CN114256586A - Debugging method of microstrip power divider after laser welding packaging - Google Patents
Debugging method of microstrip power divider after laser welding packaging Download PDFInfo
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- CN114256586A CN114256586A CN202111358225.0A CN202111358225A CN114256586A CN 114256586 A CN114256586 A CN 114256586A CN 202111358225 A CN202111358225 A CN 202111358225A CN 114256586 A CN114256586 A CN 114256586A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
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Abstract
The invention belongs to the technical field of microwave antennas, and relates to a debugging method of a microstrip power divider after laser welding and packaging. The microstrip power divider comprises a cavity, a cover plate, a microstrip line circuit board and a connector; the cavity and the cover plate are packaged in a laser welding mode; the microstrip line circuit board and the connector are arranged in the cavity; the debugging method of the microstrip power divider after laser welding and packaging comprises the following steps: and applying force and/or impact to the outside of the cavity and/or the cover plate to enable the cover plate to generate elastic and/or plastic deformation, and debugging the microstrip circuit board and/or the connector. The invention can debug and repair the micro-strip power divider packaged by laser, ensure the microwave electrical property and the high and low temperature stability of the micro-strip power divider.
Description
Technical Field
The invention belongs to the technical field of microwave antennas, and relates to a debugging method of a microstrip power divider after laser welding and packaging.
Background
The microstrip power divider is an important component of a source-controlled array radar antenna system, and has important influence on the antenna performance and the performance of the whole radar. The models are many, the quantity is large, and the task in the production debugging stage is quite heavy. The microstrip power divider consists of a cavity, a cover plate, a microstrip line circuit board and a connector, wherein the microstrip line circuit board and the connector are installed in the cavity, and the cavity and the cover plate of the power divider are packaged in a laser welding mode. Although the power divider is tested and debugged before laser welding, microwave electrical performance indexes such as standing waves, insertion loss, phase consistency, mutual isolation of ports and the like can meet requirements, the phase consistency index changes randomly and cannot be controlled and debugged. The temperature can be greatly increased in the laser welding packaging process of the power divider, the assembling clamp is disassembled after the laser packaging, the internal stress condition of the power divider is changed, and the electrical property of the power divider after the laser packaging can be inevitably changed. The power divider is in a completely sealed state after welding and packaging, so that repair and debugging cannot be performed; if the cavity and the cover plate are decomposed, the cavity and the microstrip circuit board are inevitably deformed, and the maintenance value is lost. If the performance variation exceeds the design requirement, only the scrapping treatment can be basically carried out. For the power divider which is still qualified after the performance change, the performance stability of the power divider in subsequent use under different temperature environments cannot be ensured, and uncontrollable change does not occur. Therefore, a technical method is needed to debug and repair the laser-packaged microstrip power divider, so as to ensure the microwave electrical performance and the high-temperature and low-temperature stability of the microstrip power divider. At present, a method for debugging a micro-strip power divider after laser packaging is not available.
Disclosure of Invention
In view of this, the invention provides a method for debugging a packaged microstrip power divider by laser welding, which can debug and repair the laser-packaged microstrip power divider, ensure microwave electrical performance and ensure high and low temperature stability of the microstrip power divider.
In order to achieve the technical purpose, the invention adopts the following specific technical scheme:
a debugging method of a microstrip power divider after laser welding packaging is disclosed, wherein the microstrip power divider comprises a cavity, a cover plate, a microstrip line circuit board and a connector; the cavity and the cover plate are packaged in a laser welding mode; the microstrip line circuit board and the connector are arranged in the cavity;
the debugging method of the microstrip power divider after laser welding and packaging comprises the following steps:
and applying force and/or impact to the outside of the cavity and/or the cover plate to enable the cover plate to generate elastic and/or plastic deformation, and debugging the microstrip circuit board and/or the connector.
Furthermore, the microstrip circuit board is of a layered structure, each layer of electric connection is realized through a metal conductive column, and the debugging method comprises a metal conductive column processing method, which is applied to the case that an air gap, poor contact and/or inconsistent welding height exist between the metal conductive column and a metalized via hole between strip line circuits of the microstrip circuit board; the method comprises the following steps:
s101: applying force and/or impacting the cover plate at the position of the metal conductive column with uniform force to deform the surface of the cover plate to generate a first cross-shaped pit;
processing the first cross-shaped pits of each group of metal conductive columns into three groups;
the three groups of first cross pits respectively correspond to the positions of the metal conductive columns, the compensation circuit of the metal conductive columns and the circuit board section of the metal conductive columns.
Further, three groups of first cross pits are distributed as follows: a first cross pit is located metal-conductive post department, and other two sets of cross pits distribute in the extension strip line circuit department in the 3 ~ 4mm region apart from metal-conductive post axial projection.
Furthermore, the depth of the first cross-shaped concave pits is 0.1-0.4 mm.
Further, the debugging method further comprises a phase precision control method, and the method comprises the following steps:
s201: obtaining an actually measured phase value of each signal channel of the microstrip power divider through a vector network analyzer, calculating the phase offset of each channel by taking the highest working frequency point of the power divider as a reference, and calculating the phase consistency of the power divider;
s202, correcting the phase offsets of the other channels to the maximum offset by taking the channel with the maximum phase offset as a reference value:
and (3) carrying out impact and/or pressure treatment on the cover plate at the position of the channel to be corrected of the branch extension strip line circuit by uniform force, so that the cover plate generates a pit, and the phase offset of the channel to be corrected is increased.
Further, each of the channels constitutes a branch stripline circuit, and the branch stripline circuit includes: a single channel, a tertiary branch, a secondary branch and a primary branch; the secondary branch is a branch portion of the primary branch, the tertiary branch is a branch portion of the secondary branch, and the single channel is a branch portion of the tertiary branch;
in S202, the priority of the impact and/or pressure treatment is the first-level branch, the second-level branch, the third-level branch, and the single channel.
Furthermore, the pit generated by the accurate phase control is a second cross pit, the depth of the second cross pit is 0.1-0.4 mm, and the second cross pit is used for generating 1-3 degrees of phase offset for the branch generated by the corrected branch.
Further, the debugging method further comprises a port and cover plate leveling method:
when the cover plate upwarps appears at the external port of the cavity and/or the cover plate bending angle, the cover plate at each external port and the transmission channel bending angle is leveled by using a square head tool.
Further, each pit is realized based on the impact/force application of a flat head cross special tool and/or a flat head cross screwdriver.
Furthermore, the debugging method of the microstrip power divider after laser welding and packaging is also used for debugging the microwave device and the assembly.
By adopting the technical scheme, the invention can bring the following beneficial effects:
1. the phase consistency index which is random and can not be controlled and debugged is completely controllable and adjustable, the qualification rate and the temperature stability of the microstrip power divider are greatly improved, and the rework rate of each subsequent debugging procedure is greatly reduced.
2. The debugging method is simple and easy to implement. The method is suitable for mass production, the debugging working efficiency is greatly improved, and the cost is reduced.
3. The microwave electrical property of the microstrip power divider is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic diagram of a position and a structure of a metal conductive pillar according to an embodiment of the present invention;
fig. 2 is a schematic view of a method for processing a metal conductive pillar according to an embodiment of the present invention:
FIG. 3 is a schematic diagram illustrating the distribution of three first dimples according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a branch delay line circuit according to an embodiment of the present invention; (one in five);
FIG. 5 is a schematic (one-to-eight) diagram of the processing position of the branch delay line circuit according to the embodiment of the present invention.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that various aspects of the embodiments are described below within the scope of the appended claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the disclosure, one skilled in the art should appreciate that one aspect described herein may be implemented independently of any other aspects and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number of the aspects set forth herein. Additionally, such an apparatus may be implemented and/or such a method may be practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than the number, shape and size of the components in practical implementation, and the type, quantity and proportion of the components in practical implementation can be changed freely, and the layout of the components can be more complicated.
In addition, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details.
In an embodiment of the present invention, a method for debugging a microstrip power divider after laser welding packaging is provided, where the microstrip power divider includes a cavity, a cover plate, a microstrip circuit board, and a connector; the cavity and the cover plate are packaged in a laser welding mode; the microstrip line circuit board and the connector are arranged in the cavity;
the debugging method of the microstrip power divider after laser welding and packaging comprises the following steps:
and applying force and/or impact to the outside of the cavity and/or the cover plate to enable the cover plate to generate elastic and/or plastic deformation, and debugging the microstrip circuit board and/or the connector.
In one embodiment, the microstrip circuit board is a layered structure, each layer of electrical connection is realized through a metal conductive column, the debugging method comprises a metal conductive column processing method, when an air gap, poor contact and/or inconsistent welding height exist between the metal conductive column and a metalized via hole between strip line circuits of the microstrip circuit board, impedance matching is poor, the influence on insertion loss, amplitude consistency and isolation is great, and meanwhile, the high-low temperature performance stability of the assembly is poor.
The metal conductive column processing method comprises the following steps:
s101: applying force and/or impacting the cover plate at the position of the metal conductive post with uniform force to deform the surface of the cover plate to generate a first cross-shaped pit;
processing the first cross pits of each group of metal conductive columns into three groups;
the three groups of first cross pits respectively correspond to the positions of the metal conductive columns, the compensation circuit of the metal conductive columns and the circuit board section of the metal conductive columns.
In this embodiment, three groups of first cross pits are distributed as follows: a first cross pit is located metal-conductive post department, and other two sets of cross pits distribute in the extension strip line circuit department in the 3 ~ 4mm region apart from metal-conductive post axial projection, as shown in fig. 3.
In this embodiment, the depth of the first cross-shaped pits is 0.1-0.4 mm.
Fig. 1 is a schematic diagram of a position and a structure of a metal conductive pillar according to the present embodiment;
fig. 2 is a schematic view of a processing method of the metal conductive pillar in this embodiment: ("+ + + +" in the impact pressure position).
In one embodiment, the debugging method further comprises a phase precision control method,
the dielectric constant of the microstrip circuit board changes due to stress, so that the phase offset is increased along with the increase of the stress of the circuit board, after laser packaging and welding, the stress of the circuit board cannot be reduced, and only the phase offset of a channel with small phase offset can be increased (unidirectional correction).
The accurate control method comprises the following steps:
s201: the method comprises the steps that an actually measured phase value of each signal channel of the microstrip power divider is obtained through a vector network analyzer, the phase offset is larger when the frequency is higher, the phase offset of each channel is calculated by taking the highest working frequency point of the power divider as a reference, and the phase consistency of the power divider is calculated;
s202, based on the phase consistency, correcting the phase offset of the rest channels to the maximum offset by taking the channel with the maximum phase offset as a reference value:
and (3) carrying out impact and/or pressure treatment on the cover plate at the position of the channel to be corrected of the branch extension strip line circuit by uniform force, so that the cover plate generates a pit, and the phase offset of the channel to be corrected is increased.
Each channel constitutes a branch stripline circuit, including: a single channel, a tertiary branch, a secondary branch and a primary branch; the secondary branch is a branch part of the primary branch, the tertiary branch is a branch part of the secondary branch, and the single channel is a branch part of the tertiary branch;
in S202, as shown in fig. 4, the priority of the impact and/or pressure application process is the first-level branch-second-level branch-third-level branch-single channel.
In the embodiment, the pit generated by the phase precision control is a second cross pit, and the depth of the second cross pit is 0.1-0.4 mm, so as to generate a phase offset of 1-3 degrees for the branch generated by the corrected branch.
FIG. 4 is a schematic diagram of a branch delay line circuit in the present embodiment; (one in five);
fig. 5 is a schematic processing position (one-to-eight) of the branched stripline circuit in this embodiment, in which a circle is a first cross-shaped pit, and the rest are second cross-shaped pits.
In the above embodiments, the first cross-shaped recess and the second cross-shaped recess are implemented based on the impact/force of a flat-head cross special tool and/or a flat-head cross screwdriver.
In one embodiment, the debugging method further comprises a port and cover plate leveling method:
when the cover plate upwarps appears at the external port of the cavity and/or the cover plate corner, the cover plate at each external port and the transmission channel corner is leveled by using a square head tool.
External port and apron bent angle department, because of laser encapsulation is heated and dismantles debugging frock back stress release, the apron upwarps can appear, influences the wholeness ability. After the leveling, the electromagnetic leakage can be prevented, the impedance matching of each external port can be improved, the standing wave coefficient can be improved, the loss fluctuation can be reduced, and the mutual isolation between signal channels can be improved.
The above embodiments are applicable to the strip line power divider and the assembly having the structure that the circuit board is made of flexible materials and sealed in the metal cavity. And can be extended for microwave devices and assemblies having the same structural features.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A debugging method of a microstrip power divider after laser welding packaging is characterized in that the microstrip power divider comprises a cavity, a cover plate, a microstrip line circuit board and a connector; the cavity and the cover plate are packaged in a laser welding mode; the microstrip line circuit board and the connector are arranged in the cavity;
the debugging method of the microstrip power divider after laser welding and packaging comprises the following steps:
and applying force and/or impact to the outside of the cavity and/or the cover plate to enable the cover plate to generate elastic and/or plastic deformation, and debugging the microstrip circuit board and/or the connector.
2. The debugging method of claim 1, wherein the microstrip circuit board has a layered structure, and each layer is electrically connected by a metal conductive pillar, and the debugging method includes a metal conductive pillar processing method applied when an air gap, poor contact and/or inconsistent welding height exist between the metal conductive pillar and a metalized via hole between strip line circuits of the microstrip circuit board; the method comprises the following steps:
s101: applying force and/or impacting the cover plate at the position of the metal conductive column with uniform force to deform the surface of the cover plate to generate a first cross-shaped pit;
processing the first cross-shaped pits of each group of metal conductive columns into three groups;
the three groups of first cross pits respectively correspond to the positions of the metal conductive columns, the compensation circuit of the metal conductive columns and the circuit board section of the metal conductive columns.
3. The debugging method of the microstrip power divider after laser welding and packaging according to claim 2, wherein the three groups of first cross-shaped pits are distributed as follows: a first cross pit is located metal-conductive post department, and other two sets of cross pits distribute in the extension strip line circuit department in the 3 ~ 4mm region apart from metal-conductive post axial projection.
4. The debugging method of claim 2, wherein the depth of the first cross-shaped recess is 0.1-0.4 mm.
5. The debugging method of claim 1, further comprising a phase-accurate control method, comprising the steps of:
s201: obtaining an actually measured phase value of each signal channel of the microstrip power divider through a vector network analyzer, calculating the phase offset of each channel by taking the highest working frequency point of the power divider as a reference, and calculating the phase consistency of the power divider;
s202, correcting the phase offsets of the other channels to the maximum offset by taking the channel with the maximum phase offset as a reference value:
and (3) carrying out impact and/or pressure treatment on the cover plate at the position of the channel to be corrected of the branch extension strip line circuit by uniform force, so that the cover plate generates a pit, and the phase offset of the channel to be corrected is increased.
6. The debugging method of claim 5, wherein each channel constitutes a branch delay line circuit, and the branch delay line circuit comprises: a single channel, a tertiary branch, a secondary branch and a primary branch; the secondary branch is a branch portion of the primary branch, the tertiary branch is a branch portion of the secondary branch, and the single channel is a branch portion of the tertiary branch;
in S202, the priority of the impact and/or pressure treatment is the first-level branch, the second-level branch, the third-level branch, and the single channel.
7. The debugging method of claim 6, wherein the pit generated by the phase precise control is a second cross pit, and the depth of the second cross pit is 0.1-0.4 mm, and the second cross pit is used for generating a phase offset of 1-3 ° for the branch generated by the corrected branch.
8. The debugging method of claim 1, further comprising a port and cover plate leveling method:
when the cover plate upwarps appears at the external port of the cavity and/or the cover plate bending angle, the cover plate at each external port and the transmission channel bending angle is leveled by using a square head tool.
9. The debugging method of the microstrip power divider after laser welding packaging according to any one of claims 2 to 7, wherein each pit is realized based on the impact/force application of a flat-head cross special tool and/or a flat-head cross screwdriver.
10. The method for debugging the microstrip power divider after laser welding package according to any one of claims 1 to 8, wherein the method for debugging the microstrip power divider after laser welding package is further used for debugging microwave devices and components.
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Citations (5)
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| US5488313A (en) * | 1993-07-16 | 1996-01-30 | Litton Systems, Inc. | Test probe and circuit board arrangement for the circuit under test for microstrip circuitry |
| CN101976750A (en) * | 2010-10-29 | 2011-02-16 | 深圳市大富科技股份有限公司 | Cavity filter |
| CN102522620A (en) * | 2011-12-27 | 2012-06-27 | 中国航空工业第六○七研究所 | Debugging method for pre-welding strip line splitter by laser |
| CN106342358B (en) * | 2010-09-14 | 2014-05-07 | 中国航空工业集团公司雷华电子技术研究所 | A kind of strip line end connecting structure |
| CN106876852A (en) * | 2015-12-14 | 2017-06-20 | 中国航空工业集团公司雷华电子技术研究所 | A kind of multilayer power splitter levels microstrip circuit attachment structure |
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2021
- 2021-11-16 CN CN202111358225.0A patent/CN114256586B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5488313A (en) * | 1993-07-16 | 1996-01-30 | Litton Systems, Inc. | Test probe and circuit board arrangement for the circuit under test for microstrip circuitry |
| CN106342358B (en) * | 2010-09-14 | 2014-05-07 | 中国航空工业集团公司雷华电子技术研究所 | A kind of strip line end connecting structure |
| CN101976750A (en) * | 2010-10-29 | 2011-02-16 | 深圳市大富科技股份有限公司 | Cavity filter |
| CN102522620A (en) * | 2011-12-27 | 2012-06-27 | 中国航空工业第六○七研究所 | Debugging method for pre-welding strip line splitter by laser |
| CN106876852A (en) * | 2015-12-14 | 2017-06-20 | 中国航空工业集团公司雷华电子技术研究所 | A kind of multilayer power splitter levels microstrip circuit attachment structure |
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