CN114163948A - High-temperature-resistant waterproof inorganic glue and preparation method and application thereof - Google Patents
High-temperature-resistant waterproof inorganic glue and preparation method and application thereof Download PDFInfo
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- CN114163948A CN114163948A CN202111456800.0A CN202111456800A CN114163948A CN 114163948 A CN114163948 A CN 114163948A CN 202111456800 A CN202111456800 A CN 202111456800A CN 114163948 A CN114163948 A CN 114163948A
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- 239000003292 glue Substances 0.000 title claims abstract description 41
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims abstract description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 26
- 230000002940 repellent Effects 0.000 claims abstract description 15
- 239000005871 repellent Substances 0.000 claims abstract description 15
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 13
- 239000006184 cosolvent Substances 0.000 claims abstract description 13
- 239000003063 flame retardant Substances 0.000 claims abstract description 13
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 claims abstract description 13
- 239000004640 Melamine resin Substances 0.000 claims abstract description 11
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 11
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000839 emulsion Substances 0.000 claims abstract description 11
- 239000004816 latex Substances 0.000 claims abstract description 11
- 229920000126 latex Polymers 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 8
- 238000003756 stirring Methods 0.000 claims description 47
- 239000000203 mixture Substances 0.000 claims description 39
- 238000005303 weighing Methods 0.000 claims description 20
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 12
- -1 fatty acid aluminum salt Chemical class 0.000 claims description 12
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 10
- 239000008367 deionised water Substances 0.000 claims description 10
- 229910021641 deionized water Inorganic materials 0.000 claims description 10
- 239000004952 Polyamide Substances 0.000 claims description 6
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 6
- 229920002396 Polyurea Polymers 0.000 claims description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 6
- 239000004202 carbamide Substances 0.000 claims description 6
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 6
- AAQNGTNRWPXMPB-UHFFFAOYSA-N dipotassium;dioxido(dioxo)tungsten Chemical compound [K+].[K+].[O-][W]([O-])(=O)=O AAQNGTNRWPXMPB-UHFFFAOYSA-N 0.000 claims description 6
- 239000000194 fatty acid Substances 0.000 claims description 6
- 229930195729 fatty acid Natural products 0.000 claims description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- 229920000570 polyether Polymers 0.000 claims description 6
- XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 claims description 6
- 239000011787 zinc oxide Substances 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 239000012752 auxiliary agent Substances 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract description 2
- 230000008595 infiltration Effects 0.000 abstract description 2
- 238000001764 infiltration Methods 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
- C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C09J131/04—Homopolymers or copolymers of vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention discloses high-temperature-resistant waterproof inorganic glue and a preparation method and application thereof, wherein the high-temperature-resistant waterproof inorganic glue is prepared from the following raw materials in parts by weight: 20-35 parts of white latex, 15-25 parts of sodium stearate, 13-17 parts of acrylic emulsion, 12-18 parts of melamine resin, 15-20 parts of talcum powder, 8-12 parts of ethylene glycol, 4-8 parts of flame retardant, 5-9 parts of water repellent agent, 2-3 parts of defoaming agent, 2-5 parts of flatting agent and 4-7 parts of cosolvent, and the beneficial effects of the invention are that: through adding multiple auxiliary agents in the raw materials, and the cooperation sodium stearate for the inorganic glue of preparation has good high temperature resistance, is difficult for melting in high temperature environment, simultaneously through adding water repellent in the component, makes the inorganic glue of preparation have good water resistance, thereby can avoid taking place the phenomenon of infiltration, is favorable to actual use.
Description
Technical Field
The invention relates to the technical field of inorganic glue, in particular to high-temperature-resistant waterproof inorganic glue and a preparation method and application thereof.
Background
In the existing life, inorganic glue is a chemical component without magnesium, phosphorus, aluminum, iron and the like in an additive, has good chemical activity, is waterproof and moistureproof, and reduces the reduction amount of fixed carbon, and so-called organic glue is glue containing organic components.
However, most of the inorganic glue prepared and produced in the prior art has single component, can only meet the requirement of simple bonding function, lacks certain high temperature resistance, is very easy to melt in a high temperature environment, and is not beneficial to use in the high temperature environment, and most of the inorganic glue prepared and produced in the prior art has no waterproof performance, is easy to have water seepage phenomenon when being used for sealing or bonding, and is not beneficial to practical use.
Disclosure of Invention
The invention aims to provide high-temperature-resistant waterproof inorganic glue and a preparation method and application thereof, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme that the high-temperature-resistant waterproof inorganic glue is prepared from the following raw materials in parts by weight: 20-35 parts of white latex, 15-25 parts of sodium stearate, 13-17 parts of acrylic emulsion, 12-18 parts of melamine resin, 15-20 parts of talcum powder, 8-12 parts of ethylene glycol, 4-8 parts of flame retardant, 5-9 parts of water repellent agent, 2-3 parts of defoaming agent, 2-5 parts of flatting agent and 4-7 parts of cosolvent.
Preferably, the flame retardant is one of potassium tungstate and sodium tungstate.
Preferably, the water repellent agent is one of fatty acid aluminum salt or polyamide polyurea.
Preferably, the defoaming agent is one of silicone or polyether.
Preferably, the leveling agent is one of poly terephthalic acid or polydimethylsiloxane.
Preferably, the cosolvent is one of urea and zinc oxide.
The preparation method of the high-temperature-resistant waterproof inorganic glue comprises the following steps:
s1, weighing white latex, sodium stearate, acrylic emulsion, melamine resin, talcum powder and ethylene glycol according to the formula parts, mixing, pouring into a stirrer, setting the stirring speed at 2000-3000r/min, and the stirring time at 15-28min, and obtaining a mixture I after stirring;
s2, weighing the flame retardant according to the formula parts, adding the flame retardant into the mixture I, setting the stirring speed at 1500-;
s3, weighing the water repellent agent according to the formula parts, adding the water repellent agent into the mixture II, setting the stirring speed at 1200-1800r/min, setting the stirring time at 6-9min, and obtaining a mixture III after the stirring is finished;
s4, weighing the defoaming agent, the leveling agent and the cosolvent according to the formula parts, sequentially adding the defoaming agent, the leveling agent and the cosolvent into the mixture III, setting the stirring speed at 2500-;
and S5, adding deionized water into the obtained mixture IV, and adjusting the viscosity to be used so as to obtain the high-temperature-resistant waterproof inorganic glue.
The application mode of the high-temperature-resistant waterproof inorganic glue is that the mixture IV with the viscosity adjusted by adding the deionized water is smeared on an article and stands for more than 30min at the temperature of 10-25 ℃.
Compared with the prior art, the invention has the beneficial effects that:
through adding multiple auxiliary agents in the raw materials, and the cooperation sodium stearate for the inorganic glue of preparation has good high temperature resistance, is difficult for melting in high temperature environment, simultaneously through adding water repellent in the component, makes the inorganic glue of preparation have good water resistance, thereby can avoid taking place the phenomenon of infiltration, is favorable to actual use.
Detailed Description
The invention provides a technical scheme that: the high-temperature-resistant waterproof inorganic glue is prepared from the following raw materials in parts by weight: 20-35 parts of white latex, 15-25 parts of sodium stearate, 13-17 parts of acrylic emulsion, 12-18 parts of melamine resin, 15-20 parts of talcum powder, 8-12 parts of ethylene glycol, 4-8 parts of flame retardant, 5-9 parts of water repellent agent, 2-3 parts of defoaming agent, 2-5 parts of flatting agent and 4-7 parts of cosolvent.
Wherein, the flame retardant is one of potassium tungstate and sodium tungstate.
Wherein the water repellent agent is one of fatty acid aluminum salt or polyamide polyurea.
Wherein, the defoaming agent is one of organic silicon or polyether.
Wherein, the leveling agent is one of polyterephthalic acid or polydimethylsiloxane.
Wherein, the cosolvent is one of urea or zinc oxide.
The preparation method of the high-temperature-resistant waterproof inorganic glue comprises the following steps:
s1, weighing white latex, sodium stearate, acrylic emulsion, melamine resin, talcum powder and ethylene glycol according to the formula parts, mixing, pouring into a stirrer, setting the stirring speed at 2000-3000r/min, and the stirring time at 15-28min, and obtaining a mixture I after stirring;
s2, weighing the flame retardant according to the formula parts, adding the flame retardant into the mixture I, setting the stirring speed at 1500-;
s3, weighing the water repellent agent according to the formula parts, adding the water repellent agent into the mixture II, setting the stirring speed at 1200-1800r/min, setting the stirring time at 6-9min, and obtaining a mixture III after the stirring is finished;
s4, weighing the defoaming agent, the leveling agent and the cosolvent according to the formula parts, sequentially adding the defoaming agent, the leveling agent and the cosolvent into the mixture III, setting the stirring speed at 2500-;
and S5, adding deionized water into the obtained mixture IV, and adjusting the viscosity to be used so as to obtain the high-temperature-resistant waterproof inorganic glue.
The application mode of the high-temperature-resistant waterproof inorganic glue is that the mixture IV with the viscosity adjusted by adding the deionized water is smeared on an article and stands for more than 30min at the temperature of 10-25 ℃.
Example 1, the high-temperature resistant waterproof inorganic glue is prepared from the following raw materials in parts by weight: 20 parts of white latex, 15 parts of sodium stearate, 13 parts of acrylic emulsion, 12 parts of melamine resin, 15 parts of talcum powder, 8 parts of ethylene glycol, 4 parts of potassium tungstate, 5 parts of fatty acid aluminum salt, 2 parts of organic silicon, 2 parts of poly terephthalic acid and 4 parts of urea.
A preparation method of high-temperature-resistant waterproof inorganic glue comprises the following steps:
s1, weighing white latex, sodium stearate, acrylic emulsion, melamine resin, talcum powder and ethylene glycol according to the formula parts, mixing, pouring into a stirrer, setting the stirring speed at 2000r/min, and stirring for 15min to obtain a first mixture after stirring;
s2, weighing potassium tungstate according to the formula parts, adding the potassium tungstate into the first mixture, setting the stirring speed to be 1500r/min, setting the stirring time to be 5min, and obtaining a second mixture after stirring;
s3, weighing fatty acid aluminum salt according to the formula parts, adding the fatty acid aluminum salt into the mixture II, setting the stirring speed to 1200r/min, setting the stirring time to 6min, and obtaining a mixture III after stirring;
s4, weighing organic silicon, poly (terephthalic acid) and urea according to the formula parts, sequentially adding the organic silicon, the poly (terephthalic acid) and the urea into the third mixture, setting the stirring speed to be 2500r/min, and the stirring time to be 20min, and obtaining a fourth mixture after the stirring is finished;
and S5, adding deionized water into the obtained mixture IV, and adjusting the viscosity to be used so as to obtain the high-temperature-resistant waterproof inorganic glue.
The application mode of the high-temperature-resistant waterproof inorganic glue is that the mixture IV with the viscosity adjusted by adding the deionized water is smeared on an article and stands for more than 30min at the temperature of 10 ℃.
Embodiment 2, a high temperature resistant waterproof inorganic glue, which is prepared from the following raw materials in parts by weight: 35 parts of white latex, 25 parts of sodium stearate, 17 parts of acrylic emulsion, 18 parts of melamine resin, 20 parts of talcum powder, 12 parts of ethylene glycol, 8 parts of sodium tungstate, 9 parts of polyamide polyurea, 3 parts of polyether, 5 parts of polydimethylsiloxane and 7 parts of zinc oxide.
A preparation method of high-temperature-resistant waterproof inorganic glue comprises the following steps:
s1, weighing white latex, sodium stearate, acrylic emulsion, melamine resin, talcum powder and ethylene glycol according to the formula parts, mixing, pouring into a stirrer, setting the stirring speed to be 3000r/min, and stirring for 28min to obtain a mixture I;
s2, weighing sodium tungstate according to the formula parts, adding the sodium tungstate into the first mixture, setting the stirring speed to be 2000r/min, setting the stirring time to be 8min, and obtaining a second mixture after stirring;
s3, weighing polyamide polyurea according to the formula parts, adding the polyamide polyurea into the mixture II, setting the stirring speed to be 1800r/min, setting the stirring time to be 9min, and obtaining a mixture III after stirring;
s4, weighing polyether, polydimethylsiloxane and zinc oxide according to the formula parts, sequentially adding the polyether, polydimethylsiloxane and zinc oxide into the third mixture, setting the stirring speed to be 4000r/min and the stirring time to be 35min, and obtaining a fourth mixture after stirring is finished;
and S5, adding deionized water into the obtained mixture IV, and adjusting the viscosity to be used so as to obtain the high-temperature-resistant waterproof inorganic glue.
The application mode of the high-temperature-resistant waterproof inorganic glue is that the mixture IV with the viscosity adjusted by adding the deionized water is smeared on an article and stands for more than 30min at the temperature of 25 ℃.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The high-temperature-resistant waterproof inorganic glue is characterized by being prepared from the following raw materials in parts by weight: 20-35 parts of white latex, 15-25 parts of sodium stearate, 13-17 parts of acrylic emulsion, 12-18 parts of melamine resin, 15-20 parts of talcum powder, 8-12 parts of ethylene glycol, 4-8 parts of flame retardant, 5-9 parts of water repellent agent, 2-3 parts of defoaming agent, 2-5 parts of flatting agent and 4-7 parts of cosolvent.
2. The high-temperature-resistant waterproof inorganic glue according to claim 1, characterized in that: the flame retardant is one of potassium tungstate and sodium tungstate.
3. The high-temperature-resistant waterproof inorganic glue according to claim 1, characterized in that: the water repellent agent is one of fatty acid aluminum salt or polyamide polyurea.
4. The high-temperature-resistant waterproof inorganic glue according to claim 1, characterized in that: the defoaming agent is one of organic silicon or polyether.
5. The high-temperature-resistant waterproof inorganic glue according to claim 1, characterized in that: the leveling agent is one of poly terephthalic acid or polydimethylsiloxane.
6. The high-temperature-resistant waterproof inorganic glue according to claim 1, characterized in that: the cosolvent is one of urea or zinc oxide.
7. The preparation method of the high-temperature-resistant waterproof inorganic glue according to claim 1, characterized in that: the method comprises the following steps:
s1, weighing white latex, sodium stearate, acrylic emulsion, melamine resin, talcum powder and ethylene glycol according to the formula parts, mixing, pouring into a stirrer, setting the stirring speed at 2000-3000r/min, and the stirring time at 15-28min, and obtaining a mixture I after stirring;
s2, weighing the flame retardant according to the formula parts, adding the flame retardant into the mixture I, setting the stirring speed at 1500-;
s3, weighing the water repellent agent according to the formula parts, adding the water repellent agent into the mixture II, setting the stirring speed at 1200-1800r/min, setting the stirring time at 6-9min, and obtaining a mixture III after the stirring is finished;
s4, weighing the defoaming agent, the leveling agent and the cosolvent according to the formula parts, sequentially adding the defoaming agent, the leveling agent and the cosolvent into the mixture III, setting the stirring speed at 2500-;
and S5, adding deionized water into the obtained mixture IV, and adjusting the viscosity to be used so as to obtain the high-temperature-resistant waterproof inorganic glue.
8. The use of the high temperature resistant waterproof inorganic glue according to claim 1, characterized in that: and smearing the mixture IV with the viscosity adjusted by the deionized water on an article, and standing for more than 30min at the temperature of 10-25 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111456800.0A CN114163948A (en) | 2021-12-01 | 2021-12-01 | High-temperature-resistant waterproof inorganic glue and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111456800.0A CN114163948A (en) | 2021-12-01 | 2021-12-01 | High-temperature-resistant waterproof inorganic glue and preparation method and application thereof |
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| Publication Number | Publication Date |
|---|---|
| CN114163948A true CN114163948A (en) | 2022-03-11 |
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| CN202111456800.0A Pending CN114163948A (en) | 2021-12-01 | 2021-12-01 | High-temperature-resistant waterproof inorganic glue and preparation method and application thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005281626A (en) * | 2004-03-30 | 2005-10-13 | Nitto Polymer Kogyo Kk | Inorganic-organic composite type aqueous adhesive composition |
| CN106995669A (en) * | 2017-05-23 | 2017-08-01 | 阮传华 | Industrial glue of a kind of water proof type and preparation method thereof |
| CN111019583A (en) * | 2019-12-03 | 2020-04-17 | 江苏科趣新材料科技有限公司 | Polyurethane glue and preparation method thereof |
| CN112126296A (en) * | 2020-09-19 | 2020-12-25 | 河北迎尧建筑工程有限公司 | Sound insulation emulsion paint |
-
2021
- 2021-12-01 CN CN202111456800.0A patent/CN114163948A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005281626A (en) * | 2004-03-30 | 2005-10-13 | Nitto Polymer Kogyo Kk | Inorganic-organic composite type aqueous adhesive composition |
| CN106995669A (en) * | 2017-05-23 | 2017-08-01 | 阮传华 | Industrial glue of a kind of water proof type and preparation method thereof |
| CN111019583A (en) * | 2019-12-03 | 2020-04-17 | 江苏科趣新材料科技有限公司 | Polyurethane glue and preparation method thereof |
| CN112126296A (en) * | 2020-09-19 | 2020-12-25 | 河北迎尧建筑工程有限公司 | Sound insulation emulsion paint |
Non-Patent Citations (1)
| Title |
|---|
| 中国室内装饰协会主编: "《室内装饰材料实用教程》", 30 September 2006, 上海科学技术出版社 * |
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