CN114199165A - Manufacturing device of silicon wafer and using method thereof - Google Patents
Manufacturing device of silicon wafer and using method thereof Download PDFInfo
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- CN114199165A CN114199165A CN202111298169.6A CN202111298169A CN114199165A CN 114199165 A CN114199165 A CN 114199165A CN 202111298169 A CN202111298169 A CN 202111298169A CN 114199165 A CN114199165 A CN 114199165A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The invention discloses a manufacturing device of a silicon wafer and a using method thereof, relating to the technical field of silicon wafer manufacturing. The invention includes the fuselage body, also include: the silicon wafer fixing mechanism is used for automatically positioning and fixing the silicon wafer; the silicon wafer fixing mechanism comprises a silicon wafer adsorption mechanism, the silicon wafer adsorption mechanism is used for fixing the silicon wafer, and a silicon wafer positioning mechanism is arranged in a matching manner on the silicon wafer adsorption mechanism; the rotating mechanism is used for driving the silicon wafer fixing mechanism to rotate; and the silicon wafer detection mechanism is used for detecting the flatness of the silicon wafer. According to the invention, through the matching of all accessories, the silicon wafer can be automatically positioned and adsorbed, and the silicon wafer is driven to rotate at a constant speed, and the flatness of the side wall of the silicon wafer can be effectively detected by matching with the silicon wafer detection mechanism, so that the detection result error caused by the deviation of the silicon wafer is effectively avoided, the detection accuracy is greatly improved, the detection difficulty is low, and great convenience is brought to a user.
Description
Technical Field
The invention belongs to the technical field of silicon wafer manufacturing, and particularly relates to a manufacturing device of a silicon wafer and a using method thereof.
Background
The silicon wafer is a silicon single crystal ingot produced by the Czochralski method, and is produced by a slicing heat treatment, a mirror surface processing, or the like, and is widely used for the production of semiconductor devices such as very large scale integrated circuits, and in recent years, with the increase in the degree of integration of the devices, the quality requirements for silicon wafers are increasing, and in particular, silicon wafers for devices cannot have crystal defects such as oxygen precipitates and lattice defects on the surface and in the range of several micrometers below the surface, therefore, the detection device is needed to detect the flatness of the side surface of the silicon wafer in the manufacturing process of the silicon wafer, but the existing detection device has higher difficulty in positioning and adsorbing the silicon wafer, when the flatness of the side wall of the silicon wafer is detected, the detection result is easy to be wrong due to deviation of the silicon wafer, so that the detection accuracy is low, the detection difficulty is high, and great inconvenience is brought to a user.
Disclosure of Invention
The invention aims to provide a silicon wafer manufacturing device and a using method thereof, which aim to solve the existing problems: the difficulty that current detection device fixes a position the silicon chip and adsorb is great, when examining the roughness of silicon chip lateral wall, leads to the testing result to appear the mistake because the silicon chip off normal easily, leads to the rate of accuracy of detecting lower, and the degree of difficulty that detects is great, brings very big inconvenience for the user.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the invention relates to a silicon chip manufacturing device, which comprises a machine body main body and also comprises:
the silicon wafer fixing mechanism is used for automatically positioning and fixing the silicon wafer;
the silicon wafer fixing mechanism comprises a silicon wafer adsorption mechanism, the silicon wafer adsorption mechanism is used for fixing a silicon wafer, a silicon wafer positioning mechanism is arranged on the silicon wafer adsorption mechanism in a matched mode and used for automatically positioning the silicon wafer, and a weight detector is arranged in the middle of the upper end of the silicon wafer adsorption mechanism and used for detecting the weight of the silicon wafer positioning mechanism;
the silicon wafer positioning mechanism consists of a lifting mechanism and four silicon wafer guide mechanisms, the silicon wafer guide mechanisms are connected with the silicon wafer adsorption mechanism in a sliding mode, guide slopes are arranged at the upper ends of the silicon wafer guide mechanisms and used for guiding the silicon wafers, and the lifting mechanism is used for driving the silicon wafer guide mechanisms to vertically move;
the rotating mechanism is used for driving the silicon wafer fixing mechanism to rotate;
and the silicon wafer detection mechanism is used for detecting the flatness of the silicon wafer.
Furthermore, the lifting mechanism comprises a fixed support, a first transmission motor and four limit threaded rods, the four limit threaded rods are fixed at the lower end of the silicon wafer guide mechanism, the fixed support is fixed at the lower end of the silicon wafer adsorption mechanism, the inside of the fixed support is rotatably connected with four threaded transmission rings, the threaded transmission rings are in threaded connection with the limit threaded rods, a first driven meshing gear ring is arranged on the outer side of each threaded transmission ring, an annular transmission ring is arranged on the outer side of each first driven meshing gear ring, a first annular meshing gear ring is arranged on the inner wall of each annular transmission ring, and the first annular meshing gear ring is in meshed connection with the first driven meshing gear ring;
the outside of annular transmission circle is provided with second annular tooth ring gear, first drive motor is fixed in the one end of silicon chip absorption mechanism lower extreme, just first drive motor and weight detector pass through wire electric connection, the first transmission gear of output fixedly connected with of first drive motor, first transmission gear and the meshing of second annular tooth ring gear are connected.
Further, silicon chip guiding mechanism is including unable adjustment base, unable adjustment base's upper end slope is provided with the fixed plate, the both sides of fixed plate all are provided with a plurality of locating levers, the outside of locating lever is rotated and is connected with and rotates the wheel, lies in a plurality of with one side the outside of rotating the wheel is provided with the drive belt.
Further, silicon chip adsorption apparatus constructs including rotating the mainboard, four slip chambeies have been seted up to the inside of rotating the mainboard, the inside in slip chamber is provided with vacuum adsorption apparatus and constructs, silicon chip adsorption apparatus constructs still including drive mechanism for drive vacuum adsorption apparatus constructs and removes in the inside in slip chamber.
Further, vacuum adsorption mechanism is including the working barrel, the lower extreme fixedly connected with pneumatic cylinder of working barrel, the output of pneumatic cylinder runs through working barrel fixedly connected with and pushes away the gas board, it is located the inside of working barrel to push away the gas board, the outside that pushes away the gas board is provided with the sealing washer, sealing washer and working barrel transition fit, the upper end of working barrel is provided with flexible gasket, the lower extreme of working barrel and the week that is located the pneumatic cylinder have seted up a plurality of exhaust holes.
Further, drive mechanism is including sliding seat and second drive motor, second drive motor fixed connection rotates the outside of mainboard, second drive motor's output fixedly connected with transmission threaded rod, sliding seat sliding connection is in the inside in slip chamber, the inside at the sliding seat is fixed to vacuum adsorption mechanism, one side fixedly connected with screw drive piece of sliding seat, screw drive piece and transmission threaded rod threaded connection.
Further, the outside of rotating the mainboard is provided with the motor support, motor support and second drive motor screwed connection, the working chamber has been seted up to the inside of rotating the mainboard and the one side that is located the sliding chamber, the transmission threaded rod rotates the inside of connecting at the working chamber, screw drive piece sliding connection is in the inside of working chamber.
Further, slewing mechanism is including third drive motor and annular base, annular base rotates the upper end of connection at the fuselage main part, the outside of annular base is provided with the driven meshing gear of second, third drive motor fixed connection is at the lower extreme of fuselage main part, the output of third drive motor runs through fuselage main part fixedly connected with second drive meshing gear, second drive meshing gear and the meshing of the driven meshing gear of second are connected.
Further, four corners of the lower end of the body main body are provided with supporting legs.
A method for using a silicon wafer manufacturing device comprises the following steps:
s1: placing a silicon wafer at the upper end of the silicon wafer fixing mechanism;
s2: starting a second transmission motor, and driving the vacuum adsorption mechanism to move together after the second transmission motor is started, so as to adjust the position of the vacuum adsorption mechanism;
s3: starting a first transmission motor, and driving the silicon wafer to move towards the direction close to the middle position of the silicon wafer fixing mechanism after the first transmission motor is started, so as to automatically position the silicon wafer;
when the weight of the silicon wafer detected by the weight detector is rapidly reduced when the silicon wafer rises, the first driving motor is controlled to drive the silicon wafer guide mechanism to reduce until the silicon wafer guide mechanism moves to the lower end of the silicon wafer adsorption mechanism;
s4: starting the hydraulic cylinder, discharging air in the working cylinder through the exhaust hole, and enabling a large negative pressure to be generated between the gas pushing plate and the silicon wafer to adsorb the silicon wafer;
s5: starting a third transmission motor, wherein the third transmission motor drives the silicon wafer fixing mechanism to rotate together after being started, so that the silicon wafer at the upper end of the silicon wafer fixing mechanism rotates at a constant speed;
s6: and starting the silicon wafer detection mechanism, wherein the silicon wafer detection mechanism can emit infrared rays to detect the flatness of the side wall of the silicon wafer after being started.
The invention has the following beneficial effects:
according to the invention, through the matching of all accessories, the silicon wafer can be automatically positioned and adsorbed, and the silicon wafer is driven to rotate at a constant speed, and the flatness of the side wall of the silicon wafer can be effectively detected by matching with the silicon wafer detection mechanism, so that the detection result error caused by the deviation of the silicon wafer is effectively avoided, the detection accuracy is greatly improved, the detection difficulty is low, and great convenience is brought to a user.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an apparatus for manufacturing a silicon wafer according to the present invention;
FIG. 2 is a schematic sectional view of an apparatus for manufacturing a silicon wafer according to the present invention;
FIG. 3 is a schematic structural diagram of a silicon wafer fixing mechanism of an apparatus for manufacturing a silicon wafer according to the present invention;
FIG. 4 is a schematic structural diagram of a silicon wafer positioning mechanism of an apparatus for manufacturing a silicon wafer according to the present invention;
FIG. 5 is a schematic structural diagram of a lifting mechanism of a silicon wafer manufacturing apparatus according to the present invention;
FIG. 6 is a schematic structural diagram of a silicon wafer guiding mechanism of an apparatus for manufacturing a silicon wafer according to the present invention;
FIG. 7 is a schematic structural view of a silicon wafer adsorbing mechanism of a silicon wafer manufacturing apparatus according to the present invention;
FIG. 8 is a schematic structural view of a rotating main plate of the apparatus for manufacturing silicon wafers according to the present invention;
FIG. 9 is a schematic structural diagram of a transmission mechanism of an apparatus for manufacturing silicon wafers according to the present invention;
FIG. 10 is a schematic view of a vacuum adsorption mechanism of an apparatus for manufacturing silicon wafers according to the present invention;
FIG. 11 is a schematic structural diagram of a rotation mechanism of an apparatus for manufacturing silicon wafers according to the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a main body of the body; 2. a silicon wafer fixing mechanism; 3. a silicon wafer detection mechanism; 4. a rotating mechanism; 5. a silicon wafer adsorption mechanism; 6. a silicon wafer positioning mechanism; 7. a weight detector; 8. a lifting mechanism; 9. a silicon wafer guide mechanism; 10. rotating the main board; 11. a vacuum adsorption mechanism; 12. a transmission mechanism; 13. a sliding cavity; 14. a support leg; 15. a working chamber; 16. a motor support; 17. fixing a bracket; 18. a threaded drive ring; 19. a first driven meshing gear ring; 20. an annular drive ring; 21. a first ring-shaped meshing gear ring; 22. a second ring-shaped meshing gear ring; 23. a first drive motor; 24. a first drive gear; 25. a limit threaded rod; 26. a fixed base; 27. positioning a rod; 28. a rotating wheel; 29. a second drive cog; 30. a transmission belt; 31. a fixing plate; 32. a second drive motor; 33. a transmission threaded rod; 34. a sliding seat; 35. a threaded transmission block; 36. a working barrel; 37. a hydraulic cylinder; 38. a gas pushing plate; 39. a flexible gasket; 40. a seal ring; 41. an exhaust hole; 42. an annular base; 43. a second driven pinion gear; 44. and a third transmission motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1-3, the present invention is a silicon wafer manufacturing apparatus, including a main body 1, further including:
the silicon wafer fixing mechanism 2 is used for automatically positioning and fixing the silicon wafer;
the silicon wafer fixing mechanism 2 comprises a silicon wafer adsorption mechanism 5, the silicon wafer adsorption mechanism 5 is used for fixing a silicon wafer, a silicon wafer positioning mechanism 6 is arranged on the silicon wafer adsorption mechanism 5 in a matched mode and used for automatically positioning the silicon wafer, and a weight detector 7 is arranged in the middle of the upper end of the silicon wafer adsorption mechanism 5 and used for detecting the weight of the silicon wafer positioning mechanism 6;
the silicon wafer positioning mechanism 6 consists of a lifting mechanism 8 and four silicon wafer guide mechanisms 9, the silicon wafer guide mechanisms 9 are connected with the silicon wafer adsorption mechanism 5 in a sliding mode, guide slopes are arranged at the upper ends of the silicon wafer guide mechanisms 9 and used for guiding the silicon wafers, and the lifting mechanism 8 is used for driving the silicon wafer guide mechanisms 9 to move vertically;
as shown in fig. 4-5, the lifting mechanism 8 includes a fixed support 17, a first driving motor 23 and four limit threaded rods 25, the four limit threaded rods 25 are fixed at the lower end of the silicon wafer guiding mechanism 9, the fixed support 17 is fixed at the lower end of the silicon wafer adsorbing mechanism 5, the fixed support 17 is rotatably connected with four threaded driving rings 18 inside, the threaded driving rings 18 are in threaded connection with the limit threaded rods 25, a first driven meshing gear ring 19 is arranged outside the threaded driving rings 18, an annular driving ring 20 is arranged outside the four first driven meshing gear rings 19, a first annular meshing gear ring 21 is arranged on the inner wall of the annular driving ring 20, and the first annular meshing gear ring 21 is in meshing connection with the first driven meshing gear ring 19;
in order to drive the annular transmission ring 20 to rotate, a second annular meshing gear ring 22 is arranged on the outer side of the annular transmission ring 20, a first transmission motor 23 is fixed at one end of the lower end of the silicon wafer adsorption mechanism 5, the first transmission motor 23 is electrically connected with the weight detector 7 through a lead, a first transmission gear 24 is fixedly connected to the output end of the first transmission motor 23, and the first transmission gear 24 is meshed with the second annular meshing gear ring 22;
further, as shown in fig. 4-6, the silicon wafer guiding mechanism 9 includes a fixed base 26, a fixed plate 31 is obliquely disposed at the upper end of the fixed base 26, a plurality of positioning rods 27 are disposed at both sides of the fixed plate 31, the outer sides of the positioning rods 27 are rotatably connected with rotating wheels 28, and a transmission belt 30 is disposed at the outer sides of the rotating wheels 28 located at the same side;
further, as shown in fig. 3 and fig. 7-10, the silicon wafer adsorbing mechanism 5 includes a rotating main board 10, four sliding cavities 13 are formed inside the rotating main board 10, a vacuum adsorbing mechanism 11 is disposed inside the sliding cavities 13, and the silicon wafer adsorbing mechanism 5 further includes a transmission mechanism 12 for driving the vacuum adsorbing mechanism 11 to move inside the sliding cavities 13;
the vacuum adsorption mechanism 11 comprises a working cylinder 36, a hydraulic cylinder 37 is fixedly connected to the lower end of the working cylinder 36, an output end of the hydraulic cylinder 37 penetrates through the working cylinder 36 and is fixedly connected with an air pushing plate 38, the air pushing plate 38 is located inside the working cylinder 36, a sealing ring 40 is arranged on the outer side of the air pushing plate 38, the sealing ring 40 is in transition fit with the working cylinder 36, a flexible gasket 39 is arranged at the upper end of the working cylinder 36, and a plurality of exhaust holes 41 are formed in the lower end of the working cylinder 36 and located on the periphery side of the hydraulic cylinder 37;
the transmission mechanism 12 comprises a sliding seat 34 and a second transmission motor 32, the second transmission motor 32 is fixedly connected to the outer side of the rotating main board 10, the output end of the second transmission motor 32 is fixedly connected with a transmission threaded rod 33, the sliding seat 34 is slidably connected to the inside of the sliding cavity 13, the vacuum adsorption mechanism 11 is fixed to the inside of the sliding seat 34, one side of the sliding seat 34 is fixedly connected with a threaded transmission block 35, and the threaded transmission block 35 is in threaded connection with the transmission threaded rod 33;
specifically, in order to more conveniently fix the second transmission motor 32, the outer side of the rotating main board 10 is provided with a motor support 16, the motor support 16 is in screw connection with the second transmission motor 32, a working cavity 15 is formed in the inner part of the rotating main board 10 and on one side of the sliding cavity 13, a transmission threaded rod 33 is rotatably connected in the working cavity 15, and a threaded transmission block 35 is slidably connected in the working cavity 15;
the rotating mechanism 4 is used for driving the silicon wafer fixing mechanism 2 to rotate;
referring to fig. 11, the rotating mechanism 4 includes a third transmission motor 44 and an annular base 42, the annular base 42 is rotatably connected to the upper end of the main body 1, a second driven gear 43 is disposed outside the annular base 42, the third transmission motor 44 is fixedly connected to the lower end of the main body 1, an output end of the third transmission motor 44 penetrates through the main body 1 and is fixedly connected to a second transmission gear 29, and the second transmission gear 29 is engaged with the second driven gear 43;
the silicon wafer detection mechanism 3 is used for detecting the flatness of the silicon wafer;
specifically, four corners of the lower end of the main body 1 are provided with supporting legs 14, and the main body 1 can be fixed more stably by the supporting legs 14.
Example two:
on the basis of the first embodiment, the use method of the silicon wafer manufacturing device is disclosed, and the steps are as follows:
the first step is as follows: placing a silicon wafer at the upper end of the silicon wafer fixing mechanism 2;
the second step is that: the second transmission motor 32 is started, the second transmission motor 32 can drive the transmission threaded rod 33 to rotate after being started, the transmission threaded rod 33 is in threaded connection with the threaded transmission block 35, the threaded transmission block 35 cannot rotate under the limitation of the sliding seat 34, the transmission threaded rod 33 can drive the sliding seat 34 to move inside the sliding cavity 13 through the threaded transmission block 35 when rotating, the sliding cavity 13 can drive the vacuum adsorption mechanism 11 to move together when moving, and the position of the vacuum adsorption mechanism 11 is adjusted;
the third step: when the first transmission motor 23 is started, the first transmission motor 23 drives the first transmission gear 24 to rotate, since the first transmission gear 24 and the second ring gear 22 are engaged with each other, the first transmission gear 24 rotates to drive the ring gear 20 to rotate via the second ring gear 22, and the ring gear 20 rotates to drive the first ring gear 21 to rotate together, because the first ring gear 21 is meshed with the first driven ring gear 19, the first ring gear 21 rotates to drive the screw driving ring 18 to rotate through the first driven ring gear 19, because the thread transmission ring 18 is in threaded connection with the limit threaded rod 25, and the limit threaded rod 25 cannot rotate under the limit of the silicon wafer guide mechanism 9, the limit threaded rod 25 can be driven to vertically move when the thread transmission ring 18 rotates, and the silicon wafer guide mechanism 9 can be driven to move together when the limit threaded rod 25 moves;
when the silicon wafer guide mechanism 9 makes the transmission belt 30 contact with the silicon wafer in the rising process, the silicon wafer guide mechanism can drive the silicon wafer to move, so that the silicon wafer moves towards the direction close to the middle position of the silicon wafer fixing mechanism 2, the silicon wafer is moved to the middle position of the upper end of the silicon wafer fixing mechanism 2, the silicon wafer is automatically positioned, and the transmission belt 30 correspondingly moves on the outer sides of the plurality of rotating wheels 28 in the moving process of the silicon wafer, so that the abrasion of the silicon wafer is greatly reduced;
when the silicon wafer rises, the silicon wafer is gradually separated from the weight detector 7, the weight of the silicon wafer detected by the weight detector 7 is rapidly reduced, and when the weight of the silicon wafer detected by the weight detector 7 is rapidly reduced, a control signal is sent to the first transmission motor 23 to control the first transmission motor 23 to drive the first transmission gear 24 to rotate reversely and drive the silicon wafer guide mechanism 9 to descend until the silicon wafer guide mechanism 9 moves to the lower end of the silicon wafer adsorption mechanism 5;
the fourth step: the hydraulic cylinder 37 is started, the hydraulic cylinder 37 drives the air pushing plate 38 to move in the working barrel 36 after being started, and the air pushing plate 38 can exhaust air in the working barrel 36 through the exhaust hole 41 in the moving process, so that a large negative pressure is generated between the air pushing plate 38 and the silicon wafer to adsorb the silicon wafer;
the fifth step: the third transmission motor 44 is started, the third transmission motor 44 drives the second transmission gear 29 to rotate after being started, because the second transmission gear 29 is meshed with the second driven gear 43, the second transmission gear 29 drives the annular base 42 to rotate together through the second driven gear 43 when rotating, and the annular base 42 drives the silicon wafer fixing mechanism 2 to rotate together when rotating, so that the silicon wafers at the upper end of the silicon wafer fixing mechanism 2 rotate at a constant speed;
and a sixth step: and starting the silicon wafer detection mechanism 3, wherein infrared rays are emitted by the silicon wafer detection mechanism 3 after the silicon wafer detection mechanism is started to detect the flatness of the side wall of the silicon wafer.
Through the cooperation of each accessory, can fix a position and adsorb the silicon chip automatically to carry out at the uniform velocity through driving the silicon chip and rotate, cooperation silicon chip detection mechanism 3 can effectually detect the roughness of silicon chip lateral wall, and the effectual testing result that has avoided leading to because the silicon chip off normal mistake appears, thereby great promotion the rate of accuracy that detects, and the degree of difficulty that detects is lower, brings very big facility for the user.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (10)
1. The silicon wafer manufacturing device comprises a machine body main body (1), and is characterized by further comprising:
the silicon wafer fixing mechanism (2) is used for automatically positioning and fixing the silicon wafer;
the silicon wafer fixing mechanism (2) comprises a silicon wafer adsorption mechanism (5), the silicon wafer adsorption mechanism (5) is used for fixing a silicon wafer, the silicon wafer adsorption mechanism (5) is provided with a silicon wafer positioning mechanism (6) in a matched mode and used for automatically positioning the silicon wafer, and a weight detector (7) is arranged in the middle of the upper end of the silicon wafer adsorption mechanism (5) and used for detecting the weight of the silicon wafer positioning mechanism (6);
the silicon wafer positioning mechanism (6) consists of a lifting mechanism (8) and four silicon wafer guide mechanisms (9), the silicon wafer guide mechanisms (9) are connected with the silicon wafer adsorption mechanism (5) in a sliding mode, guide slopes are arranged at the upper ends of the silicon wafer guide mechanisms (9) and used for guiding the silicon wafers, and the lifting mechanism (8) is used for driving the silicon wafer guide mechanisms (9) to move vertically;
the rotating mechanism (4) is used for driving the silicon wafer fixing mechanism (2) to rotate;
and the silicon wafer detection mechanism (3) is used for detecting the flatness of the silicon wafer.
2. The silicon wafer manufacturing device according to claim 1, wherein the lifting mechanism (8) comprises a fixed support (17), a first transmission motor (23) and four limit threaded rods (25), the four limit threaded rods (25) are fixed at the lower end of the silicon wafer guide mechanism (9), the fixed support (17) is fixed at the lower end of the silicon wafer adsorption mechanism (5), the fixed support (17) is rotatably connected with four thread transmission rings (18), the thread transmission rings (18) are in threaded connection with the limit threaded rods (25), a first driven meshing gear ring (19) is arranged on the outer side of each thread transmission ring (18), an annular transmission ring (20) is arranged on the outer side of each first driven meshing gear ring (19), a first annular meshing gear ring (21) is arranged on the inner wall of each annular transmission ring (20), the first annular meshing gear ring (21) is in meshing connection with the first driven meshing gear ring (19);
the silicon wafer adsorption device is characterized in that a second annular meshing gear ring (22) is arranged on the outer side of the annular transmission ring (20), the first transmission motor (23) is fixed at one end of the lower end of the silicon wafer adsorption mechanism (5), the first transmission motor (23) is electrically connected with the weight detector (7) through a lead, a first transmission meshing gear (24) is fixedly connected to the output end of the first transmission motor (23), and the first transmission meshing gear (24) is meshed with the second annular meshing gear ring (22).
3. The silicon wafer manufacturing device according to claim 1, wherein the silicon wafer guiding mechanism (9) comprises a fixed base (26), a fixed plate (31) is obliquely arranged at the upper end of the fixed base (26), a plurality of positioning rods (27) are arranged on both sides of the fixed plate (31), rotating wheels (28) are rotatably connected to the outer sides of the positioning rods (27), and a transmission belt (30) is arranged on the outer sides of the rotating wheels (28) on the same side.
4. The silicon wafer manufacturing device according to claim 1, wherein the silicon wafer adsorption mechanism (5) comprises a rotating main plate (10), four sliding cavities (13) are formed in the rotating main plate (10), a vacuum adsorption mechanism (11) is arranged in each sliding cavity (13), and the silicon wafer adsorption mechanism (5) further comprises a transmission mechanism (12) for driving the vacuum adsorption mechanism (11) to move in each sliding cavity (13).
5. The silicon wafer manufacturing device according to claim 4, wherein the vacuum adsorption mechanism (11) comprises a working cylinder (36), a hydraulic cylinder (37) is fixedly connected to the lower end of the working cylinder (36), an output end of the hydraulic cylinder (37) penetrates through the working cylinder (36) and is fixedly connected with an air pushing plate (38), the air pushing plate (38) is located inside the working cylinder (36), a sealing ring (40) is arranged on the outer side of the air pushing plate (38), the sealing ring (40) and the working cylinder (36) are in transition fit, a flexible gasket (39) is arranged at the upper end of the working cylinder (36), and a plurality of exhaust holes (41) are formed in the lower end of the working cylinder (36) and the periphery side of the hydraulic cylinder (37).
6. The silicon wafer manufacturing device according to claim 4, wherein the transmission mechanism (12) comprises a sliding seat (34) and a second transmission motor (32), the second transmission motor (32) is fixedly connected to the outer side of the rotating main plate (10), a transmission threaded rod (33) is fixedly connected to the output end of the second transmission motor (32), the sliding seat (34) is slidably connected to the inside of the sliding cavity (13), the vacuum adsorption mechanism (11) is fixed to the inside of the sliding seat (34), a threaded transmission block (35) is fixedly connected to one side of the sliding seat (34), and the threaded transmission block (35) is in threaded connection with the transmission threaded rod (33).
7. The silicon wafer manufacturing device according to claim 6, wherein a motor support (16) is disposed on an outer side of the rotating main plate (10), the motor support (16) is connected with the second transmission motor (32) through a screw, a working chamber (15) is opened inside the rotating main plate (10) and on one side of the sliding chamber (13), the transmission threaded rod (33) is rotatably connected inside the working chamber (15), and the threaded transmission block (35) is slidably connected inside the working chamber (15).
8. The silicon wafer manufacturing device according to claim 1, wherein the rotating mechanism (4) comprises a third transmission motor (44) and an annular base (42), the annular base (42) is rotatably connected to the upper end of the machine body (1), a second driven gear (43) is arranged on the outer side of the annular base (42), the third transmission motor (44) is fixedly connected to the lower end of the machine body (1), the output end of the third transmission motor (44) penetrates through the machine body (1) and is fixedly connected with a second transmission gear (29), and the second transmission gear (29) is in meshed connection with the second driven gear (43).
9. The silicon wafer manufacturing apparatus as set forth in claim 1, wherein the body (1) is provided with support legs (14) at four corners of the lower end thereof.
10. The use method of the silicon wafer manufacturing device is characterized by comprising the following steps:
s1: placing a silicon wafer at the upper end of the silicon wafer fixing mechanism (2);
s2: starting a second transmission motor (32), wherein the second transmission motor (32) can drive the vacuum adsorption mechanism (11) to move together after being started, and the position of the vacuum adsorption mechanism (11) is adjusted;
s3: starting the first transmission motor (23), wherein the first transmission motor (23) can drive the silicon wafer to move towards the direction close to the middle position of the silicon wafer fixing mechanism (2) after being started, and automatically position the silicon wafer;
when the silicon wafer rises, the weight of the silicon wafer detected by the weight detector (7) is rapidly reduced, and when the weight of the silicon wafer detected by the weight detector (7) is rapidly reduced, the first driving motor (23) is controlled to drive the silicon wafer guide mechanism (9) to be reduced until the silicon wafer guide mechanism (9) moves to the lower end of the silicon wafer adsorption mechanism (5);
s4: starting a hydraulic cylinder (37), discharging air in the working barrel (36) through an exhaust hole (41), and enabling a large negative pressure to be generated between an air pushing plate (38) and a silicon wafer to adsorb the silicon wafer;
s5: starting a third transmission motor (44), wherein the third transmission motor (44) can drive the silicon wafer fixing mechanism (2) to rotate together after being started, so that the silicon wafer at the upper end of the silicon wafer fixing mechanism (2) rotates at a constant speed;
s6: and (3) starting the silicon wafer detection mechanism (3), wherein infrared rays can be emitted to detect the flatness of the side wall of the silicon wafer after the silicon wafer detection mechanism (3) is started.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111298169.6A CN114199165A (en) | 2021-11-04 | 2021-11-04 | Manufacturing device of silicon wafer and using method thereof |
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| CN202111298169.6A CN114199165A (en) | 2021-11-04 | 2021-11-04 | Manufacturing device of silicon wafer and using method thereof |
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| CN114199165A true CN114199165A (en) | 2022-03-18 |
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| CN202111298169.6A Pending CN114199165A (en) | 2021-11-04 | 2021-11-04 | Manufacturing device of silicon wafer and using method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024041322A1 (en) * | 2022-08-25 | 2024-02-29 | Tcl Zhonghuan Renewable Energy Technology Co., Ltd. | Surface flatness detecting device for single crystal square rod |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024041322A1 (en) * | 2022-08-25 | 2024-02-29 | Tcl Zhonghuan Renewable Energy Technology Co., Ltd. | Surface flatness detecting device for single crystal square rod |
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