CN114141932A

CN114141932A - Base plate assembly

Info

Publication number: CN114141932A
Application number: CN202111652677.XA
Authority: CN
Inventors: 陈彦铭; 孙平如; 曹金涛
Original assignee: Wuhu Jufei Photoelectric Technology Co ltd
Current assignee: Wuhu Jufei Photoelectric Technology Co ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2022-03-04

Abstract

The invention provides a substrate assembly, which further comprises a first heat dissipation layer arranged on the back surface of the substrate main body, wherein the first heat dissipation layer is made of an insulating material, and covers the positive circuit layer and the negative circuit layer. The first heat dissipation layer is arranged on the back of the substrate main body to cover the positive circuit layer and the negative circuit layer, and is made of an insulating material, so that short circuit of the positive circuit layer and the negative circuit layer can be avoided, the positive circuit layer and the negative circuit layer can be protected, and reliability of the substrate main body is improved; simultaneously can with the transmission to anodal circuit layer with the heat on negative pole circuit layer is through the quick outside effluvium of first heat dissipation layer, can further promote the radiating efficiency.

Description

Base plate assembly

Technical Field

The invention relates to the field of display, in particular to a substrate assembly.

Background

The Micro LED technology and the Mini LED technology can support higher brightness, high dynamic range and wide color gamut due to the ultrahigh display quality and stability, have low power consumption and energy conservation, are widely applied to mobile phones, pen-type televisions, TV sets, vehicle-mounted display screens, indoor studio and outdoor large-scale display screens and the like, arouse various manufacturers and researchers to pay attention, and are put into research and development.

However, for the current product, the circuit layer is basically disposed on the front surface of the substrate, and the main way of heat dissipation is to dissipate heat from the front surface of the encapsulation adhesive layer, which results in poor bonding property between the circuit layer and the encapsulation adhesive layer on the surface layer and poor heat dissipation, so that a large amount of heat generated by the LED chip cannot be dissipated effectively, thereby affecting the life and quality of the product. Therefore, how to effectively dissipate heat of the product and improve the bonding between the product and the packaging adhesive layer is a problem to be solved urgently.

Disclosure of Invention

In view of the above-mentioned deficiencies of the related art, an object of the present invention is to provide a substrate assembly, which aims to solve the problems of how to effectively dissipate heat from a product and how to improve the bonding between the product and a packaging adhesive layer in the conventional packaging product.

In order to solve the above technical problem, the present invention provides a substrate assembly for a display module, including:

a substrate body which is an insulating substrate body;

the bonding pad groups are arranged on the front surface of the substrate main body, and each bonding pad group comprises two bonding pads corresponding to the positive electrode and the negative electrode of the LED chip respectively;

the positive electrode circuit layer and the negative electrode circuit layer are arranged on the back surface of the substrate main body;

the bonding pads in the bonding pad group are electrically connected with the positive electrode circuit layer and the negative electrode circuit layer respectively through the corresponding conductive pieces;

the first heat conduction layer is arranged on the front surface of the substrate main body, is provided with an opening for exposing the pad group, and is insulated and isolated from the pads in the pad group.

It should be noted that, in the substrate assembly provided in the present invention, each pad on the front surface of the substrate main body corresponds to one first through hole, and the positive electrode circuit layer and the negative electrode circuit layer are changed from being disposed on the front surface of the substrate main body to being disposed on the back surface of the substrate main body, and the pad on the front surface is conductively connected to the positive electrode circuit layer and the negative electrode circuit layer corresponding to the back surface through the conductive member of the first through hole. Therefore, part of heat generated by the LED chip during working can be directly transmitted to the first through hole and the conductive piece through the bonding pad, and part of heat is transmitted to the first through hole and the conductive piece through the first heat conduction layer and is transmitted to the back of the substrate main body through the first through hole and the conductive piece, so that the heat dissipation efficiency of the LED chip can be improved, and on the other hand, most of the heat generated by the LED chip during working is prevented from being transmitted from the front of the substrate main body to reduce the associativity of the packaging adhesive layer and the substrate main body. Thereby solved and dispel the heat badly among the current encapsulation product, the not good problem of associativity of base plate and encapsulation glue film, promoted the associativity of base plate main part with the encapsulation glue film to radiating efficiency and radiating effect have been improved, the quality and the life of product have been promoted simultaneously.

In some embodiments, the substrate assembly further includes a first heat dissipation layer disposed on the back surface of the substrate body, the first heat dissipation layer is made of an insulating material, and the first heat dissipation layer covers the positive electrode circuit layer and the negative electrode circuit layer. The first heat dissipation layer is arranged on the back of the substrate main body to cover the positive circuit layer and the negative circuit layer, and is made of an insulating material, so that short circuit of the positive circuit layer and the negative circuit layer can be avoided, the positive circuit layer and the negative circuit layer can be protected, and reliability of the substrate main body is improved; simultaneously can with the transmission to anodal circuit layer with the heat on negative pole circuit layer is through the quick outside effluvium of first heat dissipation layer, can further promote the radiating efficiency.

In some embodiments, the substrate assembly further comprises a second heat dissipation layer disposed on the back surface of the substrate body and covering the first heat dissipation layer, wherein the second heat dissipation layer has a thermal conductivity greater than that of the first heat dissipation layer. Through covering the second heat dissipation layer that coefficient of heat conductivity is bigger on first heat dissipation layer to further carry out quick effectual heat dissipation through the better second heat dissipation layer of heat dispersion, in order to further promote its radiating efficiency.

In some embodiments, the region of the back surface of the substrate body located between the positive electrode circuit layer and the negative electrode circuit layer is exposed to the first heat dissipation layer and covered by the second heat dissipation layer. The heat that transmits the back that is located the region between positive pole circuit layer and the negative pole circuit layer to the base plate main part like this can directly transmit to the second heat dissipation layer, through the quick outside of second heat dissipation layer giving off, and the second heat dissipation layer can form the protection to regional cover, further promotes the reliability of product.

In some embodiments, the substrate assembly further includes a plurality of second through holes penetrating through the substrate body, one of the second through holes being located between two of the bonding pads in one of the bonding pad groups and communicating the corresponding LED chip with the second heat dissipation layer. Therefore, heat which is transferred between the two bonding pads at the bottom of the LED chip during working can be quickly transferred to the second heat conduction layer through the second through hole, and is quickly radiated outwards through the second heat radiation layer, so that the heat radiation efficiency of the LED chip is further improved.

In some embodiments, the substrate assembly further includes a heat conducting member disposed in the second through hole, the heat conducting member contacts the second heat dissipation layer, so that heat transferred between the two pads at the bottom of the LED chip during operation is transferred to the second heat dissipation layer more rapidly through the heat conducting member in the second through hole, thereby further improving the heat dissipation efficiency of the LED chip.

In some embodiments, the first heat-conducting layer includes the insulating layer and covers the metal level on the insulating layer, the insulating layer is rather than adjacent the pad flushes or is higher than the pad to guarantee that the metal level that covers above that is kept away from the pad is insulating isolation, just the metal level is kept away from the positive one side of base plate main part is the mirror surface, thereby sets up better the reflecting of the positive light of base plate main part with the LED chip, promotes light-emitting efficiency, thereby has promoted its display brightness and display effect.

In some embodiments, the size of the opening is larger than the size of the LED chip. When the encapsulation glue layer is arranged on the front surface of the substrate main body subsequently, the colloid of the encapsulation glue layer can penetrate into the gap between the LED chip and the first heat conduction layer, and the bonding strength of the encapsulation glue layer can be improved.

In some embodiments, the distance between the pad group closest to the edge of the front surface of the substrate main body and the edge of the front surface of the substrate main body is less than or equal to half of the pitch between adjacent pad groups. Therefore, when the display module manufactured by the substrate assemblies is required to be spliced, the distance between two adjacent lines of LED chips at the splicing positions of the substrate main bodies of the two substrate assemblies is basically consistent with the distance between two adjacent lines of LEDs in other areas, so that dark stripes with lower brightness than the other areas at the splicing positions are prevented, and the display effect is further improved.

Drawings

Fig. 1 is a schematic cross-sectional view of a substrate assembly according to an embodiment of the invention;

fig. 2 is a schematic cross-sectional view of another substrate assembly according to an embodiment of the present invention;

fig. 3 is a schematic cross-sectional view of another substrate assembly according to an embodiment of the present invention;

fig. 4 is a schematic cross-sectional view of a first thermally conductive layer according to an embodiment of the present invention;

fig. 5 is a schematic cross-sectional view of another first thermally conductive layer according to an embodiment of the present invention;

fig. 6 is a schematic cross-sectional view of another bonding pad according to the first embodiment of the invention;

FIG. 7 is a cross-sectional view of another substrate assembly according to an embodiment of the present invention;

fig. 8 is a schematic cross-sectional structure view of a display module according to a second embodiment of the present invention;

fig. 9 is a schematic cross-sectional structure view of a display module according to a third embodiment of the present invention.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

How to carry out effectual heat dissipation to the product among the current encapsulation product, promote its associativity with the encapsulation glue film simultaneously is the problem that needs to solve urgently.

Based on this, the present invention intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.

The first embodiment is as follows:

in order to solve the problems of poor heat dissipation and poor bonding between the conventional package product and the package adhesive layer, the present embodiment provides a substrate assembly, for example, as shown in fig. 1, a schematic cross-sectional structure diagram of the substrate assembly is provided. The substrate assembly of the embodiment includes a substrate main body 1, a light emitting region 2 disposed on the front surface of the substrate main body 1, a plurality of pad groups 3 disposed in the light emitting region 2, and one pad group 3 including two pads 4 corresponding to the positive electrode and the negative electrode of the LED chip, respectively. The substrate assembly further comprises a circuit layer 5 arranged on the back face of the substrate main body 1, a plurality of positive circuit layers 6 and negative circuit layers 7 are arranged in the area, corresponding to the light emitting area 2, of the circuit layer 5, and a pair of the positive circuit layers 6 and the negative circuit layers 7 correspond to the two bonding pads 4 in one bonding pad group 3. In this embodiment, the substrate assembly further includes a plurality of first through holes 8 disposed on the substrate body 1 and conductive members (not shown in the figure) disposed in the first through holes 8, one first through hole 8 connects one pad 4 with the positive electrode circuit layer 6 or the negative electrode circuit layer 7 corresponding to the pad 4, and the pad 4 is electrically connected with the positive electrode circuit layer 6 or the negative electrode circuit layer 7 corresponding to the pad 4 through the conductive member in the first through hole 8. Therefore, heat generated during the operation of the LED chip can be transferred to the bonding pad 4 connected with the electrode through the electrode, and is transferred to the first through hole 8 and the conductive piece in the first through hole 8 through the bonding pad 4, and is further transferred to the back of the substrate main body 1 through the conductive piece, and is dissipated from the back of the substrate main body, as shown in a heat dissipation path L1 in fig. 1, on the one hand, the heat dissipation efficiency of the LED chip can be improved, on the other hand, the problem that the heat generated during the operation of the LED chip is concentrated and is dissipated from the front of the substrate main body to reduce the bonding performance of the packaging adhesive layer and the substrate main body is solved. Thereby solved and dispel the heat in the current encapsulation product bad, the not good problem of associativity of base plate and encapsulation glue film, promoted the quality and the life of product.

It should be understood that the substrate body 1 of the present embodiment may be made of various insulating materials, such as but not limited to a glass substrate, a ceramic substrate, a plastic substrate, etc. The conductive member in this embodiment may be, but is not limited to, a conductive layer disposed on a sidewall of the first through hole 8, or may be a conductive pillar disposed in the first through hole 8 and filled with the first through hole 8, the conductive layer and the conductive pillar in this embodiment may be made of a metal material, for example, may include, but not limited to, at least one of gold, silver, copper, iron, and aluminum, and the metal material has both good conductive performance and good heat conduction performance, so that the pad 4 is electrically connected to the positive electrode circuit layer 6 or the negative electrode circuit layer 7, and at the same time, the heat dissipation efficiency can be further improved. Of course, in this embodiment, the conductive layer or the conductive pillar may also be replaced with a conductive adhesive with better thermal conductivity, and details are not described herein.

In some embodiments, for example, as shown in fig. 2, a cross-sectional structure of another substrate assembly is schematically illustrated, the substrate assembly further includes a first heat dissipation layer 10 disposed on the back surface of the substrate body 1, the first heat dissipation layer 10 is made of an insulating material and covers each of the positive electrode circuit layer 6 and the negative electrode circuit layer 7. It should be noted that, the first heat dissipation layer 10 is made of an insulating material, which not only can prevent the short circuit of the positive circuit layer 6 or the negative circuit layer 7, but also can protect the positive circuit layer 6 or the negative circuit layer 7 by covering the positive circuit layer 6 or the negative circuit layer 7, thereby improving the protection performance thereof. Meanwhile, heat transferred to the positive circuit layer 6 or the negative circuit layer 7 through the first through hole 8 and the conductive member therein can be rapidly dissipated through the first heat dissipation layer 10, so that the heat dissipation efficiency is further improved. In some examples, it should be understood that the first heat dissipation layer 10 in the present embodiment may use various insulating materials with better thermal conductivity, for example, the first heat dissipation layer 10 may be disposed as, but not limited to, an inorganic layer with better heat dissipation performance, and the thickness of the inorganic layer may be, but not limited to, 5um to 10 um. The arrangement manner of the first heat dissipation layer 10 in this embodiment may include, but is not limited to, arrangement by using a mold pressing or a hot pressing, and a person skilled in the art may perform the arrangement according to actual conditions and requirements, which is not limited in this embodiment. And it should be understood that, in the present embodiment, the first heat dissipation layer 10 may be disposed on the back surface of the substrate main body 1, only the positive wiring layer 6 and the negative wiring layer 7 are covered, and the region of the back surface of the substrate main body 1 between the positive wiring layer 6 and the negative wiring layer 7 is exposed to the first heat dissipation layer 10, for example, see the example shown in fig. 2. In other application scenarios of this embodiment, the first heat dissipation layer 10 may also be disposed on the back surface of the substrate main body 1, and covers the positive electrode circuit layer 6 and the negative electrode circuit layer 7, and all other areas or a part of the areas except the positive electrode circuit layer 6 and the negative electrode circuit layer 7, which may be flexibly set according to application requirements and is not described herein again.

In some embodiments, referring to fig. 3, in order to further improve the heat dissipation efficiency, the substrate assembly further includes a second heat dissipation layer 11 disposed on the back surface of the substrate body 1 and covering the first heat dissipation layer 10, and the heat conduction efficiency of the second heat dissipation layer 11 is higher than that of the first heat dissipation layer 10. In this example, the second heat dissipation layer 11 with a larger thermal conductivity is covered on the first heat dissipation layer 10, so that the heat dissipation speed is further increased by the second heat dissipation layer 11 with a better heat dissipation performance, and the heat dissipation efficiency is further increased.

And it should be understood that, in the present embodiment, the second heat dissipation layer 11 may be disposed on the back surface of the substrate main body 1, only the first heat dissipation layer 10 is covered, and the region of the back surface of the substrate main body 1 outside the first heat dissipation layer 10 is exposed to the second heat dissipation layer 11. In other application scenarios of this embodiment, the second heat dissipation layer 11 may also be disposed on the back surface of the substrate body 1, and the first heat dissipation layer 10 and all or a part of the other regions except the positive first heat dissipation layer 10 are covered, so that the heat in the region is directly transferred to the second heat dissipation layer 11, and the heat is rapidly dissipated outwards through the second heat dissipation layer 11, thereby further improving the heat dissipation efficiency. For example, referring to fig. 3, in the present example, a region S1 of the back surface of the substrate body 1 between the positive wiring layer 6 and the negative wiring layer 7 is exposed to the first heat dissipation layer 10 and covered by the second heat dissipation layer 11. The heat thus transferred to the region S1 of the back surface of the substrate main body 1 between the positive electrode wiring layer 6 and the negative electrode wiring layer 7 can be directly transferred to the second heat dissipation layer 11. In this example, the region S2 between the adjacent pair of positive and

negative circuit layers

6 and 7 is also exposed out of the first heat dissipation layer 10 and covered by the second heat dissipation layer 11, so that the heat transferred to the regions S1 and S2 is rapidly dissipated outwards through the second heat dissipation layer 11, and the second heat dissipation layer 11 can form a protection for covering the region, thereby further improving the reliability of the product. It should be noted that the second heat dissipation layer 11 may be disposed by, but not limited to, molding, hot pressing, etc., and as long as it can be disposed correctly, those skilled in the art can perform the disposition according to actual situations and requirements, and the present embodiment does not limit it. In order to realize quick and effective heat dissipation, in practical application, the thermal conductivity of the second heat dissipation layer 11 needs to be better than that of the first heat dissipation layer 10, and is better, the first heat dissipation layer 10 can include but is not limited to inorganic insulating materials such as plastics and plastics, the second heat dissipation layer 11 can include but is not limited to materials such as graphite or graphene, the thermal conductivity of graphite or graphene materials is good, the universality is high, and the heat dissipation efficiency can be further improved.

In the present embodiment, in addition to the heat dissipation path L1 for dissipating heat to the back surface of the substrate main body shown in the above examples, in order to further improve the heat dissipation efficiency and the heat dissipation effect, in some examples, the heat dissipation path for dissipating heat to the back surface of the substrate main body may be further increased. For example, referring to fig. 4, the substrate assembly further includes a first heat conduction layer 12 disposed on the front surface of the substrate main body 1, and the first heat conduction layer 12 has an opening for exposing the pad group 3 and is insulated and isolated from the pads 4 in the pad group 3. It is also understood that the first heat conductive layer 12 is disposed on the front surface of the substrate main body 1 in the region between the adjacent pad groups 3. In this embodiment, the insulating isolation between the first heat conduction layer 12 and the pad 4 in the adjacent pad group 3 may include, but is not limited to, not contacting the pad 4, or setting the contact area between the first heat conduction layer 12 and the pad 4 as an insulating material. It should be noted that the first heat conduction layer 12 may be disposed by, but not limited to, molding, etching, etc., and those skilled in the art can dispose it according to actual situations and requirements, and the present embodiment is not limited thereto. In the present example, the first heat conduction layer 12 and the pad 4 in the adjacent pad group 3 are not in contact with each other, so that the first heat conduction layer 12 is insulated from the pad 4. For another example, as shown in fig. 5, a schematic cross-sectional structure of another first heat conduction layer 12 is shown, which includes an insulating layer 121 disposed on the front surface of the substrate main body 1, and a metal layer 122 disposed on the insulating layer 121, where the insulating layer 121 is flush with the pads 4 in the adjacent pad group 3 or higher than the pads 4 on the front surface of the substrate main body 1, so as to ensure that the metal layer 122 disposed on the insulating layer 121 is insulated and isolated from the pads 4. It should be noted that the insulating layer 121 may be disposed by, but not limited to, molding, hot pressing, etc., and those skilled in the art may set the insulating layer according to actual situations and requirements, which is not limited in this embodiment. It should be noted that the insulating layer 121 may include, but is not limited to, an inorganic insulating material such as PI, low-reflectivity ink, etc., and in practical applications, the thickness of the insulating layer 121 may be set to 1-5 um. It should be noted that no matter what kind of material the insulating layer 121 is, it may not cover or contaminate the pad 4, so as to avoid that the insulating layer covers the pad 4, which may result in improper mounting of the LED chip, or poor contact of the mounted LED chip, etc.

It should be noted that the pads 4 in the present embodiment may include, but are not limited to, being disposed embedded in the substrate body 1 and being disposed flush with the front surface of the substrate body 1, for example, as shown in fig. 5. For example, as shown in fig. 6, another schematic cross-sectional structure diagram of a pad may be further provided, a part of the area of the pad 4 may be higher than the front surface of the substrate main body 1, and certainly, all of the pads 4 may also be higher than the front surface of the substrate main body 1, and a specific arrangement manner may be set by a person skilled in the art according to actual situations and requirements.

In this embodiment, by the arrangement of the first heat conduction layer 12, heat generated by the LED chip can be transferred from the side direction of the LED chip to the first heat conduction layer 12, and transferred to the pad 4 adjacent to the LED chip through the first heat conduction layer, and further transferred to the corresponding first through hole 8 and the conductive member in the first through hole 8 through the pad 4, and further transferred to the corresponding circuit layer and the first heat dissipation layer 10 on the back surface of the substrate body 1 through the one through hole 8 and the conductive member in the first through hole 8 and further dissipated outward through the second heat dissipation layer 11, and the heat dissipation path is shown as L2 in fig. 4 to 6.

In the examples shown in fig. 5 and fig. 6, the side of the metal layer 122 away from the front surface of the substrate main body 1 may be a mirror surface, and in some examples, the metal layer 122 may include but is not limited to a bright nickel layer, the thickness of which may be set to 10um to 20um, because the bright nickel layer has a high reflectivity, and the side thereof away from the front surface of the substrate main body 1 is a mirror surface, the reflection efficiency thereof may be further improved, and thus the brightness and the display effect thereof are further improved. It should be noted that no matter what material of the metal layer is, the metal layer can not cover or contaminate the pad 4, thereby avoiding the problems of short circuit and the like caused by the metal layer. In this embodiment, the surface of the metal layer 122 away from the front surface of the substrate body 1 may be a rough surface or a concave-convex surface to further increase the angle of the reflected light.

When the LED chip operates, the heat generated by the LED chip is mainly concentrated in the projection area of the LED chip on the front surface of the substrate body 1. Therefore, in order to further improve the heat dissipation efficiency of the LED chip, referring to fig. 7, the substrate assembly further includes a plurality of second through holes 14 penetrating through the substrate main body 1, where the second through holes 14 are located between two bonding pads 4 in one bonding pad group 3, that is, the second through holes 14 are located below the LED chip 15 and communicate the corresponding LED chip with the second heat dissipation layer 11. Therefore, heat transferred between the two bonding pads at the bottom of the LED chip during operation can be quickly transferred to the second heat conduction layer 11 through the second through hole 14, and is quickly dissipated outwards through the second heat dissipation layer 11, and therefore the heat dissipation efficiency of the LED chip is further improved. The problem of poor bonding property of the packaging adhesive layer caused by heat accumulation can be further avoided.

Optionally, the substrate assembly further includes a heat conducting member (not shown in the figure) with better heat conductivity disposed in the second through hole 14, the heat conducting member 14 is in contact with the second heat dissipation layer 11, so that the heat transferred between the two pads at the bottom of the LED chip during operation will be transferred to the second heat conduction layer through the heat conducting member in the second through hole 8 more rapidly, as shown by L3 in fig. 7, further improving the heat dissipation efficiency of the LED chip. In this embodiment, the heat conducting member may be, but not limited to, a heat conducting pillar filled in the second through hole 8 by filling a second heat conducting layer disposed around an inner wall of the second through hole 8 in the second through hole, and two ends of the heat conducting member may be disposed to be in contact with the second heat dissipating layer 11 and the LED chip respectively, of course, the second heat conducting layer or the heat conducting pillar may also be only in contact with the second heat dissipating layer and not in contact with the LED chip, which is not limited in this embodiment, and those skilled in the art may set the heat conducting pillar according to actual conditions and requirements. The diameter of the heat conducting column may be the same as the diameter of the second through hole 14, or may be smaller than the diameter of the second through hole 14, and a specific setting manner may be set by a person skilled in the art according to actual conditions and requirements, which is not limited in this embodiment.

In some examples of the present embodiment, the size of the opening C shown in fig. 4 to 7 may be set larger than the size of the LED chip. When the encapsulation adhesive layer is arranged on the front surface of the substrate main body 1 subsequently, the colloid of the encapsulation adhesive layer can penetrate into the gap between the LED chip and the first heat conduction layer 12, so that the bonding strength of the encapsulation adhesive layer can be further improved.

In still other examples of the present embodiment, referring to fig. 7, the distance h1 between the pad group 3 closest to the edge of the front surface of the substrate main body 1 and the edge of the front surface of the substrate main body 1 is equal to or less than half of the pitch h2 between the adjacent pad groups 3. Like this when the display module assembly that the base plate subassembly made in this embodiment of needs is spliced, the interval between the adjacent two LED chips of the base plate main part concatenation department of two base plate subassemblies keeps unanimous basically with the interval between the adjacent two LED of other regions to prevent that luminance from appearing in concatenation department and being less than the dark line in other regions, further promote display effect.

It can be seen that the substrate assembly provided by this embodiment is formed by disposing the first through hole and the second through hole on the substrate main body, wherein two ends of the first through hole are respectively in contact with the bonding pad and the circuit layer, the second through hole is respectively in communication with the LED chip and the second heat dissipation layer, and the first heat dissipation layer and the second heat dissipation layer are disposed on the back surface of the substrate main body, so that the heat around the bonding pad and the heat around the LED chip can be quickly and effectively dissipated through the first through hole and the second through hole, the heat dissipation efficiency is improved, meanwhile, the problem of poor bonding with the packaging adhesive layer due to heat accumulation is solved, the insulating layer and the first heat conduction layer are arranged on the front surface of the substrate main body, the heat dissipation efficiency and the bonding with the packaging adhesive layer are further improved, and moreover, the reflection efficiency is improved, and the display brightness and the display effect of the product are improved, so that the quality and the service life of the product and the use satisfaction of a user are further improved.

Example two

The present embodiment provides a display module, for example, as shown in fig. 8, a schematic cross-sectional structure diagram of the display module is provided. Wherein, in order to express the structure of the display screen more clearly, the packaging adhesive layer is processed in a transparent way in the figure.

In some embodiments, the display module includes the LED chip 15, and the above substrate assembly, it should be noted that the display module further includes an encapsulation adhesive layer 16, for example, as shown in fig. 8, the encapsulation adhesive layer 16 is disposed on the front surface of the substrate main body 1, and covers the LED chip 15 completely, and the positive electrode and the negative electrode of the LED chip 15 are electrically connected to the corresponding pad 4 respectively, it should be noted that the encapsulation adhesive layer may be electrically connected by, but not limited to, using solder paste, conductive adhesive, etc., as long as the two can be connected correctly, and a person skilled in the art may set the display module according to actual situations and requirements, which is not limited by the present invention.

It should be noted that the encapsulating adhesive layer 16 may include, but is not limited to, silicone, epoxy, acrylic, etc., and may be transparent. The encapsulating adhesive layer 16 may be formed on the substrate by means including, but not limited to, injection molding, dispensing, molding, etc., so that it is tightly combined with the substrate body 1 and the LED chip 15. In some examples, the encapsulation adhesive layer 16 may cover only the LED chips 15 on the front surface of the substrate main body 1 completely, and may also cover all other areas on the front surface of the substrate main body 1 while covering the LED chips 15 on the front surface of the substrate main body 1 completely, it should be noted that the encapsulation adhesive layer 16 may include but is not limited to at least one of a transparent adhesive layer, a fluorescent adhesive layer, and a quantum dot adhesive layer, and a certain proportion of diffusion particles may also be added as required to improve the light extraction effect thereof.

It should be noted that in some embodiments, the LED chip 15 may be at least one of a red chip, a green chip, a blue chip, and the like, but is not limited thereto. For example, in some examples, the LED chips 15 include blue LED chips, red LED chips, and green LED chips. For example, the blue LED chip and the green LED chip may be gallium nitride-based LED chips, and the red LED chip may be gallium arsenide-based LED chips. In some other examples, all the LED chips may also be blue LED chips, and in order to allow a part of the LED chips to emit green light and red light, a corresponding light conversion layer may be disposed on the light emitting surface of the LED chips, where the light conversion layer may include, but is not limited to, a phosphor layer, a quantum thin film layer, and the like. It should be understood that in some examples, the LED chip may emit cyan or white or yellow light in addition to the three colors red, green, and blue. Preferably, the LED chip 15 emits white light in this embodiment.

The display module assembly of this embodiment, through set up LED chip and encapsulation glue film on base plate assembly, make display module assembly prevent that the invasion of steam from leading to the risk that the LED chip became invalid, adopt the effectual heat that produces the LED chip of foretell base plate assembly to give off simultaneously, make its associativity with the encapsulation glue film promote greatly, LED chip heat dissipation is bad in having solved current encapsulation product, with the poor problem of encapsulation glue film associativity, the life-span of its use has been prolonged, the quality of product and user's use satisfaction have been improved.

EXAMPLE III

The present embodiment provides a display module, for example, as shown in fig. 9, a schematic cross-sectional structure diagram of the display module is provided. Wherein, in order to express the structure of the display screen more clearly, the packaging adhesive layer is processed in a transparent way in the figure.

As shown in fig. 9, the first heat dissipation layer 10 of the display module covers the back surface of the substrate body 1, which may include but is not limited to being disposed on the back surface of the substrate body 1 by molding, hot pressing, etc., it should be noted that the thermal conductivity of the first heat dissipation layer 10 should be smaller than that of the second heat dissipation layer 11, so that heat cannot be accumulated in the display module to cause poor heat dissipation. In this embodiment, it is more preferable, first heat dissipation layer 10 has adopted the ceramic material, second heat dissipation layer 11 has adopted the graphite alkene material, in order to increase the speed that the heat gived off, it should be said, as long as the thermal conductivity of second heat dissipation layer 11 is greater than the thermal conductivity of first heat dissipation layer 10 and first heat dissipation layer 10 be insulating material can, technical staff in the art can also set up its material according to actual conditions and demand, simultaneously in this embodiment, it is more preferable, set up insulating layer 121 into the low reflection printing ink layer, prevent that the metal level from leading to the short circuit with the pad contact, this metal level 12 sets up to bright nickel layer, in order to improve reflection efficiency, thereby improve demonstration luminance and display effect.

It should be noted that, the first heat dissipation layer 10 is completely covered on the back surface of the substrate main body 1, so that the heat dissipation effect can be improved, the circuit layer 5 can be cooled, and the substrate main body 1 can be cooled, so that the heat dissipation efficiency of the display module is greatly improved, and the problem of delamination caused by poor combination of the packaging adhesive layer 16 and the substrate main body 1 is also avoided.

The display module assembly of this embodiment, set up the first heat dissipation layer that covers its back and conductive region through the back at the base plate main part, set up the second heat dissipation layer simultaneously on first heat dissipation layer, and the coefficient of heat conductivity on second heat dissipation layer is greater than the coefficient of heat conductivity on first heat dissipation layer, make it can dispel the heat to the base plate main part, the bad condition of base plate main part and encapsulation glue film combination has been avoided simultaneously, heat dissipation through many heat dissipation routes, give off display module assembly's heat from the back, LED chip heat dissipation is bad in having solved current encapsulation product, with the poor problem of encapsulation glue film associativity, the life-span of its use has been prolonged, the quality of product and user's use satisfaction have been improved.

The substrate assembly provided in the foregoing embodiments may be applied to various light emitting and display fields, for example, the substrate assembly may be manufactured into a display module applied to a display field (which may be a display module of a terminal such as a television, a display, a mobile phone, etc.). The display backlight module can also be applied to the display backlight module. The display backlight module can be applied to the fields of display backlight, key backlight, shooting, household lighting, medical lighting, decoration, automobiles, traffic and the like. When the LED backlight source is applied to the key backlight field, the LED backlight source can be used as a key backlight light source of mobile phones, calculators, keyboards and other devices with keys; when the camera is applied to the field of shooting, a flash lamp of a camera can be manufactured; when the lamp is applied to the field of household illumination, the lamp can be made into a floor lamp, a table lamp, an illuminating lamp, a ceiling lamp, a down lamp, a projection lamp and the like; when the lamp is applied to the field of medical illumination, the lamp can be made into an operating lamp, a low-electromagnetic illuminating lamp and the like; when the decorative material is applied to the decorative field, the decorative material can be made into various decorative lamps, such as various colored lamps, landscape illuminating lamps and advertising lamps; when the material is applied to the field of automobiles, the material can be made into automobile lamps, automobile indicating lamps and the like; when the lamp is applied to the traffic field, various traffic lights and various street lamps can be manufactured. The applications are only a few applications exemplified by the present embodiment, and it should be understood that the applications of the display module in the present embodiment are not limited to the fields exemplified above.

It should be noted that the number, shape and size relationships of the elements in the drawings do not represent the actual condition of the elements, but are merely schematic diagrams for ease of understanding. While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A base plate assembly for a display module, comprising:

a substrate body which is an insulating substrate body;

2. The substrate assembly of claim 1, further comprising a first heat dissipation layer disposed on a back surface of the substrate body, wherein the first heat dissipation layer is made of an insulating material, and the first heat dissipation layer covers the positive electrode circuit layer and the negative electrode circuit layer.

3. The substrate assembly of claim 2, further comprising a second heat spreading layer disposed on the back surface of the substrate body and overlying the first heat spreading layer, the second heat spreading layer having a thermal conductivity greater than a thermal conductivity of the first heat spreading layer.

4. The substrate assembly of claim 3, wherein an area of the back surface of the substrate body between the positive wiring layer and the negative wiring layer is exposed from the first heat dissipation layer and covered by the second heat dissipation layer.

5. The substrate assembly of claim 3, wherein the second heat spreading layer comprises a graphite layer and/or a graphene layer.

6. The substrate assembly of any one of claims 3-5, further comprising a plurality of second vias extending through the substrate body, one of the second vias being located between two of the bonding pads within one of the bonding pad sets and communicating the corresponding LED die with the second heat spreading layer.

7. The substrate assembly of claim 6, further comprising a thermal conduction member disposed within the second through-hole, the thermal conduction member being in contact with the second heat sink layer.

8. The substrate assembly of any one of claims 1-5, wherein the first thermally conductive layer comprises an insulating layer and a metal layer overlying the insulating layer, the insulating layer being flush with or higher than the pads adjacent thereto, the metal layer being mirrored on a side of the substrate body facing away from the front surface.

9. The substrate assembly of any one of claims 1-5, wherein the opening has a size that is larger than a size of the LED chip.

10. The substrate assembly of any one of claims 1-5, wherein the set of pads closest to the edge of the front surface of the substrate body is spaced from the edge of the front surface of the substrate body by a distance equal to or less than one-half of a pitch between adjacent sets of pads.