CN114236338A - Thermal cycle test method, device, storage medium and electronic equipment - Google Patents
Thermal cycle test method, device, storage medium and electronic equipment Download PDFInfo
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- 238000005382 thermal cycling Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 description 11
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Abstract
The invention provides a thermal cycle test method, a device, a storage medium and electronic equipment, relating to the technical field of thermal cycle tests, wherein the method is applied to a thermal cycle test system, and the system comprises the following components: the device to be tested, the liquid tank assembly and the plurality of temperature-controllable containers; the method comprises the following steps: acquiring a test temperature change curve; at each instant in the curve, the following operations are performed to bring the temperature variation of the device under test over time into agreement with the curve: acquiring the temperature corresponding to the current moment in the test temperature change curve as the current target temperature; obtaining a flow ratio of each temperature-controllable container when injecting the fluid into the fluid bath assembly based on the current target temperature and the temperature of the fluid in each temperature-controllable container; and controlling each temperature-controllable container to inject fluid into the liquid tank assembly based on the flow ratio so that the temperature of the device to be tested reaches the current target temperature. The technical scheme provided by the invention can more accurately control the temperature of the device to be tested so as to obtain more accurate test results.
Description
Technical Field
The invention relates to the technical field of thermal cycle tests, in particular to a thermal cycle test method and device, a storage medium and electronic equipment.
Background
The thermal cycle test is generally performed on a power semiconductor device, and takes an Insulated Gate Bipolar Transistor (IGBT) module as an example, the IGBT module is formed by welding a chip on a DBC substrate, welding the substrate on the substrate, leading out a main electrode terminal, injecting glue, and performing plastic packaging.
Due to the difference of the thermal expansion coefficients of the materials of the substrate, the lining plate and the chip, the phenomenon of the layering of cavities of welding layers occurs on each interconnection interface due to thermal fatigue caused by the temperature change of the work of the power semiconductor device, so that the thermal resistance of the device is increased, the heat dissipation efficiency of the device is influenced, and finally the failure of the product is caused. The thermal cycling capability of the device is one of the important factors affecting the lifetime of the device.
In a traditional thermal cycle test, a device is generally placed in a temperature change box, and passive thermal cycle of the device is realized through temperature change in the box body.
In the power semiconductor field, another traditional method is to install the semiconductor device directly on the controllable hot plate of temperature change rate that has temperature cycle ability, this hot plate passes through the heating rod heating, the cooling water cools off, the temperature of device changes along with the change of hot plate, compare the mode of temperature change case heat radiation, the device is obviously higher with the mode heat conduction efficiency of controlling the direct contact of temperature board, the application of experimental stress is more accurate, but cooling rate and temperature homogeneity are more difficult to control, and to the unevenness base plate, the installation is difficult, the insufficient contact of base plate and hot plate leads to the temperature follow up poor.
Therefore, the existing thermal cycle test mode has the defects of poor temperature following performance of the device to be tested, inaccurate temperature control of the device to be tested and inaccurate test result.
Disclosure of Invention
In view of the above problems in the prior art, the present invention provides a thermal cycle test method, apparatus, storage medium and electronic device, which can control the temperature of the device under test more accurately to obtain a more accurate test result.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a thermal cycle test method, which is applied to a thermal cycle test system, where the thermal cycle test system includes: the device to be tested, the liquid tank assembly and the plurality of temperature-controllable containers; the device to be tested is fixed on the liquid tank assembly; the device to be tested is fixed with the liquid tank assembly, so that the substrate of the device to be tested is positioned in the liquid tank assembly; when a preset amount of fluid is injected into the liquid tank assembly, the substrate of the device to be tested can be immersed in the fluid; each temperature-controllable container contains the fluid with different temperatures; each temperature-controllable container is communicated with the liquid tank assembly; the method comprises the following steps:
acquiring a preset test temperature change curve; the test temperature change curve reflects the relationship between time and test temperature;
at each moment in the test temperature variation curve, performing the following operations to make the temperature variation of the device under test with time consistent with the test temperature variation curve:
acquiring the temperature corresponding to the current moment in the test temperature change curve as the current target temperature;
obtaining a flow ratio of each of the temperature-controllable containers when filling the fluid tank assembly with the fluid based on the current target temperature and the temperature of the fluid in each of the temperature-controllable containers;
and controlling each temperature-controllable container to inject the fluid into the fluid tank assembly based on the flow ratio so as to enable the temperature of the device to be tested to reach the current target temperature.
Preferably, the temperatures of the fluids in the plurality of temperature-controllable containers are arranged in an arithmetic progression, and the highest temperature of the fluids is the highest temperature in the test temperature change curve, and the lowest temperature of the fluids is the lowest temperature in the test temperature change curve.
Preferably, there are two temperature-controllable containers, namely a first temperature-controllable container and a second temperature-controllable container; obtaining the flow ratio of each temperature-controllable container when injecting the fluid into the fluid tank assembly by adopting the following expression:
wherein K is the flow ratio; t is0Is the current target temperature; t is1Is the temperature of the fluid in the first controlled temperature vessel; t is2Is the temperature of the fluid in the second controlled temperature vessel.
Preferably, the fluid is an oil body.
Preferably, the substrate of the device under test is a pin fin substrate.
Preferably, the size of the liquid bath assembly matches the size of the substrate of the device under test.
Further, the substrate of the device to be tested and the liquid tank assembly are sealed through a high-temperature-resistant sealing ring.
Further, after performing the following operation at each time in the test temperature variation curve to make the change of the temperature of the device under test with time consistent with the test temperature variation curve, the method further includes:
carrying out stress detection on a preset part of the device to be detected to obtain a detection result;
and predicting the service life of the device to be tested based on the detection result.
Preferably, the predicting the lifetime of the device under test based on the detection result includes:
obtaining a thermal cycle life curve of the device to be tested based on the detection result and a known coffee-Mason life model;
and predicting the service life of the device to be tested based on the thermal cycle service life curve of the device to be tested.
In a second aspect, an embodiment of the present invention provides a thermal cycle testing apparatus, which is applied to a thermal cycle testing system, where the thermal cycle testing system includes: the device to be tested, the liquid tank assembly and the plurality of temperature-controllable containers; the device to be tested is fixed on the liquid tank assembly, so that the substrate of the device to be tested is positioned in the liquid tank assembly; when a preset amount of fluid is injected into the liquid tank assembly, the substrate of the device to be tested can be immersed in the fluid; each temperature-controllable container contains the fluid with different temperatures; each temperature-controllable container is communicated with the liquid tank assembly; the device comprises:
the temperature curve acquiring unit is used for acquiring a preset test temperature change curve; the test temperature change curve reflects the relationship between time and test temperature;
the execution unit is used for executing the following operations at each moment in the test temperature change curve so as to enable the change of the temperature of the device to be tested along with time to be consistent with the test temperature change curve:
acquiring the temperature corresponding to the current moment in the test temperature change curve as the current target temperature;
obtaining a flow ratio of each of the temperature-controllable containers when filling the fluid tank assembly with the fluid based on the current target temperature and the temperature of the fluid in each of the temperature-controllable containers;
and controlling each temperature-controllable container to inject the fluid into the fluid tank assembly based on the flow ratio so as to enable the temperature of the device to be tested to reach the current target temperature.
In a third aspect, an embodiment of the present invention provides a storage medium, where a program code is stored, and when the program code is executed by a processor, the thermal cycle testing method according to any one of the above embodiments is implemented.
In a fourth aspect, an embodiment of the present invention provides an electronic device, which includes a memory and a processor, where the memory stores program code that is executable on the processor, and when the program code is executed by the processor, the electronic device implements the thermal cycle test method according to any one of the foregoing embodiments.
According to the thermal cycle test method, the thermal cycle test device, the thermal cycle test storage medium and the electronic equipment, the flow ratio of each temperature-controllable container to the liquid tank assembly when the fluid is injected into the liquid tank assembly is obtained based on the current target temperature and the temperature of the fluid in each temperature-controllable container, and the temperature of the device to be tested reaches the current target temperature by controlling the flow ratio of the fluid injected into the liquid tank assembly by each temperature-controllable container.
Drawings
The scope of the present disclosure will be better understood from the following detailed description of exemplary embodiments, which is to be read in connection with the accompanying drawings. Wherein the included drawings are:
FIG. 1 is a flow chart of a method of an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a DUT (device under test) with a pin fin substrate according to an embodiment of the present invention;
FIG. 3 is a graph of experimental temperature changes in an example of the present invention;
fig. 4 is a diagram showing the structure of an apparatus according to an embodiment of the present invention.
Description of the reference numerals
1-device under test 2-pin fin substrate of device under test
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the following will describe in detail an implementation method of the present invention with reference to the accompanying drawings and embodiments, so that how to apply technical means to solve the technical problems and achieve the technical effects can be fully understood and implemented.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
Example one
The invention provides a novel thermal cycle test method, aiming at solving the problems of low service life modeling accuracy and poor repeatability caused by the defects of poor temperature following performance, low temperature control precision, high cooling rate control difficulty and the like of a passive thermal cycle test of a power semiconductor device by adopting a traditional method.
According to an embodiment of the present invention, there is provided a thermal cycle test method applied to a thermal cycle test system, the thermal cycle test system including: the device to be tested, the liquid tank assembly and the plurality of temperature-controllable containers; the device to be tested is fixed on the liquid tank assembly, so that the substrate of the device to be tested is positioned in the liquid tank assembly; when a preset amount of fluid is injected into the liquid tank assembly, the device substrate to be tested can be immersed in the fluid; each temperature-controllable container contains the fluid with different temperatures; each temperature-controllable container is communicated with the liquid tank assembly.
As shown in fig. 1, the method according to the embodiment of the present invention includes:
step S101, acquiring a preset test temperature change curve; the test temperature change curve reflects the relationship between time and test temperature;
in this example, the test temperatureThe variation is shown in fig. 3. In fig. 3, the abscissa is time t; the ordinate is the test temperature Tc, namely the target temperature required to be reached by the device to be tested; t isRUIs a temperature rise section, THDFor the high temperature holding section, TRDFor the cooling section, TCDIs a low temperature holding section, and TRU、THD、TRD、TCDA thermal cycling period is formed.
In the actual thermal cycle test process, tens of thousands of thermal cycle cycles are repeated to evaluate the thermal cycle capability of the device to be tested, and further, the service life of the device to be tested is evaluated.
Step S102, at each time in the test temperature variation curve, performing the following operations to make the change of the temperature of the device under test with time consistent with the test temperature variation curve: acquiring the temperature corresponding to the current moment in the test temperature change curve as the current target temperature; obtaining a flow ratio of each of the temperature-controllable containers when filling the fluid tank assembly with the fluid based on the current target temperature and the temperature of the fluid in each of the temperature-controllable containers; and controlling each temperature-controllable container to inject the fluid into the fluid tank assembly based on the flow ratio so as to enable the temperature of the device to be tested to reach the current target temperature.
In this embodiment, the temperature of the fluid injected into the fluid tank assembly can be controlled by controlling the flow ratio of the fluid injected into the fluid tank assembly by each temperature-controllable container, so that the substrate temperature of the device to be detected and the temperature of the device to be detected change along with the change of the temperature of the fluid in the fluid tank assembly.
In this embodiment, when the temperature control is performed by the fluid in the plurality of temperature-controllable containers, the temperatures of the fluids in the plurality of temperature-controllable containers are arranged in an arithmetic progression, the highest temperature of the fluid is the highest temperature in the test temperature change curve, and the lowest temperature of the fluid is the lowest temperature in the test temperature change curve.
In order to simplify the operation, in this embodiment, there are two temperature-controllable containers, namely a first temperature-controllable container and a second temperature-controllable container; then, the following expression may be used to obtain the flow ratio of each temperature-controllable container when injecting the fluid into the fluid tank assembly:
k is the flow ratio, namely the flow ratio when each temperature-controllable container injects fluid into the fluid bath component; t is0Is the current target temperature; t is1Is the temperature of the fluid in the first controlled temperature vessel; t is2Is the temperature of the fluid in the second controlled temperature vessel.
In order to make the dut have better temperature following performance, the fluid is oil in this embodiment. Because liquid high temperature oil has good mobility and fillability, its heat-conduction with the base plate direct contact of device to be measured compares gaseous heat radiation more high-efficient, consequently more accurate to the control of the temperature homogeneity, the rate of temperature change and the difference in temperature of device to be measured to this can realize the experimental of becoming more meticulous of product welding layer thermal fatigue. In order to ensure the uniformity and accuracy of the oil temperature, the response is slow through a direct heating mode, and the rapid change of the temperature is difficult to realize. In the embodiment, the constant-temperature oil with the temperature in arithmetic progression arrangement is mixed and modulated in the test process, so that the rapid change of the oil temperature in the liquid tank assembly is realized.
The principle by which the temperature of the oil body in the sump assembly can be controlled using the above expression is explained below:
the energy calculation formula generated by the temperature change of the object is as follows:
q ═ C.M.DELTA.T type (1)
Wherein Q is the energy generated by the temperature change of the object; c is the heat capacity of the object; m is the mass of the object; Δ T is the amount of change in the object.
After two fluids with the same specific heat capacity and different temperatures are mixed, the energy released by the high-temperature fluid is equal to the energy absorbed by the low-temperature fluid, and finally the temperature after the two fluids are mixed is as follows:
wherein, T0The temperature of the two fluids after mixing, namely the current target temperature; t is1The temperature of the high-temperature fluid, namely the temperature of the fluid in the first controllable temperature container; t is2Is the temperature of the cryogenic fluid, i.e., the temperature of said fluid in said second controlled temperature vessel; m1Is the mass of the high temperature fluid; m2Is the mass of the cryogenic fluid.
And the mass of the fluid is calculated as follows:
m ═ ρ V formula (3)
Wherein M is the mass of the fluid; ρ is the density of the fluid; v is the volume of the fluid.
And the volume calculation formula of the fluid is as follows:
V＝∫0 tQLt type (4)
Wherein V is the volume of the fluid; qLIs the flow rate of the fluid; t is time.
The above formulae (3) and (4) may be substituted for the formula (2):
wherein K is a ratio of a flow rate of the high-temperature fluid to a flow rate of the low-temperature fluid, that is, a flow rate ratio of each of the above-mentioned temperature-controllable containers when the fluid is injected into the fluid bath assembly; qL1The flow rate of the high-temperature fluid; qL2Is the flow rate of the cryogenic fluid; t is0The temperature of the two fluids after mixing, namely the current target temperature; t is1The temperature of the high-temperature fluid, namely the temperature of the fluid in the first controllable temperature container; t is2Is the temperature of the cryogenic fluid, i.e., the temperature of the fluid in the second controlled temperature vessel described above.
From the above formula (5):
it can thus be seen that the current target temperature of the fluid in the fluid bath assembly can be controlled by adjusting the flow ratio at which each temperature-controllable container fills the fluid bath assembly. Namely, the temperature T of the high-temperature oil can be utilized by the formula (5)1Low temperature oil temperature T2And the temperature T of the mixed oil0The flow ratio K of the high-temperature oil and the low-temperature oil can be calculated, the K value is fed back to the control system to carry out flow ratio modulation, the quick and accurate change of the mixed oil temperature can be realized, and the temperature change rate of the mixed oil temperature can be realized by adjusting the change rate of the K value. By adopting a constant temperature of T1And T2Two temperature-controllable containers are taken as temperature control auxiliary systems as examples:
(1) a temperature rising section: the high-temperature oil ratio is increased continuously, namely the K value is increased gradually, and the change rate of the K value is consistent with the temperature change rate required by the test.
(2) A high-temperature maintaining section: when the proportion of the high-temperature oil is 100 percent, namely the K value is infinite, the oil temperature reaches the maximum value, and the K value is kept unchanged, so that the high-temperature maintenance can be realized.
(3) A cooling section: the high-temperature oil ratio is continuously reduced, namely the K value is gradually reduced, and the change rate of the K value is consistent with the temperature change rate required by the test.
(4) A low-temperature maintaining section: when the proportion of the high-temperature oil is 0%, namely the K value is 0, the oil temperature reaches the minimum value, and the K value is kept unchanged at the moment, so that the low-temperature maintenance can be realized.
In this embodiment, the substrate of the device under test is a pin fin substrate.
Practice shows that the substrate of the semiconductor power device is designed into an uneven pin fin structure, so that in the process of directly radiating heat in a cooling liquid circulation mode, the thermal contact resistance between the substrate and a radiator can be eliminated, the radiating efficiency is greatly improved, and the current density of the semiconductor power device can be obviously improved. Fig. 2 shows a schematic structural diagram of a device under test with a pin fin substrate.
In this embodiment, the size of cistern subassembly with the size phase-match of the base plate of the device under test, just the base plate of the device under test with it is sealed through high temperature resistant sealing washer between the cistern subassembly.
In addition, this embodiment still can regard as a holistic frock equipment with the device under test that encapsulates through above-mentioned mode and cistern subassembly, adopts special quick plug part to install in whole thermal cycle test system to reach the purpose of realizing quick replacement to the device under test of difference.
Specifically, the high-temperature oil in the multiple temperature-controllable containers is mixed according to different flow ratios to modulate the temperature, so that the rapid change of the oil temperature is realized, the high-temperature oil flows through a liquid tank assembly provided with a device to be tested, which is provided with an uneven substrate (specifically, a pin fin substrate), and the pin fins of the pin fin substrate are immersed in the oil body, so that the temperature of the device to be tested accurately changes along with the temperature of the high-temperature oil. And finally, combining a Coffin-Mason life model to obtain a life curve according to the cycle life of the device to be tested under different test conditions.
It should be noted that, in the present embodiment, the temperature-controllable container contains a constant-temperature fluid having a certain temperature, and in an actual test process, the temperature of the fluid in the temperature-controllable container can be adjusted by the temperature-controllable container, so as to adjust the temperature of the fluid in the temperature-controllable container from one constant-temperature to another constant-temperature, so as to adapt to different test requirements. That is, the temperature-controllable container in this embodiment also has a function of adjusting the temperature of the fluid contained therein.
In practical application, the method described in this embodiment may be further divided into the following functional modules: a master control system, a temperature control system, a customized installation component and other guarantee systems. The master control system is used as a coordination control center of each system, and responses of each system are rapidly allocated in real time through feedback information; the temperature control system controls the flow ratio of each temperature-controllable container when oil bodies are injected into the liquid tank assembly, so that the rapid linear change of the test temperature is realized; the customized liquid tank assembly is designed according to the shape, size and the like of each type of device to be tested and the substrate, namely the shape and size of the liquid tank assembly are matched with the corresponding substrate. The rapid plugging interface is designed on the customized installation assembly, so that the tool can be rapidly replaced. Other security systems include power supplies, safety protection and other auxiliary devices.
Of course, the division of the functional modules is only an example, and the method described in this embodiment may be further divided into other functional modules capable of executing the method described in this embodiment according to actual needs, which is not limited herein.
In this embodiment, after performing the following operation at each time in the test temperature variation curve to make the change of the temperature of the device under test with time consistent with the test temperature variation curve, the method further includes: carrying out stress detection on a preset part of the device to be detected to obtain a detection result; and predicting the service life of the device to be tested based on the detection result.
Wherein the predicting the lifetime of the device under test based on the detection result comprises: obtaining a thermal cycle life curve of the device to be tested based on the detection result and a known coffee-Mason life model; and predicting the service life of the device to be tested based on the thermal cycle service life curve of the device to be tested.
Specifically, after the thermal cycle test is performed on the device to be tested, stress is applied to certain key parts of the device to be tested to evaluate the stress which can be borne by the parts at this time, a detection result of whether the welding layer cavity of the device to be tested is still within a specified range is obtained, a thermal cycle life curve of the device to be tested is obtained through calculation by combining a coffee-Mason life model, and finally the life of the device to be tested is predicted based on the thermal cycle life curve.
The embodiment is suitable for evaluating the service life of the welding layer of the semiconductor power device with the uneven substrate structure.
According to the thermal cycle test method provided by the embodiment of the invention, the flow ratio of each temperature-controllable container to the liquid tank assembly when the fluid is injected into the liquid tank assembly is obtained based on the current target temperature and the temperature of the fluid in each temperature-controllable container, and the temperature of the device to be tested reaches the current target temperature by controlling the flow ratio of the fluid injected into the liquid tank assembly by each temperature-controllable container.
Example two
Correspondingly to the above method embodiment, the present invention further provides a thermal cycle testing apparatus, which is applied to a thermal cycle testing system, wherein the thermal cycle testing system comprises: the device to be tested, the liquid tank assembly and the plurality of temperature-controllable containers; the device to be tested is fixed on the liquid tank assembly, so that the substrate of the device to be tested is positioned in the liquid tank assembly; when a preset amount of fluid is injected into the liquid tank assembly, the substrate of the device to be tested can be immersed in the fluid; each temperature-controllable container contains the fluid with different temperatures; each temperature-controllable container is communicated with the liquid tank assembly.
As shown in fig. 4, the apparatus includes:
a temperature curve obtaining unit 201, configured to obtain a preset test temperature variation curve; the test temperature change curve reflects the relationship between time and test temperature;
an execution unit 202, configured to, at each time in the test temperature variation curve, perform the following operations to make a change of the temperature of the device under test over time consistent with the test temperature variation curve: acquiring the temperature corresponding to the current moment in the test temperature change curve as the current target temperature; obtaining a flow ratio of each of the temperature-controllable containers when filling the fluid tank assembly with the fluid based on the current target temperature and the temperature of the fluid in each of the temperature-controllable containers; and controlling each temperature-controllable container to inject the fluid into the fluid tank assembly based on the flow ratio so as to enable the temperature of the device to be tested to reach the current target temperature.
In this embodiment, the temperatures of the fluids in the plurality of temperature-controllable containers are arranged in an arithmetic progression, the highest temperature of the fluid is the highest temperature in the test temperature variation curve, and the lowest temperature of the fluid is the lowest temperature in the test temperature variation curve.
In this embodiment, there are two temperature-controllable containers, which are a first temperature-controllable container and a second temperature-controllable container; the execution unit 202 obtains the flow ratio of each temperature-controllable container when injecting the fluid into the fluid tank assembly by using the following expression:
wherein K is the flow ratio; t is0Is the current target temperature; t is1Is the temperature of the fluid in the first controlled temperature vessel; t is2Is the temperature of the fluid in the second controlled temperature vessel.
In this embodiment, the fluid is an oil body.
In this embodiment, the substrate of the device under test is a pin fin substrate.
In this embodiment, the size of the liquid bath assembly matches the size of the substrate of the device under test.
Further, in this embodiment, the substrate of the device under test and the liquid bath assembly are sealed by a high temperature resistant sealing ring.
Further, the apparatus of this embodiment further includes:
the stress detection unit is used for performing stress detection on a preset part of the device to be detected after the execution unit 202 executes a thermal cycle test to make the change of the temperature of the device to be detected along with time consistent with the test temperature change curve, so as to obtain a detection result;
and the prediction unit is used for predicting the service life of the device to be tested based on the detection result.
In this embodiment, the prediction unit includes:
a life curve obtaining unit, configured to obtain a thermal cycle life curve of the device to be tested based on the detection result and a known Coffin-Mason life model;
and the predicting subunit is used for predicting the service life of the device to be tested based on the thermal cycle service life curve of the device to be tested.
The working principle, the working flow and the like of the device are related to the specific implementation of the thermal cycle test method provided by the invention, and the detailed description of the same technical content is omitted here.
According to the thermal cycle test device provided by the embodiment of the invention, the flow ratio of each temperature-controllable container to the liquid tank assembly is obtained based on the current target temperature and the temperature of the fluid in each temperature-controllable container, and the temperature of the device to be tested reaches the current target temperature by controlling the flow ratio of the fluid to be injected into the liquid tank assembly by each temperature-controllable container.
EXAMPLE III
There is also provided, in accordance with an embodiment of the present invention, a storage medium having program code stored thereon, which when executed by a processor, implements a thermal cycling test method as described in any one of the above embodiments.
Example four
There is also provided, according to an embodiment of the present invention, an electronic device including a memory and a processor, the memory having stored thereon program code executable on the processor, the program code implementing the thermal cycle testing method according to any one of the above embodiments when executed by the processor.
According to the thermal cycle test method, the thermal cycle test device, the thermal cycle test storage medium and the electronic equipment, the flow ratio of each temperature-controllable container to the liquid tank assembly when the fluid is injected into the liquid tank assembly is obtained based on the current target temperature and the temperature of the fluid in each temperature-controllable container, and the temperature of the device to be tested reaches the current target temperature by controlling the flow ratio of the fluid injected into the liquid tank assembly by each temperature-controllable container.
The invention solves the technical problems that the temperature following effect is poor when the power semiconductor device with the uneven substrate adopts the temperature change box to carry out the thermal cycle test, and the power semiconductor device cannot be directly arranged on the temperature-controllable heating plate to carry out the passive thermal cycle test. The invention utilizes the excellent filling property of the fluid and takes high-temperature oil as a heat transfer medium to realize the rapid and accurate control of the temperature of the welding layer of the device with the uneven substrate, thereby ensuring the evaluation accuracy of the thermal fatigue life of the device to be tested. Meanwhile, the temperature-controllable containers with the temperature in arithmetic progression arrangement are arranged and mixed and modulated through different flow ratios, so that the rapid and accurate change of the temperature is realized.
The invention also has the following advantages:
(1) the invention solves the problem that the power semiconductor device with the uneven substrate cannot be subjected to the passive thermal cycle test, has the characteristics of better temperature following effect, higher temperature control precision and better temperature uniformity of the device, and can obtain a product with more accurate service life of a welding layer and better test repeatability.
(2) The temperature change rate of the temperature control plate in the heating section and the cooling section can be accurately controlled, and the problem that the temperature rate is difficult to accurately control because the water is used for cooling in a passive thermal cycle test of the traditional temperature control plate is solved.
(3) The oil temperature setting range of the invention is wide, and the invention can solve the problem that the traditional heating plate can not realize negative temperature circulation when in passive thermal circulation.
(4) The invention adopts the auxiliary thermostatic bath for temperature mixing modulation, the temperature change rate of the mixed oil can be faster in the limited heating power, and the temperature uniformity is better.
(5) The device adopts the customized installation component with the quick plug interface, has strong universality and simple and convenient replacement, and greatly reduces the equipment development cost compared with the traditional test method. The whole system is simple in design and has high engineering application value.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, a division of a unit is merely a logical division, and an actual implementation may have another division, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed.
Units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment of the present invention.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention essentially or partially contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing an electronic device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (12)
1. A thermal cycle test method is characterized by being applied to a thermal cycle test system, wherein the thermal cycle test system comprises: the device to be tested, the liquid tank assembly and the plurality of temperature-controllable containers; the device to be tested is fixed on the liquid tank assembly, so that the substrate of the device to be tested is positioned in the liquid tank assembly; when a preset amount of fluid is injected into the liquid tank assembly, the substrate of the device to be tested can be immersed in the fluid; each temperature-controllable container contains the fluid with different temperatures; each temperature-controllable container is communicated with the liquid tank assembly; the method comprises the following steps:
acquiring a preset test temperature change curve; the test temperature change curve reflects the relationship between time and test temperature;
at each moment in the test temperature variation curve, performing the following operations to make the temperature variation of the device under test with time consistent with the test temperature variation curve:
acquiring the temperature corresponding to the current moment in the test temperature change curve as the current target temperature;
obtaining a flow ratio of each of the temperature-controllable containers when filling the fluid tank assembly with the fluid based on the current target temperature and the temperature of the fluid in each of the temperature-controllable containers;
and controlling each temperature-controllable container to inject the fluid into the fluid tank assembly based on the flow ratio so as to enable the temperature of the device to be tested to reach the current target temperature.
2. The thermal cycle test method of claim 1, wherein the temperatures of the fluids in the plurality of temperature-controllable containers are arranged in an arithmetic series, and the maximum temperature of the fluid is the highest temperature in the test temperature variation curve, and the minimum temperature of the fluid is the lowest temperature in the test temperature variation curve.
3. The thermal cycle test method according to claim 1, wherein there are two temperature-controllable containers, namely a first temperature-controllable container and a second temperature-controllable container; obtaining the flow ratio of each temperature-controllable container when injecting the fluid into the fluid tank assembly by adopting the following expression:
wherein K is the flow ratio; t is0Is the current target temperature; t is1Is the temperature of the fluid in the first controlled temperature vessel; t is2Is the temperature of the fluid in the second controlled temperature vessel.
4. The thermal cycle test method of claim 1, wherein the fluid is an oil body.
5. The thermal cycle test method of claim 1, wherein the substrate of the device under test is a pin fin substrate.
6. The thermal cycle test method of claim 1, wherein the dimensions of the fluid bath assembly match the dimensions of the substrate of the device under test.
7. The thermal cycle test method of claim 6, wherein the substrate of the device under test and the fluid bath assembly are sealed by a high temperature resistant sealing ring.
8. The thermal cycle test method of claim 1, wherein after performing the following operations at each time in the test temperature variation curve to make the temperature variation of the device under test with time consistent with the test temperature variation curve, the method further comprises:
carrying out stress detection on a preset part of the device to be detected to obtain a detection result;
and predicting the service life of the device to be tested based on the detection result.
9. The thermal cycle test method of claim 8, wherein predicting the lifetime of the device under test based on the detection result comprises:
obtaining a thermal cycle life curve of the device to be tested based on the detection result and a known coffee-Mason life model;
and predicting the service life of the device to be tested based on the thermal cycle service life curve of the device to be tested.
10. A thermal cycle test device is characterized in that the thermal cycle test device is applied to a thermal cycle test system, and the thermal cycle test system comprises: the device to be tested, the liquid tank assembly and the plurality of temperature-controllable containers; the device to be tested is fixed on the liquid tank assembly, so that the substrate of the device to be tested is positioned in the liquid tank assembly; when a preset amount of fluid is injected into the liquid tank assembly, the substrate of the device to be tested can be immersed in the fluid; each temperature-controllable container contains the fluid with different temperatures; each temperature-controllable container is communicated with the liquid tank assembly; the device comprises:
the temperature curve acquiring unit is used for acquiring a preset test temperature change curve; the test temperature change curve reflects the relationship between time and test temperature;
the execution unit is used for executing the following operations at each moment in the test temperature change curve so as to enable the change of the temperature of the device to be tested along with time to be consistent with the test temperature change curve:
acquiring the temperature corresponding to the current moment in the test temperature change curve as the current target temperature;
obtaining a flow ratio of each of the temperature-controllable containers when filling the fluid tank assembly with the fluid based on the current target temperature and the temperature of the fluid in each of the temperature-controllable containers;
and controlling each temperature-controllable container to inject the fluid into the fluid tank assembly based on the flow ratio so as to enable the temperature of the device to be tested to reach the current target temperature.
11. A storage medium having program code stored thereon, wherein the program code, when executed by a processor, implements a thermal cycle testing method according to any one of claims 1 to 9.
12. An electronic device comprising a memory, a processor, the memory having stored thereon program code executable on the processor, the program code when executed by the processor implementing the thermal cycling test method according to any one of claims 1 to 9.
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