CN114197242B - Wave-absorbing heat-conducting composite material and preparation method and application thereof - Google Patents
Wave-absorbing heat-conducting composite material and preparation method and application thereof Download PDFInfo
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- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
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- D21H19/00—Coated paper; Coating material
- D21H19/80—Paper comprising more than one coating
- D21H19/84—Paper comprising more than one coating on both sides of the substrate
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- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
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- D21H19/38—Coatings with pigments characterised by the pigments
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- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H19/00—Coated paper; Coating material
- D21H19/36—Coatings with pigments
- D21H19/44—Coatings with pigments characterised by the other ingredients, e.g. the binder or dispersing agent
- D21H19/46—Non-macromolecular organic compounds
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- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H21/00—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties
- D21H21/14—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties characterised by function or properties in or on the paper
Abstract
The invention discloses a wave-absorbing heat-conducting composite material and a preparation method and application thereof, belongs to the technical field of materials, and provides a wave-absorbing heat-conducting composite material which is of a sandwich structure, wherein the sandwich structure comprises a heat-conducting layer, a wave-absorbing layer and a filter paper layer, and the filter paper layer is positioned between the heat-conducting layer and the wave-absorbing layer; the sandwich structure is convenient for the wave absorbing layer and the heat conducting layer to independently exert respective advantages, and the heat conducting layer and the wave absorbing layer on the two side surfaces of the filter paper can be interwoven on the porous filter paper surface layer and have good compatibility, so that the interface compatibility of the sandwich structure and the wave absorbing and heat conducting performances of the two sides are improved; meanwhile, the middle layer is a filter paper layer, so that the prepared material has good flexibility and can be applied to flexible electronic circuits and electronic devices; in addition, the preparation method of the wave-absorbing heat-conducting composite material provided by the technical scheme of the invention adopts a coating mode, is simple to operate and is easy for industrial production.
Description
Technical Field
The invention belongs to the technical field of materials, and particularly relates to a wave-absorbing heat-conducting composite material as well as a preparation method and application thereof.
Background
Through development for more than ten years, the wave-absorbing and heat-conducting composite material is increasingly standardized and systematized, and industrial wave-absorbing and heat-conducting composite material products are also produced in a set and batch manner, so that the performance of the composite material is stably improved, and the composite material is applied to the field of military and civil electronic equipment. But still has some technical bottlenecks without breakthrough, and restricts the development of the whole industry. For example, the rapid development of the wave-absorbing and heat-conducting composite material is severely restricted by the problems that the material microstructure and the functional unit model are lacked, the general design theory cannot guide the actual industrial production, and the single-component filler with the heat-conducting and wave-absorbing functions is not available.
In order to improve the structure and performance of the wave-absorbing and heat-conducting composite material, many researches are carried out. CN202110576618.2 discloses an electromagnetic wave-absorbing heat-conducting composition, and the produced cellular nano NiO precursor is compounded with nitrogen-doped mesoporous carbon microspheres, and then the compound is calcined to obtain the nitrogen-doped mesoporous carbon microsphere loaded cellular structure. CN202010082833.2 discloses a boron nitride graphene polyimide composite wave-absorbing heat-conducting composite material, which obviously improves wave-absorbing heat-conducting property and stability. CN201510992447.6 can increase the filling amount of the heat conducting particles in the polysiloxane matrix by matching the first heat conducting particles and the second heat conducting particles with different average particle sizes, thereby overlapping a high-efficiency heat conducting network and increasing the heat transfer rate.
However, at present, there are many preparation methods for the mixed wave-absorbing and heat-conducting structure, but no report has been reported on how to prepare a wave-absorbing and heat-conducting composite material with a sandwich structure, in which the heat-conducting and wave-absorbing functions are matched with each other and the performances of the two materials are not weakened.
Disclosure of Invention
The invention aims to provide a wave-absorbing and heat-conducting composite material, a preparation method and application thereof, wherein the heat-conducting composite material and the wave-absorbing composite material can be matched with each other without mutually weakening respective performances.
In order to achieve the purpose, the invention adopts the technical scheme that: the wave-absorbing heat-conducting composite material is of a sandwich structure, the sandwich structure comprises a heat-conducting layer, a wave-absorbing layer and a filter paper layer, and the filter paper layer is located between the heat-conducting layer and the wave-absorbing layer.
The technical scheme of the invention provides a wave-absorbing and heat-conducting composite material with a sandwich structure, wherein a heat-conducting layer and a wave-absorbing layer are respectively arranged on two side surfaces of filter paper, on one hand, the wave-absorbing layer and the heat-conducting layer which are formed on the two side surfaces of the filter paper by the sandwich structure can be convenient for the two layers to independently exert respective advantages, on the other hand, the heat-conducting layer and the wave-absorbing layer on the two side surfaces of the filter paper can be interwoven on the surface layer of the porous filter paper and have good compatibility, so that the interface compatibility of the sandwich structure and the wave-absorbing and heat-conducting performances of the two surfaces are improved; meanwhile, the wave-absorbing and heat-conducting composite material with the paper structure provided by the invention has good flexibility.
As a preferred embodiment of the wave-absorbing heat-conducting composite material, the heat-conducting layer is formed by coating boron nitride nanosheet ink a, and the boron nitride nanosheet ink a comprises the following raw materials in parts by weight: 5-40 parts of boron nitride nanosheet, 20-50 parts of tert-butyl alcohol, 5-10 parts of glycerol and 0.1-2 parts of silane coupling agent; the wave absorbing layer is formed by coating MXene ceramic chip ink B, and the MXene ceramic chip ink B comprises the following raw materials in parts by weight: 15-50 parts of MXene ceramic chip, 20-50 parts of tert-butyl alcohol, 5-15 parts of glycerol and 0.1-2 parts of silane coupling agent.
As a preferred embodiment of the wave-absorbing and heat-conducting composite material, the apparent viscosity of the boron nitride nanosheet ink a is 3000-8000mpa · s; the MXene ceramic sheet ink B has an apparent viscosity of 2000 to 7000mpa s.
When the boron nitride nanosheet ink A and the MXene ceramic piece ink B are prepared from the raw materials in parts by weight, the apparent viscosities of the prepared boron nitride nanosheet ink A and the prepared MXene ceramic piece ink B can be guaranteed to be within the range, the heat conduction and wave absorption performances of the prepared boron nitride nanosheet ink A and the prepared MXene ceramic piece ink B can be guaranteed to be in an excellent state, and the prepared boron nitride nanosheet ink A and the prepared MXene ceramic piece ink B can be guaranteed to have good coating performance when the wave absorption heat conduction composite material is prepared through coating, so that the difficulty of the coating operation process is reduced, and the time of the coating process is saved.
As a preferred embodiment of the wave-absorbing and heat-conducting composite material, the silane coupling agent is KH-570.
As a preferred embodiment of the wave-absorbing and heat-conducting composite material, the preparation method of the boron nitride nanosheet comprises the following steps: stirring and dispersing boron nitride in a mixed solvent with the mass ratio of isopropanol to deionized water being 1.
As a preferred embodiment of the wave-absorbing and heat-conducting composite material, the mass-to-volume ratio of the boron nitride to the mixed solvent is 1: (900-1100 mL); the stirring speed is 25000 r/min, and the stirring time is 2h; the rotating speed of the centrifugation is 500r/min, and the time of the centrifugation is 45min; the suction filtration adopts a nylon filter membrane, the diameter of the nylon filter membrane is 40mm, and the aperture is 450nm; the drying is vacuum drying, the drying time is 8 hours, and the drying temperature is 60 ℃.
As a preferred embodiment of the wave-absorbing and heat-conducting composite material, the mass-to-volume ratio of the boron nitride to the mixed solvent is 1:1000mL.
As a preferred embodiment of the wave-absorbing and heat-conducting composite material, the preparation method of the MXene ceramic sheet comprises the following steps: reacting NH 4 BF 4 Dissolving in hydrochloric acid solution, and adding Ti under stirring 3 AlC 2 Continuously stirring for 30min, transferring to a hydrothermal reaction kettle, reacting at 180 ℃ for 2-16h in a nitrogen environment, naturally cooling to room temperature, centrifuging, collecting black precipitate, washing and drying to obtain a multilayer MXene; and then adding multiple layers of MXene into ultrapure water, vibrating for 2-3h in a clockwise direction under the protection of nitrogen, centrifuging for 15min at a rotation speed of 3500r/min, and taking a stable upper layer solution to obtain the MXene ceramic chip.
As the preferred embodiment of the wave-absorbing and heat-conducting composite material, NH is adopted 4 BF 4 、Ti 3 AlC 2 The mass volume ratio of the hydrochloric acid solution to the hydrochloric acid solution is 0.75g:0.25g:15mL; the mass concentration of the hydrochloric acid is 6mol/L; the mass body of the multi-layer MXene and ultrapure waterThe product ratio is 0.5g:10mL.
As a preferred embodiment of the wave-absorbing heat-conducting composite material, the wave-absorbing heat-conducting composite material comprises the following raw materials in parts by weight: 40-90 parts of boron nitride nanosheet ink A and 20-90 parts of MXene ceramic plate ink B.
As a preferred embodiment of the wave-absorbing heat-conducting composite material, the wave-absorbing heat-conducting composite material comprises the following raw materials in parts by weight: 60-80 parts of boron nitride nanosheet ink A and 50-70 parts of MXene ceramic chip ink B.
When the weight parts of the boron nitride nanosheet ink A and the MXene ceramic piece ink B are within the range, the obtained wave-absorbing and heat-conducting composite material can be ensured to have good wave-absorbing and heat-conducting properties; if the weight part of the boron nitride nanosheet ink A is small, the heat conducting property of the material is reduced, and if the weight part of the boron nitride nanosheet ink A is large, the heat conducting property is good, but the ink is difficult to mix uniformly, the adhesion strength of a paper surface is reduced, and the subsequent utilization and the stable storage of the wave-absorbing heat-conducting material are not facilitated; if the weight part of the MXene ceramic wafer ink B is less, the wave absorbing performance of the material is reduced, and if the weight part of the MXene ceramic wafer ink B is more, the ink is difficult to be uniformly mixed, the viscosity is reduced, and the wave absorbing performance of the material is reduced.
As a preferred embodiment of the wave-absorbing heat-conducting composite material, the wave-absorbing heat-conducting composite material comprises the following raw materials in parts by weight: 70 parts of boron nitride nanosheet ink A and 60 parts of MXene ceramic piece ink B.
When the weight parts of the boron nitride nanosheet ink A and the MXene ceramic piece ink B are the values, the wave-absorbing and heat-conducting composite material prepared by the method has optimal wave-absorbing performance and heat-conducting performance, wherein the heat-conducting performance can reach 9.4W/(m x k), and the wave-absorbing performance can reach-18.6 dB.
As the preferred embodiment of the wave-absorbing and heat-conducting composite material, the quantitative index of the filter paper used by the filter paper layer is 80-200g/cm 2 。
As the preferable embodiment of the wave-absorbing and heat-conducting composite material, the filter paper used in the filter paper layerThe quantitative index of (a) is 120g/cm 2 。
When the quantitative index of the filter paper used for the filter paper layer is within the above range, particularly 120g/cm 2 During the time, can provide good mechanical strength for the heat-conducting layer of paper both sides face and inhale the ripples layer and support and thickness medium, make things convenient for heat-conducting layer and inhale the ripples layer and interweave and fuse through the hole of paper, further promote the holistic heat conductivity and the wave absorption nature of material, can avoid again that the hole is too big or the paper is too thin to make heat-conducting layer and inhale the too much contact of ripples layer influence each other and reduce holistic performance.
In addition, the invention also provides a preparation method of the wave-absorbing heat-conducting composite material, which comprises the following steps: and respectively coating the boron nitride nanosheet ink A and the MXene ceramic piece ink B on two side surfaces of the filter paper, and drying to obtain the wave-absorbing and heat-conducting composite material.
As a preferable embodiment of the production method of the present invention, the coating amount of the coating is 10 to 100 g/cm 2 。
When the coating amount is within the range, the thickness of the heat conduction layer and the wave absorption layer is appropriate, the problem of too thin time cost can be avoided on one hand, and on the other hand, the phenomenon that the overall performance is not changed greatly and the phase change is reduced due to the fact that the heat conduction layer and the wave absorption layer which are caused by too thick are interwoven on the two side faces of the filter paper unevenly can be avoided.
As a preferred embodiment of the preparation method of the present invention, the preparation method of the boron nitride nanosheet ink a or the MXene ceramic sheet ink B includes the steps of: uniformly mixing the raw materials of the boron nitride nanosheet ink A or the MXene ceramic chip ink B, adding the mixture into a double-screw mixer, mixing and stirring, transferring the stirred mixture into a high-speed shearing machine, and stirring and mixing at a high speed to obtain the boron nitride nanosheet ink A or the MXene ceramic chip ink B.
As a preferable embodiment of the preparation method of the invention, the rotation speed of the mixing and stirring is 400-600rpm, and the time of the mixing and stirring is 30-60min; the high-speed stirring speed is 10000-15000rpm, and the high-speed stirring time is 10-30min.
As a preferred embodiment of the preparation method of the present invention, the drying is vacuum drying, and the temperature of the drying is 80-100 ℃.
In addition, the invention also provides application of the wave-absorbing and heat-conducting composite material in the fields of flexible electronic circuits and electronic devices.
Compared with the prior art, the invention has the following beneficial effects:
firstly, the method comprises the following steps: the wave-absorbing heat-conducting composite material provided by the invention has a sandwich structure, so that on one hand, the wave-absorbing layer and the heat-conducting layer which are formed on two side surfaces of the filter paper of the product can be convenient for the two layers to independently exert respective advantages, and on the other hand, the heat-conducting layer and the wave-absorbing layer on the two side surfaces of the filter paper can be interwoven on the surface layer of the porous filter paper and have good compatibility, so that the interface compatibility of the sandwich structure and the wave-absorbing and heat-conducting properties of the two sides are improved;
secondly, the method comprises the following steps: the wave-absorbing heat-conducting composite material provided by the technical scheme of the invention adopts a coating mode, is simple to operate and is easy for industrial production;
thirdly, the steps of: the wave-absorbing and heat-conducting composite material provided by the technical scheme of the invention takes paper as the middle layer of the sandwich, so that the prepared material has good flexibility and can be applied to flexible electronic circuits and electronic devices.
Detailed Description
To better illustrate the objects, technical solutions and advantages of the present invention, the present invention will be further described with reference to specific examples.
Example 1
The embodiment provides a wave-absorbing heat-conducting composite material which comprises the following raw materials in parts by weight: 70 parts of boron nitride nanosheet ink A and 60 parts of MXene ceramic chip ink B;
the boron nitride nanosheet ink A comprises the following raw materials in parts by weight: 25 parts of boron nitride nanosheet, 30 parts of tert-butyl alcohol, 8 parts of glycerol and 0.7 part of silane coupling agent;
the MXene ceramic chip ink B comprises the following raw materials in parts by weight: 25 parts of MXene ceramic chip, 30 parts of tert-butyl alcohol, 8 parts of glycerol and 0.7 part of silane coupling agent;
the preparation method comprises the following steps:
(1) Preparing boron nitride nanosheets: 1 g of boron nitride (99.5% by mass, particle size < 45 μm, alfa Aesar) was weighed and dispersed in 1000 cm 3 The mass ratio of isopropanol (analytically pure, tianjin Yongda chemical reagent Co., ltd.) to deionized water is 1; centrifuging the treated mixed solution at 500r/min for 45min, collecting supernatant 90% (volume fraction), and vacuum filtering with nylon filter membrane with diameter of 40mm and pore diameter of 450nm; transferring the powder on the filter membrane to a glass culture dish, and placing the glass culture dish in a vacuum drying oven at 60 ℃ for drying for 8 hours to obtain boron nitride nanosheets;
(2) Preparing the MXene ceramic chip: 0.75g of NH was weighed out 4 BF 4 Dissolved in 15mL of 6M HCl solution and then 0.25g of Ti was added under vigorous stirring 3 AlC 2 Adding the powder into the above solution, stirring for 30min, and mixing; then the reaction mixture is transferred into a 50 mL hydrothermal reaction kettle, and a certain amount of nitrogen is introduced to react for 2-16h at 180 ℃, and then the reaction mixture is naturally cooled to room temperature. The black precipitate was collected by centrifugation and washed several times with deionized water and absolute ethanol. Finally, the precipitate is dried under vacuum at 60 ℃ for 12 hours to obtain multi-layer MXene; weighing 0.5g of prepared multilayer MXene, adding the MXene into a conical flask containing 10mL of ultrapure water, and introducing a certain amount of nitrogen as protective gas to prevent the MXene from deteriorating; after sealing, shaking clockwise for 2-3h. Then centrifuging at a rotating speed of 3500r/min for 15min, and taking the upper-layer stable solution to obtain the MXene ceramic chip;
(3) Preparation of boron nitride nanosheet ink a: weighing 25 parts of boron nitride nanosheet, 30 parts of tert-butyl alcohol, 8 parts of glycerol and 0.7 part of KH-570, uniformly mixing, adding into a double-screw mixer, stirring at the rotating speed of 500rpm for 45min, transferring into a high-speed shearing machine, and stirring at the rotating speed of 12500rpm for 15min to obtain boron nitride nanosheet ink A; detecting according to a standard test method of the freeze-thaw viscosity stability of the ASTM D8020-2015 water-based ink and the ink carrier, and measuring that the apparent viscosity of the prepared boron nitride nanosheet ink A is 5500mPa s;
(4) Preparation of MXene ceramic chip ink B: weighing 25 parts of MXene ceramic chip, 30 parts of tert-butyl alcohol, 8 parts of glycerol and 0.7 part of KH-570, uniformly mixing, adding into a double-screw mixer, stirring at the rotating speed of 500rpm for 45min, transferring into a high-speed shearing machine, and stirring at the rotating speed of 12500rpm for 15min to obtain MXene ceramic chip ink B; detecting according to a standard test method of the freeze-thaw viscosity stability of the ASTM D8020-2015 water-based ink and the ink carrier, and measuring that the apparent viscosity of the MXene ceramic chip ink B obtained by preparation is 4500mPa s;
(5) Respectively mixing the boron nitride nanosheet ink A and the MXene ceramic chip ink B at a ratio of 50g/cm by adopting a screen printing method 2 Is applied to 120g/cm 2 And quantitatively arranging two side surfaces of the filter paper, and then placing the coated product in a vacuum drying oven at 80 ℃ for drying for 1 hour to obtain the wave-absorbing and heat-conducting composite material.
Example 2
The only difference between the present embodiment and embodiment 1 is that the weight portion of the boron nitride nanosheet ink a is 90 parts, and the weight portion of the MXene ceramic chip ink B is 90 parts.
Example 3
The only difference between the present embodiment and embodiment 1 is that the weight portion of the boron nitride nanosheet ink a is 60 parts, and the weight portion of the MXene ceramic chip ink B is 50 parts.
Example 4
The only difference between the present embodiment and embodiment 1 is that the weight portion of boron nitride nanosheet ink a is 80 parts, and the weight portion of MXene ceramic plate ink B is 70 parts.
Example 5
The only difference between the present embodiment and embodiment 1 is that the weight portion of the boron nitride nanosheet ink a is 40 parts, and the weight portion of the MXene ceramic chip ink B is 20 parts.
Example 6
The only difference between the present embodiment and embodiment 1 is that the weight portion of the boron nitride nanosheet ink a is 60 parts, and the weight portion of the MXene ceramic chip ink B is 40 parts.
Example 7
The only difference between the present embodiment and embodiment 1 is that the boron nitride nanosheet ink a comprises the following raw materials in parts by weight: 40 parts of boron nitride nanosheet, 45 parts of tert-butyl alcohol, 10 parts of glycerol and 2 parts of silane coupling agent; the apparent viscosity of the boron nitride nanosheet ink a is 7500 mpa · s;
the MXene ceramic chip ink B comprises the following raw materials in parts by weight: 45 parts of MXene ceramic chip, 45 parts of tert-butyl alcohol, 14 parts of glycerol and 1.5 parts of silane coupling agent; the MXene ceramic sheet ink B had an apparent viscosity of 6800 mpa s.
Example 8
The only difference between the present embodiment and embodiment 1 is that the boron nitride nanosheet ink a comprises the following raw materials in parts by weight: 8 parts of boron nitride nanosheet, 20 parts of tert-butyl alcohol, 5 parts of glycerol and 0.2 part of silane coupling agent, wherein the apparent viscosity of the boron nitride nanosheet ink A is 3500 mPa s;
the MXene ceramic chip ink B comprises the following raw materials in parts by weight: 15 parts of MXene ceramic chip, 20 parts of tert-butyl alcohol, 5 parts of glycerol and 0.2 part of silane coupling agent; the MXene ceramic sheet ink B had an apparent viscosity of 2600 mpa · s.
Comparative example 1
The only difference between the comparative example and the example 1 is that the weight part of the boron nitride nanosheet ink A is 100 parts, and the weight part of the MXene ceramic chip ink B is 110 parts.
Comparative example 2
The only difference between the comparative example and the example 1 is that the weight part of the boron nitride nanosheet ink A is 20 parts, and the weight part of the MXene ceramic chip ink B is 15 parts.
Comparative example 3
The only difference between the comparative example and the example 1 is that the boron nitride nanosheet ink A and the MXene ceramic wafer ink B are respectively printed at 200g/cm by using a screen printing method 2 The coating amount of (3) is 120g/cm 2 Both sides of the quantitative filter paper.
Comparative example 4
The only difference between the comparative example and the example 1 is that the boron nitride nanosheet ink A and the MXene ceramic wafer ink B are respectively printed at 50g/cm by using a screen printing method 2 The coating amount of (3) is up to 450g/cm 2 Both sides of the quantitative filter paper.
Comparative example 5
The only difference between the comparative example and the example 1 is that in the preparation process, 70 parts of the prepared boron nitride nanosheet ink A and 60 parts of MXene ceramic piece ink B are uniformly mixed and then coated on two sides of the filter paper.
Examples of effects
The wave-absorbing and heat-conducting composite materials prepared in the examples 1-8 and the comparative examples 1-5 are tested for heat conducting performance and wave-absorbing performance;
the heat conductivity is tested according to American standard ASTM D5470 Standard test method for Heat transfer characteristics of thermally conductive electrically insulating Material, the test principle is that a certain heat flow and pressure are applied to a sample to test the thickness of the sample and the temperature difference between a hot plate and a cold plate, so that the heat conductivity coefficient of the sample is obtained, and the test mode can simulate the actual use state and is close to the actual use scene;
the wave-absorbing performance is that the wave-absorbing performance of the heat-conducting wave-absorbing material is directly tested according to GJB 2038A-2011 & lt Radar wave-absorbing material reflectivity test method & gt, the method is the most widely used method for evaluating the performance of the wave-absorbing material in China, during the test, an electromagnetic wave signal is transmitted by a network analyzer through one antenna, the signal is transmitted to a sample to be tested and reflected out, the reflected signal is received by another antenna and sent to the network analyzer, and due to the action of the wave-absorbing material, a certain difference exists between the transmitting power and the receiving power, and the difference is converted into a numerical value with dB as a unit, namely the reflectivity of the sample;
the performance parameters obtained by the test are shown in table 1;
table 1: heat conduction and wave absorption performance test data table of wave absorption and heat conduction composite materials prepared in examples 1-8 and comparative examples 1-5
As can be seen from Table 1, when the adopted preparation parameters are within the range given by the invention, the heat conduction performance of the obtained composite material is more than 7.7W/(m x k), and the wave absorption performance is less than-15.2 dB, namely, the excellent heat conduction wave absorption performance is shown, wherein comprehensively, the parameters in the embodiment 1 and the comprehensive heat conduction wave absorption effect of the composite material obtained by the preparation method are optimal;
as can be seen from the data of example 1 and comparative examples 1 to 3, when the addition amounts of the boron nitride nanosheet ink a and the MXene ceramic chip ink B are too large or too small in parts by weight, or the coating amounts of the boron nitride nanosheet ink a and the MXene ceramic chip ink B are increased, the thermal conductivity and the wave absorption of the prepared composite material are obviously reduced; as can be seen from the data of the embodiment 1 and the comparative example 4, when the technical quantitative index of the filter paper is not within the range given by the invention, the heat conductivity and the wave absorbing performance of the prepared composite material are reduced to a certain extent; it can be seen from the data in example 1 and comparative example 5 that, when the boron nitride nanosheet ink a and the MXene ceramic sheet ink B are mixed and then coated, although both are added, the performance of the prepared composite material is not as excellent as that of the composite material prepared by respectively coating, which intuitively shows that the mixed coating of the two generates interference on the heat conduction and wave absorption performance, and the sandwich structure of the present invention can well avoid the interference phenomenon.
Finally, it should be noted that the above embodiments are intended to illustrate the technical solutions of the present invention and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (5)
1. The wave-absorbing heat-conducting composite material is characterized by being of a sandwich structure, wherein the sandwich structure comprises a heat-conducting layer, a wave-absorbing layer and a filter paper layer, and the filter paper layer is located between the heat-conducting layer and the wave-absorbing layer;
the wave-absorbing heat-conducting composite material comprises the following raw materials in parts by weight: 40-90 parts of boron nitride nanosheet ink A and 20-90 parts of MXene ceramic chip ink B; the apparent viscosity of the boron nitride nanosheet ink A is 3000-8000 mPas; the apparent viscosity of the MXene ceramic chip ink B is 2000-7000mPa s;
the quantitative index of the filter paper used in the filter paper layer is 80-200g/cm 2 ；
The heat conducting layer is formed by coating boron nitride nanosheet ink A, and the boron nitride nanosheet ink A comprises the following raw materials in parts by weight: 5-40 parts of boron nitride nanosheet, 20-50 parts of tert-butyl alcohol, 5-10 parts of glycerol and 0.1-2 parts of silane coupling agent;
the wave absorbing layer is formed by coating MXene ceramic chip ink B, and the MXene ceramic chip ink B comprises the following raw materials in parts by weight: 15-50 parts of MXene ceramic chip, 20-50 parts of tert-butyl alcohol, 5-15 parts of glycerol and 0.1-2 parts of silane coupling agent;
the silane coupling agent is KH-570;
the coating weight of the coating is 10-100 g/cm 2 。
2. The wave-absorbing heat-conducting composite material according to claim 1, which is characterized by comprising the following raw materials in parts by weight: 60-80 parts of boron nitride nanosheet ink A and 50-70 parts of MXene ceramic chip ink B.
3. The preparation method of the wave-absorbing heat-conducting composite material according to claim 1, characterized by comprising the following steps: and respectively coating the boron nitride nanosheet ink A and the MXene ceramic piece ink B on two side surfaces of the filter paper, and drying to obtain the wave-absorbing and heat-conducting composite material.
4. The production method according to claim 3, wherein the production method of the boron nitride nanosheet ink A or MXene ceramic sheet ink B comprises the steps of: uniformly mixing the raw materials of the boron nitride nanosheet ink A or the MXene ceramic chip ink B, adding the mixture into a double-screw mixer, mixing and stirring, transferring the stirred mixture into a high-speed shearing machine, and stirring and mixing to obtain the boron nitride nanosheet ink A or the MXene ceramic chip ink B.
5. The wave-absorbing heat-conducting composite material of claim 1 is applied to the fields of flexible electronic circuits and electronic devices.
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| CN202111595644.6A CN114197242B (en) | 2021-12-23 | 2021-12-23 | Wave-absorbing heat-conducting composite material and preparation method and application thereof |
| PCT/CN2022/078291 WO2023115695A1 (en) | 2021-12-23 | 2022-02-28 | Wave-absorbing thermally-conductive composite material, and preparation method therefor and use thereof |
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| CN202111595644.6A CN114197242B (en) | 2021-12-23 | 2021-12-23 | Wave-absorbing heat-conducting composite material and preparation method and application thereof |
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| WO2023115695A1 (en) | 2023-06-29 |
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