CN114126245A - Circuit board pattern electroplating sandwiched film remover and pattern electroplating sandwiched film removing process - Google Patents
Circuit board pattern electroplating sandwiched film remover and pattern electroplating sandwiched film removing process Download PDFInfo
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- CN114126245A CN114126245A CN202210093065.XA CN202210093065A CN114126245A CN 114126245 A CN114126245 A CN 114126245A CN 202210093065 A CN202210093065 A CN 202210093065A CN 114126245 A CN114126245 A CN 114126245A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
Abstract
The invention discloses a circuit board pattern electroplating film-clamping remover, which relates to the technical field of printed circuit board production, and comprises the following components in percentage by mass: 5 to 20 percent of organic alkali, 0.2 to 3 percent of penetrating agent, 0.2 to 5 percent of softening material, 0.05 to 10 percent of accelerator, 0.05 to 1 percent of tin surface bank protection agent and the balance of water. The laminating remover can reduce the surface tension of a dry film, quickly permeate into a laminating layer, soften and dissolve partial dry film residues, accelerate the fracture of a bond bridge between the dry films, eliminate the adhesive force of the dry film and a copper layer and achieve the aim of quickly and thoroughly removing the laminating.
Description
Technical Field
The invention relates to the technical field of printed circuit board production, in particular to a circuit board pattern electroplating sandwiched film remover and a pattern electroplating sandwiched film removing process.
Background
In recent years, as electronic devices are developed to be light, thin, short and small, the same light and thin requirements are put forward on printed circuit boards, and the characteristics of the printed circuit boards are represented by that circuits are more and more dense, line widths and line distances are less and less, the circuits are connected in high density, and the electrical reliability is stronger and stronger. At present, the requirement is particularly outstanding for express circuit board production enterprises. The pattern plating as a manufacturing process is an important process for thickening the circuit layer and the hole plating layer after external light imaging.
In the pattern electroplating process, the electroplating film is a main quality abnormity problem. The reason for the film clamping during electroplating is many, the distribution of the circuit pattern is uneven, the number of electroplating pendants is small, and the distribution of the electroplating current is uneven, so that the actual current born by a dense circuit or an isolated circuit area is large, the thickness of an electroplating copper layer exceeds the thickness of a dry film, the dry film is covered, and the dry film is clamped by a copper plating layer, which is commonly called as the film clamping. The contact surface of the clamped dry film and the stripping solution is small, the exchange of the stripping solution is difficult to cause the stripping failure of the post-process, and the copper layer in the area can not be completely etched during etching, thereby causing short circuit, gaps and the like to be scrapped. The problem can be solved, the thickness of the dry film can be increased, or the electroplating equipment and the parameter of the electroplating copper polish agent can be improved to improve the uniformity of the electroplating copper surface, but the implementation of the method can greatly increase the production cost and is not beneficial to enterprise cost control. At present, most manufacturers adopt self-prepared 3-5% NaOH solution to remove the membrane, and the method has the greatest advantages of low cost and simple operation, but the effect is not ideal. NaOH solution has the problems of incomplete film removal and corrosion of tin surfaces. The film stripping liquid used in the market at present, whether organic or inorganic, can only be used as the film stripping of a common production board in a printed circuit board enterprise, is difficult to remove an electroplating sandwiched film, and cannot help to improve the quality of the production board.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the electroplating clamp film can be quickly and effectively removed, the tin surface is not damaged, the quality and the yield of the production plate are improved, and the operation is convenient.
In order to solve the technical problem, the invention provides the following technical scheme:
the circuit board pattern electroplating film-clamping remover consists of the following components in percentage by mass: 5-20% of organic alkali, 0.2-3% of penetrating agent, 0.2-5% of softening material, 0.05-10% of accelerator, 0.05-1% of tin surface bank protecting agent and the balance of water;
the organic alkali is selected from at least one of alkyl alcohol amine, 2-aminoethanol and 2-hydroxyethylamine;
the penetrant is selected from at least one of JFC, JFC-1, JFC-2 and JFC-E;
the softening material is selected from at least one of acetone, butyl acetate, ethylene glycol and propylene glycol;
the accelerator is selected from at least one of diethylene glycol butyl ether, N-methylethanolamine and polyether modified polysiloxane;
the tin surface bank protection agent is at least one selected from methyl tetrazole, mercapto propylene glycol and benzimidazole.
Preferably, the mass percent of the organic base is 10-15%.
Preferably, the mass percent of the penetrating agent is 1-2%.
Preferably, the mass percentage of the softening material is 2-3%.
Preferably, the mass percent of the accelerator is 4-8%.
Preferably, the mass percent of the tin surface bank protection agent is 0.4-0.8%.
The preparation method of the circuit board pattern electroplating sandwiched film remover comprises the following steps: weighing organic alkali, penetrant, softening material, accelerator, tin surface bank protection agent and water according to the required proportion, mixing, stirring and mixing for 20-60min to obtain the sandwiched film remover.
Furthermore, the invention provides a pattern electroplating film clamping removal process, wherein a film stripping line for removing a pattern electroplating film clamping sequentially comprises a bulking section, a film stripping section I and a film stripping section II; the bulking section adopts an inorganic membrane removing liquid with the mass concentration of 2-3% or an organic membrane removing liquid with the mass concentration of 10-12%, the membrane removing temperature is 45-50 ℃, the membrane removing time is 15-30s, and the membrane removing speed is 3-4 m/min; the film removing section I adopts an inorganic film removing liquid with the mass concentration of 2-3% or an organic film removing liquid with the mass concentration of 10-12%, the film removing temperature is 45-50 ℃, the film removing time is 15-30s, and the film removing speed is 3-4 m/min; the film removing section II adopts a circuit board pattern electroplating film-clamping remover with the mass concentration of 10-12%, the film removing temperature is 45-50 ℃, the film removing time is 15-30s, and the film removing speed is 3-4 m/min.
Specifically, the process of stripping and etching the circuit board comprises the following steps: the method comprises the steps of feeding a plate, bulking section, film removing section I, film removing section II, water washing, etching, water washing, tin removing, water washing, drying and feeding the plate.
Preferably, the inorganic membrane-removing liquid is a sodium hydroxide or potassium hydroxide solution; the organic film stripping liquid comprises, by mass, 20-70% of monoethanolamine, 0.1-1.0% of chloride, 1.0-4.0% of sorbitol, 0.1-1% of corrosion inhibitor and the balance of deionized water.
Preferably, the bulking section is an inorganic membrane removing liquid with the mass concentration of 2-3%, and the membrane removing section I is an inorganic membrane removing liquid with the mass concentration of 2-3%.
Preferably, the bulking section adopts an organic film removing liquid with the mass concentration of 10-12%, and the film removing section I adopts an organic film removing liquid with the mass concentration of 10-12%.
Compared with the prior art, the circuit board pattern electroplating sandwiched film remover disclosed by the invention combines a penetrating agent, a softening material, a tin surface bank protecting agent and an accelerating agent in an organic alkali system, can reduce the surface tension of a dry film, quickly penetrates into a sandwiched film layer, softens and dissolves partial dry film slag, accelerates the fracture of a bond bridge between the dry films, enables the adhesive force of the dry film and a copper layer to disappear, and achieves the purpose of quickly and thoroughly removing the sandwiched film. The film-clamping remover is convenient to operate and can improve the quality yield of the production board.
By the aid of the pattern electroplating film-clamping removing process of the film-clamping remover, quality problems such as short circuit, gaps, open circuit and the like generated in the production process of the printed circuit board can be remarkably improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a partial effect diagram of the beaker test of examples 1 to 16 of the present invention after the membrane is removed.
FIG. 2 is a partial graph showing the effect of the beaker test of comparative examples 1 to 8 after the membrane is removed.
FIG. 3 is a graph showing the effect of the blank comparative example beaker after the membrane is removed.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it should be understood that the described embodiments are a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
The embodiment of the invention relates to a circuit board pattern electroplating sandwiched film remover, which comprises the following components in percentage by mass: 5-20% of organic alkali, 0.2-3% of penetrating agent, 0.2-5% of softening material, 0.05-10% of accelerator, 0.05-1% of tin surface bank protecting agent and the balance of water;
the organic alkali is selected from at least one of alkyl alcohol amine, 2-aminoethanol and 2-hydroxyethylamine;
the penetrant is selected from at least one of JFC, JFC-1, JFC-2 and JFC-E;
the softening material is selected from at least one of acetone, butyl acetate, ethylene glycol and propylene glycol;
the accelerator is selected from at least one of diethylene glycol butyl ether, N-methylethanolamine and polyether modified polysiloxane;
the tin surface bank protection agent is at least one selected from methyl tetrazole, mercapto propylene glycol and benzimidazole.
As a preferred embodiment, the organic base is 10-15% by mass.
As a preferred embodiment, the mass percent of the penetrating agent is 1-2%.
As a preferred embodiment, the mass percentage of the softening material is 2-3%.
As a preferred embodiment, the mass percent of the accelerator is 4-8%.
In a preferred embodiment, the mass percentage of the tin surface bank protection agent is 0.4-0.8%.
The invention discloses a process for removing a pattern electroplating sandwiched film, which comprises the following steps: the method comprises the steps of feeding a plate, bulking section, film removing section I, film removing section II, water washing, etching, water washing, tin removing, water washing, drying and feeding the plate.
The bulking section adopts inorganic membrane removing liquid with the mass concentration of 2-3% or organic membrane removing liquid with the mass concentration of 10-12%, the membrane removing temperature is 45-50 ℃, the membrane removing time is 15-30s, and the membrane removing speed is 3-4 m/min.
The film removing section I adopts inorganic film removing liquid with the mass concentration of 2-3% or organic film removing liquid with the mass concentration of 10-12%, the film removing temperature is 45-50 ℃, the film removing time is 15-30s, and the film removing speed is 3-4 m/min.
The inorganic membrane removing liquid of the bulking section and the membrane removing section I is preferably sodium hydroxide solution. The organic film stripping liquid of the bulking section and the film stripping section I comprises, by mass, 20-70% of monoethanolamine, 0.1-1.0% of chloride, 1.0-4.0% of sorbitol, 0.1-1% of a corrosion inhibitor, and the balance of deionized water, preferably 50% of monoethanolamine, 0.5% of chloride, 2.0% of sorbitol, 0.5% of a corrosion inhibitor, and the balance of deionized water.
The film removing section II adopts the circuit board pattern electroplating film-clamping remover with the mass concentration of 10-12%, the film removing temperature is 45-50 ℃, the film removing time is 15-30s, and the film removing speed is 3-4 m/min.
Preferably, the parameters of the two processes in the following table 1 are adopted in the pattern plating film-clamping removal process of the invention.
TABLE 1 two process parameters for the pattern plating film clamping removal process of the present invention
The following are specific examples and effect verification tests
According to the components and mass percentages shown in the table 2, the organic alkali, the penetrating agent, the softening material, the accelerator, the tin surface bank protection agent and the water are weighed, mixed and stirred for 30min to obtain the film-sandwiched remover of the examples 1 to 16.
TABLE 2 EXAMPLES 1-16 film-sandwiching removers of different component ratios
1) Beaker test
500ml of each of the bath solutions with the film-clamping removers of the embodiments 1 to 16 are correspondingly prepared in a beaker, wherein the mass fraction of the bath solutions with the film-clamping removers is 10 to 12 percent; another group of beakers are taken, and 500ml of the bath solution of comparative examples 1 to 8 shown in the table 3 are correspondingly prepared in the beakers; the bath solution in each beaker is stirred and heated to 50 ℃; and (3) putting the circuit boards with the electroplating sandwiched films in the same batch into the beakers corresponding to the bath solutions in the examples 1-16 and the comparative examples 1-8 respectively, observing the film stripping condition, and recording the starting loosening time of the dry film, the film stripping finishing time, whether the film stripping is clean and the copper surface corrosion condition. The test results are shown in Table 4.
TABLE 3 bath solution for comparative examples 1-8 with different component ratios
TABLE 4 beaker test results for examples 1-16, comparative examples 1-8
Wherein the blank comparative example is 500ml of 3% by mass sodium hydroxide.
Examples 1-16 beaker tests the effect after stripping is shown in figure 1; comparative example beaker tests 1-8 the effect after film removal is shown in figure 2; blank comparative example beaker test the effect after film removal is shown in figure 3.
2) Corrosion testing
Test panels, routed to 10cm by 10cm, using a common (tin-faced) substrate copper plate and a fine wire dry film board, were placed in a 500ml beaker. 100ml of the solution of the film-sandwiching removing agent of example 1 with the concentration of 100% was poured into a beaker containing a test board, heated to 50 ℃ and kept at a constant temperature, and after standing for 60min, the test board was taken out, and the appearance of the board surface was observed to see whether the board surface was corroded. The results are shown in Table 5.
TABLE 5 Corrosion test results
3) On-line testing
3.1 the bulking section and the film stripping section I adopt inorganic film stripping liquid
The group 1, the group 2 bulking section and the film removing section I adopt the process parameters shown in the table 6.
TABLE 6 Process parameters of group 1, group 2 bulking stage and film stripping stage I
Group 1 adopts the film-sandwiching remover of example 1, and liquid medicine 1 in a film-withdrawing groove of a film-withdrawing section II is prepared according to the proportion of table 7;
group 2 is provided with liquid medicine 2 in a film removing groove of a film removing section II according to the proportion of table 7;
TABLE 7 medicinal liquid proportioning process for group 1 and group 2 film removing sections II
The group 1 and the group 2 both process (the temperature of the film removing section II is 50 ℃, the film removing speed is 4m/min, and the film removing time is 30 s) film clamping test boards with different line widths/line distances, and after film removing and etching processes under the same process conditions, whether film scraps, gaps and short circuits remain on the board surface and the circuit is checked through mass production, and the test results are shown in a table 8.
TABLE 8 on-line test results for group 1 and group 2
3.2 the bulking section and the film stripping section I adopt organic film stripping liquid
The group 3, group 4 bulking section and film removing section I adopt the process parameters shown in Table 9.
TABLE 9 Process parameters for group 3, group 4 bulking stage, film stripping stage I
The organic film stripping liquid comprises, by mass, 50% of monoethanolamine, 0.5% of chloride salt, 2.0% of sorbitol, 0.5% of corrosion inhibitor and the balance of deionized water.
Group 3 adopts the film-sandwiching remover of the embodiment 1, and the liquid medicine 1 in the film-withdrawing groove of the film-withdrawing section II is prepared according to the proportion of table 10;
group 4 is provided with liquid medicine 2 in the film removing groove of the film removing section II according to the proportion of table 10;
TABLE 10 medicinal liquid proportioning process for group 3 and group 4 film removing sections II
The film clamping test boards of different line widths/line distances are processed in the groups 3 and 4 (the temperature of the film removing section II is 50 ℃, the film removing speed is 4m/min, and the film removing time is 30 s), and whether film scraps, gaps and short circuits are remained on the board surface and the circuit or not is checked through mass production after film removing and etching processes under the same process conditions, and the test results are shown in a table 11.
TABLE 11 on-line test results for group 3 and group 4
3.3 use of different components and proportions of film-sandwiching removers
The bulking sections, the film stripping sections I and the film stripping sections II of groups 5 to 14 all adopt the process parameters shown in Table 12.
TABLE 12 Process parameters of 5-14 bulking, film stripping and film stripping sections
The liquid medicine formulation of the membrane removing sections II of groups 5 to 14 is shown in Table 13.
Liquid medicine ratio of 5-14 film-removing sections II in Table 13
The groups 5 to 14 all process the film clamping test boards with different line widths/line distances, and check whether film scraps, gaps and short circuits are remained on the board surface and the circuit after film stripping and etching processes under the same process conditions through mass production, and the test results are shown in a table 14.
TABLE 14 set 5-14 on-line test results
3.4 use of different components and proportions of film-sandwiching removers
The group 15-24 bulking section, film stripping section I and film stripping section II all adopt the process parameters shown in Table 15.
TABLE 15 Process parameters of 15-24 bulking stage, film stripping stage I and film stripping stage II
The organic film stripping liquid comprises, by mass, 50% of monoethanolamine, 0.5% of chloride salt, 2.0% of sorbitol, 0.5% of corrosion inhibitor and the balance of deionized water.
The liquid medicine formulation of the film removing sections II in groups 15 to 24 is shown in Table 16.
TABLE 16 liquid medicine proportioning for 15-24 film-removing section II (color marking does not exceed upper limit)
Groups 15-24 all process film clamping test boards with different line widths/line distances, and after film stripping and etching processes under the same process conditions are carried out through mass production, whether film scraps, gaps and short circuits are left on the board surface and the lines is checked, and the test results are shown in table 17.
TABLE 17 results of on-line tests on groups 15-24
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The circuit board pattern electroplating film-clamping remover is characterized by comprising the following components in percentage by mass: 5-20% of organic alkali, 0.2-3% of penetrating agent, 0.2-5% of softening material, 0.05-10% of accelerator, 0.05-1% of tin surface bank protecting agent and the balance of water;
the organic alkali is selected from at least one of alkyl alcohol amine, 2-aminoethanol and 2-hydroxyethylamine;
the penetrant is selected from at least one of JFC, JFC-1, JFC-2 and JFC-E;
the softening material is selected from at least one of acetone, butyl acetate, ethylene glycol and propylene glycol;
the accelerator is selected from at least one of diethylene glycol butyl ether, N-methylethanolamine and polyether modified polysiloxane;
the tin surface bank protection agent is at least one selected from methyl tetrazole, mercapto propylene glycol and benzimidazole.
2. The circuit board pattern electroplating sandwiched film remover according to claim 1, wherein the mass percentage of the organic base is 10-15%.
3. The circuit board pattern electroplating sandwiched film remover according to claim 1, wherein the mass percentage of the penetrating agent is 1-2%.
4. The circuit board pattern electroplating sandwiched film remover according to claim 1, wherein the mass percentage of the softening material is 2-3%.
5. The circuit board pattern electroplating sandwiched film remover according to claim 1, wherein the mass percentage of the accelerator is 4-8%.
6. The circuit board pattern electroplating sandwiched film remover according to claim 1, wherein the mass percentage of the tin surface bank protecting agent is 0.4-0.8%.
7. A pattern electroplating film clamping removal process is characterized in that a film stripping line for removing a pattern electroplating film clamping sequentially comprises a bulking section, a film stripping section I and a film stripping section II; the bulking section adopts an inorganic membrane removing liquid with the mass concentration of 2-3% or an organic membrane removing liquid with the mass concentration of 10-12%, the membrane removing temperature is 45-50 ℃, the membrane removing time is 15-30s, and the membrane removing speed is 3-4 m/min; the film removing section I adopts an inorganic film removing liquid with the mass concentration of 2-3% or an organic film removing liquid with the mass concentration of 10-12%, the film removing temperature is 45-50 ℃, the film removing time is 15-30s, and the film removing speed is 3-4 m/min; the film removing section II adopts the circuit board pattern electroplating film clamping remover with the mass concentration of 10-12% as claimed in any one of claims 1-6, the film removing temperature is 45-50 ℃, the film removing time is 15-30s, and the film removing speed is 3-4 m/min.
8. The pattern plating film clamping removal process according to claim 7, wherein the inorganic film stripping solution is sodium hydroxide or potassium hydroxide solution; the organic film stripping liquid comprises, by mass, 20-70% of monoethanolamine, 0.1-1.0% of chloride, 1.0-4.0% of sorbitol, 0.1-1% of corrosion inhibitor and the balance of deionized water.
9. The pattern electroplating sandwiched film removing process according to claim 8, wherein the swelling section is an inorganic film removing liquid with a mass concentration of 2-3%, and the film removing section I is an inorganic film removing liquid with a mass concentration of 2-3%.
10. The pattern electroplating sandwiched film removing process according to claim 8, wherein the swelling section adopts an organic film stripping solution with a mass concentration of 10-12%, and the film stripping section I adopts an organic film stripping solution with a mass concentration of 10-12%.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114554707A (en) * | 2022-04-27 | 2022-05-27 | 深圳市板明科技股份有限公司 | Film removing process of high-precision fine circuit board |
| CN114900974A (en) * | 2022-03-03 | 2022-08-12 | 东莞市斯坦得电子材料有限公司 | Environment-friendly organic film removing liquid for printed circuit board film removing process |
| CN114980532A (en) * | 2022-05-17 | 2022-08-30 | 新余市木林森线路板有限公司 | Formula and technology of quick film stripping liquid for circuit board |
| CN115261879A (en) * | 2022-07-05 | 2022-11-01 | 南通群安电子材料有限公司 | Organic film removing liquid suitable for MSAP (multiple-site amplification process) |
| CN116583026A (en) * | 2023-07-13 | 2023-08-11 | 深圳市板明科技股份有限公司 | Tin stripping method for IC carrier plate and application thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114900974A (en) * | 2022-03-03 | 2022-08-12 | 东莞市斯坦得电子材料有限公司 | Environment-friendly organic film removing liquid for printed circuit board film removing process |
| CN114554707A (en) * | 2022-04-27 | 2022-05-27 | 深圳市板明科技股份有限公司 | Film removing process of high-precision fine circuit board |
| CN114554707B (en) * | 2022-04-27 | 2022-07-01 | 深圳市板明科技股份有限公司 | Film removing process of high-precision fine circuit board |
| CN114980532A (en) * | 2022-05-17 | 2022-08-30 | 新余市木林森线路板有限公司 | Formula and technology of quick film stripping liquid for circuit board |
| CN115261879A (en) * | 2022-07-05 | 2022-11-01 | 南通群安电子材料有限公司 | Organic film removing liquid suitable for MSAP (multiple-site amplification process) |
| CN116583026A (en) * | 2023-07-13 | 2023-08-11 | 深圳市板明科技股份有限公司 | Tin stripping method for IC carrier plate and application thereof |
| CN116583026B (en) * | 2023-07-13 | 2023-09-08 | 深圳市板明科技股份有限公司 | Tin stripping method for IC carrier plate and application thereof |
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| CN114126245B (en) | 2022-04-22 |
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