CN114192914A - Welding type power semiconductor module welding method - Google Patents
Welding type power semiconductor module welding method Download PDFInfo
- Publication number
- CN114192914A CN114192914A CN202111609211.1A CN202111609211A CN114192914A CN 114192914 A CN114192914 A CN 114192914A CN 202111609211 A CN202111609211 A CN 202111609211A CN 114192914 A CN114192914 A CN 114192914A
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- Prior art keywords
- welding
- semiconductor module
- circuit board
- solder
- gasket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 82
- 238000003466 welding Methods 0.000 title claims abstract description 69
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000005493 welding type Methods 0.000 title claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 claims abstract description 54
- 239000011248 coating agent Substances 0.000 claims abstract description 21
- 238000000576 coating method Methods 0.000 claims abstract description 21
- 238000005476 soldering Methods 0.000 claims abstract description 15
- 230000004907 flux Effects 0.000 claims description 9
- 239000010410 layer Substances 0.000 claims description 8
- 238000007790 scraping Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses a welding type power semiconductor module welding method, and relates to the technical field of semiconductor welding. The welding method of the welding type power semiconductor module comprises the following steps of S1: the circuit board to be welded is positioned, and meanwhile, the circuit board is enabled to be parallel to the horizontal plane when the bonding pad attached to the semiconductor module is not shielded and positioned, S2 and solder coating are performed: coating the solder on the circuit board pad after will fixing, guarantee the even coating of solder on the pad of circuit board during the coating solder, the solder that will surpass the pad position after the solder coating is accomplished clears up and strikes off, through the cooperation between fixing a position and the gasket to circuit board and semiconductor module, can effectually avoid the solder to appear the phenomenon of overflowing when reflow soldering carries out the welding, guaranteed the welding precision between semiconductor module and the circuit board, promoted semiconductor module's welding effect.
Description
Technical Field
The invention relates to the technical field of semiconductor welding, in particular to a welding type power semiconductor module welding method.
Background
The semiconductor device is an electronic device which has the conductivity between a good conductor and an insulator and can complete specific functions by utilizing the special electrical characteristics of semiconductor materials, can be used for generating, controlling, receiving, converting, amplifying signals and carrying out energy conversion, and the semiconductor material of the semiconductor device is silicon, germanium or gallium arsenide and can be used as equipment such as a rectifier, an oscillator, a light emitter, an amplifier, a light detector and the like; for the sake of distinction from integrated circuits, sometimes also referred to as discrete devices; the basic structure of most two-terminal devices, i.e., crystal diodes, is a PN junction.
When the semiconductor module is welded, the semiconductor module is usually welded through reflow soldering, so that the temperature can be conveniently controlled, the phenomenon of oxidation can be avoided in the welding process, when the coated solder is used for bonding the semiconductor module and the circuit board after being heated, redundant solder can overflow the position of a bonding pad and can be bonded outside the circuit board or the semiconductor module, the use effect of a device is easily influenced while the attractiveness is influenced, and the welding precision of the semiconductor module is reduced.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a welding method of a welding type power semiconductor module, which solves the problem that the welding precision of a device is influenced by the overflow of solder at high temperature.
In order to achieve the purpose, the invention is realized by the following technical scheme: a welding type power semiconductor module welding method specifically comprises the following steps: s1, positioning the device: positioning the circuit board to be welded, simultaneously ensuring that a bonding pad attached to the semiconductor module is not shielded, and simultaneously enabling the positioned circuit board to be parallel to a horizontal plane;
s2, solder coating: coating solder on a fixed circuit board pad, ensuring that the solder is uniformly coated on the pad of the circuit board when the solder is coated, and cleaning and scraping the solder exceeding the pad after the solder is coated;
s3, mounting a gasket: fixedly mounting the gasket above the circuit board, and simultaneously exposing the welding disc coated with the welding flux;
s4, positioning the semiconductor module: placing the prepared semiconductor module above the gasket, and attaching the welding point of the semiconductor module to the welding pad coated with the welding flux while placing the semiconductor module;
s5, welding and positioning: and placing the positioned semiconductor module and the circuit board into reflow soldering, bonding the circuit board and the semiconductor module after melting the solder by adjusting the proper temperature, and taking down the gasket after positioning.
Preferably, the gasket in the S3 is composed of two plate bodies, one side of each of the two plate bodies is attached to the corresponding circuit board, and the two plate bodies have the same size and thickness.
Preferably, the gasket is internally provided with a through hole, the position of the through hole corresponding to the pad of the circuit board, the two ends of the through hole are thickened, the end part of the through hole is slightly lower than the height of the pad coated with the solder, and the diameter of the through hole formed in the gasket is set according to the size of the pad and the welding position.
Preferably, the gasket is made of an insulating material, the protective layers are fixedly mounted on two sides of the gasket, and the thickness of the gasket is less than or equal to 10 mm.
Preferably, in S1, the circuit board is fixed to the conveying board in a snap-fit manner, and the bottom of the circuit board completely adheres to and is parallel to the insulating layer on the top surface of the conveying board.
Preferably, when the semiconductor module in S4 is placed, the top surface of the pad is provided with a plurality of anti-slip bumps, and the bottom of the semiconductor is bonded to the ends of the plurality of anti-slip bumps to maintain the positioning.
Preferably, the semiconductor welding points are mutually attached to the welding pad coated with the welding flux, and the welding pad is mutually attached to the inner wall of the through hole formed in the gasket.
Preferably, the inner wall of the through hole formed in the gasket is a smooth plane and is coated with an anti-adhesion layer.
Preferably, the through hole is arranged inside the two plate bodies, the two plate bodies are mutually attached, and the same pull groove is formed inside the two plate bodies.
Advantageous effects
The invention provides a welding type power semiconductor module welding method. Compared with the prior art, the method has the following beneficial effects: the welding type power semiconductor module welding method comprises the following steps of S1: the circuit board that will need the welding carries out the location operation, guarantees simultaneously that the pad with the laminating of semiconductor module does not receive sheltering from, makes the circuit board after the location be on a parallel with the horizontal plane simultaneously, S2, solder coating: coating the solder on the circuit board pad after will fixing, guarantee the even coating of solder on the pad of circuit board during the coating solder, will surpass the solder of pad position after the solder coating is accomplished and clear up scraping, S3, gasket installation: fixedly mounting the gasket on the upper side of the circuit board, and simultaneously exposing the solder-coated pad, positioning the semiconductor module at S4: placing the prepared semiconductor module above the pad, and attaching the soldering point of the semiconductor module to the soldering pad coated with the solder while placing, S5, soldering positioning: inside putting into reflow soldering with the semiconductor module and the circuit board that the location was accomplished, through adjusting suitable temperature, make the solder melt back bond circuit board and semiconductor module, take off the gasket after accomplishing the location, through the cooperation between carrying out location and the gasket to circuit board and semiconductor module, the phenomenon that appears overflowing when can effectually avoiding the solder to carry out the welding through reflow soldering, guaranteed the welding precision between semiconductor module and the circuit board, promoted semiconductor module's welding effect.
Drawings
FIG. 1 is a flow chart of a welding method of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a welding type power semiconductor module welding method specifically comprises the following steps:
s1, positioning the device: positioning the circuit board to be welded, simultaneously ensuring that a bonding pad attached to the semiconductor module is not shielded, and simultaneously enabling the positioned circuit board to be parallel to a horizontal plane;
s2, solder coating: coating solder on a fixed circuit board pad, ensuring that the solder is uniformly coated on the pad of the circuit board when the solder is coated, and cleaning and scraping the solder exceeding the pad after the solder is coated;
s3, mounting a gasket: fixedly mounting the gasket above the circuit board, and simultaneously exposing the welding disc coated with the welding flux;
s4, positioning the semiconductor module: placing the prepared semiconductor module above the gasket, and attaching the welding point of the semiconductor module to the welding pad coated with the welding flux while placing the semiconductor module;
s5, welding and positioning: placing the positioned semiconductor module and the circuit board into reflow soldering, bonding the circuit board and the semiconductor module after melting the solder by adjusting the proper temperature, and taking down the gasket after positioning;
in the embodiment of the invention, the gasket in the S3 is composed of two plate bodies, one side of the gasket is mutually attached to the corresponding circuit board, and the two plate bodies have the same size and thickness;
in the embodiment of the invention, the gasket is internally provided with a through hole, the opening position of the through hole corresponds to the pad of the circuit board, the two ends of the through hole are thickened, the end part of the through hole is slightly lower than the height of the pad coated with solder, and the diameter of the through hole arranged in the gasket is set according to the size of the pad and the welding position;
in the embodiment of the invention, the gasket is made of insulating materials, the protective layers are fixedly arranged on both sides of the gasket, and the thickness of the gasket is less than or equal to 10 mm;
in the embodiment of the invention, the circuit board in S1 is fixed on the conveying plate in a buckling mode, and the bottom of the circuit board is completely attached to the insulating layer on the top surface of the conveying plate and keeps parallel to the insulating layer;
in the embodiment of the invention, when the semiconductor module in S4 is placed, the top surface of the gasket is provided with a plurality of anti-slip salient points, and the bottom of the semiconductor is mutually attached to the end parts of the plurality of anti-slip salient points to keep positioning;
in the embodiment of the invention, the semiconductor welding point is mutually attached to the welding pad coated with the welding flux, and the welding pad is mutually attached to the inner wall of the through hole formed in the gasket;
in the embodiment of the invention, the inner wall of the through hole formed in the gasket is a smooth plane and is coated with the anti-bonding layer;
in the embodiment of the invention, the through hole is arranged inside the two plate bodies, the two plate bodies are mutually attached, and the same pull groove is arranged inside the two plate bodies.
In summary, by S1, device positioning: the circuit board that will need the welding carries out the location operation, guarantees simultaneously that the pad with the laminating of semiconductor module does not receive sheltering from, makes the circuit board after the location be on a parallel with the horizontal plane simultaneously, S2, solder coating: coating the solder on the circuit board pad after will fixing, guarantee the even coating of solder on the pad of circuit board during the coating solder, will surpass the solder of pad position after the solder coating is accomplished and clear up scraping, S3, gasket installation: fixedly mounting the gasket on the upper side of the circuit board, and simultaneously exposing the solder-coated pad, positioning the semiconductor module at S4: placing the prepared semiconductor module above the pad, and attaching the soldering point of the semiconductor module to the soldering pad coated with the solder while placing, S5, soldering positioning: inside putting into reflow soldering with the semiconductor module and the circuit board that the location was accomplished, through adjusting suitable temperature, make the solder melt back bond circuit board and semiconductor module, take off the gasket after accomplishing the location, through the cooperation between carrying out location and the gasket to circuit board and semiconductor module, the phenomenon that appears overflowing when can effectually avoiding the solder to carry out the welding through reflow soldering, guaranteed the welding precision between semiconductor module and the circuit board, promoted semiconductor module's welding effect.
And those not described in detail in this specification are well within the skill of those in the art.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A welding type power semiconductor module welding method is characterized in that: the method specifically comprises the following steps:
s1, positioning the device: positioning the circuit board to be welded, and enabling the circuit board to be parallel to a horizontal plane while ensuring that a bonding pad attached to the semiconductor module is not shielded and positioned;
s2, solder coating: coating solder on a fixed circuit board pad, ensuring that the solder is uniformly coated on the pad of the circuit board when the solder is coated, and cleaning and scraping the solder exceeding the pad after the solder is coated;
s3, mounting a gasket: fixedly mounting the gasket above the circuit board, and simultaneously exposing the welding disc coated with the welding flux;
s4, positioning the semiconductor module: placing the prepared semiconductor module above the gasket, and attaching the welding point of the semiconductor module to the welding pad coated with the welding flux while placing the semiconductor module;
s5, welding and positioning: and placing the positioned semiconductor module and the circuit board into reflow soldering, bonding the circuit board and the semiconductor module after melting the solder by adjusting the proper temperature, and taking down the gasket after positioning.
2. A welding-type power semiconductor module welding method according to claim 1, characterized in that: the S3 middle gasket is composed of two plate bodies, one side of each plate body is attached to the corresponding circuit board, and the size and the thickness of the two plate bodies are the same.
3. A welding-type power semiconductor module welding method according to claim 2, characterized in that: the gasket is internally provided with a through hole, the arranging position of the through hole corresponds to the pad of the circuit board, the two ends of the through hole are thickened, the end part of the through hole is slightly lower than the height of the pad coated with solder, and the diameter of the through hole arranged in the gasket is set according to the size of the pad and the welding position.
4. A welding-type power semiconductor module welding method according to claim 2, characterized in that: the gasket is made of insulating materials, protective layers are fixedly mounted on two sides of the gasket, and the thickness of the gasket is less than or equal to 10 mm.
5. A welding-type power semiconductor module welding method according to claim 1, characterized in that: and in the step S1, the circuit board is fixed on the conveying plate in a buckling mode, and the bottom of the circuit board is completely attached to the insulating layer on the top surface of the conveying plate and keeps parallel to the insulating layer.
6. A welding-type power semiconductor module welding method according to claim 1, characterized in that: when the semiconductor module is placed in the S4, the top surface of the gasket is provided with a plurality of anti-slip bumps, and the bottom of the semiconductor is mutually attached to the end parts of the plurality of anti-slip bumps to keep positioning.
7. A welding-type power semiconductor module welding method according to claim 6, characterized in that: the semiconductor welding points are mutually attached to the welding pads coated with the welding flux, and the welding pads are mutually attached to the inner walls of the through holes formed in the gaskets.
8. A welding-type power semiconductor module welding method according to claim 7, characterized in that: the inner wall of the through hole formed in the gasket is a smooth plane and is coated with an anti-adhesion layer.
9. A welding-type power semiconductor module welding method according to claim 3, characterized in that: the through holes are arranged in the two plate bodies, the two plate bodies are mutually attached, and the same pull grooves are formed in the two plate bodies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111609211.1A CN114192914A (en) | 2021-12-27 | 2021-12-27 | Welding type power semiconductor module welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111609211.1A CN114192914A (en) | 2021-12-27 | 2021-12-27 | Welding type power semiconductor module welding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114192914A true CN114192914A (en) | 2022-03-18 |
Family
ID=80656573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111609211.1A Pending CN114192914A (en) | 2021-12-27 | 2021-12-27 | Welding type power semiconductor module welding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114192914A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4246147A (en) * | 1979-06-04 | 1981-01-20 | International Business Machines Corporation | Screenable and strippable solder mask and use thereof |
| US20050242161A1 (en) * | 2004-04-30 | 2005-11-03 | Visteon Global Technologies, Inc. | Systems and methods for laser soldering flat flexible cable |
| CN201119128Y (en) * | 2007-11-22 | 2008-09-17 | 中国电子科技集团公司第三十八研究所 | Built-in microwave circuit board for micro assembly cavity with temporary block welding film |
| CN104392941A (en) * | 2014-10-31 | 2015-03-04 | 南通富士通微电子股份有限公司 | Method of forming flip-chip semiconductor encapsulation device |
| CN211292904U (en) * | 2019-11-14 | 2020-08-18 | 广州兴森快捷电路科技有限公司 | Hinder and weld testing arrangement and hinder and weld test fixture |
| CN111640722A (en) * | 2020-06-11 | 2020-09-08 | 厦门通富微电子有限公司 | Chip packaging method and chip packaging device |
| CN212034452U (en) * | 2020-06-06 | 2020-11-27 | 南京威赛电子元器件组装有限公司 | PCB pad structure for wave soldering |
| CN113395841A (en) * | 2021-05-25 | 2021-09-14 | 佛山市国星光电股份有限公司 | Module processing method, module and device |
-
2021
- 2021-12-27 CN CN202111609211.1A patent/CN114192914A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4246147A (en) * | 1979-06-04 | 1981-01-20 | International Business Machines Corporation | Screenable and strippable solder mask and use thereof |
| US20050242161A1 (en) * | 2004-04-30 | 2005-11-03 | Visteon Global Technologies, Inc. | Systems and methods for laser soldering flat flexible cable |
| CN201119128Y (en) * | 2007-11-22 | 2008-09-17 | 中国电子科技集团公司第三十八研究所 | Built-in microwave circuit board for micro assembly cavity with temporary block welding film |
| CN104392941A (en) * | 2014-10-31 | 2015-03-04 | 南通富士通微电子股份有限公司 | Method of forming flip-chip semiconductor encapsulation device |
| CN211292904U (en) * | 2019-11-14 | 2020-08-18 | 广州兴森快捷电路科技有限公司 | Hinder and weld testing arrangement and hinder and weld test fixture |
| CN212034452U (en) * | 2020-06-06 | 2020-11-27 | 南京威赛电子元器件组装有限公司 | PCB pad structure for wave soldering |
| CN111640722A (en) * | 2020-06-11 | 2020-09-08 | 厦门通富微电子有限公司 | Chip packaging method and chip packaging device |
| CN113395841A (en) * | 2021-05-25 | 2021-09-14 | 佛山市国星光电股份有限公司 | Module processing method, module and device |
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Application publication date: 20220318 |