CN114779034A - Test equipment based on semiconductor wafer and MAP deviation detection method - Google Patents
Test equipment based on semiconductor wafer and MAP deviation detection method Download PDFInfo
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- CN114779034A CN114779034A CN202210388032.8A CN202210388032A CN114779034A CN 114779034 A CN114779034 A CN 114779034A CN 202210388032 A CN202210388032 A CN 202210388032A CN 114779034 A CN114779034 A CN 114779034A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
Abstract
The invention belongs to the technical field of semiconductor wafer testing, and discloses a testing device based on a semiconductor wafer and a MAP deviation detection method. According to the invention, the open wafer placing and testing board facilitates the placing and taking out of the wafer, avoids the influence of the traditional groove positioning on the placing and taking out mode of the wafer, is safer and more convenient in detection work, improves the wafer taking and placing efficiency, can timely find the deflection conditions of the MAP and the wafer and timely correct the deflection conditions so as to facilitate the detection of the wafer by the PCM testing equipment main body, improves the accuracy and detection efficiency of the detection result, and meets the market use requirements.
Description
Technical Field
The invention relates to the technical field of semiconductor wafer testing, in particular to a testing device based on a semiconductor wafer and a MAP (MAP mapping) deviation detection method.
Background
The semiconductor is a product between an insulator and a conductor, after processing and production, a semiconductor wafer is subjected to film pasting and PCM test for protecting and detecting the service performance of the semiconductor wafer, and the MAP graph is often required to be established when the semiconductor wafer is subjected to the PCM test.
The existing testing equipment positions the wafer by arranging the grooves which are in accordance with the shape and size of the wafer, when the wafer is normally placed, the grooves which are in accordance with the shape and size of the wafer cannot be sequentially placed, the placing posture does not cause irreversible fracture and damage to the wafer, the semiconductor wafer is inconvenient to take out after the detection, the testing efficiency of the wafer is influenced, and when the wafer is placed in a dislocation state, the wafer does not have a correction function, the testing result is influenced or the wafer cannot be tested, so that the testing equipment based on the semiconductor wafer and the MAP deviation detection method are provided for solving the problems.
Disclosure of Invention
The present invention is directed to a test apparatus based on a semiconductor wafer and a MAP offset detection method, so as to solve the problems that the existing test apparatus locates a wafer by setting a groove corresponding to the shape and size of the wafer for placing the wafer, so that the semiconductor wafer is inconvenient to take out, and when the wafer is placed in a misplaced position, the existing test apparatus does not have a correction function, thereby affecting the test result or failing to test.
In order to solve the above problems, the present invention adopts the following technical solutions.
The utility model provides a test equipment based on semiconductor wafer, includes PCM test equipment main part, the inside of PCM test equipment main part is provided with movable chamber, the first electronic guide rail of the equal fixedly connected with in both sides of activity intracavity wall, two install the electronic guide rail of two seconds between the electronic guide rail of first, two install the bracing piece between the electronic guide rail of second, two it is connected with test base to rotate between the bracing piece, the last jacking device of installing of test base, the top fixedly connected with wafer of jacking device is shelved and is surveyed the board.
The wafer displacement system and the MAP deviation detection system are installed inside the PCM test equipment main body, the wafer displacement system comprises a data processing module, an X-axis control module, a Y-axis control module and a Z-axis control module, the X-axis control module, the Y-axis control module and the Z-axis control module are all electrically connected with the data processing module, and the X-axis control module, the Y-axis control module and the Z-axis control module are respectively electrically connected with the first electric guide rail, the second electric guide rail and the jacking device; the MAP deviation detection system comprises a position detection module, a circle center data analysis module, a MAP acquisition module, a comparison module and a deviation instruction sending module, wherein the position detection module, the MAP acquisition module, the comparison module and the deviation instruction sending module are electrically connected with the circle center data analysis module, and the deviation instruction sending module is electrically connected with the data processing module.
As a further description of the above technical solution:
the jacking device comprises an electric push rod, the electric push rod is inserted on the test base and fixedly connected with the test base, the top of the test base is fixedly connected with a containing pipe, the inner side of the containing pipe is slidably connected with an ejector rod, and the top ends of the electric push rod and the ejector rod are fixedly connected with the wafer placing and testing plate.
As a further description of the above technical solution:
the servo motor is fixedly mounted on the supporting rod on the right side, a transmission gear is fixedly connected to an output shaft of the servo motor, one side of the transmission gear is meshed with the test base, and the servo motor is electrically connected with the data processing module.
As a further description of the above technical solution:
the PCM testing equipment comprises a PCM testing equipment body, and is characterized in that a display module is fixedly mounted on the PCM testing equipment body, the display module is electrically connected with a circle center data analysis module and a data processing module, and the display module is a liquid crystal touch display screen.
As a further description of the above technical solution:
the wafer placing test board is provided with a positioning ring, and the top of the wafer placing test board is provided with a preset area through the positioning ring.
As a further description of the above technical solution:
the MAP deviation detection system further comprises a preset module and a storage module, the circle center data analysis module and the preset module are electrically connected with the storage module, and the preset module is electrically connected with the comparison module.
The invention also proposes:
a MAP deviation detection method of a semiconductor wafer-based test equipment comprises any one of the test equipment, and the MAP deviation detection method comprises the following steps:
step one, a semiconductor wafer is placed in a preset area in a positioning ring on a wafer placing and testing board, then a Z-axis control module drives the wafer placing and testing board to move downwards to enter the interior of a movable cavity, and a PCM testing equipment main body cover plate is covered;
step two, detecting the circle center position of the semiconductor wafer on the wafer placing test board through a position detection module, acquiring an MAP (MAP) diagram through an MAP diagram acquisition module, and analyzing the offset data of the circle center of the semiconductor wafer and the circle center of the MAP diagram through a circle center data analysis module for uploading detection data and acquired data;
thirdly, the offset instruction sending module sends an offset instruction to the data processing module according to the offset data, controls the X-axis control module and the Y-axis control module to operate, controls the first electric guide rail and the second electric guide rail to work, and adjusts the position of the semiconductor wafer on the wafer placing test board to enable the center of the semiconductor wafer to coincide with the center of the MAP graph;
step four, detecting the deflection angle of the BIN item of the semiconductor wafer and the BIN item of the MAP by the position detection module, uploading data to the data processing module by the deflection instruction sending module to control the servo motor to rotate, correcting the deflection angle, repeating the steps from one step to three again, and enabling the center of the semiconductor wafer and the center of the MAP to coincide again and then enter the next step;
and step five, testing the semiconductor wafer through the PCM testing equipment main body, opening the cover plate after testing is finished, controlling the jacking device to work by the Y-axis control module, driving the wafer placing and testing plate to ascend, taking out the semiconductor wafer, and finishing PCM testing of the semiconductor wafer. Compared with the prior art, the invention has the advantages that:
this scheme, open wafer shelves the test panel and makes things convenient for placing and taking out the mode of wafer, avoid traditional groove location to influence placing and taking out of wafer, detection achievement is more safe convenient, improve getting of wafer simultaneously and put efficiency, accelerate PCM test equipment main part to its detection efficiency, wafer displacement system and MAP picture skew detecting system cooperation work, remove to the wafer position of slightly having the skew, discovery MAP picture that can be timely and the deflection condition of wafer, and in time revise, so that PCM test equipment main part is to the detection of wafer, improve the accuracy and the detection efficiency of testing result, satisfy market user demand.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic top cross-sectional view of the present invention;
FIG. 3 is a schematic view of a connection structure between the lifting device and the wafer resting test board according to the present invention;
fig. 4 is a schematic diagram of the working principle of the present invention.
The numbering in the figures illustrates:
1. a PCM test apparatus main body; 2. a movable cavity; 3. a first motorized rail; 4. a second motorized rail; 5. a support bar; 6. testing the base; 7. a jacking device; 71. an electric push rod; 72. a storage tube; 73. a top rod; 8. placing a test board on the wafer; 81. positioning rings; 9. a wafer displacement system; 91. a data processing module; 92. an X-axis control module; 93. a Y-axis control module; 94. a Z-axis control module; 10. MAP offset detection system; 101. a position detection module; 102. a circle center data analysis module; 103. a MAP graph acquisition module; 104. a comparison module; 105. an offset instruction transmitting module; 106. presetting a module; 107. a storage module; 11. a servo motor; 12. a transmission gear; 13. and a display module.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention;
referring to fig. 1-4, in the invention, a semiconductor wafer based test device comprises a PCM test device main body 1, a movable cavity 2 is arranged inside the PCM test device main body 1, first electric guide rails 3 are fixedly connected to both sides of the inner wall of the movable cavity 2, two second electric guide rails 4 are installed between the two first electric guide rails 3, a support rod 5 is installed between the two second electric guide rails 4, a test base 6 is rotatably connected between the two support rods 5, a jacking device 7 is installed on the test base 6, and a wafer placing test board 8 is fixedly connected to the top of the jacking device 7;
a wafer displacement system 9 and a MAP deviation detection system 10 are installed inside the PCM testing device main body 1, the wafer displacement system 9 includes a data processing module 91, an X-axis control module 92, a Y-axis control module 93 and a Z-axis control module 94, the X-axis control module 92, the Y-axis control module 93 and the Z-axis control module 94 are electrically connected with the data processing module 91, and the X-axis control module 92, the Y-axis control module 93 and the Z-axis control module 94 are respectively electrically connected with the first electric guide rail 3, the second electric guide rail 4 and the jacking device 7; the MAP deviation detecting system 10 includes a position detecting module 101, a circle center data analyzing module 102, a MAP obtaining module 103, a comparing module 104, and a deviation instruction sending module 105, wherein the position detecting module 101, the MAP obtaining module 103, the comparing module 104, and the deviation instruction sending module 105 are electrically connected to the circle center data analyzing module 102, and the deviation instruction sending module 105 is electrically connected to the data processing module 91.
According to the invention, the open wafer placing and testing board 8 is convenient for placing and taking out wafers, the placing and taking out mode of the wafers is prevented from being influenced by traditional groove positioning, the detection work is safer and more convenient, meanwhile, the wafer taking and placing efficiency is improved, the detection efficiency of the PCM testing equipment main body 1 is accelerated, the wafer displacement system 9 and the MAP deviation detection system 10 work in a matched mode, the position of the slightly deviated wafers is moved, the deflection conditions of the MAP and the wafers can be found in time, the correction is carried out in time, the wafers are conveniently detected by the PCM testing equipment main body 1, the accuracy and the detection efficiency of detection results are improved, and the market using requirements are met.
Please refer to fig. 3, in which: the jacking device 7 comprises an electric push rod 71, the electric push rod 71 is inserted on the test base 6 and fixedly connected with the test base 6, the top of the test base 6 is fixedly connected with a containing pipe 72, the inner side of the containing pipe 72 is slidably connected with a push rod 73, and the top ends of the electric push rod 71 and the push rod 73 are fixedly connected with the wafer placing test board 8.
In the invention, the Z-axis control module 94 controls the electric push rod 71 to work, so as to drive the wafer placing and testing board 8 to move up and down in the vertical direction, and the adjustment is carried out according to the requirement, thereby facilitating the picking and placing work of the wafer on the wafer placing and testing board 8 by a user and facilitating the use of the user.
Please refer to fig. 2 and fig. 3, wherein: a servo motor 11 is fixedly arranged on the supporting rod 5 on the right side, an output shaft of the servo motor 11 is fixedly connected with a transmission gear 12, one side of the transmission gear 12 is meshed with the testing base 6, and the servo motor 11 is electrically connected with the data processing module 91.
In the invention, the data processing module 91 controls the servo motor 11 to work to drive the transmission gear 12 to rotate, and the angle of the wafer placing test board 8 is changed by the meshing of the transmission gear 12 and the test base 6, so that the angle of the wafer on the wafer placing test board 8 is corrected.
Please refer to fig. 1, in which: the PCM test equipment main body 1 is fixedly provided with a display module 13, the display module 13 is electrically connected with the circle center data analysis module 102 and the data processing module 91, and the display module 13 is a liquid crystal touch display screen.
In the invention, the deflection condition of the circle center of the MAP graph and the circle center of the wafer can be visually displayed through the display module 13, the displacement of the wafer laying test board 8 is monitored, the detection problem can be timely observed, so that the fault or the error can be timely saved, and the use safety is higher.
Please refer to fig. 2, in which: the wafer placing and testing board 8 is provided with a positioning ring 81, and the top of the wafer placing and testing board 8 is provided with a preset area through the positioning ring 81.
In the invention, the preset area defined by the positioning ring 81 can roughly prompt the range of a detector for placing the wafer, so that the situation that the test device cannot meet the correction function due to overlarge wafer placing deflection is avoided, and the normal use of the test device is ensured.
Please refer to fig. 4, in which: the MAP deviation detecting system 10 further includes a preset module 106 and a storage module 107, the circle center data analyzing module 102 and the preset module 106 are electrically connected to the storage module 107, and the preset module 106 is electrically connected to the comparison module 104.
In the invention, the upper limit of the error number of all BIN items is set through the presetting module 106, the preset threshold value and the error number of actually tested BIN items are compared through the comparison module 104, the deflection of a wafer and a MAP is judged, and the storage module 107 is used for storing test data, debugging data and the like.
Referring to fig. 1-4, the present invention further provides a MAP offset detection method for a semiconductor wafer based test apparatus, including any one of the above test apparatuses, the MAP offset detection method comprising the steps of:
step one, a semiconductor wafer is placed in a preset area in 81 circles of a positioning ring on a wafer placing and testing board 8, then a Z-axis control module 94 drives the wafer placing and testing board 8 to move downwards into the movable cavity 2, and a cover plate of a PCM testing equipment main body 1 is covered;
step two, detecting the circle center position of the semi-conductive wafer on the wafer placing test board 8 through the position detection module 101, acquiring a MAP by the MAP acquisition module 103, and analyzing the offset data of the circle center of the semiconductor wafer and the circle center of the MAP by the detected data and acquired data uploading circle center data analysis module 102;
step three, the offset instruction sending module 105 sends an offset instruction to the data processing module 91 according to the offset data, controls the operation of the X-axis control module 92 and the Y-axis control module 93, controls the first electric guide rail 3 and the second electric guide rail 4 to work, and adjusts the position of the semiconductor wafer on the wafer placing test board 8 to enable the center of the semiconductor wafer to coincide with the center of the MAP;
step four, detecting the deflection angle of the BIN item of the semiconductor wafer and the BIN item of the MAP by the position detection module 101, uploading the deflection angle to the data processing module 91 by the deflection instruction sending module 105 to control the servo motor 11 to rotate, correcting the deflection angle, repeating the steps from one step to three again, and entering the next step after the center of the circle of the semiconductor wafer is coincident with the center of the circle of the MAP again;
and step five, testing the semiconductor wafer through the PCM testing equipment main body 1, opening the cover plate after the testing is finished, controlling the jacking device 7 to work by the Y-axis control module 93, driving the wafer placing and testing plate 8 to ascend, taking out the semiconductor wafer, and finishing the PCM testing of the semiconductor wafer.
The foregoing is only a preferred embodiment of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (7)
1. A semiconductor wafer based test apparatus comprising a PCM test apparatus body (1), characterized in that: a movable cavity (2) is arranged in the PCM test equipment main body (1), first electric guide rails (3) are fixedly connected to two sides of the inner wall of the movable cavity (2), two second electric guide rails (4) are installed between the two first electric guide rails (3), a support rod (5) is installed between the two second electric guide rails (4), a test base (6) is rotatably connected between the two support rods (5), a jacking device (7) is installed on the test base (6), and a wafer placing test board (8) is fixedly connected to the top of the jacking device (7);
a wafer displacement system (9) and a MAP deviation detection system (10) are installed inside the PCM test equipment main body (1), the wafer displacement system (9) comprises a data processing module (91), an X-axis control module (92), a Y-axis control module (93) and a Z-axis control module (94), the X-axis control module (92), the Y-axis control module (93) and the Z-axis control module (94) are electrically connected with the data processing module (91), and the X-axis control module (92), the Y-axis control module (93) and the Z-axis control module (94) are respectively electrically connected with the first electric guide rail (3), the second electric guide rail (4) and the jacking device (7); the MAP deviation detection system (10) comprises a position detection module (101), a circle center data analysis module (102), a MAP acquisition module (103), a comparison module (104) and a deviation instruction sending module (105), wherein the position detection module (101), the MAP acquisition module (103), the comparison module (104) and the deviation instruction sending module (105) are electrically connected with the circle center data analysis module (102), and the deviation instruction sending module (105) is electrically connected with the data processing module (91).
2. The semiconductor wafer based test apparatus of claim 1, wherein: jacking device (7) include electric putter (71), electric putter (71) alternate on test base (6) and with test base (6) fixed connection, the top fixedly connected with of test base (6) accomodates pipe (72), the inboard sliding connection who accomodates pipe (72) has ejector pin (73), test panel (8) fixed connection is shelved with the wafer to the top of electric putter (71) and ejector pin (73).
3. The semiconductor wafer based test apparatus of claim 1, wherein: the supporting rod (5) on the right side is fixedly provided with a servo motor (11), an output shaft of the servo motor (11) is fixedly connected with a transmission gear (12), one side of the transmission gear (12) is meshed with the testing base (6), and the servo motor (11) is electrically connected with the data processing module (91).
4. The semiconductor wafer based test apparatus of claim 1, wherein: the PCM testing equipment comprises a PCM testing equipment main body (1), and is characterized in that a display module (13) is fixedly mounted on the PCM testing equipment main body (1), the display module (13) is electrically connected with a circle center data analysis module (102) and a data processing module (91), and the display module (13) is a liquid crystal touch display screen.
5. The semiconductor wafer based test apparatus of claim 1, wherein: the wafer placing and testing board (8) is provided with a positioning ring (81), and the top of the wafer placing and testing board (8) is provided with a preset area through the positioning ring (81).
6. The semiconductor wafer based test apparatus of claim 1, wherein: the MAP deviation detection system (10) further comprises a preset module (106) and a storage module (107), the circle center data analysis module (102) and the preset module (106) are electrically connected with the storage module (107), and the preset module (106) is electrically connected with the comparison module (104).
7. A MAP deviation detection method of a test equipment based on a semiconductor wafer is characterized in that: comprising a test device as claimed in any one of claims 1-6, the MAP offset detection method comprising the steps of:
step one, a semiconductor wafer is placed in a preset area in a positioning ring (81) on a wafer placing and testing board (8), then a Z-axis control module (94) drives the wafer placing and testing board (8) to move downwards to enter the interior of a movable cavity (2), and a cover plate of a PCM testing equipment main body (1) is covered;
step two, detecting the circle center position of a semi-conductive wafer on a wafer placing test board (8) through a position detection module (101), acquiring a MAP through a MAP acquisition module (103), and analyzing the deviation data of the circle center of the semiconductor wafer and the circle center of the MAP through a detected data and acquired data uploading circle center data analysis module (102);
thirdly, the offset instruction sending module (105) sends an offset instruction to the data processing module (91) according to the offset data, controls the X-axis control module (92) and the Y-axis control module (93) to operate, controls the first electric guide rail (3) and the second electric guide rail (4) to work, and adjusts the position of the semiconductor wafer on the wafer placing and testing board (8) to enable the center of the circle of the semiconductor wafer to coincide with the center of the circle of the MAP;
step four, detecting the deflection angle of the BIN item of the semiconductor wafer and the BIN item of the MAP through a position detection module (101), uploading a data processing module (91) through a deflection instruction sending module (105) to control a servo motor (11) to rotate, correcting the deflection angle, then repeating the steps one to three again, and entering the next step after the center of a circle of the semiconductor wafer is coincident with the center of a circle of the MAP again;
and step five, testing the semiconductor wafer through the PCM testing equipment main body (1), opening the cover plate after the testing is finished, controlling the jacking device (7) to work by the Y-axis control module (93), driving the wafer placing and testing plate (8) to ascend, taking out the semiconductor wafer, and finishing the PCM testing of the semiconductor wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210388032.8A CN114779034A (en) | 2022-04-13 | 2022-04-13 | Test equipment based on semiconductor wafer and MAP deviation detection method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210388032.8A CN114779034A (en) | 2022-04-13 | 2022-04-13 | Test equipment based on semiconductor wafer and MAP deviation detection method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116183604A (en) * | 2023-04-24 | 2023-05-30 | 中国标准化研究院 | Semiconductor wafer detection mechanism and equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116183604A (en) * | 2023-04-24 | 2023-05-30 | 中国标准化研究院 | Semiconductor wafer detection mechanism and equipment |
| CN116183604B (en) * | 2023-04-24 | 2023-06-20 | 中国标准化研究院 | Semiconductor wafer detection mechanism and equipment |
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