CN114193844A - Chip detection film and manufacturing method and detection method thereof - Google Patents
Chip detection film and manufacturing method and detection method thereof Download PDFInfo
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- CN114193844A CN114193844A CN202111393490.2A CN202111393490A CN114193844A CN 114193844 A CN114193844 A CN 114193844A CN 202111393490 A CN202111393490 A CN 202111393490A CN 114193844 A CN114193844 A CN 114193844A
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- 238000001514 detection method Methods 0.000 title claims abstract description 114
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 239000002994 raw material Substances 0.000 claims abstract description 56
- 229910052751 metal Inorganic materials 0.000 claims abstract description 53
- 239000002184 metal Substances 0.000 claims abstract description 53
- 239000000843 powder Substances 0.000 claims abstract description 47
- 230000001681 protective effect Effects 0.000 claims abstract description 46
- 239000004744 fabric Substances 0.000 claims abstract description 40
- 239000000835 fiber Substances 0.000 claims abstract description 40
- 239000007769 metal material Substances 0.000 claims abstract description 38
- 239000000853 adhesive Substances 0.000 claims abstract description 35
- 230000001070 adhesive effect Effects 0.000 claims abstract description 35
- 239000003822 epoxy resin Substances 0.000 claims abstract description 35
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 35
- 239000012528 membrane Substances 0.000 claims abstract description 11
- 238000002156 mixing Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 41
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 229910052709 silver Inorganic materials 0.000 claims description 20
- 239000004332 silver Substances 0.000 claims description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052737 gold Inorganic materials 0.000 claims description 18
- 239000010931 gold Substances 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000000227 grinding Methods 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims 3
- 239000002699 waste material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011895 specific detection Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2894—Aspects of quality control [QC]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
A chip detection membrane is composed of fiber cloth, a transparent protective film, a metal material, an epoxy resin adhesive and metal powder, and is characterized in that the fiber cloth, the transparent protective film and the metal material account for 77% of the total mass of the raw materials; wherein the fiber cloth accounts for 48-52% of the total mass of the raw materials; the transparent protective film accounts for 10-14% of the total mass of the raw materials; the metal material accounts for 13-17% of the total mass of the raw materials; the epoxy resin adhesive and the metal powder are stirred and mixed, and the total mass of the epoxy resin adhesive and the metal powder is 23 percent of the total mass of the raw materials after mixing; wherein the epoxy resin adhesive accounts for 7-14% of the total mass of the raw materials; the metal powder accounts for 9-16% of the total mass of the raw materials; the detection film is used by being combined with a laser detector, so that whether the chip is qualified or not can be accurately detected; the problem that the chip is found after the chip is assembled can be avoided, the use cost, manpower and material resources are reduced, and more economic losses are avoided.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to a chip detection film and a manufacturing method and a detection method thereof.
Background
The chip can not be well detected whether to be qualified or not after being produced, and a problem is found only after the chip is assembled and tested, so that great loss and waste can be caused; increases the use cost and subsequent uncertainty; if the chip is assembled after being detected to be qualified, the subsequent assembly due to unqualified chip can not cause more material waste and more economic loss in use; because of this, many chips produced by chip manufacturers are not easy to confirm the defective rate, and therefore they are not easy to sell.
Based on the above, the invention provides a chip detection film, a manufacturing method thereof and a detection method thereof, so as to solve the above problems.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a chip detection film, a manufacturing method thereof and a detection method thereof, which can effectively solve the problems in the background art.
In order to solve the problems, the technical scheme adopted by the invention is as follows: a chip detection membrane is composed of fiber cloth, a transparent protective film, a metal material, an epoxy resin adhesive and metal powder, and is characterized in that the fiber cloth, the transparent protective film and the metal material account for 77% of the total mass of the raw materials; wherein the fiber cloth accounts for 48-52% of the total mass of the raw materials; the transparent protective film accounts for 10-14% of the total mass of the raw materials; the metal material accounts for 13-17% of the total mass of the raw materials; the epoxy resin adhesive and the metal powder are stirred and mixed, and the total mass of the epoxy resin adhesive and the metal powder is 23 percent of the total mass of the raw materials after mixing; wherein the epoxy resin adhesive accounts for 7-14% of the total mass of the raw materials; the metal powder accounts for 9-16% of the total mass of the raw materials.
As a further preferable aspect of the present invention, the metal material includes aluminum, copper, silver, gold; the metal powder comprises aluminum powder, copper powder, silver powder, gold powder and nickel powder.
As a further preferable scheme of the invention, the using amount of the aluminum accounts for 13-17% of the total mass of the raw materials; the aluminum powder, the copper powder, the silver powder, the gold powder and the nickel powder are mixed according to the ratio of 1:1, and the mixed dosage accounts for 9-16% of the total mass of the raw materials.
As a further preferable scheme of the invention, the using amount of the silver accounts for 13-17% of the total mass of the raw materials; the silver powder and the copper powder are mixed according to the ratio of 1:1, and the mixed dosage accounts for 9-16% of the total mass of the raw materials.
As a further preferable scheme of the invention, the gold and the silver are mixed according to the ratio of 1:1, and the mixed dosage accounts for 13-17% of the total mass of the raw materials; the gold powder and the silver powder are mixed according to the ratio of 1:1, and the mixed dosage accounts for 9-16% of the total mass of the raw materials.
The invention also relates to a manufacturing method of the chip detection film, which is used for finishing the manufacturing of the chip detection film and comprises the following steps:
s1, fiber cloth metal plating material: plating a metal material on the surface of the fiber cloth;
s2, manufacturing a conductive layer: adding metal powder into the epoxy resin adhesive, and then stirring and mixing the epoxy resin adhesive and the metal powder uniformly;
s3, grinding the mixture: pouring the mixture of the epoxy resin adhesive and the metal powder in the step S2 into a grinder for grinding;
s4, manufacturing a chip detection surface: adding the mixture ground in the step S3 to the fiber cloth plated with the metal material in the step S1, and then leveling to form a detection surface;
s5, high-temperature baking: drying the fiber cloth scraped off in the step S4 at high temperature to fix the detection surface;
s6, pasting a transparent protective film: sticking a transparent protective film on the detection surface of the fiber cloth;
s7, laminating a protective film by a press machine: and pressing and rotating the transparent protective film through a pressing and rotating machine to enable the transparent protective film to be tightly attached to the detection surface.
The invention also relates to a chip detection method, which uses the chip detection film for detection and comprises the following steps:
a1, tearing the protective film: tearing off the transparent protective film of the detection film to leak out of the detection surface;
a2, chip placement and detection membrane: attaching a chip to be detected to the detection surface of the detection film, and then placing the detection film on a platform of a laser detector;
a3, power on: contacting a ground wire of a laser detector with a detection surface to electrify the detection surface;
a4, irradiating the chip with laser: after the detection surface is electrified with the laser detector, irradiating the chip on the detection film by the laser detector;
a5, judging whether the chip is qualified: and judging whether the chip is qualified or not according to the feedback of the laser detector after irradiation.
Compared with the prior art, the invention provides a chip detection film, a manufacturing method and a detection method thereof, and the chip detection film has the following beneficial effects:
the detection film is used by being combined with a laser detector, so that whether the chip is qualified or not can be accurately detected; the problem that the chip is found after the chip is assembled can be avoided, the use cost, manpower and material resources are reduced, and more economic losses are avoided.
Drawings
FIG. 1 is an overall flow chart of the present invention;
FIG. 2 is a schematic view of a detection membrane according to the present invention;
wherein: 1. and (3) a detection film 2 and a transparent protective film.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-2, the invention provides a chip detection film, which is composed of a fiber cloth, a transparent protective film 2, a metal material, an epoxy resin adhesive and metal powder, and is characterized in that the metal material is plated on the surface of the fiber cloth; the epoxy resin adhesive is used for mixing with metal powder and spraying the mixture to the surface of the fiber cloth plated with the metal material to form a detection surface; the transparent protective film 2 is used for being attached to a detection surface; the fiber cloth, the transparent protective film 2 and the metal material account for 77 percent of the total mass of the raw materials; wherein the fiber cloth accounts for 48-52% of the total mass of the raw materials; the transparent protective film 2 accounts for 10-14% of the total mass of the raw materials; the metal material accounts for 13-17% of the total mass of the raw materials; the epoxy resin adhesive and the metal powder are stirred and mixed, and the total mass of the epoxy resin adhesive and the metal powder is 23 percent of the total mass of the raw materials after mixing; wherein the epoxy resin adhesive accounts for 7-14% of the total mass of the raw materials; the metal powder accounts for 9-16% of the total mass of the raw materials.
The fiber cloth is mixed with a metal plating material, metal powder and an epoxy resin adhesive and scraped to the surface of the fiber cloth plated with the metal material, so that the fiber cloth has conductivity and viscosity.
As a further preferable aspect of the present invention, the metal material includes aluminum, copper, silver, gold, or a mixture of two thereof; the metal powder comprises aluminum powder, copper powder, silver powder, gold powder, nickel powder or a mixture of two of the aluminum powder, the copper powder, the silver powder, the gold powder and the nickel powder; when the detection film 1 is manufactured, specific metal materials and metal powder are selected according to the size of a chip to be detected; the sizes of the chips are specifically divided into three types: the chip is less than or equal to 7nm, the chip is more than 7nm and less than 14nm, and the chip is more than or equal to 14 nm.
As a further preferable aspect of the present invention, when the detected chip size is greater than or equal to 14nm, the metal material selected for manufacturing the detection film 1 is aluminum, and the selected metal powder is aluminum powder, copper powder, silver powder, gold powder, and nickel powder; the using amount of the aluminum accounts for 13-17% of the total mass of the raw materials; the aluminum powder, the copper powder, the silver powder, the gold powder and the nickel powder are mixed according to the ratio of 1:1, and the mixed dosage accounts for 9-16% of the total mass of the raw materials.
As a further preferable scheme of the present invention, when the detected chip size is larger than 7nm and smaller than 14nm, the metal material selected for manufacturing the detection film 1 is silver or "silver + copper", the proportion of copper is less, and the metal powder selected is silver powder and copper powder; the silver accounts for 13-17% of the total mass of the raw materials; when the plated metal is silver and copper, the using amount of the silver is reduced adaptively, and the using amount of the silver and the copper accounts for 13 to 17 percent of the total mass of the raw materials; the silver powder and the copper powder are mixed according to the ratio of 1:1, and the mixed dosage accounts for 9-16% of the total mass of the raw materials.
As a further preferable scheme of the present invention, when the detected chip size is less than or equal to 7nm, the metal material selected for manufacturing the detection film 1 is gold or silver, and the metal powder selected for manufacturing the detection film is gold powder or silver powder; the gold and the silver are mixed according to the ratio of 1:1, and the mixed dosage accounts for 13-17% of the total mass of the raw materials; the gold powder and the silver powder are mixed according to the ratio of 1:1, and the mixed dosage accounts for 9-16% of the total mass of the raw materials.
Or when the detected chip size is less than or equal to 7nm, the selected metal material can only singly select gold, and the selected metal powder can also only singly select gold powder; the using amount of the gold accounts for 13-17% of the total mass of the raw materials; the using amount of the gold powder accounts for 9-16% of the total mass of the raw materials; however, in the economic aspect, the economy of singly selecting gold and gold powder is higher than that of the gold and silver mixed use, and experiments prove that the conductive effect achieved by mixing the gold and silver powder according to the proportion of 1:1 by adopting the combination of the gold and the silver is the same as that achieved by singly adopting the gold.
Therefore, when the detected chip size is less than or equal to 7nm, one of the schemes of "gold" or "gold + silver" can be selected for use according to actual conditions.
The invention also relates to a manufacturing method of the chip detection film, which is used for finishing the manufacturing of the chip detection film and comprises the following steps:
s1, fiber cloth metal plating material: plating a metal material on the surface of the fiber cloth;
s2, manufacturing a conductive layer: adding metal powder into the epoxy resin adhesive, and then stirring and mixing the epoxy resin adhesive and the metal powder uniformly;
s3, grinding the mixture: pouring the mixture of the epoxy resin adhesive and the metal powder in the step S2 into a grinder for grinding;
s4, manufacturing a chip detection surface: adding the mixture ground in the step S3 to the fiber cloth plated with the metal material in the step S1, and then leveling to form a detection surface;
s5, high-temperature baking: drying the fiber cloth scraped off in the step S4 at high temperature to fix the detection surface;
s6, pasting a transparent protective film 2: sticking a transparent protective film 2 on the detection surface of the fiber cloth;
s7, laminating a protective film by a press machine: the transparent protective film 2 is pressed and rotated by a pressing and rotating machine, so that the transparent protective film 2 is tightly attached to the detection surface.
The step S4 further includes a scheme: adding the mixture ground in the step S3 to the transparent protective film 2, and then leveling; and (4) if the mixture ground in the step (3) is added on the transparent protective film 2, directly entering the step (S7), and then performing pressure rotation through a pressure rotating machine to press and rotate the fiber cloth and the transparent protective film 2 so that the detection surface is tightly attached between the fiber cloth and the protective film.
The high temperature in the step S5 comprises 130 ℃ and 160 ℃, and the proper temperature is selected according to the size of the chip to be detected;
when the detected chip size is greater than or equal to 14nm, the temperature used in step S5 is 130 ℃;
when the detected chip size is larger than 7nm and smaller than 14nm, the temperature adopted in the step S5 is 160 ℃;
when the detected chip size is less than or equal to 7nm, the temperature used in step S5 is 160 ℃;
in the steps S1 to S7, all the links are performed in a clean room, so that the influence of some uncertain factors in the process of manufacturing the detection film 1 on the problem of the detection film after being manufactured and the influence on the detection accuracy can be prevented.
The invention also relates to a chip detection method, which uses the chip detection film for detection and comprises the following steps:
a1, tearing the protective film: tearing off the transparent protective film 2 of the detection film 1 to leak out of the detection surface;
a2, chip placement, detection membrane 1: attaching a chip to be detected to the detection surface of the detection film 1, and then placing the detection film 1 on a platform of a laser detector;
a3, power on: contacting a ground wire of a laser detector with a detection surface to electrify the detection surface; the switched-on power supply is 8V-12V, and a proper power supply is selected according to the actually detected chip;
a4, irradiating the chip with laser: after the detection surface is electrified with the laser detector, the chip on the detection film 1 is irradiated by the laser detector;
a5, judging whether the chip is qualified: judging whether the chip is qualified or not according to feedback after irradiation of the laser detector; after the laser irradiates the chip, if the laser detector generates a buzzing alarm sound, the chip is not electrified, and the chip is unqualified; and if the laser detector does not generate a buzzing alarm sound after irradiating the chip, the chip is powered on and qualified.
As one specific embodiment 1 of the present invention:
when the detection film 1 is manufactured, the whole process needs to be finished in a dust-free workshop, and the influence of some uncertain factors in the process of manufacturing the detection film 1 on the occurrence of problems after the detection film 1 is manufactured and the influence on the detection accuracy can be prevented.
Preparing materials such as fiber cloth, the transparent protective film 2, the metal material, the epoxy resin adhesive and the metal powder, and then selecting the metal material and the metal powder according to the size of the chip to be detected.
Wherein, the fiber cloth, the transparent protective film 2 and the metal material account for 77 percent of the total mass of the raw materials; the epoxy resin adhesive and the metal powder are stirred and mixed, and the total mass of the epoxy resin adhesive and the metal powder is 23 percent of the total mass of the raw materials after mixing.
Wherein, the fiber cloth accounts for 48 to 52 percent, the transparent protective film 2 accounts for 10 to 14 percent, and the metal material accounts for 13 to 17 percent; 7-14% of epoxy resin adhesive and 9-16% of metal powder.
When the detected chip size is greater than or equal to 14nm, the selected metal material is aluminum, and the selected metal powder is aluminum powder, copper powder, silver powder, gold powder and nickel powder.
When the detected chip size is larger than 7nm and smaller than 14nm, the selected metal material is silver, and the selected metal powder is silver powder and copper powder.
When the detected chip size is less than or equal to 7nm, the selected metal material is gold or gold + silver, and the selected metal powder is gold powder or gold powder + silver powder.
As one specific embodiment 2 of the present invention:
in this embodiment, taking the detected chip size as an example of being greater than or equal to 14nm, taking the fiber cloth as an example of accounting for 50% of the total mass of the raw materials, the transparent protective film 2 as an example of accounting for 12% of the total mass of the raw materials, the metal material as an example of accounting for 15% of the total mass of the raw materials, the epoxy resin adhesive as an example of accounting for 10% of the total mass of the raw materials, and the metal powder as an example of accounting for 13% of the total mass of the raw materials, the detection film 1 is manufactured.
After selecting metal materials and metal powder, plating metal aluminum on the fiber cloth by adopting an electroplating process, and then mixing aluminum powder, copper powder, silver powder, gold powder and nickel powder according to the proportion of 1: 1; adding the mixed metal powder into the epoxy resin adhesive to be mixed with the epoxy resin adhesive, and then uniformly stirring; pouring the mixture of the epoxy resin adhesive and the metal powder into a grinder for grinding, and then adding the ground mixture to the electroplated fiber cloth to manufacture a detection surface; and (3) leveling, drying at a high temperature of 130 ℃ to shape and fix the detection surface, then attaching a transparent protective film 2 to the detection surface, and finally attaching the transparent protective film 2 to the detection surface through a large-scale press-rotating machine to manufacture the detection film 1.
The detection film 1 of the invention is matched with a laser detector for use, so that whether the chip is qualified or not can be accurately detected, and the specific detection mode is as follows:
tearing off the transparent protective film 2 of the chip detection film 1 to leak out of the detection surface, and then attaching a chip to be detected to the detection surface; then the detection film 1 is placed on a platform of a laser detector, and a ground wire of the laser detector is contacted with a detection surface of the detection film 1 to electrify the detection surface; irradiating the chip on the detection film 1 by laser, wherein when the laser detector sends out a buzzing alarm sound, the chip is not electrified and is unqualified, and then indicating which chip is unqualified by the laser; if there is no reaction after irradiation, the chip is powered on and the chip is qualified.
By using the detection film 1 to be matched with a laser detector, the problem that whether the chip is qualified or not can not be well detected after the chip is produced can be well solved; the problem that the chip is found after the chip is assembled and some subsequent problems can be avoided, the use cost and the manpower and material resources are reduced, and more economic losses are avoided.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. A chip detection membrane is composed of fiber cloth, a transparent protective film, a metal material, an epoxy resin adhesive and metal powder, and is characterized in that the fiber cloth, the transparent protective film and the metal material account for 77% of the total mass of the raw materials; wherein the fiber cloth accounts for 48-52% of the total mass of the raw materials; the transparent protective film accounts for 10-14% of the total mass of the raw materials; the metal material accounts for 13-17% of the total mass of the raw materials; the epoxy resin adhesive and the metal powder are stirred and mixed, and the total mass of the epoxy resin adhesive and the metal powder is 23 percent of the total mass of the raw materials after mixing; wherein the epoxy resin adhesive accounts for 7-14% of the total mass of the raw materials; the metal powder accounts for 9-16% of the total mass of the raw materials.
2. The chip detection membrane of claim 1, wherein the metal material comprises aluminum, copper, silver, gold; the metal powder comprises aluminum powder, copper powder, silver powder, gold powder and nickel powder.
3. The chip detection membrane of claim 2, wherein the amount of aluminum is 13-17% of the total mass of the raw materials; the aluminum powder, the copper powder, the silver powder, the gold powder and the nickel powder are mixed according to the ratio of 1:1, and the mixed dosage accounts for 9-16% of the total mass of the raw materials.
4. The chip detection membrane according to claim 2, wherein the amount of silver is 13-17% of the total mass of the raw materials; the silver powder and the copper powder are mixed according to the ratio of 1:1, and the mixed dosage accounts for 9-16% of the total mass of the raw materials.
5. The chip detection membrane of claim 2, wherein the gold and silver are mixed according to a ratio of 1:1, and the mixed amount accounts for 13-17% of the total mass of the raw materials; the gold powder and the silver powder are mixed according to the ratio of 1:1, and the mixed dosage accounts for 9-16% of the total mass of the raw materials.
6. A method for manufacturing a chip detection film, by which a method for manufacturing a chip detection film according to claims 1 to 5 is completed, comprising the steps of:
s1, fiber cloth metal plating material: plating a metal material on the surface of the fiber cloth;
s2, manufacturing a conductive layer: adding metal powder into the epoxy resin adhesive, and then stirring and mixing the epoxy resin adhesive and the metal powder uniformly;
s3, grinding the mixture: pouring the mixture of the epoxy resin adhesive and the metal powder in the step S2 into a grinder for grinding;
s4, manufacturing a chip detection surface: adding the mixture ground in the step S3 to the fiber cloth plated with the metal material in the step S1, and then leveling to form a detection surface;
s5, high-temperature baking: drying the fiber cloth scraped off in the step S4 at high temperature to fix the detection surface;
s6, pasting a transparent protective film: sticking a transparent protective film on the detection surface of the fiber cloth;
s7, laminating a protective film by a press machine: and pressing and rotating the transparent protective film through a pressing and rotating machine to enable the transparent protective film to be tightly attached to the detection surface.
7. A chip inspection method using the chip inspection film according to claims 1 to 5 for inspection, comprising the steps of:
a1, tearing the protective film: tearing off the transparent protective film of the detection film to leak out of the detection surface;
a2, chip placement and detection membrane: attaching a chip to be detected to the detection surface of the detection film, and then placing the detection film on a platform of a laser detector;
a3, power on: contacting a ground wire of a laser detector with a detection surface to electrify the detection surface;
a4, irradiating the chip with laser: after the detection surface is electrified with the laser detector, irradiating the chip on the detection film by the laser detector;
a5, judging whether the chip is qualified: and judging whether the chip is qualified or not according to the feedback of the laser detector after irradiation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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