CN207491342U - A kind of device using package sealing with laser film circuit board - Google Patents
A kind of device using package sealing with laser film circuit board Download PDFInfo
- Publication number
- CN207491342U CN207491342U CN201721588225.9U CN201721588225U CN207491342U CN 207491342 U CN207491342 U CN 207491342U CN 201721588225 U CN201721588225 U CN 201721588225U CN 207491342 U CN207491342 U CN 207491342U
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- China
- Prior art keywords
- laser
- circuit board
- plate
- film
- film circuit
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Abstract
The utility model is a kind of device using package sealing with laser film circuit board, including fixed bottom plate, wiring thin film board clamp, lifting module, laser scanning galvanometer and laser industrial control system, laser scanning galvanometer is in above wiring thin film board clamp, it is connected by optical fiber, signal wire and laser industrial control system, based on the device, laser beam is sent out using superlaser, after grating is handled, hot spot expands arrangement and is focused on, laser facula radiation is formed by the control of laser industrial control system and is sealed on the surface of film circuit board.The utility model utilizes the device of package sealing with laser film circuit board; traditional glue sealing or vacuum chemistry is replaced to seal using package sealing with laser; the water proofing property of film circuit board can be greatly improved; inoxidizability; corrosion resistance and dust-proof effect; it can prevent the use of a large amount of chemical glues and the discharge of pernicious gas simultaneously, reach environmental protection purpose.
Description
Technical field
The utility model is related to laser technology fields, and in particular to a kind of device using package sealing with laser film circuit board.
Background technology
With computer and the high speed development of intelligent automation industry, as the film circuit board of outputting communication signal, with
The advantages demands such as its is frivolous easy to install, flexible strong, and manufacture cost is low quickly increase.As industry quality-improving requires and makes
It is higher and higher to the sealing requirements of film circuit board with the extension in field.This is directly related to the use longevity of film circuit board
Life and safety.
The sealing technology of current thin film wiring board, may still using traditional glue sealing method and vacuum chemistry sedimentation
It has the following problems：Glue itself water proofing property and air-tightness are insufficient, and the time, long glue was easy to aging, and glue coating difficulty is big, anti-corruption
Corrosion is relatively low, and the glue curing time is long and pollution to environment.
Utility model content
The purpose of the utility model is to overcome problems of the existing technology, provide a kind of utilization package sealing with laser thin film wire
The device of road plate, to improve the influence of the leakproofness of film circuit board and reduction to environment.
To realize above-mentioned technical purpose and the technique effect, the utility model is achieved through the following technical solutions：
A kind of device using package sealing with laser film circuit board, including：
Fixed bottom plate；
Wiring thin film board clamp is fixed on the fixed bottom plate, for the film circuit board of clamping welding to be sealed；
Module is lifted, the wiring thin film board clamp side is set to and is fixed on the fixed bottom plate；
Laser scanning galvanometer is set to above the wiring thin film board clamp and is movably mounted to lifting module up and down
On, for emitting the wiring thin film plate surface that the laser facula with movement locus radiates welding to be sealed, make film circuit board
Between welding bead be in molten condition, reach melting sealed；
Laser industrial control system by light or is electrically connected to the laser scanning galvanometer and lifting module, laser is supplied to sweep
It retouches the laser parameter of galvanometer transmitting and lifts the lifting parameter of module.
Further, the wiring thin film board clamp includes air cylinder fixed plate, and the air cylinder fixed plate is fixed on fixed bottom
Above plate, the air cylinder fixed plate both sides are vertically connected with an offside fixed plate, and connection one is thin jointly on two sides fixed plate top
Film light transmission pressing plate, the film light transmission pressing plate lower section are equipped with several vertical lifting cylinders, and the lifting cylinder rear end is fixed in
In air cylinder fixed plate, film supporting plate is connected on the cylinder rod end of the lifting cylinder, the film splint upper surface passes through elasticity
A self-balancing adjustable plate is inlayed in part floating, and film circuit board is laid on self-balancing adjustable plate, and the cylinder rod for passing through lifting cylinder
Film circuit board is uniformly pressed between self-balancing adjustable plate and film light transmission pressing plate by end jacking.
Further, the film splint upper surface is equipped with embedding groove, and the elastic component is spring, edge in the embedding groove
Edge is uniformly provided with several for placing the spring groove of spring, the self-balancing adjustable plate by spring floating press fit in
In embedding groove, equipped with a ball grooves, spring groove around ball grooves is uniformly arranged, is equipped in the ball grooves groove center of inlaying
Ball, for providing self-balancing adjustable plate center stiff points support.
Further, the self-balancing adjustable plate upper surface, which is equipped with, places groove, the groove profile and film for placing groove
The outer profile cooperation of wiring board is consistent, places film circuit board for tiling, the both sides of the self-balancing adjustable plate are equipped with limiting
Block, for being limited to the cylinder rod end of lifting cylinder jacking stroke, the limited block is fixed on film supporting plate.
Further, connecting plate is connected on the lift side of the lifting module, laser support is connected on the connecting plate
Plate, the laser scanning galvanometer is equipped on the laser supporting plate, and the lift side of the lifting module drives connecting plate, laser support
Plate and laser scanning galvanometer move up and down together, ensure laser scanning galvanometer work desired height.
Further, the laser industrial control system includes laser controlling board, laser and electric cabinet, for providing laser
Welding energy, speed of welding, movement locus and the weld interval parameter of the laser of scanning galvanometer transmitting, and be lifting cylinder and liter
It drops module and kinetic parameter is provided, the top of the laser industrial control system is equipped with display screen, for showing each parameter.
The beneficial effects of the utility model are:
The utility model utilizes the device of package sealing with laser film circuit board, and traditional glue sealing is replaced using package sealing with laser
Or vacuum chemistry seals, and can greatly improve the water proofing property of film circuit board, inoxidizability, corrosion resistance and dust-proof effect,
It can prevent the use of a large amount of chemical glues and the discharge of pernicious gas simultaneously, reach environmental protection purpose.
Description of the drawings
Fig. 1 is the overall structure diagram of the laser to film circuit board seal welding device of the utility model.
Fig. 2 is the film circuit board clamp structure schematic diagram of the utility model.
Fig. 3 is the film supporting plate of the utility model and the fractionation structural representation of self-balancing adjustable plate；
Fig. 4 is the principle schematic of the laser beam treatment of the utility model；
Fig. 5 is that the lifting cylinder of the utility model compresses film circuit board status diagram；
Fig. 6 is that the utility model laser illustrates the state of film circuit board sealing welding.
Figure label explanation：1. bottom plate is fixed, 2. wiring thin film board clamps, 21. air cylinder fixed plates, 22. lifting cylinders,
23. film supporting plate, 231. embedding grooves, 232. springs, 233. spring grooves, 234. ball grooves, 235. balls, 24. limited blocks, 25.
Self-balancing adjustable plate, 251. place groove, 26. side fixed plates, 27. film light transmission pressing plates, 28. film circuit boards, 3. lifting moulds
Group, 4. connecting plates, 5. laser supporting plates, 6. laser scanning galvanometers, 7. laser industrial control systems, 8. displays.
Specific embodiment
Below with reference to the accompanying drawings and in conjunction with the embodiments, the utility model is described in detail.
As shown in Figure 1, a kind of device using package sealing with laser film circuit board, including：
Fixed bottom plate 1；
Wiring thin film board clamp 2 is fixed on the fixed bottom plate 1, for the film circuit board of clamping welding to be sealed
28；
Module 3 is lifted, 2 side of wiring thin film board clamp is set to and is fixed on the fixed bottom plate 1；
Laser scanning galvanometer 6 is set to 2 top of wiring thin film board clamp and is movably mounted to lifting module up and down
On 3, for emitting 28 surface of film circuit board that the laser facula with movement locus radiates welding to be sealed, make wiring thin film
Welding bead between plate 28 is in molten condition, reaches melting sealed；
Laser industrial control system 7 by light or is electrically connected to the laser scanning galvanometer 6 and lifting module 3, such as using light
Fine or signal wire mode connects, and is supplied to laser parameter and the lifting ginseng for lifting module 3 that laser scanning galvanometer 6 emits
Number.
As shown in Fig. 2, the wiring thin film board clamp 2 includes air cylinder fixed plate 21, the air cylinder fixed plate 21 is fixed on
Fixed 1 top of bottom plate, 21 both sides of air cylinder fixed plate are vertically connected with an offside fixed plate 26, two 26 tops of side fixed plate
One film light transmission pressing plate 27 of common connection, 27 lower section of film light transmission pressing plate is equipped with several vertical lifting cylinders 22, described
22 rear end of lifting cylinder is fixed in air cylinder fixed plate 21, and film supporting plate 23 is connected on the cylinder rod end of the lifting cylinder 22,
A self-balancing adjustable plate 25 is inlayed in 23 upper surface of film supporting plate by elastic component floating, and film circuit board 28 is laid in from flat
It weighs on adjustable plate 25, and the cylinder rod end for passing through lifting cylinder 22 jacks film circuit board 28 being uniformly pressed on self-balancing adjustable plate
Between 25 and film light transmission pressing plate 27.
As shown in figure 3,23 upper surface of film supporting plate is equipped with embedding groove 231, the elastic component is spring 232, described
Several are uniformly provided with for placing the spring groove 233 of spring 232, the self-balancing adjustable plate 25 along edge in embedding groove 231
By 232 floating press fit of spring in embedding groove 231,231 center of embedding groove is equipped with a ball grooves 234, spring groove
233 are uniformly arranged around ball grooves 234, ball 235 are equipped in the ball grooves 234, for 25 center of self-balancing adjustable plate
Stiff points support is provided.
With continued reference to Fig. 3,25 upper surface of self-balancing adjustable plate, which is equipped with, places groove 251, the placement groove 251
Groove profile is consistent with the outer profile cooperation of film circuit board 28, and film circuit board 28, the self-balancing adjustable plate are placed for tiling
25 both sides are equipped with limited block 24, and for being limited to the cylinder rod end of lifting cylinder 22 jacking stroke, the limited block 24 is solid
It is connected on film supporting plate 23.
With continued reference to Fig. 1, connecting plate 4 is connected on the lift side of the lifting module 3, is connected on the connecting plate 4
Laser supporting plate 5 is equipped with the laser scanning galvanometer 6 on the laser supporting plate 5, and the lift side of the lifting module 3, which drives, to be connected
Fishplate bar 4, laser supporting plate 5 and laser scanning galvanometer 6 move up and down together, ensure the work desired height of laser scanning galvanometer 6.
The laser industrial control system 7 includes laser controlling board, laser and electric cabinet, for providing laser scanning galvanometer
Welding energy, speed of welding, movement locus and the weld interval parameter of the laser of 6 transmittings, and be lifting cylinder 22 and lifting mould
Group 3 provides kinetic parameter, and the top of the laser industrial control system 7 is equipped with display screen 8, for showing each parameter.
The utility model device course of work and operation principle
When carrying out package sealing with laser film circuit board using the device of the utility model, including following process：
The first step, lifting cylinder 22 compress film circuit board 28,
As shown in figure 5, will post film circuit board 28 to be welded manually is put into putting down certainly in wiring thin film board clamp 2
It weighs in the placement groove 251 of adjustable plate 25, both sides lifting cylinder 22 drives thin film wire simultaneously by the control of laser industrial control system 7
Road plate 28 is moved upwards until being contacted with film light transmission pressing plate 27, and self-balancing adjustable plate 25 is combined by spring 232 and ball 235
Automatic adjustment makes pressure between film circuit board 28 and film light transmission pressing plate 27 uniform；
Second step, laser to 28 sealing welding of film circuit board,
As shown in Figure 4 and Figure 6, lifting module 3 drives laser scanning galvanometer 6 to move up and down to work desired height, i.e., burnt
At point, laser industrial control system 7 sets welding energy, speed of welding, movement locus and weld interval parameter, laser controlling board control
Laser processed sends out corresponding laser, after grating is handled, hot spot expands arrangement, after reaching laser scanning galvanometer 6 by optical fiber
It focuses on, the servo motor in laser scanning galvanometer 6 moves to form what welding profile needed according to 7 arrange parameter of laser industrial control system
Beam shape is radiated along 28 welding bead direction pivots clockwise or counter-clockwise of film circuit board in the film circuit board 28 posted
Surface, the welding bead between film circuit board 28 is made to be in molten condition, to reach sealing effect；
Third walks, and film circuit board 28 is taken out after the completion of welding,
After the completion of welding, lifting cylinder 22 drives film circuit board 28 to move down, and takes out film circuit board 28, and be put into
What is posted treats film circuit board 28, repeats the above-mentioned first step-third step.
The laser energy density that is focused on after laser scanning galvanometer 6 is reached in second step by optical fiber as 0.01-5J/cm2, peak value
Power is 0.01W-10KW.
The beam shape to form welding profile and need is moved according to 7 arrange parameter of laser industrial control system in second step to further include
It is a kind of in a manner that wiring thin film board clamp 2 is relatively moved to form.
The fitting welding number of plies to be sealed of the film circuit board 28 is more than double-deck or bilayer.
In the utility model, the laser emission of high energy is led on the surface for having integrated the qualified film circuit board 28 of assembling
It crosses laser industrial control system 7 to control laser energy, scanning track and laser scanning speed, make between film circuit board 28
Welding bead is in molten condition, laser light energy is absorbed at the welding bead of film circuit board 28, under the cooperation of wiring thin film board clamp 2
Reach melting sealed.
Those skilled in the art of the present technique are it is understood that the related system that is arrived involved in the utility model and its realization
Function is that computer software conventional in the prior art is carried on improved hardware and its device of composition, device or system
Program or related agreement achieve that, are not that computer software programs of the prior art or related agreement are improved.
For example, improved computer hardware system still can realize the hardware system by loading existing operation system of software
Specific function.It is understood, therefore, that the innovation of the utility model is to structure in the prior art, technique, hard
The improvement of part module and its connection syntagmatic rather than the only software to being carried in hardware module for realization in relation to function
Or the improvement of agreement.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this
For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model
Within, any modification, equivalent replacement, improvement and so on should be included within the scope of protection of this utility model.
Claims (6)
1. a kind of device using package sealing with laser film circuit board, which is characterized in that including：
Fixed bottom plate（1）；
Wiring thin film board clamp（2）, it is fixed in the fixed bottom plate（1）On, for the film circuit board of clamping welding to be sealed
（28）；
Lift module（3）, it is set to the wiring thin film board clamp（2）Side is simultaneously fixed in the fixed bottom plate（1）On；
Laser scanning galvanometer（6）, it is set to the wiring thin film board clamp（2）Top is simultaneously movably mounted to lifting module up and down
（3）On, for emitting the film circuit board that the laser facula with movement locus radiates welding to be sealed（28）Surface makes film
Wiring board（28）Between welding bead be in molten condition, reach melting sealed；
Laser industrial control system（7）, by light or it is electrically connected to the laser scanning galvanometer（6）With lifting module（3）, it is supplied to sharp
Optical scanning galvanometer（6）The laser parameter of transmitting and lifting module（3）Lifting parameter.
2. the device according to claim 1 using package sealing with laser film circuit board, which is characterized in that the wiring thin film
Board clamp（2）Including air cylinder fixed plate（21）, the air cylinder fixed plate（21）It is fixed on fixed bottom plate（1）Top, the cylinder
Fixed plate（21）Both sides are vertically connected with an offside fixed plate（26）, two side fixed plates（26）One film of connection is saturating jointly on top
Optical pressure plate（27）, the film light transmission pressing plate（27）Lower section is equipped with several vertical lifting cylinders（22）, the lifting cylinder
（22）Rear end is fixed in air cylinder fixed plate（21）On, the lifting cylinder（22）Cylinder rod end on be connected with film supporting plate（23）,
The film supporting plate（23）Upper surface one self-balancing adjustable plate is inlayed by elastic component floating（25）, film circuit board（28）Tiling
In self-balancing adjustable plate（25）On, and pass through lifting cylinder（22）The jacking of cylinder rod end by film circuit board（28）Uniformly it is pressed on
Self-balancing adjustable plate（25）With film light transmission pressing plate（27）Between.
3. the device according to claim 2 using package sealing with laser film circuit board, which is characterized in that the film supporting plate
（23）Upper surface is equipped with embedding groove（231）, the elastic component is spring（232）, the embedding groove（231）It is interior uniformly to be set along edge
There are several for placing spring（232）Spring groove（233）, the self-balancing adjustable plate（25）Pass through spring（232）It floats
Press fit is in embedding groove（231）It is interior, the embedding groove（231）Center is equipped with a ball grooves（234）, spring groove（233）It surrounds
Ball grooves（234）It is uniformly arranged, the ball grooves（234）It is interior to be equipped with ball（235）, for self-balancing adjustable plate（25）Center
Stiff points support is provided.
4. the device according to claim 2 using package sealing with laser film circuit board, which is characterized in that the self-balancing tune
Save plate（25）Upper surface, which is equipped with, places groove（251）, the placement groove（251）Groove profile and film circuit board（28）Foreign steamer
Exterior feature cooperation is consistent, and film circuit board is placed for tiling（28）, the self-balancing adjustable plate（25）Both sides be equipped with limited block
（24）, for lifting cylinder（22）Cylinder rod end jacking stroke limited, the limited block（24）It is fixed in film supporting plate
（23）On.
5. the device according to claim 1 using package sealing with laser film circuit board, which is characterized in that the lifting module
（3）Lift side on be connected with connecting plate（4）, the connecting plate（4）On be connected with laser supporting plate（5）, the laser supporting plate（5）
On the laser scanning galvanometer is installed（6）, the lifting module（3）Lift side drive connecting plate（4）, laser supporting plate（5）
And laser scanning galvanometer（6）It moves up and down together, ensures laser scanning galvanometer（6）Work desired height.
6. the device according to claim 2 using package sealing with laser film circuit board, which is characterized in that the laser industry control
System（7）Including laser controlling board, laser and electric cabinet, for providing laser scanning galvanometer（6）The weldering of the laser of transmitting
Energy, speed of welding, movement locus and weld interval parameter are connect, and is lifting cylinder（22）With lifting module（3）Power is provided
Parameter, the laser industrial control system（7）Top be equipped with display screen（8）, for showing each parameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721588225.9U CN207491342U (en) | 2017-11-24 | 2017-11-24 | A kind of device using package sealing with laser film circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721588225.9U CN207491342U (en) | 2017-11-24 | 2017-11-24 | A kind of device using package sealing with laser film circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207491342U true CN207491342U (en) | 2018-06-12 |
Family
ID=62471504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721588225.9U Withdrawn - After Issue CN207491342U (en) | 2017-11-24 | 2017-11-24 | A kind of device using package sealing with laser film circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207491342U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949178A (en) * | 2017-11-24 | 2018-04-20 | 苏州市信德威激光科技有限公司 | A kind of device and process using package sealing with laser film circuit board |
-
2017
- 2017-11-24 CN CN201721588225.9U patent/CN207491342U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949178A (en) * | 2017-11-24 | 2018-04-20 | 苏州市信德威激光科技有限公司 | A kind of device and process using package sealing with laser film circuit board |
| CN107949178B (en) * | 2017-11-24 | 2023-05-12 | 苏州市信德威激光科技有限公司 | Device and process method for sealing thin film circuit board by utilizing laser |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20180612 Effective date of abandoning: 20230512 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20180612 Effective date of abandoning: 20230512 |