CN114243446A - Linear array laser heat radiation structure and packaging mode - Google Patents
Linear array laser heat radiation structure and packaging mode Download PDFInfo
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- CN114243446A CN114243446A CN202111548919.0A CN202111548919A CN114243446A CN 114243446 A CN114243446 A CN 114243446A CN 202111548919 A CN202111548919 A CN 202111548919A CN 114243446 A CN114243446 A CN 114243446A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 43
- 230000005855 radiation Effects 0.000 title claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims abstract description 59
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- 238000007789 sealing Methods 0.000 claims abstract description 15
- 238000003466 welding Methods 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 20
- 238000003825 pressing Methods 0.000 claims description 17
- 229910000639 Spring steel Inorganic materials 0.000 claims description 15
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 8
- 238000005192 partition Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a linear array laser heat dissipation structure and a packaging mode, and relates to the technical field of lasers. This linear array laser heat radiation structure and encapsulation mode, increase rhombus heat dissipation strip, heat radiating area increases three times, carry out effectual dispersion to the produced heat of laser array strip, rhombus heat dissipation strip changes the flow direction of rivers, carry out the vortex, increase the reynolds number of rivers, when increasing heat radiating area, can strengthen the flow of rivers, become the torrent from the laminar flow, take away the heat more effectively, the setting of cooperation through-hole and sealing tube, further improve the radiating rate of rhombus heat dissipation strip, and regard water wheels as power promotion wind wheel to rotate, air in the chamber of producing wind with higher speed flows to the radiating groove from the wind-guiding way in, under the setting of inclined hole, the inside heat of rhombus fin gives off with higher speed, thereby guarantee the effective heat dissipation of laser array strip.
Description
Technical Field
The invention relates to the technical field of lasers, in particular to a linear array laser heat dissipation structure and a packaging mode.
Background
Lasers are devices capable of emitting laser light, and are classified into four categories, i.e., gas lasers, solid lasers, semiconductor lasers and dye lasers according to working media.
For a semiconductor laser, the heat dissipation in the using process is an unavoidable problem, a conventional linear array laser adopts a single-water-hole type heat dissipation mode, the heat dissipation area is small, heat accumulation is easy to generate after long-time use, and poor chip power can be caused, in the packaging process of the conventional linear array laser, a single bar is packaged by adopting a single gold-plated insulating gasket and then is additionally provided with a single lens, the packaging process is complex, in the conventional process, tungsten copper sheets are processed in two specifications, because the electrode notches of the tungsten copper sheets of the single bar are fixed and are not universal, in the conventional packaging process, the placing direction and the using specification need to be noticed during placement, the whole packaging adopts a multi-step packaging mode, a manual welding mode is adopted during welding, mass production is not facilitated, based on the retrieval of the data, the heat dissipation structure and the packaging mode of the linear array laser are specially provided, the heat dissipation area and the heat dissipation speed are increased, the packaging efficiency and the product quality are improved by adopting the packaging one-time welding jig.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a linear array laser heat dissipation structure and a packaging mode, and solves the problems that a single water hole type heat dissipation mode is adopted, the heat dissipation area is small, a single bar is packaged by a single gold-plated insulating gasket, then a single lens is additionally arranged, the packaging process is complex, the electrode gap of a tungsten copper sheet of the single bar is not universal, the whole packaging adopts a multi-step packaging mode, a manual welding mode is adopted during welding, and the mass production is not facilitated.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: the linear array laser heat dissipation structure comprises a laser array strip, a first electrode plate and a second electrode plate, wherein the first electrode plate and the second electrode plate are matched with the laser array strip, a heat dissipation assembly is arranged below the laser array strip and comprises a heat sink upper cover and a heat sink bottom shell, the heat sink upper cover and the heat sink bottom shell are fixedly bonded, insulating gaskets matched with the second electrode plate are fixedly bonded on the left side and the right side of the front surface of the heat sink upper cover through reserved grooves, the bottom of the laser array strip is fixedly connected with the top of the heat sink upper cover through a high-insulation sheet, a plurality of uniformly arranged rhombic heat dissipation fins are fixedly arranged at the bottom of the heat sink upper cover, through holes are formed in the bottoms of the rhombic heat dissipation fins, a flow channel matched with the heat sink upper cover is formed in the top of the heat sink bottom shell, a sealing pipe matched with the through holes is fixedly connected with the bottom of an inner cavity of the flow channel, and a water inlet channel and a water outlet channel communicated with the flow channel are respectively formed in the left side and the right side of the top of the heat sink bottom shell, the inside owner of inlet channel rotates and is connected with water wheels, the wind chamber has all been seted up in both sides around the left side of heat sink drain pan bottom and lie in the inlet channel, water wheels includes pivot and blade, the both ends of pivot run through the inlet channel respectively and extend to two wind chambers, and the equal fixed mounting in both ends of pivot has the wind wheel, and wherein the pivot runs through inlet channel department and makes sealed processing, the radiating groove has been seted up on the right side of heat sink drain pan bottom, the wind channel with wind chamber intercommunication is seted up in the left side of radiating groove, the inclined hole of a plurality of and sealed tube looks adaptation is seted up at the top of radiating groove.
Through adopting above-mentioned technical scheme, increase rhombus heat dissipation strip on traditional water passageway's basis, heat radiating area increases three times, carry out effectual dispersion to the produced heat of laser array strip, rhombus heat dissipation strip changes the flow direction of rivers, carry out the vortex, increase the reynolds number of rivers, when increasing heat radiating area, can strengthen the flow of rivers, become the torrent from the laminar flow, take away the heat more effectively, the setting of cooperation through-hole and sealed tube, further improve the radiating rate of rhombus heat dissipation strip, and regard water wheels as power promotion wind wheel to rotate, flow direction radiating groove in the air guide way is followed to the air in the wind cavity with higher speed, under the setting of inclined hole, the inside heat of rhombus fin gives off with higher speed, thereby guarantee the effective heat dissipation of laser array strip.
The invention is further configured to: the laser array strip comprises a plurality of laser units which are arranged in series, each laser unit comprises two laser bars and a chip, the two laser bars are arranged on the front side and the rear side of the chip, two electrode welding grooves are formed in the tops of the laser bars, and the two adjacent electrode welding grooves of the laser bars are respectively welded and fixed with the surface of the first electrode plate.
By adopting the technical scheme, the chips are ensured to be on the same straight line, and the bilateral electrode welding grooves are formed in the laser bars, so that the consistency of the laser bar materials is ensured, the arrangement direction of the bars is not required to be noticed in the packaging process, and the use is more convenient.
The invention is further configured to: the laser bars are welded and fixed on the high-heat-conductivity insulating sheet, the top of the high-heat-conductivity insulating sheet is provided with a stress slow-release groove matched with the chip, and the width of the stress slow-release groove is set to be 1.25-1.5 times of the width of the chip.
By adopting the technical scheme, the stress borne by the chip is relieved, and the stability of the chip is ensured.
The invention is further configured to: insulating supports are fixedly mounted on the top of the heat sink upper cover and located on the left side and the right side of the laser array strip, grooves are formed in the tops of the two insulating supports, and collimating lenses are fixedly bonded between the two grooves.
By adopting the technical scheme, the same linearity of the light emitting points of the chip is ensured, wherein the process that the plurality of laser array strips correspond to the plurality of collimating lenses is simplified into a single collimating lens, so that the dimming process is simplified, the packaging efficiency is greatly improved, the cost is saved for enterprises, and the direct pollution of pollutants to the laser chip can be avoided while the linearity of the light source is ensured.
The invention also discloses a packaging mode of the linear array laser heat dissipation structure, the linear array laser heat dissipation structure is packaged in the following mode, and the specific packaging mode comprises the following steps:
step one, heat sink assembly: placing the heat sink upper cover in the heat sink bottom shell along the flow channel, enabling the through holes of the rhombic radiating fins to be sleeved above the sealing pipe, and performing surface polishing and gold plating after the heat sink upper cover and the heat sink bottom shell are welded and fixed to finally obtain a radiating assembly;
step two, linear array packaging: placing the heat dissipation assembly obtained in the first step on a workbench, fixing an insulating gasket at two reserved grooves on the front surface of the heat dissipation assembly by using high-temperature-resistant AB glue, placing a jig main body on the heat dissipation assembly, placing a high-heat-conductivity insulating sheet on a heat sink upper cover by using the rear surface and the left side surface of the jig main body as reference surfaces, placing 220 ℃ high-temperature hard solder in the middle, placing a plurality of laser array strips on the high-heat-conductivity insulating sheet, placing 220 ℃ high-temperature hard solder in the middle, placing a first electrode sheet and a second electrode sheet on electrode welding grooves of the plurality of laser array strips in a serial connection manner, placing 300 ℃ high-temperature hard solder sheets in the middle, placing product spacing and breaking pieces on the jig main body, uniformly spacing the plurality of laser array strips, placing spring steel needles on pressing blocks, pressing the laser array strips by using the gravity of the pressing blocks, fixing the upper surfaces of the first electrode plate and the second electrode plate by a spring steel needle, locking and fixing the side surfaces of the first electrode plate and the second electrode plate by a plane locking screw, positioning the rear datum of the jig main body, placing the whole in a reflow heating furnace, and welding and fixing to complete the whole packaging of the linear array laser;
step three, lens assembly: after the pressing block, the spring steel needle, the product spacing partition piece, the plane locking screw and the jig main body are sequentially detached, the AB glue is directly used for bonding and fixing the insulating supports at the two ends of the laser array strip covered on the heat sink, the collimating mirror is placed in the groove of the insulating support, and then the glue is used for fixing the collimating mirror to complete the assembly of the linear array laser.
Through adopting above-mentioned technical scheme, utilize the cooperation of plane locking screw, tool main part, product interval spacer, briquetting and spring steel needle, constitute the welding smelting tool, improved encapsulation efficiency and product quality, guaranteed the uniformity and the accuracy of product precision, shortened the encapsulation process, practiced thrift recruitment cost and time cost for the enterprise. The method comprises the steps of packaging a high-thermal-conductivity insulating sheet and a heat dissipation module, packaging the high-thermal-conductivity insulating sheet and a plurality of laser array strips, packaging a plurality of laser array strips, electrode plates and electrode plates, and packaging the electrode plates and insulating gaskets, wherein the steps are replaced by welding jigs in a unified manner, and the stability of the linear array laser is guaranteed.
The invention is further configured to: the inner surface of the jig main body is matched with the outer surface of the heat sink upper cover, and the top of the jig main body is provided with a slot matched with the product spacing partition.
The invention is further configured to: and the bottom of the pressing block is provided with an avoiding groove matched with the chip.
The invention is further configured to: the screw holes matched with the plane locking screws are formed in the left side and the right side of the front face of the jig main body.
(III) advantageous effects
The invention provides a linear array laser heat dissipation structure and a packaging mode. The method has the following beneficial effects:
(1) this linear array laser heat radiation structure, through increase rhombus heat dissipation strip on traditional water passageway's basis, heat radiating area increases three times, carry out effectual dispersion to the produced heat of laser array strip, rhombus heat dissipation strip changes the flow direction of rivers, carry out the vortex, increase the reynolds number of rivers, when increasing heat radiating area, can strengthen the flow of rivers, become the torrent from the laminar flow, take away the heat more effectively, the setting of cooperation through-hole and stand pipe, further improve the radiating rate of rhombus heat dissipation strip, and regard water wheels as power promotion wind wheel to rotate, flow direction radiating groove in the wind channel is followed to the air in the chamber of producing wind with higher speed, under the setting of inclined hole, the inside heat of rhombus fin gives off with higher speed, thereby guarantee the effective heat dissipation of laser array strip.
(2) This linear array laser heat radiation structure has guaranteed that the chip is on same straight line to set up bilateral electrode welding groove on the laser bar, guaranteed the uniformity of laser bar material, need not to pay attention to the orientation of putting of bar in packaging technology, it is more convenient to use, and under the setting in stress slow-release groove, alleviates the stress that the chip received, guarantees the stability of chip.
(3) This linear array laser heat radiation structure through the setting of insulating support and collimating mirror, has guaranteed the same linearity that the chip goes out the light spot, wherein simplifies the technology that a plurality of laser array strips correspond a plurality of collimating lens into single collimating lens for the technology of adjusting luminance is simplified, has improved encapsulation efficiency greatly, for the cost is practiced thrift to the enterprise, when guaranteeing the linearity of light source, also can avoid the direct pollution of pollutant to laser chip.
(4) This linear array laser heat radiation structure's packaging method utilizes plane locking screw, tool main part, product interval to separate the cooperation of piece, briquetting and spring steel needle, constitutes the welding smelting tool, has improved encapsulation efficiency and product quality, has guaranteed the uniformity and the accuracy of product precision, has shortened the encapsulation process, has practiced thrift recruitment cost and time cost for the enterprise. The packaging method comprises the steps of packaging a high-heat-conductivity insulating sheet and a heat dissipation module of the packaging process, packaging the high-heat-conductivity insulating sheet and a plurality of laser array strips, packaging a plurality of laser array strips, electrode plates and electrode plates, and packaging electrode plates and insulating gaskets, wherein the packaging steps are replaced by welding jigs in a unified manner, so that the stability of the linear array laser is guaranteed, the uniformity of welding flux and the consistency and accuracy of product precision are guaranteed by adopting a jig one-step forming welding mode, and the packaging, assembling and adjusting process of the next process is simplified.
(5) According to the packaging mode of the linear array laser heat dissipation structure, the spring steel needle is arranged on the pressing block, so that the thermal stress generated by high-temperature hard solder during high-temperature melting can be relieved, and the stability of a chip is ensured.
Drawings
FIG. 1 is a schematic external view of the present invention;
FIG. 2 is an exploded schematic view of the present invention;
FIG. 3 is a schematic structural view of the heat sink upper cover, the heat sink bottom shell, the diamond-shaped fins and the sealing tube of the present invention;
fig. 4 is a bottom view of the heat sink upper cover structure of the present invention;
fig. 5 is a schematic view of the internal structure of the heat sink bottom case of the present invention;
FIG. 6 is a schematic structural view of a heat sink bottom shell, a water wheel, a wind wheel, a heat dissipation groove, an inclined hole, a wind guide channel and a wind generating cavity of the present invention;
FIG. 7 is a schematic structural diagram of the present invention in a packaged state;
FIG. 8 is a schematic structural view of a planar locking screw, a jig main body, a product space spacer, a press block and a spring steel needle according to the present invention.
Fig. 9 is a bottom view of a portion of the heat sink bottom case structure of the present invention.
In the figure, 1, laser array bar; 2. a first electrode sheet; 3. a second electrode sheet; 4. a high thermal conductivity insulation sheet; 5. a heat dissipating component; 6. a heat sink upper cover; 7. a heat sink bottom shell; 8. a rhombic heat radiating fin; 9. a sealing tube; 10. a water wheel; 11. a wind wheel; 12. a heat sink; 13. an inclined hole; 14. laser bars; 15. a chip; 16. a stress slow-release groove; 17. an insulating support; 18. a collimating mirror; 19. a plane locking screw; 20. a jig main body; 21. a product spacing spacer; 22. briquetting; 23. a spring steel needle; 24. and an insulating gasket.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-9, an embodiment of the present invention provides a technical solution: the linear array laser heat dissipation structure comprises a laser array strip 1, a first electrode plate 2 and a second electrode plate 3 which are matched with the laser array strip 1, wherein the first electrode plate 2 and the second electrode plate 3 are both manufactured by adopting a pure copper gold plating process as a detailed description, specifically, the laser array strip 1 comprises a plurality of laser units which are arranged in series, each laser unit comprises two laser bars 14 and a chip 15, as the detailed description, the laser units are formed by clamping the chip 15 by the two laser bars 14 and then carrying out one-time welding by high-temperature hard welding flux at about 300 ℃ through a reflow furnace by using high-heat-conductivity hard welding flux at the bottom 4, the chips 15 are ensured to be on the same straight line, the two laser bars 14 are arranged at the front side and the rear side of the chip 15, the tops of the laser bars 14 are provided with bilateral electrode welding grooves, the electrode welding grooves of the two adjacent laser bars 14 are respectively welded and fixed with the surface of the first electrode plate 2, the laser bars 14 in the laser unit are gold-plated by tungsten copper sheets, and the same electrode welding areas, namely, double-side electrode welding grooves, are reserved at the two ends, so that the laser bars 14 do not need to be noticed in the direction during welding.
Further, the laser bars 14 are welded and fixed on the high heat conduction insulating sheet 4, the top of the high heat conduction insulating sheet 4 is provided with stress slow release grooves 16 matched with the chips 15, and the width of the stress slow release grooves 16 is set to be 1.25-1.5 times of the width of the chips.
As a preferred scheme, a heat dissipation assembly 5 is arranged below the laser array strip 1, the heat dissipation assembly 5 comprises a heat sink upper cover 6 and a heat sink bottom shell 7, the heat sink upper cover 6 and the heat sink bottom shell 7 are fixedly bonded, and insulating gaskets 24 matched with the second electrode plate 3 are fixedly bonded on the left side and the right side of the front surface of the heat sink upper cover 6 through arranging reserved grooves, as a detailed description, the insulating gaskets 24 are manufactured by adopting a single-side copper-clad gold-plating process to ensure the welding performance of one side and the insulating and nonconductive performance of the other side, the bottom of the laser array strip 1 is fixedly connected with the top of the heat sink upper cover 6 through a high-heat-conductivity insulating sheet 4, further, the high-heat-conductivity insulating sheet 4 is manufactured by adopting an aluminum nitride or graphite ceramic sheet material, and the two sides of the high-heat-conductivity insulating sheet 4 both adopt a copper-clad process to play roles in welding and fixing a laser unit and heat dissipation by high heat conduction, the bottom of the heat sink upper cover 6 is fixedly provided with a plurality of rhombic cooling fins 8 which are uniformly arranged, the bottom of each rhombic cooling fin 8 is provided with a through hole, the height of each rhombic cooling fin 8 is set to be 2.3mm, the length of each rhombic cooling fin 8 is set to be 1.2mm, the width of each rhombic cooling fin is set to be 0.6mm, the diameter of each through hole is set to be 0.4mm, the top of the heat sink bottom shell 7 is provided with a flow channel matched with the heat sink upper cover 6, the bottom of an inner cavity of the flow channel is fixedly connected with a sealing pipe 9 matched with the through hole, specifically, when the sealing pipe 9 is matched with the through holes, sealant is firstly coated on the periphery of the sealing pipe 9 to ensure the sealing quality after the rhombic cooling fins 8 are matched with the sealing pipe 9, the left side and the right side of the top of the heat sink bottom shell 7 are respectively provided with a water inlet channel and a water outlet channel which are communicated with the flow channel (a cooling water circulation channel, which is not shown in the figure and is used as a conventional technical means, hereinafter, not described in detail), the water outlet is connected with the water inlet of the circulating water channel to form a water circulation, the water inlet channel is mainly and rotatably connected with a water wheel 10, the left side of the bottom of the heat sink bottom shell 7 and the front and back sides of the water inlet channel are both provided with an air generating cavity, as shown in fig. 9, the bottom of the heat sink bottom cover 7 is fixedly bonded with a plugging bottom cover matched with the air generating cavity, the water wheel 10 comprises a rotating shaft and a blade, the two ends of the rotating shaft respectively penetrate through the water inlet channel and extend into the two air generating cavities, wherein the water wheel 10 is impacted by circulating cold area water with certain pressure to rotate, so as to drive the rotating shaft to rotate the wind wheel 11, and both ends of the rotating shaft are fixedly provided with wind wheels 11, wherein the rotating shaft penetrates through the water inlet channel for sealing treatment, the right side of the bottom of the heat sink bottom shell 7 is provided with a heat dissipation groove 12, the left side of the heat dissipation groove 12 is provided with a guide channel communicated with the air generating cavity, for further explanation, as shown in fig. 6, air guide channels adapted to the air generating cavity are respectively formed at the front side and the rear side of the heat sink bottom shell 7, a filter screen block is arranged in the air guide channels to prevent external impurities from entering the air generating cavity, and a plurality of inclined holes 13 adapted to the sealing pipes 9 are formed at the top of the heat dissipation groove 12.
As the preferred scheme, the top of the heat sink upper cover 6 and the left and right sides of the laser array strip 1 are both fixedly provided with insulating supports 17, the tops of the two insulating supports 17 are both provided with grooves, and collimating lenses 18 are fixedly bonded between the two grooves.
The packaging mode of the linear array laser heat radiation structure comprises a welding jig consisting of a plane locking screw 19, a jig main body 20, a product spacing partition 21, a pressing block 22 and a spring steel needle 23, and the linear array laser heat radiation structure is packaged in the following mode, and the specific packaging mode comprises the following steps:
step one, heat sink assembly: placing the heat sink upper cover 6 in the heat sink bottom shell 7 along the flow channel, so that the through holes of the rhombic radiating fins 8 are sleeved above the sealing pipe 9, performing surface polishing and gold plating after performing fusion welding and fixing on the heat sink upper cover 6 and the heat sink bottom shell 7, and finally preparing the radiating assembly 5, further, both the heat sink upper cover 6 and the heat sink bottom shell 7 are made of oxygen-free copper materials, the welding mode adopts copper fusion welding, and after the welding is completed, a pressure resistance value test is performed, so that the situation of water leakage can not occur when the heat sink upper cover and the heat sink bottom shell 7 work in a set water pressure;
step two, linear array packaging: placing the heat dissipation assembly 5 obtained in the first step on a workbench, fixing an insulating gasket 24 at two preformed grooves on the front surface of the heat dissipation assembly 5 by using high-temperature-resistant AB glue, placing a jig main body 20 on the heat dissipation assembly 5, placing a high-heat-conductivity insulating sheet 4 on a heat sink upper cover 6 by taking the rear surface and the left side surface of the jig main body 20 as reference surfaces, placing a high-temperature hard solder of 220 ℃ in the middle, placing a plurality of laser array strips 1 on the high-heat-conductivity insulating sheet 4, placing a high-temperature hard solder of 220 ℃ in the middle, ensuring the welding strength and high heat conductivity, as shown in figures 1 and 2, placing a first electrode plate 2 and a second electrode plate 3 on electrode welding grooves of the plurality of laser array strips 1 in a series connection manner, placing a high-temperature hard solder sheet of 300 ℃ in the middle, placing a product interval breaking piece 21 with the thickness of 1mm on the jig main body 20, uniformly spacing the plurality of laser array strips 1, after a spring steel needle 23 is installed on a pressing block 22, the pressing block is placed on a laser array strip 1, a plurality of laser array strips 1 are pressed by the gravity of the pressing block 22, an avoiding groove is formed in the middle of the pressing block 22 to avoid the position of a chip 15, the spring steel needle 23 fixes the upper surfaces of a first electrode plate 2 and a second electrode plate 3, a plane locking screw 19 is locked and fixed on the side surfaces of the first electrode plate 2 and the second electrode plate 3, meanwhile, the rear datum of a jig main body 20 is well positioned, the whole is placed in a reflow heating furnace, and after welding and fixing, the whole packaging of the linear array laser is completed;
step three, lens assembly: after the pressing block 22, the spring steel needle 23, the product spacing partition 21, the plane locking screw 19 and the jig main body 20 are sequentially removed, the insulating supports 17 are directly bonded and fixed at two ends of the laser array strip 1 on the heat sink upper cover 6 by using AB glue, the collimating lens 18 is placed in a groove of the insulating support 17, and then the collimating lens 18 is fixed by using glue to complete the assembly of the linear array laser.
As an optimal scheme, in order to ensure the stability of the installation of the product space spacer 21, the inner surface of the jig main body 20 is adapted to the outer surface of the heat sink upper cover 6, and the top of the jig main body 20 is provided with a slot adapted to the product space spacer 21.
Preferably, in order to ensure the structural stability of the chip 15, the bottom of the pressing block 22 is provided with an avoiding groove adapted to the chip 15.
Preferably, the left and right sides of the front surface of the jig main body 20 are provided with threaded holes matched with the plane locking screws 19.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. Linear array laser heat radiation structure, including laser array strip (1), with first electrode slice (2) and second electrode slice (3) of laser array strip (1) looks adaptation, its characterized in that: a heat dissipation assembly (5) is arranged below the laser array strip (1), the heat dissipation assembly (5) comprises a heat sink upper cover (6) and a heat sink bottom shell (7), the heat sink upper cover (6) and the heat sink bottom shell (7) are fixedly bonded, insulating gaskets (24) matched with the second electrode plate (3) are fixedly bonded on the left side and the right side of the front face of the heat sink upper cover (6) through reserved grooves, the bottom of the laser array strip (1) is fixedly connected with the top of the heat sink upper cover (6) through a high-heat-conduction insulating sheet (4), a plurality of uniformly-arranged rhombic cooling fins (8) are fixedly mounted at the bottom of the heat sink upper cover (6), through holes are formed in the bottoms of the rhombic cooling fins (8), a flow channel matched with the heat sink upper cover (6) is formed in the top of the heat sink bottom shell (7), and a sealing pipe (9) matched with the through holes is fixedly connected with the bottom of an inner cavity of the flow channel, the utility model discloses a heat sink, including heat sink drain pan (7), water inlet channel and the play water channel that is linked together with the runner are seted up respectively to the left and right sides at heat sink drain pan (7) top, the inside main rotation of water inlet channel is connected with water wheels (10), the left side of heat sink drain pan (7) bottom just is located the front and back both sides of water inlet channel and has all seted up the wind-producing chamber, water wheels (10) are including pivot and blade, the both ends of pivot are run through the water inlet channel respectively and are extended to two wind-producing chambers, and the equal fixed mounting in both ends of pivot has wind wheel (11), and wherein the pivot runs through water inlet channel department and do sealed processing, radiating groove (12) have been seted up on the right side of heat sink drain groove (7) bottom, the wind channel that communicates with the wind-producing chamber is seted up in the left side of radiating groove (12), the tip hole (13) of a plurality of and sealed tube (9) looks adaptation are seted up at the top of radiating groove (12).
2. The line laser heat dissipation structure of claim 1, characterized in that: the laser array strip (1) comprises a plurality of laser units which are arranged in series, each laser unit comprises two laser bars (14) and a chip (15), the two laser bars (14) are arranged on the front side and the rear side of the chip (15), the top of each laser bar (14) is provided with a bilateral electrode welding groove, and the two adjacent electrode welding grooves of the laser bars (14) are respectively fixed with the surface of the first electrode plate (2) in a welding mode.
3. The line laser heat dissipation structure of claim 2, characterized in that: the laser bar (14) is welded and fixed on the high-heat-conductivity insulating sheet (4), the top of the high-heat-conductivity insulating sheet (4) is provided with a stress slow-release groove (16) matched with the chip (15), and the width of the stress slow-release groove (16) is set to be 1.25-1.5 times of the width of the chip.
4. The line laser heat dissipation structure of claim 1, characterized in that: insulating supports (17) are fixedly mounted on the top of the heat sink upper cover (6) and on the left side and the right side of the laser array strip (1), grooves are formed in the tops of the two insulating supports (17), and collimating lenses (18) are fixedly bonded between the two grooves.
5. The packaging mode of the linear array laser heat radiation structure is characterized in that: the heat dissipation structure of the linear array laser adopts the following packaging method, and the specific packaging method comprises the following steps:
step one, heat sink assembly: placing the heat sink upper cover (6) in the heat sink bottom shell (7) along the flow channel, enabling the through holes of the rhombic radiating fins (8) to be sleeved above the sealing pipe (9), performing fusion welding and fixing on the heat sink upper cover (6) and the heat sink bottom shell (7), and performing surface polishing and gold plating to finally obtain the radiating assembly (5);
step two, linear array packaging: placing the heat dissipation assembly (5) obtained in the first step on a workbench, fixing an insulating gasket (24) at two preformed grooves on the front surface of the heat dissipation assembly (5) by using high-temperature-resistant AB glue, placing a jig main body (20) on the heat dissipation assembly (5), placing a high-heat-conductivity insulating sheet (4) on a heat sink upper cover (6) by taking the rear surface and the left side surface of the jig main body (20) as reference surfaces, placing 220 ℃ high-temperature hard solder in the middle, placing a plurality of laser array strips (1) on the high-heat-conductivity insulating sheet (4), placing 220 ℃ high-temperature hard solder in the middle, placing a first electrode sheet (2) and a second electrode sheet (3) on electrode welding grooves of the plurality of laser array strips (1) in a series connection manner, placing 300 ℃ high-temperature hard solder sheets in the middle, placing a product spacing blocking piece (21) on the jig main body (20), and uniformly spacing the plurality of laser array strips (1), after a spring steel needle (23) is installed on a pressing block (22), the laser array strip is placed on a laser array strip (1), a plurality of laser array strips (1) are pressed and covered by the gravity of the pressing block (22), the spring steel needle (23) fixes the upper surfaces of a first electrode plate (2) and a second electrode plate (3), a plane locking screw (19) is locked and fixed on the side surfaces of the first electrode plate (2) and the second electrode plate (3), meanwhile, the rear datum of a jig main body (20) is well positioned, the whole is placed in a reflow heating furnace, and after welding and fixing, the whole packaging of a linear array laser is completed;
step three, lens assembly: after a pressing block (22), a spring steel needle (23), a product spacing partition (21), a plane locking screw (19) and a jig main body (20) are removed in sequence, an AB glue is directly used for bonding and fixing an insulating support (17) at two ends of a laser array strip (1) on a heat sink upper cover (6), a collimating mirror (18) is placed in a groove of the insulating support (17), and then glue is used for fixing the collimating mirror (18) to complete the assembly of the linear array laser.
6. The packaging method of the linear array laser heat dissipation structure of claim 5, wherein: the inner surface of the jig main body (20) is matched with the outer surface of the heat sink upper cover (6), and the top of the jig main body (20) is provided with a slot matched with the product spacing partition (21).
7. The packaging method of the linear array laser heat dissipation structure of claim 5, wherein: the bottom of the pressing block (22) is provided with an avoiding groove matched with the chip (15).
8. The packaging method of the linear array laser heat dissipation structure of claim 5, wherein: the left side and the right side of the front surface of the jig main body (20) are provided with threaded holes matched with the plane locking screws (19).
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115021070A (en) * | 2022-08-03 | 2022-09-06 | 度亘激光技术（苏州）有限公司 | Side pump module and semiconductor laser |
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