CN114251933B - Full-automatic semiconductor heating equipment - Google Patents
Full-automatic semiconductor heating equipment Download PDFInfo
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- CN114251933B CN114251933B CN202111567990.3A CN202111567990A CN114251933B CN 114251933 B CN114251933 B CN 114251933B CN 202111567990 A CN202111567990 A CN 202111567990A CN 114251933 B CN114251933 B CN 114251933B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 53
- 238000010438 heat treatment Methods 0.000 title claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 46
- 230000009471 action Effects 0.000 claims abstract description 11
- 238000001035 drying Methods 0.000 claims abstract description 11
- 238000004140 cleaning Methods 0.000 claims description 40
- 230000005540 biological transmission Effects 0.000 claims description 16
- 230000007246 mechanism Effects 0.000 claims description 14
- 238000007599 discharging Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 230000000740 bleeding effect Effects 0.000 claims description 5
- 230000006978 adaptation Effects 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 2
- 230000033001 locomotion Effects 0.000 abstract description 10
- 230000032258 transport Effects 0.000 abstract description 6
- 230000008859 change Effects 0.000 abstract description 2
- 230000003044 adaptive effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 230000009349 indirect transmission Effects 0.000 description 3
- 240000007232 Illicium verum Species 0.000 description 2
- 235000008227 Illicium verum Nutrition 0.000 description 2
- 230000002337 anti-port Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B9/00—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards
- F26B9/10—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards in the open air; in pans or tables in rooms; Drying stacks of loose material on floors which may be covered, e.g. by a roof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/001—Handling, e.g. loading or unloading arrangements
- F26B25/003—Handling, e.g. loading or unloading arrangements for articles
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B3/00—Drying solid materials or objects by processes involving the application of heat
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microbiology (AREA)
- Drying Of Solid Materials (AREA)
Abstract
The invention discloses full-automatic semiconductor heating equipment, and relates to the technical field of semiconductors. The inner rotating wheel is driven to rotate by the starting of the driving motor, so as to drive the movement wheel of the maltese machine to rotate, because the inner rotating wheel and the Maltese machine core wheel are in adaptive rotation, the rotation of the inner rotating wheel drives the outer long rod to swing, the rotating connecting rod is pulled to swing, the rotating connecting rod is in rotational connection with the material sucking support to drive the material sucking support to do right-angle rotational motion, the sucker panel on the material sucking support is aligned with the surface sucking panel on the octagonal rotating roller to suck or collect and release, the octagonal rotating roller intermittently rotates under the action of the driving motor, and when the surface sucking panel on the octagonal rotating roller which intermittently rotates reaches the uppermost surface, the drying opening heats the octagonal rotating roller, the intermittent type rotates and transports, utilizes unloading subassembly reverse operation to take for unloading all is and goes up unloading on it, replaces artifical unloading, and manual change is automatic, has improved work efficiency greatly.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a full-automatic semiconductor heating device.
Background
The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, etc., for example, diodes are devices fabricated using semiconductors. The importance of semiconductors is enormous, both from a technological and economic point of view. Most electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to a semiconductor. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., with silicon being one of the most influential of various semiconductor material applications.
Traditional semiconductor need heat the operation to it in the course of working and producing, and traditional firing equipment has certain defect, and it can not heat the unloading of material loading mode that generally adopts artifical material loading, has increased the material loading time, extension production time, increase cost.
Disclosure of Invention
The invention provides a full-automatic semiconductor heating device, which solves the problems in the prior art.
In order to achieve the purpose, the invention is realized by the following technical scheme: a full-automatic semiconductor heating device comprises a lower base plate, wherein an inner transmission mechanism is arranged on the upper surface of the lower base plate, a first conveying belt and a second conveying belt are respectively arranged on the upper surface of the lower base plate and positioned on two sides of the inner transmission mechanism, a heating case is fixedly arranged on the upper side of the lower base plate by virtue of a supporting column, a drying opening is formed in the bottom of the heating case, and a cleaning machine is arranged at the bottom of the inner transmission mechanism; interior drive mechanism is including setting up the rotating turret subassembly of transporting the semiconductor in the middle part of the lower plate, the both sides of rotating turret subassembly are provided with material loading subassembly and unloading subassembly respectively to material loading subassembly and unloading subassembly rely on rotating turret subassembly central symmetry to set up, and the driving motor antiport in material loading subassembly and the unloading subassembly realizes different transportation effects, and the semiconductor after the second conveyer belt transports the unloading subassembly is transported away.
As a further scheme of the invention: the feeding assembly comprises first inner support rods, second inner support rods and a driving motor, wherein the first inner support rods are fixedly arranged on the lower bottom plate, the number of the first inner support rods is two, the upper ends of the two first inner support rods are respectively and rotatably provided with a rotating slider, the first inner support rods are rotatably and slidably provided with a material sucking support by virtue of the rotating sliders, the second inner support rods are rotatably provided with rotating connecting rods, the driving end of the driving motor is rotatably provided with an inner rotating wheel, a Maltese core wheel is rotatably arranged right above the inner rotating wheel, the upper ends of the rotating connecting rods are rotatably connected with the material sucking support, the lower ends of the rotating connecting rods are rotatably connected with one end of an outer long rod, the other end of the outer long rod is rotatably connected with the inner rotating wheel, and the semiconductor feeding action is realized on the whole;
the inner rotating wheel is driven to rotate by starting the driving motor, and then the Maltese machine core wheel is driven to rotate, the inner rotating wheel and the Maltese machine core wheel are matched and rotated to ensure the vertical direction of one surface, meanwhile, the rotation of the inner rotating wheel drives the outer long rod to swing, the rotating connecting rod is pulled to swing, the rotating connecting rod is rotatably connected with the material sucking support to drive the material sucking support to do right-angle rotation motion, a sucker panel on the material sucking support is aligned with a surface sucking panel on the octagonal rotating roller to suck or retract, a semiconductor is conveyed to the surface sucking panel from the first conveying belt, the octagonal rotating roller intermittently rotates under the action of the driving motor, when the surface sucking panel on the octagonal rotating roller intermittently rotates to the uppermost surface, a drying opening heats the octagonal rotating roller, the octagonal rotating roller intermittently rotates and transports the semiconductor, the feeding and discharging assembly reversely operates to take the feeding and discharging materials on the octagonal rotating roller, and the feeding and discharging are both the feeding and discharging of the octagonal rotating roller, the manual feeding and discharging are replaced, the manual feeding and discharging is changed into the automatic feeding and discharging, and the working efficiency is greatly improved.
As a further scheme of the invention: the overall structure of the blanking assembly is the same as that of the feeding assembly, so that the overall universality of the device is ensured.
As a further scheme of the invention: the rotating turret subassembly is including fixing the support frame on the lower plate, the support frame is provided with two on the lower plate, rotates between two support frames and is provided with eight star anise live-rollers, eight of eight star anise live-rollers are equipped with on the surface and inhale a panel, and the carrier is transported in the middle of the rotating turret subassembly effect, needs to possess certain high temperature resistance physical characteristic.
As a further scheme of the invention: inhale the material support and include two side supports, the same one of two side supports is served and is fixed and be provided with the sucking disc panel, the sucking disc panel is close to one of side support and serves the fixed panel of bleeding that is provided with, has all seted up the spout mouth on every side support to spout mouth and rotation between the slider looks adaptation, the action of bleeding can be carried out to the inside of side support, with the sucking disc panel from first conveyer belt absorption semiconductor.
As a further scheme of the invention: the rotating connecting rod comprises a connecting shaft which is rotatably arranged in the second inner supporting rod, an upper rotating connecting rod is fixedly arranged on the upper side of one end of the connecting shaft, a lower rotating connecting rod is fixedly arranged on the lower side of the other end of the connecting shaft, and an included angle between the upper rotating connecting rod and the lower rotating connecting rod is an obtuse angle, so that the rotating stability of force is ensured, and the force direction cannot be changed due to the deviation of the angle.
As a further scheme of the invention: the internal rotation wheel main part sets up the interior runner main part on the support frame including rotating, the fixed connecting rod that is provided with in one side of interior runner main part, the fixed connecting rod that is provided with down of opposite side of interior runner main part, it sets up for the obtuse angle to go up between connecting rod and the lower connecting rod, go up the fixed restriction piece that is provided with on the port that interior runner main part was kept away from to connecting rod and lower connecting rod, ensure the intermittent rotation stability between interior runner and the maltese core wheel.
As a further scheme of the invention: synchronous rotation is guaranteed between the malta machine core wheel and the octagonal rotating roller.
As a further scheme of the invention: the cleaning machine comprises two tripods, three internal rotating rollers are rotatably arranged between the two tripods, a cleaning belt is jointly arranged outside the three internal rotating rollers, a lower support is fixedly arranged at the bottom of each tripod, a cleaning pool is fixedly arranged at the bottom of each cleaning belt and positioned on the upper side of the lower bottom plate, and the upper surface of each cleaning belt is connected with the surface of the suction surface panel.
As a further scheme of the invention: the working method comprises the following steps:
step S1: placing the semiconductor workpieces in the previous procedure on a first conveying belt in sequence, and carrying out indirect transmission on the first conveying belt;
step S2: after the intermittent transmission of the first conveying belt is stopped, the driving motor is started, the starting of the driving motor drives the inner rotating wheel to rotate, and further drives the maltese core wheel to rotate, the inner rotating wheel and the maltese core wheel rotate in a matched mode, and the maltese core wheel ensures 45-degree rotation, so that the vertical direction of one surface is ensured, meanwhile, the rotation of the inner rotating wheel drives the outer long rod to swing, the rotating connecting rod is pulled to swing, the rotating connecting rod is rotatably connected with the material sucking support, the material sucking support is driven to rotate in a right angle mode, the sucker panel on the material sucking support is aligned with the surface sucking panel on the octagonal rotating roller to suck or retract, semiconductors are conveyed to the surface sucking panel from the first conveying belt, and the octagonal rotating roller rotates intermittently under the action of the driving motor;
step S3: when the surface suction panel on the octagonal rotating roller rotating intermittently rotates to the uppermost surface, the drying port heats the octagonal rotating roller rotating intermittently, and the octagonal rotating roller rotating intermittently transfers the octagonal rotating roller to take the octagonal rotating roller by utilizing the reverse operation of the blanking assembly.
The invention provides a full-automatic semiconductor heating device. Compared with the prior art, the method has the following beneficial effects:
1. a full-automatic semiconductor heating device drives an inner rotating wheel to rotate by starting a driving motor, and further drives a Maltese core wheel to rotate, the inner rotating wheel and the Maltese core wheel are matched to rotate, and the Maltese core wheel ensures 45-degree rotation, so that the vertical direction of one surface is ensured, meanwhile, the rotation of the inner rotating wheel drives an outer long rod to swing, a rotating connecting rod is pulled to swing, the rotating connecting rod is rotatably connected with a material suction support, so as to drive the material suction support to do right-angle rotation motion, a sucker panel on the material suction support is aligned with a surface suction panel on an octagonal rotating roller to suck or retract, a semiconductor is conveyed to the surface suction panel from a first conveying belt, the octagonal rotating roller intermittently rotates under the action of the driving motor, when the surface suction panel on the octagonal rotating roller which intermittently rotates reaches the uppermost surface, a drying opening heats the semiconductor, the intermittent type rotates and transports, utilizes unloading subassembly reverse operation to take for unloading all is and goes up unloading on it, replaces artifical unloading, and manual change is automatic, has improved work efficiency greatly.
2. It is continuous with external driving motor through interior commentaries on classics roller, the rotation of interior commentaries on classics roller drives the cleaning tape and rotates, the cleaning tape contacts with the bottom of inhaling the face panel, inhale the face panel pivoted while the rotation of cleaning tape also cleans the performance of face panel, cleaning tape after cleaning simultaneously utilizes clean pond to wash the cleaning tape surface, the convenience is to the cleaning of cleaning tape, wholly guarantees the clean degree on its surface, prevents that impurity from producing the influence to the heating of semiconductor.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the internal transmission mechanism of the present invention;
FIG. 3 is a schematic view of a loading assembly according to the present invention;
FIG. 4 is a schematic view of the suction support structure of the present invention;
FIG. 5 is a schematic view of a rotating link structure according to the present invention;
FIG. 6 is a schematic view of an inner rotor structure according to the present invention;
FIG. 7 is a schematic view of a turret block assembly according to the present invention;
FIG. 8 is a schematic view of the structure of the cleaning machine of the present invention.
In the figure: 1. heating the chassis; 2. a support column; 3. a first conveyor belt; 4. a lower base plate; 5. an internal transmission mechanism; 51. a feeding assembly; 511. a material sucking support; 5111. a side bracket; 5112. a chute opening; 5113. an air extraction panel; 5114. a suction cup panel; 512. rotating the slide block; 513. a first inner support strut; 514. rotating the connecting rod; 5141. rotating the connecting rod upwards; 5142. a connecting shaft; 5143. a lower rotating connecting rod; 515. a second inner support strut; 516. an outer long rod; 517. a drive motor; 518. an inner runner; 5181. an inner rotary wheel main body; 5182. a lower connecting rod; 5183. an upper connecting rod; 5184. a limiting block; 519. a maltese core wheel; 52. a turret assembly; 521. an octagonal turning roll; 522. a suction surface panel; 523. a support frame; 53. a blanking assembly; 6. a second conveyor belt; 7. drying the opening; 8. a cleaning machine; 81. an internal rotating roller; 82. a cleaning belt; 83. a tripod; 84. a lower bracket; 85. and (5) cleaning the pool.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description of the embodiments, structures, features and effects according to the present invention will be given with reference to the accompanying drawings and preferred embodiments.
Referring to fig. 1 to 8, a full-automatic semiconductor heating device includes a lower plate 4, an inner transmission mechanism 5 is disposed on an upper surface of the lower plate 4, a first conveyor belt 3 and a second conveyor belt 6 are respectively disposed on the upper surface of the lower plate 4 and on two sides of the inner transmission mechanism 5, a heating cabinet 1 is fixedly disposed on the upper surface of the lower plate 4 by means of a support column 2, a drying opening 7 is disposed at the bottom of the heating cabinet 1, and a cleaning machine 8 is disposed at the bottom of the inner transmission mechanism 5; interior drive mechanism 5 is including setting up the rotating turret subassembly 52 of transporting the semiconductor in the middle part of lower plate 4, the both sides of rotating turret subassembly 52 are provided with material loading subassembly 51 and unloading subassembly 53 respectively to material loading subassembly 51 and unloading subassembly 53 rely on rotating turret subassembly 52 central symmetry to set up, and driving motor 517 antiport in material loading subassembly 51 and the unloading subassembly 53 realizes different transportation effects, and the semiconductor after second conveyer belt 6 transports unloading subassembly 53 is transported away.
The feeding assembly 51 comprises a first inner supporting rod 513, a second inner supporting rod 515 and a driving motor 517 which are fixedly arranged on the lower bottom plate 4, two first inner supporting rods 513 are arranged, the upper ends of the two first inner supporting rods 513 are respectively provided with a rotating sliding block 512 in a rotating way, the first inner supporting rod 513 is rotatably and slidably provided with a material sucking bracket 511 by virtue of a rotating slide block 512, a rotating connecting rod 514 is rotatably arranged on the second inner supporting rod 515, an inner rotating wheel 518 is rotatably arranged on the driving end of the driving motor 517, a maltese movement wheel 519 is rotatably arranged right above the inner rotating wheel 518, the upper end of the rotating connecting rod 514 is rotatably connected with the material suction bracket 511, the lower end of the rotating connecting rod 514 is rotatably connected with one end of the outer long rod 516, the other end of the outer long rod 516 is rotatably connected with the inner rotating wheel 518, and the whole semiconductor loading action is realized.
The blanking assembly 53 and the feeding assembly 51 have the same integral structure, and the overall universality of the device is ensured.
The rotating frame component 52 comprises two support frames 523 fixed on the lower bottom plate 4, the two support frames 523 are arranged on the lower bottom plate 4, the octagonal rotating rollers 521 are arranged between the two support frames 523 in a rotating mode, eight surfaces of the octagonal rotating rollers 521 are provided with face suction panels 522, and the rotating frame component 52 acts on a middle transfer carrier and needs to have certain high-temperature-resistant physical characteristics.
The rotation link 514 includes a connection shaft 5142 rotatably disposed in the second inner support bar 515, an upper rotation link 5141 is fixedly disposed on an upper side of one end of the connection shaft 5142, a lower rotation link 5143 is fixedly disposed on a lower side of the other end of the connection shaft 5142, and an included angle between the upper rotation link 5141 and the lower rotation link 5143 is an obtuse angle, so that the rotational stability of the force is ensured, and the direction of the force cannot be changed due to deviation of the angle.
The inner rotating wheel 518 comprises an inner rotating wheel body 5181 which is rotatably arranged on the support frame 523, an upper connecting rod 5183 is fixedly arranged on one side of the inner rotating wheel body 5181, a lower connecting rod 5182 is fixedly arranged on the other side of the inner rotating wheel body 5181, an obtuse angle is formed between the upper connecting rod 5183 and the lower connecting rod 5182, a limiting block 5184 is fixedly arranged on a port, far away from the inner rotating wheel body 5181, of the upper connecting rod 5183 and the lower connecting rod 5182, and intermittent rotation stability between the inner rotating wheel 518 and the maltese movement wheel 519 is ensured.
The cleaning machine 8 comprises two tripods 83, three internal rotating rollers 81 are rotatably arranged between the two tripods 83, a cleaning belt 82 is jointly arranged outside the three internal rotating rollers 81, a lower bracket 84 is fixedly arranged at the bottom of each tripod 83, a cleaning pool 85 is fixedly arranged at the bottom of each cleaning belt 82 and on the upper side of the lower bottom plate 4, the upper surface of each cleaning belt 82 is in contact with the surface of the suction panel 522, the internal rotating rollers 81 are connected with an external driving motor, the cleaning belts 82 are driven to rotate by the rotation of the internal rotating rollers 81, the cleaning belts 82 are in contact with the bottom of the suction panel 522, the cleaning belts 82 are rotated while the suction panel 522 rotates to wipe and clean the surface of the suction panel 522, and the cleaning belts 82 after being wiped clean are used for cleaning the surface of the cleaning belts 82 by the cleaning pool 85, so that the cleaning of the cleaning belts 82 is convenient and the cleanness of the surfaces of the cleaning belts 82 is ensured integrally, preventing impurities from affecting the heating of the semiconductor.
Synchronous rotation is ensured between the maltese movement wheel 519 and the octagonal turning roller 521.
The working method comprises the following steps:
step S1: placing the semiconductor workpieces in the previous procedure on a first conveying belt 3 in sequence, and carrying out indirect transmission on the first conveying belt 3;
step S2: after the intermittent transmission of the first conveying belt 3 is stopped, the driving motor 517 is started, the driving motor 517 drives the inner rotating wheel 518 to rotate, so as to drive the maltese core wheel 519 to rotate, the inner rotating wheel 518 and the maltese core wheel 519 rotate in a matched mode, so that the maltese core wheel 519 ensures 45-degree rotation, the vertical direction of one surface is ensured, meanwhile, the rotation of the inner rotating wheel 518 drives the outer long rod 516 to swing, the rotating connecting rod 514 is pulled to swing, the rotating connecting rod 514 is rotatably connected with the material sucking support 511, the material sucking support 511 is driven to rotate at right angles, the sucker panel 5114 on the material sucking support 511 is aligned with the material sucking panel 522 on the octagonal rotating roller 521 to suck or collect, semiconductors are conveyed to the material sucking panel 522 from the first conveying belt 3, and the octagonal rotating roller 521 rotates intermittently under the action of the driving motor 517;
step S3: when the surface suction panel 522 on the octagonal rotating roller 521 intermittently rotates to the uppermost surface, the drying port 7 heats the surface suction panel, and the surface suction panel is intermittently rotated and transferred and is reversely operated by the blanking assembly 53 to be taken.
When the invention is used, semiconductor workpieces in a previous process are sequentially placed on a first conveying belt 3, the first conveying belt 3 carries out indirect transmission, after the intermittent transmission of the first conveying belt 3 is stopped, a driving motor 517 is started, the starting of the driving motor 517 drives an inner rotating wheel 518 to rotate, and further drives a maltese movement wheel 519 to rotate, as the inner rotating wheel 518 and the maltese movement wheel 519 rotate in a matching way, the maltese movement wheel 519 ensures 45-degree rotation, the vertical direction of one surface is ensured, meanwhile, the rotation of the inner rotating wheel 518 drives an outer long rod 516 to swing, a rotating connecting rod 514 is pulled to swing, the rotating connecting rod 514 is rotatably connected with a material suction bracket 511 to drive the material suction bracket 511 to rotate, meanwhile, a rotating sliding block 512 on a first inner supporting rod 513 is slidably arranged in a sliding groove port 5112 on the material suction bracket 511, and when the rotating connecting rod 514 drives the material suction bracket 511 to swing, the rotating block 512 limits the chute opening 5112 of the suction frame 511, so that one end of the suction frame 511 slides and rotates on the first inner supporting rod 513, the other end is lifted up under the limit of the rotating link 514, due to the length limitation of the rotating connecting rod 514, the material sucking bracket 511 is changed from vertical to horizontal under the limitation of the rotating slide block 512 and the rotating connecting rod 514, the rotating angle is 90 degrees, the sucker panel 5114 on the material sucking bracket 511 sucks or collects the semiconductor aligned with the suction panel 522 on the octagonal rotating roller 521, the semiconductor is transferred to the suction panel 522 from the first conveying belt 3, the octagonal rotating roller 521 rotates intermittently under the action of the driving motor 517, when the suction panel 522 on the octagonal rotating roller 521 rotating intermittently reaches the uppermost surface, drying port 7 heats it, transports at intermittent type rotation, utilizes unloading subassembly 53 reverse operation to take.
Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A full-automatic semiconductor heating equipment, includes lower plate (4), its characterized in that: an inner transmission mechanism (5) is arranged on the upper surface of the lower bottom plate (4), a first conveying belt (3) and a second conveying belt (6) are respectively arranged on the upper surface of the lower bottom plate (4) and positioned at two sides of the inner transmission mechanism (5), the upper side of the lower bottom plate (4) is fixedly provided with a heating case (1) by virtue of a supporting column (2), the bottom of the heating case (1) is provided with a drying opening (7), and the bottom of the inner transmission mechanism (5) is provided with a cleaning machine (8); the inner transmission mechanism (5) comprises a rotating frame assembly (52) arranged in the middle of the lower bottom plate (4) and used for transferring semiconductors, a feeding assembly (51) and a discharging assembly (53) are respectively arranged on two sides of the rotating frame assembly (52), and the feeding assembly (51) and the discharging assembly (53) are arranged in a centrosymmetric mode by means of the rotating frame assembly (52);
the feeding assembly (51) comprises first inner supporting rods (513), second inner supporting rods (515) and driving motors (517) which are fixedly arranged on a lower bottom plate (4), the number of the first inner supporting rods (513) is two, the upper ends of the two first inner supporting rods (513) are respectively and rotatably provided with a rotating sliding block (512), the first inner supporting rods (513) are rotatably and slidably provided with a material sucking support (511) by virtue of the rotating sliding blocks (512), the second inner supporting rods (515) are rotatably provided with rotating connecting rods (514), the driving ends of the driving motors (517) are rotatably provided with inner rotating wheels (518), core wheels (519) of the Malta instruments are rotatably arranged right above the inner rotating wheels (518), the upper ends of the rotating connecting rods (514) are rotatably connected with the material sucking supports (511), and the lower ends of the rotating connecting rods (514) are rotatably connected with one end of an outer long rod (516), the other end of the outer long rod (516) is rotatably connected with the inner rotating wheel (518).
2. The fully automatic semiconductor heating apparatus according to claim 1, wherein: the blanking assembly (53) and the feeding assembly (51) are identical in integral structure.
3. The fully automatic semiconductor heating apparatus according to claim 1, wherein: the rotating frame assembly (52) comprises two supporting frames (523) fixed on the lower bottom plate (4), the two supporting frames (523) are arranged on the lower bottom plate (4), an octagonal rotating roller (521) is rotatably arranged between the two supporting frames (523), and eight surfaces of the octagonal rotating roller (521) are provided with face suction panels (522).
4. The fully automatic semiconductor heating apparatus according to claim 1, wherein: inhale material support (511) and include two side support (5111), the same one of two side support (5111) is served and is fixed and be provided with sucking disc panel (5114), sucking disc panel (5114) are close to one of side support (5111) and serve fixed being provided with panel (5113) of bleeding, have all seted up spout opening (5112) on every side support (5111) to the looks adaptation between spout opening (5112) and rotation slider (512).
5. The fully automatic semiconductor heating apparatus according to claim 1, wherein: the rotating connecting rod (514) comprises a connecting shaft (5142) which is rotatably arranged in the second inner supporting rod (515), an upper rotating connecting rod (5141) is fixedly arranged on the upper side of one end of the connecting shaft (5142), a lower rotating connecting rod (5143) is fixedly arranged on the lower side of the other end of the connecting shaft (5142), and an included angle between the upper rotating connecting rod (5141) and the lower rotating connecting rod (5143) is an obtuse angle.
6. The fully automatic semiconductor heating apparatus according to claim 1, wherein: interior runner (518) are including rotating inner rotary wheel main part (5181) that sets up on support frame (523), the fixed connecting rod (5183) that is provided with in one side of inner rotary wheel main part (5181), the fixed connecting rod (5182) down that is provided with in opposite side of inner rotary wheel main part (5181), go up the obtuse angle setting between connecting rod (5183) and lower connecting rod (5182), go up connecting rod (5183) and lower connecting rod (5182) and keep away from on the port of inner rotary wheel main part (5181) fixed being provided with restriction piece (5184).
7. The fully automatic semiconductor heating apparatus according to claim 1, wherein: the malta machine core wheel (519) and the octagonal rotating roller (521) ensure synchronous rotation.
8. The fully automatic semiconductor heating apparatus according to claim 1, wherein: the cleaning machine (8) comprises two tripods (83), three internal rotating rollers (81) are arranged between the two tripods (83) in a rotating mode, a cleaning belt (82) is arranged outside the three internal rotating rollers (81) together, a lower support (84) is fixedly arranged at the bottom of each tripod (83), a cleaning pool (85) is fixedly arranged at the bottom of each cleaning belt (82) and positioned on the upper side of the lower base plate (4), and the upper surface of each cleaning belt (82) is in contact with the surface of the suction surface panel (522).
9. The fully automatic semiconductor heating apparatus according to claim 1, wherein: the working method comprises the following steps:
step S1: placing the semiconductor workpieces in the previous process on a first conveyer belt (3) in sequence, and indirectly transmitting the first conveyer belt (3);
step S2: after the intermittent transmission of the first conveying belt (3) is stopped, a driving motor (517) is started, the driving motor (517) is started to drive an inner rotating wheel (518) to rotate and further drive a Maltese core wheel (519) to rotate, the inner rotating wheel (518) and the Maltese core wheel (519) are matched to rotate, the Maltese core wheel (519) ensures 45-degree rotation, the vertical direction of one surface is ensured, meanwhile, the rotation of the inner rotating wheel (518) drives an outer long rod (516) to swing, a rotating connecting rod (514) is pulled to swing, the rotating connecting rod (514) is in rotating connection with a suction support (511) to drive the suction support (511) to perform right-angle rotation, a suction cup panel (5114) on the suction support (511) is aligned with a suction surface panel (522) on an octagonal roller (521) to suck or collect and release semiconductors, and the semiconductors are conveyed to the suction surface panel (522) from the first conveying belt (3), the octagonal rotating roller (521) intermittently rotates under the action of the driving motor (517);
step S3: when the surface suction panel (522) on the octagonal rotating roller (521) which intermittently rotates reaches the uppermost surface, the drying port (7) heats the surface suction panel, and the surface suction panel is transferred in intermittent rotation and taken by utilizing the reverse operation of the blanking assembly (53).
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| CN114251933B true CN114251933B (en) | 2022-09-13 |
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| CN109770792A (en) * | 2019-01-29 | 2019-05-21 | 南通理工学院 | A kind of intelligence manufacture workshop floor cleaning device |
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| CN114251933A (en) | 2022-03-29 |
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Denomination of invention: A fully automatic semiconductor heating equipment Effective date of registration: 20230907 Granted publication date: 20220913 Pledgee: BINHAI YIRUN ELECTRONICS CO.,LTD. Pledgor: YANCHENG XIRUN SEMICONDUCTOR Co.,Ltd. Registration number: Y2023980055661 |