CN114126760A - 微流控芯片及其加液方法、微流控系统 - Google Patents
微流控芯片及其加液方法、微流控系统 Download PDFInfo
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Abstract
一种微流控芯片,包括对盒设置的第一基板(110)和第二基板(120),第一基板(110)和第二基板(120)之间形成有容液腔A,第一基板(110)上形成有沿厚度方向贯穿第一基板(110)的进液孔B,第一基板(110)包括沿第一基板(110)的厚度方向依次设置的第一电极层(113)和疏水层(111),第一电极层(113)设置在疏水层(111)背离第二基板(120)的表面上;第二基板(120)包括沿第二基板(120)的厚度方向依次设置的调节层(121)和第二电极层(122),第二电极层(122)位于调节层(121)背离第一基板(110)的一侧。一种微流控系统和一种微流控芯片的控制方法。
Description
PCT国内申请,说明书已公开。
Claims (20)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
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PCT/CN2020/090005 WO2021226871A1 (zh) | 2020-05-13 | 2020-05-13 | 微流控芯片及其加液方法、微流控系统 |
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CN202080000724.XA Pending CN114126760A (zh) | 2020-05-13 | 2020-05-13 | 微流控芯片及其加液方法、微流控系统 |
CN202180000102.1A Pending CN113939366A (zh) | 2020-05-13 | 2021-01-29 | 微流控芯片 |
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US (2) | US20220126287A1 (zh) |
EP (1) | EP4112176A4 (zh) |
JP (1) | JP2023524187A (zh) |
CN (2) | CN114126760A (zh) |
WO (2) | WO2021226871A1 (zh) |
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2020
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- 2020-05-13 WO PCT/CN2020/090005 patent/WO2021226871A1/zh active Application Filing
- 2020-05-13 CN CN202080000724.XA patent/CN114126760A/zh active Pending
-
2021
- 2021-01-29 EP EP21773435.9A patent/EP4112176A4/en active Pending
- 2021-01-29 WO PCT/CN2021/074457 patent/WO2021227567A1/zh unknown
- 2021-01-29 US US17/600,294 patent/US20220314217A1/en active Pending
- 2021-01-29 CN CN202180000102.1A patent/CN113939366A/zh active Pending
- 2021-01-29 JP JP2022514564A patent/JP2023524187A/ja active Pending
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Publication number | Publication date |
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CN113939366A (zh) | 2022-01-14 |
US20220314217A1 (en) | 2022-10-06 |
US20220126287A1 (en) | 2022-04-28 |
JP2023524187A (ja) | 2023-06-09 |
WO2021226871A1 (zh) | 2021-11-18 |
WO2021227567A1 (zh) | 2021-11-18 |
EP4112176A1 (en) | 2023-01-04 |
EP4112176A4 (en) | 2023-10-18 |
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