CN114252007A - Optical detection device and method for three-dimensional structure of micro-nano device - Google Patents
Optical detection device and method for three-dimensional structure of micro-nano device Download PDFInfo
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- CN114252007A CN114252007A CN202011005007.4A CN202011005007A CN114252007A CN 114252007 A CN114252007 A CN 114252007A CN 202011005007 A CN202011005007 A CN 202011005007A CN 114252007 A CN114252007 A CN 114252007A
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 230000003287 optical effect Effects 0.000 title claims abstract description 16
- 238000001514 detection method Methods 0.000 title claims abstract description 13
- 238000013519 translation Methods 0.000 claims abstract description 21
- 238000007493 shaping process Methods 0.000 claims abstract description 13
- 238000005259 measurement Methods 0.000 claims description 13
- 239000002131 composite material Substances 0.000 claims description 8
- 238000013528 artificial neural network Methods 0.000 claims description 3
- 238000013135 deep learning Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000004088 simulation Methods 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 description 7
- 230000003595 spectral effect Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005305 interferometry Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001028 reflection method Methods 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y35/00—Methods or apparatus for measurement or analysis of nanostructures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/08—Measuring arrangements characterised by the use of optical techniques for measuring diameters
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/22—Measuring arrangements characterised by the use of optical techniques for measuring depth
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
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- Length Measuring Devices By Optical Means (AREA)
Abstract
A three-dimensional structure optical detection device for a micro-nano device comprises a light source, a light beam shaping module, a semi-transparent semi-reflective mirror, a focusing lens, a translation table, a detector and a computer, wherein laser output by the light source is shaped and expanded by the light beam shaping module, parallel light beams after expansion are reflected by the semi-transparent semi-reflective mirror, focused by the focusing lens and irradiated on a sample to be detected; placing a sample to be detected on the translation table and at a defocusing position; the reflected light beam sequentially passes through the focusing lens and the semi-transparent semi-reflective mirror and is detected by the detector; the translation stage and the detector are controlled by the computer in a linkage manner, so that the scanning and the data acquisition are synchronously carried out. The device and the method can measure the line width, the height/depth, the side wall angle and the like of the line and the groove and the uniformity of all parameters, the diameter, the height/depth, the side wall angle and the uniformity of all parameters of the particle and the hole, and can also measure S/L-shaped structures, array structures or multi-layer stacking and other complex structures.
Description
Technical Field
The invention relates to the technical field of micro-nano scanning measurement, in particular to an optical detection device and method for a three-dimensional structure of a micro-nano device.
Background
The 'Zhongxing event' occurred in 2018 lets people realize that the autonomous development of the semiconductor industry plays a crucial role in national economic development and industrial safety. Through decades of development, the performance of semiconductor devices is greatly improved. With the improvement of performance, the feature size of the device structure is smaller and smaller, and the device structure is more and more complex. To ensure device quality and yield, three-dimensional feature sizes of semiconductor devices need to be measured and analyzed.
Semiconductor device feature sizes are typically on the order of μm to nm. The traditional measuring methods include an electron microscope, a scanning tunneling microscope and an atomic force microscope, and the methods can only measure a surface structure and can only adopt destructive means for an internal structure, and meanwhile, the measuring speed is low. In recent years, nondestructive measurement techniques based on optical methods, such as white light interferometry, spectral reflectance, spectral scattering, laser confocal methods, and the like, have become mature. Such optical methods typically require precise focusing to obtain accurate measurements, and require refocusing when measuring surfaces or internal structures of different heights of the semiconductor device, affecting the speed of measurement. Meanwhile, the white light interference method and the spectral reflection method can only obtain the depth information of the groove or hole structure, and the spectral scattering method can only obtain the average result of parameters such as the line width, the aperture, the side wall angle and the like of the array structure, so that the structure information of the semiconductor device cannot be completely and really reflected.
The applicant has found that the above-mentioned prior art has the following technical drawbacks
(1) The traditional method has low measurement speed and cannot measure the internal structure of a device under the condition of not damaging a sample;
(2) an optical method capable of realizing nondestructive measurement usually needs accurate focusing, and repeated focusing is needed when the surface or the internal structure of the micro-nano device with different heights is measured, so that the measurement speed is influenced;
(3) optical methods typically reflect only partial structural information of the sample to be measured or average parametric information of the array structure.
Disclosure of Invention
In view of the above, the main objective of the present invention is to provide an optical detection apparatus and method for detecting a three-dimensional structure of a micro-nano device, so as to partially solve at least one of the above technical problems.
In order to achieve the above object, as an aspect of the present invention, there is provided an optical detection apparatus for a three-dimensional structure of a micro-nano device, comprising a light source, a beam shaping module, a half-mirror, a focusing lens, a translation stage, a detector and a computer, wherein,
laser output by the light source is shaped and expanded by the light beam shaping module, and parallel expanded light beams are reflected by the semi-transparent semi-reflector, focused by the focusing lens and irradiated on a sample to be measured; placing the sample to be detected on the translation table and at a defocusing position; the reflected light beam sequentially passes through the focusing lens and the semi-transparent semi-reflecting mirror and is detected by the detector; the translation stage and the detector are controlled by the computer in a linkage manner, so that the scanning and the data acquisition are synchronously carried out.
Optionally, the detector comprises a high speed camera.
As another aspect of the present invention, there is provided a method of the optical detection apparatus as described above, comprising the steps of:
laser output by the light source is shaped and expanded by the light beam shaping module;
the expanded parallel light beams are reflected by the semi-transparent semi-reflector, focused by the focusing lens and irradiated on a sample to be measured;
placing a sample to be detected on a translation table and locating the sample to be detected at a defocusing position;
the reflected light beam sequentially passes through the focusing lens and the semi-transparent semi-reflective mirror and is detected by a detector;
the translation table and the detector are controlled by a computer in a linkage manner to realize synchronous scanning and data acquisition;
processing the acquired data by a computer to obtain a scanning composite image of the sample to be detected, and comparing the scanning composite image with a database;
and selecting the database image which is most matched with the scanning synthetic image through comparison, wherein the structural characteristics and the geometric parameters corresponding to the matched image are the final measurement result.
Optionally, the database is built by measuring a series of standard samples with different structural features and different geometric parameters, or by numerical simulation.
Optionally, the neural network is trained by a deep learning method to recognize and scan the synthetic image, so that the tedious work of establishing the database is avoided.
Based on the technical scheme, compared with the prior art, the optical detection device and method for the three-dimensional structure of the micro-nano device have at least one of the following beneficial effects:
(1) the method provided by the invention does not need accurate focusing, can realize scanning measurement by using the sample stage positioning system, and the measurement result cannot be influenced by the fluctuation of the structure of the sample to be measured.
(2) The method provided by the invention has no special requirement on the monochromaticity of the light source.
(3) The device and the method can measure the line width, the height/depth, the side wall angle and the like of the line and the groove and the uniformity of all parameters, the diameter, the height/depth, the side wall angle and the uniformity of all parameters of the particle and the hole, and can also measure S/L-shaped structures, array structures or multi-layer stacking and other complex structures.
(4) The device and the method provided by the invention can also be used for measuring the inclination, the flatness, the film thickness uniformity and the like of the silicon wafer.
Drawings
Fig. 1 is a schematic structural diagram of a measurement device in an embodiment of the present invention.
In the above figures, the reference numerals have the following meanings:
1. a light source; 2. A beam shaping module; 3. A semi-transparent semi-reflective mirror; 4. A focusing lens; 5. a translation stage; 6. A high-speed camera; 7. And (4) a computer.
Detailed Description
The invention uses the convergent light beam to irradiate the sample at the defocusing position, and the detector records the light intensity distribution of the reflected light field. The light beam horizontally sweeps the sample to be measured in a certain step length, and because the sample is positioned at an out-of-focus position, the incident angles at different positions of the convergent light spot are different, and the influence of the sample to be measured on the reflected light field is also different. Therefore, the detector can record a series of slightly different reflected light field images, and data on the central axis of each image is selected to form a brand new scanning composite image. Meanwhile, the structural characteristics and the geometric parameters of the sample to be detected can influence the intensity distribution of the reflected light field, so that the structural characteristics and the geometric parameters of the sample to be detected can be obtained by comparing the measured scanning synthetic image with a database. The device can realize the measurement of geometric parameters and defect detection of the micro-nano scale three-dimensional structure, and is expected to provide a new detection means for the fields of semiconductors and the like.
In order that the objects, technical solutions and advantages of the present invention will become more apparent, the present invention will be further described in detail with reference to the accompanying drawings in conjunction with the following specific embodiments.
As shown in figure 1, the invention discloses an optical detection device for a three-dimensional structure of a micro-nano device, which comprises a light source, a beam shaping module, a semi-transparent and semi-reflective mirror, a focusing lens, a translation stage, a detector and a computer, wherein,
laser output by the light source is shaped and expanded by the light beam shaping module, and parallel expanded light beams are reflected by the semi-transparent semi-reflector, focused by the focusing lens and irradiated on a sample to be measured; placing the sample to be detected on the translation table and at a defocusing position; the reflected light beam sequentially passes through the focusing lens and the semi-transparent semi-reflecting mirror and is detected by the detector; the translation stage and the detector are controlled by the computer in a linkage manner, so that the scanning and the data acquisition are synchronously carried out.
As an alternative embodiment, the detector includes, but is not limited to, a high speed camera.
As another aspect of the present invention, there is provided a method of the optical detection apparatus as described above, comprising the steps of:
laser output by the light source is shaped and expanded by the light beam shaping module;
the expanded parallel light beams are reflected by the semi-transparent semi-reflector, focused by the focusing lens and irradiated on a sample to be measured;
placing a sample to be detected on a translation table and locating the sample to be detected at a defocusing position;
the reflected light beam sequentially passes through the focusing lens and the semi-transparent semi-reflective mirror and is detected by a detector;
the translation table and the detector are controlled by a computer in a linkage manner to realize synchronous scanning and data acquisition;
processing the acquired data by a computer to obtain a scanning composite image of the sample to be detected, and comparing the scanning composite image with a database;
and selecting the database image which is most matched with the scanning synthetic image through comparison, wherein the structural characteristics and the geometric parameters corresponding to the matched image are the final measurement result.
As an alternative embodiment, the database is established by measuring a series of standard samples with different structural characteristics and different geometric parameters, or by a numerical simulation method.
As an optional embodiment, the neural network can be trained by a deep learning method to identify and scan the synthetic image, so that the tedious work of establishing a database is avoided.
The technical solution of the present invention is further described below by a preferred embodiment of the present invention.
Laser output by the light source 1 is shaped and expanded by the light beam shaping module 2, and parallel expanded light beams are reflected by the semi-transparent and semi-reflective mirror 3, focused by the focusing lens 4 and irradiated on a sample. The sample is placed on the translation stage 5 in an out-of-focus position. The reflected light beam passes through the focusing lens 4 and the half mirror 3 in sequence and then is detected by the high-speed camera 6. The translation stage 5 and the high-speed camera 6 are controlled by the computer 7 in a linkage manner, so that the scanning and the data acquisition are synchronously carried out. The collected data is processed by the computer 7 to obtain a scanned composite image of the sample and compared with the database. The database is established by measuring series of standard samples with different structural features and different geometric parameters, a database image which is most matched with the scanning synthetic image is selected by comparison, and the structural features and the geometric parameters corresponding to the matched image are the final measuring results.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. An optical detection device for a three-dimensional structure of a micro-nano device is characterized by comprising a light source, a beam shaping module, a semi-transparent semi-reflecting mirror, a focusing lens, a translation stage, a detector and a computer, wherein,
laser output by the light source is shaped and expanded by the light beam shaping module, and parallel expanded light beams are reflected by the semi-transparent semi-reflector, focused by the focusing lens and irradiated on a sample to be measured; placing the sample to be detected on the translation table and at a defocusing position; the reflected light beam sequentially passes through the focusing lens and the semi-transparent semi-reflecting mirror and is detected by the detector; the translation stage and the detector are controlled by the computer in a linkage manner, so that the scanning and the data acquisition are synchronously carried out.
2. The optical inspection device of claim 1, wherein the detector includes a high-speed camera.
3. A method of optically inspecting devices according to claim 1, comprising the steps of:
laser output by the light source is shaped and expanded by the light beam shaping module;
the expanded parallel light beams are reflected by the semi-transparent semi-reflector, focused by the focusing lens and irradiated on a sample to be measured;
placing a sample to be detected on a translation table and locating the sample to be detected at a defocusing position;
the reflected light beam sequentially passes through the focusing lens and the semi-transparent semi-reflective mirror and is detected by a detector;
the translation table and the detector are controlled by a computer in a linkage manner to realize synchronous scanning and data acquisition;
processing the acquired data by a computer to obtain a scanning composite image of the sample to be detected, and comparing the scanning composite image with a database;
and selecting the database image which is most matched with the scanning synthetic image through comparison, wherein the structural characteristics and the geometric parameters corresponding to the matched image are the final measurement result.
4. The method according to claim 3, characterized in that the database is established by measuring a series of standard samples with different structural features, different geometrical parameters, or by means of numerical simulations.
5. The method of claim 3, wherein the neural network is trained to recognize the scanned synthetic image by a deep learning method, thereby avoiding the tedious work of building a database.
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Cited By (1)
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| CN115265361A (en) * | 2022-06-27 | 2022-11-01 | 赛赫智能设备（上海）股份有限公司 | Method for measuring parameters of inner hole of flat pad of fastener by using non-contact cone mirror |
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