CN114248003B - Micro part laser processing technique - Google Patents
Micro part laser processing technique Download PDFInfo
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- CN114248003B CN114248003B CN202111674897.2A CN202111674897A CN114248003B CN 114248003 B CN114248003 B CN 114248003B CN 202111674897 A CN202111674897 A CN 202111674897A CN 114248003 B CN114248003 B CN 114248003B
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- 238000012545 processing Methods 0.000 title claims abstract description 84
- 238000000034 method Methods 0.000 title claims abstract description 56
- 229920006267 polyester film Polymers 0.000 claims abstract description 70
- 238000001179 sorption measurement Methods 0.000 claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 abstract description 6
- 238000010923 batch production Methods 0.000 abstract description 2
- 238000003698 laser cutting Methods 0.000 abstract description 2
- 238000003754 machining Methods 0.000 description 9
- 230000000007 visual effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005183 environmental health Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
- B23K37/0443—Jigs
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a process method for laser processing of micro parts, which comprises the following steps: attaching a first polyester film on the second surface of the blank; performing first limiting; manufacturing a first surface microstructure and a through hole on the first surface, and attaching a second polyester film on the first surface with the first surface microstructure; after attaching a second polyester film on the first surface, removing the first polyester film; placing one surface of the blank with the second polyester film on a negative pressure adsorption table for second limiting; obtaining a second surface microstructure; cutting out the shape of the part, and stripping off the leftover materials to obtain the micro part. According to the technical method for laser processing of the micro-parts, the polyester film is used for clamping the micro-parts, so that laser cutting through is prevented from damaging the adsorption table, the production cost is reduced, the negative pressure adsorption table is adopted to absorb blank processing, the positioning mark is matched with the laser system, the processing precision is improved, the method is suitable for batch production of the micro-parts, the production efficiency is improved, and the labor cost is reduced.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a process method for laser processing of micro parts.
Background
With the development of society and the progress of technology, micro parts and products are widely applied to industries such as electronic consumer goods, medical treatment, precise instruments, environmental energy sources, electronic information, aerospace, weaponry and the like, and are closely related to national security and environmental health. The manufacturing of the miniature product has important scientific significance and application potential, and the micro-forming technology has low production cost, high efficiency and good processing quality and has great development potential.
Micromachine parts with dimensions of tens of micrometers to one millimeter are widely required in the fields of precision machinery, medical equipment, 5G mobile communication equipment, and the like. The sub-millimeter level is not only the external dimensions of the part, but also the micro-structure of sub-millimeter level is required on both sides of the part. The material of the component is usually copper, aluminum, stainless steel or metal alloy material, or ceramic material such as aluminum oxide, silicon nitride, etc., and the raw material is usually flake-shaped. If the ceramic is machined by a mechanical method, the part is too small to clamp, and the ceramic material is broken due to the stress of the cutter; if chemical etching is used, the accuracy of the microstructure is difficult to control, and chemical processing of nonmetallic materials often involves highly toxic vapor species. The ultrafast laser is suitable for processing the miniature parts, but the positioning of product clamping and turning processing and the like still have difficulties.
Disclosure of Invention
In order to overcome the defects in the prior art, the embodiment of the invention provides a technical method for micro part laser processing, which is used for solving the problems of difficult product clamping, turn-over and positioning in micro part processing.
The invention discloses a process method for laser processing of micro parts, which comprises the following steps:
attaching a first polyester film to a second surface of the blank, wherein the thickness of the blank is the same as the thickness of the finally formed part, and the blank is provided with a first surface and a second surface which are opposite in the thickness direction;
placing one surface of the blank with the first polyester film on a negative pressure adsorption table, so that the blank is limited for the first time through negative pressure;
when the blank is in a first limiting state, manufacturing a first surface microstructure and a through hole on the first surface, wherein the through hole is not overlapped with the finally formed part in the thickness direction, and the first polyester film is not cut through when the through hole is cut;
attaching a second polyester film on the first surface with the first surface microstructure;
after a second polyester film is stuck on the first surface, removing the first polyester film;
placing one surface of the blank with the second polyester film on a negative pressure adsorption table, so that the blank is subjected to second limiting through negative pressure;
and identifying the through holes, and processing the second surface by taking the through holes as first positioning marks so as to obtain the second surface microstructure.
Further, the above-mentioned process method for laser processing of micro parts, after the step of identifying the through hole and processing the second surface by using the through hole as the first positioning mark, further comprises the following steps:
cutting out the shape of the part, and completely cutting through the blank;
and stripping off the scraps to obtain the processed part.
Furthermore, in the above technical method for laser processing of micro parts, the first surface microstructure and the second surface microstructure are both groove structures.
Further, in the above-mentioned process method for laser processing of micro parts, the step of attaching a first polyester film to the second surface of the blank, wherein the thickness of the blank is the same as the thickness of the last formed part, the blank has a first surface and a second surface opposite to each other in the thickness direction, and multiple sets of positioning pin holes are simultaneously manufactured, the blank comprises multiple preset processing areas, the blank has the first surface and the second surface, the second surface is attached with the first polyester film, the negative pressure adsorption table is provided with a set of positioning pins, a set of positioning pin holes are sequentially sleeved on the positioning pins, and the first surface microstructure and the first positioning mark are manufactured in the corresponding processing area.
Furthermore, according to the technical method for the laser processing of the micro-parts, the laser system is positioned by adopting a field lens, a scanning galvanometer, an ultrafast pulse laser and a coaxial vision system.
Furthermore, in the above technical method for laser processing of micro parts, the distance between a group of positioning pins is larger than the size of a preset processing area, and the width of the first polyester film and the width of the second polyester film are smaller than the distance between a group of positioning pins.
In the above-mentioned method, the thickness of the blank is the same as the thickness of the final formed part, and the blank has a first surface and a second surface opposite to each other in the thickness direction, where the blank is preset with a machining area of m×n array, the blank is provided with the first surface and the second surface, the second surface is provided with the first polyester film, each machining area is provided with the first surface microstructure, and the blank is provided with a set of second positioning marks, preferably a set of second positioning marks are disposed on a set of diagonal corners of the blank.
Further, in an embodiment, in the above-described process method for laser processing of micro parts, an XY stage is disposed under the negative pressure adsorption stage, and the XY stage sequentially sends a plurality of processing areas to the lower side of the laser system, so as to complete laser processing of a plurality of preset processing areas.
Further, in the technical method for laser processing of the micro-parts in the embodiment, the laser system is positioned by a field lens, a scanning galvanometer, an ultrafast pulse laser and a paraxial vision system.
Further, in the above-mentioned process method for laser processing of micro parts, the range of the processing area is the effective working range of the field lens, and when the F100 field lens is selected, the normal working range is 50×50mm.
The beneficial effects of the invention are as follows:
1. according to the technical method for laser processing of the micro parts, the polyester film is used for clamping and fixing the blank and the micro parts in the laser processing process, the polyester film is prevented from damaging the adsorption table by laser cutting, and the production cost is reduced.
2. According to the technical method for laser processing of the micro parts, the negative pressure adsorption table is adopted for adsorbing and fixing blank processing, and the positioning mark is matched with the laser system to improve processing precision, so that the method is suitable for batch production of the micro parts, improves production efficiency and reduces labor cost.
The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments, as illustrated in the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the structure of a micro-component in an embodiment of the invention;
FIG. 2 is a schematic illustration of a single part blank conforming to a first polyester film in accordance with an embodiment of the present invention;
FIG. 3 is a schematic illustration of a single part blank after a first surfacing operation in accordance with an embodiment of the present invention;
FIG. 4 is a schematic illustration of a blank of a single part conforming to a second polyester film in accordance with one embodiment of the present invention;
FIG. 5 is a schematic illustration of a blank of a single part after a second machined microstructure is completed in accordance with an embodiment of the present invention;
FIG. 6 is a schematic illustration of a single part blank after completing a cut profile in accordance with a first embodiment of the present invention;
FIG. 7 is a schematic illustration of a single part of the first embodiment of the present invention after the trim strip has been removed;
FIG. 8 is a schematic diagram of a laser system and a negative pressure adsorption stage according to a second embodiment of the present invention;
FIG. 9 is a schematic diagram of a preset machining area in a second embodiment of the present invention;
FIG. 10 is a schematic illustration of a blank with a plurality of processing regions preset in a second embodiment of the invention;
FIG. 11 is a schematic illustration of a blank after first surfacing in accordance with the second embodiment of the invention;
FIG. 12 is a schematic illustration of a second polyester film attached to a first surface of a blank in accordance with the second embodiment of the invention;
FIG. 13 is a schematic view of a second surface finish of a blank according to a second embodiment of the invention;
FIG. 14 is a schematic view of a second embodiment of the present invention after the plurality of processing area blanks are stripped of scrap;
FIG. 15 is a schematic illustration of parts after peeling the second polyester film in accordance with embodiment II of the present invention;
FIG. 16 is a schematic view showing the structure of a laser system, an XY stage, and a negative pressure suction stage in a third embodiment of the present invention;
FIG. 17 is a schematic view of an array of large-format blank-machined parts in accordance with an embodiment of the present invention.
Reference numerals of the above drawings: 1-parts; 11-a first surface microstructure; 12-a second surface microstructure; 2-blank; 21-a through hole; 22-a first surface; 23-a second surface; 24-locating pin holes; 25-a second positioning mark; 3-a first polyester film; 4-a second polyester film; a 5-laser system; 51-F100 field lens; 52-scanning a galvanometer; 53-ultrafast pulsed laser; 54-a coaxial vision camera; 55-paraxial vision system; 6-a negative pressure adsorption table; 61-locating pins; 7-a processing area; 8-X axis; 9-Y axis.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, in the description of the present invention, the terms "first," "second," and the like are used for descriptive purposes only and to distinguish between similar objects, and there is no order of preference between them, nor should they be construed as indicating or implying relative importance. Furthermore, in the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
The following is a detailed description of the embodiments with reference to fig. 1 to 17.
Example 1
As shown in fig. 1, the part 1 in this example has a hexagonal shape of 1×1mm and a thickness of 0.08mm, and the first surface microstructure 11 and the second surface microstructure 12 of grooves of 0.02mm depth are formed on the opposite surfaces of the part near one side, respectively, and the blank 2 is a sheet of 0.08mm thickness.
The technical method for laser processing of the micro part comprises the following steps:
as shown in fig. 2, a first polyester film 3 with adhesiveness is attached to a second surface 23 of a blank 2, wherein the thickness of the blank 2 is the same as that of a part 1 to be finally formed, and the blank 2 has a first surface 22 and a second surface 23 which are opposite in the thickness direction;
placing one surface of the blank 2 with the first polyester film 3 on a negative pressure adsorption table 6, so that the blank 2 is limited for the first time through negative pressure;
after the blank 2 is in the first limit state, a laser system 5 is used for manufacturing a first surface microstructure 11 and a through hole 21 shown in fig. 3 on a first surface 22, wherein the through hole 21 and a part 1 formed finally are not overlapped in the thickness direction, and the first polyester film 3 is not cut through when the through hole 21 is cut; the shape of the through hole 21 may be a round hole, a cross hole or a square hole;
as shown in fig. 4, a second polyester film 4 is attached to a first surface 22 having a first surface microstructure 11;
after attaching the second polyester film 4 to the first surface 22, removing the first polyester film 3;
placing one surface of the blank 2 with the second polyester film 4 on a negative pressure adsorption table 6, so that the blank is subjected to secondary limiting through negative pressure;
the through-holes 21 are identified, and the second surface 23 is processed with the through-holes 21 as first positioning marks, which are identified by machine vision, to obtain the second surface microstructure 12 as shown in fig. 5.
By means of the method, the blank is placed on the negative pressure adsorption table to be processed through the polyester film, a visual positioning mark is made for processing of the second surface while the first surface microstructure is processed, the laser system automatically recognizes the positioning mark before the second surface processing is performed, the technical method of micro part laser processing is achieved, the polyester film and the negative pressure adsorption table are adopted, the polyester film is used for clamping and fixing the blank and the micro part, the polyester film prevents the laser system from cutting damage to the negative pressure adsorption table, and meanwhile, the laser system is adopted, processing precision is improved, and the method is suitable for micro part production.
Specifically, in this embodiment, after the step of identifying the through hole 21 and processing the second surface 23 with the through hole 21 as the first positioning mark, thereby obtaining the second surface microstructure 12 "shown in fig. 5, the method further includes the following steps:
cutting the profile of the part 1 completely through the blank 2 but not through the second polyester film 4;
the scraps were peeled off to obtain a processed part 1 shown in fig. 1.
Specifically, in this embodiment, the first surface microstructure 11 and the second surface microstructure 12 are both groove structures, and neither of them penetrates the blank 2, the groove depth is 0.02mm, and neither of them penetrates the blank 2, and the relative positions of the profile of the second surface microstructure 12 and the part 1 and the first surface microstructure 11 are ensured by a first positioning mark.
Example two
As shown in fig. 10, in this embodiment, a sheet material with a width of 120mm is selected as the blank 2, a plurality of 50×50mm machining areas 7 are preset along the length direction of the blank 2, and a 10×10 array of parts as shown in fig. 9 is arranged and machined in each machining area 7. The laser working range in this example is 50×50mm.
The technical method for laser processing of the micro part comprises the following steps:
firstly, as shown in fig. 9-11, selecting a sheet material with the same thickness as the part 1 and the width of 120mm as a blank 2, simultaneously manufacturing a plurality of groups of positioning pin holes 24 on the blank 2, wherein each group of positioning pin holes 24 corresponds to one processing area 7, the blank 2 comprises five preset groups of processing areas 7, the blank 2 is provided with a first surface 22 and a second surface 23 which are opposite in the thickness direction, and a first polyester film 3 is adhered on the second surface 23; the range of the preset machining region 7 in the present embodiment is 50×50mm;
one surface of the blank 2 with the first polyester film 3 is placed on a negative pressure adsorption table 6, a group of positioning pins 61 are arranged on the negative pressure adsorption table 6, and a group of positioning pin holes 24 are sleeved on the positioning pins 61 in sequence, so that the blank 2 is limited for the first time through the matching of the positioning pin holes 24 and the positioning pins 61;
after the blank 2 is in the first limit state, a first surface microstructure 11 and a through hole 21 of a 10×10 array are manufactured in a corresponding processing area 7 by using a laser system 5, wherein the through hole 21 and a part 1 formed finally are not overlapped in the thickness direction; the shape of the through hole 21 may be a round hole, a cross hole or a square hole;
as shown in fig. 12, a second polyester film 4 is attached to a first surface 22 having a first surface microstructure 11;
after attaching the second polyester film 4 to the first surface 22, removing the first polyester film 3;
placing one surface of the blank 2 with the second polyester film 4 on the negative pressure adsorption table 6, so that the blank 2 is subjected to second limiting through the matching of the positioning pin holes 24 and the positioning pins 61;
identifying the through holes 21, and processing the second surface 23 with the through holes 21 as first positioning marks, thereby obtaining a plurality of second surface microstructures 12 as shown in fig. 13, and completely cutting through the outline of the part 1, wherein the first positioning marks 21 are identified by machine vision;
as shown in fig. 14, the scrap was peeled off to obtain a plurality of parts 1 after processing which remained adhered to the second polyester film 4 as shown in fig. 15.
Specifically, as shown in fig. 8, in this embodiment, the laser system 5 employs a field lens 51, a scanning galvanometer 52 and an ultrafast pulse laser 53 of F100, the laser working range of the laser system 5 is 50×50mm, the laser system 5 is positioned by using a coaxial vision system 54, the field of view is 2.85×2.15mm, and the resolution is 1.1 μm.
Specifically, as shown in fig. 8, in this embodiment, the distance between one set of positioning pins 61 is 100mm, and the width of the first polyester film 3 and the width of the second polyester film 4 are smaller than the pitch between one set of positioning pins 61.
Specifically, as shown in fig. 10, in the present embodiment, the interval between one set of the registration pin holes 24 and the adjacent set of registration pin holes 24 is 60mm.
By the method, sheet materials with the width of 120mm are selected as blanks to process micro parts, polyester films are used for placing the blanks on a negative pressure adsorption table to process, a group of positioning pins 61 are arranged on the negative pressure adsorption table 6, a group of positioning pin holes 24 are sleeved on the positioning pins 61 in sequence, the first surface 22 and the second surface 23 of the blanks 2 are respectively processed through a laser system 5 in corresponding processing areas 7, a micro part laser processing process method is realized, the polyester films are used for clamping and fixing the micro parts, the polyester films prevent the laser system from cutting the negative pressure adsorption table, the blanks are initially positioned by using the cooperation of the positioning pins and the positioning pin holes, so that the first positioning mark of each part 1 can enter the visual field range of a coaxial vision system, the positioning mark is identified by adopting the coaxial vision system, the processing precision can be controlled within +/-5 mu m, the processing range is large, the production efficiency is improved, 100 micro part products can be obtained in each processing area, and hundreds of processing areas can be obtained.
Example III
The present embodiment adds an XY table on the basis of the second embodiment, replaces the coaxial vision system 54 with the paraxial vision system 55, and cancels the positioning pin 61, thus being suitable for processing large-format blanks.
Firstly, as shown in fig. 16-17, a large-format blank 2 is selected, an array of m×n processing areas is set on the blank 2, the blank 2 is provided with a first surface 22 and a second surface 23, a first polyester film 3 is attached to the second surface 22, 10×10 groups of first surface microstructures 11 are manufactured in each processing area 7, a group of second positioning marks 25 are set on opposite angles of the blank 2, the second positioning marks 25 are through holes and are set outside the range of the array of m×n processing areas, and the range of each processing area 7 in the embodiment is 50×50mm;
placing one surface of the blank 2 with the first polyester film 3 on a negative pressure adsorption table 6, so that the blank 2 is limited for the first time through negative pressure;
when the blank 2 is in the first limit state, driving an XY table to sequentially send a second positioning mark 25 on the blank 2 into a visual field range of a paraxial vision system 55, accurately positioning the actual placement position of the blank 2, and sequentially sending M multiplied by N processing areas 7 to the position right below a field lens 51 of F100 by the XY table to process a first surface microstructure 11, wherein a 10 multiplied by 10 array of first surface microstructures 11 are processed and manufactured in each processing area 7 by using a laser system 5;
attaching a second polyester film 4 on the first surface 22 having the first surface microstructure 11;
after attaching the second polyester film 4 to the first surface 22, removing the first polyester film 3;
placing one surface of the blank 2 with the second polyester film 4 on a negative pressure adsorption table 6, so that the blank 2 is limited for the second time through negative pressure;
the XY stage is driven to sequentially send the second positioning marks 25 into the visual field of the paraxial vision system 55 to accurately position the actual placement position of the blank 2, and then sequentially send the M×N machining areas 7 to the position right below the field lens 51 of the F100 to machine the second surface microstructures 12, and the laser system 5 is used for machining and manufacturing the second surface microstructures 12 of the 10×10 array and the outline cutting of the 10×10 parts 1 in each machining area 7.
Cutting out the outline of the part 1, completely cutting through the blank 2, but not cutting through the second polyester film 4;
finally, the scraps were peeled off to obtain m×n×100 processed parts 1 shown in fig. 1.
Specifically, in this embodiment, an XY stage is disposed below the negative pressure adsorption stage 6, where the XY stage includes an X axis 8 and a Y axis 9, a plurality of processing regions 7 are sequentially sent to below the laser system 5, and a second positioning mark 25 is sequentially sent to a visual field of the paraxial vision system 55, where in each processing region 7, the second surface 23 of the blank 2 is processed by using the laser system 5, so as to obtain a plurality of second surface microstructures 12.
Specifically, in this embodiment, the laser system 5 employs a field lens 51, a scanning galvanometer 52, and an ultrafast pulse laser 53 of F100, and the laser system 5 is positioned by a paraxial vision system 55. The paraxial vision system is a CCD camera mounted beside the laser scanning head.
By means of the method, large-format blanks 2 are selected for processing micro parts, the blanks are clamped and fixed through polyester films in the laser processing process, the blanks 2 are fixed through a negative pressure adsorption table 6, the blanks 2 are not moved relative to the negative pressure adsorption table in the processing process, a paraxial vision system 55 accurately positions the actual placement positions of the blanks 2, the XY table sequentially sends a plurality of processing areas 7 to the lower portion of the laser system 5, the laser system 5 processes 10X 10 micro parts 1 in each processing area 7, a micro part laser processing process method is achieved, the polyester films are used for clamping and fixing the blanks and the micro parts, the polyester films prevent the laser system from cutting the negative pressure adsorption table 6, the method is suitable for processing large-format blanks, the XY table is used, meanwhile, the paraxial vision system is adopted, the processing range is large, the method is suitable for mass production of the micro parts, and production efficiency is improved.
The principle and the implementation mode of the invention are explained by applying specific examples, and the above examples are only used for helping to understand the technical scheme and the core idea of the invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.
Claims (7)
1. The technical method for laser processing of the micro-parts is characterized by comprising the following steps:
attaching a first polyester film to a second surface of the blank, wherein the thickness of the blank is the same as that of the finally formed part, and the blank is provided with a first surface and a second surface which are opposite in the thickness direction;
placing one surface of the blank with the first polyester film on a negative pressure adsorption table, so that the blank is limited for the first time through negative pressure;
when the blank is in a first limiting state, a laser system is used for manufacturing a first surface microstructure and a through hole on the first surface, wherein the through hole is not overlapped with a part formed finally in the thickness direction;
attaching a second polyester film on the first surface with the first surface microstructure;
after attaching a second polyester film on the first surface, removing the first polyester film;
placing one surface of the blank with the second polyester film on a negative pressure adsorption table, so that the blank is subjected to second limiting through negative pressure;
and identifying the through holes, and processing the second surface by taking the through holes as positioning marks so as to obtain the second surface microstructure.
2. The method of claim 1, wherein after the step of identifying the through hole and processing the second surface with the through hole as the first positioning mark to obtain the second surface microstructure, the method further comprises the steps of:
cutting out the shape of the part, and completely cutting through the blank;
and stripping off the scraps to obtain the processed part.
3. The method of claim 1, wherein the first surface microstructure and the second surface microstructure are groove structures.
4. The method according to claim 1, wherein the step of attaching a first polyester film to a second surface of a blank, wherein the thickness of the blank is the same as the thickness of the final formed part, the blank has a first surface and a second surface opposite to each other in the thickness direction, the blank is provided with a plurality of sets of positioning pin holes, the blank comprises a plurality of preset processing areas, the negative pressure adsorption table is provided with a set of positioning pins, the positioning pins are sleeved with the set of positioning pin holes in sequence, and the first surface microstructure and the first positioning mark are manufactured in the corresponding areas.
5. The method of claim 4, wherein the spacing between a set of said alignment pins is greater than the size of the predetermined processing zone, and the width of said first and second polyester films is less than the spacing between a set of said alignment pins.
6. The method according to claim 4, wherein the step of attaching a first polyester film to a second surface of a blank, wherein the thickness of the blank is the same as the thickness of the final formed part, the blank has a first surface and a second surface opposite to each other in the thickness direction, the blank is provided with an array of m×n processing areas, the blank is provided with the first surface and the second surface, the second surface is attached with the first polyester film, the first surface microstructure is formed in each processing area, and a set of second positioning marks are provided on the blank.
7. The method according to claim 6, wherein an XY stage is provided under the negative pressure suction stage, and the XY stage sequentially feeds the plurality of processing regions to the lower side of the laser system, thereby completing the laser processing of the plurality of processing regions.
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| CN1772428A (en) * | 2004-11-12 | 2006-05-17 | 日立比亚机械股份有限公司 | Laser processing machine and method |
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| JP2013157452A (en) * | 2012-01-30 | 2013-08-15 | Hamamatsu Photonics Kk | Method for manufacturing semiconductor device |
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| CN112775539A (en) * | 2019-11-07 | 2021-05-11 | 大族激光科技产业集团股份有限公司 | Laser processing method and apparatus |
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| CN1772428A (en) * | 2004-11-12 | 2006-05-17 | 日立比亚机械股份有限公司 | Laser processing machine and method |
| CN1800258A (en) * | 2004-11-12 | 2006-07-12 | 东京应化工业株式会社 | Protective film agent for laser dicing and wafer processing method using the protective film agent |
| JP2013157452A (en) * | 2012-01-30 | 2013-08-15 | Hamamatsu Photonics Kk | Method for manufacturing semiconductor device |
| CN106944750A (en) * | 2015-12-18 | 2017-07-14 | 通用电气公司 | For making ceramic matrix composite（CMC）The System and method for of sheet material forming |
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