CN114126246A - PCB fine circuit repairing process - Google Patents
PCB fine circuit repairing process Download PDFInfo
- Publication number
- CN114126246A CN114126246A CN202111385571.8A CN202111385571A CN114126246A CN 114126246 A CN114126246 A CN 114126246A CN 202111385571 A CN202111385571 A CN 202111385571A CN 114126246 A CN114126246 A CN 114126246A
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- China
- Prior art keywords
- pcb
- laser
- circuit
- repairing
- repairing device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000001514 detection method Methods 0.000 claims abstract description 53
- 230000003287 optical effect Effects 0.000 claims abstract description 41
- 238000007641 inkjet printing Methods 0.000 claims abstract description 29
- 239000012530 fluid Substances 0.000 claims abstract description 27
- 238000005516 engineering process Methods 0.000 claims abstract description 21
- 239000007921 spray Substances 0.000 claims description 8
- 230000007547 defect Effects 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 230000008439 repair process Effects 0.000 abstract description 15
- 238000007664 blowing Methods 0.000 abstract description 4
- 238000007639 printing Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011895 specific detection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a PCB (printed circuit board) fine circuit repairing process, and belongs to the technical field of PCB repairing. The method comprises the steps of firstly determining the type of the PCB through automatic optical detection, respectively sending the type of the PCB to a laser repairing device according to the problem type of the PCB, blowing a short circuit part, a sprayed redundant conductive fluid part and a protruding module part in the PCB by using a laser repairing technology, sending the PCB to a 3D ink-jet printing repairing device, filling the problems of open circuit and gap by using a 3D ink-jet printing technology, and separately using or combining the two technologies to finish the fine circuit repairing work of the PCB. The PCB fine circuit repairing process provided by the invention can repair various problems such as open circuit, short circuit and gap in the PCB fine circuit, has high repairing quality, does not damage the PCB, improves the yield of the PCB output, and effectively improves the production efficiency.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) repairing, in particular to a PCB fine circuit repairing process.
Background
The PCB is one of important parts in the electronic industry, is a support body of electronic components and a carrier for electrical connection, and is conducted through a circuit arranged on the PCB. In the production and manufacturing process of the PCB circuit, due to the fact that production equipment and other uncontrollable reasons are very easy to cause short circuit or open circuit and other conditions of a connecting circuit, the defective PCB board is directly scrapped to cause great economic loss, and therefore the circuit on the defective PCB board needs to be repaired to reduce the economic loss, and manual repair is time-consuming and labor-consuming. Furthermore, the fineness of the instruments used in the increasingly sophisticated PCB manufacturing process is also millimeter or even micrometer, and it is difficult for the human eye to repair the problem with high precision. Therefore, how to solve the problems of open circuit, short circuit and the like of the fine circuit in the PCB, the circuit on the PCB is repaired, and the problem to be solved is used in production.
Disclosure of Invention
In view of the above disadvantages, an object of the present invention is to provide a repair process for a fine circuit of a PCB, which can repair various problems such as open circuit, short circuit, and gap in the fine circuit of the PCB, and has high repair quality, thereby reducing the rejection rate of the PCB, improving the yield of the PCB, and effectively improving the production efficiency.
The technical scheme adopted by the invention to achieve the aim is as follows:
1. a PCB fine circuit repairing process comprises the following steps:
step S1, detecting whether the type of the PCB is good or not by using an automatic optical detection technology at an automatic optical detection device;
step S2, if the type of the PCB board is good, the PCB board is transmitted to a next processing device;
if the type of the PCB is the PCB with the short-circuit problem, the PCB is transmitted to a laser repairing device, and the coordinates with the short-circuit problem detected by the automatic optical detection technology are fed back to the laser repairing device; the laser repairing device sends laser to the coordinate position according to the fed back coordinate line with the short circuit problem to burn open circuit, and transmits the PCB subjected to laser burning back to the automatic optical detection device for detection;
if the type of the PCB is the PCB with the open-circuit problem, the PCB is transmitted to a 3D ink-jet printing repairing device, and the coordinates of the open-circuit problem detected by the automatic optical detection technology are fed back to the 3D ink-jet printing repairing device; the 3D ink-jet printing repairing device sprays and prints curable conductive fluid to the coordinate according to the fed back coordinates of the open circuit problem, fills the coordinate line with the open circuit problem, enables the PCB to be normally conducted, and transmits the conducted PCB to the laser repairing device; the laser repairing device emits laser to the periphery of the position where the open circuit problem occurs, so that redundant conductive fluid on the periphery of the circuit at the position where the open circuit problem occurs is burnt off, and the PCB after laser burning off is conveyed back to the automatic optical detection device for detection;
if the type of the PCB is the PCB with the gap problem, the PCB is transmitted to the 3D ink-jet printing repairing device, and the coordinates with the gap problem detected by the automatic optical detection technology are fed back to the 3D ink-jet printing repairing device; the 3D ink-jet printing repairing device sprays and prints curable conductive fluid to the coordinate according to the fed back coordinates of the gap problem, fills the coordinate line with the gap problem, enables the PCB to be normally conducted, and transmits the conducted PCB to the laser repairing device; the laser repairing device sends laser to the periphery of the position where the gap problem coordinate occurs, redundant conductive fluid on the periphery of the circuit at the position where the gap problem coordinate occurs is burnt off, and the PCB after laser burning off is conveyed back to the automatic optical detection device for detection;
if the type of the PCB is the PCB with the protruding module problem, the PCB is transmitted to a laser repairing device, and the coordinates with the protruding module problem detected by the automatic optical detection technology are fed back to the laser repairing device; and the laser repairing device sends laser to the coordinate according to the fed back coordinate with the protruding module to burn the protruding module, and transmits the PCB subjected to laser burning back to the automatic optical detection device for detection.
Further, the line distance of the lines in the PCB is 35-100 μm.
Further, the line pitch of the lines in the PCB board is 50 μm.
Further, the diameter of the laser emitted by the laser repairing device is 35-100 μm.
Further, the diameter of the jet of the 3D ink-jet printing repairing device is 35-100 μm.
Further, the step 1 is that the automatic optical detection device automatically scans the PCB board through the camera, collects an image, compares the tested circuit with qualified parameters in the database, inspects the defects on the PCB board through image processing, and displays the defects through the automatic mark of the display.
Further, the conductive fluid is copper paste or silver paste.
The invention has the beneficial effects that:
(1) by using 3D ink-jet printing and laser repairing, when the automatic optical detection device detects a problem existing on the PCB, if the short circuit problem occurs, the laser is used for blowing the position of the circuit with the short circuit problem, so that the PCB can be normally conducted, and the repairing is completed; if the open circuit problem occurs, spraying curable conductive fluid to the open circuit part through 3D ink-jet printing to conduct the open circuit part on the PCB, and burning off redundant conductive fluid through laser to avoid the redundant conductive fluid from causing short circuit of the PCB; if the gap problem occurs, spraying curable conductive fluid to the gap part by using 3D ink-jet printing to conduct the gap part, and then burning off redundant conductive fluid by using laser to avoid short circuit of the PCB board caused by the redundant conductive fluid; if the protruding module problem appears having, then use laser to blow the protruding module, make the PCB board normally switch on to make the disability rate in PCB board substandard product accessible automated inspection reduces production with repairing, avoided artifical repair's the degree of difficulty, under the condition that does not hinder the PCB board, improved the yields of PCB board output, effectively improved the production efficiency of PCB board.
(2) The diameter of the laser emitted by the laser repairing device is set to be 35-100 mu m, so that the laser can be better suitable for the circuit of the PCB, repairing modes such as blowing and the like are carried out on fine positions in the circuit, the quality of repairing the PCB is effectively guaranteed, the rejection rate of the PCB is reduced, the yield of the PCB is improved, and the production efficiency is effectively improved.
(3) The diameter of the 3D ink-jet printing repairing device is 35-100 mu m, so that the 3D ink can be better sprayed and printed on the circuit of the PCB, repairing modes such as spray printing and the like are carried out on fine and thin positions in the circuit, the quality of repairing the PCB is effectively guaranteed, the rejection rate of the PCB is reduced, the yield of the PCB is improved, and the production efficiency is effectively improved.
(4) Through using automatic optical detection device and automatic optical detection technique, compare qualified parameter in PCB board and the database of output, just can seek and eliminate the mistake in the early stage of assembling process, realize good process control, improved the yields of PCB board output, effectively reduce the later stage and join in marriage the dress after the discovery PCB board goes wrong and direct condemned possibility.
The foregoing is a summary of the technical solutions of the present invention, and the present invention is further described below with reference to specific embodiments.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the intended purposes, the following detailed description of the embodiments of the present invention is given with reference to the preferred embodiments.
The embodiment of the invention provides 1. a PCB fine circuit repairing process, which is characterized by comprising the following steps:
step S1, detecting whether the type of the PCB is good or not by using an automatic optical detection technology at an automatic optical detection device;
step S2, if the type of the PCB board is good, the PCB board is transmitted to a next processing device;
if the type of the PCB is the PCB with the short-circuit problem, the PCB is transmitted to a laser repairing device, and the coordinates with the short-circuit problem detected by the automatic optical detection technology are fed back to the laser repairing device; the laser repairing device sends laser to the coordinate position according to the fed back coordinate line with the short circuit problem to enable the open circuit to be blown, so that the PCB can be normally conducted, the repairing is completed, and the PCB after the laser blowing is completed is transmitted back to the automatic optical detection device to be detected;
if the type of the PCB is the PCB with the open-circuit problem, the PCB is transmitted to a 3D ink-jet printing repairing device, and the coordinates of the open-circuit problem detected by the automatic optical detection technology are fed back to the 3D ink-jet printing repairing device; the 3D ink-jet printing repairing device sprays and prints curable conductive fluid to the coordinate according to the fed back coordinates of the open circuit problem, fills the coordinate line with the open circuit problem, enables the PCB to be normally conducted, and transmits the conducted PCB to the laser repairing device; the laser repairing device emits laser to the periphery of the position where the short circuit problem occurs, redundant conductive fluid around the position where the short circuit problem occurs is blown, the PCB is prevented from being short-circuited by the redundant conductive fluid, and the PCB after being burned out by the laser is conveyed back to the automatic optical detection device for detection;
if the type of the PCB is the PCB with the gap problem, the PCB is transmitted to the 3D ink-jet printing repairing device, and the coordinates with the gap problem detected by the automatic optical detection technology are fed back to the 3D ink-jet printing repairing device; the 3D ink-jet printing repairing device sprays and prints curable conductive fluid to the coordinate according to the fed back coordinates of the gap problem, fills the coordinate line with the gap problem, enables the PCB to be normally conducted, and transmits the conducted PCB to the laser repairing device; the laser repairing device sends laser to the periphery of the position where the gap problem occurs, so that redundant conductive fluid around the position where the gap problem occurs is burnt, the PCB is prevented from being short-circuited by the redundant conductive fluid, and the PCB after the laser burning is conveyed back to the automatic optical detection device for detection;
if the type of the PCB is the PCB with the protruding module problem, the PCB is transmitted to a laser repairing device, and the coordinates with the protruding module problem detected by the automatic optical detection technology are fed back to the laser repairing device; and the laser repairing device sends laser to the coordinate according to the fed back coordinate with the protruding module to burn the protruding module, and transmits the PCB subjected to laser burning back to the automatic optical detection device for detection.
And after the repaired PCB is sent back to the automatic optical detection device for detection, the steps are repeated, so that the rejection rate of the PCB is further reduced.
The short circuit part in the PCB is burnt out through using the laser repairing technology, the surplus conductive fluid part that the jet printing came out, the module part protrudes, and use 3D ink-jet printing technology to fill the problem of opening a way and breach, two kinds of technologies separately use or combine the use, make PCB substandard product accessible automated inspection with repair the disability rate that reduces in the production, the difficulty degree of artifical repair has been avoided, under the condition that does not hinder the PCB board, the yields of PCB board output has been improved, the production efficiency of PCB board has effectively been improved.
For the specific structure of the PCB, the line distance of the circuit in the PCB is 35-100 mu m, and the line distance is set to 35-100 mu m, so that the PCB can be adapted to parts which are commonly used in the market, and the application range of the PCB is wider.
Preferably, the line pitch of the lines in the PCB board is 50 μm.
In order to better repair, the diameter of the laser emitted by the laser repairing device is 35-100 microns, and the diameter of the laser emitted by the laser repairing device is set to be 35-100 microns, so that the laser can be better suitable for a circuit of a PCB, repairing modes such as burning-out and the like are carried out on fine positions in the circuit, the quality of repairing the PCB is effectively guaranteed, the rejection rate of the PCB is reduced, the yield of the PCB is improved, and the production efficiency is effectively improved.
In order to better repair, the diameter sprayed by the 3D ink-jet printing repair device is 35-100 micrometers, so that 3D ink can be better sprayed and printed on a circuit of a PCB, and repair modes such as spray printing and the like are carried out on fine and thin positions in the circuit, so that the quality of repairing the PCB is effectively guaranteed, the rejection rate of the PCB is reduced, the yield of PCB output is improved, and the production efficiency is effectively improved.
For the specific detection mode in the step 1, the step 1 specifically includes that the automatic optical detection device automatically scans the PCB through the camera, acquires an image, compares the tested line with qualified parameters in the database, inspects the defects on the PCB through image processing, and displays the defects through the automatic marks of the display. Through using automatic optical detection device and automatic optical detection technique, compare qualified parameter in PCB board and the database of output, just can seek and eliminate the mistake in the early stage of assembling process, realize good process control, improved the yields of PCB board output, effectively reduce the later stage and join in marriage the dress after the discovery PCB board goes wrong and direct condemned possibility.
Preferably, the conductive fluid is copper paste or silver paste. By using the copper paste and the silver paste as the conductive fluid, the good conductivity can be ensured when the conductive fluid is sprayed and printed on the PCB, the price is low, the repairing cost is effectively reduced, and the repairing process has higher practicability.
It should be noted that the fine circuit repairing process for the PCB disclosed in the present invention is a new repairing method for the PCB production process, and the specific control method is not the innovation point of the present invention. The automatic optical detection device, the 3D inkjet printing repair device, the laser repair device and other components involved in the present invention may be universal standard components or components known to those skilled in the art, and the structure, principle and control method thereof are known to those skilled in the art through technical manuals or through routine experiments.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that other structures obtained by using the same or similar technical features as the above-described embodiments of the present invention are within the protection scope of the present invention.
Claims (7)
1. A PCB fine circuit repairing process is characterized by comprising the following steps:
step S1, detecting whether the type of the PCB is good or not by using an automatic optical detection technology at an automatic optical detection device;
step S2, if the type of the PCB board is good, the PCB board is transmitted to a next processing device;
if the type of the PCB is the PCB with the short-circuit problem, the PCB is transmitted to a laser repairing device, and the coordinates with the short-circuit problem detected by the automatic optical detection technology are fed back to the laser repairing device; the laser repairing device sends laser to the coordinate position according to the fed back coordinate line with the short circuit problem to burn open circuit, and transmits the PCB subjected to laser burning back to the automatic optical detection device for detection;
if the type of the PCB is the PCB with the open-circuit problem, the PCB is transmitted to a 3D ink-jet printing repairing device, and the coordinates of the open-circuit problem detected by the automatic optical detection technology are fed back to the 3D ink-jet printing repairing device; the 3D ink-jet printing repairing device sprays and prints curable conductive fluid to the coordinate according to the fed back coordinates of the open circuit problem, fills the coordinate line with the open circuit problem, enables the PCB to be normally conducted, and transmits the conducted PCB to the laser repairing device; the laser repairing device emits laser to the periphery of the position where the open circuit problem occurs, so that redundant conductive fluid on the periphery of the circuit at the position where the open circuit problem occurs is burnt off, and the PCB after laser burning off is conveyed back to the automatic optical detection device for detection;
if the type of the PCB is the PCB with the gap problem, the PCB is transmitted to the 3D ink-jet printing repairing device, and the coordinates with the gap problem detected by the automatic optical detection technology are fed back to the 3D ink-jet printing repairing device; the 3D ink-jet printing repairing device sprays and prints curable conductive fluid to the coordinate according to the fed back coordinates of the gap problem, fills the coordinate line with the gap problem, enables the PCB to be normally conducted, and transmits the conducted PCB to the laser repairing device; the laser repairing device sends laser to the periphery of the position where the gap problem coordinate occurs, redundant conductive fluid on the periphery of the circuit at the position where the gap problem coordinate occurs is burnt off, and the PCB after laser burning off is conveyed back to the automatic optical detection device for detection;
if the type of the PCB is the PCB with the protruding module problem, the PCB is transmitted to a laser repairing device, and the coordinates with the protruding module problem detected by the automatic optical detection technology are fed back to the laser repairing device; and the laser repairing device sends laser to the coordinate according to the fed back coordinate with the protruding module to burn the protruding module, and transmits the PCB subjected to laser burning back to the automatic optical detection device for detection.
2. The rotatable PCB fine circuit repairing process of claim 1, wherein: the line distance of the lines in the PCB is 35-100 mu m.
3. The rotatable PCB fine circuit repairing process of claim 2, wherein: the line distance of the circuit in the PCB is 50 mu m.
4. The rotatable PCB fine circuit repairing process of claim 2, wherein: the diameter of the laser emitted by the laser repairing device is 35-100 mu m.
5. The rotatable PCB fine circuit repairing process of claim 2, wherein: the diameter of the jet of the 3D ink-jet printing repairing device is 35-100 mu m.
6. The rotatable PCB fine circuit repairing process of claim 1, wherein: the step 1 is that the automatic optical detection device automatically scans the PCB through the camera, collects images, compares the tested circuit with qualified parameters in the database, inspects the defects on the PCB through image processing, and displays the defects through the automatic marks of the display.
7. The rotatable PCB fine circuit repairing process of claim 1, wherein: the conductive fluid is copper paste or silver paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111385571.8A CN114126246A (en) | 2021-11-22 | 2021-11-22 | PCB fine circuit repairing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111385571.8A CN114126246A (en) | 2021-11-22 | 2021-11-22 | PCB fine circuit repairing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114126246A true CN114126246A (en) | 2022-03-01 |
Family
ID=80439262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111385571.8A Pending CN114126246A (en) | 2021-11-22 | 2021-11-22 | PCB fine circuit repairing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114126246A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004311914A (en) * | 2003-02-21 | 2004-11-04 | Ntn Corp | Method for correcting fine pattern defect of flat surface substrate and correcting device |
| CN113556934A (en) * | 2021-06-24 | 2021-10-26 | 广东工业大学 | Method and device for automatically detecting and quickly repairing printed circuit board |
-
2021
- 2021-11-22 CN CN202111385571.8A patent/CN114126246A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004311914A (en) * | 2003-02-21 | 2004-11-04 | Ntn Corp | Method for correcting fine pattern defect of flat surface substrate and correcting device |
| CN113556934A (en) * | 2021-06-24 | 2021-10-26 | 广东工业大学 | Method and device for automatically detecting and quickly repairing printed circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 黄忠琴: "《电工电子实验实训教程》", 苏州大学出版社, pages: 208 * |
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| PB01 | Publication | ||
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Application publication date: 20220301 |