CN110260788A - Optical micro/nano measuring device, the method for extracting structure micro-nano dimension information to be measured - Google Patents

Optical micro/nano measuring device, the method for extracting structure micro-nano dimension information to be measured Download PDF

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Publication number
CN110260788A
CN110260788A CN201910591971.0A CN201910591971A CN110260788A CN 110260788 A CN110260788 A CN 110260788A CN 201910591971 A CN201910591971 A CN 201910591971A CN 110260788 A CN110260788 A CN 110260788A
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lens
image
object lens
nano
measured
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CN110260788B (en
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屈玉福
彭仁举
郝嘉麟
柳姝姌
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Beihang University
Beijing University of Aeronautics and Astronautics
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Beijing University of Aeronautics and Astronautics
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y35/00Methods or apparatus for measurement or analysis of nanostructures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G01B21/045Correction of measurements
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00Image enhancement or restoration
    • G06T5/10Image enhancement or restoration using non-spatial domain filtering
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00Image enhancement or restoration
    • G06T5/70Denoising; Smoothing
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00Image enhancement or restoration
    • G06T5/80Geometric correction
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/60Analysis of geometric attributes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/10Image acquisition modality
    • G06T2207/10056Microscopic image
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/20Special algorithmic details
    • G06T2207/20048Transform domain processing
    • G06T2207/20056Discrete and fast Fourier transform, [DFT, FFT]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Geometry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Optics & Photonics (AREA)
  • Microscoopes, Condenser (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The present invention provides a kind of optical micro/nano measuring devices and the method for automatically extracting object to be measured dimension information.The illumination part and imaging moiety of the measuring device are made of multiple 4f systems, and different illumination numerical apertures, the reflective Kohler illumination mode of polarization state can be generated according to object to be measured type and sensitivity requirement and obtains the picture of required enlargement ratio.The device realizes the purpose of logical burnt scanning using a piezoelectric positioner with the objective scan of itself, and swash width can be controlled accurately, and be easy to be directly mounted on line of production technology, can satisfy the requirement of on-line measurement.The size extraction method contains the noise cancelling alorithm based on Fourier transformation.The Fourier spectrum and phase of out-of-focus image are emulated by calculating the practical out-of-focus image of each width and corresponding ideal, and by the former frequency spectrum and the latter's phase combination, its inverse Fourier transform is calculated again, eliminates the optical noise generated in measurement process by external interference and mechanical noise to realize.

Description

Optical micro/nano measuring device, the method for extracting structure micro-nano dimension information to be measured
Technical field
The logical burnt scanning optical micro/nano measuring device based on Fourier transformation correction that the present invention relates to a kind of and extract to The method and recording medium of geodesic structure micro-nano dimension information.Optically and mechanically noise can be corrected more particularly to one kind and is obtained Method compared with the optical nano measuring device of high measurement accuracy result and for extracting structure micro-nano dimension information to be measured, belongs to The optical micro/nano of semicon industry measures and process control field.
Background technique
Under the promotion of Moore's Law, the size of semiconductor constantly reduces, and structure is gradually three-dimensional from 2 dimensional planes to 3 dimensions Direction develop.And traditional micro-nano measurement method gradually exposes its limitation, too such as atomic force microscope measurement efficiency It is low, scanning electron microscope can only provide 2 dimension width informations and cannot accurately provide the 3rd dimension elevation information etc..Optical micro/nano is surveyed Amount has the advantages that a series of uniquenesses compared with traditional micro-nano measurement method, as low in cost, measurement efficiency is high, operability By force, without destructiveness etc..Optical micro/nano mensuration based on logical burnt scanning refers to for one group of structural parameters x=[x1..., xn]T, Simulation means are first passed through in advance calculates the corresponding optical signalling set f (x) under objective focus positions consecutive variations.Then survey is utilized It measures device and collects structural parameters x to be measured0Corresponding optical signalling y (x0), and calculate the root-mean-square error of the two:
χ (x, x0)=| | f (x)-y (x0)||
The measurement knot closest to real structure parameter is finally extracted from root-mean-square error in conjunction with the thought of least square FruitIt meets:
Wherein Ω is structural parameters domain.
Under the conditions of practical application, the measurement result of the optical micro/nano measurement based on logical burnt scanning is quick to some factor height Sense, such as the lateral mechanical oscillation of measuring device and the angle inhomogeneities of actual illumination light.Above-mentioned factor can introduce mechanical noise And optical noise, cause the precision of measurement result to reduce.Therefore using the algorithm of Fourier transformation to optical signalling set f (x) It is corrected, with the measurement result of be eliminated mechanical noise and optical noise interference, improves the precision of measurement result.
Summary of the invention
Technical problems to be solved of the present invention are: provide one kind can quickly correction mechanical noise and optical noise, have Help online, real-time measurement semiconductor components and devices micro-nano dimensional structure logical burnt scanning optical micro/nano measuring device and for mentioning The method for taking structure micro-nano dimension information to be measured.
Optical micro/nano measuring device according to the present invention, comprising: reflective Kohler illumination and imaging moiety;It is fixed with object lens Bit position, wherein reflective Kohler illumination and imaging moiety include: light source;First object lens, are placed in front of light source, for assembling Illumination light;Aperture is placed in front of first object lens;First lens are placed in front of the aperture, are used to form collimated light Road;Second lens are placed in front of first lens, are used for and the first lens forming 4f system;Polarizing film is placed in standard In straight light path;Amici prism is placed in after the polarizing film;And the third lens, it is placed in after second lens;4th Lens are placed in the third lens rear, for forming 4f system with the third lens;Plane mirror;Second object lens, for producing Raw reflective Kohler illumination and imaging;With imaging CCD, object lens position portion includes: piezoelectric positioner, is connected with second object lens It connects, for scanning second object lens up and down along optical axis, realizes the purpose of logical burnt scanning;And control unit, control the piezoelectricity Locator.
Measuring system of the present invention, the preferably described light source, first object lens and the aperture constitute a light Illumination light sent from the light source is converged to the small hole center by source system, first object lens, and the aperture again will Poly- illumination light becomes divergent illumination light.
Measuring device of the present invention, preferably described first lens and second lens constitute 4f system, described The incident focal plane of the 4f system of first lens and second lens composition is overlapped with plane where the small hole center, described The conjugation back focal plane weight of the outgoing focal plane and second object lens of the 4f system of first lens and second lens composition It closes, by adjusting hole diameter size, to obtain the reflective Kohler illumination mode of different incident numerical apertures.
Measuring device of the present invention, the preferably described polarizing film be placed in first lens and second lens it Between, for different types of sample to be tested, by adjusting the light passing axis direction of polarizing film, to obtain optimal measurement sensitivity.
Measuring device of the present invention, the preferably described control unit controls the piezoelectric positioner, so that described Second object lens scan up and down along optical axis and realize logical burnt scanning, do not generate any influence, while the measuring device to objective table Optical noise caused by mechanical noise caused by the mechanical displacement of itself and required swash width internal cause defocus is smaller, to survey The precision influence for measuring result is smaller.
The method of extraction structure micro-nano dimension information to be measured of the invention, comprising: analog image simulation process, for generating Form the emulation out-of-focus image sequence of search library;Actual image acquisition step, for acquiring the out-of-focus image sequence to geodesic structure; Real image aligning step, for removing in real image by the introduced optical noise of external interference and mechanical noise;Logical coke Scan image establishment step;With logical burnt scan image comparison and information extracting step to be measured.
The method of the present invention for extracting structure micro-nano dimension information to be measured, preferably in analog image simulation process, Using full vector calculation method, it is first a series of plane wave components by Kohler illumination photodegradation, then calculates each plane The corresponding NEAR FIELD SCATTERING distribution of wave component, recycles Abbe theory of image formation to calculate the Far-Zone Field Transformation of each near field distribution and as flat EDS maps are finally overlapped synthesis and obtain final ideal analog image.
The method of the present invention for extracting structure micro-nano dimension information to be measured, preferably in actual image acquisition step, By controlling piezoelectric positioner, object lens is made to return to initial position without hand by feedback compensation after each swash width Dynamic adjustment, meets quick duplicate measurements needs.
The method of the present invention for extracting structure micro-nano dimension information to be measured, preferably in real image aligning step, Using the thought of Fourier transformation, it respectively is isolated by the frequency spectrum and phase of Noise real image and ideal analog image, and will The spectral combination of the phase of Noise real image and ideal analog image is drawn with eliminating in former real image by external interference The optical noise and mechanical noise entered.
Computer readable storage medium of the invention is stored thereon with executable instruction, and described instruction is in one or more When processor executes, one or more of processor perform claims can be made to require described in 6~9 for extracting knot to be measured The method of structure micro-nano dimension information.
The invention has the following advantages over the prior art:
(1) the configuration of the present invention is simple, it is easy to operate, picture noise is eliminated from software respective, it is of less demanding to level of hardware;
(2) mode of objective scan of the invention replaces the objective table scanning mode of the logical burnt scanning system of tradition logical to realize The purpose of coke scanning, makes system be easy to be attached in semiconductor production process equipment;
(3) measurement result precision of the invention is high, and measuring speed is fast, is suitble to on-line measurement and produces application in enormous quantities.
Detailed description of the invention
Fig. 1 is Measuring System Models figure of the invention;
Fig. 2 is illumination 4f index path of the invention;
Fig. 3 is imaging 4f index path of the invention;
Fig. 4 is reflective Kohler illumination and imaging moiety module map of the invention;
Fig. 5 is object lens position portion module map of the invention:
Fig. 6 is the overall flow figure of the method for extraction structure micro-nano dimension information to be measured of the invention;
Fig. 7 is the flow chart of analog image simulation process of the invention;
Fig. 8 is the flow chart of actual image acquisition step of the invention;
Fig. 9 is the flow chart of real image aligning step of the invention;
Figure 10 is the flow chart of logical burnt scan image establishment step of the invention;
Figure 11 is logical burnt scan image comparison of the invention and information extracting step flow chart to be measured.
Specific embodiment
Fig. 1 is the model schematic of the measuring system 10 of the embodiment of the present invention, which is made of following three parts: reflection Formula Kohler illumination part, imaging moiety and object lens position portion, wherein reflective Kohler illumination part includes: LED light source 11, the One object lens 21, aperture 22, the first lens 23, polarizing film 24, unpolarized Amici prism 25, the second lens 26, plane mirror 27, Second object lens 28, objective table 12.Imaging moiety includes: the second object lens 28, and piezoelectric positioner 29, plane mirror 27, second thoroughly Mirror 26, unpolarized Amici prism 25, the third lens 31, the 4th lens 32, CCD camera 33.Object lens position portion includes that piezoelectricity is fixed Position device 29 and its control unit 14.Second object lens 28 are controlled by piezoelectric positioner 29.When a measurement is started, control unit 14 is issued to 29 Instruction, 29 the second object lens 28 of control move down a trip since nominal focusing position, then carry out logical coke from bottom to top Scanning, obtains a series of out-of-focus images, does not generate any influence to objective table, while caused by the mechanical displacement of device itself Optical noise caused by mechanical noise and required swash width internal cause defocus is smaller, influences on the precision of measurement result smaller.
Fig. 2 is the schematic illustration of reflective Kohler illumination part in the embodiment of the present invention.One the first object lens 21 is placed Before LED light source 11, for assembling incident light.One aperture 22 is placed at convergent point.One focal length is the first of 100nm Lens 23 are placed in front of 22, and focus is just overlapped with aperture 22, and the divergent beams issued from 22 are converted into collimated light beam. One piece of polarizing film 24 is placed in collimated light path for generating different polarization illumination light, to be directed to different types of mesh to be measured Mark selects suitable illumination condition.One unpolarized Amici prism 25 is used for optical path of transferring after being placed in 24.Another focal length is After the second lens 26 of 100nm are placed in 15, the divergent beams issued from 22 are imaged in one jointly by the second lens 26 and 23 On the focal plane of second object lens 28.The position for adjusting the second object lens 28 makes it be conjugated the focal plane of back focal plane and the second lens 26 It is overlapped, the divergent spherical wave that each picture point issues on 26 focal plane of the second lens at this time becomes not simultaneous interpretation after the second object lens 28 The plane wave in direction is broadcast, to form reflective Kohler illumination mode on object plane.First lens and described second Lens form the relaying microscope group of reflective Kohler illumination part, and constitute incident focal plane and be overlapped with plane where the aperture, The 4f system that outgoing focal plane is overlapped with second object lens conjugation back focal plane, holds by adjusting the size of the hole diameter It is easy to get to different illumination numerical apertures.
Fig. 3 is the schematic illustration of the imaging moiety of the embodiment of the present invention.Scattering of second object lens 28 collected from sample 13 Light, and it is common Polaroid with the second lens 26.The third lens 31 are placed in after the second lens 26, and focal plane is saturating with second The focal plane of mirror 26, which is overlapped, is converted into collimated light for the scattering light issued from the second lens 26.It is saturating that 4th lens 32 are placed in third After mirror 31, collimated light is converged on the sensitized lithography of CCD camera 33.By selecting the focal length of the 4th lens 32 and adjusting the The distance between four lens 32 and the third lens 31, can obtain the picture of different enlargement ratios.
Fig. 4 is the module map of reflective Kohler illumination and imaging moiety according to an embodiment of the present invention, wherein aforementioned second Object lens 28, aforesaid plane reflecting mirror 27, aforementioned second lens 26, aforementioned unpolarized Amici prism 25 are illuminations and are imaged public Module, while playing transmitting illumination light and scattering the effect of light.
Fig. 5 is object lens locating module figure according to an embodiment of the present invention.Aforementioned control unit 14 is to aforementioned piezoelectric positioner 29 Move is issued, aforementioned second object lens, 28 accurate movement is controlled.It is anti-to control unit 14 while aforementioned second object lens 28 are mobile Image Acquisition number is presented, after reaching defined amount, aforementioned control unit 14, which issues, terminates move.
Fig. 6 is the overall flow figure of the method for extraction structure micro-nano dimension information to be measured of the invention.Extraction of the invention The method of structure micro-nano dimension information to be measured includes: analog image simulation process 1, for measuring to practical object to be measured Before, the n width ideal emulation out-of-focus image for corresponding to n various sizes of analog samples of composition search library is simulated in advance, Wherein the analogy method of each width ideal emulation out-of-focus image is all based on the thought of full vector calculating, i.e., is had first using time domain It limits calculus of finite differences and calculates NEAR FIELD SCATTERING distribution and its Far-Zone Field Transformation, then use Abbe theory of image formation by all by the way that aperture is imaged Far field component is superimposed synthesis on as plane, obtains as the light distribution in plane;Actual image acquisition step 2, for opening Quick Acquisition waits for the out-of-focus image sequence of geodesic structure after beginning measurement, and wherein control unit output control signal drives piezoelectric positioner Object lens are scanned along optical axis, and after the every stepping a distance of object lens, CCD camera shoots the practical defocus of a width of object to be measured immediately Image;Real image aligning step 3, for being removed in real image after the completion of step 2 using Fourier transformation correcting algorithm By the introduced optical noise of external interference and mechanical noise, i.e., first respectively by the practical out-of-focus image of each width and ideal emulation The amplitude frequency spectrum and phase frequency spectrum of out-of-focus image are separated by Fourier transformation, then by the amplitude frequency of practical out-of-focus image The phase frequency spectrum combination of spectrum and ideal emulation out-of-focus image, finally does Fourier inversion to it again, realizes practical defocus figure As the purpose about ideal emulation out-of-focus image correction;Logical coke scan image establishment step 4, for being completed in step 1 and step 3 Practical logical burnt scan image is respectively created from practical out-of-focus image and emulation out-of-focus image afterwards and comprising emulating logical burnt scanning figure The search library of picture, wherein out-of-focus image practical for each width and emulation out-of-focus image, selected first one piece includes mesh to be measured The subregion of region of interest in mark, then extracts the mean intensity of the subregion, finally by these mean intensities according to step 1 It carries out stacking go forward side by side row interpolation and smooth operation with the focal position in step 2, exports logical burnt scan image;With logical burnt scanning figure As comparison and information extracting step to be measured 5, for extracting the dimension information of object to be measured after the completion of step 4, i.e., based on minimum The thought of square law, the quantitative difference calculated in practical logical burnt image and search library between each logical burnt image of width ideal emulation, Wherein best matching result differs the corresponding simulation model of the logical burnt image of the smallest that width ideal emulation with practical logical burnt image Parameter is to be taken as the correspondence parameter of object to be measured.
Fig. 7 is the flow chart of analog image simulation process.Step 61 is the knot of input model before running simulation program Structure parameter x, the optical parameter of measuring system 10: wavelength X, illumination numerical aperture INA and collection numerical aperture CNA, and set The calculating domain sizes L of FDTDxAnd Ly.Under Kohler illumination mode, every bit receives identical illumination cone in visual field, illumination The Space Angle of light cone is related with INA.Therefore illumination cone is resolved into that a series of amplitudes are identical, and the direction of propagation is different by step 62 Plane wave component, then calculate each plane wave component using Finite-Difference Time-Domain Method in step 63 is influenced by sample to be tested Corresponding NEAR FIELD SCATTERING distribution.After obtaining NEAR FIELD SCATTERING distribution, step 64 is by the principle of optical grating diffraction by near field distribution The far-field distribution being transformed in k-space, the i.e. Fourier transformation of scattered field.The equal independent action of above step in X, the Y of light vector, The component in tri- directions Z, the method for being consequently belonging to full vector calculating.According to Abbe theory of image formation, as plane distribution is actually It is all can be by the stack result of the scattering Fourier components of the image space diaphragm limited by CNA, therefore step 65 is by being superimposed To scattered field Fourier components and export simulation out-of-focus image.
Fig. 8 is the flow diagram of actual image acquisition step.Before acquisition, set the camera exposure time, input from Burnt picture number 2n+1 leads to coke scanning step k nm and specified image store path.After starting acquisition, piezoelectric positioner is controlled 29, so that piezoelectric positioner 29 is controlled second object lens 28 first and move down n × knm, is then iterated by control unit 14 Operation.Camera 33 of every iteration exposes once, and then second object lens 28 move up k nm, and judge collecting image Whether number meets the requirements.After acquisition picture number is met the requirements, control unit 14 is issued to piezoelectric positioner 29 and is instructed, control Second object lens 28 return to initial position.By controlling piezoelectric positioner, pass through object lens after each swash width Feedback compensation returns to initial position without manually adjusting, and meets quick duplicate measurements needs.
Fig. 9 is the flow chart of real image aligning step.Optical noise will lead to the pattern inclination of logical burnt scan image, machine The pattern that tool noise will lead to logical burnt scan image fluctuates, it is seen that the two results from the relevant influence of displacement.Step 71 To each width out-of-focus image application Fourier transformation, respectively obtain practical out-of-focus image and ideal emulation out-of-focus image frequency spectrum and Phase.Then phase of the frequency spectrum of the practical out-of-focus image of step 72 multiplied by emulation out-of-focus image, Fu of image after being corrected In leaf transformation, finally in step 73 to the result application inverse Fourier transform, then the out-of-focus image after available correction.
Figure 10 is the logical burnt scan image of flow chart of logical burnt scan image establishment step really by out-of-focus image sequence heap One two-dimensional section figure of three-dimensional scattering intensity distribution data collection made of folded, its X-axis represent the true of each position of sample to be tested Real space position, Y-axis represent the corresponding focal position of each out-of-focus image, and gray value represents normalization light intensity.Wherein step 81 Operation is normalized to the out-of-focus image containing target with smooth background out-of-focus image, the background of obtained normalization out-of-focus image Area grayscale value tends to 0, is conducive to eliminate the influence that illumination light light-intensity variation generates in collection process.Step 82 extracts strong Spending contour curve is being averaged for the secondary region light intensity, therefore any change in size less than the secondary region cannot be resolved. Step 83 and step 84 are caused respectively to burnt scan image progress interpolation and smothing filtering is known a little about made of stacking with eliminating to stack Discontinuity.
Figure 11 is that logical burnt scan image compares and the size of the flow chart of information extracting step to be measured extraction object to be measured is believed Breath is really the process of a reverse temperature intensity, first by the logical burnt image of object to be measured and the system obtained by Forward modeling The logical burnt image of column emulation is matched, obtain it is a series of quantitatively match index, then establish the fitting function of these matching indexs, The dimension information of object to be measured is extracted by finding the corresponding moulded dimension of fitting function minimum value.Wherein step 91 calculate to The difference between the logical burnt image of target and the logical burnt image of emulation is surveyed, as quantitative matching index.Step 92 refers to according to matching Target distribution situation selects quadratic function or spline function as fitting function.Step 93 digital simulation functional minimum value, when It needs to be further processed to search out optimal solution when there are multiple Local Extremums.
Shown in the drawings of some block diagrams and/or flow chart.It should be understood that some sides in block diagram and/or flow chart Frame or combinations thereof can be realized by computer program instructions.These computer program instructions can be supplied to general purpose computer, The processor of special purpose computer or other programmable data processing units, so that these instructions are when executed by this processor can be with Creation is for realizing function/operation device illustrated in these block diagrams and/or flow chart.
Therefore, the technology of the disclosure can be realized with the form of hardware and/or software (including firmware, microcode etc.). In addition, the technology of the disclosure can take the form of the computer program product on the computer-readable medium for being stored with instruction, The computer program product uses or combines instruction execution system for instruction execution system (for example, one or more processors) System uses.In the context of the disclosure, computer-readable medium, which can be, can include, store, transmitting, propagating or transmitting and refer to The arbitrary medium of order.For example, computer-readable medium can include but is not limited to electricity, magnetic, optical, electromagnetic, infrared or semiconductor system System, device, device or propagation medium.The specific example of computer-readable medium includes: magnetic memory apparatus, such as tape or hard disk (HDD);Light storage device, such as CD (CD-ROM);Memory, such as random access memory (RAM) or flash memory;And/or wired/ Wireless communication link ".
While there has been shown and described that example embodiments of the present invention, it will be appreciated by those skilled in the art that not carrying on the back In the case where from the scope and spirit of the present invention limited in appended claims and their equivalents, these example embodiments can be done Variation on various forms and details out.

Claims (10)

1. a kind of optical micro/nano measuring device, it is characterised in that:
It include: reflective Kohler illumination and imaging moiety;With
Object lens position portion,
Wherein reflective Kohler illumination and imaging moiety include:
Light source;
First object lens, are placed in front of light source, for assembling illumination light;
Aperture is placed in front of first object lens;
First lens are placed in front of the aperture, are used to form collimated light path;
Second lens are placed in front of first lens, are used for and the first lens forming 4f system;
Polarizing film is placed in collimated light path;
Amici prism is placed in after the polarizing film;With
The third lens are placed in after second lens;
4th lens are placed in the third lens rear, for forming 4f system with the third lens;
Plane mirror;
Second object lens, for generating reflective Kohler illumination and imaging;With
CCD is imaged,
Object lens position portion includes: piezoelectric positioner, is connect with second object lens, for making second object lens along optical axis The purpose of logical burnt scanning is realized in lower scanning;With
Control unit controls the piezoelectric positioner.
2. measuring system according to claim 1, it is characterised in that: the light source, first object lens and the aperture A light-source system is constituted, illumination light sent from the light source is converged to the small hole center, institute by first object lens Stating aperture becomes divergent illumination light for convergence illumination light again.
3. measuring device according to claim 1, it is characterised in that:
First lens and second lens constitute 4f system, the 4f of first lens and second lens composition The incident focal plane of system is overlapped with plane where the small hole center, the 4f of first lens and second lens composition The outgoing focal plane of system is overlapped with the conjugation back focal plane of second object lens, by adjusting hole diameter size, to obtain The reflective Kohler illumination mode of different incident numerical apertures.
4. measuring device according to claim 1, it is characterised in that:
The polarizing film is placed between first lens and second lens, for different types of sample to be tested, is led to The light passing axis direction of adjustment polarizing film is crossed, to obtain optimal measurement sensitivity.
5. measuring device according to claim 1, it is characterised in that:
The control unit controls the piezoelectric positioner, so that second object lens are scanned up and down along optical axis and realized logical Coke scanning does not generate any influence, while mechanical noise caused by the mechanical displacement of the measuring device itself to objective table And optical noise caused by required swash width internal cause defocus is smaller, influences on the precision of measurement result smaller.
6. a kind of method for extracting structure micro-nano dimension information to be measured, it is characterised in that:
Include:
Analog image simulation process, for generating the emulation out-of-focus image sequence of composition search library;
Actual image acquisition step, for acquiring the out-of-focus image sequence to geodesic structure;
Real image aligning step, for removing in real image by the introduced optical noise of external interference and mechanical noise;
Logical coke scan image establishment step;With
Logical coke scan image compares and information extracting step to be measured.
7. the method according to claim 6 for extracting structure micro-nano dimension information to be measured, it is characterised in that:
It is first a series of planes by Kohler illumination photodegradation using full vector calculation method in analog image simulation process Then wave component calculates the corresponding NEAR FIELD SCATTERING distribution of each plane wave component, recycles Abbe theory of image formation to calculate each The Far-Zone Field Transformation of a near field distribution and as plane distribution is finally overlapped synthesis and obtains final ideal analog image.
8. the method according to claim 6 for extracting structure micro-nano dimension information to be measured, it is characterised in that:
In actual image acquisition step,
By control piezoelectric positioner, make object lens after each swash width by feedback compensation return to initial position without It must manually adjust, meet quick duplicate measurements needs.
9. the method according to claim 6 for extracting structure micro-nano dimension information to be measured, it is characterised in that:
In real image aligning step, using the thought of Fourier transformation, it respectively is isolated by Noise real image and ideal The frequency spectrum and phase of analog image, and by the spectral combination of the phase of Noise real image and ideal analog image, to eliminate By the introduced optical noise of external interference and mechanical noise in former real image.
10. a kind of computer readable storage medium is stored thereon with executable instruction, described instruction is in one or more processors When execution, one or more of processor perform claims can be made to require described in 6~9 for extracting structure micro-nano to be measured The method of dimension information.
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