CN114156286B - Display panel - Google Patents
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- CN114156286B CN114156286B CN202111447062.3A CN202111447062A CN114156286B CN 114156286 B CN114156286 B CN 114156286B CN 202111447062 A CN202111447062 A CN 202111447062A CN 114156286 B CN114156286 B CN 114156286B
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the application provides a display panel; the display panel comprises a first substrate, a second substrate and a filling layer, wherein the first substrate comprises a substrate and a driving circuit layer arranged on the substrate, the driving circuit layer comprises a plurality of first terminals, the second substrate is arranged opposite to the first substrate, the second substrate comprises a light-emitting layer and a plurality of second terminals arranged on the light-emitting layer, each second terminal is arranged opposite to and electrically connected with each first terminal, and the filling layer is arranged between the first substrate and the second substrate; according to the display panel, the filling layer is arranged between the driving circuit layer and the light-emitting layer, so that the first terminal is electrically connected with the corresponding second terminal, gaps existing between the circuit driving layer and the light-emitting layer are completely filled in other areas, the bonding strength between the circuit driving layer and the light-emitting layer is improved, and the reliability of the display panel is further improved.
Description
Technical Field
The application relates to the field of display, in particular to a display panel.
Background
At present, for a Display screen in which a circuit driving layer and an Organic Light-Emitting Display (OLED) Light-Emitting layer are separated into a sub-mother board form, a conductive material is often used to bond the circuit driving layer and the OLED Light-Emitting layer, so as to realize an electric signal transmission and conduction function. However, a gap still exists between the circuit driving layer and the OLED luminescent layer, the reliability of a display product can be reduced due to air reserved in the gap, and the circuit driving layer and the OLED luminescent layer are bonded by only relying on a single conductive material, so that the bonding strength between the circuit driving layer and the OLED luminescent layer is weak, the OLED luminescent layer is easy to peel off, and the production yield of the display product is further affected.
Therefore, a display panel is needed to solve the above technical problems.
Disclosure of Invention
The embodiment of the application provides a display panel, which can improve the technical problem that the reliability of a display product is reduced due to the fact that a gap exists between a circuit driving layer and an OLED luminescent layer in the current display panel.
The embodiment of the application provides a display panel, which comprises: the display device comprises a first substrate, a second substrate and a filling layer, wherein the first substrate comprises a substrate and a driving circuit layer arranged on the substrate, the driving circuit layer comprises a plurality of first terminals, one or more second substrates are arranged on the first substrate, each second substrate comprises a light-emitting layer and a plurality of second terminals arranged on the light-emitting layer, and each second terminal is arranged opposite to and electrically connected with each first terminal;
wherein the filling layer is arranged between the first substrate and the second substrate.
Optionally, in some embodiments of the present application, the filling layer includes a conductive portion and a first insulating portion, the conductive portion is disposed between the first terminal and the second terminal, an orthographic projection of the conductive portion on the first substrate overlaps an orthographic projection of the first terminal on the first substrate, and the first insulating portion is disposed around the first terminal and the second terminal;
wherein the first terminal is electrically connected with the corresponding second terminal through the conductive part.
Optionally, in some embodiments of the present application, when the driving circuit layer is a transparent driving circuit layer and the light emitting layer is a transparent organic light emitting layer, the material of the first insulating portion includes at least one of a transparent optical adhesive film and a transparent optical adhesive.
Optionally, in some embodiments of the present application, when the driving circuit layer is a flexible driving circuit layer and the light emitting layer is a flexible organic light emitting layer, the material of the first insulating portion includes at least one of a flexible adhesive film and a flexible adhesive.
Optionally, in some embodiments of the present application, the material of the filling layer includes any one of a first anisotropic conductive adhesive film and a anisotropic conductive adhesive; the materials of the conductive part and the first insulating part comprise a first resin matrix and a plurality of first conductive particles filled in the first resin matrix;
wherein the first terminals are electrically connected with the corresponding second terminals through the first conductive particles.
Optionally, in some embodiments of the present application, the material of the filling layer includes a second anisotropic conductive film; the material of the conductive part comprises a second resin matrix and a plurality of second conductive particles filled in the second resin matrix, and the material of the first insulating part comprises the second resin matrix;
wherein the first terminals are electrically connected with the corresponding second terminals through the second conductive particles.
Optionally, in some embodiments of the present application, the material of the conductive portion includes at least one of an anisotropic conductive adhesive film, an anisotropic conductive adhesive, a metal solder, a solder paste, and a liquid metal; the material of the first insulating part comprises at least one of insulating adhesive and insulating adhesive film;
the conductive adhesive comprises a polymer conductive adhesive or a conductive adhesive doped with conductive particles, wherein the conductive particles are metal particles or at least one combination of graphene, carbon nano tubes, carbon fibers and metal nanowires.
Optionally, in some embodiments of the present application, the first terminal is in contact with the corresponding second terminal, and the filling layer includes a second insulating portion, and the second insulating portion is disposed around the first terminal and the second terminal;
the material of the second insulating part comprises at least one of insulating adhesive and insulating adhesive film.
Optionally, in some embodiments of the present application, a thickness of the filling layer is greater than or equal to a sum of thicknesses of the first terminal and the second terminal disposed corresponding to the first terminal.
Optionally, in some embodiments of the present application, a plurality of first grooves are disposed on the first substrate, and the first terminals are disposed in the first grooves; and/or the second substrate is provided with a plurality of second grooves, and the second terminals are arranged in the second grooves;
wherein the filling layer completely fills the first groove or the second groove.
The embodiment of the application provides a display panel; the display panel comprises a first substrate, a second substrate and a filling layer, wherein the first substrate comprises a substrate and a driving circuit layer arranged on the substrate, the driving circuit layer comprises a plurality of first terminals, the second substrate is arranged opposite to the first substrate, the second substrate comprises a light-emitting layer and a plurality of second terminals arranged on the light-emitting layer, each second terminal is arranged opposite to and electrically connected with each first terminal, and the filling layer is arranged between the first substrate and the second substrate; according to the display panel, the filling layer is arranged between the driving circuit layer and the light-emitting layer, so that the first terminal is electrically connected with the corresponding second terminal, gaps existing between the circuit driving layer and the light-emitting layer are completely filled in other areas, the bonding strength between the circuit driving layer and the light-emitting layer is improved, and the reliability of the display panel is further improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic plan view of a display panel according to a first embodiment of the present disclosure;
fig. 2 is a schematic cross-sectional structure of a display panel according to a first embodiment of the present disclosure;
fig. 3 is a schematic cross-sectional structure of a display panel according to a second embodiment of the present disclosure;
fig. 4 is a schematic cross-sectional structure of a display panel according to a third embodiment of the present disclosure;
fig. 5 is a schematic cross-sectional structure of a display panel according to a fourth embodiment of the present disclosure.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and explanation only and is not intended to limit the present application. In this application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.
Aiming at the technical problem that the reliability of a display product is reduced due to the fact that gaps exist between a circuit driving layer and an OLED luminescent layer in the current display panel, the embodiment of the application can improve the technical problem.
The technical solutions of the present application will now be described with reference to specific embodiments.
Referring to fig. 1 to 5, a display panel 100 according to an embodiment of the present disclosure includes: a first substrate 101, a second substrate 201, and a filling layer 31, the first substrate 101 including a substrate and a driving circuit layer 102 disposed on the substrate, the driving circuit layer 102 including a plurality of first terminals 103, the second substrate 201 being disposed opposite to the first substrate 101, the second substrate 201 including a light emitting layer 202 and a plurality of second terminals 203 disposed on the light emitting layer 202, each of the second terminals 203 being disposed opposite to and electrically connected to each of the first terminals 103;
wherein the filling layer 31 is disposed between the first substrate 101 and the second substrate 201.
According to the display panel 100, the filling layer 31 is arranged between the driving circuit layer 102 and the light-emitting layer 202, so that the first terminal 103 is electrically connected with the corresponding second terminal 203, gaps existing between the driving circuit layer 102 and the light-emitting layer 202 are completely filled in other areas, the bonding strength between the driving circuit layer 102 and the light-emitting layer 202 is improved, and the reliability of the display panel 100 is further improved.
The technical solutions of the present application will now be described with reference to specific embodiments.
Example 1
Fig. 1 is a schematic plan view of a display panel 100 according to a first embodiment of the present disclosure; the display panel includes a first substrate 101, one or more second substrates 201 are disposed on the same first substrate 101 in an array, and a plurality of driving chips 104 are disposed on the first substrate 101.
Specifically, an assembly gap 300 exists between two adjacent second substrates. Fig. 2 is a schematic cross-sectional structure of a display panel 100 according to a first embodiment of the present disclosure; wherein the display panel 100 includes: a first substrate 101, a second substrate 201, and a filling layer 31, the first substrate 101 including a substrate and a driving circuit layer 102 disposed on the substrate, the driving circuit layer 102 including a plurality of first terminals 103, the second substrate 201 being disposed opposite to the first substrate 101, the second substrate 201 including a light emitting layer 202 and a plurality of second terminals 203 disposed on the light emitting layer 202, each of the second terminals 203 being disposed opposite to and electrically connected to each of the first terminals 103;
wherein the filling layer 31 is disposed between the first substrate 101 and the second substrate 201.
In the embodiment of the application, the substrate may include a first flexible substrate layer, a silicon dioxide layer, a second flexible substrate layer and a buffer layer which are sequentially stacked. Wherein the second flexible substrate layer and the first flexible substrate layer are the same in material and may include at least one of PI (polyimide), PET (polyethylene naphthalate), PEN (polyethylene naphthalate), PC (polycarbonate), PES (polyethersulfone), PAR (aromatic fluorotoluene containing polyarylate), or PCO (polycyclic olefin). The buffer layer is composed of a stack structure of one or more of silicon-containing nitride, silicon-containing oxide or silicon-containing oxynitride.
Further, the driving circuit layer 102 includes a thin film transistor, a gate insulating layer, an interlayer dielectric layer, a conductive pad, a first passivation layer, a pixel electrode, and a second passivation layer. The thin film transistor comprises an active layer, a grid electrode, a source electrode and a drain electrode. The active layer is disposed on the first substrate 101, and the active layer includes a channel region and doped regions, and the doped regions are located at two sides of the channel region. The active layer may be an oxide active layer or a low temperature polysilicon active layer. For example, in some embodiments, the material of the active layer is indium tin oxide, ln-IZO, ITZO, ITGZO, HIZO, IZO (InZnO), znO: F, in may also be used 2 O 3 :Sn、In 2 O 3 :Mo、Cd 2 SnO 4 、ZnO:Al、TiO 2 Nb, cd-Sn-O or other metal oxides. The doped region can be a P-type doped region or an N-type doped region, and when the doped region is the P-type doped region, the doped element of the doped region is one or a mixture of two of boron and indium. When the doped region is an N-type doped region, the doped element of the doped region is one or a mixture of more of phosphorus, arsenic and antimony.
Further, the gate insulating layer covers the active layer and the substrate. The material of the gate insulating layer may be one of silicon nitride, silicon oxide, silicon oxynitride or aluminum oxide or any combination thereof.
The gate is disposed on the gate insulating layer, and an orthographic projection of the gate on the substrate is entirely covered by an orthographic projection of the active layer on the base layer. Wherein, the material of the grid electrode can be metal or alloy such as Cr, W, ti, ta, mo, al, cu, and the grid metal layer composed of multiple layers of metals can also meet the requirement.
The interlayer dielectric layer covers the gate insulating layer and the gate, wherein the interlayer dielectric layer can be oxide or oxynitride.
The source electrode and the drain electrode are respectively and electrically connected with the doped regions positioned at two sides of the channel region. The source electrode and the drain electrode can be made of Cr, W, ti, ta, mo, al, cu metal or alloy, and a gate metal layer consisting of multiple layers of metals can also be used.
The second passivation layer covers the pixel electrode and the first passivation layer, and exposes the first electrode 22. The first passivation layer and the second passivation layer can be made of SiO x 、SiO x /SiN x Lamination or SiO x /SiN x /Al 2 O 3 Laminated inorganic nonmetallic film layer materials.
In this embodiment of the present application, the light emitting layer 202 includes a plurality of pixel units, each of which is composed of at least two sub-pixels with different colors, and each of the pixel units includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel arranged along a first direction.
Further, the light emitting layer 202 is any one of an organic electroluminescent layer, a light emitting diode light emitting layer, a micro light emitting diode light emitting layer, and a mini light emitting diode light emitting layer.
In the embodiment of the present application, the filling layer 31 is disposed between the first substrate 101 and the second substrate 201.
Further, the filling layer 31 includes a conductive portion 311 and a first insulating portion 312, the conductive portion 311 is disposed between the first terminal 103 and the second terminal 203, a front projection of the conductive portion 311 on the first substrate 101 overlaps a front projection of the first terminal 103 on the first substrate 101, and the first insulating portion 312 is disposed around the first terminal 103 and the second terminal 203;
wherein the first terminal 103 is electrically connected to the corresponding second terminal 203 through the conductive portion 311.
Still further, the conductive portion 311 is used to fill a gap of a signal conductive region between the driving circuit layer 102 and the light emitting layer 202, and the first insulating portion 312 is used to fill a gap of a non-signal conductive region between the driving circuit layer 102 and the light emitting layer 202.
In the embodiment of the present application, the material of the conductive portion 311 may be one or more of Anisotropic Conductive Film (ACF), anisotropic conductive Adhesive (ACP), conductive adhesive, metal solder, solder paste, liquid metal, and the like, but is not limited thereto.
Further, the conductive adhesive may be a polymer conductive adhesive or a conductive adhesive doped with conductive particles, but is not limited thereto; the doped conductive particles can be metal particles or graphene, carbon nano tubes, carbon fibers, metal nanowires and the like and composite materials thereof, and the metal particles can be one or more of gold, silver, copper, aluminum, nickel and composite materials thereof. The metallic solder may be an alloy solder such as Bi, in, sn, pb, etc.
In this embodiment, the material of the first insulating portion 312 includes at least one of an insulating adhesive and an insulating adhesive film, where the insulating adhesive is a non-conductive adhesive, the insulating adhesive film is a non-conductive adhesive film, and the insulating adhesive is transparent or non-transparent, and may be hard adhesive or soft adhesive.
In the embodiment of the present application, since the conductive portion 311 is disposed between the driving circuit layer 102 and the light emitting layer 202, the thickness of the filling layer 31 is greater than the sum of the thicknesses of the first terminal 103 and the second terminal 203 disposed corresponding to the first terminal 103.
Further, when the material of the first insulating portion 312 is a transparent optical adhesive film or a transparent optical adhesive, and the light emitting layer 202 is a transparent organic light emitting layer 202, and the driving circuit layer 102 is a transparent driving circuit layer 102, at this time, the display panel 100 can realize transparent display; when the material of the first insulating portion 312 is a flexible adhesive film or a flexible adhesive, and the light emitting layer 202 is a flexible organic light emitting layer 202, and the driving circuit layer 102 is a flexible driving circuit layer 102, the display panel 100 can be applied to a flexible display device.
In the embodiment of the present application, the driving circuit layer 102 inputs a signal to the light emitting layer 202 to make it emit light. The first terminals 103 are protruded or recessed on the driving circuit layer 102, the second terminals 203 are protruded or recessed on the light emitting layer 202, and each of the second terminals 203 is disposed opposite to and electrically connected with each of the first terminals 103; at this time, after the electric signal of the driving circuit layer 102 is transmitted to the first terminal 103, the first terminal 103 is transmitted to the second terminal 203 via the conductive portion 311, and finally transmitted to the light emitting layer 202, thereby realizing the light emitting display function of the display panel 100. Meanwhile, the non-signal conductive region between the driving circuit layer 102 and the light emitting layer 202 is bonded by the first insulating portion 312, so that the bonding strength between the driving circuit layer 102 and the light emitting layer 202 is enhanced.
Further, when the first terminal 103 is recessed on the driving circuit layer 102, a plurality of first grooves are formed on the first substrate 101, and the first terminal 103 is disposed in the first grooves; when the second terminal 203 is recessed on the light emitting layer 202, a plurality of second grooves are formed on the second substrate 201, and the second terminal 203 is disposed in the second grooves;
wherein the filling layer 31 completely fills the first groove or the second groove.
In the embodiment of the application, the driving circuit layer 102 and the light-emitting layer 202 are separately disposed on the first substrate 101 and the second substrate 201, which are in the form of a spliced display screen, so that the small-size flexible display screen can be spliced into a large-size flexible display. In view of the technical problem that a gap exists between the driving circuit layer 102 and the OLED light-emitting layer 202 in the current display panel 100, resulting in a decrease in reliability of a display product, the display panel 100 provided in this embodiment of the present application includes a first substrate 101, a second substrate 201, and a filling layer 31, where the first substrate 101 includes a substrate and the driving circuit layer 102 disposed on the substrate, the driving circuit layer 102 includes a plurality of first terminals 103, the second substrate 201 is disposed opposite to the first substrate 101, the second substrate 201 includes a light-emitting layer 202 and a plurality of second terminals 203 disposed on the light-emitting layer 202, each of the second terminals 203 is disposed opposite to and electrically connected to each of the first terminals 103, and the filling layer 31 is disposed between the first substrate 101 and the second substrate 201, where the filling layer 31 includes a conductive portion 311 disposed between the driving circuit layer 102 and the light-emitting layer 202 and a first insulating portion 312 disposed outside the conductive portion 311; in the display panel 100, the filling layer 31 is disposed between the driving circuit layer 102 and the light emitting layer 202, so that the first terminal 103 is electrically connected with the corresponding second terminal 203, and the gap between the driving circuit layer 102 and the light emitting layer 202 is completely filled in the non-signal communication region between the driving circuit layer 102 and the light emitting layer 202, thereby improving the bonding strength between the driving circuit layer 102 and the light emitting layer 202 and further improving the reliability of the display panel 100.
Example two
As shown in fig. 3, a schematic cross-sectional structure of a display panel 100 according to a second embodiment of the present application is shown; the structure of the display panel 100 in the second embodiment of the present application is the same as or similar to that of the display panel 100 in the first embodiment of the present application, and the difference is that the conductive portion 311 and the first insulating portion 312 are made of an integrally formed material.
Specifically, in the embodiment of the present application, the material of the filling layer 31 includes any one of a first anisotropic conductive adhesive film and a anisotropic conductive adhesive; the materials of the conductive part 311 and the first insulating part 312 each include a first resin matrix 41 and a plurality of first conductive particles 42 filled in the first resin matrix 41;
wherein the first terminals 103 are electrically connected to the corresponding second terminals 203 through the first conductive particles 42.
Specifically, the first anisotropic conductive adhesive film or the anisotropic conductive adhesive is conductive only in a first direction, which is a direction extending from the first terminal 103 to the second terminal 203, and is nonconductive in a planar direction perpendicular to the first direction. Wherein, the first anisotropic conductive film is directly bonded between the driving circuit layer 102 and the light emitting layer 202 by using a mold pressing process, so that the first conductive particles 42 can uniformly fill the whole area; the anisotropic conductive adhesive is coated on the light-emitting layer 202 or the driving circuit layer 102 by a coating process, and then is directly bonded between the driving circuit layer 102 and the light-emitting layer 202 by a molding process, so that the first conductive particles 42 can uniformly fill the whole area.
Further, the pitch of two adjacent first conductive particles 42 in the conductive portion 311 is smaller than or equal to the pitch of two adjacent first conductive particles 42 in the first insulating portion 312. This arrangement can increase the distribution density of the first conductive particles 42 in the conductive portion 311, thereby improving the conductivity of the conductive portion 311 and further improving the reliability of the display panel 100.
Aiming at the technical problem that a gap exists between a driving circuit layer 102 and an OLED light-emitting layer 202 in the current display panel 100, so that the reliability of a display product is reduced, the display panel 100 provided by the embodiment of the application comprises a first substrate 101, a second substrate 201 and a filling layer 31, wherein the first substrate 101 comprises a substrate and the driving circuit layer 102 arranged on the substrate, the driving circuit layer 102 comprises a plurality of first terminals 103, the second substrate 201 is arranged opposite to the first substrate 101, the second substrate 201 comprises a light-emitting layer 202 and a plurality of second terminals 203 arranged on the light-emitting layer 202, each second terminal 203 is arranged opposite to and electrically connected with each first terminal 103, and the filling layer 31 is arranged between the first substrate 101 and the second substrate 201, wherein the material of the filling layer 31 comprises any one of a first anisotropic conductive adhesive film and an anisotropic conductive adhesive; in the display panel 100, the filling layer 31 is disposed between the driving circuit layer 102 and the light emitting layer 202, so that the first terminal 103 is electrically connected with the corresponding second terminal 203, and the gap between the driving circuit layer 102 and the light emitting layer 202 is completely filled in the non-signal communication region between the driving circuit layer 102 and the light emitting layer 202, thereby improving the bonding strength between the driving circuit layer 102 and the light emitting layer 202 and further improving the reliability of the display panel 100.
In addition, in comparison with the first embodiment of the present application, the conductive portion 311 and the first insulating portion 312 are integrally formed, so that the driving circuit layer 102 and the light-emitting layer 202 are conducted, and the effect of close adhesion between the driving circuit layer 102 and the light-emitting layer 202 is further achieved.
Example III
Fig. 4 is a schematic cross-sectional structure of a display panel 100 according to a third embodiment of the present disclosure; the structure of the display panel 100 in the third embodiment of the present application is the same as or similar to the structure of the display panel 100 in the second embodiment of the present application, and the difference is that the material of the filling layer 31 includes a second anisotropic conductive film; the material of the conductive part 311 includes a second resin matrix 51 and a plurality of second conductive particles 52 filled in the second resin matrix 51, and the material of the first insulating part 312 includes the second resin matrix 51;
wherein the first terminals 103 are electrically connected to the corresponding second terminals 203 through the second conductive particles 52.
Specifically, in this embodiment of the present application, the second anisotropic conductive film is an array anisotropic conductive film, where the conductive particles are arranged in a direction according to the circuit requirement, and only the circuit requirement area of the resin substrate has the conductive particles.
Further, the second conductive particles 52 are aligned along the first direction.
The second anisotropic conductive film is directly bonded between the driving circuit layer 102 and the light emitting layer 202 by using a mold pressing process, so that the second conductive particles 52 can uniformly fill the entire conductive portion 311.
In this embodiment, when the material of the first insulating portion 312 is a transparent resin substrate and the light emitting layer 202 is a transparent organic light emitting layer 202 and the driving circuit layer 102 is a transparent driving circuit layer 102, the display panel 100 may realize transparent display; when the material of the first insulating portion 312 is a flexible resin matrix and the light emitting layer 202 is a flexible organic light emitting layer 202 and the driving circuit layer 102 is a flexible driving circuit layer 102, the display panel 100 may be applied to a flexible display device.
Aiming at the technical problem that a gap exists between a driving circuit layer 102 and an OLED light-emitting layer 202 in the current display panel 100, so that the reliability of a display product is reduced, the display panel 100 provided by the embodiment of the application comprises a first substrate 101, a second substrate 201 and a filling layer 31, wherein the first substrate 101 comprises a substrate and the driving circuit layer 102 arranged on the substrate, the driving circuit layer 102 comprises a plurality of first terminals 103, the second substrate 201 is arranged opposite to the first substrate 101, the second substrate 201 comprises a light-emitting layer 202 and a plurality of second terminals 203 arranged on the light-emitting layer 202, each second terminal 203 is arranged opposite to and electrically connected with each first terminal 103, and the filling layer 31 is arranged between the first substrate 101 and the second substrate 201, wherein the material of the filling layer 31 is an array anisotropic conductive film; in the display panel 100, the filling layer 31 is disposed between the driving circuit layer 102 and the light emitting layer 202, so that the first terminal 103 is electrically connected with the corresponding second terminal 203, and the gap between the driving circuit layer 102 and the light emitting layer 202 is completely filled in the non-signal communication region between the driving circuit layer 102 and the light emitting layer 202, thereby improving the bonding strength between the driving circuit layer 102 and the light emitting layer 202 and further improving the reliability of the display panel 100.
In addition, compared with the second embodiment of the present application, the third embodiment of the present application adopts the array type anisotropic conductive adhesive film to bond the first terminal 103 and the second terminal 203 together, so as to realize interlayer transmission of circuit signals, and realize absolute insulation of a non-signal conducting area while ensuring conduction of a signal conducting area, and simultaneously, the driving circuit layer 102 and the light-emitting layer 202 are tightly attached together, so that the process operation is simpler, and the advantage of higher reliability is realized.
Example IV
Fig. 5 is a schematic cross-sectional structure of a display panel 100 according to a fourth embodiment of the present disclosure; the structure of the display panel 100 in the fourth embodiment of the present application is the same as or similar to the structure of the display panel 100 in the first embodiment of the present application, and the difference is that the first terminal 103 is in direct contact with the corresponding second terminal 203, the filling layer 31 includes a second insulating portion 61, and the second insulating portion 61 is disposed around the first terminal 103 and the second terminal 203;
wherein, the material of the second insulating portion 61 includes at least one of an insulating adhesive and an insulating adhesive film.
In this embodiment, a molding process is used to press a small portion of the second insulating portion 61 between the light emitting layer 202 and the driving circuit layer 102 to an empty state as much as possible, so that the electrical resistance between the first terminal 103 and the second terminal 203 is minimized while the bonding strength is ensured.
In the embodiment of the present application, since the first terminal 103 is directly electrically connected to the second terminal 203, the thickness of the filling layer 31 is equal to the sum of the thicknesses of the first terminal 103 and the second terminal 203 disposed corresponding to the first terminal 103.
In this embodiment, when the material of the second insulating portion 61 is a transparent insulating adhesive or a transparent insulating film, and the light-emitting layer 202 is a transparent organic light-emitting layer 202, and the driving circuit layer 102 is a transparent driving circuit layer 102, at this time, the display panel 100 may realize transparent display; when the material of the second insulating portion 61 is a transparent insulating adhesive or a transparent insulating film, and the light emitting layer 202 is a flexible organic light emitting layer 202, and the driving circuit layer 102 is a flexible driving circuit layer 102, the display panel 100 can be applied to a flexible display device.
Aiming at the technical problem that a gap exists between a driving circuit layer 102 and an OLED light-emitting layer 202 in the current display panel 100, so that the reliability of a display product is reduced, the display panel 100 provided by the embodiment of the application comprises a first substrate 101, a second substrate 201 and a filling layer 31, wherein the first substrate 101 comprises a substrate and the driving circuit layer 102 arranged on the substrate, the driving circuit layer 102 comprises a plurality of first terminals 103, the second substrate 201 is arranged opposite to the first substrate 101, the second substrate 201 comprises a light-emitting layer 202 and a plurality of second terminals 203 arranged on the light-emitting layer 202, each second terminal 203 is arranged opposite to and electrically connected with each first terminal 103, and the filling layer 31 is arranged between the first substrate 101 and the second substrate 201, wherein the filling layer 31 is made of at least one of insulating adhesive and insulating adhesive film; in the display panel 100, the filling layer 31 is disposed between the driving circuit layer 102 and the light emitting layer 202, so that the first terminal 103 is electrically connected with the corresponding second terminal 203, and the gap between the driving circuit layer 102 and the light emitting layer 202 is completely filled in the non-signal communication region between the driving circuit layer 102 and the light emitting layer 202, thereby improving the bonding strength between the driving circuit layer 102 and the light emitting layer 202 and further improving the reliability of the display panel 100.
In addition, in comparison with the fourth embodiment of the present application, the driving circuit layer 102 and the light-emitting layer 202 are bonded together in the non-signal transmission area of the display panel 100 by using an insulating adhesive or an insulating adhesive film, and the first terminal 103 and the second terminal 203 are directly electrically connected by using a molding process, so that the light-emitting layer 202 and the driving circuit layer 102 of the display panel 100 are tightly bonded while circuit conduction can be realized by using one material.
Accordingly, embodiments of the present application also provide a mobile terminal including the display panel 100 as set forth in any one of the above. The mobile terminal is mainly applied to the active matrix organic electroluminescent display panel 100, and has wide application space in vehicle-mounted, mobile phone, tablet personal computer and television products.
The embodiment of the application provides a display panel 100 and a mobile terminal; the display panel 100 includes a first substrate 101, a second substrate 201, and a filling layer 31, the first substrate 101 includes a substrate and a driving circuit layer 102 disposed on the substrate, the driving circuit layer 102 includes a plurality of first terminals 103, the second substrate 201 is disposed opposite to the first substrate 101, the second substrate 201 includes a light emitting layer 202 and a plurality of second terminals 203 disposed on the light emitting layer 202, each of the second terminals 203 is disposed opposite to and electrically connected to each of the first terminals 103, and the filling layer 31 is disposed between the first substrate 101 and the second substrate 201; in the display panel 100, the filling layer 31 is disposed between the driving circuit layer 102 and the light emitting layer 202, so that the first terminal 103 is electrically connected with the corresponding second terminal 203, and gaps between the driving circuit layer 102 and the light emitting layer 202 are completely filled in other areas, so that the bonding strength between the driving circuit layer 102 and the light emitting layer 202 is improved, and the reliability of the display panel 100 is further improved.
The foregoing has described in detail a display panel 100 and a mobile terminal provided in embodiments of the present application, and specific examples have been applied herein to illustrate the principles and implementations of the present application, where the foregoing examples are only for aiding in understanding the methods and core ideas of the present application; meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.
Claims (9)
1. A display panel, comprising:
a first substrate including a substrate and a driving circuit layer disposed on the substrate, the driving circuit layer including a plurality of first terminals;
the second substrates are arranged on the first substrates, each second substrate comprises a light-emitting layer and a plurality of second terminals arranged on the light-emitting layer, and each second terminal is arranged opposite to and electrically connected with each first terminal; and
a filling layer disposed between the first substrate and the second substrate;
the filling layer comprises a conductive part and a first insulating part, the conductive part is arranged between the first terminal and the second terminal, the orthographic projection of the conductive part on the first substrate is overlapped with the orthographic projection of the first terminal on the first substrate, the first insulating part surrounds the first terminal and the second terminal, and the first terminal is electrically connected with the corresponding second terminal through the conductive part.
2. The display panel according to claim 1, wherein when the driving circuit layer is a transparent driving circuit layer and the light emitting layer is a transparent organic light emitting layer, the material of the first insulating portion includes at least one of a transparent optical adhesive film and a transparent optical adhesive.
3. The display panel according to claim 1, wherein when the driving circuit layer is a flexible driving circuit layer and the light emitting layer is a flexible organic light emitting layer, the material of the first insulating portion includes at least one of a flexible adhesive film and a flexible adhesive.
4. The display panel according to claim 1, wherein the material of the filling layer includes any one of a first anisotropic conductive adhesive film and a anisotropic conductive adhesive; the materials of the conductive part and the first insulating part comprise a first resin matrix and a plurality of first conductive particles filled in the first resin matrix;
wherein the first terminals are electrically connected with the corresponding second terminals through the first conductive particles.
5. The display panel of claim 1, wherein the material of the filler layer comprises a second anisotropic conductive film; the material of the conductive part comprises a second resin matrix and a plurality of second conductive particles filled in the second resin matrix, and the material of the first insulating part comprises the second resin matrix;
wherein the first terminals are electrically connected with the corresponding second terminals through the second conductive particles.
6. The display panel of claim 5, wherein the material of the conductive portion comprises at least one of an anisotropic conductive film, an anisotropic conductive adhesive, a metallic solder, a solder paste, and a liquid metal; the material of the first insulating part comprises at least one of insulating adhesive and insulating adhesive film;
the conductive adhesive comprises a polymer conductive adhesive or a conductive adhesive doped with conductive particles, wherein the conductive particles are metal particles or at least one combination of graphene, carbon nano tubes, carbon fibers and metal nanowires.
7. A display panel, comprising:
a first substrate including a substrate and a driving circuit layer disposed on the substrate, the driving circuit layer including a plurality of first terminals;
the second substrates are arranged on the first substrates, each second substrate comprises a light-emitting layer and a plurality of second terminals arranged on the light-emitting layer, and each second terminal is arranged opposite to and electrically connected with each first terminal; and
a filling layer disposed between the first substrate and the second substrate;
the first terminal is in contact with the corresponding second terminal, the filling layer comprises a second insulating part, the second insulating part is arranged around the first terminal and the second terminal, and the material of the second insulating part comprises at least one of insulating adhesive and insulating adhesive film.
8. The display panel according to claim 1 or 7, wherein a thickness of the filling layer is greater than or equal to a sum of thicknesses of the first terminal and the second terminal provided corresponding to the first terminal.
9. The display panel according to claim 1 or 7, wherein a plurality of first grooves are provided on the first substrate, and the first terminals are disposed in the first grooves; and/or the second substrate is provided with a plurality of second grooves, and the second terminals are arranged in the second grooves;
wherein the filling layer completely fills the first groove or the second groove.
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| CN114744017A (en) * | 2022-04-27 | 2022-07-12 | 武汉华星光电半导体显示技术有限公司 | Display panel, manufacturing method thereof and mobile terminal |
| CN114864624B (en) * | 2022-05-12 | 2023-08-08 | 滁州惠科光电科技有限公司 | Display panel and display |
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| US10497845B2 (en) * | 2017-03-27 | 2019-12-03 | Seoul Semiconductor Co., Ltd. | Display apparatus and method of manufacturing the same |
| WO2020036230A1 (en) * | 2018-08-17 | 2020-02-20 | 国立大学法人京都大学 | Optical element and refresh drive method for optical element |
| CN111176027A (en) * | 2020-02-20 | 2020-05-19 | Tcl华星光电技术有限公司 | Liquid crystal display panel and preparation method thereof |
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