CN114199420A - LTCC-based high-temperature-resistant pressure sensor and manufacturing method thereof - Google Patents
LTCC-based high-temperature-resistant pressure sensor and manufacturing method thereof Download PDFInfo
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- CN114199420A CN114199420A CN202111508997.8A CN202111508997A CN114199420A CN 114199420 A CN114199420 A CN 114199420A CN 202111508997 A CN202111508997 A CN 202111508997A CN 114199420 A CN114199420 A CN 114199420A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L27/00—Testing or calibrating of apparatus for measuring fluid pressure
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
Abstract
The invention discloses a high-temperature resistant pressure sensor based on LTCC (low temperature co-fired ceramic) and a manufacturing method thereof, wherein the high-temperature resistant pressure sensor comprises an upper electrode base, an upper fixed electrode, an upper pressure cavity, an upper pressure sensitive film, a middle movable electrode, a lower pressure sensitive film, a lower pressure cavity, a lower fixed electrode and a lower electrode base which are sequentially connected from top to bottom; the upper electrode base and the lower electrode base are respectively formed by laminating and sintering at least one layer of ceramic chip, an upper air guide hole is formed in the middle position of the upper electrode base corresponding to the upper fixed electrode, and a lower air guide hole is formed in the middle position of the lower electrode base corresponding to the lower fixed electrode, so that a differential capacitive pressure sensor structure is formed; according to the invention, the LTCC ceramic material is selected, so that the high temperature resistance of the sensor is improved, and the sensor is suitable for being applied in a high-temperature environment; the pressure sensor with a differential structure is selected, so that the sensitivity and the linearity of the sensor are improved; the manufacturing method has the advantages of simple process, high reliability, low cost and universality.
Description
Technical Field
The invention relates to a pressure sensor, in particular to a high-temperature-resistant pressure sensor based on LTCC and a manufacturing method thereof.
Background
The pressure sensor is a sensing device for measuring pressure, and is a sensor widely used. The high-temperature pressure sensor is a pressure sensor applied to special environment, and is widely applied to pressure measurement in high-temperature environment in the fields of petrochemical industry, oil wells of oil fields, automobiles, electric power, aerospace, weapon industry and the like. Attention has been paid to how to develop a pressure sensor suitable for use in high temperature environments.
In terms of materials: most of the conventional pressure sensors use silicon and metal strain gauges as main materials. However, the silicon material has intrinsic excitation phenomenon when the temperature exceeds 280 ℃, and the doped silicon has the characteristic of strong sensitivity to temperature, so the doped silicon is difficult to use in a high-temperature environment; in addition, the pressure sensor with the metal strain gauge as a sensitive element has the biggest defects that the size of a device is large, an output signal is too small, and the deformation influence of temperature on metal strain is large under a high-temperature environment, so that the output of the sensor is influenced, and the pressure sensor is not suitable for the high-temperature environment. At present, the pressure sensor with the MEMS structure has difficulty in stable measurement in the environment with the temperature of more than 400 ℃ in the international range. Some materials for high temperature applications, such as SOS (silicon on sapphire), SiC, GaN, etc., can meet the requirements of temperature applications, but are not suitable for experimental research due to their high price and difficult realization of the process. Due to the characteristics of high Temperature resistance, Low cost, insulation, self-packaging and the like of the Ceramic, and the Low Temperature Co-fired Ceramic (LTCC), the process has the specific advantages in the aspects of manufacturing a multi-cavity three-dimensional structure and a multi-layer interconnection technology. The pressure sensor is made of the LTCC material and the process, and can be applied in a high-temperature environment of about 400-600 ℃.
In terms of signal detection: most pressure sensors mainly adopt a piezoresistive type and a capacitive type, but the intrinsic temperature dependence characteristic of the piezoresistive effect of a material of the piezoresistive type pressure sensor cannot work in a high-temperature environment; the common capacitive pressure sensor mainly uses single capacitance. The single capacitor type pressure signal detection is adopted, and the sensitivity and the linearity are low.
Disclosure of Invention
The invention aims to: the problem that the pressure sensor in the prior art is difficult to measure in the environment with the temperature higher than 400 ℃ is solved; the invention provides a high-temperature resistant pressure sensor based on LTCC and a manufacturing method thereof, and aims to improve the sensitivity and the linearity of a capacitive pressure sensor in the prior art.
The technical scheme of the invention is as follows:
a high-temperature resistant pressure sensor based on LTCC comprises an upper electrode base, an upper fixed electrode, an upper pressure cavity, an upper pressure sensitive film, a middle movable electrode, a lower pressure sensitive film, a lower pressure cavity, a lower fixed electrode and a lower electrode base which are sequentially connected from top to bottom;
the upper electrode base and the lower electrode base are respectively formed by laminating and sintering at least one layer of ceramic chip, an upper air guide hole is formed in the middle position of the upper electrode base corresponding to the upper fixed electrode, and a lower air guide hole is formed in the middle position of the lower electrode base corresponding to the lower fixed electrode;
the upper pressure cavity, the upper pressure sensitive film, the lower pressure sensitive film and the lower pressure cavity are respectively arranged on a layer of ceramic chip and are respectively aligned with the three electrodes in position to form a differential capacitive pressure sensor structure;
the upper electrode base is further provided with three conductive through hole columns, the lower ends of the three conductive through hole columns respectively extend to the ceramic chip layers where the three electrodes are located, and the lower ends of the three conductive through hole columns are respectively connected with one end of the corresponding electrode through conduction band interconnection lines.
Preferably, the upper electrode base and the lower electrode base are respectively formed by laminating and sintering three layers of ceramic tiles.
Preferably, the upper surface of the upper electrode base is provided with pressure welding points of three conductive through hole columns.
A manufacturing method of a high-temperature-resistant pressure sensor based on LTCC comprises the following steps:
s1, falling of the sheet: cutting the raw porcelain belt into raw porcelain pieces with ten block sizes by adopting a piece dropping machine, flatly placing the raw porcelain pieces after being dropped into a metal tray lined with fiber-free coated paper one by one, and then placing the raw porcelain pieces and the tray into an oven or an infrared drying oven with forced air convection for pretreatment;
s2, punching: drilling holes at corresponding positions of the green ceramic chips by using a punching machine or a laser cutting machine to form conductive through holes, air guide holes or cavities;
s3, hole filling: aligning the green ceramic chip to be filled with the hole on the hole mask plate, uniformly pressing the electronic paste into the conductive through hole, and metallizing the conductive through hole to form a conductive through hole column;
s4, screen printing: through the action of a scraper of a machine head of the screen printer, the slurry on the screen printing plate is uniformly deposited on the corresponding green ceramic plate to form a uniform film layer with controllable film thickness, and three electrodes, three conduction band interconnection lines and three pressure welding points are correspondingly formed;
s5, placing a cavity filling plug: firstly, manufacturing a cavity filling plug with an applicable size according to the size requirement of a pressure cavity; then placing the prepared cavity filling plug into the corresponding pressure cavity;
s6, lamination and lamination: firstly, aligning and stacking ten layers of green ceramic chips into a complete green ceramic blank according to a specified direction and sequence by using an accurate positioning pin of a laminating table consistent with a green ceramic chip positioning hole and a fully-automatic laminating machine with a graph alignment function; then, vacuum packaging the stacked green ceramic blanks by using a vacuum packaging machine, and then compacting the green ceramic blanks into a green ceramic body by using an isostatic pressing laminating machine;
s7, slicing and co-firing: firstly, cutting the laminated pressure sensor green porcelain body into pressure sensor unit green porcelain bodies by using a cutting machine; then putting the segmented green ceramic bodies of the pressure sensor units on a sintering support of a sintering furnace for co-sintering, and finally forming the designed high-temperature pressure sensor;
s8, detection: and (4) carrying out appearance inspection on the manufactured pressure sensor by using naked eyes and a microscope, and testing the electrical parameters of the pressure sensor by using a probe testing table.
Preferably, the temperature of the pretreatment in step S1 is: 110-: 15-30 min.
Preferably, the step S3 is characterized in that the hole filling adopts two methods of extrusion hole filling and printing hole filling, wherein:
and (3) extruding and filling holes: working air pressure: 20-28 psi, filling time: 6 s-9 s;
printing and filling holes: scraper pressure: 40 psi-50 psi; blade speed: not more than 70mm/s to 100 mm/s.
Preferably, in step S4, the printing pressure: less than or equal to 0.5 MPa; printing speed: less than or equal to 10 cm/s; drying time: 10 min; drying temperature: at 60 ℃.
Preferably, in step S5, the cavity filling plug is made of dow corning gel, and the ratio of the dow corning gel to the component a is: silicon dioxide powder: dow corning silica gel component B = 1: 6: 10.
preferably, in step S6, the isostatic press presses a green body into a green body at a temperature of 70 ℃ for a lamination time of 10min under a pressure of 25 MPa.
Preferably, in step S7, the green ceramic co-firing process is controlled by a sintering curve, wherein the sintering curve comprises an initial heating period, a binder removal period, a heating period, a high-temperature heat preservation period, and a cooling period; initial temperature rise period: the room temperature is between 350 ℃, and the heating rate is between 4.5 and 6.4 ℃/min; and (3) gel removing period: the rubber discharge period is about 450 ℃ and 2 h; a temperature rise period: the process of converting the powder of the raw porcelain body into the solid state is carried out at the temperature of 450-850 ℃ and the heating rate of 4.5-6.4 ℃; and (3) high-temperature heat preservation period: the green ceramic body formed a stable, firm morphology during this time, with a sintering temperature peak of about 850 ℃, 10 min: a cooling period: and the cooling process after the sintering of the green porcelain body is finished is 850-room temperature, and the cooling rate is 5-6.5 ℃/min.
The invention has the advantages that:
1. according to the high-temperature-resistant pressure sensor based on the LTCC, the LTCC ceramic material is selected, so that the high temperature resistance of the sensor is improved, and the sensor is suitable for being applied in a high-temperature environment;
2. the pressure sensor with a differential structure is selected, so that the sensitivity and the linearity of the sensor are improved;
3. the manufacturing method has the advantages of simple process, high reliability, low cost and universality.
Drawings
The invention is further described with reference to the following figures and examples:
FIG. 1 is a schematic cross-sectional view of an LTCC-based refractory pressure sensor;
FIG. 2 is a schematic view of a green ceramic tile being dropped;
FIG. 3 is a schematic view of the punching of a ceramic tile;
FIG. 4 is a schematic illustration of conductive via filling;
FIG. 5 is a schematic view of screen printing of ceramic tiles;
FIG. 6 is a schematic view of a cavity positioned to fill the pressure cavity;
fig. 7 is a schematic view of the lamination and lamination of ceramic tiles.
Detailed Description
As shown in fig. 1, the LTCC-based high temperature resistant pressure sensor of this embodiment includes an upper electrode base, an upper fixed electrode 3a, an upper pressure cavity 4a, an upper pressure sensitive film, a middle movable electrode 3c, a lower pressure sensitive film, a lower pressure cavity 4b, a lower fixed electrode 3b, and a lower electrode base, which are sequentially connected from top to bottom; the upper electrode base and the lower electrode base are respectively formed by laminating and sintering three layers of ceramic chips, an upper air guide hole 2a is formed in the middle position, corresponding to the upper fixed electrode 3a, of the upper electrode base, and a lower air guide hole 2b is formed in the middle position, corresponding to the lower fixed electrode 3b, of the lower electrode base; the upper pressure cavity 4a, the upper pressure sensitive film, the lower pressure sensitive film and the lower pressure cavity 4b are respectively arranged on a layer of ceramic chip and are aligned with the three electrodes respectively in position, so that a differential capacitive pressure sensor structure is formed.
The upper electrode base is further provided with a first conductive through hole column 5a, a second conductive through hole column 5b and a third conductive through hole column 5c, the lower ends of the three conductive through hole columns respectively extend to the ceramic chip layers where the upper fixed electrode 3a, the middle movable electrode 3c and the lower fixed electrode 3b are located, and the lower ends of the three conductive through hole columns are respectively connected with one end of the corresponding electrode through a first conduction band interconnection line 6a, a second conduction band interconnection line 6b and a third conduction band interconnection line 6 c. The upper surface of the upper electrode base is provided with a first pressure welding point 1a, a second pressure welding point 1b and a third pressure welding point 1c of three conductive through hole columns.
The LTCC-based high temperature resistant pressure sensor of this embodiment is manufactured through the following steps.
The pressure sensor is manufactured based on the LTCC process. LTCC (Low Temperature Co-fired Ceramic) is a multilayer interconnection Ceramic substrate manufacturing technology. Through the main processes of chip dropping, punching, hole filling, screen printing, lamination, co-firing, slicing, multilayer top surface, detection and the like, a plurality of unsintered flexible Green ceramic chips (Green Tape) with thick-film conductors, embedded resistors, built-in cavities and interlayer interconnection metalized through holes printed on the surfaces are heated and pressed simultaneously to be laminated into an integral structure, and then are sintered together in a low-temperature environment with the highest temperature of 800-950 ℃ to form a rigid high-density multilayer interconnection LTCC substrate or an electronic device. The differential capacitive pressure sensor with the double-pressure cavity structure is manufactured by adopting an LTCC process, and is specifically explained as follows.
S1, falling of the sheet: as shown in fig. 2. A tape-out machine was used to divide Dupont 951PT green tape into 10 pieces 8 having dimensions of 154mm by 154 mm. Marking an upper layer number on the upper right corner of the green ceramic chip, flatly placing the green ceramic chip subjected to chip falling into a metal tray lined with fiber-free coated paper one by one, and then placing the green ceramic chip together with the tray into a drying oven or an infrared drying oven with forced air convection for pretreatment, wherein the temperature is as follows: 120 ℃, time: and 20 min.
S2, punching: as shown in fig. 3. Firstly, a punching machine or a laser cutting machine converts layout data into a punching data format recognized by equipment, and then holes are drilled at corresponding positions of a green ceramic chip according to the designed distribution through the up-and-down movement of a punch with the required through hole diameter or the cutting of a laser beam to form required patterns such as through holes or cavities. Forming a lower air guide hole 2b on the 1 st-3 rd layer of green ceramic wafer through punching or laser cutting; forming a lower pressure cavity 4b and a conductive through hole 5 on the 4 th layer of green ceramic wafer; forming a conductive through hole 5 on the 5 th and 6 th layers of green ceramic chips; forming an upper pressure cavity 4a and a conductive through hole 5 on the 7 th layer of green ceramic wafer; and forming an upper air guide hole 2a and a conductive through hole 5 on the green porcelain sheets of the 8 th to 10 th layers. And respectively observing the quality of the formed through hole and the formed cavity under a microscope to see whether chips exist in the through hole or not, the shape of the through hole, the drilling precision and the positioning precision and the like by using a 3D microscope.
S3, hole filling: as shown in fig. 4. The raw porcelain to be filled in the hole is aligned to the positioned hole mask plate and is pressed tightly by the pressure of the clamping plate, the electronic paste Dupont6141Ag is uniformly pressed into the conductive through hole 5, the conductive through hole is metalized, and a first conductive through hole column 5a, a second conductive through hole column 5b and a third conductive through hole column 5c are formed. The hole filling can adopt two methods of extrusion hole filling and printing hole filling. And (3) extruding and filling holes: working air pressure: 20-28 psi, filling time: 6 s-9 s; printing and filling holes: scraper pressure: 40 psi-50 psi; blade speed: not more than 70mm/s to 100 mm/s.
S4, screen printing: as shown in fig. 5. Through the regular action of a scraper of a machine head of a screen printer, Dupont6146Pd/Ag slurry on the screen printing plate is uniformly deposited on the green ceramic plate to form a uniform film layer with controllable film thickness. The pressure sensor lower fixed electrode 3b and the second conduction band interconnection line 6b are formed on the 3 rd layer, the pressure sensor intermediate movable electrode 3c and the third conduction band interconnection line 6c are formed on the 5 th layer, and the pressure sensor upper fixed electrode 3a and the first conduction band interconnection line 6a are formed on the 8 th layer by screen printing. A first pressure pad 1a, a second pressure pad 1b, a third pressure pad 1c or other circuit patterns (such as inductance, capacitance, etc.) are formed on the 10 th layer (top layer).
Printing pressure: less than or equal to 0.5 MPa; printing speed: less than or equal to 10 cm/s. Drying time and temperature: drying temperature for 10 min: at 60 ℃.
S5, placing a cavity filling plug in the pressure cavity: as shown in fig. 6. The purpose of using the cavity fill plug is to shape the cavity mold to prevent subsequent lamination from collapsing or deforming the cavity. Firstly, a first cavity filling plug 7a and a second cavity filling plug 7b with suitable sizes are manufactured according to the requirements of the cavity sizes. The cavity filling plug material is prepared from Dow Corning glue according to the proportion: 1 (daokoning silica gel component a): 6 (silica powder): 10 (daokoning silica gel component B); the prepared first cavity filling plug 7a and the second cavity filling plug 7b are arranged in the corresponding upper pressure cavity 4a and the lower pressure cavity 4 b.
S6, lamination and lamination: as shown in fig. 7. Firstly, aligning and stacking 10 layers of green ceramic chips 8 into a complete green ceramic blank according to a specified direction and sequence by a precise positioning pin of a laminating table consistent with a green ceramic chip positioning hole and a fully-automatic laminating machine with a graph aligning function. And then the stacked green porcelain blanks are encapsulated in vacuum by using a vacuum encapsulating machine, and then the green porcelain blanks are compressed into a compact green porcelain body by using an isostatic pressing laminating machine to generate the pressure of 25MPa at the temperature of 70 ℃ and the laminating time of 10 min.
S7, slicing and co-firing: first, the laminated pressure sensor green ceramic body is cut by a cutter and divided into individual pressure sensor unit green ceramic bodies (green ceramic blocks). The slicing process requirements are as follows: temperature of the slide holder: 70 ℃; temperature of the cutter: 80 ℃; cutting speed: 200 mm/s. Then the ceramic bodies of the separated pressure sensor units are put on a sintering support of a sintering furnace for co-sintering, and finally the designed high-temperature pressure sensor is formed, as shown in figure 1.
The green ceramic body co-firing process is mainly controlled by a sintering curve, and the sintering curve mainly comprises an initial heating-up period, a binder removal period, a heating-up period, a high-temperature heat preservation period and a cooling period. Initial temperature rise period: the room temperature is between 350 ℃, and the heating rate is between 4.5 and 6.4 ℃/min; and (3) gel removing period: the rubber discharge period is about 450 ℃ and 2 h; a temperature rise period: the process of converting the powder of the raw porcelain body into the solid state is carried out at the temperature of 450-850 ℃ and the heating rate of 4.5-6.4 ℃; and (3) high-temperature heat preservation period: the green ceramic body formed a stable, firm morphology during this time, with a sintering temperature peak of about 850 ℃, 10 min: a cooling period: and the cooling process after the sintering of the green porcelain body is finished is 850-room temperature, and the cooling rate is 5-6.5 ℃/min.
S8, detection: the manufactured pressure sensor is subjected to appearance inspection by naked eyes and a microscope, and a probe test bench is used for testing electric parameters such as capacitance and the like of the pressure sensor.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose of the embodiments is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All modifications made according to the spirit of the main technical scheme of the invention are covered in the protection scope of the invention.
Claims (10)
1. The high-temperature-resistant pressure sensor based on the LTCC is characterized by comprising an upper electrode base, an upper fixed electrode (3 a), an upper pressure cavity (4 a), an upper pressure sensitive film, a middle movable electrode (3 c), a lower pressure sensitive film, a lower pressure cavity (4 b), a lower fixed electrode (3 b) and a lower electrode base which are sequentially connected from top to bottom;
the upper electrode base and the lower electrode base are respectively formed by laminating and sintering at least one layer of ceramic chip, the upper electrode base is provided with an upper air guide hole (2 a) corresponding to the middle part of the upper fixed electrode (3 a), and the lower electrode base is provided with a lower air guide hole (2 b) corresponding to the middle part of the lower fixed electrode (3 b);
the upper pressure cavity (4 a), the upper pressure sensitive film, the lower pressure sensitive film and the lower pressure cavity (4 b) are respectively arranged on a layer of ceramic chip, and the positions of the upper pressure cavity, the upper pressure sensitive film, the lower pressure sensitive film and the lower pressure cavity are respectively aligned with the three electrodes to form a differential capacitance pressure sensor structure;
the upper electrode base is further provided with three conductive through hole columns, the lower ends of the three conductive through hole columns respectively extend to the ceramic chip layers where the three electrodes are located, and the lower ends of the three conductive through hole columns are respectively connected with one end of the corresponding electrode through conduction band interconnection lines.
2. The LTCC based high temperature resistant pressure sensor of claim 1, wherein the upper electrode base and the lower electrode base are each formed by laminating and sintering three layers of ceramic sheets.
3. The LTCC-based high temperature resistant pressure sensor of claim 1, wherein the upper surface of the upper electrode base is provided with a pressure welding point of three conductive via posts.
4. A manufacturing method of a high-temperature-resistant pressure sensor based on LTCC (Low temperature Co-fired ceramic) is characterized by comprising the following steps:
s1, falling of the sheet: cutting the raw porcelain belt into raw porcelain pieces with ten block sizes by adopting a piece dropping machine, flatly placing the raw porcelain pieces after being dropped into a metal tray lined with fiber-free coated paper one by one, and then placing the raw porcelain pieces and the tray into an oven or an infrared drying oven with forced air convection for pretreatment;
s2, punching: drilling holes at corresponding positions of the green ceramic chips by using a punching machine or a laser cutting machine to form conductive through holes, air guide holes or cavities;
s3, hole filling: aligning the green ceramic chip to be filled with the hole on the hole mask plate, uniformly pressing the electronic paste into the conductive through hole, and metallizing the conductive through hole to form a conductive through hole column;
s4, screen printing: through the action of a scraper of a machine head of the screen printer, the slurry on the screen printing plate is uniformly deposited on the corresponding green ceramic plate to form a uniform film layer with controllable film thickness, and three electrodes, three conduction band interconnection lines and three pressure welding points are correspondingly formed;
s5, placing a cavity filling plug: firstly, manufacturing a cavity filling plug with an applicable size according to the size requirement of a pressure cavity; then placing the prepared cavity filling plug into the corresponding pressure cavity;
s6, lamination and lamination: firstly, aligning and stacking ten layers of green ceramic chips into a complete green ceramic blank according to a specified direction and sequence by using an accurate positioning pin of a laminating table consistent with a green ceramic chip positioning hole and a fully-automatic laminating machine with a graph alignment function; then, vacuum packaging the stacked green ceramic blanks by using a vacuum packaging machine, and then compacting the green ceramic blanks into a green ceramic body by using an isostatic pressing laminating machine;
s7, slicing and co-firing: firstly, cutting the laminated pressure sensor green porcelain body into pressure sensor unit green porcelain bodies by using a cutting machine; then putting the segmented green ceramic bodies of the pressure sensor units on a sintering support of a sintering furnace for co-sintering, and finally forming the designed high-temperature pressure sensor;
s8, detection: and (4) carrying out appearance inspection on the manufactured pressure sensor by using naked eyes and a microscope, and testing the electrical parameters of the pressure sensor by using a probe testing table.
5. The method of making an LTCC based high temperature pressure sensor as claimed in claim 4, wherein the temperature of the pre-treatment in step S1 is: 110-: 15-30 min.
6. The method of making an LTCC based high temperature pressure sensor as claimed in claim 4, wherein the step S3 is to fill the hole by using two methods of extrusion and printing, wherein:
and (3) extruding and filling holes: working air pressure: 20-28 psi, filling time: 6 s-9 s;
printing and filling holes: scraper pressure: 40 psi-50 psi; blade speed: not more than 70mm/s to 100 mm/s.
7. The method of making an LTCC based high temperature pressure sensor as claimed in claim 4, wherein in step S4, the printing pressure: less than or equal to 0.5 MPa; printing speed: less than or equal to 10 cm/s; drying time: 10 min; drying temperature: at 60 ℃.
8. The method for manufacturing the LTCC-based high temperature resistant pressure sensor according to claim 4, wherein in step S5, the cavity filling plug is made of Dow Corning gel, and the proportion of the Dow Corning gel component A is as follows: silicon dioxide powder: dow corning silica gel component B = 1: 6: 10.
9. the method of making an LTCC-based high temperature resistant pressure sensor according to claim 4, wherein in step S6, the isostatic press is used to generate a pressure of 25MPa, and the green ceramic body is pressed into a green ceramic body at 70 ℃ for 10 min.
10. The method for manufacturing the LTCC-based high-temperature resistant pressure sensor according to claim 4, wherein in step S7, the green ceramic co-firing process is controlled by a sintering curve, and the sintering curve comprises an initial heating period, a binder removal period, a heating period, a high-temperature heat preservation period and a cooling period; initial temperature rise period: the room temperature is between 350 ℃, and the heating rate is between 4.5 and 6.4 ℃/min; and (3) gel removing period: the rubber discharge period is about 450 ℃ and 2 h; a temperature rise period: the process of converting the powder of the raw porcelain body into the solid state is carried out at the temperature of 450-850 ℃ and the heating rate of 4.5-6.4 ℃; and (3) high-temperature heat preservation period: the green ceramic body formed a stable, firm morphology during this time, with a sintering temperature peak of about 850 ℃, 10 min: a cooling period: and the cooling process after the sintering of the green porcelain body is finished is 850-room temperature, and the cooling rate is 5-6.5 ℃/min.
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