CN112230128A - Device and method for testing high-frequency performance of laser chip and storage medium - Google Patents
Device and method for testing high-frequency performance of laser chip and storage medium Download PDFInfo
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- CN112230128A CN112230128A CN202011461819.XA CN202011461819A CN112230128A CN 112230128 A CN112230128 A CN 112230128A CN 202011461819 A CN202011461819 A CN 202011461819A CN 112230128 A CN112230128 A CN 112230128A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- G—PHYSICS
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- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
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Abstract
The invention discloses a laser chip high-frequency performance testing device, which comprises: the device comprises a substrate, and a calibration unit, a verification unit and at least one test unit which are arranged on the substrate; the calibration unit comprises an open circuit module, a short circuit module, a load module and a through module, and is used for calibrating the test instrument; the verification unit is used for verifying the calibration result of the calibration unit; the test unit comprises a group of test modules, the test unit is used for testing the high-frequency performance of the laser chip to be tested, the technical problem that the test fixture in the prior art needs to be provided with an additional ceramic substrate to place the laser and an additional gold wire to conduct a signal link, and the ceramic substrate and the gold wire can influence the test result is solved, the influence of eliminating the ceramic substrate and the gold wire is achieved, the program does not need to be written, the accurate high-frequency characteristic of the laser can be obtained, and the test time is saved.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to a device and a method for testing high-frequency performance of a laser chip and a storage medium.
Background
Over the last decade, the increasing potential of optical interconnection systems has put higher demands on the research and analysis of laser performance, and accurate and rapid simulation of laser performance has become more and more urgent in the performance evaluation and network analysis of the whole optical interconnection system.
In laser performance simulation, an accurate laser small-signal equivalent circuit model needs to be extracted, and the small-signal equivalent circuit model is usually fit from actually tested laser high-frequency performance parameters (S parameters). If the test is wrong or the test accuracy is not enough, a wrong circuit model is fitted, so that the simulation of the whole optical device fails.
In the process of testing the high-frequency performance of the conventional laser, a test fixture is needed, referring to fig. 1, because the radio-frequency signal of the network analyzer cannot be directly applied to the two ends of the laser. In the laser testing process, the laser still can generate heat, and high temperature can influence the performance of laser, and in order to dispel the heat, still need a special preparation ceramic substrate to place the laser. Therefore, in the test data, the influence of the test fixture and the ceramic substrate is actually included, and after the test is finished, a program is written to remove the influence of the fixture and the ceramic substrate, which is very complicated mathematical processing, and is very difficult for a common test engineer, and the written program does not have a standard for judging the quality, and unless the experience is very rich, the accuracy of the program after the process is difficult to judge.
In the process of implementing the invention, the inventor finds that the following problems are found besides great difficulty in writing degree:
at least two sets of test fixtures are generally designed, one set is used for calibration, the other set is used for testing, and in the testing process, if the testing result is found to be incorrect, the two sets of fixtures need to be replaced back and forth, so that a lot of time is consumed; meanwhile, when the ceramic substrate is welded on the fixture, the fixture and a high-frequency signal link on the ceramic substrate are conducted through gold wires, and the gold wires have high impedance characteristics at high frequency, so that the final test result is influenced.
Disclosure of Invention
The invention mainly aims to provide a device for testing the high-frequency performance of a laser chip, and aims to solve the technical problem that in the prior art, an additional ceramic substrate is required to be arranged on a test fixture for placing a laser and an additional gold wire for conducting a signal link, and the ceramic substrate and the gold wire can influence the test result.
In order to achieve the above object, the present invention provides a device for testing high frequency performance of a laser chip, the device comprising: the device comprises a substrate, and a calibration unit, a verification unit and at least one test unit which are arranged on the substrate; the calibration unit comprises an open circuit module, a short circuit module, a load module and a through module, and is used for calibrating the test instrument; the verification unit is used for verifying the calibration result of the calibration unit; the test unit comprises a group of test modules and is used for testing the high-frequency performance of the laser chip to be tested.
Preferably, the apparatus comprises: the calibration unit, the verification unit and the test unit are all composed of signal lines and ground lines which are plated on the substrate.
Preferably, the calibration unit further comprises: the signal wire of the open circuit module is disconnected with the ground wire; the signal wire of the short circuit module is communicated with the ground wire; a load resistor is arranged between the signal wire and the ground wire of the load module; the ground wires of the through module are arranged on two sides of the signal wire, and two ends of the signal wire of the through module are disconnected with the ground wires.
Preferably, the load module further comprises: two 100-ohm load resistors are connected in parallel between the signal wire and the ground wire.
Preferably, the test module comprises: the first test module is used for mounting the laser to be tested; the second test module is used for installing a detector; and probes of two ports of the analyzer are simultaneously added on the first test module and the second test module to obtain the high-frequency performance parameters of the laser to be tested.
The invention also provides a laser chip high-frequency performance testing method, which is applied to a laser chip high-frequency performance testing device and comprises the following steps: adding probes of two ports of the analyzer to the calibration unit for calibration to obtain a calibration result; adding the probe to the verification unit for verification, and judging whether the calibration result is normal or not; and if the laser device to be tested is normal, the probe is added to a test unit where the laser device to be tested is tested to be tested, and the high-frequency performance parameters of the laser device to be tested are obtained.
Further, the calibration of the calibration unit with probes at two ports of the analyzer includes: selecting a calibration mode and a transmission line type of the analyzer; and sequentially adding the probe to the open circuit module, the short circuit module, the load module and the through module of the calibration unit for calibration to obtain the calibration result.
Further, the adding the probe to the verification unit for verification and judging whether the calibration result is normal further includes: performing a double-port test on the verification unit to obtain corresponding high-frequency performance parameters; and determining whether the calibration result is normal or not according to the relation between the amplitude and the phase of the high-frequency performance parameter and a preset requirement.
Further, the adding the probe to a test unit where the laser device to be tested is tested to obtain the high-frequency performance parameters of the laser device to be tested further includes: testing the laser to be tested to obtain a test result; and performing de-embedding processing on the test result to obtain the high-frequency performance parameter of the laser to be tested.
The invention also provides a computer readable storage medium, on which a laser chip high-frequency performance test program is stored, which when executed by a processor implements the steps of the laser chip high-frequency performance test method according to any one of the above.
The invention provides a laser chip high-frequency performance testing device, which comprises: the device comprises a substrate, and a calibration unit, a verification unit and at least one test unit which are arranged on the substrate; the calibration unit comprises an open circuit module, a short circuit module, a load module and a through module, and is used for calibrating the test instrument; the verification unit is used for verifying the calibration result of the calibration unit; the test unit comprises a group of test modules, the test unit is used for testing the high-frequency performance of the laser chip to be tested, by arranging the calibration unit, the verification unit and the test unit on the substrate, the influence of the substrate and gold wires on the test result is eliminated, the test result is more reliable by designing the calibration unit, the use of the test fixture is avoided by designing the test unit, the test process is simple, the test fixture does not need to be replaced back and forth, the time is saved, therefore, the problem that the test fixture in the prior art needs to arrange an additional ceramic substrate for placing the laser and an additional gold wire for conducting the signal link is solved, the ceramic substrate and the gold wire can influence the test result, so that the influence of the ceramic substrate and the gold wire is eliminated, the accurate high-frequency characteristic of the laser can be obtained without writing a program, and the test time is saved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a prior art laser high frequency performance device;
FIG. 2 is a schematic structural diagram of a device for testing high-frequency performance of a laser chip according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a device for testing high-frequency performance of a laser chip according to an embodiment of the present invention;
FIG. 4 is a schematic flow chart of a method for testing high-frequency performance of a laser chip according to an embodiment of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
3 | |
| 2 | |
31 | |
| 21 | |
32 | |
| 22 | Short- |
4 | |
| 23 | |
5 | Laser device to be tested |
| 24 | Straight-through |
6 | Detector |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture, and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if the meaning of "and/or" and/or "appears throughout, the meaning includes three parallel schemes, for example," A and/or B "includes scheme A, or scheme B, or a scheme satisfying both schemes A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The embodiment of the invention provides a device and a method for testing high-frequency performance of a laser chip and a storage medium.
Referring to fig. 2 to 4, in an embodiment of the present invention, the apparatus for testing high frequency performance of a laser chip includes:
a substrate 1, and a calibration unit 2, a verification unit 3 and at least one test unit 4 disposed on the substrate 1.
Specifically, the substrate 1 in the present application may be a ceramic substrate 1, and the calibration unit 2, the verification unit 3, and the test unit 4 are metal conductive layers and are disposed on the substrate 1 by electroplating. The substrate 1 is provided with at least one test unit 4, which can be used for performance testing of a plurality of lasers 5 to be tested simultaneously or for standby.
The calibration unit 2 includes an open circuit module 21, a short circuit module 22, a load module 23, and a pass-through module 24, and the calibration unit 2 is used for calibrating the test instrument.
Specifically, the calibration unit 2 has four properties of open circuit, short circuit, matched termination and through connection, and can be directly used for calibrating the network analyzer. The network analyzer supports a SOLT (S = short, O = open, L = Load, T = Thru = straight) calibration technology, that is, a short-circuit, open-circuit, Load and straight calibration mode, which is a traditional calibration mode established on the basis of 12 errors, and different calibration modules of the calibration unit 2 are used for calibration.
The verification unit 3 is used for verifying the calibration result of the calibration unit 2.
Specifically, since the conventional SOLT calibration can only be calibrated to the coaxial plane and cannot be calibrated to the front end of the laser 5 to be tested, which will introduce test errors, the verification unit 3 is provided for verifying the calibration result of the calibration unit 2.
The test unit 4 comprises a group of test modules, and the test unit 4 is used for testing the high-frequency performance of the laser 5 chip to be tested.
Specifically, each test unit 4 includes a set of test modules, and multiple test units 4 can be used for performance testing of multiple lasers under test 5 simultaneously or in standby. The test unit 4 supports lasers in two packaging forms of wire bond and flip chip, and can simultaneously test the high-frequency performance of a plurality of lasers.
Preferably, the apparatus comprises: the calibration unit 2, the verification unit 3, and the test unit 4 are each composed of a signal line and a ground line plated on the substrate 1. The signal line of the open circuit module 21 is disconnected from the ground line; the signal line of the short-circuit module 22 is communicated with the ground line; a load resistor is arranged between the signal line of the load module 23 and the ground wire; the ground lines of the through module 24 are disposed on two sides of the signal line, and two ends of the signal line of the through module 24 are disconnected from the ground lines.
Specifically, the calibration unit 2, the verification unit 3, and the test unit 4 are each composed of a signal line and a ground line plated on the substrate 1, and the signal line and the ground line are all gold layers. The verification unit 3 and the through module 24 in the calibration unit 2 have similar structures, and are all 3 gold layers, the middle gold layer is a ground wire, and the gold layers on the two sides are ground wires, however, the length of the gold layer of the verification unit 3 is longer than that of the gold layer of the through module 24. The calibration unit 2 and the test unit 4 are both in an E shape, the middle gold layer is a signal line, and the signal line is surrounded by the ground wire gold layer around the signal line. The calibration unit 2 and the test unit 4 are designed in an "E" shape to facilitate the connection of resistors or lasers therein, and in the calibration unit 2, the connection of signal lines and ground lines is facilitated to form short-circuit, open-circuit and other circuit connections, and simultaneously, a GSG or GS (two types of radio frequency probes) structure is facilitated to form. The short circuit means that the signal line is directly short-circuited to the ground wire, the open circuit means that the tail end of the signal line is separated from the ground wire, the load means that a 50-ohm load is connected in series between the tail end of the signal line and the ground wire, the straight connection means that a short transmission line is connected, the ground wire is arranged on two sides of the signal line, and two ends of the signal line of the straight-through module 24 are disconnected with the ground wire.
Preferably, the load module 23 further comprises: two 100-ohm load resistors are connected in parallel between the signal line and the ground line.
Specifically, two 100-ohm load resistors are connected in parallel between the signal line and the ground line, and the two 100-ohm load resistors are connected in parallel to form a 50-ohm load.
Preferably, the test module comprises: a first test module 31 for mounting the laser 5 to be tested; a second test module 32 for mounting the probe 6; probes of two ports of the analyzer are simultaneously added to the first test module 31 and the second test module 32 to obtain high-frequency performance parameters of the laser 5 to be tested.
Specifically, the test module includes a first test module 31 and a second test module 32, as shown in the figure, the left side of each test module is the first test module 31, and the right side is the second test module 32, during testing, the laser 5 to be tested is connected between the signal line of the first test module 31 and the ground, and the detector 6 is connected between the signal line of the second test module 32 and the ground. And the signal line and the ground line of the test module form a GSG or GS structure. In order to detect circuit performance, it is necessary to conduct the circuit signal to the transmission line, which requires at least two conductors, i.e., "signal conductor" and "ground conductor", in the RF probe, GSG, GS, SG are three basic types of probes, "G" is "ground conductor", and "S" is "signal conductor", which are connected to the signal line or ground line, respectively, in the embodiment of the present application, during calibration or test.
An embodiment of the present invention provides a device for testing high-frequency performance of a laser chip, including: the device comprises a substrate 1, and a calibration unit 2, a verification unit 3 and at least one test unit 4 which are arranged on the substrate 1; the calibration unit 2 comprises an open circuit module 21, a short circuit module 22, a load module 23 and a through module 24, and the calibration unit 2 is used for calibrating the test instrument; the verification unit 3 is used for verifying the calibration result of the calibration unit 2; the test unit 4 comprises a group of test modules, the test unit 4 is used for testing the high-frequency performance of a chip of a laser 5 to be tested, the calibration unit 2, the verification unit 3 and the test unit 4 are arranged on the substrate 1, the influence of the substrate 1 and gold wires on a test result is eliminated, the test result is more reliable by designing the calibration unit 2, the use of a test fixture is avoided by designing the test unit 4, the test process is simple, the test fixture does not need to be replaced back and forth, the time is saved, the technical problem that the test fixture in the prior art needs to be provided with an additional ceramic substrate 1 for placing the laser and an additional gold wire for conducting a signal link, the ceramic substrate 1 and the gold wire can influence the test result is solved, the influence of the ceramic substrate 1 and the gold wire is eliminated, the program does not need to be written, and the accurate high-frequency characteristic of the laser can be obtained, the technical effect of saving the testing time.
An embodiment of the present invention further provides a method for testing high-frequency performance of a laser chip, which is applied to a device for testing high-frequency performance of a laser chip, and with reference to fig. 4, the method includes:
and S101, adding probes of two ports of the analyzer to the calibration unit 2 for calibration to obtain a calibration result.
Specifically, before testing, mounting and calibration, including mounting of the port 1 and port 2 probes of the network analyzer, and testing of the ceramic substrate 1, are performed first. After the probes are installed, two probes are added on the calibration unit 2 for calibration to obtain a calibration result. The network analyzer supports the SOLT calibration technology, namely short-circuit, open-circuit, load and direct connection calibration modes, and is a traditional calibration mode established on the basis of 12 errors.
Step S102, adding the probe to the verification unit 3 for verification, and judging whether the calibration result is normal.
Specifically, since the conventional SOLT calibration piece can only calibrate to the coaxial surface and cannot calibrate to the front end of the laser 5 to be tested, the verification unit 3 is arranged to verify the test error introduced by the calibration piece, the verification unit 3 is a short transmission line, and the probe is used for verifying the calibration effect when added to the verification unit 3.
Step S103, adding the probe to the test unit 4 where the laser device 5 to be tested is tested to perform testing, and obtaining the high-frequency performance parameters of the laser device 5 to be tested.
Specifically, after the calibration is finished, the laser is welded, the probe of the network analyzer is added on the test unit 4 where the laser 5 to be tested is tested, and the network tester can test the S parameter curve. Wherein the S-parameter of the detector 6 may be directly excluded.
Further, step S101 further includes: selecting a calibration mode and a transmission line type of the analyzer; and sequentially adding the probes to the open-circuit module 21, the short-circuit module 22, the load module 23 and the through module 24 of the calibration unit 2 for calibration to obtain a calibration result.
Specifically, the calibration process includes the steps of clicking to enter a calibration interface after the network analyzer is started, selecting a SOLT calibration mode, selecting microsstrip by line type, and sequentially placing probes on an open-circuit module 21, a short-circuit module 22, a load module 23 and a through module 24 of the laser chip high-frequency performance testing device to calibrate one by one.
Further, step S102 further includes: performing a dual-port test on the verification unit 3 to obtain corresponding high-frequency performance parameters; and determining whether the calibration result is normal or not according to the relation between the amplitude and the phase of the high-frequency performance parameter and the preset requirement.
Specifically, after the calibration is finished, the probe is moved to the verification unit 3, a two-port test is performed, whether the amplitude and the phase of the S parameter are at the preset required levels is observed to judge whether the calibration result is normal, if the calibration result is normal, the calibration is finished, and a corresponding calibration file is stored.
Further, step S102 further includes: testing the laser 5 to be tested to obtain a test result; and (5) performing de-embedding processing on the test result to obtain the high-frequency performance parameter of the laser 5 to be tested.
Specifically, after calibration is finished, a laser is welded for testing, a group of S parameter curves is measured, an electro-optical test operation interface of the network analyzer is entered, a stored calibration file and an S parameter file of the detector 6 are selected simultaneously, wherein the S parameter of the detector 6 is provided by a manufacturer or obtained by testing, and then the detector 6 is de-embedded by clicking EO test, so that the influence of the detector 6 is eliminated.
An embodiment of the present invention further provides a computer-readable storage medium, where a laser chip high-frequency performance testing program is stored on the computer-readable storage medium, and when the laser chip high-frequency performance testing program is executed by a processor, the steps of the laser chip high-frequency performance testing method according to any one of the above embodiments are implemented.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A laser chip high-frequency performance testing device is characterized by comprising:
the device comprises a substrate, and a calibration unit, a verification unit and at least one test unit which are arranged on the substrate;
the calibration unit comprises an open circuit module, a short circuit module, a load module and a through module, and is used for calibrating the test instrument;
the verification unit is used for verifying the calibration result of the calibration unit;
the test unit comprises a group of test modules and is used for testing the high-frequency performance of the laser chip to be tested.
2. The apparatus of claim 1, wherein the apparatus comprises:
the calibration unit, the verification unit and the test unit are all composed of signal lines and ground lines which are plated on the substrate.
3. The apparatus of claim 2, wherein the calibration unit further comprises:
the signal wire of the open circuit module is disconnected with the ground wire;
the signal wire of the short circuit module is communicated with the ground wire;
a load resistor is arranged between the signal wire and the ground wire of the load module;
the ground wires of the through module are arranged on two sides of the signal wire, and two ends of the signal wire of the through module are disconnected with the ground wires.
4. The apparatus of claim 3, wherein the load module further comprises:
two 100-ohm load resistors are connected in parallel between the signal wire and the ground wire.
5. The apparatus of claim 2, wherein the test module comprises:
the first test module is used for mounting the laser to be tested;
the second test module is used for installing a detector;
and probes of two ports of the analyzer are simultaneously added on the first test module and the second test module to obtain the high-frequency performance parameters of the laser to be tested.
6. A method for testing the high-frequency performance of a laser chip is applied to a device for testing the high-frequency performance of the laser chip, and is characterized by comprising the following steps:
adding probes of two ports of the analyzer to the calibration unit for calibration to obtain a calibration result;
adding the probe to the verification unit for verification, and judging whether the calibration result is normal or not; if the judgment result is normal, then,
and adding the probe to a test unit where the laser to be tested is tested to test, so as to obtain the high-frequency performance parameters of the laser to be tested.
7. The method of claim 6, wherein the calibrating step comprises the steps of applying probes at two ports of the analyzer to the calibration unit to obtain a calibration result, and further comprising the steps of:
selecting a calibration mode and a transmission line type of the analyzer;
and sequentially adding the probe to the open circuit module, the short circuit module, the load module and the through module of the calibration unit for calibration to obtain the calibration result.
8. The method of claim 6, wherein said applying said probe to said verification unit for verification and determining whether said calibration result is normal further comprises:
performing a double-port test on the verification unit to obtain corresponding high-frequency performance parameters;
and determining whether the calibration result is normal or not according to the relation between the amplitude and the phase of the high-frequency performance parameter and a preset requirement.
9. The method of claim 6, wherein the applying the probe to a test unit where a laser device under test is located for testing to obtain the high frequency performance parameters of the laser device under test, further comprises:
testing the laser to be tested to obtain a test result;
and performing de-embedding processing on the test result to obtain the high-frequency performance parameter of the laser to be tested.
10. A computer-readable storage medium, having stored thereon a laser chip high frequency performance testing program, which when executed by a processor, implements the steps of the laser chip high frequency performance testing method of any one of claims 6 to 9.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113985246A (en) * | 2021-10-21 | 2022-01-28 | 武汉光谷信息光电子创新中心有限公司 | Testing and packaging tool and system for chip |
| CN114193844A (en) * | 2021-11-23 | 2022-03-18 | 深圳市塬煌电子科技有限公司 | Chip detection film and manufacturing method and detection method thereof |
| CN114636962A (en) * | 2022-05-20 | 2022-06-17 | 苏州联讯仪器有限公司 | Automatic calibration equipment, method, device and medium for driving power panel |
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