CN114217101A

CN114217101A - Radio frequency test probe structure and radio frequency test system

Info

Publication number: CN114217101A
Application number: CN202111278519.2A
Authority: CN
Inventors: 刘东平; 翟巍; 江成
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2021-10-30
Filing date: 2021-10-30
Publication date: 2022-03-22
Anticipated expiration: 2041-10-30
Also published as: CN114217101B

Abstract

The application provides a radio frequency test probe structure and radio frequency test system relates to radio frequency test technical field, and this radio frequency test probe structure includes: the test device comprises a shell, a medium, a first test needle and a second test needle. The medium is arranged in the shell, the shell is made of conductive materials, the first test needle is arranged in the medium, and the first test needle is coaxial with the medium; the second test needle sets up on the shell, and the test end of first test needle and the test end of second test needle are located the same end of shell. An impedance adapting structure is arranged between the first testing needle and the second testing needle, and the impedance adapting structure at least comprises a compensation structure or a coaxial structure. By arranging the compensation structure and/or the coaxial structure, the impedance between the first test needle and the second test needle is close to or equal to the impedance of the radio frequency transmission line, so that the probe structure has better impedance matching in the radio frequency test process.

Description

Radio frequency test probe structure and radio frequency test system

Technical Field

The application relates to the technical field of radio frequency testing, in particular to a radio frequency testing probe structure and a radio frequency testing system.

Background

When performing radio frequency testing, a general radio frequency testing instrument cannot be directly connected with a device to be tested, and needs to be connected with a product to be tested or a single board through a probe structure, and then a signal is guided into the radio frequency testing instrument.

When testing a PCB or a substrate on a product, the impedance of the rf transmission line is generally 50 Ω, and it is necessary to match the impedance of the test probe structure with the impedance of the transmission line as much as possible, i.e. the impedance of the test probe structure is closer to or equal to 50 Ω. In the prior art, one of the schemes is to adopt a test probe with a coaxial eccentric structure, which is limited by the requirement of characteristic impedance, and the joint at the bottom of the test probe is large, so that a large avoidance space needs to be reserved on a PCB or a substrate to avoid a needle cylinder; and because the coaxial structure is adopted, the metal area at the bottom of the probe is large, and the problems of large parasitic capacitance and the risk of short circuit are easy to occur. Another solution is to control the impedance of the test probe structure to 50 Ω by adding a matching circuit, but in this solution, the internal structure of the test probe is too complex and costly.

Disclosure of Invention

The embodiment of the application provides a radio frequency test probe structure and a radio frequency test system, which can solve the problem that the characteristic impedance of a radio frequency test probe between the test process and a device to be tested is high, so that the broadband matching of radio frequency signals in the radio frequency test process is improved, and meanwhile, the avoidance space of the structure is reduced.

In order to achieve the purpose, the technical scheme is as follows:

in a first aspect, the present application provides a radio frequency test probe structure for coupling an outgoing radio frequency probing signal from a transmission line of a radio frequency connector, and coupling the outgoing radio frequency probing signal into a circuit under test through the radio frequency test probe structure, the radio frequency test probe structure including: the test device comprises a shell, a medium, a first test needle and a second test needle.

The medium is arranged in the shell, the shell is made of conductive materials, the first test needle is arranged in the medium, the signal end of the first test needle is connected with a signal wire of the radio frequency connector, and the first test needle is coaxial with the medium; the second test needle sets up on the shell, and the test end of first test needle and the test end of second test needle are located the same end of shell.

An impedance adapting structure is arranged between the first testing needle and the second testing needle and used for adjusting the impedance between the first testing needle and the second testing needle to be close to or equal to the impedance of the radio frequency transmission line.

On this basis, when this probe structure was applied to the radio frequency test, first test needle mainly was used for the conduction of radio frequency signal, and the second test needle is used for carrying out ground connection, and is coaxial with the medium through setting up first test needle, forms coaxial test structure with the electrically conductive shell in the medium outside, can reduce the impedance in the radio frequency test process. By arranging the impedance adapting structure between the first test needle and the second test needle, the impedance structure can comprise a compensation structure and/or a coaxial structure, and the compensation structure in the impedance adapting structure increases the capacitance between the first test needle and the second test needle, so that the impedance between the first test needle and the second test needle is improved; the coaxial structure in the impedance adapting structure can directly adjust the impedance between the first test pin and the second test pin to the impedance of the radio frequency transmission line. By arranging the compensation structure and/or the coaxial structure, the impedance between the first test needle and the second test needle is close to or equal to the impedance of the radio frequency transmission line, so that the probe structure has better impedance matching in the radio frequency test process.

In a possible design manner of the first aspect, the impedance adapting structure includes a compensation structure, the compensation structure is a compensation block formed by a conductive material, the compensation block is disposed on the first testing pin and the second testing pin, one end of the compensation block is connected to the second testing pin, and a gap is maintained between the other end of the compensation block and the first testing pin.

On this basis, by setting up compensation structure between first test needle and second test needle: the compensation block is connected with the second test needle, so that the distance between the first test needle and the grounding needle (the second test needle) can be reduced, the capacitance between the first test needle and the second test needle is increased, and the impedance between the first test needle and the second test needle is reduced. By arranging the compensation block to keep a gap with the first test needle, the first test needle can be prevented from being in direct contact with the second test needle to form a short circuit.

In a possible design manner of the first aspect, the impedance adapting structure includes a compensation structure and a coaxial structure, the compensation structure is a connection block formed by a conductive material, and the coaxial structure is an annular block formed by a conductive material. The annular block is of a hollow annular structure and is connected with the second test needle through a connecting block, the annular block is sleeved outside the first test needle, and the annular block is coaxial with the first test needle.

On this basis, it is coaxial with first test needle through setting up the annular piece to be connected annular piece and second test needle through the connecting block, make annular piece and first test needle form coaxial configuration, can adjust the impedance between first test needle and the second test needle and equal with the impedance of radio frequency transmission line through the diameter size of adjusting the annular piece.

In a possible design manner of the first aspect, the first test needle comprises a needle head and a needle body, the impedance adapting structure comprises a compensation structure, the compensation structure is the needle head, and the diameter of the needle head is larger than that of the needle body; the needle body is a first test needle positioned in the medium, and the needle head is a first test needle positioned outside the medium.

On this basis, the diameter through setting up first test needle syringe needle is greater than the diameter of needle body, compare in the same big test needle of syringe needle diameter and needle body diameter, the great first test needle of syringe needle diameter can reduce the distance between first test needle and the second test needle in this embodiment, make the great syringe needle of diameter form the compensation structure, the impedance between first test needle and the second test needle has been reduced, make the impedance between first test needle and the second test needle more be close to the impedance of radio frequency transmission line, be favorable to improving the impedance matching of probe structure.

In a possible design manner of the first aspect, the compensation block is a rectangular parallelepiped, the width of the compensation block is equal to the diameter of the second test pin, and the height of the compensation block is smaller than the length of the second test pin.

On this basis, set up the compensation piece into the cuboid, and set up the width of compensation piece into the diameter that equals with the second test needle, can conveniently process, in production and processing process, can test needle and compensation piece integrated into one piece with the second. The height of the compensation block is set to be smaller than the length of the second test needle, so that a good avoidance space can be formed, and the situation that the space occupied by the probe structure greatly influences the layout of devices on the mainboard to be tested is avoided.

In a possible design manner of the first aspect, the connecting block is a cuboid, the width of the connecting block is equal to the diameter of the second testing pin, the height of the connecting block is equal to the height of the annular block, and the height of the annular block is smaller than the length of the second testing pin.

On this basis, set up the connecting block into the cuboid, the width of connecting block equals with the diameter of second test needle, and the height of connecting block equals with the height of annular piece, can conveniently process, highly sets up the length that is less than the second test needle with the height of annular piece, can form good space of dodging.

In one possible embodiment of the first aspect, the difference between the diameter of the needle and the diameter of the needle body is 0.1 to 0.2 mm. The design shows a specific arrangement example of the needle head and the needle body.

In a possible embodiment of the first aspect, the first test pin is an elastic pin and the second test pin is a rigid pin.

On this basis, be the elasticity needle through setting up first test needle, set up the second test needle and be the stereoplasm needle, be favorable to improving first test needle and second test needle and the mainboard that awaits measuring between contact stability, realize good electric conductivity.

In one possible embodiment of the first aspect, the first test pin is arranged parallel to the second test pin.

On this basis, parallel through setting up two test needles, be favorable to the production and processing, be favorable to realizing simultaneously two test needles and the mainboard that awaits measuring between be connected, and can not account for the mainboard that awaits measuring great space.

In a possible design of the first aspect, the top end of the medium is flush with the top end of the housing and the bottom end of the medium is flush with the bottom end of the housing. This design shows a specific arrangement example between the media and the housing.

In a second aspect, the present application provides a radio frequency test system, which includes a motherboard to be tested, a radio frequency connector, a radio frequency cable, a radio frequency tester, and a radio frequency test probe structure according to the first aspect and any possible design manner thereof, wherein a test end of the radio frequency test probe structure is electrically connected to the motherboard to be tested, and the radio frequency test probe structure is electrically connected to the radio frequency tester through the radio frequency connector and the radio frequency cable.

It is to be understood that the above radio frequency test system according to the second aspect may refer to the beneficial effects of the first aspect and any possible design thereof, and will not be described herein again.

Drawings

Fig. 1 is a partial schematic view illustrating a connection between a radio frequency test probe structure and a motherboard to be tested according to an embodiment of the present disclosure;

fig. 2 is a schematic partial structure diagram of the main board 6 to be tested shown in fig. 1;

fig. 3 is a schematic connection diagram of a radio frequency test system according to an embodiment of the present application;

FIG. 4 is a schematic diagram of a coaxial test pin configuration of the prior art;

FIG. 5 is a schematic diagram of an RF test probe structure according to an embodiment of the present application;

fig. 6 is a schematic 3D structure diagram of an rf test probe structure according to an embodiment of the present disclosure;

fig. 7 is a schematic diagram of a parallel two-wire rf transmission line model according to an embodiment of the present application;

FIG. 8 is a schematic diagram of another RF test probe configuration provided in an embodiment of the present application;

FIG. 9 is a block diagram illustrating an RF test probe structure according to an embodiment of the present application and S of the RF test probe structure shown in FIG. 4₁₁A graph comparing curves;

FIG. 10 is a schematic diagram of yet another RF test probe structure provided in an embodiment of the present application;

FIG. 11 is a schematic 3D structure diagram of another RF test probe structure according to an embodiment of the present application;

FIG. 12 is a schematic diagram of yet another RF test probe structure according to an embodiment of the present application;

FIG. 13 is a schematic 3D structure diagram of another RF test probe structure according to an embodiment of the present application;

FIG. 14 is a block diagram illustrating an embodiment of an RF test probe structure and an RF test probe structure S shown in FIG. 4₁₁The curves are compared with the graph.

In the figure: 1-a housing; 2-a medium; 3-a first test needle; 31-a needle core; 32-a needle head; 4-a second test needle; 5-radio frequency connector; 6-mainboard to be tested; 7-a first patch; 8-a second patch; 9-a compensation block; 10-connecting blocks; 11-a ring block; 12-impedance transforming device; 13-a directional coupler; 14-a radio frequency cable; 15-radio frequency tester; 16-fixed seat.

Detailed Description

The technical solution in the present application will be described below with reference to the accompanying drawings.

In the embodiments of the present application, words such as "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present concepts related in a concrete fashion.

In the embodiments of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

It is to be understood that the terminology used in the description of the various described examples herein is for the purpose of describing particular examples only and is not intended to be limiting. As used in the description of the various illustrated examples, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

In the present application, "at least one" means one or more, "a plurality" means two or more. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of the singular or plural items. For example, at least one (one) of a, b, or c, may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or multiple.

It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. The term "and/or" is an associative relationship that describes an associated object, meaning that three relationships may exist, e.g., A and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" in the present application generally indicates that the former and latter related objects are in an "or" relationship.

It is also to be understood that, in the present application, unless otherwise explicitly specified or limited, the term "coupled" is to be interpreted broadly, e.g., "coupled" may be a fixed connection, a sliding connection, a removable connection, an integral part, or the like; may be directly connected or indirectly connected through an intermediate.

It will be further understood that the terms "comprises," "comprising," "includes," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It should be appreciated that reference throughout this specification to "one embodiment," "another embodiment," "one possible design" means that a particular feature, structure, or characteristic described in connection with the embodiment or implementation is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment of the present application" or "in another embodiment of the present application" or "in one possible design" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

The term "rectangular parallelepiped" as used in the embodiments of the present application includes regular rectangular cuboids and quasi-rectangular cuboids, which include rectangular cuboids having chamfers or rectangular cuboids having a plurality of surfaces with partially extending solid bodies, such as "compensation blocks" and "connection blocks" as used in the embodiments of the present application.

In order to solve the problem that the characteristic impedance of a probe structure in a radio frequency test is high between the probe structure and a device to be tested in the test process in the prior art, the embodiment of the application provides a radio frequency test probe structure, which can improve the broadband matching of radio frequency signals in the radio frequency test process and reduce the avoidance space of the structure. The following describes embodiments of the present application with reference to fig. 1 to 14.

The embodiment of the application provides a radio frequency test probe structure, and the test probe structure is connected with a mainboard 6 to be tested and used for outputting a radio frequency detection signal from a transmission line coupling of a radio frequency connector 5, and the radio frequency detection signal is introduced into a corresponding radio frequency tester 15 to be tested through the coupling of the radio frequency test probe structure. The main board 6 to be tested in the embodiment of the present application may be a PCB board or a chip substrate or other single boards. In the embodiments of the present application, a PCB is taken as an example for explanation.

As shown in fig. 1, fig. 1 is a partial schematic view of a connection between a radio frequency test probe structure and a motherboard 6 to be tested, specifically, a schematic view of a test pin in the radio frequency test probe structure contacting a part of a PCB board, where the test pin in the embodiment of the present application includes a first test pin 3 and a second test pin 4. The main board 6 to be tested shown in fig. 1 is a PCB, and can be used for connecting with an antenna, the upper half part of the PCB is a clearance, the lower part of the PCB is provided with a patch and a radio frequency circuit, and the first test pin 3 and the second test pin 4 in the radio frequency test probe structure are correspondingly connected with the first patch 7 and the second patch 8 on the PCB respectively, so that the radio frequency test probe structure can be communicated with the radio frequency circuit of the PCB.

In the embodiment of the application, the first patch 7 and the second patch 8 are arranged on the PCB and then connected with the test needle in the radio frequency test probe structure, and the first patch 7 and the second patch 8 can be recycled after the radio frequency test is completed. As shown in fig. 2, fig. 2 is a schematic partial structure diagram of the main board 6 to be tested shown in fig. 1, and in this embodiment, the schematic partial structure diagram may be a schematic partial structure diagram of a PCB, the PCB may be connected to an antenna, and an upper half portion of the PCB may be used as a clearance area of the antenna, after the radio frequency test is completed, the first patch 7 and the second patch 8 may be electrically connected to a connection element in the clearance area, and the connection manner may be as shown in fig. 2, and may specifically be a soldering connection manner. The occupation space of first paster 7 and second paster 8 on the PCB board is little, and is with low costs, and two pasters all can regard as the required component to use on the PCB board moreover, and the radio frequency test probe structure that provides in the embodiment of this application can link to each other with the PCB board through first paster 7 and second paster 8, has reduced connection cost, has reduced the space occupation to the PCB board simultaneously.

The radio frequency test probe structure provided in the embodiment of the present application is specifically applied to a radio frequency test system, as shown in fig. 3, and fig. 3 is a schematic connection diagram of the radio frequency test system provided in the embodiment of the present application. The radio frequency test system comprises a mainboard 6 to be tested, a radio frequency test probe structure, a radio frequency connector 5, a radio frequency cable 14 and a radio frequency tester 15, wherein a test needle in the radio frequency test probe structure is in contact with and electrically connected with the mainboard 6 to be tested so as to realize the conduction of radio frequency signals, the radio frequency test probe structure is conducted with the radio frequency tester 15 through the radio frequency connector 5 and the radio frequency cable 14, the radio frequency signals are transmitted to the radio frequency tester 15, and the radio frequency tester 15 tests and analyzes the radio frequency signals.

In addition, a directional coupler 13 and the like can be added between the radio frequency test probe structure and the radio frequency tester 15, and the directional coupler 13 can be used for isolating, separating and mixing signals, so that indexes of the radio frequency signals such as directivity, standing wave ratio, coupling degree and insertion loss are improved. An impedance transforming device 12 may also be added between the radio frequency connector 5 and the directional coupler 13, and the impedance transforming device 12 may be used to adjust the impedance of the radio frequency test probe structure.

The following describes a structure of a radio frequency test probe and a radio frequency test apparatus in an embodiment of the present application.

In order to facilitate understanding of the technical solutions of the present application, before writing the embodiments of the present application, a brief description is made on a technical background related to the technical solutions of the present application, and a coaxial test pin structure in the prior art is described in the embodiments of the present application.

Referring to fig. 4, fig. 4 is a schematic diagram of a coaxial test pin structure in the prior art. As shown in fig. 4, the related art test pin structure includes a housing 1, a medium 2, a first test pin 3, and a second test pin 4. The medium 2 is arranged in the shell 1, the first test pin 3 is arranged in the medium 2, a signal end of the first test pin 3 is connected with a signal wire of the radio frequency connector 5, and the first test pin 3 is coaxial with the medium 2. The second test needle 4 is arranged on the shell 1, and the test end of the first test needle 3 and the test end of the second test needle 4 are positioned at the same end of the shell 1. In the technology, although the first test pin 3 and the medium 2 are arranged in a coaxial structure, the distance between the first test pin 3 and the second test pin 4 is still large, so that the impedance of the whole test pin structure is still high, and the impedance matching in the radio frequency test process is influenced.

In order to improve impedance matching of a radio frequency test probe structure in a radio frequency test process, the embodiment of the application provides a radio frequency test probe structure. The radio frequency test probe structure of the embodiment of the application is provided with an impedance adaptation structure between the first test pin and the second test pin in the radio frequency test probe structure shown in fig. 4, the impedance adaptation structure at least comprises a compensation structure or a coaxial structure, and the impedance adaptation structure is used for adjusting the impedance between the first test pin and the second test pin to enable the impedance to be close to or equal to the impedance (50 ohms) of a radio frequency transmission line. The impedance matching structure may be formed by a compensation structure, such as the compensation block 9 shown in fig. 5 or the needle head of the first test needle shown in fig. 12, or by a compensation structure or a coaxial structure, such as the annular block 11 shown in fig. 10, which is a coaxial structure, and the connection block 11 is mainly used for connecting the annular block 11 and the second test needle 4, but has the function of the compensation structure, so that the connection block 10 can also be regarded as the compensation structure in the impedance matching structure. Specific probe structures are described below.

Referring to fig. 5, fig. 5 is a schematic diagram of an rf test probe structure according to an embodiment of the present disclosure. As shown in fig. 5, the radio frequency test structure provided by the embodiment of the present application includes a housing 1, a medium 2, and test pins, wherein the test pins include a first test pin 3 and a second test pin 4. The medium 2 is arranged in the shell 1, the first test needle 3 is arranged in the medium 2, and the first test needle 3 is coaxial with the medium 2. The second test needle 4 is connected on the shell 1, is provided with compensation piece 9 between first test needle 3 and the second test needle 4, wherein, has the clearance between compensation piece 9 and the first test needle 3, and compensation piece 9 is connected with second test needle 4. The signal end of the first test needle 3 is connected with the signal interface of the radio frequency connector 5, and the test end of the first test needle 3 and the test end of the second test needle 4 are located at the same end of the shell 1.

In the embodiment of the application, the shell 1 is a supporting main body of the whole radio frequency test probe structure, can provide support for other parts of the radio frequency test probe structure, and can provide certain protection effect for other parts. The housing 1 may also serve as a connector to other instruments or structures during testing of the rf test probe structure. For example, when the connector is connected to the rf connector 5, the housing 1 may be connected to the ground as a direct connection between the motherboard 6 to be tested and the rf connector 5.

The material of the housing 1 is a conductive material, and in the embodiment of the present application, the housing 1 is made of a metal material, for example, copper or iron, and the like. It should be noted that the shape of the housing 1 is not limited in the embodiment of the present application, and the housing 1 may be a cylindrical, polygonal prism, rectangular parallelepiped, square, or other shape of the housing 1. In the embodiment of the present application, the radio frequency probe test structure is a coaxial test pin structure, where the coaxial test pin structure is a circle of metal conductor disposed on the periphery of the first test pin 3, the first test pin 3 is disposed in the center of the circle of metal conductor, and the medium 2 is disposed between the first test pin 3 and the metal conductor.

Referring to fig. 5, the casing 1 of fig. 5 is a metal casing 1, and the inside of the casing 1 has a hollow portion for mounting the medium 2 and the first test pin 3. Specifically, the hollow portion of shell 1 is a through-hole in this application, sets up first test needle 3 in this through-hole, and the clearance part between first test needle 3 and the shell 1 is provided with medium 2. In an actual production process, the medium 2 may be fitted into the through hole of the housing 1 first, and then the first test pin 3 may be mounted in the medium 2. Therefore, it is possible to form the medium 2 in a cylindrical shape and to form a through mounting hole for mounting the first test pin 3 at the center of the medium 2, the diameter of the mounting hole being the same as the diameter of the first test pin 3. Wherein the outer diameter of the medium 2 is the same as the diameter of the through hole, so that the whole medium 2 can fill up the through hole in the housing 1.

The first test needle 3 is arranged in the medium 2, the axis of the first test needle 3 coincides with the axis of the medium 2, the outer diameter of the medium 2 is the same as the diameter of the through hole, namely, the axis of the first test needle 3 coincides with the axis of the through hole in the shell 1, so that the first test needle 3, the medium 2 and the metal shell 1 form a coaxial structure, the first test needle 3, the medium 2 and the shell 1 are arranged to be the coaxial structure, and the characteristic impedance of the first test needle 3 in the test process can be adjusted. One end of the first test needle 3 close to the radio frequency connector 5 is a signal end, and the signal end of the first test needle 3 is used for being connected with a signal wire of the radio frequency connector 5; the other end is a testing end and is used for contacting with the mainboard 6 to be tested and transmitting the radio frequency signal to the mainboard 6 to be tested.

In the embodiment of the present application, two test pins are provided, wherein the first test pin 3 is mainly used for transmitting radio frequency signals, and the second test pin 4 is mainly used for performing ground connection. The second test needle 4 can be fixed to be set up on the shell 1, and the shell 1 is connected with the earth connection in the radio frequency joint 5, and in the test process, the second test needle 4 contacts with the second paster 8 on the mainboard 6 that awaits measuring. The second testing pin 4 may be connected to the housing 1 by welding or screwing, and the second testing pin 4 and the housing 1 may also be integrally formed, for example, the second testing pin 4 may be directly milled on the housing 1.

The end that second test needle 4 and mainboard 6 that awaits measuring contacted is its test end, and the test end of first test needle 3 sets up the same end at shell 1 with the test end of second test needle 4. The test end of the first test pin 3 and the test end of the second test pin 4 are convenient to contact with the mainboard 6 to be tested simultaneously by the arrangement, so that electric connection is realized. The same end of the housing 1 in the embodiment of the present application refers to an end of the housing 1 close to the motherboard 6 to be tested.

In the embodiment of the present application, a compensation block 9 is further disposed between the first testing pin 3 and the second testing pin 4, the compensation block 9 is made of a metal material, and the compensation block 9 is used for reducing the distance between the first testing pin 3 and the second testing pin 4. The compensation block 9 is connected with the second test needle 4 to realize grounding, a certain gap is kept between the compensation block 9 and the first test needle 3, and the compensation block 9 is prevented from being in direct contact with the first test needle 3 to cause short circuit.

It should be noted that the shape of the compensation block 9 is not particularly limited in the embodiment of the present application, but in actual processing, the shape of the compensation block 9 may be set to the shape shown in fig. 6 for convenience of processing. Fig. 6 is a schematic 3D structure diagram of a radio frequency test probe structure according to an embodiment of the present application, and as shown in fig. 6, a main body of a compensation block 9 is a cuboid, and the compensation block 9 is adaptively matched with a connection portion of a second test probe 4. The width of the compensation block 9 can be set to be the same as the diameter of the second test pin 4, the height of the compensation block 9 can be set to be slightly lower than the length of the second test pin 4 leaking out of the housing 1, the length of the compensation block 9 can be set to be slightly smaller than the diameter of the second test pin 4, or set to be slightly larger than the diameter of the second test pin 4, but it is required to ensure that the compensation block 9 has a certain clearance with the first test pin 3.

For example, the diameter of the first test pin 3 and the second test pin 4 is generally 0.3 to 0.5mm, the length of the first test pin 3 is 3 to 5mm, the diameter of the first test pin 3 and the second test pin 4 is 0.3mm in the embodiment of the present application, and the length of the first test pin 3 is 4 mm. The center-to-center distance between the first test needle 3 and the second test needle 4 is 0.8mm, and the length of the first test needle 3 and the second test needle 4 leaking out of the housing 1 is 0.6 mm. The height of the compensation block 9 may be set to 0.5mm, the width of the compensation block 9 may be set to 0.3mm, which is the same as the diameter of the second test pin 4, and the length of the compensation block 9 may be set to 0.2mm, or to 0.4 mm.

In the embodiment of the present application, the compensation block 9 is connected to the second test pin 4 to reduce the distance between the first test pin 3 and the second test pin 4, so that the impedance matching of the probe structure can be improved. The principle of adding the compensation block 9 to improve the impedance matching can be briefly explained by the following model.

Referring to fig. 7, fig. 7 is a schematic diagram of a parallel two-wire rf transmission line model according to an embodiment of the present application. As shown in fig. 7, the transmission lines shown in the figure are two transmission lines with the same straight line size, the two transmission lines are arranged in parallel, and the medium 2 between the two transmission lines is air. When the compensation block 9 is not provided, the radio frequency transmission between the first test pin 3 and the second test pin 4 can be simplified to the above-described model. In the model shown in FIG. 7, the characteristic impedance of two cylindrical conductors in air

Distributed capacitance

Characteristic impedance

When the compensation block 9 is not provided, the distance D between the first test pin 3 and the second test pin 4 is 0.8mm, and the radii R of the first test pin 3 and the second test pin 4 are both 0.15mm, and the calculation result is substituted into the above formula to calculate the Z0 to 175 Ω. As shown in fig. 5, by providing a compensation block 9 having a length of 0.2mm on the second test pin 4, correspondingly, the distance D between the first test pin 3 and the second test pin 4 is decreased by 0.2mm to 0.6mm, and by substituting it into the above formula, it can be seen that the distributed capacitance between the probe structures is increased, Z0 is decreased, D is 0.6mm, and by substituting it into the above formula, Z0 of the probe structure is calculated to be 131 Ω.

Fig. 8 is a schematic diagram of another rf test probe structure provided in this embodiment of the present application, and as shown in fig. 8, by further increasing the length of the compensation block 9 to 0.4mm, the distance D between the first test pin 3 and the second test pin 4 is 0.4mm, and the Z0 substituted into the above formula to calculate the probe structure to be 61 Ω. In the existing standard, the impedance of the coaxial line and the impedance of the rf line are both 50 Ω, and it can be seen from the above calculation results that the impedance matching of the probe structure can be improved by increasing the length of the compensation block 9, i.e., decreasing the distance between the first test pin 3 and the second test pin 4.

It should be noted that, the compensation block 9 shown in the embodiment of the present application is added between the first test pin 3 and the second test pin 4, and the impedance infantry of the probe structure after adding the compensation block 9 can directly calculate according to the corresponding formula in the model shown in fig. 7, in the embodiment of the present application, the formula is directly used to calculate the impedance of the probe structure after adding the compensation block 9, and the calculation result is not the true impedance value of the probe structure after adding the compensation block 9. In the embodiment of the present application, the above formula is directly used for calculating the result, which is only for convenience of explaining the variation trend of the impedance of the probe structure after the compensation block 9 is added, that is, the length of the compensation block 9 between the first test pin 3 and the second test pin 4 is increased to reduce the distance between the first test pin 3 and the second test pin 4, so that the impedance of the probe structure can be effectively reduced, and the impedance of the probe structure is closer to 50 Ω in the design standard, thereby improving the matching.

In order to analyze the matching improvement effect of the probe structure after the compensation block 9 is added, the embodiment of the application compares the S11 performances of the radio frequency test probe structure before and after the compensation block 9 is added. Referring to fig. 9, fig. 9 is a diagram illustrating an rf test probe structure according to an embodiment of the present application and S of the rf test probe structure shown in fig. 4₁₁The curves are compared with the graph. Referring to FIG. 9, a curve S1 shows the S of an RF test probe structure according to an embodiment of the present invention₁₁Curve, curve S2 shows the S of the RF test probe structure of FIG. 4₁₁Curve line. As can be seen from the curves S1 and S2, the return loss of the RF test probe structure provided by the embodiment of the present application is lower than that of the RF test probe structure shown in FIG. 4 under the same RF frequency, which indicates that the RF test probe structure after adding the compensation block 9 is more than that without adding the compensation block 9The bandwidth matching is better.

In the embodiment of the present application, when the first test pin 3 and the second test pin 4 are disposed, the first test pin 3 and the second test pin 4 may be disposed in parallel, and the axis of the first test pin 3 and the axis of the second test pin 4 may be both parallel to the center line of the housing 1. Namely, the probe structure is kept to be vertically placed, so that the first test needle 3 and the second test needle 4 can be vertically contacted with the mainboard 6 to be tested which is horizontally placed. In the process of preventing contact, the first test pin 3 and the second test pin 4 are damaged due to overlarge contact force.

Specifically, the first test pin 3 and the second test pin 4 can be kept perpendicular to the main board 6 to be tested in the test process. Therefore, the distance between the first test needle 3 and the second test needle 4 can be controlled, and too much space on the mainboard 6 to be tested cannot be occupied. Set up first test needle 3 and second test needle 4 to keep the vertical state with the mainboard 6 that awaits measuring for first test needle 3 and second test needle 4 can not lead to the test needle to warp or break because of the atress is too big at the mainboard 6 contact in-process that awaits measuring, can realize contacting with the mainboard 6 that awaits measuring with the shortest nook closing member 31 moreover.

When setting up first test needle 3 and second test needle 4, because first test needle 3 need link to each other with radio frequency joint 5, and first test needle 3 need form coaxial test needle structure with medium 2 and shell 1, consequently first test needle 3 sets up inside shell 1, fixes first test needle 3 through setting up medium 2 between first test needle 3 and shell 1. And the second test pin 4 mainly plays a role of grounding and can be directly and fixedly connected to the shell 1.

In the radio frequency test process, the length of the first test pin 3 and the second test pin 4 exposed out of the housing 1 affects the distance between the housing 1 and the mainboard 6 to be tested. Therefore, when the first test needle 3 and the second test needle 4 are arranged, the first test needle 3 is generally extended out of the housing 1 and/or the medium 2 by a length which is a first preset length; the second test needle 4 will also typically be extended out of the housing 1 by a length which is a second predetermined length. The first preset length and the second preset length can be set to be equal, or the first preset length can be set to be slightly larger than the second preset length. The values of the first preset length and the second preset length generally need to be larger than the heights of the devices of the first patch 7 and the second patch 8 on the mainboard 6 to be tested, so that a sufficient avoiding space is formed, a reserved space does not need to be arranged on the mainboard 6 to be tested, the first patch 7 and the second patch 8 on the mainboard 6 to be tested can be provided with corresponding devices according to needs, and the situation that the shell 1 can interfere with the devices does not need to be worried.

In the embodiment of the present application, both ends of the medium 2 are flush with both ends of the housing 1, as shown in fig. 5, the top end of the medium 2 is flush with the top end of the housing 1, and the bottom end of the medium 2 is flush with the bottom end of the housing 1. In addition, the signal end of first test needle 3 also keeps the parallel and level with the top of medium 2 and the top of shell 1, set up convenient processing like this, it connects 5 with the radio frequency to be convenient to be connected simultaneously, bottom and the bottom parallel and level of shell 1 with the bottom of medium 2, can make the first test needle 3 that is located in shell 1 all wrap up by medium 2, be favorable to reducing the impedance, medium 2 has been avoided simultaneously and has stretched out shell 1, cause the interference to the device on the mainboard 6 that awaits measuring in the test process.

In the embodiment of the present application, when the first test pin 3 and the second test pin 4 are provided, both the first test pin 3 and the second test pin 4 may be provided as elastic pins. The first testing needle 3 is an elastic needle, which means that after the testing end of the first testing needle 3 is contacted with the first patch 7 on the mainboard 6 to be tested, and after the first testing needle 3 is subjected to a force in the axial direction, the first preset length can be changed along with the force. Similarly, the second testing pin 4 is an elastic pin, which means that after the testing end of the second testing pin 4 contacts the second patch 8 on the motherboard 6 to be tested, and when the second testing pin 4 receives a force in the axial direction, the second preset length can be changed along with the force. For example, when the housing 1 moves towards the main board 6 to be tested, after the testing end of the first testing pin 3 contacts with the first patch 7 on the main board 6 to be tested and the testing end of the second testing pin 4 contacts with the second patch 8 on the main board 6 to be tested, the housing 1 continues to move towards the direction close to the main board 6 to be tested, and then the first preset length and the second preset length both shorten along with the continued movement of the housing 1. After the test end of the first test pin 3 and the test end of the second test pin 4 are respectively contacted with the first patch 7 and the second patch 8 on the mainboard 6 to be tested, and the first test pin 3 and the second test pin 4 are both in a compressed state, if the housing 1 moves towards the direction far away from the mainboard 6 to be tested, the first test pin 3 and the second test pin 4 are lengthened along with the movement of the housing 1 due to the elasticity.

Further, the first test pin 3 may be an elastic pin, and the second test pin 4 may be a hard pin. The second test needle 4 is a hard needle, which means that: after the second test needle 4 is contacted with the second patch 8 on the mainboard 6 to be tested, the second preset length of the second test needle 4 can not be changed due to the stress change of the second test needle 4. That is, after the second testing pin 4 contacts the second patch 8 on the main board 6 to be tested, if the housing 1 continues to move toward the direction close to the main board 6 to be tested, when the stress of the second testing pin 4 is too large, the second testing pin 4 may be damaged or the second patch 8 on the main board 6 to be tested and the main board 6 to be tested may be damaged.

It should be noted that, when the first testing pin 3 and the second testing pin 4 are both in a natural state, the first preset length may be set to be greater than the second preset length, or the first preset length may be set to be equal to the second preset length. The natural state refers to a state when the first test pin 3 and the second test pin 4 are not subjected to external force, and when the radio frequency probe test structure is not in a test state, namely, a suspended state when the first test pin 3 and the second test pin 4 are not in contact with the mainboard 6 to be tested, the state at this time is a natural state.

In general, when the first test pin 3 is a pogo pin and the second test pin 4 is a hard pin, the first preset length may be set to be greater than the second preset length. For example, the first preset length is set to 0.6mm, and the second preset length is set to 0.5 mm. In the test process, when the shell 1 is close to the mainboard 6 that awaits measuring gradually, because first length of predetermineeing is greater than the second length of predetermineeing, first test needle 3 can be prior to second test needle 4 and the mainboard 6 contact that awaits measuring, because first test needle 3 is the pogo pin, after first test needle 3 and the mainboard 6 that awaits measuring contact, shell 1 continues to be close to the mainboard 6 that awaits measuring, and first test needle 3 can be compressed, until second test needle 4 and the mainboard 6 contact that awaits measuring. Because the second test needle 4 is the stereoplasm needle, consequently after second test needle 4 and the mainboard 6 that awaits measuring contact, shell 1 stop motion, first test needle 3 and second test needle 4 all keep good contact with the mainboard 6 that awaits measuring this moment, because first test needle 3 and second test needle 4 parallel arrangement, first length of predetermineeing at this moment equals with second length of predetermineeing.

When the first test pin 3 and the second test pin 4 are both pogo pins, the first preset length may be set to be equal to the second preset length. For example, the first preset length and the second preset length are both set to be 0.6 mm. In the test process, when the shell 1 is gradually close to the mainboard 6 to be tested, because first preset length equals second preset length, consequently first test needle 3 and second test needle 4 can contact with the mainboard 6 to be tested simultaneously, and because first test needle 3 and second test needle 4 are the pogo pin, after first test needle 3 and second test needle 4 contact with the mainboard 6 to be tested, shell 1 continues to be close to the mainboard 6 to be tested, first test needle 3 and second test needle 4 can be compressed because of having elasticity, the condition that first test needle 3 and second test needle 4 are impaired can not appear.

In order to improve the matching impedance of the radio frequency test probe structure, the embodiment of the application further provides a radio frequency test probe structure. Referring to fig. 10, fig. 10 is a schematic diagram of another structure of an rf test probe according to an embodiment of the present application. As shown in fig. 10, the radio frequency test structure provided by the embodiment of the present application includes a housing 1, a medium 2, and test pins, wherein the test pins include a first test pin 3 and a second test pin 4. The medium 2 is arranged in the shell 1, the first test needle 3 is arranged in the medium 2, and the first test needle 3 is coaxial with the medium 2. The second test needle 4 is connected on the shell 1, and the syringe needle 32 outside of first test needle 3 is provided with annular piece 11, and annular piece 11 forms coaxial structure with the syringe needle 32 of first test needle 3, is connected through connecting block 10 between annular piece 11 and the second test needle 4. The signal end of the first test needle 3 is connected with the signal interface of the radio frequency connector 5, and the test end of the first test needle 3 and the test end of the second test needle 4 are located at the same end of the shell 1.

The needle head 32 of the first test needle 3 refers to a portion of the first test needle 3 exposed from the housing 1 or a portion of the first test needle 3 exposed from the medium 2, and in general, the bottom end of the medium 2 and the bottom end of the housing 1 are flush with each other, so that the portion of the first test needle 3 exposed from the housing 1 and the portion of the first test needle 3 exposed from the medium 2 are the same. In the embodiment of the present application, the annular block 11 refers to a structure having a circular ring shape, and the annular block 11 is made of a metal structure so as to form a coaxial structure with the needle head 32 of the first test needle 3, and the impedance of the coaxial structure is 50 Ω by adjusting the diameter of the annular block 11. Wherein, adopt the air as medium 2 between annular piece 11 and the syringe needle 32 of first test needle 3, compare in medium 2 or other plastic material class medium 2 that adopt the PE material, adopt air medium 2 can reduce the diameter size of annular piece 11 to reserve more dodges the space for radio frequency test time. The diameter of the ring block 11 refers to the inner diameter of the ring block 11.

The annular block 11 is connected with the second test needle 4 through the connecting block 10, wherein the connecting block 10 is made of a conductive material, metal can be generally adopted as the connecting block 10, and the second test needle 4 can be conducted with the annular block 11 through the connecting block 10 made of the conductive material, so that the annular block 11 can be grounded in the test process.

In the embodiment of the application, the metal annular block 11 is arranged outside the needle head 32 of the first test needle 3, and the annular block 11 is communicated with the second test needle 4 through the connecting block 10 made of a conductive material, so that the needle head 32 of the first test needle 3 and the annular block 11 form a coaxial structure, and the impedance of the coaxial structure can be accurately adjusted to be 50 Ω by controlling the diameter of the annular block 11, so that good signal matching is realized. By using air as the medium 2 in the coaxial structure, the diameter of the annular block 11 can be reduced to achieve the effect of reducing the avoidance space.

In the embodiment of the present application, the shapes of the ring block 11 and the connection block 10 may be set with reference to fig. 11, and fig. 11 is a schematic 3D structure diagram of another structure of the rf test probe according to the embodiment of the present application. As shown in fig. 11, the ring block 11 and the housing 1 may be an integrally formed structure, wherein a ring-shaped connecting structure is provided between the ring block 11 and the housing 1, and the connecting structure forms a step between the housing 1 and the ring block 11. The diameter of the connecting structure can be set to be the same as that of the medium 2, and the thickness of the connecting structure can be set according to actual needs, so that stable connection between the annular block 11 and the shell 1 can be realized. The length of the connection block 10 may be set to a minimum distance between the second test pin 4 and the ring block 11, the width of the ring block 11 may be set to the same size as the diameter of the second test pin 4, and the height of the connection block 10 may be set to the same height as the ring block 11. For example, if the length of the needle head 32 of the first test needle 3 is 0.6mm and the length of the needle head 32 of the second test needle 4 is 0.6mm, the height of the ring-shaped block 11 and the connecting block 10 may be set to 0.5 mm. The ring block 11 and the connecting block 10 are arranged as described above, mainly for the sake of manufacturing convenience.

In order to improve the matching impedance of the radio frequency test probe structure, the embodiment of the application further provides a radio frequency test probe structure. Referring to fig. 12, fig. 12 is a schematic diagram of another structure of an rf test probe according to an embodiment of the present disclosure. As shown in fig. 12, the radio frequency test structure provided in the embodiment of the present application includes a housing 1, a medium 2, and test pins, wherein the test pins include a first test pin 3 and a second test pin 4. Medium 2 sets up in shell 1, and first test needle 3 sets up in medium 2, and first test needle 3 is coaxial with medium 2, and second test needle 4 is connected on shell 1. The first test needle 3 includes a needle head 32 and a core 31, wherein the diameter of the needle head 32 is larger than that of the core 31. The signal end of the first test needle 3 is connected with the signal interface of the radio frequency connector 5, and the test end of the first test needle 3 and the test end of the second test needle 4 are located at the same end of the shell 1.

In the embodiment of the present application, the needle head 32 of the first testing needle 3 also refers to the portion where the first testing needle 3 leaks the medium 2 and the housing 1, and the diameter of the needle head 32 of the first testing needle 3 is set to be larger, so that the distance between the first testing needles 3 can be reduced, thereby being beneficial to improving the impedance of the radio frequency testing probe structure. Specifically, referring to the model shown in fig. 7, when the diameter of the probe head 32 of the first test probe 3 is set to be larger, although the center-to-center distance between the first test probe 3 and the second test probe 4 is not changed, the radius R of the first test probe 3 is increased, so that the Z0 of the probe structure is correspondingly reduced, the impedance of the probe structure is closer to 50 Ω, and the impedance matching of the probe structure during the rf test is improved.

It should be noted that, when the diameter of the needle head 32 of the first test needle 3 is increased, the height of the increased portion may be slightly smaller than the overall length of the needle head 32, specifically refer to fig. 13, where fig. 13 is a schematic 3D structure diagram of another structure of the rf test probe provided in this embodiment of the present application. As shown in fig. 13, the size of the portion of the needle 32 contacting the first patch 7 on the main board 6 to be tested may be set to be the same as the diameter of the core 31. The diameter of the core 31 of the first test needle 3 may be set to 0.2-0.4mm, and the diameter of the tip 32 may be set to 0.1-0.2mm larger than the diameter of the core 31. For example, if the diameter of the core 31 of the first test needle 3 is set to 0.2mm and the diameter of the needle 32 is set to 0.2mm larger than the diameter of the core 31, the diameter of the needle 32 is 0.4 mm. The length of the needle head 32 is 0.6mm, wherein the height of the thickened part of the needle head 32 can be set to 0.5mm, and the diameter of a section of the tail end of the needle head 32, which is 0.1mm long, is set to 0.2mm, so that the arrangement is convenient for the first test needle 3 to contact with the first patch 7 on the mainboard 6 to be tested.

In order to analyze the matching improvement effect of the probe structure after the needle head 32 of the first test needle 3 is thickened, the embodiments of the present application compare the S11 performances of the rf test probe structure before and after the needle head 32 is thickened. Referring to fig. 14, fig. 14 is a diagram illustrating an rf test probe structure according to another embodiment of the present application and S of the rf test probe structure shown in fig. 4₁₁The curves are compared with the graph. Referring to FIG. 14, a curve S3 shows an S of yet another RF test probe structure according to an embodiment of the present invention₁₁Curve, curve S4 shows the S of the RF test probe structure of FIG. 4₁₁Curve line. As can be seen from the curves S3 and S4, the return loss of the rf test probe structure provided by the embodiment of the present application is lower than that of the rf test probe structure shown in fig. 4 at the same rf frequency, which indicates that the rf test probe structure after adding the compensation block 9 has better bandwidth matching than the rf test probe structure without adding the compensation block 9.

Based on the above concept of the present application, in an embodiment of the present application, a radio frequency testing apparatus is further provided. As shown in fig. 5, 10, and 12, the radio frequency testing apparatus includes a fixing base 16 and a radio frequency testing probe structure provided in any one of the above embodiments, a housing 1 of the radio frequency testing probe structure is fixedly connected to the fixing base 16, the fixing base 16 is provided with a plurality of connecting holes, and the radio frequency testing apparatus can be fixed or connected by matching with bolts or screws.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application.

The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, the scope of protection of the present application includes the preferred embodiments and all variations and modifications that fall within the scope of the embodiments of the present application.

The above detailed description is given to a radio frequency test probe structure, a radio frequency test device, and a radio frequency test system provided in the present application, and a specific example is applied in the present application to explain the principle and the implementation manner of the present application, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

The above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A radio frequency test probe structure for coupling an rf probing signal out of a transmission line of a radio frequency connector through the radio frequency test probe structure into a circuit-under-test, the radio frequency test probe structure comprising: the test device comprises a shell, a medium, a first test needle and a second test needle;

the medium is arranged in the shell, the shell is made of conductive materials, the first test needle is arranged in the medium, a signal end of the first test needle is connected with a signal wire of the radio frequency connector, and the first test needle is coaxial with the medium;

the second testing needle is arranged on the shell, and the testing end of the first testing needle and the testing end of the second testing needle are positioned at the same end of the shell;

2. The probe structure of claim 1, wherein the impedance matching structure comprises a compensation structure, the compensation structure is a compensation block formed by a conductive material, the compensation block is disposed on the first testing pin and the second testing pin, one end of the compensation block is connected to the second testing pin, and a gap is maintained between the other end of the compensation block and the first testing pin.

3. The probe structure of claim 1, wherein the impedance adapting structure comprises a compensation structure and a coaxial structure, the compensation structure is a connection block formed by a conductive material, the coaxial structure is an annular block formed by a conductive material, the annular block is a hollow annular structure, the annular block is connected with the second test pin through the connection block, the annular block is sleeved outside the first test pin, and the annular block is coaxial with the first test pin.

4. The probe structure of claim 1, wherein the first test needle comprises a needle head and a needle body, the impedance adapting structure comprises a compensating structure, the compensating structure is the needle head, and the diameter of the needle head is larger than that of the needle body;

the needle body is the first test needle positioned in the medium, and the needle head is the first test needle positioned outside the medium.

5. The probe structure of claim 2, wherein the compensation block is a rectangular parallelepiped, the width of the compensation block is equal to the diameter of the second test pin, and the height of the compensation block is smaller than the length of the second test pin.

6. The probe structure of claim 3, wherein the connecting block is a rectangular parallelepiped, the width of the connecting block is equal to the diameter of the second testing pin, the height of the connecting block is equal to the height of the annular block, and the height of the annular block is smaller than the length of the second testing pin.

7. The probe structure according to claim 4, wherein the difference between the diameter of the needle head and the diameter of the needle body is 0.1 to 0.2 mm.

8. The probe structure according to any one of claims 1 to 7, wherein the first test needle is an elastic needle and the second test needle is a rigid needle.

9. The probe structure according to any one of claims 1 to 8, wherein the first test pin is disposed in parallel with the second test pin.

10. The probe structure of claim 9, wherein the top end of the medium is flush with the top end of the housing and the bottom end of the medium is flush with the bottom end of the housing.

11. A radio frequency test system, comprising a main board to be tested, a radio frequency connector, a radio frequency cable, a radio frequency tester, and the radio frequency test probe structure of any one of claims 1 to 10, wherein a test end of the radio frequency test probe structure is electrically connected to the main board to be tested, and the radio frequency test probe structure is electrically connected to the radio frequency tester through the radio frequency connector and the radio frequency cable.