CN114779034A - Test equipment based on semiconductor wafer and MAP deviation detection method - Google Patents

Abstract

The invention belongs to the technical field of semiconductor wafer testing, and discloses a testing device based on a semiconductor wafer and a MAP deviation detection method. According to the invention, the open wafer placing and testing board facilitates the placing and taking out of the wafer, avoids the influence of the traditional groove positioning on the placing and taking out mode of the wafer, is safer and more convenient in detection work, improves the wafer taking and placing efficiency, can timely find the deflection conditions of the MAP and the wafer and timely correct the deflection conditions so as to facilitate the detection of the wafer by the PCM testing equipment main body, improves the accuracy and detection efficiency of the detection result, and meets the market use requirements.

Description

A semiconductor wafer-based test equipment and MAP map shift detection method

technical field

The invention relates to the technical field of semiconductor wafer testing, in particular to a semiconductor wafer-based testing device and a method for detecting deviation of a MAP map.

Background technique

Semiconductor is a product between insulators and conductors. After the semiconductor wafer is processed and produced, it needs to be tested for lamination and PCM to protect and detect the performance of the semiconductor wafer. When the semiconductor wafer is tested for PCM Often a MAP map needs to be established.

Existing test equipment positions the wafer by setting grooves that match the shape and size of the wafer. When placed normally, the grooves that just fit are often unable to be placed in sequence, and the placement posture is incorrect. It causes irreversible fracture damage to the wafer, and it is inconvenient to take out the semiconductor wafer after the test, which affects the test efficiency of the wafer, and when the wafer is placed in the wrong position, it does not have the correcting function, which affects the test result or cannot be tested. A semiconductor wafer-based test equipment and a MAP shift detection method are proposed to solve such problems.

SUMMARY OF THE INVENTION

In view of the related problems mentioned in the background art, the purpose of the present invention is to provide a semiconductor wafer-based test equipment and a MAP map shift detection method, so as to solve the problem of the existing test equipment for the placement of the wafer. The grooves with the same shape and size locate the wafer, which is inconvenient to take out the semiconductor wafer, and when the wafer is misplaced, it does not have the correcting function, which affects the test results or cannot be tested.

In order to solve the above problems, the present invention adopts the following technical solutions.

A testing equipment based on semiconductor wafers, comprising a PCM testing equipment main body, a movable cavity is arranged inside the PCM testing equipment main body, and first electric guide rails are fixedly connected to both sides of the inner wall of the movable cavity, and the two said Two second electric guide rails are installed between the first electric guide rails, a support rod is installed between the two second electric guide rails, a test base is rotatably connected between the two support rods, and a test base is installed on the test base There is a lifting device, and the top of the lifting device is fixedly connected with a wafer resting test board.

The main body of the PCM test equipment is equipped with a wafer displacement system and a MAP map shift detection system. The wafer displacement system includes a data processing module, an X-axis control module, a Y-axis control module and a Z-axis control module. The X-axis control module, the Y-axis control module and the Z-axis control module are all electrically connected with the data processing module, and the X-axis control module, the Y-axis control module and the Z-axis control module are respectively connected with the first electric guide rail, Two electric guide rails are electrically connected with the jacking device; the MAP map offset detection system includes a position detection module, a circle center data analysis module, a MAP map acquisition module, a comparison module and an offset command sending module, the position detection module, The MAP map acquisition module, the comparison module and the offset command sending module are all electrically connected with the circle center data analysis module, and the offset command sending module is electrically connected with the data processing module.

As a further description of the above technical solution:

The jacking device includes an electric push rod, the electric push rod is inserted into the test base and fixedly connected with the test base, the top of the test base is fixedly connected with a storage tube, and the inner side of the storage tube is slidably connected with a top. The top of the electric push rod and the ejector rod are fixedly connected with the wafer resting test board.

As a further description of the above technical solutions:

A servo motor is fixedly installed on the support rod on the right side, the output shaft of the servo motor is fixedly connected with a transmission gear, one side of the transmission gear is engaged with the test base, and there is an electrical connection between the servo motor and the data processing module. sexual connection.

As a further description of the above technical solutions:

A display module is fixedly installed on the main body of the PCM test equipment, the display module is electrically connected with the center data analysis module and the data processing module, and the display module is a liquid crystal touch display screen.

As a further description of the above technical solutions:

A positioning ring is arranged on the wafer resting test board, and a preset area is set on the top of the wafer resting test board through the positioning ring.

As a further description of the above technical solutions:

The MAP shift detection system further includes a preset module and a storage module, the circle center data analysis module and the preset module are both electrically connected to the storage module, and the preset module is electrically connected to the comparison module.

The present invention also proposes:

A MAP map shift detection method of a semiconductor wafer-based test equipment, comprising any of the above-mentioned test equipment, and the MAP map shift detection method includes the following steps:

Step 1. Place the semiconductor wafer on the preset area in the positioning circle on the wafer resting test board, and then the Z-axis control module drives the wafer resting test board to move down into the interior of the movable cavity, and cover the main body cover of the PCM test equipment. plate;

Step 2: Detect the position of the center of the semiconductor wafer on the wafer resting test board by the position detection module, and the MAP map acquisition module acquires the MAP map, and the detection data and the acquired data are uploaded. offset data;

Step 3: The offset command sending module sends the offset command to the data processing module according to the offset data, controls the operation of the X-axis control module and the Y-axis control module, controls the operation of the first electric guide rail and the second electric guide rail, and adjusts the wafer shelving test The position of the semiconductor wafer on the board, so that the center of the semiconductor wafer coincides with the center of the MAP map;

Step 4: Detect the deflection angle between the BIN item of the semiconductor wafer and the BIN item of the MAP map through the position detection module, upload the data processing module through the offset command sending module to control the rotation of the servo motor, correct the deflection angle, and then repeat steps 1 to 3 again , the center of the semiconductor wafer and the center of the MAP map coincide again and enter the next step;

Step 5. Test the semiconductor wafer through the main body of the PCM test equipment. After the test is completed, open the cover plate. The Y-axis control module controls the lifting device to drive the wafer resting test board to rise, and the semiconductor wafer is taken out to complete the semiconductor wafer. PCM test. Compared with the prior art, the advantages of the present invention are:

In this solution, the open wafer shelf test board facilitates the placement and removal of wafers, avoids the traditional slot positioning affecting the placement and removal of wafers, and makes inspection work safer and more convenient. To test the detection efficiency of the main body of the equipment, the wafer displacement system and the MAP map shift detection system work together to move the slightly offset wafer position, and the deflection of the MAP map and the wafer can be found in time, and the detection can be carried out. Timely correction to facilitate the detection of wafers by the main body of the PCM test equipment, improve the accuracy of detection results and detection efficiency, and meet market demand.

Description of drawings

Fig. 1 is the structural representation of the present invention;

Fig. 2 is the top sectional structure schematic diagram of the present invention;

FIG. 3 is a schematic diagram of the connection structure of the lifting device and the wafer resting test board according to the present invention;

FIG. 4 is a schematic diagram of the working principle of the present invention.

Description of the labels in the figure:

1. Main body of PCM test equipment; 2. Active cavity; 3. First electric guide rail; 4. Second electric guide rail; 5. Support rod; 6. Test base; 7. Jacking device; 71. Electric push rod; 72, Storage tube; 73, ejector pin; 8, wafer resting test board; 81, positioning ring; 9, wafer displacement system; 91, data processing module; 92, X-axis control module; 93, Y-axis control module; 94, Z-axis control module; 10, MAP map offset detection system; 101, position detection module; 102, circle center data analysis module; 103, MAP map acquisition module; 104, comparison module; 105, offset command sending module; 106, pre- Design module; 107, storage module; 11, servo motor; 12, transmission gear; 13, display module.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention;

Please refer to FIGS. 1-4 . In the present invention, a semiconductor wafer-based testing equipment includes a PCM testing equipment main body 1 . The PCM testing equipment main body 1 is provided with a movable cavity 2 inside, and both sides of the inner wall of the movable cavity 2 are fixed A first electric guide rail 3 is connected, two second electric guide rails 4 are installed between the two first electric guide rails 3, a support rod 5 is installed between the two second electric guide rails 4, and the two support rods 5 rotate between A test base 6 is connected, a jacking device 7 is installed on the test base 6, and a wafer resting test board 8 is fixedly connected to the top of the jacking device 7;

Inside the main body 1 of the PCM test equipment, a wafer displacement system 9 and a MAP shift detection system 10 are installed. The wafer displacement system 9 includes a data processing module 91 , an X-axis control module 92 , a Y-axis control module 93 and a Z-axis control module. Module 94, the X-axis control module 92, the Y-axis control module 93 and the Z-axis control module 94 are all electrically connected to the data processing module 91, the X-axis control module 92, the Y-axis control module 93 and the Z-axis control module 94 are respectively It is electrically connected with the first electric guide rail 3, the second electric guide rail 4 and the jacking device 7; the MAP map offset detection system 10 includes a position detection module 101, a circle center data analysis module 102, a MAP map acquisition module 103, and a comparison module 104 It is electrically connected with the offset command sending module 105, the position detection module 101, the MAP map acquisition module 103, the comparison module 104, the offset command sending module 105 and the circle center data analysis module 102, and the offset command sending module 105 is connected with the data processing module. Electrical connection between 91.

In the present invention, the open wafer resting test board 8 facilitates the placement and removal of wafers, avoids the traditional slot positioning affecting the placement and removal of wafers, makes inspection work safer and more convenient, and improves the efficiency of wafer picking and placement. To speed up the detection efficiency of the PCM test equipment main body 1, the wafer displacement system 9 cooperates with the MAP map offset detection system 10 to move the slightly offset wafer position, so that the MAP map and the wafer can be found in time. Deflection situation, and correct it in time, so as to facilitate the detection of the wafer by the main body 1 of the PCM test equipment, improve the accuracy of the detection result and the detection efficiency, and meet the needs of the market.

Please refer to FIG. 3, wherein: the jacking device 7 includes an electric push rod 71, the electric push rod 71 is inserted on the test base 6 and is fixedly connected with the test base 6, and the top of the test base 6 is fixedly connected with a storage tube 72, the storage tube An ejector rod 73 is slidably connected to the inner side of the 72 , and the tops of the electric push rod 71 and the ejector rod 73 are fixedly connected to the wafer resting test board 8 .

In the present invention, the operation of the electric push rod 71 is controlled by the Z-axis control module 94, thereby driving the lifting and lowering movement of the wafer resting test board 8 in the vertical direction, and adjusting according to the needs, which is convenient for the user to place the wafer resting test board 8. It is convenient for users to use the wafer for pick and place work.

Please refer to FIG. 2 and FIG. 3 , in which: a servo motor 11 is fixedly installed on the support rod 5 on the right side, a transmission gear 12 is fixedly connected to the output shaft of the servo motor 11, and one side of the transmission gear 12 is engaged with the test base 6, and the servo motor The motor 11 and the data processing module 91 are electrically connected.

In the present invention, the data processing module 91 controls the work of the servo motor 11, drives the transmission gear 12 to rotate, and uses the meshing of the transmission gear 12 with the test base 6 to change the angle of the wafer resting test board 8, thereby correcting the wafer resting test board 8 The angle of the upper wafer.

Please refer to FIG. 1 , wherein: a display module 13 is fixedly installed on the main body 1 of the PCM test equipment, and the display module 13 is electrically connected with the circle center data analysis module 102 and the data processing module 91 , and the display module 13 is a liquid crystal touch display screen.

In the present invention, the display module 13 can visually display the deflection of the center of the MAP map and the center of the wafer, and monitor the displacement of the wafer resting test board 8, so that detection problems can be observed in time, so as to save faults or mistakes in time, and the use is safe. Sex is higher.

Please refer to FIG. 2 , wherein: a positioning ring 81 is provided on the wafer resting test board 8 , and a preset area is set on the top of the wafer resting test board 8 through the positioning ring 81 .

In the present invention, the preset area planned by the positioning ring 81 can roughly prompt the inspector to place the wafer range, avoid excessive wafer placement deflection and cause the test device to fail to meet the correcting function, and ensure the normal use of the test device.

Please refer to FIG. 4 , wherein: the MAP shift detection system 10 further includes a preset module 106 and a storage module 107 , the center data analysis module 102 and the preset module 106 are both electrically connected to the storage module 107 , and the preset module 106 is electrically connected to the comparison module 104 .

In the present invention, the preset module 106 sets the upper limit of the number of errors in all BIN items, and the comparison module 104 compares the preset threshold with the number of errors in the actual test BIN items to determine the deflection of the wafer and the MAP map. The storage module 107 is used for Store test data and debug data, etc.

Referring to FIGS. 1-4, the present invention also provides a method for detecting a MAP shift of a semiconductor wafer-based test equipment, including any of the above-mentioned test equipment, and the method for detecting a MAP shift includes the following steps:

Step 1. Place the semiconductor wafer in the preset area of the positioning ring 81 on the wafer resting test board 8, and then the Z-axis control module 94 drives the wafer resting test board 8 to move down into the interior of the movable cavity 2, and cover it. PCM test equipment main body 1 cover;

Step 2: Detect the position of the center of the semiconductor wafer on the wafer resting test board 8 by the position detection module 101, the MAP map acquisition module 103 acquires the MAP map, and the detection data and the acquired data are uploaded to the circle center data analysis module 102 to analyze the center of the semiconductor wafer and the center of the semiconductor wafer. Offset data of the center of the MAP map;

Step 3: The offset command sending module 105 sends the offset command to the data processing module 91 according to the offset data, controls the operation of the X-axis control module 92 and the Y-axis control module 93, and controls the operation of the first electric guide rail 3 and the second electric guide rail 4 , adjust the position of the semiconductor wafer on the wafer resting test board 8, so that the center of the semiconductor wafer coincides with the center of the MAP map;

Step 4: Detect the deflection angle of the BIN item of the semiconductor wafer and the BIN item of the MAP map through the position detection module 101, upload the data processing module 91 through the offset command sending module 105 to control the rotation of the servo motor 11, correct the deflection angle, and then again Steps 1 to 3 are repeated, the center of the semiconductor wafer and the center of the MAP map overlap again and then enter the next step;

Step 5. Test the semiconductor wafer through the main body 1 of the PCM test equipment. After the test is completed, the cover is opened. The Y-axis control module 93 controls the lifting device 7 to work, drives the wafer resting test board 8 to rise, and takes out the semiconductor wafer. Completed semiconductor wafer PCM test.

The above description is only a preferred embodiment of the present invention; however, the protection scope of the present invention is not limited thereto. Any person skilled in the art who is familiar with the technical scope of the present invention, according to the technical solution of the present invention and its improvement concept, equivalently replaces or changes, should be covered within the protection scope of the present invention.

Claims (7)

1. A semiconductor wafer based test apparatus comprising a PCM test apparatus body (1), characterized in that: a movable cavity (2) is arranged in the PCM test equipment main body (1), first electric guide rails (3) are fixedly connected to two sides of the inner wall of the movable cavity (2), two second electric guide rails (4) are installed between the two first electric guide rails (3), a support rod (5) is installed between the two second electric guide rails (4), a test base (6) is rotatably connected between the two support rods (5), a jacking device (7) is installed on the test base (6), and a wafer placing test board (8) is fixedly connected to the top of the jacking device (7);

a wafer displacement system (9) and a MAP deviation detection system (10) are installed inside the PCM test equipment main body (1), the wafer displacement system (9) comprises a data processing module (91), an X-axis control module (92), a Y-axis control module (93) and a Z-axis control module (94), the X-axis control module (92), the Y-axis control module (93) and the Z-axis control module (94) are electrically connected with the data processing module (91), and the X-axis control module (92), the Y-axis control module (93) and the Z-axis control module (94) are respectively electrically connected with the first electric guide rail (3), the second electric guide rail (4) and the jacking device (7); the MAP deviation detection system (10) comprises a position detection module (101), a circle center data analysis module (102), a MAP acquisition module (103), a comparison module (104) and a deviation instruction sending module (105), wherein the position detection module (101), the MAP acquisition module (103), the comparison module (104) and the deviation instruction sending module (105) are electrically connected with the circle center data analysis module (102), and the deviation instruction sending module (105) is electrically connected with the data processing module (91).

2. The semiconductor wafer based test apparatus of claim 1, wherein: jacking device (7) include electric putter (71), electric putter (71) alternate on test base (6) and with test base (6) fixed connection, the top fixedly connected with of test base (6) accomodates pipe (72), the inboard sliding connection who accomodates pipe (72) has ejector pin (73), test panel (8) fixed connection is shelved with the wafer to the top of electric putter (71) and ejector pin (73).

3. The semiconductor wafer based test apparatus of claim 1, wherein: the supporting rod (5) on the right side is fixedly provided with a servo motor (11), an output shaft of the servo motor (11) is fixedly connected with a transmission gear (12), one side of the transmission gear (12) is meshed with the testing base (6), and the servo motor (11) is electrically connected with the data processing module (91).

4. The semiconductor wafer based test apparatus of claim 1, wherein: the PCM testing equipment comprises a PCM testing equipment main body (1), and is characterized in that a display module (13) is fixedly mounted on the PCM testing equipment main body (1), the display module (13) is electrically connected with a circle center data analysis module (102) and a data processing module (91), and the display module (13) is a liquid crystal touch display screen.

5. The semiconductor wafer based test apparatus of claim 1, wherein: the wafer placing and testing board (8) is provided with a positioning ring (81), and the top of the wafer placing and testing board (8) is provided with a preset area through the positioning ring (81).

6. The semiconductor wafer based test apparatus of claim 1, wherein: the MAP deviation detection system (10) further comprises a preset module (106) and a storage module (107), the circle center data analysis module (102) and the preset module (106) are electrically connected with the storage module (107), and the preset module (106) is electrically connected with the comparison module (104).

7. A MAP deviation detection method of a test equipment based on a semiconductor wafer is characterized in that: comprising a test device as claimed in any one of claims 1-6, the MAP offset detection method comprising the steps of:

step one, a semiconductor wafer is placed in a preset area in a positioning ring (81) on a wafer placing and testing board (8), then a Z-axis control module (94) drives the wafer placing and testing board (8) to move downwards to enter the interior of a movable cavity (2), and a cover plate of a PCM testing equipment main body (1) is covered;

step two, detecting the circle center position of a semi-conductive wafer on a wafer placing test board (8) through a position detection module (101), acquiring a MAP through a MAP acquisition module (103), and analyzing the deviation data of the circle center of the semiconductor wafer and the circle center of the MAP through a detected data and acquired data uploading circle center data analysis module (102);

thirdly, the offset instruction sending module (105) sends an offset instruction to the data processing module (91) according to the offset data, controls the X-axis control module (92) and the Y-axis control module (93) to operate, controls the first electric guide rail (3) and the second electric guide rail (4) to work, and adjusts the position of the semiconductor wafer on the wafer placing and testing board (8) to enable the center of the circle of the semiconductor wafer to coincide with the center of the circle of the MAP;

step four, detecting the deflection angle of the BIN item of the semiconductor wafer and the BIN item of the MAP through a position detection module (101), uploading a data processing module (91) through a deflection instruction sending module (105) to control a servo motor (11) to rotate, correcting the deflection angle, then repeating the steps one to three again, and entering the next step after the center of a circle of the semiconductor wafer is coincident with the center of a circle of the MAP again;

and step five, testing the semiconductor wafer through the PCM testing equipment main body (1), opening the cover plate after the testing is finished, controlling the jacking device (7) to work by the Y-axis control module (93), driving the wafer placing and testing plate (8) to ascend, taking out the semiconductor wafer, and finishing the PCM testing of the semiconductor wafer.

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