CN114023669A - Self-leveling device for mass transfer of MicroLED and application thereof - Google Patents
Self-leveling device for mass transfer of MicroLED and application thereof Download PDFInfo
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- CN114023669A CN114023669A CN202111220046.0A CN202111220046A CN114023669A CN 114023669 A CN114023669 A CN 114023669A CN 202111220046 A CN202111220046 A CN 202111220046A CN 114023669 A CN114023669 A CN 114023669A
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention belongs to the semiconductor related technical field, and discloses a self-leveling device for transferring a micro LED (light emitting diode) in a huge amount and an application thereof, wherein the device comprises: the lower wafer motion table comprises a first support with XYZ three-direction freedom and a sliding table; the upper wafer motion table comprises a second support with XYZ three-direction freedom and an adsorption structure; the substrate direct-driven self-leveling micro-tripod head comprises a spherical motor and a self-leveling micro-tripod head, wherein the spherical motor is arranged on the sliding table, and the self-leveling micro-tripod head is driven by the spherical motor to rotate or lock in X, Y or Z direction; the self-leveling micro-cloud platform comprises a synchronous adjusting disk and a lower wafer adsorption disk, wherein a plurality of top columns are arranged on the surface of the synchronous adjusting disk, force sensors are respectively arranged above the top columns, and holes corresponding to the top columns are formed in the lower wafer adsorption disk so that the force sensors protrude out of the surface of the lower wafer adsorption disk. The transfer head is not limited by the area of the transfer head, parallelism in the process of transferring the large plane can be realized, and transfer efficiency is obviously improved.
Description
Technical Field
The invention belongs to the technical field of semiconductor correlation, and particularly relates to a self-leveling device for mass transfer of a micro LED and application thereof.
Background
The micro light emitting diode (micro LED, also called as mu LED) is a new generation of inorganic self-luminous display technology which reduces the size of the traditional LED to below 50 mu m and is highly integrated with a driving circuit on a single chip, has the unique advantages of higher brightness, lower power consumption, longer service life, quick response, higher reliability and the like compared with the traditional display technology, and has wide application in the fields of high-resolution display, biomedical, visible light communication, wearable electronics and the like. One of the difficulties in the development of the μ LED technology is the huge transfer process, which needs to transfer several million μ LEDs with micron-sized particles from the epitaxially grown substrate to the circuit substrate, but the current huge transfer process and the device thereof cannot meet the requirements of high yield (99.9999%), high precision (± 0.5 μ M) and high speed (1M/h).
In view of the above problems, chinese patent CN109712928B discloses a high precision transfer printing apparatus and system suitable for micro devices, which can realize the adsorption and release of micro devices by the electrostatic adsorption force generated by electrostatic adsorption sheets. The transfer printing device has low power consumption by taking static electricity as an energy source for transfer printing, can adapt to transfer printing of devices in different forms, and simultaneously the transfer printing head can move horizontally and vertically under the control of the moving device to transfer the transfer printing substrates in different specifications, thereby improving the transfer efficiency and reducing the production cost. Chinese patent CN109216400B discloses a huge transfer device of a micro led array device and a related method, wherein a magnetic nano thin film layer is formed on an epitaxial substrate of the micro led array device as an electrode of the micro led array device, so that magnetic force can be directly adopted to adsorb the micro led array device, and in this way, an additional magnetic layer is not required to be added, thereby avoiding the processes of manufacturing and removing the magnetic layer, simplifying the transfer method of the micro led array device, and improving the huge transfer efficiency.
The two methods overcome the defects that the traditional mechanical mode is difficult to pick up and easily damages the chip, but the transfer efficiency is limited to a certain extent by the size of the transfer head, and meanwhile, the acting force regulation needs to be realized within a specific range, so that the process window is reduced, and the industrial cost is increased. Chinese patent CN111584689A discloses a huge transfer device and a transfer method for MicroLEDs, wherein mask illumination and conveyor belt transfer are adopted to realize multi-array MicroLED irradiation transfer, and the MicroLEDs on a sapphire substrate are irradiated by laser and transferred onto an adhesive layer of a conveyor belt during transfer. The mode generates acting force for transferring the chip through light irradiation, and then realizes the mode of selectivity and array light spots by adopting the modes of masks, light spot focusing array and the like, thereby improving the efficiency of the mass transfer device and the method.
The laser transfer technology is based on the action mechanism of laser and substance, utilizes the interface area material to absorb the beam energy to cause rapid physical change or chemical reaction to generate driving force to regulate and control the interface state so as to overcome the adhesion force of a surface layer material and a micro LED, has the advantages of small damage to a device, high selectivity, rapid and efficient response and the like, has the advantages of repair compared with other technologies, can melt out the dead spots, has great effect on improving the yield, can achieve higher yield, precision and transfer rate under proper process parameters, and becomes a huge transfer solution with great potential at present. However, although laser transfer can satisfy high-speed and selective transfer, the transfer accuracy has a lot of influence factors, and it is necessary to study various parameter problems such as laser parameters (e.g. laser energy density, pulse frequency, spot size, etc.), geometric parameters of a transfer device (e.g. plate pitch, chip pitch), etc., and laser equipment is expensive and relatively high in cost. Particularly, in the transfer process, the donor substrate and the receiving substrate need to move in coordination with the laser spot, and the spacing and the relative parallelism between the donor substrate and the receiving substrate directly affect the yield and the precision of mass transfer, which is a technical core and a difficulty of the development of mass transfer devices adapted to the prior art.
Disclosure of Invention
Aiming at the defects or the improvement requirements of the prior art, the invention provides the self-leveling device for the mass transfer of the MicroLED and the application thereof.
To achieve the above object, according to one aspect of the present invention, there is provided a self-leveling device for micro led bulk transfer, the device comprising: the lower wafer moving table comprises a first support with XYZ three-direction freedom degree and a sliding table arranged on the first support, so that the sliding table can move in X, Y or Z direction on the first support; the upper wafer moving table comprises a second support with XYZ three-direction freedom degree and an adsorption structure arranged on the second support, and the adsorption structure is positioned above the sliding table; the adsorption structure comprises an upper wafer adsorption disc, and the upper wafer adsorption disc is used for adsorbing an upper wafer; the substrate direct-driven self-leveling micro cloud platform comprises a spherical motor and a self-leveling micro cloud platform, wherein the spherical motor is arranged on the sliding platform, and the self-leveling micro cloud platform is driven by the spherical motor to rotate or lock in the X, Y or Z direction; the self-leveling micro-cloud platform comprises a synchronous adjusting disk and a lower wafer adsorption disk arranged above the synchronous adjusting disk, wherein a plurality of top columns are arranged on the surface of the synchronous adjusting disk, force sensors are respectively arranged above the top columns, and holes corresponding to the top columns are formed in the lower wafer adsorption disk so that the force sensors protrude out of the surface of the lower wafer adsorption disk.
Preferably, the self-leveling micro-pan head further comprises a guide post and a height adjusting nut, the guide post is fixed to the lower surface of the lower wafer adsorption plate, a hole corresponding to the guide post is formed in the synchronous adjustment plate to prevent the lower wafer adsorption plate and the synchronous adjustment plate from being dislocated, and the height adjusting nut is used for adjusting the height of the top post so as to control the distance between the upper wafer and the lower wafer.
Preferably, the spherical motor comprises a spherical stator, a spherical joint, a spherical shell, a plurality of permanent magnets, a wire winding wound on the surface of the permanent magnet and a built-in sensor, wherein the spherical joint is arranged outside the spherical stator, the spherical joint comprises a spherical part, a top cover rotating shaft arranged on the surface of the spherical part and a top cover arranged above the top cover rotating shaft, and the self-leveling micro-cloud platform is arranged on the top cover; the permanent magnets are uniformly distributed on and penetrate through the spherical shell, and the built-in sensor is used for feeding back and controlling the performance of the spherical motor.
Preferably, the second support includes the cap type support, the adsorption structure still includes the rotary displacement platform that vacuum chuck adaptor and cover located vacuum chuck adaptor one end, the rotary displacement bench is equipped with a plurality of fine setting jackscrews, it locates to go up the wafer adsorption disc the tip of vacuum chuck adaptor, a plurality of fine setting jackscrews are used for adjusting go up the depth of parallelism of wafer adsorption disc.
Preferably, first support includes first X direction motion guide rail, first Y direction motion guide rail, first Z direction motion guide rail, first X direction motion guide rail and first Y direction motion guide rail are located first Z direction motion guide rail below, the slip table is located on the first Z direction motion guide rail.
Preferably, the second support is a gantry structure, the second support comprises a second X-direction moving guide rail, a second Y-direction moving guide rail and a second Z-direction moving guide rail, and the adsorption structure is arranged on the second Z-direction moving guide rail.
Preferably, the device further comprises a control system for controlling the lower wafer motion table, the upper wafer motion table and the substrate direct-drive self-leveling micro-pan-tilt to work.
Preferably, the device further comprises a fixed support base for supporting the lower wafer motion table, the upper wafer motion table and the substrate direct-drive self-leveling micro-pan-tilt.
According to another aspect of the invention, there is provided an application of a self-leveling device for mass transfer of a micro led, the device being applied to a laser transfer micro led.
In general, compared with the prior art, the self-leveling device for the mass transfer of the micro led and the application thereof provided by the invention have the following advantages that:
1. the self-adjusting device can realize the self-adjustment of the parallelism of the adsorbed upper wafer and the adsorbed lower wafer through the spherical motor and the self-leveling micro-pan head, further ensure the transfer precision in the non-contact transfer process, and can keep good parallelism even if the areas of the upper wafer adsorption disc and the lower wafer adsorption disc are large, so that more micro LEDs can be transferred at one time, and the transfer efficiency is obviously improved;
2. the error caused by the roughness of the upper wafer adsorption disc and the lower wafer adsorption disc can be overcome through the jacking column and the force sensor arranged on the jacking column, the transfer precision is ensured, the pose of the lower wafer adsorption disc can be fixed through the spherical motor, further, frequent adjustment during transfer of different batches is avoided, and the transfer efficiency is obviously improved.
3. The movement of the self-leveling micro-cradle head is controlled by the on-off of the permanent magnet, and the response is timely.
4. The device in the application is very suitable for laser transfer MicroLED, can realize high-precision relative motion or integral motion of a donor/receiving substrate, realizes mass transfer of micro devices, effectively improves production efficiency and promotes business process.
Drawings
FIG. 1 is an overall block diagram of a MicroLED bulk transfer self-leveling device;
FIG. 2 is a block diagram of a lower wafer motion stage of a MicroLED bulk transfer self-leveling apparatus;
FIG. 3 is a block diagram of an upper wafer motion stage of a micro LED bulk transfer self leveling device;
FIG. 4 is a block diagram of a substrate direct drive self-leveling micro-pan/tilt and lower wafer motion stage;
fig. 5A is an overall structural view of a spherical motor;
FIG. 5B is a cross-sectional view of a spherical motor;
fig. 6 is a control schematic of the control system.
The same reference numbers will be used throughout the drawings to refer to the same or like elements or structures, wherein:
100-fixed support base, 101-marble base, 102-rubber pad, 103-drawer slide, 104-slide support, 105-structural steel support, 106-caster, 107-adjustable foot pad, 108-locker;
200-a lower wafer moving table, 201-an interference anti-collision device, 202-a sliding table, 203-a first Z-direction moving guide rail, 204-a drag chain, 205-a packaging cover, 206-a fixing piece, 207-a first X-direction moving guide rail, 208-a linear motor, 209-an anti-collision limit, 210-an anti-collision limit, 211-a servo motor and 212-a screw and nut mechanism;
300-an upper wafer moving table, 301-a gantry marble, 302-a Y-axis drag chain baffle, 303-a Y-axis drag chain, 304-a packaging cover, 305-a fixing piece, 306-an anti-collision limit, 307-a vacuum chuck adaptor, 308-an upper wafer adsorption disc, 309-a rotary displacement table, 310-a fine adjustment jackscrew, 311-a second X-direction moving guide rail, 312-a cap-shaped support, 313-an anti-collision limit, 314-a servo motor, 315-a Z-axis drag chain and 316-an interference anti-collision device;
400-substrate direct-drive self-leveling micro-holder, 401-spherical motor, 402-height adjusting nut, 403-top column, 404-synchronous adjusting disk, 405-guide column, 406-lower wafer adsorption disk;
501-top cover, 502-spherical shell, 503-permanent magnet, 504-spherical motor base, 505-spherical stator, 506-wire winding, 507-spherical joint and 508-top cover rotating shaft.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Referring to fig. 1 and 2, the present invention provides a self-leveling apparatus for mass transfer of micro led, which includes a lower wafer motion stage 200, an upper wafer motion stage 300, a substrate direct-drive self-leveling micro stage 400, a fixed support base 100 and a control system (as shown in fig. 6). The lower wafer movement stage 200 and the upper wafer movement stage 300 are fixed on the fixed support base 100. The lower wafer motion stage 200 is used for fixing and moving the lower wafer (i.e., receiving the substrate). The upper wafer motion stage 300 is used for fixing and moving an upper wafer (i.e., a donor substrate). The lower wafer motion table 200, the upper wafer motion table 300 and the substrate direct-drive self-leveling micro-pan-tilt 400 realize wafer bearing and motion functions through a control system. The lower wafer motion table 200 and the upper wafer motion table 300 can keep the two wafers relatively static at the concentric positions and perform integral translation under the action of a control system, so that the motion requirement of a laser process is met, and the motion precision is determined by the manufacturing precision of a motion component and the control precision of a control component;
as shown in fig. 1, the fixed supporting base 100 comprises a marble base 101, a rubber pad 102, a drawer slide 103, a slide bracket 104, a structural steel bracket 105, casters 106, adjustable feet 107 and a storage cabinet 108, wherein the adjustable feet 107 and the casters 106 are mounted on four bottom corners below the structural steel bracket 105 to perform the fixed supporting and carrying functions of the whole moving platform; the four adjustable foot pads 107 are changed in length through threads so as to finely adjust the horizontal degree of the plane on the marble base 101; the marble base 101 is erected on the rubber pad 102 of the structural steel bracket 105 and provides a reference for each movement direction of the movement platform; the sliding rail bracket 104 is arranged on the structural steel bracket 105 and fixedly provided with the drawer sliding rail 103, and the storage cabinet 108 is fixed on the drawer sliding rail 103 and is arranged at the vacant position of the structural steel bracket 105 to be used as equipment storage.
As shown in fig. 2, the lower wafer movement stage 200 is mounted on the marble base 101 and fixed by a fixing member 206, and the lower wafer movement stage 200 includes a first support having XYZ three-directional degrees of freedom and a slide table 202 provided on the first support so that the slide table 202 moves in X, Y or Z direction on the first support.
Further, in this embodiment, the first bracket includes a first X-direction moving guide 207, a first Y-direction moving guide, and a first Z-direction moving guide 203, the first X-direction moving guide and the first Y-direction moving guide are disposed below the first Z-direction moving guide 203, and the sliding table is disposed on the first Z-direction moving guide. The first Z-direction motion rail 203 may be a screw-nut mechanism 212. The ends of the first X-direction motion guide 207 and the first Y-direction motion guide are both provided with bump stops 209. The end of the first Z-direction motion rail 203 is provided with an anti-collision limit 210. The lower wafer motion table 200 further comprises a linear motor 208, a servo motor 211, an interference anti-collision device 201, a drag chain 204, a packaging cover 205 and the like, and a motion structure component of the lower wafer motion table 200 provides high-precision translational freedom of a lower wafer in X \ Y \ Z three directions.
As shown in fig. 3, the upper wafer motion stage 300 is preferably a gantry structure, the second support includes a second X-direction motion guide rail 311, a second Y-direction motion guide rail, and a second Z-direction motion guide rail, and the adsorption structure is disposed on the second Z-direction motion guide rail. The ends of the second X-direction motion guide rail 311 and the second Y-direction motion guide rail are provided with an anti-collision limit 306, and the end of the second Z-direction motion guide rail is provided with an anti-collision limit 313. The second bracket also comprises a gantry marble 301 and a fixing piece 305 thereof, a Y-axis drag chain baffle 302, a Y-axis drag chain 303 and a Z-axis drag chain 315, a cap-shaped bracket 312, a servo motor 314, a fine-tuning jackscrew 310, an interference anti-collision device 316, a packaging cover 304 and the like, and the high-precision translational freedom degree in the X \ Y \ Z three directions and the manual rotation freedom degree in the horizontal direction are formed; the adsorption structure further comprises a vacuum chuck adapter 307 and a rotary displacement table sleeved at one end of the vacuum chuck adapter 307, wherein a plurality of fine-tuning jackscrews 310 are arranged on the rotary displacement table 309, the upper wafer adsorption disc 308 is arranged at the end of the vacuum chuck adapter 307, and the fine-tuning jackscrews 310 are used for adjusting the parallelism of the upper wafer adsorption disc 308.
As shown in fig. 4, the substrate direct-drive self-leveling micro-pan-tilt 400 is installed on the lower wafer motion stage 200, and includes a spherical motor 401 and a self-leveling micro-pan-tilt, the spherical motor 401 is installed on the slide, and the self-leveling micro-pan-tilt is driven by the spherical motor to rotate or lock in X, Y or Z direction; the self-leveling micro-cloud platform comprises a synchronous adjusting disk 404 and a lower wafer adsorption disk 406 arranged above the synchronous adjusting disk 404, wherein a plurality of top pillars 403 are arranged on the surface of the synchronous adjusting disk 404, force sensors are respectively arranged above the top pillars 403, and holes corresponding to the top pillars 403 are formed in the lower wafer adsorption disk 406 so that the force sensors protrude out of the surface of the lower wafer adsorption disk 406.
The self-leveling micro-tripod head further comprises a guide post 405 and a height-adjusting nut 402, wherein the guide post 405 is fixed on the lower surface of the lower wafer adsorption disc 406, a hole corresponding to the guide post 405 is formed in the synchronous adjustment disc 404 to prevent the lower wafer adsorption disc 406 and the synchronous adjustment disc 404 from being positionally dislocated, and the height-adjusting nut 402 is used for adjusting the height of the top post 403 so as to control the distance between the upper wafer and the lower wafer. The number of the top posts 403 is preferably 3, and 3 top posts 403 are uniformly distributed on the periphery of the synchronous control disk 404.
The self-leveling micro-tripod head can provide rotation freedom degrees of the lower wafer in three directions around X, Y, Z respectively under the driving of the spherical motor, when the upper wafer and the lower wafer are concentrically aligned, the upper wafer is slowly moved to be contacted with the top pillars 403, at the moment, the spherical motor adaptively adjusts the pose of the lower wafer through rotation in different directions until the upper wafer and the three top pillars 403 are completely contacted, the two wafers are considered to be parallel, and at the moment, the self-leveling process is completed. Go up the wafer and adsorb dish and lower wafer and adsorb the dish and all adopt detachable connected mode in this application to the different needs change not equidimension last wafer adsorb dish and lower wafer adsorb dish.
As shown in fig. 5A and 5B, the spherical motor 401 includes a spherical stator 505, a spherical joint 507, a spherical housing 502, a plurality of permanent magnets 503, a wire winding 506 wound on the surface of the permanent magnets, and a built-in sensor, wherein the spherical joint 507 is disposed outside the spherical stator 505, the spherical joint 507 includes a spherical portion, a top cover rotating shaft 508 disposed on the surface of the spherical portion, and a top cover 501 disposed above the top cover rotating shaft 508, and the self-leveling micro-cloud platform is disposed on the top cover; the permanent magnets 503 are uniformly distributed on and penetrate the spherical shell 502. The spherical motor is connected to the slide table 202 through a spherical motor base 504. After the wire winding 506 is electrified, the ball joint 507 can rotate X, Y or Z three directions around the spherical stator 505 under the action of an armature; the built-in sensor is used for feedback and motor control, for example, the built-in sensor can be a rotating shaft inertia sensor, a rotating speed sensor, a position sensor, a temperature sensor and other motor parameter sensors, and is respectively used for monitoring performance parameters such as the rotating speed, the temperature, the rotating shaft angle and the like of the motor.
In the working process, the self-leveling device for the mass transfer of the MicroLED comprises the following operation steps:
step 1: the upper wafer is adsorbed on the upper wafer adsorption plate 308, and the lower wafer is adsorbed on the lower wafer adsorption plate 406;
step 2: controlling the upper wafer motion stage 300 and the lower wafer motion stage 200 to move along the XY direction, so that the two adsorption disks are concentrically aligned;
and step 3: processing errors of the upper wafer adsorption disc 308 and the lower wafer adsorption disc 406 are obtained, parallelism balance intervals are obtained, the height adjusting nuts 402 are rotated, the heights of the plurality of top columns 403 are synchronously adjusted until the intervals of the top columns are offset from the processing errors, and leveling is achieved;
and 4, step 4: and (4) acquiring indication values of the force sensors at the end parts of the jack posts during leveling, and keeping the indication values unchanged during transferring of the micro LEDs every time so as to ensure the parallelism during transferring every time.
In summary, the transfer head is not limited by the area of the transfer head, parallelism in the large plane transfer process can be realized, transfer efficiency is obviously improved, and the problem of transfer deviation caused by the substrate distance in the micro LED massive transfer is solved.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (9)
1. A self-leveling device for micro led bulk transfer, the device comprising:
the lower wafer moving table comprises a first support with XYZ three-direction freedom degree and a sliding table arranged on the first support, so that the sliding table can move in X, Y or Z direction on the first support;
the upper wafer moving table comprises a second support with XYZ three-direction freedom degree and an adsorption structure arranged on the second support, and the adsorption structure is positioned above the sliding table; the adsorption structure comprises an upper wafer adsorption disc, and the upper wafer adsorption disc is used for adsorbing an upper wafer;
the substrate direct-driven self-leveling micro cloud platform comprises a spherical motor and a self-leveling micro cloud platform, wherein the spherical motor is arranged on the sliding platform, and the self-leveling micro cloud platform is driven by the spherical motor to rotate or lock in the X, Y or Z direction; the self-leveling micro-cloud platform comprises a synchronous adjusting disk and a lower wafer adsorption disk arranged above the synchronous adjusting disk, wherein a plurality of top columns are arranged on the surface of the synchronous adjusting disk, force sensors are respectively arranged above the top columns, and holes corresponding to the top columns are formed in the lower wafer adsorption disk so that the force sensors protrude out of the surface of the lower wafer adsorption disk.
2. The apparatus of claim 1, wherein the self-leveling micro stage further comprises a guide post fixed to a lower surface of the lower wafer chuck, and a height adjusting nut for adjusting a height of the top post to control a distance between the upper wafer and the lower wafer, wherein the synchronous adjusting disk is provided with a hole corresponding to the guide post to prevent the lower wafer chuck from moving relative to the synchronous adjusting disk.
3. The device according to claim 1 or 2, wherein the spherical motor comprises a spherical stator, a spherical joint, a spherical shell, a plurality of permanent magnets, a wire winding wound on the surface of the permanent magnets and a built-in sensor, wherein the spherical joint is arranged outside the spherical stator, the spherical joint comprises a spherical part, a top cover rotating shaft arranged on the surface of the spherical part and a top cover arranged above the top cover rotating shaft, and the self-leveling micro-cloud platform is arranged on the top cover; the permanent magnets are uniformly distributed on and penetrate through the spherical shell; and the built-in sensor is used for feeding back and controlling the performance of the spherical motor.
4. The apparatus according to claim 1, wherein the second support comprises a hat-shaped support, the adsorption structure further comprises a vacuum chuck adapter and a rotary displacement table sleeved at one end of the vacuum chuck adapter, the rotary displacement table is provided with a plurality of fine tuning jackscrews, the upper wafer adsorption disc is arranged at the end of the vacuum chuck adapter, and the fine tuning jackscrews are used for adjusting the parallelism of the upper wafer adsorption disc.
5. The device of claim 1, wherein the first support comprises a first X-direction moving guide rail, a first Y-direction moving guide rail, and a first Z-direction moving guide rail, the first X-direction moving guide rail and the first Y-direction moving guide rail are disposed below the first Z-direction moving guide rail, and the sliding table is disposed on the first Z-direction moving guide rail.
6. The device of claim 1 or 5, wherein the second support is a gantry-type structure, the second support comprises a second X-direction moving guide rail, a second Y-direction moving guide rail and a second Z-direction moving guide rail, and the adsorption structure is arranged on the second Z-direction moving guide rail.
7. The apparatus of claim 1, further comprising a control system for controlling operation of the lower wafer motion stage, the upper wafer motion stage, and the substrate direct drive self-leveling micro-stage.
8. The apparatus of claim 1, further comprising a fixed support base for supporting the lower wafer motion stage, the upper wafer motion stage, and the substrate direct drive self-leveling micro-pan head.
9. Use of a self-leveling device for mass transfer of MicroLED's according to any of claims 1 to 8, wherein the device is used in laser transfer MicroLED's.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111220046.0A CN114023669A (en) | 2021-10-20 | 2021-10-20 | Self-leveling device for mass transfer of MicroLED and application thereof |
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| CN202111220046.0A CN114023669A (en) | 2021-10-20 | 2021-10-20 | Self-leveling device for mass transfer of MicroLED and application thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115241111A (en) * | 2022-09-05 | 2022-10-25 | 广州纳动半导体设备有限公司 | Rectification and alignment system for chip mass transfer packaging and application method thereof |
| CN116631929A (en) * | 2023-07-24 | 2023-08-22 | 广东工业大学 | Chip transfer method, system, equipment and medium based on swing arm die bonder |
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2021
- 2021-10-20 CN CN202111220046.0A patent/CN114023669A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115241111A (en) * | 2022-09-05 | 2022-10-25 | 广州纳动半导体设备有限公司 | Rectification and alignment system for chip mass transfer packaging and application method thereof |
| CN116631929A (en) * | 2023-07-24 | 2023-08-22 | 广东工业大学 | Chip transfer method, system, equipment and medium based on swing arm die bonder |
| CN116631929B (en) * | 2023-07-24 | 2024-01-05 | 广东工业大学 | Chip transfer method, system, equipment and medium based on swing arm die bonder |
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