CN110183817A - Low dielectric fluorenyl benzoxazine resin combination of a kind of high heat resistance high tenacity and its preparation method and application - Google Patents

Low dielectric fluorenyl benzoxazine resin combination of a kind of high heat resistance high tenacity and its preparation method and application Download PDF

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CN110183817A
CN110183817A CN201910446652.0A CN201910446652A CN110183817A CN 110183817 A CN110183817 A CN 110183817A CN 201910446652 A CN201910446652 A CN 201910446652A CN 110183817 A CN110183817 A CN 110183817A
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resin
benzoxazine resin
heat resistance
low dielectric
high heat
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CN110183817B (en
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支肖琼
黄杰
李建学
唐文东
赵萧萧
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Sichuan Dongcai Technology Group Co Ltd
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Sichuan Dongcai Technology Group Co Ltd
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    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
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    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
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    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
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    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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    • B32B2307/00—Properties of the layers or laminate
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    • B32B2361/00—Phenoplast, aminoplast
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Abstract

The invention discloses low dielectric fluorenyl benzoxazine resin combinations of a kind of high heat resistance high tenacity and preparation method thereof, it is characterized in that: it is resin object: inorganic filler: promotor: solvent=100:30~70:0.01~1:57~80 mixture that the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, which is weight ratio,；Resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:40~80:10~40 mixture；Benzoxazine resin is that weight ratio is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: the single object in other benzoxazine resin=60~100:0~40 or mixture；The present composition has excellent heat resistance, lower dielectric constant and dielectric dissipation factor, preferable anti-flammability and bending strength, lower water absorption rate etc. for fields such as laminate, integrated antenna package, high-frequency high-speed copper-clad plate and high density internets.

Description

A kind of low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity and its preparation Method and purposes
Technical field
The invention belongs to containing organic macromolecule mixture composition and its preparation, be related to a kind of low Jie of high heat resistance high tenacity Electric fluorenyl benzoxazine resin combination and its preparation method and application.The low dielectric fluorenyl benzo of high heat resistance high tenacity of the present invention is disliked Piperazine resin combination can be used for the fields such as laminate, integrated antenna package, high-frequency high-speed copper-clad plate and high density internet, have Wide application prospect.
Background technique
In recent years, 5G communication becomes worldwide research and development focus, because it is with higher reliability, faster speed, Strategic leading action will be played to made in China 2025, while be also Internet of Things especially internet, China Automobile Industry to pass Important basic condition.5G communicates the requirement due to its message transmission rate and high reliability etc., to the laminate used, covers copper Plate dielectric constant, dielectric dissipation factor and in terms of propose very high requirement.And as laminate, copper-clad plate The electronics resins of important component reduce dielectric constant, dielectric dissipation factor and improve its heat resistance as people's research Emphasis.
Benzoxazine be by phenol, aldehyde and amine occur Mannich reaction generate a kind of 6-membered heterocyclic compound, heating or Ring-opening polymerisation under catalyst action generates the reticular structure of nitrogenous and similar phenolic resin, has many excellent performances.；Example As there is no a small molecule releasing when its solidification, higher glass transition temperature, lesser hygroscopicity, preferable MOLECULE DESIGN, And when solidifying close to zero shrinking percentage and preferable flame retardant property and electrical property etc..The designability of benzoxazine molecule is very By force, by using the phenols of different structure, amine, the excellent functional polymer material of heat resistance, dielectricity is obtained.
In recent years, people begin trying fluorenyl introducing benzo, due to introducing cardo ring in molecular structure, phenyl ring Number obviously increases, and the rigidity and heat resistance of polymer are greatly improved, meanwhile, the nonpolarity enhancing of molecule reduces tree The water imbibition of rouge, wet-hot aging performance are greatly improved.But then, the structure of fluorenyl is too rigid, so that it is being applied When can there is a problem of that plate brittleness is big, bending strength is low.For this problem, many patented technologies are synthesized by MOLECULE DESIGN A series of novel fluorenyl benzoxazine of toughening modifyings, such as CN103936686A have synthesized tetra functional fluorenyl benzoxazine, By adjusting the rigidity and flexible group in fatty amine and substituted or non-substituted bigcatkin willow aldehyde compound, the friendship of benzoxazine is improved Join density, improve flexibility, but since there are four oxazines rings into ring position for intramolecular, steric hindrance is larger, there can be benzene And the problem of oxazines cyclization rate is low, product yield low (45~80%), similar patent there are also CN102702225A and CN103896867A.CN102634019A is mentioned bisphenol compound such as bisphenol-A, bisphenol AF, Bisphenol F etc. together with bisphenol fluorene It is introduced into fluorenyl benzo structure as phenol source, heat resistance and flexible is adjusted by the ratio of bisphenol fluorene and bisphenol compound Property, but this obtained polymer that improves is difficult to have both high-fire resistance and high-flexibility.CN102702128A and CN102702129A improves the flexibility of fluorenyl benzoxazine, but equally exist product yield by introducing flexible ester-group, ehter bond Not high problem (50-85%).Moreover, providing only the molecular structure of new fluorenyl benzo, heat resistance in above patent document Data (Tg:180-390 DEG C, Td5%:330-420 DEG C) and flexibility improve it is theoretical, and fail to provide flexibility improvement and Concrete application method.And verified, the poor (Dk:3.78- of dielectric properties of the fluorenyl benzoxazine pour mass of above structure 4.42, Df:0.0067-0.0098), and substrate used in the characteristic requirements copper-clad plate of 5G communication high frequency high speed, laminate have more Good dielectric properties (Dk≤3.5, Df≤0.007).In addition, Wang Jun " the conjunction of fluorenyl benzoxazine of Harbin Engineering University At polymerization and performance study " in paper by introducing a variety of alkyl segments from amine source so that the alkyl fluorenyl benzo of synthesis Oxazines flexibility and dielectric properties are preferable, but since alkyl connects on amine source, and in benzoxazine solidification, alkyl is not retained in On main chain, cause pendency alkyl be easy to fall off, the heat resistance of product it is poor (Tg:180-230 DEG C, Td5%:310-350 ℃).Therefore, develop it is a kind of have both heat resistance, flexibility, the benzoxazine resin of low dielectric and composition, and applied Seem extremely urgent in bonding sheet, laminate and copper-clad plate.
Summary of the invention
The purpose of the present invention is intended to overcome the deficiencies in the prior art described above, and provides a kind of high heat resistance high tenacity low dielectric fluorenes Base benzoxazine resin composition and its preparation method and application.Heat resistance, flexibility, low dielectric etc. are had both to provide one kind Low dielectric fluorenyl benzoxazine resin combination of the high heat resistance high tenacity of superperformance and preparation method thereof, be applied to bonding sheet, It can get the product of excellent performance in laminate and copper-clad plate.
The contents of the present invention are: a kind of low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, feature it Place is: the low dielectric fluorenyl benzoxazine resin combination of the high heat resistance high tenacity is that weight ratio is resin object: inorganic filler: being promoted Agent: solvent=100:30~70:0.01~1:57~80 resin object, inorganic filler, promotor and solvent mixture；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:40~ The mixture of 80:10~40；
The benzoxazine resin is that weight ratio is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: other benzos The single object in oxazines resin=60~100:0~40 or mixture；
The low dielectric fluorenyl benzoxazine resin of the high heat resistance high tenacity is to have the following structure the compound of general formula 1.:
①
Formula 1. in, R1For C1~C6Alkyl；R2For H, allyl, nitro, alkynyl etc.；
Other described benzoxazine resins are phenol-aniline type benzoxazine resin, bisphenol-f type benzoxazine resin, bis-phenol A type benzoxazine resin, diaminodiphenylmethane type benzoxazine resin, diaminodiphenylsulfone type benzoxazine resin, phenolphthalein Type benzoxazine resin, benzoxazine resin containing double bond, cyanate modified benzoxazine resin, the tree of benzoxazine containing acetenyl The mixture of one or more of rouge, dicyclopentadiene type benzoxazine resin；
The DCPD epoxy resin is the compound of following general structure 2.:
②
Formula 2. in, n be (being selected from) 1~10 integer；
The phosphorus containing phenolic resin is the compound of following general structure 3.:
③
Formula 3. in, m be (being selected from) 1~5 integer；
The inorganic filler is montmorillonite, calcium carbonate, magnesium hydroxide, zinc borate, talcum, aluminium hydroxide, kaolin, sulfuric acid The mixture of one or more of barium, silica, silicon powder, mica powder；
The promotor be one of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2- methyl 4-phenyl imidazoles or Two or more mixtures；
The solvent is acetone, butanone, toluene, cyclohexanone, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, N, N- bis- The mixture of one or more of methylformamide, DMAC N,N' dimethyl acetamide, methylisobutylketone.
In the contents of the present invention: the solvent is in the low dielectric fluorenyl benzoxazine resin combination of the high heat resistance high tenacity In weight percent content be preferably 25%~38%.
In the contents of the present invention: the low dielectric fluorenyl benzoxazine resin of the high heat resistance high tenacity preferably it is following 4.~ 6. the mixture of one or more of the compound of structural formula:
④
⑤
⑥
The content of the DCPD epoxy resin (preferably) is the 50%~70% of the benzoxazine resin (total) weight；
The content of the phosphorus containing phenolic resin (preferably) is the 20%~30% of the benzoxazine resin (total) weight.
Another content of the invention is: a kind of preparation of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity Method, it is characterized in that step are as follows:
A, the synthesis of the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity:
Equipped with stirring, thermometer, condenser pipe reactor A in, be added molar ratio for 1:2~4 paraformaldehyde and primary (paraformaldehyde molal quantity refers to the formaldehyde molal quantity after paraformaldehyde whole depolymerization to amine compounds in molar ratio herein, with more Polyformaldehyde molal quantity=paraformaldehyde weight ÷ 30g/mol is calculating standard, rear same), adding weight is paraformaldehyde and primary The toluene that 1~3 times of amine compounds total weight, stirs evenly, and is warming up to 60~85 DEG C of 0.5~6h of reaction, is subsequently added into containing alkyl The molar ratio of bisphenol fluorene, fluorenes containing alkyl bisphenol and primary amino-compound be 1:2~3, add material total weight 1 ‰ in reactor~ 1% catalyst, heating make reaction mass reach reflux temperature, maintain reaction 4~12 hours, stop heating, stand 1~3h, After resin layer and water layer layering, lower layer's resin layer is taken, washed, be layered with the NaOH aqueous solution that (appropriate) concentration is 1mol/L, Lower layer's resin layer is taken, then is washed with deionized, is layered, takes lower layer's resin layer, toluene, water is removed with rotary evaporator, obtains The low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity, it is spare；Wherein:
The paraformaldehyde is the paraformaldehyde that the degree of polymerization is 10~100；
The fluorenes containing alkyl bisphenol is adjacent methyl bisphenol fluorenes, methyl bisphenol fluorenes, 2- hydroxyethyl bisphenol fluorenes, 2- propyl bis-phenol Fluorenes, 3- n-propyl bisphenol fluorene, o-tert-butyl bisphenol fluorene, 3- tert-butyl bisphenol fluorene, 3- amyl bisphenol fluorene, in adjacent phenyl bisphenol fluorene One or more kinds of mixtures；The synthesis of the fluorenes containing alkyl bisphenol can use prior art preparation；It is described to contain alkyl Bisphenol fluorene can also synthesize with the following method: equipped with stirring, thermometer, condenser pipe reactor B in, using molar ratio as Fluorenone: Fluorenone and alkylphenol is added in alkylphenol=1:4~8, adds suitable concentrated sulfuric acid and β-mercaptopropionic acid, is warming up to 40 Then the methanol with alkylphenol identical weight is added into reactor B, filters while hot, filtrate is through water by~50 DEG C of 2~4h of reaction It crystallizes, dried to get white alkyl bisphenol fluorenes (solid) after washing；
The primary amino-compound be aniline, 3- vinyl aniline, 2- allyl aniline, 2- nitroaniline, 3- nitroaniline, The mixture of one or more of 4- nitroaniline, 4- acetylenylaniline, acetylenylaniline；
The catalyst is zinc chloride, indium trihalide, ferric trichloride, Antimony pentachloride, fluoroform sulphonate, morpholine trifluoro second The mixture of one or more of the metal halides such as hydrochlorate, alchlor-nitro alkyl compound.
B, the preparation of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity:
By weight for resin object: inorganic filler: promotor: solvent=100:30~70:0.01~1:57~80 take tree Rouge object, inorganic filler, promotor and solvent are uniformly mixed, obtain the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity Composition；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:40~ The mixture of 80:10~40；
The benzoxazine resin is that weight ratio is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: other benzos The single object in oxazines resin=60~100:0~40 or mixture；
The low dielectric fluorenyl benzoxazine resin of the high heat resistance high tenacity is to have the following structure the compound of general formula 1.:
①
Formula 1. in, R1For C1~C6Alkyl；R2For H, allyl, nitro, alkynyl etc.；
Other described benzoxazine resins are phenol-aniline type benzoxazine resin, bisphenol-f type benzoxazine resin, bis-phenol A type benzoxazine resin, diaminodiphenylmethane type benzoxazine resin, diaminodiphenylsulfone type benzoxazine resin, phenolphthalein Type benzoxazine resin, benzoxazine resin containing double bond, cyanate modified benzoxazine resin, the tree of benzoxazine containing acetenyl The mixture of one or more of rouge, dicyclopentadiene type benzoxazine resin；
The DCPD epoxy resin is the compound of following general structure 2.:
②
Formula 2. in, n be (being selected from) 1~10 integer；
The phosphorus containing phenolic resin is the compound of following general structure 3.:
③
Formula 3. in, m be (being selected from) 1~5 integer；
The inorganic filler is montmorillonite, calcium carbonate, magnesium hydroxide, zinc borate, talcum, aluminium hydroxide, kaolin, sulfuric acid The mixture of one or more of barium, silica, silicon powder, mica powder；
The promotor be one of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2- methyl 4-phenyl imidazoles or Two or more mixtures；
The solvent is acetone, butanone, toluene, cyclohexanone, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, N, N- bis- The mixture of one or more of methylformamide, DMAC N,N' dimethyl acetamide and methylisobutylketone.
In another content of the invention: solvent described in step b is in the low dielectric fluorenyl benzoxazine tree of high heat resistance high tenacity Weight percent content in oil/fat composition is preferably 25%~38%.
In another content of the invention: the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity described in step b is preferable Be it is following 4.~mixture of 6. one or more of compound of structural formula:
④
⑤
⑥
The content of the DCPD epoxy resin (preferably) is the 50%~70% of the benzoxazine resin (total) weight；
The content of the phosphorus containing phenolic resin (preferably) is the 20%~30% of the benzoxazine resin (total) weight.
In another content of the invention: the synthesis of the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity described in step a Preferably: equipped with stirring, thermometer, condenser pipe reactor A in, be added molar ratio for 1:3 paraformaldehyde and primary amine Compound, adding weight is paraformaldehyde and 1.5 times of primary amino-compound total weight of toluene, is stirred evenly, it is warming up to 60~ 85 DEG C of reaction 4h, are subsequently added into fluorenes containing alkyl bisphenol, and the molar ratio of fluorenes containing alkyl bisphenol and primary amino-compound is 1:2.1, then plus Entering the catalyst of material total weight 0.5% in reactor B, heating makes reaction mass reach reflux temperature, reaction 6 hours is maintained, Stop heating, stand 1h, after resin layer and water layer layering, takes lower layer's resin layer, the NaOH for being 1mol/L with (appropriate) concentration Aqueous solution washing, layering, take lower layer's resin layer, then be washed with deionized, be layered, take lower layer's resin layer, use rotary evaporator Toluene, water are removed, the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity is obtained.
Another content of the invention is: a kind of use of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity On the way, it is characterized in that: the low dielectric fluorenyl benzoxazine resin combination of the high heat resistance high tenacity to be used to prepare high heat resistance high tenacity low Dielectric fluorenyl benzoxazine resin combination prepreg, preparation method is: reinforcing material is placed in low Jie of high heat resistance high tenacity It is taken out after (abundant) dipping in electric fluorenyl benzoxazine resin combination, then dry through (heating), obtains high heat resistance high tenacity Low dielectric fluorenyl benzoxazine resin combination prepreg；
The reinforcing material is any one of organic synthetic fibers, natural fiber, organic fabric or inorganic fabric.
Another content of the invention is: the use of the low dielectric fluorenyl benzoxazine resin combination of the high heat resistance high tenacity On the way, it is characterized in that: the low dielectric fluorenyl benzoxazine resin combination of the high heat resistance high tenacity to be used to prepare high heat resistance high tenacity low Dielectric fluorenyl benzoxazine resin combination laminate, preparation method is: by the low dielectric fluorenyl benzo of the high heat resistance high tenacity Oxazines resin combination prepreg, after being overlapped according to thickness requirement, in 0.2~3MPa pressure and 130~250 DEG C of temperatures System 1~4 hour, obtains the low dielectric fluorenyl benzoxazine resin combination laminate of high heat resistance high tenacity.
Another content of the invention is: the use of the low dielectric fluorenyl benzoxazine resin combination of the high heat resistance high tenacity On the way, it is characterized in that: the low dielectric fluorenyl benzoxazine resin combination of the high heat resistance high tenacity to be used to prepare high heat resistance high tenacity low Dielectric fluorenyl benzoxazine resin combination copper-clad plate, preparation method is: by the low dielectric fluorenyl benzo of the high heat resistance high tenacity Oxazines resin combination prepreg after overlapping according to thickness requirement, is covered with metal foil on two sides or single side, in 0.2~3MPa It is suppressed 1~4 hour at a temperature of pressure and 130~250 DEG C, obtains the low dielectric fluorenyl benzoxazine resin group of high heat resistance high tenacity Close object copper-clad plate；
The metal foil is copper foil or aluminium foil, and thickness is without limitation.
Compared with prior art, the present invention have following features and the utility model has the advantages that
(1) using the present invention, the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity in the synthesis process, uses for the first time Metal halogenides as catalysts improves molecular alkyl reactivity, so that fluorenyl benzoxazine cyclization rate improves, product is received Rate can achieve 75%~95%；
(2) alkyl segment of the invention, to introduce in the low dielectric fluorenyl benzoxazine resin structure of high heat resistance high tenacity is used, Increase the free volume of molecule, (pour mass dielectric constant is 3.1, and dielectric dissipation factor is so that Polymeric dielectric is had excellent performance 0.0039)；
(3) in the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity of the present invention, due to the introducing of alkyl segment, increase The flexibility of molecule, overcomes the rigidity of fluorenyl, and the bending strength of plate is greatly improved that (bending strength can achieve 634~691MPa)；Meanwhile the alkyl segment of introducing is phenolic hydroxyl group ortho position or the meta position for being linked at bisphenol fluorene, when such benzo is disliked When piperazine solidifies, alkyl segment can be retained on solidfied material main chain, heat-resisting compared with the side-chain structure that alkyl segment obtains is introduced by amine source Property is more preferable；And because the carbon atom number of alkyl segment is no more than 6, the fatty segment that benzoxazine polymer will not be flexible because of introducing Heat resistance is caused to decline (pour mass Tg is up to 240~288 DEG C, and Td5% is up to 350~398 DEG C)；Realize preferable flexibility With the balance of higher heat resistance；
(4) using of the invention, introducing DCPD epoxy in the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity Resin, using dicyclopentadiene structure in its higher heat resistance and molecule so that composition heat resistance with higher and compared with Good dielectric properties；
(5) present invention is used, introduces phosphorus-containing phenolic aldehyde in the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity Resin, because containing few hydroxy radical content when it is as curing agent, so that product molecular polarity is smaller, dielectric properties are excellent, together When, it can play the role of fire retardant there are also higher phosphorus content (9%)；
(6) it using the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity of the present invention, is suppressed by its interworking Plate, have lower dielectric constant (3.35~3.78) and dielectric dissipation factor (0.008~0.010)；It is higher heat-resisting Property (Td5% >=390 DEG C, Tg >=200 DEG C)；Preferable toughness (bending strength can achieve 634~720MPa) and there is low suction The characteristics such as water rate, preferable humidity resistance, realize the balance of properties in system；
(7) present composition can be used for laminate, integrated antenna package, high-frequency high-speed copper-clad plate and high density internet Equal fields, have excellent heat resistance, lower dielectric constant and dielectric dissipation factor, preferable anti-flammability and bending strength, Lower water absorption rate etc., function admirable, product preparation process is simple, easy to operate, practical.
Specific embodiment
The invention will be further described for example given below, but is not to be construed as to the scope of the present invention Limitation, person skilled in art is according to the content of aforementioned present invention to some nonessential improvement of the invention made and tune It is whole, still fall within protection scope of the present invention.
In the low dielectric benzoxazine resin composition of high heat resistance high tenacity described in Examples 1 to 20, specific group of use Divide and proportion see the table below 1:
Table 1: the component and proportion of the low dielectric benzoxazine resin composition of high heat resistance high tenacity:
Material is in parts by weight in Examples 1 to 20, in which:
Resin object: inorganic filler: promotor: solvent=100:30~70:0.01~1:57~80,
Benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:40~80:10~40,
The low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: other benzoxazine resin=60~100:0~40,
The low dielectric benzoxazine resin composition of high heat resistance high tenacity described in Examples 1 to 20 the preparation method comprises the following steps: by high The low dielectric benzoxazine resin of heat-resisting high tenacity, DCPD epoxy resin, phosphorus-containing phenolic aldehyde, curing accelerator, filler and stirring solvent It is uniformly mixed, solid content is 62%~75%.
The preparation of prepreg: smooth bright and clean, with a thickness of 0.2mm E- glass-fiber-fabric is chosen, it is (molten to be immersed in above-mentioned composition Liquid) in after, take out, then toast in 130~170 DEG C of baking ovens 4~7 minutes it is obtained.The weight resin percentage of prepreg Content is 32%~68%.
The preparation of laminate: prepreg cut-parts are overlapped, and up and down coated with release film, then are placed in hot press, keep rising Warm rate is suppressed 1~4 hour at 0.2~3MPa pressure and 150~250 DEG C and is formed to after temperature in 1~3 DEG C/min.
The preparation of copper-clad plate: above-mentioned prepreg cut-parts are overlapped, and are covered with copper foil on prepreg two sides or single side, It suppresses 1~4 hour and forms at 0.2~3MPa pressure and 130~250 DEG C.
The low dielectric fluorenyl benzoxazine resin combination copper-clad plate (Halogen) of high heat resistance high tenacity prepared by the present invention with it is right The portion of techniques performance comparison situation of ratio plate see the table below 2:
Table 2: the portion of techniques performance comparison of copper-clad plate (Halogen) and comparative example plate of the present invention:
Comparative example 1 (matrix resin are as follows: phosphorous epoxy+phenolic aldehyde+DCPD benzoxazine) and (matrix resin are as follows: contain of comparative example 2 Phosphorus epoxy+polyphenylene oxide+phosphorus-containing phenolic aldehyde) be outsourcing the test data for the halogen-free board under high frequency.
Copper is covered using the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity of the formula preparation of embodiment 6~20 The performance test data of plate (Halogen) is shown in Table 3-1 and table 3-2:
Table 3-1: 6~12 copper-clad plate of the embodiment of the present invention (Halogen) performance test data
Table 3-2: 13~20 copper-clad plate of the embodiment of the present invention (Halogen) performance test data
Technical performance test method in table 2,3 (table 3-1 and table 3-2) is as follows:
(1) glass transition temperature (Tg)
According to differential scanning calorimetry, it is measured according to the DSC method of 2.4.25 defined in IPC-TM-650.
(2) thermal decomposition temperature (Td)
It is measured according to the method for 2.4.26 defined in IPC-TM-650.
(3) dielectric constant
Flat band method is used according to 2.5.5.9 in IPC-TM-650, measures the dielectric constant under 1GHz.
(4) dielectric dissipation factor tangent
Flat band method is used according to 2.5.5.9 in IPC-TM-650, measures the dielectric dissipation factor tangent under 1GHz.
(5) anti-flammability
Standard is measured referring to UL94.
(6) peel strength
According in IPC-TM-650 in the method for 2.4.8 defined " thermal stress " experiment condition, test metallic cover layer Peel strength.
(7) thermally stratified layer time T-288
It is measured according to the method for 2.4.24.1 defined in IPC-TM-650.
(8) water absorption rate
It is measured according to the method for 2.6.2.1 defined in IPC-TM-650.
By table 2,3 (table 3-1 and table 3-2) as it can be seen that having using the embodiment of the present invention plate obtained excellent resistance to Hot, lower dielectric constant and dielectric dissipation factor, preferable anti-flammability and bending strength, lower water absorption rate.The present invention Composition can be used for the fields such as laminate, integrated antenna package, high-frequency high-speed copper-clad plate and high density internet, have it is wide Application prospect.
Embodiment 21:
A kind of low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, the low dielectric fluorenyl of the high heat resistance high tenacity Benzoxazine resin composition is that weight ratio is resin object: inorganic filler: promotor: solvent=100:30:0.01:57 resin Object, inorganic filler, promotor and solvent mixture；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:40:10 Mixture；
The benzoxazine resin is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity.
Embodiment 22:
A kind of low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, the low dielectric fluorenyl of the high heat resistance high tenacity Benzoxazine resin composition is that weight ratio is resin object: inorganic filler: promotor: solvent=100:70:1:80 resin object, Inorganic filler, promotor and solvent mixture；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:80:40 Mixture；
The benzoxazine resin is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity.
Embodiment 23:
A kind of low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, the low dielectric fluorenyl of the high heat resistance high tenacity Benzoxazine resin composition is that weight ratio is resin object: inorganic filler: promotor: solvent=100:50:0.5:69 resin Object, inorganic filler, promotor and solvent mixture；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:60:25 Mixture；
The benzoxazine resin is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity.
Embodiment 24:
A kind of low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, the low dielectric fluorenyl of the high heat resistance high tenacity Benzoxazine resin composition is that weight ratio is resin object: inorganic filler: promotor: solvent=100:30:0.01:57 resin Object, inorganic filler, promotor and solvent mixture；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:40:10 Mixture；
The benzoxazine resin is that weight ratio is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: other benzos Oxazines resin=60:1 mixture.
Embodiment 25:
A kind of low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, the low dielectric fluorenyl of the high heat resistance high tenacity Benzoxazine resin composition is that weight ratio is resin object: inorganic filler: promotor: solvent=100:70:1:80 resin object, Inorganic filler, promotor and solvent mixture；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:80:40 Mixture；
The benzoxazine resin is that weight ratio is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: other benzos Oxazines resin=100:40 mixture.
Embodiment 26:
A kind of low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, the low dielectric fluorenyl of the high heat resistance high tenacity Benzoxazine resin composition is that weight ratio is resin object: inorganic filler: promotor: solvent=100:50:0.5:68 resin Object, inorganic filler, promotor and solvent mixture；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:60:25 Mixture；
The benzoxazine resin is that weight ratio is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: other benzos Oxazines resin=80:20 mixture.
Embodiment 27:
A kind of low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, the low dielectric fluorenyl of the high heat resistance high tenacity Benzoxazine resin composition is that weight ratio is resin object: inorganic filler: promotor: solvent=100:70:1:57 resin object, Inorganic filler, promotor and solvent mixture；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:50:20 Mixture；
The benzoxazine resin is that weight ratio is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: other benzos Oxazines resin=80:20 mixture.
Embodiment 28:
A kind of low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, the low dielectric fluorenyl of the high heat resistance high tenacity Benzoxazine resin composition is that weight ratio is resin object: inorganic filler: promotor: solvent=100:30:1:80 resin object, Inorganic filler, promotor and solvent mixture；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:70:30 Mixture；
The benzoxazine resin is that weight ratio is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: other benzos Oxazines resin=80:18 mixture.
Embodiment 29:
A kind of preparation method of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, step are as follows:
A, the synthesis of the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity:
Equipped with stirring, thermometer, condenser pipe reactor A in, be added molar ratio for 1:2 paraformaldehyde and primary amine Closing object, (paraformaldehyde molal quantity refers to the formaldehyde molal quantity after paraformaldehyde whole depolymerization in molar ratio herein, with poly first Aldehyde molal quantity=paraformaldehyde weight ÷ 30g/mol is calculating standard, rear same), adding weight is paraformaldehyde and primary amine The toluene for closing 1 times of object total weight, stirs evenly, is warming up to 60 DEG C of reaction 6h, is subsequently added into fluorenes containing alkyl bisphenol, contains alkyl bisphenol The molar ratio of fluorenes and primary amino-compound is 1:2, adds the catalyst of material total weight 1 ‰ in reactor, and heating makes reactant Material reaches reflux temperature, maintains reaction 12 hours, stops heating, stands 1h, after resin layer and water layer layering, takes lower-layer resin Layer is washed with the NaOH aqueous solution that (appropriate) concentration is 1mol/L, is layered, take lower layer's resin layer, then is washed with deionized, divides Layer, takes lower layer's resin layer, removes toluene, water with rotary evaporator, obtains the low dielectric fluorenyl benzoxazine tree of high heat resistance high tenacity Rouge, it is spare；
B, the preparation of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity:
By weight being resin object: inorganic filler: promotor: solvent=100:30:0.01:57 takes resin object, inorganic fills out Material, promotor and solvent are uniformly mixed, and the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity is made；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:40:10 Mixture；The benzoxazine resin is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity.
Embodiment 30:
A kind of preparation method of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, step are as follows:
A, the synthesis of the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity:
Equipped with stirring, thermometer, condenser pipe reactor A in, be added molar ratio for 1:4 paraformaldehyde and primary amine Closing object, (paraformaldehyde molal quantity refers to the formaldehyde molal quantity after paraformaldehyde whole depolymerization in molar ratio herein, with poly first Aldehyde molal quantity=paraformaldehyde weight ÷ 30g/mol is calculating standard, rear same), adding weight is paraformaldehyde and primary amine The toluene for closing 3 times of object total weight, stirs evenly, is warming up to 85 DEG C of reaction 0.5h, is subsequently added into fluorenes containing alkyl bisphenol, double containing alkyl The molar ratio of phenol fluorenes and primary amino-compound is 1:3, adds the catalyst of material total weight 1% in reactor, and heating makes to react Material reaches reflux temperature, maintains reaction 4 hours, stops heating, stands 3h, after resin layer and water layer layering, takes lower layer tree Rouge layer is washed with the NaOH aqueous solution that (appropriate) concentration is 1mol/L, is layered, takes lower layer's resin layer, then be washed with deionized, Layering, takes lower layer's resin layer, removes toluene, water with rotary evaporator, obtains the low dielectric fluorenyl benzoxazine of high heat resistance high tenacity Resin, it is spare；
B, the preparation of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity:
By weight be resin object: inorganic filler: promotor: solvent=100:70:1:80 take resin object, inorganic filler, Promotor and solvent are uniformly mixed, obtain the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:80:40 Mixture；The benzoxazine resin is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity.
Embodiment 31:
A kind of preparation method of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, step are as follows:
A, the synthesis of the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity:
Equipped with stirring, thermometer, condenser pipe reactor A in, be added molar ratio for 1:3 paraformaldehyde and primary amine Closing object, (paraformaldehyde molal quantity refers to the formaldehyde molal quantity after paraformaldehyde whole depolymerization in molar ratio herein, with poly first Aldehyde molal quantity=paraformaldehyde weight ÷ 30g/mol is calculating standard, rear same), adding weight is paraformaldehyde and primary amine The toluene for closing 2 times of object total weight, stirs evenly, is warming up to 75 DEG C of reaction 3h, is subsequently added into fluorenes containing alkyl bisphenol, contains alkyl bisphenol The molar ratio of fluorenes and primary amino-compound is 1:2.5, adds the catalyst of material total weight 0.5% in reactor, and heating makes anti- It answers material to reach reflux temperature, maintains reaction 8 hours, stop heating, stand 2h, after resin layer and water layer layering, take lower layer Resin layer is washed with the NaOH aqueous solution that (appropriate) concentration is 1mol/L, is layered, takes lower layer's resin layer, then be washed with deionized water It washs, be layered, take lower layer's resin layer, remove toluene, water with rotary evaporator, obtain the low dielectric fluorenyl benzo of high heat resistance high tenacity and dislike Piperazine resin, it is spare；
B, the preparation of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity:
By weight being resin object: inorganic filler: promotor: solvent=100:50:0.5:68 takes resin object, inorganic fills out Material, promotor and solvent are uniformly mixed, and obtain the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:60:25 Mixture；The benzoxazine resin is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity.
Embodiment 32:
A kind of preparation method of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, step b are as follows: by weight Than for resin object: inorganic filler: promotor: solvent=100:30:0.01:57 takes resin object, inorganic filler, promotor and solvent It is uniformly mixed, obtains the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:40:10 Mixture；The benzoxazine resin is that weight ratio is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: other benzene And oxazines resin=60:1 mixture；It is any in the other the same as in Example 2 9~31, it omits.
Embodiment 33:
A kind of preparation method of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, step b are as follows: by weight Than for resin object: inorganic filler: promotor: solvent=100:70:1:80 takes resin object, inorganic filler, promotor and solvent mixed It closes uniformly, obtains the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:80:40 Mixture；The benzoxazine resin is that weight ratio is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: other benzene And oxazines resin=100:40 mixture；It is any in the other the same as in Example 2 9~31, it omits.
Embodiment 34:
A kind of preparation method of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, step b are as follows: by weight Than for resin object: inorganic filler: promotor: solvent=100:50:0.5:68 takes resin object, inorganic filler, promotor and solvent It is uniformly mixed, obtains the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:60:25 Mixture；The benzoxazine resin is that weight ratio is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: other benzene And oxazines resin=80:20 mixture；It is any in the other the same as in Example 2 9~31, it omits.
Embodiment 35:
A kind of preparation method of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, step b are as follows: by weight Than for resin object: inorganic filler: promotor: solvent=100:70:1:57 takes resin object, inorganic filler, promotor and solvent mixed It closes uniformly, obtains the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:50:20 Mixture；The benzoxazine resin is that weight ratio is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: other benzene And oxazines resin=80:20 mixture；It is any in the other the same as in Example 2 9~31, it omits.
Embodiment 36:
A kind of preparation method of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, step b are as follows: by weight Than for resin object: inorganic filler: promotor: solvent=100:30:1:80 takes resin object, inorganic filler, promotor and solvent mixed It closes uniformly, obtains the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:70:30 Mixture；The benzoxazine resin is that weight ratio is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: other benzene And oxazines resin=80:18 mixture；It is any in the other the same as in Example 2 9~31, it omits.
Embodiment 37:
A kind of preparation method of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, height described in step a are resistance to The synthesis of the low dielectric fluorenyl benzoxazine resin of hot high tenacity is: equipped with stirring, thermometer, condenser pipe reactor A in, add Enter the paraformaldehyde and primary amino-compound that molar ratio is 1:3, adding weight is paraformaldehyde and primary amino-compound total weight 1.5 Toluene again, stirs evenly, is warming up to 60~85 DEG C of reaction 4h, is subsequently added into fluorenes containing alkyl bisphenol, fluorenes containing alkyl bisphenol and primary The molar ratio of amine compounds is 1:2.1, adds the catalyst of material total weight 0.5% in reactor B, and heating makes reaction mass Reach reflux temperature, maintain reaction 6 hours, stop heating, stand 1h, after resin layer and water layer layering, takes lower layer's resin layer, It washed, be layered with the NaOH aqueous solution that (appropriate) concentration is 1mol/L, take lower layer's resin layer, then be washed with deionized, be layered, Lower layer's resin layer is taken, toluene, water is removed with rotary evaporator, obtains the low dielectric fluorenyl benzoxazine tree of high heat resistance high tenacity Rouge；It is any in the other the same as in Example 2 9~36, it omits.
In the step a of above-described embodiment 29~37:
The paraformaldehyde is the paraformaldehyde that the degree of polymerization is 10~100；
The fluorenes containing alkyl bisphenol is adjacent methyl bisphenol fluorenes, methyl bisphenol fluorenes, 2- hydroxyethyl bisphenol fluorenes, 2- propyl bis-phenol Fluorenes, 3- n-propyl bisphenol fluorene, o-tert-butyl bisphenol fluorene, 3- tert-butyl bisphenol fluorene, 3- amyl bisphenol fluorene, in adjacent phenyl bisphenol fluorene One or more kinds of mixtures；The synthesis of the fluorenes containing alkyl bisphenol can use prior art preparation；It is described to contain alkyl Bisphenol fluorene can also synthesize with the following method: equipped with stirring, thermometer, condenser pipe reactor B in, using molar ratio as Fluorenone: Fluorenone and alkylphenol is added in alkylphenol=1:4~8, adds suitable concentrated sulfuric acid and β-mercaptopropionic acid, is warming up to 40 Then the methanol with alkylphenol identical weight is added into reactor B, filters while hot, filtrate is through water by~50 DEG C of 2~4h of reaction It crystallizes, dried to get white alkyl bisphenol fluorenes (solid) after washing；
The primary amino-compound be aniline, 3- vinyl aniline, 2- allyl aniline, 2- nitroaniline, 3- nitroaniline, The mixture of one or more of 4- nitroaniline, 4- acetylenylaniline, acetylenylaniline；
The catalyst is zinc chloride, indium trihalide, ferric trichloride, Antimony pentachloride, fluoroform sulphonate, morpholine trifluoro second The mixture of one or more of the metal halides such as hydrochlorate, alchlor-nitro alkyl compound.
In above-described embodiment 21~37:
The low dielectric fluorenyl benzoxazine resin of the high heat resistance high tenacity is to have the following structure the compound of general formula 1.:
①
Formula 1. in, R1For C1~C6Alkyl；R2For H, allyl, nitro, alkynyl etc.；
Other described benzoxazine resins are phenol-aniline type benzoxazine resin, bisphenol-f type benzoxazine resin, bis-phenol A type benzoxazine resin, diaminodiphenylmethane type benzoxazine resin, diaminodiphenylsulfone type benzoxazine resin, phenolphthalein Type benzoxazine resin, benzoxazine resin containing double bond, cyanate modified benzoxazine resin, the tree of benzoxazine containing acetenyl The mixture of one or more of rouge, dicyclopentadiene type benzoxazine resin；
The DCPD epoxy resin is the compound of following general structure 2.:
②
Formula 2. in, n be (being selected from) 1~10 integer；
The phosphorus containing phenolic resin is the compound of following general structure 3.:
③
Formula 3. in, m be (being selected from) 1~5 integer；
The inorganic filler is montmorillonite, calcium carbonate, magnesium hydroxide, zinc borate, talcum, aluminium hydroxide, kaolin, sulfuric acid The mixture of one or more of barium, silica, silicon powder, mica powder；
The promotor be one of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2- methyl 4-phenyl imidazoles or Two or more mixtures；
The solvent is acetone, butanone, toluene, cyclohexanone, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, N, N- bis- The mixture of one or more of methylformamide, DMAC N,N' dimethyl acetamide and methylisobutylketone；
The low dielectric fluorenyl benzoxazine resin of the high heat resistance high tenacity be it is following 4.~6. in the compound of structural formula One or more kinds of mixtures:
④
⑤
⑥
Embodiment 38:
A kind of purposes of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, low Jie of the high heat resistance high tenacity It is solid that electric fluorenyl benzoxazine resin combination is used to prepare the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity half Change piece, preparation method is: reinforcing material being placed in the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity and (is filled Point) take out after dipping, then it is dry through (heating), obtain the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity partly Cured sheets；
The reinforcing material is any one of organic synthetic fibers, natural fiber, organic fabric or inorganic fabric.
Embodiment 39:
A kind of purposes of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, low Jie of the high heat resistance high tenacity Electric fluorenyl benzoxazine resin combination is used to prepare the low dielectric fluorenyl benzoxazine resin combination lamination of high heat resistance high tenacity Plate, preparation method are: by the low dielectric fluorenyl benzoxazine resin combination prepreg of the high heat resistance high tenacity, according to thickness It is required that suppressed 1~4 hour at a temperature of 0.2~3MPa pressure and 130~250 DEG C after overlapping, it is low to obtain high heat resistance high tenacity Dielectric fluorenyl benzoxazine resin combination laminate.
Embodiment 40:
A kind of purposes of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity, low Jie of the high heat resistance high tenacity Electric fluorenyl benzoxazine resin combination is used to prepare the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity and covers copper Plate, preparation method are: by the low dielectric fluorenyl benzoxazine resin combination prepreg of the high heat resistance high tenacity, according to thickness It is required that being covered with metal foil on two sides or single side after overlapping, it is small that 1~4 is suppressed at a temperature of 0.2~3MPa pressure and 130~250 DEG C When, obtain the low dielectric fluorenyl benzoxazine resin combination copper-clad plate of high heat resistance high tenacity；
The metal foil is copper foil or aluminium foil, and thickness is without limitation.
In above-described embodiment: it is not specifically specified in used percentage, be quality (weight) percentage or Well known to a person skilled in the art percentages；It is not specifically specified in used ratio, it is quality (weight) ratio； The parts by weight can be gram or kilogram.
In above-described embodiment: technological parameter (temperature, time, concentration etc.) and dosage of each component numerical value in each step etc. are Range, any point is applicable.
The technology contents being not specifically delineated in the content of present invention and above-described embodiment are compared with technology, the raw material Commercial product.
The present invention is not limited to the above embodiments, can be implemented described in the content of present invention and has the good result.

Claims (10)

1. the low dielectric fluorenyl benzoxazine resin combination of a kind of high heat resistance high tenacity, it is characterized in that: the high heat resistance high tenacity is low Dielectric fluorenyl benzoxazine resin combination is that weight ratio is resin object: inorganic filler: promotor: solvent=100:30~70: The resin objects of 0.01~1:57~80, inorganic filler, promotor and solvent mixture；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:40~80:10 ~40 mixture；
The benzoxazine resin is that weight ratio is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: other benzoxazines The single object in resin=60~100:0~40 or mixture；
The low dielectric fluorenyl benzoxazine resin of the high heat resistance high tenacity is to have the following structure the compound of general formula 1.:
①
Formula 1. in, R1For C1~C6Alkyl；R2For H, allyl, nitro, alkynyl etc.；
Other described benzoxazine resins are phenol-aniline type benzoxazine resin, bisphenol-f type benzoxazine resin, bisphenol A-type Benzoxazine resin, diaminodiphenylmethane type benzoxazine resin, diaminodiphenylsulfone type benzoxazine resin, phenolphthalein type benzene And it is oxazines resin, benzoxazine resin containing double bond, cyanate modified benzoxazine resin, benzoxazine resin containing acetenyl, double The mixture of one or more of Cyclopeutadiene type benzoxazine resin；
The DCPD epoxy resin is the compound of following general structure 2.:
②
Formula 2. in, n be 1~10 integer；
The phosphorus containing phenolic resin is the compound of following general structure 3.:
③
Formula 3. in, m be 1~5 integer；
The inorganic filler be montmorillonite, calcium carbonate, magnesium hydroxide, zinc borate, talcum, aluminium hydroxide, kaolin, barium sulfate, The mixture of one or more of silica, silicon powder, mica powder；
The promotor is one or both of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2- methyl 4-phenyl imidazoles Above mixture；
The solvent is acetone, butanone, toluene, cyclohexanone, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, N, N- dimethyl The mixture of one or more of formamide, DMAC N,N' dimethyl acetamide, methylisobutylketone.
2. by the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity described in claim 1, it is characterized in that: described molten Weight percent content of the agent in the low dielectric fluorenyl benzoxazine resin combination of the high heat resistance high tenacity be 25%~ 38%.
3. the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity as claimed in claim 1 or 2 is pressed, it is characterized in that: institute State the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity be it is following 4.~one or both of the compound of 6. structural formula Above mixture:
④
⑤
⑥
The content of the DCPD epoxy resin is the 50%~70% of the benzoxazine resin weight；
The content of the phosphorus containing phenolic resin is the 20%~30% of the benzoxazine resin weight.
4. the preparation method of the low dielectric fluorenyl benzoxazine resin combination of a kind of high heat resistance high tenacity, it is characterized in that step are as follows:
A, the synthesis of the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity:
Equipped with stirring, thermometer, condenser pipe reactor A in, be added molar ratio for 1:2~4 paraformaldehyde and primary amine Object is closed, adding weight is paraformaldehyde and 1~3 times of primary amino-compound total weight of toluene, stirs evenly, is warming up to 60~85 DEG C 0.5~6h of reaction, is subsequently added into fluorenes containing alkyl bisphenol, and the molar ratio of fluorenes containing alkyl bisphenol and primary amino-compound is 1:2~3, The catalyst of material total weight 1 ‰~1% in reactor is added, heating makes reaction mass reach reflux temperature, maintains reaction 4 ~12 hours, stop heating, stand 1~3h, after resin layer and water layer layering, takes lower layer's resin layer, be 1mol/L with concentration NaOH aqueous solution washing, layering, take lower layer's resin layer, then be washed with deionized, be layered, take lower layer's resin layer, with rotation Evaporator removes toluene, water, obtains the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity, spare；Wherein:
The paraformaldehyde is the paraformaldehyde that the degree of polymerization is 10~100；
The fluorenes containing alkyl bisphenol is adjacent methyl bisphenol fluorenes, methyl bisphenol fluorenes, 2- hydroxyethyl bisphenol fluorenes, 2- propyl bisphenol fluorene, 3- One of n-propyl bisphenol fluorene, o-tert-butyl bisphenol fluorene, 3- tert-butyl bisphenol fluorene, 3- amyl bisphenol fluorene, adjacent phenyl bisphenol fluorene Or two or more mixture；
The primary amino-compound is aniline, 3- vinyl aniline, 2- allyl aniline, 2- nitroaniline, 3- nitroaniline, 4- nitre The mixture of one or more of base aniline, 4- acetylenylaniline, acetylenylaniline；
The catalyst is zinc chloride, indium trihalide, ferric trichloride, Antimony pentachloride, fluoroform sulphonate, morpholine trifluoroacetic acid The mixture of one or more of the metal halides such as salt, alchlor-nitro alkyl compound；
B, the preparation of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity:
By weight be resin object: inorganic filler: promotor: solvent=100:30~70:0.01~1:57~80 take resin object, Inorganic filler, promotor and solvent are uniformly mixed, obtain the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity Object；
The resin object is that weight ratio is benzoxazine resin: DCPD epoxy resin: phosphorus containing phenolic resin=100:40~80:10 ~40 mixture；
The benzoxazine resin is that weight ratio is the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity: other benzoxazines The single object in resin=60~100:0~40 or mixture；
The low dielectric fluorenyl benzoxazine resin of the high heat resistance high tenacity is to have the following structure the compound of general formula 1.:
①
Formula 1. in, R1For C1~C6Alkyl；R2For H, allyl, nitro, alkynyl etc.；
Other described benzoxazine resins are phenol-aniline type benzoxazine resin, bisphenol-f type benzoxazine resin, bisphenol A-type Benzoxazine resin, diaminodiphenylmethane type benzoxazine resin, diaminodiphenylsulfone type benzoxazine resin, phenolphthalein type benzene And it is oxazines resin, benzoxazine resin containing double bond, cyanate modified benzoxazine resin, benzoxazine resin containing acetenyl, double The mixture of one or more of Cyclopeutadiene type benzoxazine resin；
The DCPD epoxy resin is the compound of following general structure 2.:
②
Formula 2. in, n be 1~10 integer；
The phosphorus containing phenolic resin is the compound of following general structure 3.:
③
Formula 3. in, m be 1~5 integer；
The inorganic filler be montmorillonite, calcium carbonate, magnesium hydroxide, zinc borate, talcum, aluminium hydroxide, kaolin, barium sulfate, The mixture of one or more of silica, silicon powder, mica powder；
The promotor is one or both of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2- methyl 4-phenyl imidazoles Above mixture；
The solvent is acetone, butanone, toluene, cyclohexanone, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, N, N- dimethyl The mixture of one or more of formamide, DMAC N,N' dimethyl acetamide and methylisobutylketone.
5. special by the preparation method of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity described in claim 4 Sign is: weight percent of the solvent described in step b in the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity Content is 25%~38%.
6. the preparation method of the low dielectric fluorenyl benzoxazine resin combination of the high heat resistance high tenacity of claim 4 or 5 is pressed, Be characterized in: the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity described in step b be it is following 4.~chemical combination of 6. structural formula The mixture of one or more of object:
④
⑤
⑥
The content of the DCPD epoxy resin is the 50%~70% of the benzoxazine resin weight；
The content of the phosphorus containing phenolic resin is the 20%~30% of the benzoxazine resin weight.
7. the preparation method of the low dielectric fluorenyl benzoxazine resin combination of the high heat resistance high tenacity of claim 4 or 5 is pressed, Be characterized in: the synthesis of the low dielectric fluorenyl benzoxazine resin of high heat resistance high tenacity described in step a is: equipped with stirring, thermometer, In the reactor A of condenser pipe, the paraformaldehyde and primary amino-compound that molar ratio is 1:3 is added, adding weight is paraformaldehyde It with 1.5 times of toluene of primary amino-compound total weight, stirs evenly, is warming up to 60~85 DEG C of reaction 4h, be subsequently added into double containing alkyl The molar ratio of phenol fluorenes, fluorenes containing alkyl bisphenol and primary amino-compound is 1:2.1, adds material total weight 0.5% in reactor B Catalyst, heating make reaction mass reach reflux temperature, maintain reaction 6 hours, stop heating, 1h are stood, to resin layer and water After layer layering, lower layer's resin layer is taken, the NaOH aqueous solution for being 1mol/L with concentration is washed, is layered, and takes lower layer's resin layer, then spend Ion water washing, layering, take lower layer's resin layer, remove toluene, water with rotary evaporator, obtain the low dielectric of high heat resistance high tenacity Fluorenyl benzoxazine resin.
8. the purposes of the low dielectric fluorenyl benzoxazine resin combination of a kind of high heat resistance high tenacity, it is characterized in that: the high heat resistance is high The low dielectric fluorenyl benzoxazine resin combination of toughness is used to prepare the low dielectric fluorenyl benzoxazine resin group of high heat resistance high tenacity Object prepreg is closed, preparation method is: reinforcing material is placed in the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity It is taken out after being impregnated in object, then through drying, obtains the low dielectric fluorenyl benzoxazine resin combination semi-solid preparation of high heat resistance high tenacity Piece；
The reinforcing material is any one of organic synthetic fibers, natural fiber, organic fabric or inorganic fabric.
9. by the purposes of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity described in claim 8, it is characterized in that: The low dielectric fluorenyl benzoxazine resin combination of the high heat resistance high tenacity is used to prepare the low dielectric fluorenyl benzo of high heat resistance high tenacity Oxazines resin combination laminate, preparation method is: by the low dielectric fluorenyl benzoxazine resin combination of the high heat resistance high tenacity Object prepreg after overlapping according to thickness requirement, is suppressed 1~4 hour at a temperature of 0.2~3MPa pressure and 130~250 DEG C, Obtain the low dielectric fluorenyl benzoxazine resin combination laminate of high heat resistance high tenacity.
10. by the purposes of the low dielectric fluorenyl benzoxazine resin combination of high heat resistance high tenacity described in claim 8, feature Be: the low dielectric fluorenyl benzoxazine resin combination of the high heat resistance high tenacity is used to prepare the low dielectric fluorenyl benzene of high heat resistance high tenacity And oxazines resin combination copper-clad plate, preparation method is: by the low dielectric fluorenyl benzoxazine resin group of the high heat resistance high tenacity Close object prepreg, after overlapping according to thickness requirement, be covered with metal foil on two sides or single side, 0.2~3MPa pressure and 130~ It is suppressed 1~4 hour at a temperature of 250 DEG C, obtains the low dielectric fluorenyl benzoxazine resin combination copper-clad plate of high heat resistance high tenacity；
The metal foil is copper foil or aluminium foil.
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