CN114220753A

CN114220753A - Wafer pre-stripping device

Info

Publication number: CN114220753A
Application number: CN202111574566.1A
Authority: CN
Inventors: 方明江
Original assignee: Wuxi Chengcheng Electronic Technology Co ltd
Current assignee: Wuxi Chengcheng Electronic Technology Co ltd
Priority date: 2021-12-21
Filing date: 2021-12-21
Publication date: 2022-03-22

Abstract

The invention belongs to the technical field of semiconductor stripping equipment, and particularly relates to a wafer pre-stripping device which comprises an ultrasonic generator and a solution tank with a funnel-shaped bottom, wherein a vibrating rod is connected to the ultrasonic generator and is positioned in the solution tank, a rack supporting frame is arranged in the solution tank, a wafer rack is arranged at the top of the rack supporting frame, two groups of filtering assemblies which are connected in parallel are connected to the bottom of the solution tank, a guide pipe is arranged in the solution tank and is positioned right above the wafer rack, a heater is connected to the guide pipe, and a same circulating pump is connected between the heater and the two filtering assemblies.

Description

Wafer pre-stripping device

Technical Field

The invention relates to the technical field of semiconductor stripping equipment, in particular to a wafer pre-stripping device.

Background

In the semiconductor manufacturing industry, after a wafer is subjected to photoetching and metallization, a metal film is formed on photoresist at a place where the photoresist exists, the photoresist on a substrate needs to be removed by using a solvent, metal on the photoresist is also removed together, and then a required metal pattern is obtained, wherein the process is called a stripping process.

In the traditional mode, a high-pressure stripping machine is usually adopted to directly strip the metallized wafer or the wafer is manually put into a glass cylinder containing a solvent to be soaked and ultrasonically pre-stripped and then stripped by the high-pressure stripping machine; in the former, a large amount of residual glue and metal are left in the high-pressure stripping machine, so that the machine maintenance period is short, the filter element is frequently replaced, the metal is inconvenient to recover, and the surface of a wafer is easily polluted; the latter is complicated in process, causes cross contamination of the solution, is harmful to the health of an operator who contacts the chemical solution for a long time, and is prone to cause fragments by manual operation.

Therefore, we propose a wafer pre-peeling apparatus to solve the above problem.

Disclosure of Invention

The invention aims to solve the defects in the prior art and provides a wafer pre-stripping device.

In order to achieve the purpose, the invention adopts the following technical scheme: the utility model provides a wafer stripping off device in advance, includes supersonic generator and the solution tank that the bottom is hourglass hopper-shaped, the last vibrting spear that is connected with of supersonic generator, the vibrting spear is located the solution tank, the rack support frame is installed to the solution tank, the disk rack is installed at the top of rack support frame, the bottom of solution tank is connected with two sets of parallelly connected filter assembly together, be equipped with the pipe in the solution tank, the pipe is located the disk rack directly over, be connected with the heater on the pipe, be connected with same circulating pump between heater and two filter assembly.

Preferably, the conduit is provided with a temperature sensor, a pneumatic valve and a flow sensor, the temperature sensor is arranged between the heater and the pneumatic valve, and the flow sensor is positioned on one side of the pneumatic valve far away from the temperature sensor.

Preferably, an overflow pipe is installed in the solution tank, the overflow pipe penetrates through the solution tank and is fixedly connected with the solution tank, and the overflow pipe is located above the conduit.

Preferably, the bottom of the solution tank is provided with a filter screen, the filter screen is made of stainless steel, and the aperture of the filter screen is 45 μm.

Preferably, the filtering pipeline comprises a preposed manual valve, a manual air inlet valve, a first filter element, a second filter element, a manual liquid discharge valve and a postpositional manual valve, wherein the preposed manual valve is positioned between the first filter element and the second filter element.

Preferably, the top of the sheet frame support frame is provided with a fixing groove, the top of the fixing groove and the top of the sheet frame support frame are both in a grid screw hole shape, the sheet frame and the fixing groove are detachably connected together, and the sheet frame is made of polytetrafluoroethylene.

Preferably, the pore diameter of the first filter element is 9 μm, and the pore diameter of the second filter element is 10 μm.

Preferably, the output ends of the two filtering components are connected with the same main liquid discharge valve, the water inlet end of the circulating pump is positioned between the main liquid discharge valve and the two filtering components, and the water outlet end of the circulating pump is communicated with the heater.

Preferably, the same control alarm is electrically connected between the flow sensor and the heater.

Preferably, the bottom of the conduit is provided with uniformly distributed fine holes, the normal lines of the fine holes are vertically downward, and the fine holes are positioned right above the wafer rack.

Compared with the prior art, the invention has the beneficial effects that: placing a wafer rack with wafers on a wafer rack support frame, turning on an ultrasonic generator, setting frequency and power, and vibrating by a vibrating rod at a certain frequency; opening an equipment operation switch, enabling a circulating pump and a heater to work, opening a pneumatic valve, enabling a solution to flow downwards at a certain speed through a guide pipe with uniform pores when the solution is pumped into a solution tank through the circulating pump, and enabling the solution and the surface of the wafer to generate tangential convection; the stripped metal and residual glue fall into the filter screen, the metal and impurities with smaller particles are sequentially filtered by the first filter element and the second filter element, and the filtered solution is continuously pumped into the solution tank by the circulating pump to realize circulating operation.

The high-pressure stripping machine can prolong the maintenance period of the high-pressure stripping machine, effectively recovers metals, can ensure continuous work when the filter element is replaced by adopting two sets of filter assemblies, and reduces downtime.

Drawings

Fig. 1 is a schematic view of an overall structure of a wafer pre-peeling apparatus according to the present invention.

In the figure: 1. an ultrasonic generator; 2. a solution tank; 3. a vibration rod; 4. a wafer rack; 5. a sheet frame support frame; 6. filtering with a screen; 7. a front manual valve; 8. a manual air intake valve; 9. a first filter element; 10. a second filter element; 11. a manual drain valve; 12. a rear manual valve; 13. a main drain valve; 14. a circulation pump; 15. a heater; 16. a temperature sensor; 17. a pneumatic valve; 18. a flow sensor; 19. a conduit; 20. and (4) an overflow pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

Referring to fig. 1, the embodiment provides a wafer pre-peeling device, which includes an ultrasonic generator 1 and a solution tank 2 with a funnel-shaped bottom, the ultrasonic generator 1 is connected with a vibrating rod 3, the vibrating rod 3 is located in the solution tank 2, a rack support frame 5 is installed in the solution tank 2, a wafer rack 4 is installed at the top of the rack support frame 5, the bottom of the solution tank 2 is connected with two sets of filter assemblies connected in parallel, a conduit 19 is arranged in the solution tank 2, the conduit 19 is located right above the wafer rack 4, a heater 15 is connected on the conduit 19, and a same circulating pump 14 is connected between the heater 15 and the two filter assemblies.

The conduit 19 is provided with a temperature sensor 16, an air-operated valve 17 and a flow sensor 18, the temperature sensor 16 is positioned between the heater 15 and the air-operated valve 17, and the flow sensor 18 is positioned on the side of the air-operated valve 17 away from the temperature sensor 16.

Specifically, by arranging the ultrasonic generator 1 and the temperature sensor 16 on the conduit 19, the solution at the outlet of the circulating pump 14 can be heated to a certain temperature when passing through the heater 15, and the temperature sensor 16 can read the real-time temperature of the solution, so that the solubility of the photoresist can be increased, and the stripping effect can be enhanced.

An overflow pipe 20 is installed in the solution tank 2, the overflow pipe 20 penetrates through the solution tank 2 and is fixedly connected with the solution tank 2, and the overflow pipe 20 is positioned above the conduit 19.

Further, the upper port of the solution tank 2 is higher than the liquid level of the solution in the solution tank 2, when the liquid level of the solution supplemented to the solution tank 2 exceeds the height of the upper port, the redundant solution flows away from the overflow pipe 20, and the outlet end of the overflow pipe 20 is connected with a plant drainage pipeline.

The bottom of the solution tank 2 is provided with a filter screen 6, the filter screen 6 is made of stainless steel, and the aperture of the filter screen 6 is 45 μm.

The filtering pipeline comprises a preposed manual valve 7, a manual air inlet valve 8, a first filter element 9, a second filter element 10, a manual drain valve 11 and a postposition manual valve 12, wherein the preposed manual valve 7 is positioned between the first filter element 9 and the second filter element 10.

Specifically, the two filter assemblies are respectively a front manual valve 7a, a manual air inlet valve 8a, a first filter element 9a, a second filter element 10a, a manual liquid discharge valve 11a, a rear manual valve 12a, a front manual valve 7b, a manual air inlet valve 8b, a first filter element 9b, a second filter element 10b, a manual liquid discharge valve 11b and a rear manual valve 12b, the front ends of the

filter elements

8a and 8b are connected with plant compressed air, the rear ends of the filter elements 11a and 11b are connected with a plant liquid discharge pipeline, the filter assemblies are opened 7a, 7b, 12a and 12b, the

filter elements

8a, 8b, 11a and 11b are closed, and the filter assemblies work normally; when the filter element I9 or the filter element II 10 is normally disassembled, the solution in the filter tube assembly can be discharged into a plant drainage pipeline by compressed air by closing the

filter elements

7a, 7b and 12a, 12b and opening the

filter elements

8a, 8b and 11a, 11 b; the normal during operation adopts filter assembly all the way can, start filter assembly all the way in addition when needing the renew cartridge, close this filter assembly all the way that is using can.

The fixed slot has been seted up at the top of piece frame support frame 5, and the top of fixed slot and piece frame support frame 5 is the net screw hole form, and disk frame 4 is in the same place with detachable the linking of fixed slot, and the material of disk frame 4 is polytetrafluoroethylene.

The aperture of the first filter element 9 is 9 μm, and the aperture of the second filter element 10 is 10 μm.

The output ends of the two filtering components are connected with the same main liquid discharge valve 13, the water inlet end of the circulating pump 14 is positioned between the main liquid discharge valve 13 and the two filtering components, and the water outlet end of the circulating pump 14 is communicated with the heater 15.

Specifically, when the solution in the solution tank 2 is replaced, the circulation pump 14 is closed, the total liquid discharge valve 13 is opened, after the solution in the solution tank 2 is completely discharged, the total liquid discharge valve 13 is closed, and the solution in the solution tank 2 is replenished again.

The same control alarm is electrically connected between the flow sensor 18 and the heater 15.

Specifically, the flow sensor 18 can display the flow rate of the solution in the real-time temperature sensor 16, and by setting a flow threshold, when the first filter element 9 or the second filter element 10 is blocked, the control alarm detects that the set threshold sends an alarm signal, the alarm signal is connected with the heater 15, the power supply of the heater 15 can be automatically cut off, and the solution is prevented from being continuously heated.

The bottom of the conduit 19 is provided with evenly distributed pores, the normal line of the pores is vertical downwards, and the pores are positioned right above the wafer rack 4.

Specifically, if the normal line of the fine hole at the bottom of the conduit 19 is directed vertically downward, the flow direction of the solution in use in the conduit 19 can be ensured to be parallel to the surface of the wafer and to flow downward uniformly.

When the wafer rack is in work, the wafer rack 4 with wafers is placed on the wafer rack support frame 5, the ultrasonic generator 1 is started, the frequency and the power are set, and the vibration rod 3 vibrates at a certain frequency; the operation switch of the device is turned on, the circulating pump 14 and the heater 15 work, the pneumatic valve 17 is turned on, when the solution is pumped into the solution tank 2 through the circulating pump 14, the solution flows downwards at a certain speed through the conduit 19 with the uniform pores, and the solution and the surface of the wafer generate tangential convection; the stripped metal and residual glue fall into the filter screen 6, the metal and impurities with smaller particles are sequentially filtered by the first filter element 9 and the second filter element 10, and the filtered solution is continuously pumped into the solution tank 2 by the circulating pump 14 to realize circulating operation.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims

1. The utility model provides a wafer stripping off device in advance, includes supersonic generator (1) and solution tank (2) that the bottom is hourglass hopper-shaped, its characterized in that, be connected with vibrting spear (3) on supersonic generator (1), vibrting spear (3) are located solution tank (2), install rack support frame (5) in solution tank (2), disk rack (4) are installed at the top of rack support frame (5), the bottom of solution tank (2) is connected with two sets of parallelly connected filter assembly together, be equipped with pipe (19) in solution tank (2), pipe (19) are located disk rack (4) directly over, be connected with heater (15) on pipe (19), be connected with same circulating pump (14) between heater (15) and two filter assembly.

2. The wafer pre-stripping apparatus as claimed in claim 1, characterized in that the conduit (19) is provided with a temperature sensor (16), a pneumatic valve (17) and a flow sensor (18), the temperature sensor (16) being located between the heater (15) and the pneumatic valve (17), the flow sensor (18) being located on a side of the pneumatic valve (17) remote from the temperature sensor (16).

3. The wafer pre-stripping device as claimed in claim 1, characterized in that an overflow pipe (20) is installed in the solution tank (2), the overflow pipe (20) penetrates through the solution tank (2) and is fixedly connected with the solution tank (2), and the overflow pipe (20) is located above the conduit (19).

4. The wafer pre-peeling apparatus as claimed in claim 1, wherein a filter screen (6) is disposed at the bottom of the solution tank (2), the filter screen (6) is made of stainless steel, and the aperture of the filter screen (6) is 45 μm.

5. The wafer pre-stripping device as claimed in claim 1, characterized in that the filtering pipeline comprises a pre-manual valve (7), a manual air inlet valve (8), a first filter element (9), a second filter element (10), a manual drain valve (11), and a post-manual valve (12), wherein the pre-manual valve (7) is located between the first filter element (9) and the second filter element (10).

6. The wafer pre-peeling apparatus as claimed in claim 1, wherein a fixing groove is formed at a top of the wafer holder support (5), the fixing groove and the top of the wafer holder support (5) are both in a mesh screw hole shape, the wafer holder (4) and the fixing groove are detachably connected together, and the wafer holder (4) is made of polytetrafluoroethylene.

7. The wafer pre-peeling device as claimed in claim 5, wherein the pore diameter of the first filter element (9) is 9 μm, and the pore diameter of the second filter element (10) is 10 μm.

8. The wafer pre-stripping device as claimed in claim 1, characterized in that the same main drain valve (13) is connected to the output ends of the two filtering assemblies, the water inlet end of the circulating pump (14) is located between the main drain valve (13) and the two filtering assemblies, and the water outlet end of the circulating pump (14) is communicated with the heater (15).

9. The wafer pre-peeling apparatus as claimed in claim 2, wherein the same control alarm is electrically connected between the flow sensor (18) and the heater (15).

10. The wafer pre-stripping device as claimed in claim 1, characterized in that the bottom of the conduit (19) is provided with uniformly distributed pores, the normal of the pores is vertical downwards, and the pores are located right above the wafer rack (4).