CN114171441A - Cleaning device rotating frame and cleaning machine adopting same - Google Patents
Cleaning device rotating frame and cleaning machine adopting same Download PDFInfo
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- CN114171441A CN114171441A CN202111564505.7A CN202111564505A CN114171441A CN 114171441 A CN114171441 A CN 114171441A CN 202111564505 A CN202111564505 A CN 202111564505A CN 114171441 A CN114171441 A CN 114171441A
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- wafer loading
- loading device
- cleaning
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- fixing frame
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Abstract
The invention discloses a cleaning device rotating frame and a cleaning machine adopting the cleaning frame, wherein the cleaning device rotating frame comprises a main rotating shaft arranged vertically, a top disc with a horizontal top surface, a bottom disc with a horizontal top surface, a plurality of vertical rods arranged vertically, a plurality of wafer loading device fixing frames and a wafer loading device fixing frame rotation stopping device; the wafer loading device fixing frame can rotate along the central axis of the vertical rod; each wafer loading device fixing frame is provided with an array along the main rotating shaft; the cleaning machine comprises a closed machine frame and a cleaning device rotating frame, wherein a main rotating shaft driving motor, a water spraying device, a nitrogen spraying device, a hot air spraying device and a circulating water tank are arranged in the machine frame, the main rotating shaft driving motor is connected with a main rotating shaft, the circulating water tank is arranged at the bottom end of the machine frame, and a movable door for placing a wafer loading device is arranged on the machine frame. The device can solve the problems of mutual interference and local unclean cleaning of the crystal boxes when the number of the crystal boxes is large in the prior art.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a rotary frame of a cleaning device and a cleaning machine adopting the rotary frame.
Background
In recent years, with the development of semiconductor manufacturing technology, the demand for production tools between processes of semiconductor production is increasing, including cassettes, which are used for transferring wafers and are often used. The existing crystal box comprises a crystal box body with an opening on one side and a crystal box cover, wherein the crystal box cover is matched with the opening of the crystal box body and used for sealing the crystal box, and a plurality of grooves used for placing wafers are formed in the crystal box body.
Since the pod is used to transport wafers, the pod may be contaminated with particulate matter in the surrounding environment during placement and removal of the wafers and during transport. Therefore, the pod needs to be periodically cleaned using the pod cleaning apparatus. Prior art cleaning devices typically employ a solution rinse and a dry gas supply. However, the inventor found that when the cleaning device in the prior art is used, the cleaning solution cannot be discharged in time, so that the efficiency of the cleaning and spin-drying processes is not high, and the conventional wafer cassette cleaning device relies on gas drying and utilizes a rotating shaft to rotate for assisting spin-drying, but since the gas is a source of particle pollution, the use of gas drying affects the overall cleaning effect, and the particle pollutants in the gas are attached to the inside of the wafer cassette.
Therefore, how to provide a cassette cleaning apparatus capable of sufficiently cleaning is a technical problem to be solved by those skilled in the art.
Patent publication No. CN107665832A discloses a cassette cleaning device, comprising: the cleaning device comprises a cleaning chamber and a crystal box placing frame, wherein a spraying device is arranged in the cleaning chamber, the crystal box placing frame comprises a rotating shaft, a crystal box body fixing device and a crystal box cover fixing device, and the crystal box body fixing device and the crystal box cover fixing device are arranged on the rotating shaft. According to the crystal box cleaning equipment provided by the invention, the crystal box body is placed on the crystal box body fixing device, the crystal box cover is placed on the crystal box cover fixing device, and the crystal box is cleaned through the spraying device, so that the crystal box is sufficiently cleaned, when the crystal box placing frame rotates for drying, the cleaning solution is thrown out, the crystal box cleaning efficiency is improved, and the crystal box cleaning cost is reduced. The disadvantages are that: the angle of the crystal box can not be changed, the crystal box is difficult to install, the operation is inconvenient, and the cleaning efficiency is low; the crystal box is directly hung on the rotating shaft, so that the space utilization efficiency of the whole device is low; the number of the crystal boxes hung on the rotating shaft cannot be too large, otherwise, the conditions of cleaning solution blocking, interference and the like can be generated among the crystal boxes, and the local cleaning of the crystal boxes is not thorough.
Disclosure of Invention
The invention aims to provide a rotary frame of a cleaning device and a cleaning machine adopting the rotary frame, aiming at the defects of the prior art and solving the problems of mutual interference and local unclean cleaning among crystal boxes when the number of the crystal boxes is large in the prior art.
The technical scheme adopted by the invention is as follows.
The cleaning device rotating frame comprises a main rotating shaft arranged vertically, a top disc with a horizontal top surface, a base disc with a horizontal top surface, a plurality of vertical rods arranged vertically, a plurality of wafer loading device fixing frames and a wafer loading device fixing frame rotation stopping device.
The top disc and the bottom disc are arranged on the main rotating shaft, and the central axis of the main rotating shaft, the central axis of the top disc and the central axis of the bottom disc are on the same vertical straight line; the diameters of the top disk and the bottom disk are the same.
The top disc fin plates with horizontal top surfaces and horizontal bottom surfaces are annularly arrayed on the radial peripheral surface of the top disc, the bottom disc fin plates with horizontal top surfaces and horizontal bottom surfaces are arranged under the top disc fin plates on the radial peripheral surface of the bottom disc, and vertical rods are vertically arranged between the top disc fin plates and the bottom disc fin plates under the top disc fin plates.
A wafer loading device fixing frame is arranged on each upright rod and can rotate along the central axis of the upright rod. Each wafer loader mount is arrayed along the main rotary shaft.
The beneficial effects are as follows: the wafer loading device fixing frame is provided with an array along the main rotating shaft, so that the cleaning space can be utilized to the maximum extent; the wafer loading device fixing frame can rotate along the central axis of the vertical rod, the angle of the wafer loading device fixing frame can be changed in the cleaning process, and the problems that in the prior art, when the number of the crystal boxes is large, the crystal boxes are mutually interfered, and local cleaning is not clean are solved.
As the preferred technical scheme, the end of the top disc, far away from the main rotating shaft, is connected with the bottom disc through a plurality of vertical plates; a plurality of circular ring plates with horizontal top surfaces are arranged between the top disc and the bottom disc and are connected with the vertical plates.
As a preferred technical scheme, the wafer loading device fixing frame rotation stopping device comprises a horizontal insertion hole arranged on a top disc fin plate and a vertical insertion hole arranged on the top end of the wafer loading device fixing frame, a horizontal insertion rod is arranged on the horizontal insertion hole, a U-shaped clamping plate with an opening facing away from the insertion rod is arranged on the horizontal insertion rod, when the vertical insertion hole of the clamping plate is aligned with the clamping plate, the rotation stopping of the wafer loading device fixing frame is realized by inserting the clamping plate and the vertical rotation stopping rod of the vertical insertion hole of the wafer loading device fixing frame,
alternatively, the first and second electrodes may be,
the wafer loading device fixing frame rotation stopping device comprises a plurality of fin plate vertical insertion holes formed in a top disc fin plate and a plurality of wafer loading device fixing frame vertical insertion holes formed in the top end of the wafer loading device fixing frame.
As the preferred technical scheme, a plurality of wafer basket fixing stations are arranged on the wafer loading device fixing frame.
As the preferred technical scheme, a plurality of crystal box fixing stations are arranged on the wafer loading device fixing frame.
The cleaning machine comprises a closed frame, wherein the frame is internally provided with any one of the cleaning device rotating frame, a main rotating shaft driving motor, a water spraying device, a nitrogen spraying device, a hot air spraying device and a circulating water tank, the main rotating shaft driving motor is connected with the main rotating shaft, the circulating water tank is arranged at the bottom end of the frame, and the frame is provided with a movable door for placing a wafer loading device.
The beneficial effects are as follows: the cleaning device rotating frame is placed in a closed space, and the wafer loading device fixing frame is arranged along the main rotating shaft in an array mode, so that the cleaning space can be utilized to the maximum extent; the wafer loading device fixing frame can rotate along the central axis of the vertical rod, the angle of the wafer loading device fixing frame can be changed once according to needs when each round of cleaning is carried out, the problems of mutual interference and local cleaning incompleteness among the wafer boxes when the number of the wafer boxes is large are solved, and all positions of a plurality of objects to be cleaned can be cleaned; the movable door is provided with a wafer loading device, and a wafer box and a wafer basket can be loaded or unloaded to or from each wafer loading device fixing frame from the movable door. The cleaning device is provided with a water spraying device, a nitrogen spraying device, a hot air spraying device and a circulating water tank, and is clean and efficient.
As the preferred technical scheme, the water spraying device comprises a water spraying pipe vertically arranged on the outer side of the rotary frame of the cleaning device, and a plurality of water spraying nozzles are arranged on the water spraying pipe. By adopting the technical scheme, the space is utilized to the maximum extent.
As the preferred technical scheme, the hot air spraying device comprises a hot air spraying pipe vertically arranged on the outer side of the rotary frame of the cleaning device, and a plurality of hot air spraying openings are formed in the hot air spraying pipe. By adopting the technical scheme, the space is utilized to the maximum extent.
As preferred technical scheme, spout the nitrogen gas device and include perpendicularly to the nitrogen gas pipe that spouts that sets up in the belt cleaning device swivel mount outside, spout and be equipped with a plurality of nitrogen gas mouths on the nitrogen gas pipe. By adopting the technical scheme, the space is utilized to the maximum extent.
As the preferred technical scheme, the top end of the frame is provided with a cavity, and the main rotating shaft driving motor is arranged in the cavity.
Drawings
FIG. 1 is a front view of a preferred embodiment of a spin stand of the cleaning apparatus of the present invention.
Fig. 2 is a partially enlarged view of a portion a of fig. 1.
Fig. 3 is a partially enlarged view of a portion C of fig. 2.
Fig. 4 is a partially enlarged view of a portion B of fig. 1.
Fig. 5 is a right side view of the spin stand of the cleaning apparatus shown in fig. 1.
Fig. 6 is a top view of the cleaning apparatus spin stand shown in fig. 1.
Fig. 7 is a partially enlarged view of a portion D of fig. 6.
Figure 8 is a perspective view of a wafer loader mount mounted on a vertical rod.
Fig. 9 is a partially enlarged view of a portion E of fig. 8.
Fig. 10 is a partially enlarged view of a portion F of fig. 8.
Fig. 11 is a partially enlarged view of a portion H of fig. 10.
Fig. 12 is a partially enlarged view of a portion I of fig. 11.
Fig. 13 is a partially enlarged view of a portion G of fig. 8.
Fig. 14 is a schematic structural view of a wafer loading device holder rotation stopping device.
FIG. 15 is a schematic structural view of a preferred embodiment of a spin stand of the cleaning apparatus of the present invention.
Fig. 16 is a partially enlarged view of a portion J of fig. 15.
FIG. 17 is a schematic diagram of a preferred embodiment of the cleaning machine.
Fig. 18 is a cross-sectional view taken along M-M' of fig. 17.
Fig. 19 is a partially enlarged view of a portion K of fig. 18.
Fig. 20 is a partially enlarged view of a portion L of fig. 18.
Wherein: a main rotating shaft-1; a top plate-2; a chassis-3; a vertical rod-4; a wafer loading device fixing frame-5; a wafer loading device fixing frame rotation stopping device-6; top disc fin-7; a chassis fin-8; a vertical plate-9; a circular ring plate-10;
a horizontal jack-11; the fixing frame of the chip loading device is vertically inserted into the insertion hole-12; a horizontal inserted link-13; a splint-14; a rotation stopping rod-15; the fin plate is vertically inserted into the hole-16;
wafer basket-holding station-17; a cassette-holding station-18;
a frame-19; a main rotating shaft driving motor-20; a circulating water tank-21; a movable door-22;
a spray pipe-23; water jet-24; a hot air spraying pipe-25; a hot air spraying opening-26; a nitrogen spraying pipe-27; a nitrogen spraying port-28;
a wafer basket-29; a crystal box-30; a cavity-31; a wafer basket-32; a cassette-33; a bearing-34.
Detailed description of the preferred embodiments
The invention is further described below with reference to the following figures and examples.
Example 1. As shown in fig. 1-14, the cleaning device rotating frame includes a main rotating shaft 1 vertically disposed, a top plate 2 with a horizontal top surface, a bottom plate 3 with a horizontal top surface, a plurality of vertical rods 4 vertically disposed, a plurality of wafer loading device fixing frames 5, and a wafer loading device fixing frame rotation stopping device 6.
The top disc 2 and the bottom disc 3 are arranged on the main rotating shaft 1, and the central axis of the main rotating shaft 1, the central axis of the top disc 2 and the central axis of the bottom disc 3 are on the same vertical straight line; the diameters of the top disc 2 and the bottom disc 3 are the same.
Eight top disc fin plates 7 with horizontal top surfaces and horizontal bottom surfaces are annularly arrayed on the radial peripheral surface of the top disc 2, a chassis fin plate 8 with horizontal top surfaces and horizontal bottom surfaces is arranged under each top disc fin plate 7 on the radial peripheral surface of the chassis 3, and a vertical rod 4 is vertically arranged between each top disc fin plate 7 and the chassis fin plate 8 under the top disc fin plate 7.
A wafer loading device fixing frame 5 is arranged on each upright rod 4, and the wafer loading device fixing frame 5 can rotate along the central axis of the upright rod 4. The wafer loader holders 5 are arranged in an array around the main rotation axis 1.
The end of the top disc 2 far away from the main rotating shaft 1 is connected with the bottom disc 3 through four vertical plates 9; a plurality of circular ring plates 10 with horizontal top surfaces are arranged between the top disc 2 and the bottom disc 3, and the circular ring plates 10 are connected with the vertical plates 9.
The wafer loading device fixing frame rotation stopping device 6 comprises a horizontal insertion hole 11 formed in the top plate fin 7 and a vertical insertion hole 12 formed in the top end of the wafer loading device fixing frame 5, a horizontal insertion rod 13 is arranged on the horizontal insertion hole 11, a clamping plate 14 with an opening facing the direction away from the insertion rod and in a U shape is arranged on the horizontal insertion rod 13, and when the vertical insertion hole of the clamping plate 14 is aligned with the clamping plate 14, the wafer loading device fixing frame rotation stopping device fixing frame 5 is stopped by a vertical rotation stopping rod 15 inserted into the clamping plate 14 and the vertical insertion hole 12 of the wafer loading device fixing frame. The top end and the bottom end of the upright rod 4 are respectively connected with the top disc 2 and the bottom disc 3 through bearings 34.
Two wafer basket fixing stations 17 are arranged on the wafer loading device fixing frames 5.
Each wafer loading device fixing frame 5 is provided with a wafer box fixing station 18.
The wafer loading device fixing frame 5 is annularly arranged along the main rotating shaft 1, so that the cleaning space can be utilized to the maximum extent; each wafer loading device fixing frame 5 fixes 2 wafer basket fixing stations 17 and 1 crystal box fixing station 18, and the whole device can fix 16 wafer baskets and 8 crystal boxes. The wafer loading device fixing frame 5 can rotate along the central axis of the upright rod 4, and the angle of the wafer loading device fixing frame 5 can be changed during cleaning.
Example 2. As shown in fig. 17-20, the cleaning machine is characterized in that: the cleaning device comprises a closed rack 19, wherein a cleaning device rotating frame in embodiment 1 is arranged in the rack 19, a main rotating shaft driving motor 20, a water spraying device, a nitrogen spraying device, a hot air spraying device and a circulating water tank 21 are arranged in the rack 19, the main rotating shaft driving motor 20 is connected with the main rotating shaft 1, the circulating water tank 21 is arranged at the bottom end of the rack 19, and a movable door 22 for placing a wafer loading device is arranged on the rack 19.
The water spraying device comprises a water spraying pipe 23 vertically arranged on the outer side of the rotary frame of the cleaning device, and a plurality of water spraying nozzles 24 are arranged on the water spraying pipe 23.
The hot air spraying device comprises a hot air spraying pipe 25 vertically arranged on the outer side of the rotary frame of the cleaning device, and a plurality of hot air spraying openings 26 are formed in the hot air spraying pipe 25.
The nitrogen spraying device comprises a nitrogen spraying pipe 27 vertically arranged on the outer side of the rotating frame of the cleaning device, and a plurality of nitrogen spraying ports 28 are formed in the nitrogen spraying pipe 27.
The top end of the frame 19 is provided with a cavity 31, and the main rotating shaft driving motor 20 is arranged in the cavity 31.
When the device works, the movable door 22 is opened firstly, the movable door 22 is provided with a protection switch, and the movable door 22 is opened and does not run. Loading, mounting the crystal basket and the crystal box on a wafer loading device fixing frame 5, rotating the wafer loading device fixing frame 5 to a required direction, and fixing through a wafer loading device fixing frame rotation stopping device 6; loading the next wafer loading device fixing frame 5 until all the wafer loading device fixing frames 5 are completely loaded; when the door is closed, cleaning, water spraying and rotation are started. The wafer loader holder 5 is further opened to change the direction thereof as necessary, and the cleaning water is sprayed again to rotate the wafer loader holder. The time for starting to spray nitrogen and heating purified air for drying can be set, and when the time is up to the stop of operation, the movable door 22 is opened, and the material is taken. The FOU crystal box and the wafer basket with the size of 6 inches, 8 inches and 12 inches can be cleaned.
In the embodiment, the cleaning device rotating frame is arranged in a closed space, and the wafer loading device fixing frames 5 are annularly arranged along the main rotating shaft 1, so that the cleaning space can be utilized to the maximum extent; the wafer loading device fixing frame 5 can rotate along the central axis of the vertical rod 4, the angle of the wafer loading device fixing frame 5 can be changed once according to the requirement when each round of cleaning is carried out, the problems of mutual interference and local cleaning incompleteness among the crystal boxes when the number of the crystal boxes is large are solved, and all positions of a plurality of objects to be cleaned can be cleaned; a movable door 22 for placing a wafer loader is provided, and a cassette or a wafer basket can be loaded or unloaded from each wafer loader holder 5 through the movable door 22. The device is provided with a water spraying device, a nitrogen spraying device, a hot air spraying device and a circulating water tank 21, and is clean and efficient to clean.
Example 3. As shown in fig. 15 to 16, the wafer loader holder rotation stopping device 6 includes a plurality of fin plate vertical insertion holes 16 formed in the top plate fin plate 7, and a plurality of wafer loader holder vertical insertion holes 12 formed in the top end of the wafer loader holder 5, and when a fin plate vertical insertion hole 16 is aligned with a wafer loader holder vertical insertion hole 12, the wafer loader holder 5 is rotated by inserting the fin plate vertical insertion hole 16 and the vertical rotation stopping rod 15 of the wafer loader holder vertical insertion hole 12. The wafer loading device fixing frame 5 is sleeved on the upright rod 4.
The above-mentioned embodiments are only for understanding the present invention, and are not intended to limit the technical solutions of the present invention, and those skilled in the relevant art can make various changes or modifications, and all equivalent changes or modifications are intended to be included within the scope of the present invention. The present invention is not described in detail, but is known to those skilled in the art.
Claims (10)
1. Belt cleaning device swivel mount, its characterized in that: the device comprises a main rotating shaft (1) which is vertically arranged, a top disc (2) of which the top surface is a horizontal plane, a base disc (3) of which the top surface is a horizontal plane, a plurality of vertical rods (4) which are vertically arranged, a plurality of wafer loading device fixing frames (5) and a wafer loading device fixing frame rotation stopping device (6);
the top disc (2) and the bottom disc (3) are arranged on the main rotating shaft (1), and the central axis of the main rotating shaft (1), the central axis of the top disc (2) and the central axis of the bottom disc (3) are on the same vertical straight line; the diameters of the top disc (2) and the bottom disc (3) are the same;
a plurality of top disc fin plates (7) with horizontal top surfaces and horizontal bottom surfaces are annularly arrayed on the radial peripheral surface of the top disc (2), chassis fin plates (8) with horizontal top surfaces and horizontal bottom surfaces are arranged under the top disc fin plates (7) on the radial peripheral surface of the chassis (3), and vertical rods (4) are vertically arranged between the top disc fin plates (7) and the chassis fin plates (8) under the top disc fin plates;
a wafer loading device fixing frame (5) is arranged on each upright rod (4), and the wafer loading device fixing frame (5) can rotate along the central axis of the upright rod (4); the wafer loading device holders (5) are annularly arranged in an array along the main rotating shaft (1).
2. The cleaning apparatus spin stand of claim 1, wherein: the end of the top disc (2) far away from the main rotating shaft (1) is connected with the chassis (3) through a plurality of vertical plates (9); a plurality of circular ring plates (10) with horizontal top surfaces are arranged between the top disc (2) and the bottom disc (3), and the circular ring plates (10) are connected with the vertical plates (9).
3. The cleaning apparatus spin stand of claim 1, wherein: the wafer loading device fixing frame rotation stopping device (6) comprises a horizontal direction insertion hole (11) arranged on the top disc fin plate (7) and a vertical direction insertion hole (12) of the wafer loading device fixing frame arranged on the top end of the wafer loading device fixing frame (5), a horizontal insertion rod (13) is arranged on the horizontal direction insertion hole (11), a U-shaped clamping plate (14) with an opening facing to the direction far away from the insertion rod is arranged on the horizontal insertion rod (13), when the vertical direction insertion hole of the clamping plate (14) is aligned with the clamping plate (14), the wafer loading device fixing frame rotation stopping is realized through a vertical direction rotation stopping rod (15) which is inserted into the clamping plate (14) and the vertical direction insertion hole (12) of the wafer loading device fixing frame,
alternatively, the first and second electrodes may be,
the wafer loading device fixing frame rotation stopping device (6) comprises a plurality of fin plate vertical direction insertion holes (16) arranged on a top disc fin plate (7) and a plurality of wafer loading device fixing frame vertical direction insertion holes (12) arranged on the top end of the wafer loading device fixing frame (5), and when one fin plate vertical direction insertion hole (16) is aligned with one wafer loading device fixing frame vertical direction insertion hole (12), the wafer loading device fixing frame rotation stopping device fixing frame (5) is realized through inserting the fin plate vertical direction insertion hole (16) and a wafer loading device fixing frame vertical direction rotation stopping rod (15) of the wafer loading device fixing frame to the insertion hole (12).
4. The cleaning apparatus spin stand of claim 1, wherein: a plurality of wafer basket fixing stations (17) are arranged on the wafer loading device fixing frames (5).
5. The cleaning apparatus spin stand of claim 1, wherein: a plurality of crystal box fixing stations (18) are arranged on the wafer loading device fixing frame (5).
6. Cleaning machine, its characterized in that: the cleaning device comprises a closed machine frame (19), wherein a cleaning device rotating frame, a main rotating shaft driving motor (20), a water spraying device, a nitrogen spraying device, a hot air spraying device and a circulating water tank (21) are arranged in the machine frame (19), the cleaning device rotating frame is as claimed in any one of claims 1 to 5, the main rotating shaft driving motor (20) is connected with the main rotating shaft (1), the circulating water tank (21) is arranged at the bottom end of the machine frame (19), and a movable door (22) for placing a wafer loading device is arranged on the machine frame (19).
7. The cleaning machine of claim 6, wherein: the water spraying device comprises a water spraying pipe (23) which is vertically arranged on the outer side of the rotating frame of the cleaning device, and a plurality of water spraying nozzles (24) are arranged on the water spraying pipe (23).
8. The cleaning machine of claim 6, wherein: the hot air spraying device comprises a hot air spraying pipe (25) vertically arranged on the outer side of the rotary frame of the cleaning device, and a plurality of hot air spraying openings (26) are formed in the hot air spraying pipe (25).
9. The cleaning machine of claim 6, wherein: the nitrogen spraying device comprises a nitrogen spraying pipe (27) vertically arranged on the outer side of the rotating frame of the cleaning device, and a plurality of nitrogen spraying ports (28) are arranged on the nitrogen spraying pipe (27).
10. The cleaning machine of claim 6, wherein: a cavity (31) is arranged at the top end of the frame (19), and the main rotating shaft driving motor (20) is arranged in the cavity (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111564505.7A CN114171441A (en) | 2021-12-21 | 2021-12-21 | Cleaning device rotating frame and cleaning machine adopting same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111564505.7A CN114171441A (en) | 2021-12-21 | 2021-12-21 | Cleaning device rotating frame and cleaning machine adopting same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114171441A true CN114171441A (en) | 2022-03-11 |
Family
ID=80487533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111564505.7A Pending CN114171441A (en) | 2021-12-21 | 2021-12-21 | Cleaning device rotating frame and cleaning machine adopting same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114171441A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115213183A (en) * | 2022-08-03 | 2022-10-21 | 东莞市凯迪微智能装备有限公司 | Wafer box cleaning equipment and cleaning process thereof |
-
2021
- 2021-12-21 CN CN202111564505.7A patent/CN114171441A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115213183A (en) * | 2022-08-03 | 2022-10-21 | 东莞市凯迪微智能装备有限公司 | Wafer box cleaning equipment and cleaning process thereof |
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