CN114200890A - Laser processing device and method - Google Patents
Laser processing device and method Download PDFInfo
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- CN114200890A CN114200890A CN202111295034.4A CN202111295034A CN114200890A CN 114200890 A CN114200890 A CN 114200890A CN 202111295034 A CN202111295034 A CN 202111295034A CN 114200890 A CN114200890 A CN 114200890A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/4097—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using design data to control NC machines, e.g. CAD/CAM
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32153—Exchange data between user, cad, caq, nc, capp
Abstract
The invention discloses a laser processing device, which comprises a mechanical processing platform, a feedback module, a laser processing module, a path simulation module and a numerical control coding module, wherein the feedback module is used for controlling the laser processing platform to rotate; the path simulation module is used for simulating a machining path according to an original workpiece model and a target workpiece model; the numerical control coding module is used for converting the simulated machining path into a numerical control coding program; the feedback module is used for calculating the error between the processed workpiece and the target workpiece, and when the error is greater than or equal to an error threshold, the path simulation module re-determines the simulated processing path until the error is less than the error threshold. According to the laser processing device and method provided by the invention, the linkage operation of the laser processing module and the mechanical processing platform is realized through programming, and the flexible conversion of the laser spot on the space position, the time and the energy in the processing process is realized by combining the path simulation module, the online observation module and the feedback module.
Description
Technical Field
The invention belongs to the field of laser processing, and particularly relates to a laser processing device and method.
Background
The laser processing is a novel processing method for removing materials based on the photo-thermal effect, has the advantages of no contact, high energy, flexibility in processing, no material selectivity and the like for traditional difficult-to-process materials, and gradually becomes an important processing means for the difficult-to-process materials. Laser processing is to irradiate the energy of a light beam to the surface of a material after refraction and focusing, and remove, melt or change the surface performance of an object through the focused high energy. The focused laser usually presents Gaussian distribution light spots, and is similar to a semi-spherical shape of the action surface of the material, so that a circular pit is formed on the processing surface. The relative motion of the light spots and the material is formed by changing the moving light spots through the internal light path or by the mechanical motion of the processing material, so that the pits of the single light spot continuously form lines or surfaces to process the material.
The analogy is that by using the traditional mechanical processing, the light spot in the laser processing is the cutter in the mechanical processing; the ablation process is formed by the contact of the laser spot with the material. Compared with mechanical processing, the cutter for laser processing can be smaller, and finer processing can be realized at the micron level; higher energy can be focused to form a harder cutter to process objects which are difficult to cut by the traditional cutter, and meanwhile, the problem that consumables need to be replaced, such as cutter abrasion, is avoided. A laser is a great advantage as a tool.
However, laser machining also has significant limitations: in machining, relative movement of the tool and the workpiece can be realized by programming, and the change of machining parameters such as calling of various tools and machining speed can be completed in the same program, so that all machining steps of parts can be completed by one program in machining. The size of a laser spot in laser processing is determined by the selection of a focusing lens and cannot be changed in real time, the movement path of the laser spot is changed by changing an internal device of an optical system, and the focusing of the laser spot can only be vertical to the focusing lens to form two-dimensional processing; if a curved surface or an angled surface needs to be machined, the machining needs to be carried out through the matching of a mechanical shaft. The existing laser processing equipment basically does not realize the flexible linkage processing of a mechanical system and an optical system. Different from the removal of a machining cutter, the removal rate of the laser parameters with the same energy to the material is different, so that the actual removal amount of the material by the laser cannot be completely consistent with the setting of the laser spot size path parameters, and each part of each material needs to be subjected to a large number of process tests to determine the removal amount of the laser in the actual machining. In summary, to use laser as a knife, the laser needs to have the flexibility of the knife, and can process any shape of any material flexibly and accurately.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the problems in the related art. Therefore, the invention aims to provide a laser processing device and a laser processing method, which realize the linkage operation of a laser processing module and a mechanical processing platform through programming, and simultaneously realize the flexible conversion of laser spots on spatial position, time and energy in the processing process by combining a path simulation module, an online observation module and a feedback module.
In order to achieve the purpose, the invention provides the following technical scheme: a laser processing method comprising the steps of:
s01: loading a workpiece on a machining platform, acquiring an original workpiece model and a target workpiece model and transmitting the original workpiece model and the target workpiece model to a path simulation module;
s02: the path simulation module obtains a simulated processing path through calculation simulation and transmits the simulated processing path to the numerical control coding module;
s03: the numerical control coding module converts the simulated processing path into a numerical control coding program and transmits the numerical control coding program to the laser processing module and the mechanical processing platform; the numerical control coding program is used for simultaneously controlling the operation of the laser processing module and the operation of the mechanical processing platform;
s04: the laser processing module and the mechanical processing platform operate in a linkage manner according to the numerical control coding program to process a workpiece;
s05: the feedback module calculates the error between the processed workpiece model and the target workpiece model;
s06: if the error is smaller than the error threshold value, the simulated machining path and the numerical control coding program are reserved; if the error is larger than or equal to the error threshold, the path simulation module re-determines the simulated machining path and returns to the step S03;
s07: and (5) performing laser processing on the workpieces in the same batch by adopting the numerical control coding program reserved in the step S06.
Further, a database is stored in the path simulation module in the step S02, where the database includes the removal rates and processing parameters of different laser beams for different workpiece materials; and the path simulation module simulates according to the original workpiece model, the target workpiece model and the database to obtain a simulated machining path.
Further, in step S05, scanning the processed workpiece by using an online observation module to obtain a processed workpiece model; and transmitting the processed workpiece model to a feedback model, wherein the feedback model calculates the error between the processed workpiece model and the target workpiece model.
Further, in step S06, if the error is greater than or equal to the error threshold, the feedback module transmits the processed workpiece model to the path simulation module, and the path simulation module performs simulation according to the original workpiece model, the processed workpiece model, the target workpiece model, and the database, and re-determines the simulated processing path.
Further, the operation of the laser processing module in step S03 includes turning on and off the laser light source and changing parameters of the laser processing module, wherein the parameters of the laser processing module include at least one of laser power, focal length variation, scanning speed, pulse number and laser frequency.
Furthermore, the machining platform is a multi-axis linkage machining platform.
Further, the operation of the machining platform in step S03 includes axial movement of the machining platform in various directions.
A laser processing device comprises a mechanical processing platform, a feedback module, a laser processing module, a path simulation module and a numerical control coding module;
the path simulation module is used for simulating a machining path according to an original workpiece model and a target workpiece model, and the output end of the path simulation module is connected with the input end of the numerical control coding module;
the numerical control coding module is used for converting the simulated processing path into a numerical control coding program, and the output end of the numerical control coding module is connected with the laser processing module and the mechanical processing platform; the numerical control coding program is used for controlling parameters of the laser processing module and parameters of the mechanical processing platform;
the feedback module is used for calculating the error between the processed workpiece and the target workpiece, and when the error is greater than or equal to an error threshold, the path simulation module re-determines the simulated processing path until the error is less than the error threshold.
Furthermore, the laser processing module comprises a laser, a light path transmission unit, a beam expanding unit, a galvanometer unit, a focusing mirror unit and a laser spot; the laser output end is connected the input of light path transmission unit, the output of light path transmission unit is connected the input of expanding the beam unit, the output of expanding the beam unit is connected the input of mirror unit shakes, the output of mirror unit shakes is connected the input of focus mirror unit, the output of focus mirror unit is connected the laser facula.
Further, the galvanometer unit comprises M galvanometers, and the focusing mirror unit comprises M focusing mirrors; m is an integer greater than 0.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
the invention provides a laser processing device and a laser processing method, wherein laser is used as a cutter, and a numerical control coding program capable of simultaneously controlling the operation of a laser processing module and the operation of a mechanical processing platform is obtained through the simulation and coding of a numerical control coding module, so that the linkage operation of the mechanical processing platform and the laser processing module is realized, and the flexible conversion of laser spots on spatial position, time and energy in the processing process is further realized.
Meanwhile, the path simulation module is provided with a database containing the removal rates and the processing parameters of different lasers for different workpiece materials, so that the optimal simulation of the processing path can be realized; and the high-efficiency linkage operation of the mechanical processing platform and the laser processing module is realized by combining the real-time monitoring and feedback of the online observation module and the feedback module.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
In the drawings:
FIG. 1 is a flow chart of a laser processing method according to the present invention;
FIG. 2 is a schematic view of an apparatus for laser processing according to the present invention;
FIG. 3 is a schematic view of a model of a target workpiece for laser processing in example 1;
FIG. 4 is a schematic view illustrating a concave profile of a workpiece in accordance with example 1;
FIG. 5 is a schematic view of the machining of the intrados contour of the workpiece in example 1;
FIG. 6 is a schematic view showing one of the processing of the planar small grooves in the workpiece according to example 1;
FIG. 7 is another schematic view of the machining of a planar small groove in a workpiece according to example 1;
FIG. 8 is a schematic view of an original workpiece model and a target workpiece model in example 2;
FIG. 9 is a schematic view of the initial processing in example 2;
fig. 10 is a schematic view of the blade 1 in example 2 when machined;
FIG. 11 is a schematic view of the workpiece of embodiment 2 rotated to the blade 2;
fig. 12 is a schematic view of the blade 2 in example 2 when machined;
FIG. 13 is a schematic view of a model of a target workpiece in example 2;
reference numerals: 11-laser spot; 12-a machining platform; 13-a workpiece; 14-concave profile; 15-cambered surface profile; 16-planar mini-grooves.
Detailed Description
For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the following description, it is to be understood that the orientations and positional relationships indicated by "front", "rear", "upper", "lower", "left", "right", "longitudinal", "lateral", "vertical", "horizontal", "top", "bottom", "inner", "outer", "leading", "trailing", and the like are configured and operated in specific orientations based on the orientations and positional relationships shown in the drawings, and are only for convenience of describing the present invention, and do not indicate that the device or element referred to must have a specific orientation, and thus, are not to be construed as limiting the present invention.
It is also noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," "disposed," and the like are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or intervening elements may also be present. The terms "first", "second", "third", etc. are only for convenience in describing the present technical solution, and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
Referring to fig. 1, a laser processing method provided in this embodiment includes the following steps:
s01: and loading the workpiece on the machining platform, acquiring an original workpiece model and a target workpiece model and transmitting the original workpiece model and the target workpiece model to the path simulation module.
Specifically, the original workpiece model and the target workpiece model can be drawn in drawing software and then imported into the path simulation module.
S02: and the path simulation module obtains a simulated machining path through calculation simulation and transmits the simulated machining path to the numerical control coding module.
The path simulation module is internally stored with a database, and the database comprises the removal rate and the processing parameters of the laser to different workpiece materials; after the workpiece material, the original workpiece model and the target workpiece model are input into the path simulation module, the path simulation module can automatically simulate an optimal machining path, namely a simulated machining path, by combining the database. The material of the workpiece may be manually input into the path simulation module when the workpiece model is imported.
The method and the device have the advantages that the database containing the laser processing parameters is stored in the path simulation module, and linkage processing can be carried out by comprehensively considering the characteristics of laser and machining in the process of acquiring the simulated processing path.
Because the path simulation module is stored with a database, and the database comprises the corresponding relation of the removal rate and the processing parameters of different lasers to different workpiece materials, the parameters of the removal amount, the removal speed and the like of the lasers are quantized into specific processing data. The simulation software can be Mastercam, UG or other simulation software, and is embedded into the path simulation module with the database at the same time, and the simulation software can call the data in the database in real time; and comparing the original workpiece model with the target workpiece model during operation, setting a removal area, or manually setting a removal path, importing the required processing data in a database, and acquiring a simulated processing path.
In the step, the simulated machining path can be directly and manually input into the path simulation module.
S03: the numerical control coding module converts the simulated processing path into a numerical control coding program and transmits the numerical control coding program to the laser processing module and the mechanical processing platform; the numerical control coding program is used for simultaneously controlling the operation of the laser processing module and the operation of the mechanical processing platform.
The operation of the laser processing module comprises the turning on and off of a laser light source and the parameter change of the laser processing module, wherein the parameter of the laser processing module comprises at least one of laser power, focal length variable distance, scanning speed, pulse number and laser frequency.
The machining platform can be a multi-axis linkage machining platform, such as a three-axis linkage machining platform, a four-axis linkage machining platform or a five-axis linkage machining platform; the parameters of the machining platform include axial movement of the machining platform in all directions.
The core idea of the step is to integrate the motion of the mechanical processing platform and the motion of the laser processing module together, so that the mechanical processing platform and the laser processing module can be simultaneously operated in the processing process of the workpiece, and the application range of laser processing can be enlarged through the cooperation of the mechanical processing platform and the laser processing module, and the flexible conversion of laser spots on space positions, time and energy in the processing process is realized. Of course, the digitally controlled code program of the present invention may include only the parameters of the laser machining module or only the mechanical motion parameters of the machining platform for certain particular shaped workpieces.
S04: and the laser processing module and the mechanical processing platform are in linkage operation according to the numerical control coding program to process the workpiece. After the numerical control coding program is determined, once the laser processing device is started, the laser processing module and the mechanical processing platform are controlled to process the workpiece according to the numerical control coding program which is designed in advance.
S05: the feedback module calculates the error between the processed workpiece and the target workpiece.
Preferably, an online observation module is arranged on one side of the machining platform, and is used for scanning the machined workpiece and reconstructing a three-dimensional model, and acquiring a machined workpiece model; and transmitting the processed workpiece model to a feedback model, and calculating the error between the processed workpiece and the target workpiece by the feedback model. The on-line observation module positioned on one side of the machining platform can scan and obtain a machined workpiece model in real time, and can explain error calculation to the feedback module in time, so that the real-time adjustment of the simulated machining path and the numerical control coding program are facilitated.
Preferably, the original workpiece model and the target workpiece model drawn by the drawing software in step S01 are simultaneously transmitted to the feedback module for storage, which facilitates comparison and error calculation in this step.
S06: if the error is smaller than the error threshold value, the numerical control coding program is reserved; if the error is larger than or equal to the error threshold, the numerical control coding module re-determines the numerical control coding program according to the error and returns to the step S04. The specific error threshold may be determined according to specific workpiece production requirements.
The output end of the feedback module is connected with the path simulation module, when the error calculated by the feedback module is smaller than the error threshold value, the feedback module transmits the calculation result to the path simulation module, the path simulation module stores the corresponding simulated machining path, and the numerical control programming module stores the corresponding numerical control coding program for the follow-up continuous laser machining control of workpieces of the same type.
When the error calculated by the feedback module is greater than or equal to the error threshold, the feedback module transmits the calculation result to the path simulation module, and the path simulation module re-determines the simulated machining path according to the error result, the original workpiece model, the target machining model and the machined workpiece model, and returns to step S03. The specific method for re-determining the simulated machining path is as follows:
because the path simulation module is stored with a database, and the database comprises the corresponding relation of the removal rate and the processing parameters of different lasers to different workpiece materials, the parameters of the removal amount, the removal speed and the like of the lasers are quantized into specific processing data. The simulation software can be Mastercam, UG or other simulation software, and is embedded into the path simulation module with the database at the same time, and the simulation software can call the data in the database in real time; and comparing the original workpiece model with the target workpiece model during operation, referring to the machined workpiece model, resetting the removal area, or manually setting the removal path, importing the required machining data in a database, and acquiring the simulated machining path. Note that: when the simulated machining path is determined again, the original path does not achieve the expected effect, and when the simulated machining path is determined again, the simulation software can call the machined workpiece model for reference so as to further optimize the simulated machining path.
S07: and (5) performing laser processing on the workpieces in the same batch by adopting the numerical control coding program reserved in the step S06.
In the prior art, a mechanical processing platform and a laser module cannot be controlled to move together simultaneously aiming at a coding program in the laser processing process, and the flexibility of laser processing cannot be improved. The biggest problem to be solved by integrating the control of the laser processing module and the mechanical processing platform in the same numerical control coding program is the accuracy of the program. In order to obtain an accurate laser processing effect, the invention adopts an online observation module to obtain a processed workpiece model in real time, adopts a feedback module to calculate errors for multiple times, and continuously optimizes a numerical control coding program according to an error calculation result to finally obtain the numerical control coding program meeting an error threshold.
Referring to fig. 2, the laser processing apparatus provided in this embodiment includes a mechanical processing platform, a feedback module, a laser processing module, a path simulation module, and a digital control encoding module;
the path simulation module is used for simulating a processing path according to the original workpiece model and the target workpiece model, and the output end of the path simulation module is connected with the input end of the numerical control coding module;
the numerical control coding module is used for converting the simulated processing path into a numerical control coding program, and the output end of the numerical control coding module is connected with the laser processing module and the mechanical processing platform; the numerical control coding program is used for controlling parameters of the laser processing module and parameters of the mechanical processing platform;
the feedback module is used for calculating the error between the machined workpiece and the target workpiece, the output end of the feedback module is connected with the path simulation module, when the error calculated by the feedback module is smaller than an error threshold value, the feedback module transmits the calculation result to the path simulation module, the path simulation module stores the corresponding simulated machining path, and meanwhile, the numerical control changing module stores the corresponding numerical control coding program for subsequently and continuously carrying out laser machining control on the workpieces of the same type. When the error calculated by the feedback module is larger than or equal to the error threshold value, the feedback module transmits the calculation result to the path simulation module, and the path simulation module re-determines the simulated machining path according to the error result, the original workpiece model, the target machining model and the machined workpiece model.
The laser processing module comprises a laser, a light path transmission unit, a beam expanding unit, a galvanometer unit, a focusing mirror unit and a laser spot; the laser output end is connected with the input end of the light path transmission unit, the output end of the light path transmission unit is connected with the input end of the beam expanding unit, the output end of the beam expanding unit is connected with the input end of the mirror vibrating unit, the output end of the mirror vibrating unit is connected with the input end of the focusing mirror unit, and the output end of the focusing mirror unit is connected with the laser spot.
Preferably, the laser processing module further includes a laser shaping unit, where the laser shaping unit is located inside the laser spot and is used to shape the laser output by the focusing mirror unit into a target shape, including but not limited to a flat-bottom light, a square spot, a triangular spot, and the like. The laser spots with different shapes are arranged to facilitate processing of different workpieces.
Preferably, the galvanometer unit comprises M galvanometers, and the focusing mirror unit comprises M focusing mirrors; m is an integer greater than 0. A focusing mirror required to be used is changed through light path switching to change the size of a laser spot; meanwhile, the size of the laser spot can be changed by controlling the position movement of the focusing lens; is convenient for processing different workpieces.
Preferably, an online observation module may be further disposed on one side of the machining platform in this embodiment, and the online observation module is used to scan the machined workpiece and obtain a machined workpiece model; and transmitting the processed workpiece model to a feedback model, and calculating the error between the processed workpiece and the target workpiece by the feedback model. The on-line observation module positioned on one side of the machining platform can scan and obtain a machined workpiece model in real time, and can explain error calculation to the feedback module in time, so that the real-time adjustment of the simulated machining path and the numerical control coding program are facilitated.
Example 1
Referring to fig. 3-7, in the present embodiment, the original shape is a workpiece 13 with a flat surface, the workpiece 13 is fixed on a machining platform 12, and the laser spot 11 in the laser processing module is located above the workpiece 13; the target workpiece is shown in fig. 3-7, and the surface of the target workpiece comprises a concave profile 14, a cambered profile 15, a planar mini-groove 16 and the like.
Referring to fig. 4, when the concave profile 13 of the workpiece 13 is processed, the laser beam at the concave profile is blocked and cannot be processed, the numerical control coding program at this stage includes parameters of the machining platform, and the specific parameters may be parameters for controlling the machining platform to rotate counterclockwise in the vertical plane, that is, the machining platform 12 rotates along the axis a in fig. 4, so that the concave profile is exposed at the vertical laser spot 11.
Referring to fig. 5, when the arc contour 15 of the workpiece is machined, the numerical control coding program at this stage may include parameters of the machining platform and parameters of the laser machining module, because the arc contour is located at different heights in the vertical direction; the parameters of the machining platform may be to control the machining platform 12 to move up and down along the Z-axis direction, so as to ensure that the laser spot 11 machines the surface of the workpiece at different heights. The parameters of the laser processing module can control the laser spot to reciprocate along XY axes in the horizontal plane, so as to ensure that the laser spot processes the surface of the workpiece at different positions.
Referring to fig. 6, when machining the small flat groove 16 of the workpiece, the numerical control coding program at this stage may include parameters of the laser machining module, and the machining platform 12 remains stationary; the parameters of the laser processing module can be used for controlling the laser spot 11 to reciprocate along the XY axes in the horizontal plane, so as to ensure that the laser spot 11 processes the surface of the workpiece at different positions.
Referring to fig. 7, when the planar small groove 16 of the workpiece is machined, the numerical control coding program at this stage may include parameters of the machining platform, and the laser spot 11 remains stationary; the parameters of the machining platform may be to control the machining platform 12 to reciprocate along the XY axes in the horizontal plane, so as to ensure that the laser spot 11 machines the surface of the workpiece at different positions.
Example 2
Referring to fig. 8, in the present embodiment, the original workpiece is circular, the target workpiece is four blades, and the remaining portion is the removed area.
Referring to fig. 9, during initial processing, the laser spot 11 is controlled by the numerical control coding program to be stationary, the machining platform rotates around the axis a of the mechanical shaft, and the laser spot 11 performs contour rough processing on the original workpiece;
referring to fig. 10, when the profile of the blade 1 is processed, the laser spot 11 and the machining platform are controlled to operate in a linkage manner by a numerical control coding program;
referring to fig. 11, after the contour of the blade 1 is processed, the laser spot 11 is controlled by the numerical control coding program to be stationary, and the machining platform rotates around the axis a of the machine shaft to rotate the blade 2 to the position of the laser spot.
Referring to fig. 12, when the profile of the blade 2 is processed, the laser spot 11 and the machining platform are controlled to operate in a linkage manner by the numerical control coding program;
the above-described machining process of the blade is repeated to obtain the target workpiece as shown in fig. 13.
It is to be understood that the foregoing examples, while indicating the preferred embodiments of the invention, are given by way of illustration and description, and are not to be construed as limiting the scope of the invention; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several changes and modifications can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.
Claims (10)
1. A laser processing method, characterized by comprising the steps of:
s01: loading a workpiece on a machining platform, acquiring an original workpiece model and a target workpiece model and transmitting the original workpiece model and the target workpiece model to a path simulation module;
s02: the path simulation module obtains a simulated processing path through calculation simulation and transmits the simulated processing path to the numerical control coding module;
s03: the numerical control coding module converts the simulated processing path into a numerical control coding program and transmits the numerical control coding program to the laser processing module and the mechanical processing platform; the numerical control coding program is used for simultaneously controlling the operation of the laser processing module and the operation of the mechanical processing platform;
s04: the laser processing module and the mechanical processing platform operate in a linkage manner according to the numerical control coding program to process a workpiece;
s05: the feedback module calculates the error between the processed workpiece model and the target workpiece model;
s06: if the error is smaller than the error threshold value, the simulated machining path and the numerical control coding program are reserved; if the error is larger than or equal to the error threshold, the path simulation module re-determines the simulated machining path and returns to the step S03;
s07: and (5) performing laser processing on the workpieces in the same batch by adopting the numerical control coding program reserved in the step S06.
2. The laser processing method according to claim 1, wherein the path simulation module in step S02 stores a database, wherein the database contains the removal rates and processing parameters of different laser beams for different workpiece materials; and the path simulation module simulates according to the original workpiece model, the target workpiece model and the database to obtain a simulated machining path.
3. The laser processing method according to claim 2, wherein the step S05 is performed by scanning the processed workpiece with an online observation module to obtain a processed workpiece model; and transmitting the processed workpiece model to a feedback model, wherein the feedback model calculates the error between the processed workpiece model and the target workpiece model.
4. The laser processing method according to claim 3, wherein in step S06, if the error is greater than or equal to the error threshold, the feedback module transmits the processed workpiece model to the path simulation module, and the path simulation module performs simulation based on the original workpiece model, the processed workpiece model, the target workpiece model and the database to determine the simulated processing path again.
5. The laser processing method of claim 1, wherein the operation of the laser processing module in step S03 includes turning on and off of the laser light source and changing parameters of the laser processing module, wherein the parameters of the laser processing module include at least one of laser power, focal length variation, scanning speed, pulse number and laser frequency.
6. The laser processing method according to claim 1, wherein the machining platform is a multi-axis linkage machining platform.
7. The laser machining method according to claim 6, wherein the operation of the machining platform in step S03 includes axial movement of the machining platform in various directions.
8. A laser processing device is characterized by comprising a mechanical processing platform, a feedback module, a laser processing module, a path simulation module and a numerical control coding module;
the path simulation module is used for simulating a machining path according to an original workpiece model and a target workpiece model, and the output end of the path simulation module is connected with the input end of the numerical control coding module;
the numerical control coding module is used for converting the simulated processing path into a numerical control coding program, and the output end of the numerical control coding module is connected with the laser processing module and the mechanical processing platform; the numerical control coding program is used for controlling parameters of the laser processing module and parameters of the mechanical processing platform;
the feedback module is used for calculating the error between the processed workpiece and the target workpiece, and when the error is greater than or equal to an error threshold, the path simulation module re-determines the simulated processing path until the error is less than the error threshold.
9. The laser processing device of claim 8, wherein the laser processing module comprises a laser, an optical path transmission unit, a beam expanding unit, a galvanometer unit, a focusing mirror unit and a laser spot; the laser output end is connected the input of light path transmission unit, the output of light path transmission unit is connected the input of expanding the beam unit, the output of expanding the beam unit is connected the input of mirror unit shakes, the output of mirror unit shakes is connected the input of focus mirror unit, the output of focus mirror unit is connected the laser facula.
10. The laser processing apparatus according to claim 9, wherein the galvanometer unit includes M galvanometers, and the focusing mirror unit includes M focusing mirrors; m is an integer greater than 0.
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