will under
One LED support is transmitted to jig platform and carries out the operation of next round bonding.
Bonder is provided with glue applying mechanism, is applied to the chip for glue to be stained with, existing point glue equipment is only arranged
One drop glue portion, so that dripping on chip, glue surface product is small, and leading to product, there are quality hidden danger.
Utility model content
The purpose of this utility model includes providing a kind of glue applying mechanism and bonder, point glue equipment and bonder due to setting
Two drop glue portions become larger so that dripping glue surface product on chip, improve the quality of product.
A kind of glue applying mechanism comprising point sebific duct and Glue dripping head, Glue dripping head include interconnecting piece and be connected with interconnecting piece
First drop glue portion and the second drop glue portion, interconnecting piece is movably set in sebific duct, and the first drop glue portion and the second drop glue portion can be
Some sebific ducts are protruded into or stretched out under the driving of interconnecting piece.
Above-mentioned sebific duct includes spring, and spring is set to the inside of a sebific duct, and the both ends of spring are held in a sebific duct respectively
Inner wall and interconnecting piece.
Above-mentioned sebific duct includes dispensing tube body and the first branch pipe and the second branch pipe that are connected with dispensing tube body, connection
Portion is movably set in dispensing tube body, and spring is set in dispensing tube body and is held in interconnecting piece, the first drop glue portion
Perhaps the first branch pipe second of stretching drop glue portion can be protruded under the driving of interconnecting piece to be protruded into or stretch under the driving of interconnecting piece
Second branch pipe out.
Above-mentioned Glue dripping head includes First Transition section and the second changeover portion, and one end of First Transition section is connected to interconnecting piece, separately
One end forms the first drop glue portion, and one end of the second changeover portion is connected to interconnecting piece, and the other end forms the second drop glue portion, First Transition
Section can be under the driving of interconnecting piece in first in-pipe, so that the first drop glue portion extends into or out the first branch pipe, the second mistake
Crossing section can be under the driving of interconnecting piece in second in-pipe, so that the second drop glue portion extends into or out the second branch pipe.
Partition is provided on above-mentioned dispensing tube body, the first branch pipe and the second branch pipe are respectively separated and are set on partition, and
It is connected to dispensing tube body.
Above-mentioned sebific duct further includes third branch pipe, and third branch pipe is connected to dispensing tube body and is set to the first branch pipe and
Between two branch pipes, for cooperating the Glue dripping head in only one drop glue portion.
Above-mentioned first drop glue portion and the second drop glue portion are tapered.
Above-mentioned sebific duct includes dispensing tube body, Glue dripping head include interconnecting piece and the first drop glue portion being connected with interconnecting piece and
Second drop glue portion, interconnecting piece movably protrudes into or stretches out in dispensing tube body, thus drive simultaneously the first drop glue portion and
Do close and point of distance sebific duct ontology movement in the second drop glue portion.
Above-mentioned dispensing tube body inner wall is provided with the first limiting section, is provided on the outer wall of interconnecting piece and matches with the first limiting section
The second limiting section closed, for preventing interconnecting piece from rotating in dispensing tube body.
A kind of bonder comprising rack and above-mentioned glue applying mechanism, glue applying mechanism are set in rack.
The beneficial effect of the utility model embodiment includes:
This glue applying mechanism comprising point sebific duct and Glue dripping head, Glue dripping head include interconnecting piece and be connected with interconnecting piece the
One drop glue portion and the second drop glue portion, interconnecting piece is movably set in a sebific duct, and the first drop glue portion and the second drop glue portion can be
Some sebific ducts are protruded into or stretched out under the driving of interconnecting piece, since existing container portion becomes rectangle from traditional square,
So only one drips glue portion, causes the both ends of rectangular bimorph not have glue, cause product there are quality hidden danger, be arranged now
First drop glue portion and the second drop glue portion can protrude under the driving of interconnecting piece or stretch out some sebific ducts, and in rectangular chip phase
Pair both ends put and apply glue, to improve the quality of product.
This bonder comprising rack and above-mentioned glue applying mechanism, glue applying mechanism are set in rack.This bonder due to
Provided with above-mentioned glue applying mechanism, so that the wafer quality of this bonder production is further improved.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by
Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also
To obtain other relevant attached drawings according to these attached drawings.
Fig. 1 is the structural schematic diagram for the glue applying mechanism that the utility model first embodiment provides；
Fig. 2 is the structural schematic diagram for the glue applying mechanism that the utility model second embodiment provides.
Icon: 100- glue applying mechanism；10- point sebific duct；11- dispensing tube body；The first branch pipe of 12-；The second branch pipe of 13-；20-
Glue dripping head；21- interconnecting piece；22- First Transition section；The second changeover portion of 23-；24- spring；25- sealing cover；211- limited block；
212- holding block；221- first drips glue portion；231- second drips glue portion.
Specific embodiment
Conventional Glue dripping head only has a drop glue portion at present, is applied to the glue foot that square wafer die bond is out of question, is stained with every time
It is enough, but now with the lightening requirement of product, the rectangle that chip becomes is stained with glue using single drop glue portion, is caused rectangular
Shape crystal both ends will cause quality hidden danger all without glue in this way.
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Usually here in attached drawing description and
The component of the utility model embodiment shown can be arranged and be designed with a variety of different configurations.
Therefore, requirement is not intended to limit to the detailed description of the embodiments of the present invention provided in the accompanying drawings below
The scope of the utility model of protection, but it is merely representative of the selected embodiment of the utility model.Based in the utility model
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the range of the utility model protection.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
It is in the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, or
The utility model product using when the orientation or positional relationship usually put, be merely for convenience of description the utility model and letter
Change description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation construct and
Operation, therefore should not be understood as limiting the present invention.In addition, term " first ", " second ", " third " etc. are only used for area
Divide description, is not understood to indicate or imply relative importance.
In addition, the terms such as term "horizontal", "vertical" are not offered as requiring component abswolute level or pendency, but can be slightly
Low dip.It is not to indicate that the structure has been had to if "horizontal" only refers to that its direction is more horizontal with respect to for "vertical"
It is complete horizontal, but can be slightly tilted.
In the description of the present invention, it should also be noted that, unless otherwise clearly defined and limited, term " is set
Set ", " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection,
Or it is integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, intermediary can also be passed through
It is indirectly connected, can be the connection inside two elements.For the ordinary skill in the art, it can be managed with concrete condition
Solve the concrete meaning of above-mentioned term in the present invention.
First embodiment
Please refer to Fig. 1, this glue applying mechanism 100 includes point sebific duct 10 and Glue dripping head 20, Glue dripping head 20 include interconnecting piece 21 and
Being connected with interconnecting piece 21 and the first drop glue portion 221 and the second drop glue portion 231, interconnecting piece 21 is movably set to a sebific duct
In 10, the first drop glue portion 221 and the second drop glue portion 231 can protrude under the driving of interconnecting piece 21 or stretch out some sebific ducts 10.
Point sebific duct 10 can be different structures according to different 20 structure settings of Glue dripping head, in the present embodiment, above-mentioned
Point sebific duct 10 includes dispensing tube body 11 and the first branch pipe 12 and the second branch pipe 13 that are connected with dispensing tube body 11, interconnecting piece
21 are movably set in dispensing tube body 11, and the first drop glue portion 221 can protrude into or stretch out under the driving of interconnecting piece 21
First branch pipe 12, the second drop glue portion 231 can protrude under the driving of interconnecting piece 21 or stretch out the second branch pipe 13.In other implementations
In example, point sebific duct 10 further includes third branch pipe, and third branch pipe is connected to dispensing tube body 11 and is set to the first branch pipe 12 and the
Between two branch pipes 13, for cooperating the Glue dripping head 20 in only one drop glue portion, or for being equipped with, there are three drop glue portions
Glue dripping head 20.
Further, partition is provided on dispensing tube body 11, the first branch pipe 12 and the second branch pipe 13 are arranged in parallel respectively
In on partition, and it is connected to dispensing tube body 11, specifically, equipped with first through hole in being generally shaped like of dispensing tube body 11
Cylinder, one end inner wall of dispensing tube body 11 are provided with threaded hole, and threaded hole is threadedly coupled with sealing cover 25, the other end be every
Plate, partition are circular slab, and two through-holes are arranged at intervals on partition, and the outer end of two through-holes of partition has been respectively communicated with first
Pipe 12 and the second branch pipe 13, are arranged in parallel between the first branch pipe 12 and the second branch pipe 13, and extend along the direction far from partition.
Further, with sebific duct 10 cooperate Glue dripping head 20 include interconnecting piece 21 and be connected with interconnecting piece 21 first
Glue portion 221 and the second drop glue portion 231 are dripped, Glue dripping head 20 further includes First Transition section 22 and the second changeover portion 23, First Transition section
22 one end is connected to interconnecting piece 21, and the other end forms the first drop glue portion 221, and one end of the second changeover portion 23 is connected to interconnecting piece
21, the other end forms the second drop glue portion 231, and the first drop glue portion 221 and the second drop glue portion 231 are tapered, First Transition section 22
It can be moved in the first branch pipe 12 under the driving of interconnecting piece 21, so that the first drop glue portion 221 protrudes into or stretches the first branch pipe 12, the
Two changeover portions 23 can move in the second branch pipe 13 under the driving of interconnecting piece 21, so that the second drop glue portion 231 extends into or out
Second branch pipe 13.
Specifically, 11 both ends of dispensing tube body are connected separately with sealing cover 25 and interconnecting piece 21, and in dispensing tube body 11
Portion forms seal chamber, and spring 24 is set to the inside of dispensing tube body 11, and the both ends of spring 24 support sealing cover 25 respectively
Inner wall and interconnecting piece 21, the substantially trapezoidal convex block of the shape of interconnecting piece 21, convex block include integrally formed holding block 212 and limit
Position block 211, holding block 212 is along the direction protrusion far from limited block 211, and for being held in spring 24, the peripheral wall of limited block 211 is equal
It is held in 11 inner wall of dispensing tube body, limited block 211 is held in the inside of partition, limited block 211 far from the side of holding block 212
Side interval far from holding block 212 is connected with First Transition section 22 and the second changeover portion 23, First Transition section 22 and the second mistake
It crosses section 23 to extend along the direction far from limited block 211, and is arranged in parallel, First Transition section 22 and the second changeover portion 23 are elongated
Pipe, two elongated tubulars are respectively formed drop glue portion far from one end of limited block 211, drip the generally conical shape tip in glue portion.
Second embodiment
Referring to figure 2., the knot of the point glue equipment in the structure and first embodiment of the glue applying mechanism 100 in second embodiment
Structure is roughly the same, unlike, point sebific duct 10 include dispensing tube body 11, Glue dripping head 20 include interconnecting piece 21 and with interconnecting piece 21
Connected the first drop glue portion 221 and the second drop glue portion 231, interconnecting piece 21 movably protrudes into or stretches in dispensing tube body 11
Out, so that the first drop glue portion 221 and the second drop glue portion 231 be driven to do close and point of distance sebific duct ontology 11 movement simultaneously.
Further, 11 inner wall of dispensing tube body is provided with the first limiting section, is provided on the outer wall of interconnecting piece 21 and the
Second limiting section of one limiting section cooperation, for preventing interconnecting piece 21 from rotating in dispensing tube body 11.
Specifically, dispensing tube body 11 is not provided with partition far from one end of sealing cover 25, and dispensing tube body 11 is separate
The first limiting section is provided on the inner wall of one end of sealing cover 25, the first limiting section is groove and quantity is two, two grooves
The opposite two sides of 11 inner wall of dispensing tube body are axially set in along dispensing tube body 11, the limited block 211 of interconnecting piece 21
The opposite two sides of outer wall are provided with the raised line with groove cooperation, as the second limiting section, due to the cooperation of groove and raised line,
It moving so that interconnecting piece 21 under the driving of spring 24, can be done along dispensing tube body 11 is axial, but interconnecting piece 21 and dispensing
It cannot mutually be rotated between tube body 11, so that being fixedly connected on the First Transition section 22 and the second transition of interconnecting piece 21
In dispensing, position is constant always in two drop glue portions of section 23.
This glue applying mechanism 100 includes point sebific duct 10 and Glue dripping head 20, Glue dripping head 20 include interconnecting piece 21 and with interconnecting piece 21
Being connected and the first drop glue portion 221 and the second drop glue portion 231, interconnecting piece 21 is movably set in a sebific duct 10, and first
Drop glue portion 221 and the second drop glue portion 231 can protrude under the driving of interconnecting piece 21 or stretch out some sebific ducts 10, thus on chip
Point applies glue.
This bonder includes rack and above-mentioned glue applying mechanism 100, and glue applying mechanism 100 is set in rack.Bonder by
Pcb board is transmitted to the operating position on fixture by feed mechanism, and PCB is first needed to by glue applying mechanism 100 position of bonding wafer
Dispensing, then bonding arm moves to absorption wafer position from origin position, and chip is placed on the expander wafer disk of film support
On, rear suction nozzle moves downward bonding arm in place, moves upwards jack-up chip, bonding arm returns to origin position after picking up chip
(leakage brilliant detection position), bonding arm moves to bonding position from origin position again, and bonding arm is again after suction nozzle downbond chip
Origin position is returned, is thus a complete bonding process.After the completion of a beat is run, obtained by Machine Vision Detection
To the data of the next position of chip, and chip coil motor is conveyed data to, made after allowing motor to cover corresponding distance next
A chip is moved to the pickup wafer position of alignment.The dispensing bonding position of pcb board is also same process, until on pcb board
All dispensing positions have all been bonded chip, then pcb board are removed from workbench by transport mechanism, and load onto new pcb board and open
Begin new working cycles.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this
For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model
Within, any modification, equivalent replacement, improvement and so on should be included within the scope of protection of this utility model.
Claims (10)
1. a kind of glue applying mechanism, which is characterized in that including sebific duct and Glue dripping head, the Glue dripping head include interconnecting piece and with it is described
The the first drop glue portion and the second drop glue portion that interconnecting piece is connected, the interconnecting piece is movably set in the sebific duct, described
First drop glue portion and second drop glue portion can protrude under the driving of the interconnecting piece or stretch out described sebific duct.
2. glue applying mechanism according to claim 1, which is characterized in that described sebific duct includes spring, the spring setting
In the inside of described sebific duct, the both ends of the spring are held in described rubber tube inner wall and the interconnecting piece respectively.
3. glue applying mechanism according to claim 2, which is characterized in that described sebific duct include dispensing tube body and with it is described
The first branch pipe and the second branch pipe that dispensing tube body is connected, the interconnecting piece are movably set to the dispensing tube body
Interior, the spring is set in the dispensing tube body and is held in the interconnecting piece, and first drop glue portion can be in the company
First branch pipe is protruded into or stretched out under the driving of socket part, and second drop glue portion can protrude under the driving of the interconnecting piece
Or stretch out second branch pipe.
4. glue applying mechanism according to claim 3, which is characterized in that the Glue dripping head includes First Transition section and the second mistake
Section is crossed, one end of the First Transition section is connected to the interconnecting piece, and the other end forms first drop glue portion, second mistake
The one end for crossing section is connected to the interconnecting piece, and the other end forms second drop glue portion, and the First Transition section can be in the company
In first in-pipe under the driving of socket part, so that first drop glue portion extends into or out first branch pipe, institute
Stating the second changeover portion can be under the driving of the interconnecting piece in second in-pipe, so that second drop glue portion protrudes into
Or stretch out second branch pipe.
5. glue applying mechanism according to claim 3, which is characterized in that it is provided with partition on the dispensing tube body, it is described
First branch pipe and second branch pipe are respectively separated and are set on the partition, and are connected to the dispensing tube body.
6. glue applying mechanism according to claim 3, which is characterized in that described sebific duct further includes third branch pipe, and described
Three branch pipes are connected to dispensing tube body and are set between first branch pipe and second branch pipe, for cooperating only one
Drip the Glue dripping head in glue portion.
7. glue applying mechanism according to claim 1, which is characterized in that the first drop glue portion and second drop glue portion are equal
It is tapered.
8. glue applying mechanism according to claim 1, which is characterized in that described sebific duct includes dispensing tube body, the point
Rubber head includes that interconnecting piece and the first drop glue portion being connected with the interconnecting piece and the second drop glue portion, the interconnecting piece movably exist
It protrudes into or stretches out in the dispensing tube body, so that the first drop glue portion and the second drop glue portion be driven to do by near and far simultaneously
Movement from the dispensing tube body.
9. glue applying mechanism according to claim 8, which is characterized in that the dispensing tube body inner wall is provided with the first limit
Portion is provided with the second limiting section with first limiting section cooperation on the outer wall of the interconnecting piece, for preventing the connection
Portion rotates in the dispensing tube body.
10. a kind of bonder, which is characterized in that including glue applying mechanism described in any one of rack and claim 1-9, institute
Glue applying mechanism is stated to be set in the rack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920126635.4U CN209502149U (en) | 2019-01-24 | 2019-01-24 | A kind of glue applying mechanism and bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920126635.4U CN209502149U (en) | 2019-01-24 | 2019-01-24 | A kind of glue applying mechanism and bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209502149U true CN209502149U (en) | 2019-10-18 |
Family
ID=68202451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920126635.4U Active CN209502149U (en) | 2019-01-24 | 2019-01-24 | A kind of glue applying mechanism and bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209502149U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113798132A (en) * | 2021-11-16 | 2021-12-17 | 河南芯睿电子科技有限公司 | Efficient glue dispensing device and method for power management chip |
| CN114273157A (en) * | 2021-12-02 | 2022-04-05 | 包娴英 | Quick air-drying equipment for efficient dispensing of electronic elements |
-
2019
- 2019-01-24 CN CN201920126635.4U patent/CN209502149U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113798132A (en) * | 2021-11-16 | 2021-12-17 | 河南芯睿电子科技有限公司 | Efficient glue dispensing device and method for power management chip |
| CN113798132B (en) * | 2021-11-16 | 2022-02-08 | 河南芯睿电子科技有限公司 | Efficient glue dispensing method for power management chip |
| CN114273157A (en) * | 2021-12-02 | 2022-04-05 | 包娴英 | Quick air-drying equipment for efficient dispensing of electronic elements |
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