CN114221209A - Automatic packaging equipment for semiconductor laser - Google Patents
Automatic packaging equipment for semiconductor laser Download PDFInfo
- Publication number
- CN114221209A CN114221209A CN202111297466.9A CN202111297466A CN114221209A CN 114221209 A CN114221209 A CN 114221209A CN 202111297466 A CN202111297466 A CN 202111297466A CN 114221209 A CN114221209 A CN 114221209A
- Authority
- CN
- China
- Prior art keywords
- bottom plate
- guide rail
- assembling
- heating bottom
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0236—Fixing laser chips on mounts using an adhesive
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses automatic packaging equipment for a semiconductor laser, which comprises a heating bottom plate, a packaging substrate, an assembling device, a dispensing device and a pressing device, wherein the heating bottom plate is a rectangular bottom plate, a guide rail groove is formed in the middle of the heating bottom plate, a driving motor is arranged at one side end of the heating bottom plate and is connected with a guide rail, a supporting rod is arranged in the middle of the guide rail and is connected with the packaging substrate, and the packaging substrate is a substrate with holes punched in a rectangular array. The packaging method directly packages the packaging substrate in a flow line mode of assembly, glue dispensing and pressing processes which can be carried out only by using a mechanical arm originally, the driving motor of the heating bottom plate is linked with the assembling device, the glue dispensing device and the pressing device, and the assembling device, the glue dispensing device and the pressing device work in sequence when the driving motor moves the packaging substrate slowly.
Description
Technical Field
The invention belongs to the technical field of semiconductor laser packaging, and particularly relates to automatic packaging equipment for a semiconductor laser.
Background
A conventional laser sealing method used in the industry is a frit scanning method in which upper and lower substrates are sealed together by a sealing material, and a laser beam is irradiated onto the sealing material and moved point by point along the contour of a sealing pattern to complete the sealing. However, the scanning time of this method is determined according to the size and specific profile of the frit pattern, the packaging efficiency is low, the precision requirement for laser alignment is high, and the problem is particularly serious in the small-sized package.
Disclosure of Invention
The invention aims to solve the defects of the prior art, and provides automatic packaging equipment for a semiconductor laser, which comprises a heating bottom plate, a packaging substrate, an assembling device, a glue dispensing device and a pressing device, wherein the heating bottom plate is a rectangular bottom plate, a guide rail groove is arranged in the middle of the heating bottom plate, a driving motor is arranged at one side end of the heating bottom plate and is connected with a guide rail, a support rod is arranged in the middle of the guide rail and is connected with the packaging substrate, the packaging substrate is a substrate with holes punched in a rectangular array, trapezoidal assembling bases are arranged at four corners of the heating bottom plate, the assembling device is a guide pillar type assembling device which can move up and down, the glue dispensing device is an annular glue dispensing device with fixed height and uniform speed, the pressing device is a guide pillar type pressing device which can move up and down, and the assembling device is arranged at the center of the assembling base on the left side in a crossing manner, and the dispensing device and the pressing device are connected with the right assembly base.
Furthermore, the heating bottom plate is internally provided with an electric heating wire.
Furthermore, both ends of the assembling device and the pressing device are provided with synchronous lifting screw rods.
Furthermore, the glue dispensing device comprises a glue dispensing gun and a support, the glue dispensing gun is arranged on an annular guide rail of the support, and an electric drive guide rail wheel is arranged at the top of the glue dispensing gun.
Furthermore, the assembling device comprises a screw rod and a guide plate, and a plurality of waist holes are formed in the guide plate.
Has the advantages that:
the packaging method comprises the following steps that the mode that the procedure use assembly line which needs to be assembled, dispensed and pressed by using a mechanical arm originally is directly packaged, a driving motor for heating a bottom plate is linked with an assembling device, a dispensing device and a pressing device, and the assembling device, the dispensing device and the pressing device work in sequence when the driving motor slowly moves the packaging substrate.
Drawings
FIG. 1 is a schematic top view of an automated packaging apparatus for semiconductor lasers;
in the figure; 1. heating bottom plate, 2, packaging substrate, 3, assembly base, 4, driving motor, 5, guide rail, 6, assembly quality, 7, adhesive deposite device, 8, the push-down device.
Detailed Description
For the purpose of enhancing the understanding of the present invention, the present invention will be further described in detail with reference to the following examples and the accompanying drawings, which are only used for explaining the present invention and are not to be construed as limiting the scope of the present invention.
The implementation example is as follows:
an automatic packaging device for semiconductor laser comprises a heating bottom plate, a packaging substrate, an assembling device, a glue dispensing device and a pressing device, the heating bottom plate is a rectangular bottom plate, a guide rail groove is arranged in the middle of the heating bottom plate, a driving motor is arranged at one side end of the heating bottom plate, the driving motor is connected with the guide rail, a support rod is arranged in the middle of the guide rail and connected with the packaging substrate, the packaging substrate is a rectangular array perforated substrate, trapezoidal assembly bases are arranged at four corners of the heating bottom plate, the assembling device is a guide post type assembling device which moves up and down, the glue dispensing device is an annular glue dispensing device with fixed height and uniform speed, the pressing device is a guide column type pressing device which moves up and down, the assembling device stretches across and is arranged at the center of the left assembling base, and the dispensing device and the pressing device are both connected with the right assembling base.
As shown in fig. 1;
fixing a laser base at a hole on a packaging substrate 2, fixing the packaging substrate 2 to a guide rail 5, enabling the packaging substrate 2 to move at a constant speed from left to right through a driving motor 4, when the laser base on the packaging substrate 2 moves to the position below an assembling device, stopping the driving motor 4 from moving, assembling a laser component through a lead screw by the assembling device 6, continuously moving the packaging substrate 2 after assembling is completed, when the position where assembling is completed moves to the position below a glue dispensing device 7, stopping the driving motor 4 from moving, enabling the glue dispensing device 7 to rotate for dispensing, continuously moving the packaging substrate 2 after dispensing is completed, when the position where dispensing is completed moves to the position below a pressing device 8, downwards moving the pressing device 8 for pressing, and moving the packaging substrate 2 out after pressing.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (5)
1. An automatic packaging device for a semiconductor laser is characterized by comprising a heating bottom plate, a packaging substrate, an assembling device, a glue dispensing device and a pressing device, wherein the heating bottom plate is a rectangular bottom plate, a guide rail groove is formed in the middle of the heating bottom plate, a driving motor is arranged at one side end of the heating bottom plate and is connected with a guide rail, a supporting rod is arranged in the middle of the guide rail and is connected with the packaging substrate, the packaging substrate is a substrate with a rectangular array for punching, trapezoidal assembling bases are arranged at four corners of the heating bottom plate, the assembling device is a guide pillar type assembling device capable of moving up and down, the glue dispensing device is an annular glue dispensing device with fixed height and uniform speed, the pressing device is a guide pillar type pressing device capable of moving up and down, and the assembling device stretches across the center of the assembling base arranged on the left side, and the dispensing device and the pressing device are connected with the right assembly base.
2. An automated packaging apparatus for semiconductor lasers as claimed in claim 1 wherein the interior of the heated substrate is provided with heating wires.
3. An automated packaging apparatus for semiconductor lasers as claimed in claim 1 wherein both ends of said assembly means and said hold-down means are provided with synchronized elevation screws.
4. The automated packaging apparatus of claim 1, wherein the dispensing device comprises a dispensing gun and a support, the dispensing gun is disposed on a circular guide rail of the support, and an electrically driven guide rail wheel is disposed on a top of the dispensing gun.
5. An automated packaging apparatus for semiconductor lasers as claimed in claim 3 wherein said mounting means includes a lead screw and a guide plate, said guide plate having a plurality of waist holes therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111297466.9A CN114221209A (en) | 2021-11-04 | 2021-11-04 | Automatic packaging equipment for semiconductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111297466.9A CN114221209A (en) | 2021-11-04 | 2021-11-04 | Automatic packaging equipment for semiconductor laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114221209A true CN114221209A (en) | 2022-03-22 |
Family
ID=80695642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111297466.9A Pending CN114221209A (en) | 2021-11-04 | 2021-11-04 | Automatic packaging equipment for semiconductor laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114221209A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103779244A (en) * | 2014-01-21 | 2014-05-07 | 谢创 | Automatic production line for chip on board bonding |
| CN213032885U (en) * | 2020-08-05 | 2021-04-23 | 苏州华工自动化技术有限公司 | Automatic lens assembling equipment |
-
2021
- 2021-11-04 CN CN202111297466.9A patent/CN114221209A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103779244A (en) * | 2014-01-21 | 2014-05-07 | 谢创 | Automatic production line for chip on board bonding |
| CN213032885U (en) * | 2020-08-05 | 2021-04-23 | 苏州华工自动化技术有限公司 | Automatic lens assembling equipment |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |