CN114220730B - Chip chemical tinning processing technology - Google Patents
Chip chemical tinning processing technology Download PDFInfo
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- CN114220730B CN114220730B CN202111312267.0A CN202111312267A CN114220730B CN 114220730 B CN114220730 B CN 114220730B CN 202111312267 A CN202111312267 A CN 202111312267A CN 114220730 B CN114220730 B CN 114220730B
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- frame
- clamping
- chip
- mounting
- washing
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- 239000000126 substance Substances 0.000 title claims abstract description 26
- 238000005516 engineering process Methods 0.000 title claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 128
- 238000005406 washing Methods 0.000 claims abstract description 120
- 238000004140 cleaning Methods 0.000 claims abstract description 40
- 230000007246 mechanism Effects 0.000 claims description 33
- 238000001914 filtration Methods 0.000 claims description 20
- 230000005484 gravity Effects 0.000 claims description 19
- 230000007306 turnover Effects 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 238000007747 plating Methods 0.000 claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000007605 air drying Methods 0.000 claims description 4
- 238000005238 degreasing Methods 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 239000013013 elastic material Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 210000001503 joint Anatomy 0.000 claims description 3
- 230000005389 magnetism Effects 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 230000013011 mating Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000007717 exclusion Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1642—Substrates other than metallic, e.g. inorganic or organic or non-conductive semiconductor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Abstract
The invention relates to the technical field of chip tinning, in particular to a chip chemical tinning processing technology, which uses chip chemical tinning processing equipment, wherein the equipment comprises a water washing frame, a water washing device, a water inlet device and a water draining device, the water washing frame is of a shell structure with an opening at the upper end, the water washing device is arranged in the water washing frame, water inlet devices are arranged on the left side and the right side of the water washing frame, and the water draining device is arranged at the bottom of the water washing frame. The invention can realize the function of simultaneously cleaning a plurality of chips and simultaneously ensure that the surfaces of the chips can be cleaned by cleaning water.
Description
Technical Field
The invention relates to the technical field of chip tinning, in particular to a chip chemical tinning process.
Background
Tin plating and its alloy are one kind of coating with excellent weldability and certain corrosion resistance and may be used widely in electronic element and printed circuit board. Besides the physical methods such as hot dipping and spraying, the methods such as electroplating, dip plating and chemical plating are widely used in industry due to simplicity and easiness. The chemical tinning water can be used for chemical tinning of copper alloy surfaces such as red copper, brass, beryllium copper and the like, and the tin plating layer is bright silvery white, so that the weldability and the decoration of copper can be improved, the conductivity is not affected, and the chemical tinning water can be used in the aspects of electronic industry, furniture appliances, food packaging and the like. The chemical tinning process mainly comprises the steps of degreasing, washing, microetching, washing, chemical tinning, washing, air drying, detecting and the like.
At present, the following problems exist in the chemical tinning process of the chip: a. the surface of the chip is plated with tin by the chemical tinning solution, so that the chip is required to be immediately cleaned by clean hot water after tinning, spots and stains on the surface of a plating layer of the chip are prevented, the chip is generally clamped by a clamp during cleaning so as to be cleaned in clean water, and the problem that the contact part between the clamping end and the surface of the chip cannot be cleaned by the clean water occurs; b. meanwhile, the cleaning water needs to be ensured to be clean enough in the cleaning process of the chip, and most of the existing methods are to replace the cleaning water and clean the cleaning pool periodically, so that the cleaning water in the cleaning pool can not be ensured to be always kept in a clean state, and therefore tin plating liquid impurities still remain on the surface of the chip.
Disclosure of Invention
The invention provides a chip chemical tinning processing technology which can solve the problems.
In order to achieve the above purpose, the present invention adopts the following technical scheme: the chip chemical tinning processing technology uses chip chemical tinning processing equipment, the equipment comprises a water washing frame, a water washing device, a water inlet device and a water draining device, and the specific method during the operation of the equipment is as follows: s1, degreasing and washing: and cleaning grease and stains on the surface of the chip so as not to influence the coating effect.
S2, micro-etching water washing: and microetching the surface of the chip to improve the subsequent tinning efficiency of the surface of the chip, and then cleaning the microetching solution on the surface of the chip.
S3, tinning and water washing: and (3) carrying out tinning treatment on the surface of the chip through chemical tinning liquid, and cleaning the chemical tinning liquid adhered to the surface of the chip after the tinning is finished.
S4, air drying and storing: and S3, drying the moisture on the surface of the chip, packaging the chip in a sealing way, and storing the chip in a dry environment.
The washing frame is of a shell structure with an opening at the upper end, a washing device is arranged in the washing frame, water inlets are arranged at the left side and the right side of the washing frame, and a water drainage device is arranged at the bottom of the washing frame.
The washing device comprises a rotating shaft, a rotating motor, a mounting ring, mounting strips, a turning shaft, a clamping shaft, a turning mechanism, a mounting frame and a clamping mechanism, wherein the rotating shaft is arranged in the washing frame through a spline, one end of the rotating shaft is connected with the output end of the rotating motor through a coupler, the rotating motor is arranged on the outer wall of the washing frame through a motor base, two mounting rings which are arranged front and back are arranged on the rotating shaft, the outer side wall of the mounting ring is circumferentially and uniformly connected with a plurality of mounting strips, one end of the mounting strips, far away from the mounting ring, is provided with the turning shaft through the spline, the turning shaft is connected with the clamping shaft in a sliding clamping manner towards one end of the middle of the rotating shaft, one end of the mounting strips, far away from the clamping shaft, is connected with the mounting frame, and the clamping mechanism is arranged on the mounting frame.
The water inlet device comprises a water inlet pipe and mounting seats, the mounting seats are arranged on the left side and the right side of the washing frame, the mounting seats are shell structures which face one side of the washing frame, through holes are formed in the left side and the right side of the washing frame, the mounting seats are in sealing butt joint with the through holes, and the water inlet pipe is communicated with one side, far away from the washing frame, of the mounting seats.
The drainage device comprises a drainage frame, a drainage pipe and a filtering mechanism, wherein the drainage frame is arranged in the middle of the lower end of the water washing frame, the drainage frame is communicated with the water washing frame, the filtering mechanism is arranged in the drainage frame, and the drainage pipe is communicated with the bottom of the drainage frame.
Preferably, the turnover mechanism comprises an annular gear and a matched gear, the matched gear is arranged at one end, far away from the mounting strip, of the turnover shaft through a spline, the annular gear is fixed on the front side wall and the rear side wall of the inside of the washing frame, the annular gear is concentric with the rotating shaft, and the matched gear is internally meshed with the annular gear.
Preferably, the clamping mechanism comprises a clamping frame, clamping branched chains, a drawing block, a permanent magnet and a reset spring, wherein the mounting frame is of a shell structure which faces one side of the middle of the rotating shaft, the clamping frame is arranged in the mounting frame in a sliding manner along the axis direction of the clamping shaft, the clamping branched chains are arranged in the clamping frame, two through holes which are distributed vertically are formed in the outer side wall of the mounting frame, the drawing block is arranged in the through holes in a sliding manner, the permanent magnet is arranged on the opposite sides of the clamping frame and the drawing block, the magnetism of the permanent magnet is the same as that of the permanent magnet, and the reset spring is connected between the clamping frame and the mounting frame.
Preferably, the clamping branched chain comprises a fixed shaft, an incomplete gear, a planar rack and a sliding component, the clamping frame is of a shell structure which is open towards one side of the middle of the rotating shaft, a plurality of incomplete gears are arranged in the clamping frame along the length direction of the clamping frame, the incomplete gears are arranged on the fixed shaft through splines, the fixed shaft is arranged in the clamping frame through bearings, the planar rack is slidably arranged on one side, far away from the incomplete gears, of the clamping frame, the planar rack is meshed with the incomplete gears, and the two ends of the planar rack are connected with the sliding component.
Preferably, the sliding component include connecting rope, auxiliary roller, locating plate and gravity piece, the both ends of pressing from both sides tight frame towards installing frame one side all are fixed with the locating plate, press from both sides tight frame and all be provided with two auxiliary rollers along its length direction's both ends, and the auxiliary roller passes through the mounting bracket to be fixed on pressing from both sides tight frame, the plane rack both ends are connected with the one end of two connecting ropes respectively, the connecting rope other end slides in proper order and passes and presss from both sides tight frame and locating plate and tip and be connected with the gravity piece, the gravity piece slides and sets up on pressing from both sides tight frame outer wall, it slides on the auxiliary roller to connect the rope, the opposite end between locating plate and the gravity piece all is provided with the elastic layer.
Preferably, the outer side wall of the incomplete gear far away from the planar rack is provided with a contact layer, and the contact layer is made of elastic materials.
Preferably, the filter mechanism include filter frame, sealed pad, back frame, filter and filter screen, the removal hole with the inside intercommunication of drain frame is seted up to drain frame front end, and the downthehole filter frame that is provided with that slides of removal, the filter frame is back type structure, and the filter frame upper and lower end all is provided with sealed pad, the filter frame passes through sealed pad and removal hole sliding seal cooperation, the filter frame is inside to be installed back frame from last down through detachable mode equidistant, is located the filter screen is installed on the back frame of filter frame lower extreme, and is otherwise install the filter on the back frame, from last down distributing filter hole on the filter reduces gradually.
Preferably, the lower end face of the inside of the washing frame is provided with V-shaped inclined faces which are symmetrically arranged left and right, a heating plate is arranged in the washing frame, and the inner side wall of the washing frame is coated with a heat-insulating coating.
Preferably, the upper end face of the washing frame is provided with two expansion plates which are arranged symmetrically left and right.
The invention has the beneficial effects that: 1. the invention can realize the function of simultaneously cleaning a plurality of chips and simultaneously ensure that the surfaces of the chips can be cleaned by cleaning water.
2. According to the invention, the incomplete gear is meshed with the planar rack, so that the incomplete gear can reciprocally rotate in a state that the planar rack reciprocally moves, and the contact position of the incomplete gear and the chip surface is always changed, so that the chip surface can be ensured to be cleaned by cleaning water.
3. According to the washing device disclosed by the invention, the chip is driven to circumferentially rotate along the axis of the rotating shaft through the rotating shaft, and simultaneously, the chip can also circumferentially rotate along the axis of the rotating shaft through the turnover mechanism, so that the stirring effect of the chip in the washing frame is improved, and the chip can be better cleaned.
4. According to the invention, the cleaning water discharged from the water washing frame is subjected to multistage filtration through the plurality of filter plates with different filter hole diameters, so that the filtration efficiency is improved, and meanwhile, the cleaning water is filtered through the filter screen, so that fine particles of impurities contained in the cleaning water are filtered.
Drawings
The invention will be further described with reference to the drawings and examples.
Fig. 1 is a flow chart of the present invention.
Fig. 2 is a schematic structural view of the present invention.
Fig. 3 is a top view of the present invention.
FIG. 4 is a schematic view of the structure of the washing apparatus of the present invention.
Fig. 5 is a cross-sectional view taken at X-X of fig. 3 in accordance with the present invention.
Fig. 6 is a cross-sectional view of the present invention at Y-Y of fig. 3.
Fig. 7 is an enlarged view of a portion of the invention at B of fig. 6.
Fig. 8 is an enlarged view of a portion of fig. 7 at C in accordance with the present invention.
Fig. 9 is a schematic view of the structure of the clamping mechanism, mounting frame, clamping shaft, turning shaft and mating gear of the present invention.
Fig. 10 is an enlarged view of a portion of fig. 5 a of the present invention.
In the figure: 100. a chip; 1. washing the frame with water; 11. a heating plate; 12. a telescoping plate; 2. a water washing device; 21. a rotating shaft; 22. a rotating motor; 23. a mounting ring; 24. a mounting bar; 25. a turnover shaft; 26. the clamping shaft; 27. a turnover mechanism; 271. an inner gear ring; 272. a mating gear; 28. a mounting frame; 29. a clamping mechanism; 291. a clamping frame; 292. clamping the branched chain; 293. a drawing block; 294. a permanent magnet; 295. a return spring; 296. a fixed shaft; 297. an incomplete gear; 2971. a contact layer; 298. a planar rack; 299. a sliding assembly; 2991. a connecting rope; 2992. an auxiliary roller; 2993. a positioning plate; 2994. a gravity block; 3. a water inlet device; 31. a water inlet pipe; 32. a mounting base; 4. a drainage device; 41. a drain frame; 42. a drain pipe; 43. a filtering mechanism; 431. a filter frame; 432. a sealing gasket; 433. a mold frame; 434. a filter plate; 435. and (5) a filter screen.
Detailed Description
Embodiments of the present invention are described below with reference to the accompanying drawings. In this process, to ensure clarity and convenience of description, the widths of the lines or the sizes of the constituent elements in the drawings may be exaggerated.
In addition, the terms below are defined based on functions in the present invention, and may be different according to intention of an operator or convention. Accordingly, these terms are defined based on the entire contents of the present specification.
Referring to fig. 1 to 3, a chip electroless tin plating process using a chip electroless tin plating apparatus comprising a washing frame 1, a washing device 2, a water inlet device 3 and a water outlet device 4, the specific method for operating the apparatus is as follows: s1, degreasing and washing: and cleaning grease and stains on the surface of the chip so as not to influence the coating effect.
S2, micro-etching water washing: and microetching the surface of the chip to improve the subsequent tinning efficiency of the surface of the chip, and then cleaning the microetching solution on the surface of the chip.
S3, tinning and water washing: the surface of the chip is subjected to tinning treatment through chemical tinning liquid, the chemical tinning liquid for cleaning the adhesion of the surface of the chip after the tinning is finished is used for enabling the cleaning water in the water washing frame 1 to be in a flowing state all the time through the water inlet device 3 and the water outlet device 4, ensuring that the cleaning water in the water washing frame 1 is kept clean enough, then clamping the chip subjected to the chemical tinning on the clamping end in the water washing device 2, and enabling the chip to be overturned and stirred in the water washing frame 1 through the water washing device 2, so that the chip can be cleaned better.
S4, air drying and storing: and S3, drying the moisture on the surface of the chip, packaging the chip in a sealing way, and storing the chip in a dry environment.
The washing frame 1 is of a shell structure with an opening at the upper end, a washing device 2 is arranged in the washing frame 1, water inlets 3 are arranged on the left side and the right side of the washing frame 1, and a water drainage device 4 is arranged at the bottom of the washing frame 1; during specific work, firstly, the washing device 2 is adjusted according to the size specification of the chip 100, then clean water is conveyed into the washing frame 1 through the water inlet device 3, then the chip 100 subjected to chemical tinning is moved into the washing frame 1 and clamped on the washing device 2, so that the chip 100 is turned over and washed in the washing frame 1 under the driving of the washing device 2, meanwhile, the water draining device 4 is opened, so that water in the washing frame 1 is always in a flowing state under the combined action of the water inlet device 3 and the water draining device 4, the problem that cleaning water is turbid due to the fact that tinning liquid adhered to the chip 100 is mixed in the cleaning water in the washing frame 1 is avoided, and the washing of the subsequent chip 100 is affected.
Referring to fig. 2, 3 and 5, the water inlet device 3 includes a water inlet pipe 31 and an installation seat 32, the installation seat 32 is installed on the left and right sides of the water washing frame 1, and the installation seat 32 is a shell structure opening towards one side of the water washing frame 1, through holes are all formed on the left and right sides of the water washing frame 1, the installation seat 32 is in sealing butt joint with the through holes, and the water inlet pipe 31 is communicated with one side, far away from the water washing frame 1, of the installation seat 32.
Referring to fig. 2 and 5, the drainage device 4 includes a drainage frame 41, a drainage pipe 42 and a filtering mechanism 43, the drainage frame 41 is installed in the middle of the lower end of the washing frame 1, the drainage frame 41 is communicated with the washing frame 1, the filtering mechanism 43 is disposed in the drainage frame 41, and the drainage pipe 42 is communicated with the bottom of the drainage frame 41.
In specific operation, clean water in the existing hot water source is conveyed into the mounting seat 32 through the water inlet pipe 31 and then flows into the water washing frame 1, meanwhile, the clean water in the water washing frame 1 can be discharged along the water discharging frame 41, solid impurities contained in the clean water are filtered through the filtering mechanism 43, then the clean water is collected into the existing water collecting tank through the water discharging pipe 42, and then the clean water in the water collecting tank is conveyed into the existing hot water source after being purified.
Referring to fig. 5, 6 and 10, the filtering mechanism 43 includes a filtering frame 431, a sealing pad 432, a mold returning frame 433, a filter plate 434 and a filter screen 435, a moving hole communicated with the inside of the draining frame 41 is formed at the front end of the draining frame 41, the filtering frame 431 is in a mold returning structure, the upper end and the lower end of the filtering frame 431 are respectively provided with a sealing pad 432, the filtering frame 431 is in sliding sealing fit with the moving hole through the sealing pad 432, the mold returning frame 433 is installed inside the filtering frame 431 from top to bottom in a detachable mode at equal intervals, the filter screen 435 is installed on the mold returning frame 433 at the lowermost end of the filtering frame 431, the filter plate 434 is installed on the other mold returning frame 433, and the filter holes on the filter plate 434 distributed from top to bottom are gradually reduced. In specific operation, the cleaning water in the water washing frame 1 is conveyed into the filtering frame 431 at the lower end of the water washing frame, the cleaning water sequentially passes through the filtering plates 434 from top to bottom to filter out impurities contained in the cleaning water, then fine impurities in the cleaning water are filtered out through the filtering plates 435, and finally the cleaning water is discharged through the drain pipe 42; when the filter plate 434 and the filter screen 435 need to be replaced or cleaned, the filter frame 431 is withdrawn from the moving hole, and then the mold frame 433 with the filter plate 434 and the filter screen 435 mounted thereon is detached, thereby facilitating the replacement and cleaning of the filter plate 434 and the filter screen 435.
Referring to fig. 3 to 9, the washing device 2 includes a rotating shaft 21, a rotating motor 22, a mounting ring 23, mounting strips 24, a turning shaft 25, a clamping shaft 26, a turning mechanism 27, a mounting frame 28 and a clamping mechanism 29, wherein the rotating shaft 21 is mounted in the washing frame 1 through a spline, one end of the rotating shaft 21 is connected with the output end of the rotating motor 22 through a coupling, the rotating motor 22 is mounted on the outer wall of the washing frame 1 through a motor base, two mounting rings 23 arranged front and back are mounted on the rotating shaft 21, the outer side wall of the mounting ring 23 is uniformly connected with a plurality of mounting strips 24 in the circumferential direction, one end, far away from the mounting ring 23, of the mounting strips 24 is provided with the turning shaft 25 through a spline, one end, facing the middle part of the rotating shaft 21, of the turning shaft 25 is slidably clamped with the clamping shaft 26, the other end of the turning shaft 25 is connected with the turning mechanism 27, one end, far away from the mounting strips 24, of the clamping shaft 26 is connected with the mounting frame 28, and the clamping mechanism 29 is arranged on the mounting frame 28; during specific work, the chip 100 is placed between the two front and back distributed mounting frames 28 and clamped and fixed through the clamping mechanism 29, then the rotating motor 22 drives the rotating shaft 21 to rotate, the mounting ring 23 drives the mounting bars 24 to synchronously rotate, then the chip 100 rotates in the washing frame 1 along with the rotating shaft 21 under the driving of the overturning shaft 25 and the clamping shaft 26, the cleaning effect of the chip 100 is improved, the chip 100 rotates by taking the axis of the overturning shaft 25 as the center under the action of the overturning mechanism 27, the cleaning effect of the chip 100 in the washing frame 1 is further improved, and the clamping shaft 26 is required to be in sliding clamping connection along the axis direction of the overturning shaft 25, so that the overturning shaft 25 can drive the clamping shaft 26 to synchronously rotate, and meanwhile, the positions of the mounting frames 28 can be adjusted through the clamping shaft 26, so that the distance between the two front and back arranged mounting frames 28 is changed, and the chips 100 with different sizes can be clamped and fixed.
Referring to fig. 4, the turnover mechanism 27 includes an inner gear ring 271 and a mating gear 272, the mating gear 272 is mounted on one end of the turnover shaft 25 far away from the mounting bar 24 through a spline, the inner gear ring 271 is fixed on the front and rear side walls of the inside of the washing frame 1, the inner gear ring 271 is concentric with the rotating shaft 21, and the mating gear 272 is meshed with the inner gear ring 271. When the mounting bar 24 is driven to synchronously rotate by the mounting ring 23 through the rotating shaft 21, the matched gear 272 on the turnover shaft 25 also synchronously rotates along with the rotating shaft 21, and then the matched gear 272 is rotationally meshed with the annular gear 271, so that the matched gear 272 drives the turnover shaft 25 to circumferentially rotate along the axis of the turnover shaft 25, and the chip 100 is driven to synchronously rotate through the clamping shaft 26 and the mounting frame 28, so that the chip 100 can also rotate along with the turnover shaft 25 while rotating along with the rotating shaft 21, and the cleaning efficiency of the chip 100 in the washing frame 1 is improved.
Referring to fig. 7 and 8, the clamping mechanism 29 includes a clamping frame 291, a clamping branched chain 292, a drawing block 293, a permanent magnet 294 and a return spring 295, the mounting frame 28 is a shell structure with an opening towards one side of the middle of the rotating shaft 21, the clamping frame 291 is slidably disposed in the mounting frame 28 along the axial direction of the clamping shaft 26, the clamping branched chain 292 is disposed in the clamping frame 291, two through holes distributed up and down are formed in the outer side wall of the mounting frame 28, the drawing block 293 is slidably disposed in the through holes, the permanent magnet 294 is mounted on opposite sides of the clamping frame 291 and the drawing block 293, the two have the same magnetism, and the return spring 295 is connected between the clamping frame 291 and the mounting frame 28. When the chip 100 is placed between two clamping frames 291, the pull block 293 is controlled to move towards the inside of the mounting frame 28 by the existing clamp manually, so that a mutual exclusion acting force is generated between the permanent magnet 294 on the pull block 293 and the permanent magnet 294 on the clamping frame 291, the clamping frame 291 moves towards the chip 100 until the clamping branched chain 292 clamps and fixes the chip 100, after the washing of the chip 100 is completed, the pull block 293 is controlled to move towards a direction far away from the mounting frame 28 by the existing clamp, so that a mutual exclusion acting force is not generated between the permanent magnet 294 on the pull block 293 and the permanent magnet 294 on the clamping frame 291, and the clamping frame 291 returns to an initial position under the action of the reset spring 295, so that the clamping branched chain 292 does not clamp and fix the chip 100. It should be noted that, when the pull block 293 is manually clamped by the existing clamp and the pull block 293 is pushed to move into the mounting frame 28, the pull block 293 is clamped in the mounting frame 28, so that the problem that the chip 100 cannot be clamped by the clamping branched chain 292 due to the fact that the pull block 293 is separated from the mounting frame 28 when the mounting frame 28 is turned over is prevented, and when the chip 100 needs to be taken out, the pull block 293 is manually clamped by the existing clamp and the pull block 293 is pulled by the existing clamp so as to move the pull block 293 out of the mounting frame 28.
Referring to fig. 7 and 8, the clamping branched chain 292 includes a fixed shaft 296, an incomplete gear 297, a planar rack 298 and a sliding assembly 299, the clamping frame 291 is a housing structure that is opened towards one side of the middle of the rotating shaft 21, a plurality of incomplete gears 297 are disposed in the clamping frame 291 along the length direction thereof, the incomplete gears 297 are mounted on the fixed shaft 296 through splines, the fixed shaft 296 is mounted in the clamping frame 291 through bearings, the planar rack 298 is slidably disposed in the clamping frame 291 at one side far away from the incomplete gears 297, the planar rack 298 is meshed with the incomplete gears 297, and both ends of the planar rack 298 are connected with the sliding assembly 299. When the mounting frame 28 drives the clamping frame 291 to rotate by taking the axis of the turnover shaft 25 as the center, the planar rack 298 slides up and down under the cooperation of the two sliding components 299, so that the incomplete gear 297 rotates on the fixed shaft 296 in a reciprocating manner, the contact surface of the incomplete gear 297 and the chip 100 is changed, and the problem that the contact surface of the incomplete gear 297 and the chip 100 cannot be cleaned by cleaning water is avoided.
Referring to fig. 8, the sliding assembly 299 comprises a connecting rope 2991, auxiliary rollers 2992, a positioning plate 2993 and a gravity block 2994, wherein the positioning plate 2993 is fixed at two ends of one side of the clamping frame 291 facing the mounting frame 28, two auxiliary rollers 2992 are arranged at two ends of the clamping frame 291 along the length direction of the clamping frame, the auxiliary rollers 2992 are fixed on the clamping frame 291 through mounting frames, two ends of the planar rack 298 are respectively connected with one ends of the two connecting ropes 2991, the other ends of the connecting ropes 2991 sequentially slide through the clamping frame 291 and the positioning plate 2993, the ends of the connecting ropes are connected with the gravity block 2994, the gravity block 2994 is slidably arranged on the outer wall of the clamping frame 291, the connecting ropes 2991 slide on the auxiliary rollers 2992, and elastic layers are arranged at opposite ends between the positioning plate 2993 and the gravity block 2994. When the clamping frame 291 drives the chip 100 to rotate to a vertical position, the gravity block 2994 at the upper end of the clamping frame 291 can slide downwards under the action of gravity, the gravity block 2994 at the upper end of the clamping frame 291 can pull the connecting rope 2991 and pull the plane rack 298 to move upwards, so that the incomplete gear 297 rotates, the position of the outer side wall of the incomplete gear 297, which is contacted with the surface of the chip 100, is changed, cleaning water is obtained at the position of the incomplete gear 297, which is contacted with the surface of the chip 100, and meanwhile, the gravity block 2994 at the lower end of the clamping frame 291 can move to the positioning plate 2993 at the lower end of the clamping frame 291, so that the connecting rope 2991 connected between the gravity block 2994 at the lower end and the lower end of the plane rack 298 is in a loose state, and the gravity block 2994 at the upper end of the clamping frame 291 can drive the plane rack 298 to move upwards through the connecting rope 2991 on the clamping frame 291, and finally the chip 100 is shifted downwards; when the clamping frames 291 drive the chip 100 to rotate 180 degrees again, the chip 100 also deflects downwards, and at the moment, the chip 100 returns to the original position to contact with the outer side wall of the incomplete gear 297, so that the function of reciprocating the chip 100 between the clamping frames 291 is realized, and the position where the chip 100 contacts with the incomplete gear 297 is cleaned by clean water.
Referring to fig. 7, the outer side wall of the incomplete gear 297 away from the planar rack 298 is provided with a contact layer 2971, and the contact layer 2971 is made of an elastic material; the elastic contact layer 2971 enables the incomplete gear 297 to clamp and fix the chip 100 better, so that the chip 100 is prevented from sliding and being separated from the clamping of the incomplete gear 297, and meanwhile, the contact layer 2971 can effectively prevent the incomplete gear 297 from being in direct contact with the surface of the chip 100, so that the problem of surface scratch of the chip 100 is easily caused; the outer side wall of the contact layer 2971 is provided with a plurality of V-shaped grooves so as to improve the clamping force between the contact layer 2971 and the surface of the chip and avoid the problem that the chip 100 is separated from the incomplete gear 297 for clamping when the chip 100 is turned and cleaned in the washing frame 1.
Referring to fig. 5, the lower end surface of the inside of the washing frame 1 is provided with V-shaped inclined surfaces which are symmetrically arranged left and right, a heating plate 11 is arranged in the washing frame 1, and the inner side wall of the washing frame 1 is coated with a heat-insulating coating; the problem that impurities contained in clean water in the water washing frame 1 are deposited at the bottom of the water washing frame 1 can be effectively avoided through the V-shaped inclined surface at the bottom of the water washing frame 1, the clean water in the water washing frame 1 can be ensured to keep enough temperature through the heating plate 11, the problem of temperature reduction of the clean water is avoided, the cleaning effect of the chip 100 is further affected, and meanwhile, heat dissipation of the clean water can be avoided through the heat insulation coating coated on the inner side wall of the water washing frame 1.
Referring to fig. 2, 3, 5 and 6, the upper end surface of the water washing frame 1 is provided with two expansion plates 12 symmetrically arranged left and right; after the chip 100 is clamped and mounted on the washing device 2, the upper end of the washing frame 1 is sealed by the expansion plate 12 at the upper end of the washing frame 1, so that the heat dissipation of clean water in the washing frame 1 is avoided.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a chip chemical tinning processing technology, its has used chip chemical tinning processing equipment, and this equipment includes washing frame (1), washing device (2), water inlet unit (3) and drainage device (4), its characterized in that: the specific method for the operation by adopting the equipment is as follows:
s1, degreasing and washing: cleaning grease on the surface of the chip;
s2, micro-etching water washing: microetching the surface of the chip, and then cleaning the microetching solution on the surface of the chip;
s3, tinning and water washing: carrying out tinning treatment on the surface of the chip through chemical tinning liquid, and cleaning the chemical tinning liquid adhered to the surface of the chip after the tinning is finished;
s4, air drying and storing: after the step S3 is completed, drying the moisture on the surface of the chip, and then sealing and packaging the chip and storing the chip in a dry environment;
the water washing frame (1) is of a shell structure with an opening at the upper end, a water washing device (2) is arranged in the water washing frame (1), water inlet devices (3) are arranged on the left side and the right side of the water washing frame (1), and a water drainage device (4) is arranged at the bottom of the water washing frame (1); wherein:
the washing device (2) comprises a rotating shaft (21), a rotating motor (22), a mounting ring (23), mounting strips (24), a turnover shaft (25), a clamping shaft (26), a turnover mechanism (27), a mounting frame (28) and a clamping mechanism (29), wherein the rotating shaft (21) is mounted in the washing frame (1) through a spline, one end of the rotating shaft (21) is connected with the output end of the rotating motor (22) through a coupling, the rotating motor (22) is mounted on the outer wall of the washing frame (1) through a motor base, two front-back mounting rings (23) are mounted on the rotating shaft (21), a plurality of mounting strips (24) are uniformly connected to the periphery of the outer side wall of the mounting ring (23), one end, far away from the mounting ring (23), of the mounting strips (24) is provided with the turnover shaft (25) through the spline, one end, facing the middle of the rotating shaft (21), of the turnover shaft (25) is connected with the clamping shaft (26) through the sliding clamping joint, and one end, far away from the mounting strip (24), of the mounting frame (28) is provided with the clamping mechanism (29);
the clamping mechanism (29) comprises a clamping frame (291), a clamping branched chain (292), a drawing block (293), a permanent magnet (294) and a reset spring (295), wherein the mounting frame (28) is of a shell structure which is open towards one side of the middle of the rotating shaft (21), the clamping frame (291) is slidably arranged in the mounting frame (28) along the axial direction of the clamping shaft (26), the clamping branched chain (292) is arranged in the clamping frame (291), two through holes which are vertically distributed are formed in the outer side wall of the mounting frame (28), the drawing block (293) is slidably arranged in the through holes, the permanent magnet (294) is arranged on the opposite sides of the clamping frame (291) and the drawing block (293), the two are identical in magnetism, and the reset spring (295) is connected between the clamping frame (291) and the mounting frame (28);
the clamping branched chain (292) comprises a fixed shaft (296), an incomplete gear (297), a planar rack (298) and a sliding assembly (299), wherein the clamping frame (291) is of a shell structure which is opened towards one side of the middle of the rotating shaft (21), a plurality of incomplete gears (297) are arranged in the clamping frame (291) along the length direction of the clamping frame, the incomplete gears (297) are arranged on the fixed shaft (296) through splines, the fixed shaft (296) is arranged in the clamping frame (291) through bearings, the planar rack (298) is slidably arranged on one side, far away from the incomplete gears (297), of the clamping frame (291), the planar rack (298) is meshed with the incomplete gears (297), the two ends of the planar rack (298) are connected with the sliding assembly (299), the incomplete gears (297) reciprocate on the fixed shaft (296), and the contact surface between the incomplete gears (297) and the chip (100) is changed.
The water inlet device (3) comprises a water inlet pipe (31) and mounting seats (32), the mounting seats (32) are arranged on the left side and the right side of the water washing frame (1), the mounting seats (32) are shell structures which are open towards one side of the water washing frame (1), through holes are formed in the left side and the right side of the water washing frame (1), the mounting seats (32) are in sealing butt joint with the through holes, and the water inlet pipe (31) is communicated with one side, far away from the water washing frame (1), of the mounting seats (32);
the drainage device (4) comprises a drainage frame (41), a drainage pipe (42) and a filtering mechanism (43), wherein the drainage frame (41) is installed at the middle of the lower end of the water washing frame (1), the drainage frame (41) is communicated with the water washing frame (1), the filtering mechanism (43) is arranged in the drainage frame (41), and the drainage pipe (42) is communicated with the bottom of the drainage frame (41).
2. A chip electroless tin plating process according to claim 1, wherein: the turnover mechanism (27) comprises an annular gear (271) and a matching gear (272), the matching gear (272) is arranged at one end, far away from the mounting strip (24), of the turnover shaft (25) through a spline, the annular gear (271) is fixed on the front side wall and the rear side wall of the inside of the washing frame (1), the annular gear (271) is concentric with the rotating shaft (21), and the matching gear (272) is meshed with the annular gear (271) in an inner mode.
3. A chip electroless tin plating process according to claim 1, wherein: the sliding assembly (299) comprises a connecting rope (2991), auxiliary rollers (2992), a positioning plate (2993) and a gravity block (2994), wherein the two ends of one side of a clamping frame (291) facing a mounting frame (28) are respectively fixed with the positioning plate (2993), the two ends of the clamping frame (291) along the length direction of the clamping frame are respectively provided with two auxiliary rollers (2992), the auxiliary rollers (2992) are fixed on the clamping frame (291) through mounting racks, the two ends of a planar rack (298) are respectively connected with one ends of the two connecting ropes (2991), the other ends of the connecting ropes (2991) sequentially slide through the clamping frame (291) and the positioning plate (2993) and the ends of the gravity block (2994), the gravity block (2994) is slidably arranged on the outer wall of the clamping frame (291), and the opposite ends between the positioning plate (2993) and the gravity block (2994) are respectively provided with an elastic layer.
4. A chip electroless tin plating process according to claim 1 or 3, wherein: the outer side wall of the incomplete gear (297) far away from the plane rack (298) is provided with a contact layer (2971), and the contact layer (2971) is made of elastic materials.
5. A chip electroless tin plating process according to claim 1, wherein: the utility model provides a filter mechanism (43) include filter frame (431), sealed pad (432), back type frame (433), filter (434) and filter screen (435), the removal hole with the inside intercommunication of drain frame (41) is seted up to drain frame (41) front end, and removes the downthehole filter frame (431) that is provided with of sliding, filter frame (431) are back structure, and filter frame (431) upper and lower extreme all is provided with sealed pad (432), filter frame (431) are through sealed pad (432) and removal hole sliding seal cooperation, filter frame (431) inside from last back type frame (433) of installing through detachable mode equidistant, be located filter frame (431) back type frame (433) of lower extreme and install filter screen (435), the balance back type frame (433) are last to be installed filter plate (434), follow down the filter hole on filter plate (434) of distribution gradually reduces.
6. A chip electroless tin plating process according to claim 1, wherein: the inner lower end face of the washing frame (1) is provided with V-shaped inclined faces which are symmetrically arranged left and right, a heating plate (11) is arranged in the washing frame (1), and the inner side wall of the washing frame (1) is coated with a heat-insulating coating.
7. A chip electroless tin plating process according to claim 1, wherein: the upper end face of the water washing frame (1) is provided with two telescopic plates (12) which are symmetrically arranged left and right.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111312267.0A CN114220730B (en) | 2021-11-08 | 2021-11-08 | Chip chemical tinning processing technology |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111312267.0A CN114220730B (en) | 2021-11-08 | 2021-11-08 | Chip chemical tinning processing technology |
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| CN114220730A CN114220730A (en) | 2022-03-22 |
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| KR20040038504A (en) * | 2002-11-01 | 2004-05-08 | 주식회사 포스코 | Automatic cleaning and loading apparatus of plating solution filter |
| KR20050115644A (en) * | 2004-06-04 | 2005-12-08 | 삼성전자주식회사 | Apparatus for cleaning a wafer |
| CN110571165A (en) * | 2018-06-05 | 2019-12-13 | 中芯国际集成电路制造(上海)有限公司 | cleaning device, cleaning method, semiconductor processing machine table and wafer processing method |
| CN111889443A (en) * | 2020-06-28 | 2020-11-06 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment |
| CN113385242A (en) * | 2020-03-11 | 2021-09-14 | 珠海六和节能投资有限公司 | Micro-fluidic chip equipment with chip is from cleaning function |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4421611B2 (en) * | 2003-08-07 | 2010-02-24 | 株式会社荏原製作所 | Substrate processing equipment |
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2021
- 2021-11-08 CN CN202111312267.0A patent/CN114220730B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040038504A (en) * | 2002-11-01 | 2004-05-08 | 주식회사 포스코 | Automatic cleaning and loading apparatus of plating solution filter |
| KR20050115644A (en) * | 2004-06-04 | 2005-12-08 | 삼성전자주식회사 | Apparatus for cleaning a wafer |
| CN110571165A (en) * | 2018-06-05 | 2019-12-13 | 中芯国际集成电路制造(上海)有限公司 | cleaning device, cleaning method, semiconductor processing machine table and wafer processing method |
| CN113385242A (en) * | 2020-03-11 | 2021-09-14 | 珠海六和节能投资有限公司 | Micro-fluidic chip equipment with chip is from cleaning function |
| CN111889443A (en) * | 2020-06-28 | 2020-11-06 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment |
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Effective date of registration: 20240129 Address after: 343900 Suichuan Industrial Park (East District), Ji'an City, Jiangxi Province Applicant after: JI'AN HOTCHAIN TECHNOLOGY CO.,LTD. Country or region after: China Address before: 518100 1201, No. 110, North Ring Road, Xinqiao community, Xinqiao street, Bao'an District, Shenzhen, Guangdong Province Applicant before: Shenzhen Hongda autumn science and Technology Co.,Ltd. Country or region before: China |
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