CN114228017B - Forming device and forming process of DCDC converter and DCDC converter - Google Patents
Forming device and forming process of DCDC converter and DCDC converter Download PDFInfo
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- CN114228017B CN114228017B CN202210170418.1A CN202210170418A CN114228017B CN 114228017 B CN114228017 B CN 114228017B CN 202210170418 A CN202210170418 A CN 202210170418A CN 114228017 B CN114228017 B CN 114228017B
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/26—Moulds or cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Abstract
The invention provides a forming device and a forming process of a DCDC converter and the DCDC converter, wherein the forming device comprises: the lower die comprises a supporting plate, and a plurality of placing grooves are formed in one surface of the supporting plate; the positioning columns are arranged in the placing grooves in a matched mode one by one, and one ends of the positioning columns are connected into the placing grooves; the upper die is provided with a plurality of grooves and cavities corresponding to the plurality of putting grooves, the bottoms of the grooves are provided with through holes, one side wall of each groove is provided with an opening, and the openings are used for communicating the cavities with the grooves; the other end of the positioning column is inserted into the through hole, the top end face of the lower die placing groove and the end face of the outer side of the bottom of the groove in the upper die are abutted together, the through hole is filled with the positioning column, the converter does not have a metal shell, and the converter is small in overall size and low in cost.
Description
Technical Field
The invention relates to the technical field of production equipment and production processes of vehicle DCDC converters, in particular to a forming device and a forming process of a DCDC converter and the DCDC converter.
Background
Most DCDC (direct current-direct current) converters on the market mostly adopt to set up in the shell of aluminium die-casting after the inner core components and parts encapsulating, and the shell generally can play the effect of protection converter inner core, but because requirements such as inside creepage distance of converter, electrical insulation, the shell generally need be designed into and has certain volume, makes the whole bulky of converter product like this, and is with high costs.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a forming device and a forming process of a DCDC converter and the DCDC converter.
In order to achieve the above objects and other objects, the present invention includes the following technical solutions: the present invention provides a molding apparatus of a DCDC converter, the apparatus including: the lower die comprises a supporting plate, and a plurality of placing grooves are formed in one surface of the supporting plate; the positioning columns are arranged in the placing grooves in a matched mode one by one, and one ends of the positioning columns are connected into the placing grooves; the upper die is provided with a plurality of grooves and cavities corresponding to the plurality of putting grooves, the bottoms of the grooves are provided with through holes, one side wall of each groove is provided with an opening, and the openings are used for communicating the cavities with the grooves; the other end of the positioning column is inserted into the through hole, the top end face of the lower die placing groove and the end face of the outer side of the bottom of the groove in the upper die are abutted together, and the through hole is filled with the positioning column.
In one embodiment, the positioning column comprises a base plate and a boss which are connected together, the base plate is connected in the insertion groove, and the boss is inserted into the through hole.
In one embodiment, the top of the boss and the bottom of the groove are on the same plane, the outer end face of the groove corresponding to the through hole is provided with a convex part communicated with the groove, the boss penetrates through the convex part to fill the through hole, and the inner surface shape of the convex part is matched with that of the boss.
In one embodiment, the substrate is movably connected in the placing groove, the substrate and the supporting plate in the placing groove are provided with connecting holes, the connecting holes in the supporting plate are provided with limiting columns communicated with the connecting holes, the height of each limiting column is larger than the thickness of the substrate, and the outer diameter of each limiting column is smaller than the diameter of each connecting hole of the substrate.
In an embodiment, the upper die and the positioning column are made of the same material, and the material is any one of polytetrafluoroethylene, silica gel, aluminum and polystyrene.
The invention also provides a forming process of the DCDC converter, which comprises the following steps:
-S1: providing a molding apparatus, the molding apparatus comprising: the lower die comprises a supporting plate, and a plurality of placing grooves are formed in one surface of the supporting plate; the positioning columns are arranged in the placing grooves in a matched mode one by one, and one ends of the positioning columns are connected into the placing grooves; the upper die is provided with a plurality of grooves and cavities corresponding to the plurality of putting grooves, the bottoms of the grooves are provided with through holes, one side wall of each groove is provided with an opening, and the openings are used for communicating the cavities with the grooves; the other end of the positioning column is inserted into the through hole, the end face of the top of the lower die placing groove is abutted against the end face of the outer side of the bottom of the groove in the upper die, and the through hole is filled with the positioning column; -S2: the circuit board and the connector which are connected together are respectively arranged in the groove and the cavity, and one end of the connector is clamped and fixed at the opening of the side wall of the groove; -S3: introducing pouring sealant into the groove and curing to obtain a sealant layer, wherein the sealant layer and the circuit board are integrally formed into the converter body; -S4: and taking out the converter body and the connector to obtain the DCDC converter.
In an embodiment, the potting adhesive is any one or more of epoxy resin, silica gel, and polyurethane.
In one embodiment, the substrate is movably connected in the placing groove, the substrate and the supporting plate in the placing groove are provided with connecting holes, the connecting holes in the supporting plate are provided with limiting columns communicated with the connecting holes, the height of each limiting column is larger than the thickness of the substrate, and the outer diameter of each limiting column is smaller than the diameter of each connecting hole of the substrate.
In an embodiment, the upper die and the positioning column are made of the same material, and the material is any one of polytetrafluoroethylene, silica gel, aluminum and polystyrene.
In one embodiment, the length of the converter body is 35-40 mm, the width is 23-26 mm, and the height is 14-17 mm.
In one embodiment, the potting layer has any one or more of the following characteristics: (1) the Shore D hardness at normal temperature is 70-90; (2) volume resistivity at normal temperature is more than 1014Omega cm; (3) the insulation strength at normal temperature is more than 15 KV/mm; (4) the water absorption rate of 24 hours at normal temperature is less than 0.3 percent; (5) the tensile strength is more than 20 MPa; (6) the heat conductivity coefficient is more than 0.7W/m.K; (7) the flame retardant rating reaches UL 94V-0; (8) the application temperature range is-60 to 135 ℃.
The invention further provides the DCDC converter prepared by the molding process.
Compared with the prior art, the molding device and the molding process of the DCDC converter and the DCDC converter provided by the invention have the advantages that the upper die and the positioning column are made of polytetrafluoroethylene materials, the die made of the materials does not react with pouring sealant, the requirement of glue pouring molding can be met, automatic equipment is used for ejecting a product for molding, the production efficiency is high, workers are easy to operate, mass production can be realized, and the produced converter has the advantages of small volume, light weight and low cost.
Drawings
Fig. 1 is a schematic diagram of a converter according to the present invention.
Fig. 2 is a schematic diagram of the converter circuit board and connector of the present invention.
FIG. 3 is a schematic structural view of the molding apparatus of the present invention.
Fig. 4 is a schematic structural view of the lower mold and the positioning post of the present invention.
Fig. 5 is a schematic structural view of the positioning post of the present invention.
Fig. 6 is a schematic structural view of the upper mold of the present invention.
Figure 7 shows a cross-sectional view of the insertion groove of the present invention.
FIG. 8 is a cross-sectional view of the molding apparatus of the present invention.
FIG. 9 is a view showing a positional relationship between the upper mold and the convex portion according to the present invention.
FIG. 10 shows a process flow diagram of the forming process of the present invention.
FIG. 11 is a graph showing the average efficiency of the converter with different input voltages according to the present invention.
Detailed Description
Referring to fig. 1 to 11, embodiments of the present invention are described below with specific examples, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
As shown in fig. 1 to 3, the present invention provides a DCDC converter, which has no metal casing and is integrally formed by a circuit board and an encapsulating layer wrapped outside the circuit board, the DCDC converter 100 may be a dc power supply that converts a high-voltage dc power supply into a low-voltage dc power supply so as to convert and supply power to different low-voltage electric devices in a vehicle, and the output power of the DCDC converter 100 may be 30 to 125W, such as 64W, 94W, 104W, and the like.
As shown in fig. 1 to 2, the converter 100 may include a converter body 101, the converter body 101 includes a circuit board 101a, an inner core component of the converter 100 may be disposed on the circuit board 101a, the converter body 101 may further include an encapsulating layer, the encapsulating layer may wrap the circuit board 101a, the converter 100 may further include a connector 102, the connector 102 may be fixed on one side of the converter body 101, the connector 102 may connect the converter body 101 and a device that needs to be converted and powered, an outer contour of the encapsulating layer may be a cubic structure, a length of the outer contour of the encapsulating layer may be 35 to 40mm, for example, 38.5mm, a width of the encapsulating layer may be 23 to 26mm, for example, 25mm, and a height of the encapsulating layer may be 14 to 17mm, for example, 16 mm. The glue-pouring layer is directly used as the shell of the converter body 101, so that the size of the converter 100 is reduced.
As shown in fig. 3 and 4, the present invention further provides a molding apparatus 1 for a DCDC converter as described above, the molding apparatus 1 may include a lower mold 200, the lower mold 200 may be made of a metal material, for example, an aluminum material, the lower mold 200 includes a support plate 201, the support plate 201 is provided with a plurality of insertion grooves 202, the insertion grooves 202 may include 20 to 40 insertion grooves 202, and the insertion grooves 202 may be arranged in an array on the support plate 201, for example, may be 4 × 5, 5 × 6, 6 × 6, and the like. The support plate 201 may be a rectangular parallelepiped with rounded corners.
As shown in fig. 3 and 4, the forming apparatus 1 may further include a plurality of positioning pillars 300, the positioning pillars 300 may be individually disposed in the insertion groove 202, the positioning pillars 300 may be made of any one of teflon, aluminum, silicone, and polystyrene, and further may be made of teflon, the positioning pillars 300 may include a substrate 300a and a boss 300b, the substrate 300a and the boss 300b may be integrally formed, the boss 300b may be connected to a surface of the substrate 300a, for example, the boss 300b may be vertically disposed on a surface of the substrate 300a, the substrate 300a may be connected to the insertion groove 202, and the connection manner may be fixed.
As shown in fig. 5 and 7, in order to meet the slight difference in the size of the upper mold 400, the substrate 300a may be movably connected to the insertion groove 202, and the movable connection may be as follows, specifically, the substrate 300a and the support plate 201 in the insertion groove 202 may both be provided with a connection hole 203. The connecting hole 203 of the supporting plate 201 may be provided with a limiting post 204 communicated therewith, the height of the limiting post 204 may be greater than the thickness of the substrate 300a, the outer diameter of the limiting post 204 may be smaller than the diameter of the connecting hole 203 of the substrate 300a, the movable connection may be implemented by using a bolt assembly 205, the bolt assembly 205 may include a bolt body 205a and a limiting member 205b, the limiting member 205b may be disposed between the limiting post 204 and the bolt body 205a, the bolt body 205a passes through the limiting member 205b to enter the limiting post 204 and is finally inserted into the connecting hole 203 of the supporting plate 201 to limit the substrate 300a between the bolt assembly 205 and the supporting plate 201, and further, the diameter of the limiting member 205b is greater than the diameter of the connecting hole 203 of the substrate 300 a. According to the invention, the up-down and left-right displacement of the substrate 300a in the placing groove 202 is realized through the difference of the thickness of the bolt assembly 205, the limiting column 204 and the substrate 300a and the aperture of the connecting hole 203, so that the leakage of pouring sealant caused by dimension errors caused by a preparation process of a mold is avoided.
As shown in fig. 6 and 8, the forming apparatus 1 may further include an upper die 400, the upper die 400 may be made of the same material as the positioning column 300, the upper die 400 may be made of any one of teflon, aluminum, and silicone, and further may be made of teflon, the upper die 400 is provided with a plurality of grooves 401 and cavities 402 corresponding to the insertion groove 202, the cavities 402 may be communicated through side wall openings 401b of the grooves 401, the bottom of the grooves 401 is provided with through holes 401a, further, the top of the bosses 300b covers the through holes 401a, the top of the bosses 300b and the bottom of the grooves 401 may be located on the same plane, and specifically, the bosses 300b may be interference-filled in the through holes 401a to seal the through holes 401 a. The groove 401 may be used for molding the potting layer, and specifically, the shape of the groove 401 is the same as that of the transducer body 101.
As shown in fig. 4 and 6, the top end surface of the lower mold insertion groove 202 abuts against the bottom outer end surface of the upper mold middle groove 401, the top of the boss 300b of the positioning post 300 can fill the through hole 401a, and further, the surface area of the top of the through hole 401a can be 8-10 mm2。
As shown in fig. 6 to 8, in some embodiments, the outer end surface of the recess 401 corresponding to the through hole 401a is provided with a protrusion 403 communicating with the recess 401, the inner surface of the protrusion 403 may be shaped to match the boss 300b, and the protrusion 403 may enhance the stability of the upper die 400 and the lower die 200 abutting against each other.
As shown in fig. 7, when the molding apparatus 1 is used, the bottom surface of the groove 401 of the upper mold 400 can abut against the upper end surface of the insertion groove 202 of the lower mold 200, and the boss 300b on the positioning post 300 can fill the through hole 401a in the groove 401.
As shown in fig. 9, another aspect of the present invention further provides a molding process of a DCDC converter, where the molding process may integrally mold a circuit board of the converter and a potting adhesive to obtain the converter, and a metal shell is not required to be separately disposed, the converter includes a converter body and a connector, and the molding process includes steps S1 to S4:
-S1: providing a molding apparatus, the molding apparatus comprising:
the lower die comprises a supporting plate, and a plurality of placing grooves are formed in one surface of the supporting plate;
the positioning columns are arranged in the placing grooves in a matched mode one by one, and one ends of the positioning columns are fixed in the placing grooves;
the upper die is provided with a plurality of grooves and cavities corresponding to the plurality of putting grooves, the bottoms of the grooves are provided with through holes, one side wall of each groove is provided with an opening, and the openings are used for communicating the cavities with the grooves;
the other end of the positioning column is inserted into the through hole, the end face of the top of the lower die placing groove is abutted against the end face of the outer side of the bottom of the groove in the upper die, and the through hole is filled with the positioning column;
-S2: the circuit board and the connector which are connected together are respectively arranged in the groove and the cavity, and one end of the connector is clamped and fixed at the opening of the side wall of the groove;
-S3: introducing pouring sealant into the groove and curing to obtain a sealant layer, wherein the sealant layer and the circuit board are integrally formed into the converter body;
-S4: and taking out the converter body and the connector to obtain the DCDC converter.
In step S1, the molding apparatus may be integrally disposed on a dispenser.
In step S2, as shown in fig. 2 and fig. 6, the circuit board 101a and the connector 102 may be connected in advance, specifically, the connector is provided with card slots 102a, the card slots 102a may be symmetrically disposed on an end surface of the connector 102, and the card slots 102a may facilitate clamping the connector 102 at the side wall opening 401 b.
In step S3, the pouring sealant may be introduced through a dispenser, before the pouring sealant is introduced, a release agent may be sprayed on the sidewall and the bottom of the groove 401, the release agent may be a mylar polyester material, the pouring sealant may be any one of epoxy resin, silica gel, and polyurethane, and further may be polyurethane, the polyurethane may be polyurethane of two components, the pouring sealant may be a dark liquid such as brown, black, etc., the viscosity of the pouring sealant may be 1500 to 2500mPa · S at normal temperature, and the density may be 1.5 to 1.7g/cm3The gel time (160 g) of the pouring sealant at normal temperature can be 30-50 min. Further, the pouring sealant can be a Shanghai Fuming type FM-500(HT) pouring sealant, the curing temperature can be 50-70 ℃, for example 60 ℃, the curing time can be 20-40 min, for example 30min, and the curing can be completed by baking in a tunnel furnace.
In step S3, further, the hardness Shore D of the gel-filled layer at normal temperature may be 70 to 90, and the volume resistivity at normal temperature may be greater than 1014Omega cm, the insulation strength at normal temperature can be more than 15 KV/mm, the water absorption rate at normal temperature for 24h can be less than 0.3%, the tensile strength of the encapsulating layer can be more than 20MPa, the heat conductivity coefficient can be more than 0.7W/m.K, the flame retardant grade can reach UL94V-0, and the application temperature range of the encapsulating layer can be-60-135 ℃.
In step S4, the converter body 101 with the connector 102 connected to the recess 401 can be taken out by a robot, the lower mold 200 and the upper mold 400 can be disassembled, the converter 100 can be ejected from the through hole 401a by the robot, and the ejected converter 100 can be placed in a blister tray for packaging to obtain a finished product.
Examples of the invention
In one embodiment, the DCDC converter can be manufactured by the following steps:
-S1: providing a forming device as shown in fig. 3, wherein an upper die and a positioning column are both made of teflon materials, and the forming device is fixed on a dispensing table;
-S2: the circuit board and the connector which are connected together are respectively arranged in the groove and the cavity, and one end of the connector is clamped and fixed at the opening of the side wall of the groove;
-S3: introducing a pouring sealant FM-500(HT) into the groove through a dispenser, conveying the pouring sealant into a tunnel furnace through a conveyor belt, and curing for 30min at the temperature of 60 ℃ to obtain a pouring sealant layer, wherein the pouring sealant layer and the circuit board are integrally formed into the converter body;
-S4: and ejecting the converter body and the connector in batches by using a manipulator automation device to obtain the DCDC converter sample.
Evaluation of
(1) Sample efficiency
The average efficiency of the converter was measured for different input voltages according to the present invention and the results are shown in fig. 10. One path of output of the converter is 12V/5A, the other path of output of the converter is 5V/1A, two paths of output circuits can respectively supply power for equipment with different voltage requirements on the electric vehicle in a conversion mode, the average efficiency can reach more than 92%, and the performance is good.
(2) Point temperature test
The invention adopts the point temperature test to carry out the temperature test on the components on the converter circuit board so as to evaluate the heat dissipation performance. The point temperature test method comprises the following steps: the thermocouple wires are dotted on the upper surface of each device on the circuit board, the thermocouple wires and the circuit board are integrated into a whole by glue pouring according to the steps in the example and are placed in a constant temperature box at 40 ℃, the converter product is fully loaded in the constant temperature box to work, a computer is used for recording temperature data, and a dotted temperature data table is shown in table 1.
As can be seen from table 1, the temperatures of the various electrical components do not exceed the specified maximum temperature (SPEC temperature), and the converter prepared by the present invention has good heat dissipation performance.
TABLE 1 evaluation table of point temperature data
| Temperature point Device for placing | SPEC Temperature of | 72V，40℃12V/ 3.5A，5V/1A | 65V，40℃，12V/ 4A，5V/1A | 54V，40℃12V/ 4.5A，5V/1A | 54V，40℃12V/ 4A，5V/1A | 48V，40℃12V/
4.5A，5V/ |
36V，40℃12V/ 5A，5V/1A |
| Electrolysis of electricity CS2 | 105 | 98.9 | 102 | 104.29 | 96.975 | 100.34 | 102.41 |
| Electrolysis of electricity CS3 | 105 | 95.9 | 98.68 | 100.48 | 93.744 | 96.618 | 98.082 |
| Inductor L1 | 130 | 121.7 | 125.39 | 127.219 | 116.828 | 121.02 | 121.833 |
| MOS tube Q1 | 150 | 128 | 131.58 | 132.74 | 120.438 | 124.87 | 125.312 |
| MOS tube Q2 | 150 | 121.7 | 125.9 | 128.23 | 116.913 | 121.131 | 122.814 |
| Chip U1 | 125 | 114.6 | 117.3 | 117.898 | 109.23 | 112.27 | 112.581 |
| Resistor R2 | 155 | 127.6 | 131.9 | 134.428 | 122.203 | 127.255 | 129.409 |
| Ambient temperature Degree AMB | 39.6 | 36.6 | 37.463 | 37.786 | 37.53 | 38.081 | |
| Triode transistor QA1 | 150 | 125.3 | 128.37 | 129.55 | 119.381 | 122.78 | 122.679 |
| Chip and method for manufacturing the sameU2 | 125 | 96.6 | 99 | 100.452 | 94.211 | 96.834 | 98.362 |
Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value. The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (8)
1. An apparatus for molding a DC/DC converter, the apparatus comprising:
the lower die comprises a supporting plate, and a plurality of placing grooves are formed in one surface of the supporting plate;
the positioning columns are arranged in the placing grooves in a matched mode one by one, and one ends of the positioning columns are connected into the placing grooves;
the upper die is provided with a plurality of grooves and cavities corresponding to the plurality of putting grooves, the bottoms of the grooves are provided with through holes, one side wall of each groove is provided with an opening, and the openings are used for communicating the cavities with the grooves;
the other end of the positioning column is inserted into the through hole, the top end face of the lower die placing groove and the end face of the outer side of the bottom of the groove in the upper die are abutted together, and the through hole is filled with the positioning column.
2. The molding apparatus as defined in claim 1, wherein: the positioning column comprises a base plate and a boss which are connected together, the base plate is connected in the putting groove, and the boss is inserted into the through hole.
3. The molding apparatus as defined in claim 2, wherein: the top of the boss and the bottom of the groove are on the same plane, the end face of the outer side of the groove corresponding to the through hole is provided with a convex part communicated with the groove, the boss penetrates through the convex part to fill the through hole, and the inner surface shape of the convex part is matched with that of the boss.
4. The molding apparatus as defined in claim 2, wherein: the base plate is movably connected in the putting-in groove, connecting holes are formed in the base plate and the supporting plate in the putting-in groove, limiting columns communicated with the connecting holes are arranged on the connecting holes in the supporting plate, the height of each limiting column is larger than the thickness of the base plate, and the outer diameter of each limiting column is smaller than the diameter of each base plate connecting hole.
5. A molding process of a DC/DC converter is characterized in that: the molding process comprises the following steps:
-S1: providing a molding apparatus, the molding apparatus comprising: the lower die comprises a supporting plate, and a plurality of placing grooves are formed in one surface of the supporting plate;
the positioning columns are arranged in the placing grooves in a matched mode one by one, and one ends of the positioning columns are connected into the placing grooves;
the upper die is provided with a plurality of grooves and cavities corresponding to the plurality of putting grooves, the bottoms of the grooves are provided with through holes, one side wall of each groove is provided with an opening, and the openings are used for communicating the cavities with the grooves;
the other end of the positioning column is inserted into the through hole, the end face of the top of the lower die placing groove is abutted against the end face of the outer side of the bottom of the groove in the upper die, and the through hole is filled with the positioning column;
-S2: the circuit board and the connector which are connected together are respectively arranged in the groove and the cavity, and one end of the connector is clamped and fixed at the opening of the side wall of the groove;
-S3: introducing pouring sealant into the groove and curing to obtain a sealant layer, wherein the sealant layer and the circuit board form a converter body integrally;
-S4: and taking out the converter body and the connector to obtain the DC/DC converter.
6. The molding process according to claim 5, wherein: the pouring sealant is any one or more of epoxy resin, silica gel and polyurethane.
7. The molding process according to claim 5, wherein: the converter body is 35-40 mm long, 23-26 mm wide and 14-17 mm high.
8. The molding process according to claim 5, wherein: the encapsulating layer has any one or more of the following characteristics:
(1) the Shore D hardness at normal temperature is 70-90;
(2) volume resistivity at normal temperature is more than 1014Ω·cm；
(3) The insulation strength at normal temperature is more than 15 KV/mm;
(4) the water absorption rate of 24 hours at normal temperature is less than 0.3 percent;
(5) the tensile strength is more than 20 MPa;
(6) the heat conductivity coefficient is more than 0.7W/m.K;
(7) the flame retardant rating reaches UL 94V-0;
(8) the application temperature range is-60 to 135 ℃.
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| CN202210170418.1A CN114228017B (en) | 2022-02-24 | 2022-02-24 | Forming device and forming process of DCDC converter and DCDC converter |
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| CN202210170418.1A CN114228017B (en) | 2022-02-24 | 2022-02-24 | Forming device and forming process of DCDC converter and DCDC converter |
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| CN114228017B true CN114228017B (en) | 2022-04-29 |
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| CN114228017A (en) | 2022-03-25 |
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