CN114245610B - Wave soldering positioning jig and wave soldering method for pins of circuit board - Google Patents
Wave soldering positioning jig and wave soldering method for pins of circuit board Download PDFInfo
- Publication number
- CN114245610B CN114245610B CN202210098194.8A CN202210098194A CN114245610B CN 114245610 B CN114245610 B CN 114245610B CN 202210098194 A CN202210098194 A CN 202210098194A CN 114245610 B CN114245610 B CN 114245610B
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- circuit board
- positioning
- pins
- wave soldering
- rotor
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- 238000005476 soldering Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000004891 communication Methods 0.000 claims description 2
- 238000002372 labelling Methods 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052802 copper Inorganic materials 0.000 abstract description 11
- 239000010949 copper Substances 0.000 abstract description 11
- 238000003466 welding Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000005192 partition Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention discloses a circuit board pin wave soldering positioning jig and a circuit board pin wave soldering method, and relates to the technical field of positioning jigs. The technical proposal is as follows: the utility model provides a circuit board pin wave soldering positioning jig, which comprises a main board, the one side of mainboard is connected with the pivot structure, pivot structure connects at least one rotor, the one end and the pivot structure rotation of rotor are connected, the inside channel structure who follows self length direction that is provided with of rotor, the inside location stay cord that is provided with of rotor, the location stay cord fifty percent discount and the channel structure of rotor are passed to the fifty percent discount portion, the fifty percent discount portion of location stay cord penetrates from the one end that the rotor is connected the mainboard, wear out from the one end of keeping away from the mainboard, the fifty percent discount portion of location stay cord encloses into the position sleeve. The rotating piece on the main board can rotate at will, the area of the positioning sleeve can be enlarged or reduced by the doubling part of the positioning pull rope, when the positioning sleeve is used, the pins penetrate through the copper holes of the positioning sleeve and the circuit board, and then the positioning sleeve is reduced to fix the pins of the plug-in unit, so that the plug-in unit is prevented from being deviated due to movement of the pins during welding.
Description
Technical Field
The invention relates to the technical field of positioning jigs, in particular to a circuit board pin wave soldering positioning jig and a circuit board pin wave soldering method.
Background
The current sales of servers are increased year by year, more boards are needed for increasing the number of servers, and the number of electronic components on the boards is also increased, especially in the field of servers, because the design is complex, the functions are strong, and then the boards are required to be connected with each other, so that the components of connectors are also used more.
The connector is one of a plurality of components on a board card, and generally has a connection function, an indication function and the like, the components generally belong to DIP type components (also called plug-ins), the components are connected with the circuit board by inserting pins into copper holes of the circuit board, the size and the structure of the plug-ins are relatively complex, the plug-ins are quite irregular and irregular, the plug-ins are required to be manually inserted into the circuit board and then welded, the welding mode is wave soldering (wave soldering is that the pins of the plug-ins are firstly inserted into the copper holes of the circuit board, the pins of the plug-ins penetrate through the whole circuit board and exceed the bottom surface of the circuit board, and then high-temperature liquid tin is filled into the copper holes of the circuit board in a wave mode, so that the pins of the plug-ins and the copper holes of the circuit board are welded together), and therefore, the production problems of the plug-in type components can be quite high.
The most common production problem is that the plug-in components are offset after wave soldering, a plurality of pins or plug-in components with larger weight are better, the offset angle is smaller, but most plug-in components have the problems. The key to the problem is that because the card needs to pass pins through the copper holes of the circuit board, the diameter of the pins of the card assembly cannot be the same as or very close to the diameter of the holes of the circuit board, because the connector has many pins, and the pins are relatively long, the pins can be slightly bumped when being taken up during transportation or production, and the diameter of the pins is relatively close to the holes of the circuit board, so that the connector assembly cannot be inserted into the holes of the circuit board. The diameter of the pins of the package is much smaller than the diameter of the copper holes of the circuit board, which results in a problem that the package may wobble after the connector is inserted into the copper holes of the circuit board and the package may deflect after wave soldering.
For the problem, two positioning pins are added on two sides of the plug-in, the material is heat-resistant plastic, the design of the positioning pins is thicker, two common through holes are formed in the circuit board, copper plating is not needed in the holes, and the two positioning pins are relatively close to the common holes of the circuit board in diameter, so that the circuit board can be better inserted because of the thicker positioning pins. However, the problem still remains unsolved in this method, firstly, the structure of the plug-in is affected by adding the positioning pins on the plug-in body, the complexity and the manufacturing cost of the plug-in manufacturing process are increased, secondly, the offset problem can not be well solved by adding the positioning pins on the left side and the right side, the left deflection and the right deflection are less, but the upper and lower deflection still occur, thirdly, the area of the circuit board occupied by the plug-in is increased, and therefore, no enough space is left on the circuit board for placing other components.
Disclosure of Invention
Aiming at the problem that the pins of the plug-in unit are smaller than the diameter of the mounting holes of the circuit board, and the plug-in unit is deviated after the pins are inserted into the mounting holes, the invention provides the circuit board pin wave soldering positioning jig and the circuit board pin wave soldering method, which can fix the pins after the pins are inserted into the mounting holes, and further fix the plug-in unit.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a circuit board pin wave soldering positioning jig, which comprises a main board, the one side of mainboard is connected with the pivot structure, pivot structure connects at least one rotor, the one end and the pivot structure rotation of rotor are connected, the inside channel structure who follows self length direction that is provided with of rotor, the inside location stay cord that is provided with of rotor, the location stay cord fifty percent discount and the channel structure of rotor are passed to the fifty percent discount portion, the fifty percent discount portion of location stay cord penetrates from the one end that the rotor is connected the mainboard, wear out from the one end of keeping away from the mainboard, the fifty percent discount portion of location stay cord encloses into the position sleeve. The rotary piece on the main board can rotate at will, the doubling part of the positioning stay rope can pull out from the rotary piece to enlarge the area of the positioning sleeve, the end part of the positioning stay rope can also be pulled to reduce the area of the positioning sleeve, the positioning sleeve is enlarged in advance before the pins are inserted into the circuit board, the pins penetrate through the positioning sleeve first and then penetrate through the circuit board, the positioning sleeve is reduced later, the pins are fixed by matching with the through holes of the circuit board, and then the plug-in unit is fixed, so that the plug-in unit is prevented from being offset due to the movement of the pins during welding, and the circuit board is unqualified.
Preferably, the rotating shaft structure comprises a rotating shaft perpendicular to the main board, one end of the rotating shaft is connected with the main board, the other end of the rotating shaft is connected with a supporting plate, the supporting plate is arranged in parallel with the main board, and one end of the rotating piece is provided with a connecting ring matched with the rotating shaft. One side of mainboard and circuit board laminating, the backup pad is used for stabilizing the plug-in components, sets up the axis of rotation between mainboard and the backup pad, and the rotor passes through go-between and rotation axis connection to rotate around the axis of rotation.
Preferably, the channel structure comprises a first channel and a second channel which are parallel, wherein the first channel and the second channel are arranged along the length direction of the rotating piece, and one end of the positioning stay rope penetrates through the first channel and then is folded in half to reversely penetrate back into the second channel. The first channel and the second channel can prevent the positioning stay rope in the rotating piece from winding and knotting.
Preferably, both ends of the positioning pull rope are connected with the same handle. The end part of the positioning stay rope is fixed through the handle, and meanwhile, the positioning stay rope is convenient to pull, so that the range of the positioning sleeve is narrowed.
Preferably, a partition plate is arranged between the rotating plates, the partition plate is uniformly arranged radially around the center of the main plate, and the partition plate is connected to the main plate. The rotating area and the angle of the rotating piece are limited, so that the phenomenon that the part of the positioning pull rope positioned outside the rotating piece is wound due to the rotation of the rotating piece is prevented, and the use is influenced.
Preferably, the centers of the main board, the rotating shaft and the supporting board are provided with positioning holes, and the positioning holes of the main board, the rotating shaft and the supporting board are concentrically arranged. The locating hole is used for cooperating with the locating structure that the circuit board presets, make the tool lie in the plug-in components center as far as possible, be convenient for location operation, improve stability.
Preferably, a plastic layer is arranged on one surface of the main board, which is not connected with the rotating piece. The plastic layer has rough surface and certain elasticity, can improve the stability of the jig placed on the circuit board, is convenient for operation, and can be replaced by a double-sided adhesive.
Preferably, a plurality of positioning grooves are formed in the main board, the positioning grooves are uniformly distributed around the center of the main board, positioning convex blocks are arranged on the surface, opposite to the main board, of the rotating board, and the positioning grooves are matched with the positioning convex blocks. The stability of rotor position is improved, prevents that the rotor from rotating and leading to the position sleeve to enlarge, causes the pin to rock.
A circuit board pin wave soldering method using any circuit board pin wave soldering positioning jig comprises the following steps:
s1: in the case of a printed circuit board, a mark is made at the center of the place where the card is placed on the circuit board,
s2: the positioning holes of the wave soldering positioning jig for the pins of the circuit board correspond to the marks on the circuit board, one surface of the main board provided with the plastic layer faces the circuit board and is placed on the circuit board,
s3: the rotating plates are rotated, one end of each rotating plate which is not connected with the main board points to a pin hole of one circuit board,
s4: the positioning sleeve in each rotating plate is pulled outwards until the area of the positioning sleeve covers the pin hole of the corresponding circuit board,
s5: placing the plug-in unit above the supporting plate to make the pins of the plug-in unit pass through the positioning sleeve and the pin holes of the circuit board,
s6: pulling the handle to shrink the positioning sleeve and fix the pins,
s7: wave soldering is firstly carried out on the positioned pins, and then wave soldering is carried out on other pins.
Preferably, the marking mode of the circuit board comprises the steps of labeling and dotting on the surface of the circuit board.
The invention has the following beneficial effects: can fix the pin of plug-in components of different positions after inserting the circuit board through the arbitrary turned angle of rotor blade, and then fix the position of placing the plug-in components on the circuit board, prevent wave soldering's in-process, the pin rocks, leads to the plug-in components position to produce the skew, and the circuit board is scrapped.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the description of the embodiments or the prior art will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic structural view of an embodiment of the present invention.
Fig. 2 is a schematic view of a structure in which a rotor plate is removed in an embodiment of the present invention.
Fig. 3 is a schematic structural view of a rotor according to an embodiment of the present invention.
Fig. 4 is a partial cross-sectional view of a rotor plate in an embodiment of the invention.
In the figure: 1. the device comprises a main board, 2, a rotating piece, 3, a supporting board, 4, a positioning hole, 5, a positioning groove, 6, a partition board, 7, a rotating shaft, 8, a positioning lug, 9, a lead hole, 10, a connecting ring, 11, a first channel, 12, a second channel, 13, a handle, 14, a positioning pull rope, 15, a positioning sleeve, 16 and a wire storage cavity.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
As shown in fig. 1-4, a wave soldering positioning jig for pins of a circuit board comprises a main board 1, wherein a rotating shaft 7 is connected to the center of the main board 1, one end of the rotating shaft 7 is connected with the main board 1, the other end of the rotating shaft 7 is connected with the center of a supporting board 3, and the supporting board 3 and the main board 1 are arranged in parallel. The rotating shaft 7 is rotationally connected with four rotating plates 2, one end of each rotating plate 2 is provided with a connecting ring 10, the connecting rings 10 are sleeved on the rotating shaft 7, two parallel first channels 11 and two parallel second channels 12 are arranged in the rotating plates 2, the first channels 11 and the second channels 12 are arranged along the length direction of the rotating plates 2, positioning pull ropes 14 are arranged in the rotating plates 2, the positioning pull ropes 14 penetrate from one end, close to the center of the main plate 1, of each first channel 11, penetrate from one end, far away from the center of the main plate 1, of each first channel 11, then are folded in half, penetrate from one end, far away from the center of the main plate 1, of each second channel 12, penetrate from one end, close to the center of the main plate 1, of each second channel 12, the two folding parts, close to one end, far away from the center of the main plate 1, of each rotating plate 2, of each positioning pull rope 14 form a positioning sleeve 15, and two ends of each positioning pull rope 14 are connected to the same handle 13. The rotating piece 2, the positioning pull rope 14 and the handle 13 are in one-to-one correspondence, the positioning pull rope 14 is a flexible rope wire such as a copper wire, an iron wire and the like, if a metal wire is adopted to brush insulating materials on the surface, the expansion and the shrinkage of the positioning sleeve 15 can be realized by pulling the handle 13 or pulling the folded part of the positioning pull rope 14. The inside of the rotating plate 2 is also provided with a wire storage cavity communicated with the first channel 11 and the second channel 12, and the wire storage cavity is used for placing a positioning pull rope 14.
One side of the main board 1, which is provided with the rotating shaft 7, is provided with a plurality of positioning grooves 5, the positioning grooves 5 are evenly distributed around the center of the main board 1, one side of the rotating piece 2, which is opposite to the main board 1, is provided with positioning convex blocks 8, and the positioning convex blocks 8 are matched with the positioning grooves 5. The one side of setting axis of rotation 7 of mainboard 1 still is provided with baffle 6, and baffle 6 encircles the center of mainboard 1 and is radial evenly arranged, is provided with a baffle 6 between every two adjacent rotor plates 2. The main board 1 is also provided with lead holes 9, every two lead holes 9 are in a group, four groups of lead holes 9 are respectively positioned between every two adjacent partition boards 6, and the positioning pull ropes 14 in the rotating piece 2 can be led to the other side of the main board 1 from one side of the rotating piece 2 through the lead holes 9, so that the arrangement of the positioning pull ropes 14 is more orderly and clear. The main board 1, the rotating shaft 7 and the supporting plate 3 are provided with positioning holes 4 in the centers, and the positioning holes 4 of the three are concentrically arranged. The side of the main board 1, which is not provided with the rotating shaft 7, is provided with a plastic layer.
A wave soldering method for the pins of the circuit board by using the wave soldering positioning jig for the pins of the circuit board comprises the following steps,
1. and (3) information collection: and for the plug-in type component, collecting size information and layout information corresponding to the plug-in a system for applying for the material number, and generating a distribution two-dimensional diagram of pins of the plug-in component by a PLM (product life cycle management) system according to the collected size information and layout information.
2. Screening: the plug-in components that easily incline are screened out according to the distribution two-dimensional map of pin by the system of application material number, the principle is that the plug-in components that the pin is a straight line or forms several parallel lines are screened out (what is seen at present is that the pin of this shape can easily deviate is serious, and also some shapes can not judge easily whether easily deviate, can observe easily deviate according to actual production condition, if find easily deviate, can feed back again according to the production condition and add corresponding shape, just can screen out afterwards, can continuously update screening principle), then mark these connectors, then give the system of production with mark information synchronization.
3. Marking: the list of the components easy to deflect is obtained by a system applying a material number before production, and then the central position of the components on the circuit board is automatically marked according to the position information of the components on the circuit board, wherein the marking mode can be that a small label is stuck on the surface of the circuit board or the components are directly spotted.
4. Use above-mentioned tool:
s1: the positioning holes 4 of the wave soldering positioning jig for the pins of the circuit board correspond to marks on the circuit board, one surface of the main board 1 provided with the plastic layer faces the circuit board and is placed on the circuit board,
s2: the rotating plates 2 are rotated, one end of each rotating plate 2 which is not connected with the main board 1 is directed to a pin hole of one circuit board,
s3: the positioning sleeve 15 in each rotating plate 2 is pulled outwards until the area of the positioning sleeve 15 covers the pin holes of the corresponding circuit board,
s4: the card is placed over the support plate 3, with the pins of the card passing through the locating sleeve 15 and the pin holes of the circuit board,
s5: pulling the handle, shrinking the positioning sleeve 15, fixing the pins,
s6: wave soldering is firstly carried out on the positioned pins, and then wave soldering is carried out on other pins.
The fixture for fixing the assembly is suitable for various plug-ins, is thin, is hollow in the middle to serve as a positioning hole 1 and is used for aligning a marking point of the central position of the assembly, the fixture is attached to the surface of a circuit board, 4 (preferred) rotating pieces 2 which can rotate and stretch respectively are arranged on the universal fixture, a positioning sleeve 15 which can be tightened is connected to the top end of each rotating piece 2, and the top end of each rotating piece 2 can be tightened through a handle 13 on the fixture.
When the board card is produced, an operator takes a fixture for fixing the assembly after seeing the mark on the circuit board, aligns the area hollowed in the middle with the mark on the circuit board, then attaches the fixture to the surface of the circuit board, then rotates and stretches the 4 rotary pieces 2 to the positions of copper holes of pins of the circuit board, then passes pins of the plug-in unit through the positioning sleeve 15 and the copper holes of the circuit board, then pulls the handle 13 on the fixture under the condition that the plug-in unit is not deflected, tightens the 4 positioning sleeve 15, thereby fixing the pins of the plug-in unit and the fixture together, if the number of the pins is less than 4, the fixture is all fixed, such as an LED module with 2 pins, the 2 pins are fixed, and if the number of the pins is more than 4, one pin is fixed in each of the directions of upper left, lower left, upper right and lower right. After the pins are fixed by the positioning sleeve 15, the plug-in assembly cannot deflect after wave soldering.
It will be understood that when an element or layer is referred to as being "on" or "connected" or "coupled" to another element or layer, it can be directly on, connected or coupled to the other element or layer, or intervening elements or layers may also be present. In contrast, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers present. Like numbers refer to like elements throughout. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Spatially relative terms, such as "under" …, "below," "lower," "above," "over" and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "under" or "beneath" other elements or features would then be oriented "over" the other elements or features. Thus, the exemplary term "below" may include both an orientation above and below. Other orientations of the device (90 degrees or other orientations) are possible, and spatially relative descriptors used herein interpreted accordingly.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the expressions within this document. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The terms "first," "second," "third," "fourth" and the like in the description and in the claims and in the above drawings, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
Although the present invention has been described in detail by way of preferred embodiments with reference to the accompanying drawings, the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope of the present disclosure without departing from the spirit and the essence of the present disclosure, and shall be covered by the scope of the present disclosure. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (6)
1. The utility model provides a circuit board pin wave soldering positioning jig, a serial communication port, including mainboard (1), one side of mainboard (1) is connected with the pivot structure, at least one rotor (2) is connected to the pivot structure, the one end and the pivot structure rotation of rotor (2) are connected, the inside channel structure that is provided with along self length direction of rotor (2), rotor (2) inside is provided with location stay cord (14), the channel structure of rotor (2) is passed in the fifty percent discount and the fifty percent discount portion of location stay cord (14), the fifty percent discount portion of location stay cord (14) penetrates from the one end that rotor (2) connect mainboard (1), wear out from the one end that keeps away from mainboard (1), the fifty percent discount portion of location stay cord (14) encloses into spacer sleeve (15); the rotating shaft structure comprises a rotating shaft (7) perpendicular to the main board (1), one end of the rotating shaft (7) is connected with the main board (1), the other end of the rotating shaft (7) is connected with a supporting plate (3), the supporting plate (3) is arranged in parallel with the main board (1), and one end of the rotating piece (2) is provided with a connecting ring (10) matched with the rotating shaft (7); the channel structure comprises a first channel (11) and a second channel (12) which are parallel, the first channel (11) and the second channel (12) are arranged along the length direction of the rotary piece (2), and one end of the positioning stay rope (14) passes through the first channel (11) and then is folded in half to reversely pass through the second channel (12); two ends of the positioning pull rope (14) are connected with the same handle (13); a baffle plate (6) is arranged between the rotating plates (2), the baffle plate (6) is uniformly arranged in a radial mode around the center of the main plate (1), and the baffle plate (6) is connected to the main plate (1).
2. The wave soldering positioning jig for the pins of the circuit board according to claim 1, wherein the centers of the main board (1), the rotating shaft (7) and the supporting plate (3) are provided with positioning holes (4), and the positioning holes (4) of the main board (1), the rotating shaft (7) and the supporting plate (3) are concentrically arranged.
3. The wave soldering positioning jig for pins of a circuit board according to claim 1, wherein a plastic layer is arranged on one surface of the main board (1) which is not connected with the rotating piece (2).
4. The wave soldering positioning jig for pins of circuit boards according to claim 1, wherein a plurality of positioning grooves (5) are formed in the main board (1), the positioning grooves (5) are uniformly distributed around the center of the main board (1), positioning protruding blocks (8) are arranged on the surface, opposite to the main board (1), of the rotating piece (2), and the positioning grooves (5) are matched with the positioning protruding blocks (8).
5. A circuit board pin wave soldering method using the circuit board pin wave soldering positioning jig according to any one of claims 1 to 4, comprising the steps of:
s1: in the case of a printed circuit board, a mark is made at the center of the place where the card is placed on the circuit board,
s2: the positioning holes (4) of the wave soldering positioning jig for the pins of the circuit board correspond to the marks on the circuit board, one surface of the main board (1) provided with the plastic layer faces the circuit board and is placed on the circuit board,
s3: the rotating sheets (2) are rotated, one end of each rotating sheet (2) which is not connected with the main board (1) points to a pin hole of a circuit board,
s4: the positioning sleeve (15) in each rotating plate (2) is pulled outwards until the area of the positioning sleeve (15) covers the pin hole of the corresponding circuit board,
s5: placing the plug-in unit above the supporting plate (3) to enable pins of the plug-in unit to pass through the positioning sleeve (15) and pin holes of the circuit board,
s6: pulling the handle (13) to shrink the positioning sleeve (15) and fix the pins,
s7: wave soldering is firstly carried out on the positioned pins, and then wave soldering is carried out on other pins.
6. The circuit board pin wave soldering method of claim 5, wherein the marking of the circuit board comprises labeling and dotting the surface of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN114905108B (en) * | 2022-05-18 | 2024-07-23 | 珠海市横仓电子科技有限公司 | Welding machine, manufacturing method of keyboard and keyboard |
| CN117156717B (en) * | 2023-10-31 | 2024-02-06 | 深圳市首航新能源股份有限公司 | Method for manufacturing circuit board, method for manufacturing power module and power module |
Citations (5)
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| CN104735925A (en) * | 2013-12-23 | 2015-06-24 | 深圳市共进电子股份有限公司 | Piece insertion and wave soldering passing method and printed circuit board |
| CN204968224U (en) * | 2015-09-25 | 2016-01-13 | 杭州华三通信技术有限公司 | Circuit board |
| CN205847743U (en) * | 2016-07-05 | 2016-12-28 | 深圳市鸿发鑫科技有限公司 | A kind of Wave soldering fixture with gland |
| CN206472379U (en) * | 2016-11-22 | 2017-09-05 | 南京高喜电子科技有限公司 | A kind of Wave crest Welding tool |
| CN209930643U (en) * | 2018-12-24 | 2020-01-10 | 河源湧嘉实业有限公司 | Furnace-passing jig for wave soldering |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104735925A (en) * | 2013-12-23 | 2015-06-24 | 深圳市共进电子股份有限公司 | Piece insertion and wave soldering passing method and printed circuit board |
| CN204968224U (en) * | 2015-09-25 | 2016-01-13 | 杭州华三通信技术有限公司 | Circuit board |
| CN205847743U (en) * | 2016-07-05 | 2016-12-28 | 深圳市鸿发鑫科技有限公司 | A kind of Wave soldering fixture with gland |
| CN206472379U (en) * | 2016-11-22 | 2017-09-05 | 南京高喜电子科技有限公司 | A kind of Wave crest Welding tool |
| CN209930643U (en) * | 2018-12-24 | 2020-01-10 | 河源湧嘉实业有限公司 | Furnace-passing jig for wave soldering |
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