CN114164476A - Conductive copper bar, hanger assembly and electroplating equipment - Google Patents
Conductive copper bar, hanger assembly and electroplating equipment Download PDFInfo
- Publication number
- CN114164476A CN114164476A CN202010947792.9A CN202010947792A CN114164476A CN 114164476 A CN114164476 A CN 114164476A CN 202010947792 A CN202010947792 A CN 202010947792A CN 114164476 A CN114164476 A CN 114164476A
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- copper bar
- conductive copper
- contact
- hanger
- fixed
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The application discloses copper bar, hanger subassembly and electroplating device lead to electricity, this copper bar includes: the fixed end is provided with a fixed hole and is fixedly connected with the hanging rack through the fixed hole; the groove is arranged at one end of the fixed end; and the contact bosses are arranged in the grooves and are used for conducting contact with the vertical continuous electroplating line conductive copper bars. This application is through setting up two at least contact boss, increases the contact point position of the electrically conductive copper bar of electrically conductive copper bar and perpendicular continuous electric plate wire, improves the electrically conductive copper bar of perpendicular continuous electric plate wire and the problem of stores pylon electrically conductive copper bar because of dirty contact failure, improves the copper facing effect of perpendicular continuous electroplating device.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a conductive copper bar, a hanger assembly and electroplating equipment.
Background
An important link in the current closed loop of the existing vertical continuous electroplating equipment is the contact between the conductive copper bar of the vertical continuous electroplating line and the conductive copper bar of the hanging rack, and if the contact between the conductive copper bar and the hanging rack is poor, the copper plating effect of the printed circuit board can be influenced. The contact surface of the conductive copper bar of the vertical continuous electroplating line and the contact surface of the conductive copper bar of the hanging rack are both planes, and the friction between the conductive copper bar of the vertical continuous electroplating line and the conductive copper bar of the hanging rack is reduced by smearing conductive oil on the contact surfaces of the conductive copper bar of the hanging rack and the conductive copper bar of the vertical continuous electroplating line, and the conductivity of the conductive copper bar and the conductive copper bar of the hanging rack is increased.
Disclosure of Invention
The application provides a conductive copper bar, hanger subassembly and electroplating device, has solved the stores pylon and has moved on the electroplating line for a long time, scribbles oily conductive oil because of perpendicular continuous electroplating line's conductive copper bar and stores pylon conductive copper bar, can accumulate on the conductive copper bar dirty, leads to the contact surface bad, and electric conductivity variation influences the problem of final copper-plating effect.
In order to solve the technical problem, the application adopts a technical scheme that: the utility model provides a conductive copper bar, conductive copper bar is used for electrically conductive with perpendicular continuous electric plate wire conductive copper bar contact when with stores pylon simultaneous movement, and this conductive copper bar includes: the fixed end is provided with a fixed hole and is fixedly connected with the hanging rack through the fixed hole; the groove is arranged at one end of the fixed end; and the contact bosses are arranged in the grooves and are used for conducting contact with the vertical continuous electroplating line conductive copper bars.
Wherein the thickness of the contact boss is set to 5 mm.
Wherein, the fixed orifices are provided with a plurality of.
Wherein, a certain distance is arranged between the edge of the contact boss and the edge of the groove.
Wherein, a certain distance is arranged between the contact boss and one end of the fixed end connected with the groove.
Wherein the pitch is set to 5 mm.
Wherein, the contact boss is provided with a buffer mechanism.
Wherein the contact plane of the contact boss is flush with the fixed end.
In order to solve the above technical problem, the present application adopts another technical solution: the utility model provides a hanger subassembly, hanger subassembly includes stores pylon and electrically conductive copper bar, and electrically conductive copper bar passes through the fixed orifices to be fixed on the stores pylon, and electrically conductive copper bar is above-mentioned arbitrary electrically conductive copper bar.
In order to solve the above technical problem, the present application adopts another technical solution: the electroplating equipment comprises a hanger component, a driving component and a vertical continuous electroplating line conductive copper bar, wherein the hanger component is fixed on the driving component and moves synchronously with the driving component, the hanger component is in contact with the vertical continuous electroplating line conductive copper bar in the moving process and conducts electricity, and the hanger component is the hanger component.
The beneficial effect of this application is: being different from the condition of prior art, this application provides a copper busbar, and this copper busbar includes: the fixed end is provided with a fixed hole and is fixedly connected with the hanging rack through the fixed hole; the groove is arranged at one end of the fixed end; and the contact bosses are arranged in the grooves and are used for conducting contact with the vertical continuous electroplating line conductive copper bars. This application is through setting up two at least contact boss, increases the contact point position of the electrically conductive copper bar of electrically conductive copper bar and perpendicular continuous electric plate wire, improves the electrically conductive copper bar of perpendicular continuous electric plate wire and the problem of stores pylon electrically conductive copper bar because of dirty contact failure, improves the copper facing effect of perpendicular continuous electroplating device.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
fig. 1 is a schematic structural diagram of a first embodiment of a conductive copper bar provided in the present application;
FIG. 2 is a left side view of the copper bar of FIG. 1;
fig. 3 is a schematic structural diagram of a second embodiment of a conductive copper bar provided in the present application;
FIG. 4 is a left side view of the copper bar of FIG. 3;
fig. 5 is a schematic cross-sectional structure view of the section a-a of the copper conductive bar of fig. 3;
FIG. 6 is a schematic structural view of one embodiment of a hanger assembly provided herein;
FIG. 7 is a schematic structural diagram of an embodiment of an electroplating apparatus provided herein.
Detailed Description
In order to make the technical problems solved, the technical solutions adopted, and the technical effects achieved by the present application clearer, the technical solutions of the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of a first embodiment of a conductive copper bar provided in the present application, and fig. 2 is a left side view of the conductive copper bar of fig. 1. The copper busbar 10 includes a fixed end 101, a groove 102, and at least two contact bumps 103.
In this embodiment, the fixing end 101 is provided with a plurality of fixing holes 104, and the copper busbar 10 is fixedly connected to the rack through the fixing holes 104. Meanwhile, the conductive copper bar 10 is also connected with a power supply of the electroplating equipment through the fixing hole 104, so as to provide current for the electroplating equipment to carry out copper plating on the printed circuit board.
In the present embodiment, the groove 102 is disposed at one end of the fixed end 101, the length of the groove 102 is the same as that of the fixed end 101, and the depth of the groove 102 can be set according to practical situations, for example, the depth of the groove 102 is set to 5 mm.
In the embodiment, at least two contact bosses 103 are arranged in the groove 102, the thickness of the contact boss 103 is set to be 5mm, and the contact plane of the contact boss 103, which is contacted with the vertical continuous plating line conductive copper bar, is kept flush with the plane of the fixed end 101. The contact boss 103 is provided with a certain distance from the edge of the groove 102. Specifically, a certain distance is arranged between the contact boss 103 and the end of the fixed end 101 connected with the groove 102, and the distance can be set according to actual conditions, and optionally, the distance between the contact boss 103 and the end of the fixed end 101 connected with the groove 102 is set to be 5 mm. The distance between the two contact projections 103 can be set as the case may be, and is not limited here.
In this embodiment, the conductive copper bar 10 is fixed on a rack, and the rack moves on the line body through a driving assembly. When the hanger is driven by the driving assembly to move on the line body, the conductive copper bar 10 synchronously moves on the line body together with the hanger, and the conductive copper bar 10 is in contact conduction with the vertical continuous electroplating line conductive copper bar in the moving process of the conductive copper bar, so that the copper plating process of the printed circuit board is realized. Specifically, the surface coating of the contact boss 103 of the conductive copper bar 10 has the conductive oil, and when the conductive copper bar 10 moves on the line body along with the hanger in synchronization, at least two contact bosses 103 of the conductive copper bar 10 are in contact conduction with the vertical continuous plating line conductive copper bar. When the conductivity of the contact boss 103 is deteriorated due to the dirt accumulated on the conductive oil in at least two contact bosses 103, the groove 102 exists between two adjacent contact bosses 103, which does not affect each other, and the conductivity of other contact bosses 103 remains unchanged, so that the conductivity of the whole conductive copper bar 10 is not deteriorated due to the poor contact of the dirt on part of the contact bosses 103.
Difference and prior art, this application provides a copper busbar, and this copper busbar includes: the fixed end is provided with a fixed hole and is fixedly connected with the hanging rack through the fixed hole; the groove is arranged at one end of the fixed end; and the contact bosses are arranged in the grooves and are used for conducting contact with the vertical continuous electroplating line conductive copper bars. This application is through setting up two at least contact boss, increases the contact point position of the electrically conductive copper bar of electrically conductive copper bar and perpendicular continuous electric plate wire, improves the electrically conductive copper bar of perpendicular continuous electric plate wire and the problem of stores pylon electrically conductive copper bar because of dirty contact failure, improves the copper facing effect of perpendicular continuous electroplating device.
Referring to fig. 3, fig. 4 and fig. 5, fig. 3 is a schematic structural view of a second embodiment of the conductive copper bar provided in the present application, fig. 4 is a left side view of the conductive copper bar of fig. 3, and fig. 5 is a schematic structural view of a cross-section a-a of the conductive copper bar of fig. 3. The copper conductive bar 20 includes a fixed end 201, a groove 202, and at least two contact bumps 203.
In the embodiment, the fixing end 201 is provided with a plurality of fixing holes 204, and the copper busbar 20 is fixedly connected to the rack through the fixing holes 204. Meanwhile, the conductive copper bar 20 is also connected with a power supply of the electroplating equipment through the fixing hole 204, so as to provide current for the electroplating equipment to carry out copper plating on the printed circuit board.
In the present embodiment, the groove 202 is disposed at one end of the fixing end 201, the length of the groove 202 is the same as the length of the fixing end 201, and the depth of the groove 202 can be set according to practical situations, for example, the depth of the groove 202 is set to 5 mm.
In the embodiment, at least two contact bosses 203 are arranged in the groove 202, the thickness of the contact bosses 203 is set to be 5mm, and the contact plane of the contact bosses 203 contacted with the vertical continuous plating line conductive copper bar is kept flush with the plane of the fixed end 201. The contact boss 203 is provided with a certain distance from the edge of the groove 202. Specifically, a certain distance is arranged between the contact boss 203 and the end of the fixed end 201 connected with the groove 202, the distance can be set according to actual conditions, and optionally, the distance between the contact boss 203 and the end of the fixed end 201 connected with the groove 202 is set to be 5 mm. The distance between the two contact projections 203 can be set as the case may be, and is not limited here.
In the present embodiment, the contact boss 203 is provided with the buffer mechanisms 205, wherein the buffer mechanisms 205 are provided at both ends of the contact boss 203 in the direction of the movement of the wire body. Specifically, buffer 205 sets up to chamfer or round angle shape for electrically conductive copper bar 20 is following the synchronous online body direction motion of stores pylon, and contact boss 203 is more stable with perpendicular continuous electric plate wire electrically conductive copper bar contact in-process, avoids electrically conductive copper bar 20 and perpendicular continuous electric plate wire electrically conductive copper bar contact striking in the twinkling of an eye to rock the unstability that leads to electroplating equipment structure.
In this embodiment, the conductive copper bar 20 is fixed on a rack, and the rack moves on the line body through a driving assembly. When the hanger is driven by the driving assembly to move on the line body, the conductive copper bar 20 synchronously moves on the line body together with the hanger, and the conductive copper bar 20 is in contact conduction with the vertical continuous electroplating line conductive copper bar in the moving process of the conductive copper bar, so that the copper plating process of the printed circuit board is realized. Specifically, the surface coating of the contact boss 203 of the conductive copper bar 20 has the conductive oil, and when the conductive copper bar 20 moves on the line body along with the hanger in synchronization, at least two contact bosses 203 of the conductive copper bar 20 are in contact conduction with the vertical continuous plating line conductive copper bar. When the conductivity of the contact boss 203 is deteriorated due to the dirt accumulated on the conductive oil in at least two contact bosses 203, the groove 202 is formed between two adjacent contact bosses 203, and the conductivity of the other contact bosses 203 is still maintained, so that the conductivity of the whole conductive copper bar 20 is not deteriorated due to the poor contact of the dirt on the part of the contact bosses 203.
Difference and prior art, this application provides a copper busbar, and this copper busbar includes: the fixed end is provided with a fixed hole and is fixedly connected with the hanging rack through the fixed hole; the groove is arranged at one end of the fixed end; and the contact bosses are arranged in the grooves and are used for conducting contact with the vertical continuous electroplating line conductive copper bars. This application is through setting up two at least contact boss, increases the contact point position of the electrically conductive copper bar of electrically conductive copper bar and perpendicular continuous electric plate wire, improves the electrically conductive copper bar of perpendicular continuous electric plate wire and the problem of stores pylon electrically conductive copper bar because of dirty contact failure, improves the copper facing effect of perpendicular continuous electroplating device.
Referring to fig. 6, fig. 6 is a schematic structural diagram of an embodiment of a hanger assembly provided in the present application. The hanger assembly 60 includes a hanger 601 and a copper conductive bar 602.
In this embodiment, the copper busbar 602 is fixed on the rack 601 through a fixing hole, and the copper busbar 602 is any one of the above copper busbars. The conductive copper bar 602 can also be connected with a power supply of electroplating equipment through the fixing hole, so that the conductive copper bar 602 is in contact conduction with the vertical continuous electroplating line conductive copper bar in the process of synchronously moving on the line body with the hanging rack 601, and current is provided for copper plating of the printed circuit board.
In this embodiment, the copper busbar 602 is fixed on the hanger 601 through the fixing hole. The copper busbar 602 is any one of the above copper busbars. The conductive copper bar 602 is fixed on the hanger 601, and the hanger 601 moves on the line body through the driving assembly. When the hanging rack 601 is driven by the driving assembly to move on the line body, the conductive copper bar 602 synchronously moves on the line body together with the hanging rack 601, and the conductive copper bar 602 is in contact conduction with the vertical continuous electroplating line conductive copper bar in the moving process, so that the copper plating process of the printed circuit board is realized. Specifically, the surface of the contact boss of the conductive copper bar 602 is coated with conductive oil, and when the conductive copper bar 602 moves on the line body along with the hanger, at least two contact bosses of the conductive copper bar 602 are in contact conduction with the vertical continuous electroplating line conductive copper bar. Wherein, when the partial electric conductivity that leads to this contact boss worsens because of the dirty electric conduction oil of accumulation in two at least contact bosses, because there is the recess between two adjacent contact bosses, do not influence each other, the electric conductivity of other contact bosses remains unchanged for the electric conductivity of whole electrically conductive copper bar 602 can not be because of partial contact boss because dirty contact failure worsens.
Difference and prior art, this application provides a hanger subassembly, and this hanger subassembly includes stores pylon and conductive copper bar, and conductive copper bar passes through the fixed orifices to be fixed on the stores pylon, and conductive copper bar is the conductive copper bar of above-mentioned arbitrary item. This application is through setting up two at least contact boss, increases the contact point position of the electrically conductive copper bar of electrically conductive copper bar and perpendicular continuous electric plate wire, improves the electrically conductive copper bar of perpendicular continuous electric plate wire and the problem of stores pylon electrically conductive copper bar because of dirty contact failure, improves the copper facing effect of perpendicular continuous electroplating device.
Referring to fig. 7, fig. 7 is a schematic structural diagram of an embodiment of an electroplating apparatus according to the present application. The plating apparatus 70 includes a hanger assembly 701, a driving assembly 702, and a vertical continuous plating line copper conductive bar 703.
In this embodiment, the hanger assembly 701 is fixed on the driving assembly 702 and moves synchronously with the driving assembly 702, the hanger assembly 701 is in contact with the conductive copper bar 703 of the vertical continuous plating line for conduction during the movement, and the hanger assembly 701 is the hanger assembly described above. Specifically, the hanger assembly 701 includes a conductive copper bar 7011 and a hanger 7012, the conductive copper bar 7011 is fixed to the hanger 7012 through a fixing hole, and the conductive copper bar 7011 is any one of the conductive copper bars. The conductive copper bar 7011 can also be connected to a power supply of the electroplating device 70 through the fixing hole, so that the conductive copper bar 7011 is in contact with and conducted with the vertical continuous electroplating line conductive copper bar 703 during the process of synchronously moving on the line body with the rack 7012, thereby providing current for copper plating of the printed circuit board.
In this embodiment, the conductive copper bar 7011 is fixed on the rack 7012, and the rack 7012 is driven by the driving assembly 702 to move on a wire. When the hanging rack 7012 is driven by the driving assembly to move on the line body, the conductive copper bar 7011 synchronously moves on the line body with the hanging rack 7012, and in the moving process of the conductive copper bar 7011, the conductive copper bar is in contact conduction with the vertical continuous electroplating line conductive copper bar 703, so that the copper plating process of the printed circuit board is realized. Specifically, the surface of the contact boss of the conductive copper bar 7011 is coated with conductive oil, and when the conductive copper bar 7011 moves on the line body along with the hanger 7012, at least two contact bosses of the conductive copper bar 7011 are in contact conduction with the vertical continuous electroplating line conductive copper bar 703. Wherein, when the partial electric conductivity that leads to this contact boss worsens because of the dirty electric oil of accumulation in two at least contact bosses, because there is the recess between two adjacent contact bosses, do not influence each other, the electric conductivity of other contact bosses remains unchanged for the electric conductivity of whole electrically conductive copper bar 7011 can not be because of partial contact boss because dirty contact is bad and the variation.
Being different from prior art, this application provides an electroplating device, and this electroplating device includes hanger subassembly, drive assembly and perpendicular continuous plating line conductive copper bar, and hanger subassembly is fixed on drive assembly, and with drive assembly synchronous motion, it is electrically conductive to contact with perpendicular continuous plating line conductive copper bar in the motion process, and hanger subassembly is foretell hanger subassembly. This application is through setting up two at least contact boss, increases the contact point position of the electrically conductive copper bar of electrically conductive copper bar and perpendicular continuous electric plate wire, improves the electrically conductive copper bar of perpendicular continuous electric plate wire and the problem of stores pylon electrically conductive copper bar because of dirty contact failure, improves the copper facing effect of perpendicular continuous electroplating device.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.
Claims (10)
1. The utility model provides a conductive copper bar, conductive copper bar is used for and stores pylon synchronous motion when electrically conductive copper bar contact electrically conducts with perpendicular continuous electric plate wire, its characterized in that, conductive copper bar includes:
the fixed end is provided with a fixed hole and is fixedly connected with the hanging rack through the fixed hole;
the groove is arranged at one end of the fixed end;
and the contact bosses are arranged in the grooves and are used for conducting contact with the vertical continuous electroplating line conductive copper bars.
2. The copper busbar according to claim 1, wherein the contact boss is provided with a thickness of 5 mm.
3. The copper busbar according to claim 1, wherein the fixing hole is provided in plurality.
4. The copper busbar of claim 1, wherein a space is provided between the contact boss edge and the groove edge.
5. The copper busbar according to claim 4, wherein a space is provided between the contact boss and the end of the fixed end connected to the groove.
6. The bar of electrically conductive copper of claim 5, wherein the pitch is set to 5 mm.
7. The copper busbar of claim 1, wherein the contact boss is provided with a buffer mechanism.
8. The copper busbar of claim 1, wherein the contact plane of the contact boss remains flush with the fixed end.
9. A hanger assembly, characterized in that the hanger assembly comprises a hanger and a conductive copper bar, the conductive copper bar is fixed on the hanger through a fixing hole, and the conductive copper bar is the conductive copper bar according to any one of claims 1 to 8.
10. An electroplating apparatus, comprising a hanger assembly, a driving assembly and a vertical continuous electroplating line conductive copper bar, wherein the hanger assembly is fixed on the driving assembly and moves synchronously with the driving assembly, and the hanger assembly is contacted with the vertical continuous electroplating line conductive copper bar for conduction in the moving process, and is the hanger assembly of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010947792.9A CN114164476B (en) | 2020-09-10 | 2020-09-10 | Conductive copper bar, hanger assembly and electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010947792.9A CN114164476B (en) | 2020-09-10 | 2020-09-10 | Conductive copper bar, hanger assembly and electroplating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114164476A true CN114164476A (en) | 2022-03-11 |
| CN114164476B CN114164476B (en) | 2023-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010947792.9A Active CN114164476B (en) | 2020-09-10 | 2020-09-10 | Conductive copper bar, hanger assembly and electroplating equipment |
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Citations (7)
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|---|---|---|---|---|
| US6239408B1 (en) * | 1998-06-30 | 2001-05-29 | Matsushita Electric Industrial Co., Ltd. | Positioner |
| JP2003027292A (en) * | 2001-07-06 | 2003-01-29 | Kida Seiko Kk | Click feed conveyance equipment for continuous electroplating |
| JP2005248300A (en) * | 2004-03-08 | 2005-09-15 | Sumitomo Bakelite Co Ltd | Plating feeding holder |
| CN103046106A (en) * | 2011-10-12 | 2013-04-17 | 丸仲工业株式会社 | Lubricating grease supply system of conveying-type continuous plating device |
| CN207713845U (en) * | 2017-12-15 | 2018-08-10 | 亚硕企业股份有限公司 | the conductive mechanism of electroplating device |
| CN207810454U (en) * | 2017-12-22 | 2018-09-04 | 昆山博通机械设备有限公司 | Novel single sprocket chain conduction transfer hanger |
| CN211456946U (en) * | 2020-03-30 | 2020-09-08 | 江苏益肯电工科技有限公司 | Electric brush with ash removing groove |
-
2020
- 2020-09-10 CN CN202010947792.9A patent/CN114164476B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6239408B1 (en) * | 1998-06-30 | 2001-05-29 | Matsushita Electric Industrial Co., Ltd. | Positioner |
| JP2003027292A (en) * | 2001-07-06 | 2003-01-29 | Kida Seiko Kk | Click feed conveyance equipment for continuous electroplating |
| JP2005248300A (en) * | 2004-03-08 | 2005-09-15 | Sumitomo Bakelite Co Ltd | Plating feeding holder |
| CN103046106A (en) * | 2011-10-12 | 2013-04-17 | 丸仲工业株式会社 | Lubricating grease supply system of conveying-type continuous plating device |
| CN207713845U (en) * | 2017-12-15 | 2018-08-10 | 亚硕企业股份有限公司 | the conductive mechanism of electroplating device |
| CN207810454U (en) * | 2017-12-22 | 2018-09-04 | 昆山博通机械设备有限公司 | Novel single sprocket chain conduction transfer hanger |
| CN211456946U (en) * | 2020-03-30 | 2020-09-08 | 江苏益肯电工科技有限公司 | Electric brush with ash removing groove |
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| CN114164476B (en) | 2023-03-28 |
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