CN114126242B - 3D printing conformal circuit preparation method - Google Patents

3D printing conformal circuit preparation method Download PDF

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Publication number
CN114126242B
CN114126242B CN202111220329.5A CN202111220329A CN114126242B CN 114126242 B CN114126242 B CN 114126242B CN 202111220329 A CN202111220329 A CN 202111220329A CN 114126242 B CN114126242 B CN 114126242B
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parts
layer
printing
nozzle
printing ink
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CN114126242A (en
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张鹏
刘康
朱强
王传杰
陈刚
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Harbin Institute of Technology Weihai
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Harbin Institute of Technology Weihai
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041—Digital printing on surfaces other than ordinary paper
    • B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C09D11/103—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds of aldehydes, e.g. phenol-formaldehyde resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C09D11/104—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks

Abstract

The application provides a 3D printing conformal circuit preparation method, which solves the technical problem that the service life of the conventional conformal circuit is short; the method comprises the following steps: (1) coating the surface of the substrate with an insulating material to form a first insulating layer; (2) printing ink on the conductive layer and adding the ink into the inner-layer nozzle; adding the bonding layer printing ink into the outer layer nozzle; setting a 3D printing program and printing parameters, and printing to form a conducting layer and a bonding layer outside the insulating material, wherein the bonding layer wraps the outer surface of the conducting layer; the inner layer nozzle and the outer layer nozzle are formed by separating an inner arc clapboard of the printer nozzle, and the cross sectional area of the inner layer nozzle is smaller than that of the outer layer nozzle; (3) and printing ink on the insulating layer into a printer nozzle, and printing a second insulating layer outside the bonding layer to obtain the 3D printed conformal circuit. The method is widely applied to the technical field of circuit manufacturing.

Description

Preparation method of 3D printing conformal circuit
Technical Field
The present application relates to conformal circuits, and more particularly, to a method for fabricating a 3D printed conformal circuit.
Background
The circuit board is an important electronic component, a support body of the electronic component and an important carrier for electrical connection of the electronic component. Almost all electronic devices have no circuit board, and only electronic components such as integrated circuits, from electronic watches, general purpose computers, televisions, to supercomputers, communication equipment, military weapon systems, etc., are electrically interconnected with each other using circuit boards.
The common circuit board manufacturing technology in the traditional integrated circuit chip processing or various electronic devices is a copper foil etching method, which uses a copper clad laminate as a substrate, forms a corrosion-resistant circuit pattern through screen printing or photoimaging, and obtains a circuit through chemical etching; if the circuit board is a double-layer or multi-layer circuit board, hole metallization and electroplating are carried out to realize interlayer circuit interconnection. Therefore, the conventional circuit board has a complicated manufacturing process, many processes, consumes a large amount of water and electricity, and generates a large amount of wastewater and contaminants.
Due to the wide application field of the conformal circuit, the conformal circuit is also required to participate in use under a plurality of extreme environments. Therefore, an important factor for commercialization is the lifetime, and the lifetime of the conformal circuit is not only dependent on the material and the process, but also the packaging is a crucial part. The package not only protects the conformal circuit on a physical layer, but also prevents water, oxygen, corrosive liquid and the like in the external environment from corroding the conformal circuit.
3D printing is a non-contact, non-pressure and non-plate printing and copying technology, and has the characteristic of non-plate digital printing, thereby simplifying the manufacturing process. The 3D printing can also avoid the problem that the photoetching technology wastes more than 95% of materials in the use of the materials, and the area printed by adopting the printing mode is equal to the used area, so that the cost of the printing mode is much lower than that of the traditional photoetching technology in the view of long-term development. From the general development direction, the 3D printing technology will become a new vitality for the PCB industry, and has an important impact on the innovation of the PCB production technology. The 3D printed circuit board can realize rapid design and processing of a complex three-dimensional microstructure, and can perform rapid change of graphs through a software-based printing control system.
Disclosure of Invention
In order to solve the above problems, the technical scheme adopted by the application is as follows: provided is a 3D printing conformal circuit preparation method, which comprises the following steps:
(1) coating the surface of the substrate with an insulating material;
(2) adding the printing ink of the conductive layer into the inner-layer nozzle, and adding the printing ink of the bonding layer into the outer-layer nozzle; setting a 3D printing program and printing parameters, and printing to form a conducting layer and a bonding layer outside the insulating material, wherein the bonding layer wraps the outer surface of the conducting layer;
the inner layer nozzle and the outer layer nozzle are formed by separating an inner arc clapboard of the printer nozzle, and the cross section area of the inner layer nozzle is smaller than that of the outer layer nozzle;
(3) and printing ink on the insulating layer into a printer nozzle, and printing a second insulating layer outside the bonding layer to obtain the 3D printed conformal circuit.
Preferably, in the step (1), the insulating material, which forms the first insulating layer, is mainly composed of the following components in parts by weight: 3-8 parts of epoxy resin, 2-8 parts of phenolic resin, 3-8 parts of nitrile latex, 1-3 parts of polyvinylpyrrolidone and 3-8 parts of polyethylene glycol, and dissolving the components in an acetone solution.
Preferably, in the step (2), the conductive layer printing ink mainly comprises the following components in parts by weight: 5-10 parts of graphene oxide, 10-20 parts of graphene, 5-10 parts of carbon nano tube, 10-20 parts of nano silver, 10-20 parts of nano copper, 1-3 parts of polyvinylpyrrolidone and 1-3 parts of polyacrylate, and adding the mixture into an aqueous solution to dissolve the mixture to prepare the nano-silver/nano-copper/polyvinyl pyrrolidone composite material.
Preferably, in the step (2), the adhesive layer printing ink mainly comprises the following components in parts by weight: 5-10 parts of poly (butylene succinate), 5-10 parts of poly (ethylene succinate), 10-20 parts of polycaprolactone and 1-5 parts of polyethylene glycol, and adding dichloromethane to dissolve the components to prepare the aqueous solution.
Preferably, in the step (3), the insulating layer printing ink mainly comprises the following components in parts by weight: 5-10 parts of epoxy resin, 5-10 parts of phenolic resin, 5-10 parts of nitrile latex, 5-10 parts of polyvinylpyrrolidone and 5-10 parts of polyethylene glycol are dissolved in acetone solution to prepare the emulsion.
Preferably, the viscosity of the insulating material, the conductive layer printing ink, the adhesive layer printing ink and the insulating layer printing ink is more than or equal to 1000 cps.
Preferably, in the step (2), the width of the inner layer nozzle is 50-150 μm, and the width of the outer layer nozzle is 150-250 μm.
Preferably, in the step (1), the 3D printing program and the printing parameters are set as follows, firstly, CT scanning is adopted to establish a three-dimensional model of a printing substrate, then, a specific path of a printing circuit is established on the surface of the three-dimensional model, a code file is formed according to the printing path, and finally, the code file is imported into printer software.
The method has the advantages that the conformal circuit is prepared in a 3D printing mode, the problem that the surface of the conformal circuit is difficult to print in the printing process is solved, and the problems that the preparation process of the traditional processing method is complex, a large amount of water and electricity are consumed, and a large amount of wastewater and pollutants are generated are solved. The forming and manufacturing of the conformal circuit are simple, convenient, quick, safe, effective, green and environment-friendly.
In the face of the problems of safety and service life of the conformal circuit in extreme environments, the conformal circuit is completely covered by the multi-layer cladding structure. Firstly, a layer of insulating material with corrosion resistance, electric conduction resistance and strong isolation is spread on the surface of a substrate to form a first insulating layer so as to realize effective protection on the substrate material. Subsequently, circuit printing is carried out through 3D printing technology, a semi-wrapped printing body is creatively established, the inner layer is printed with a conducting layer, and the outer layer is wrapped with a bonding layer, so that the two advantages of establishment and use of a conformal circuit are achieved. Firstly, realized the printing width regulation and control to the inlayer conducting layer, under the effect of outer tie coat, the conducting layer of inlayer can't freely spread, has shortened the width of inlayer material, and corresponding increase the thickness of inlayer material, improved conformal circuit's transmission performance.
In order to further regulate and control the corrosion resistance and the service life of the conformal circuit, the secondary covering of the insulating layer is carried out after the circuit printing is finished, the uniform covering of the insulating layer on the surface of the circuit is realized by regulating and controlling the configuration and the extrusion performance of the printing ink of the insulating layer, the micropores and partial defects of the bonding layer material are filled, and the successful preparation of the high-performance conformal circuit is realized.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic cross-sectional view of a printer nozzle of the present invention;
fig. 2 is a schematic diagram of a 3D printing conformal circuit structure according to the present invention.
The symbols in the drawings illustrate that:
1. printing ink on the bonding layer; 2. printing ink on the conductive layer; 3. a substrate; 4. a first insulating layer; 5. a conductive layer; 6. a bonding layer; 7. a second insulating layer; 8. a circular arc partition plate; 9. the width of the inner layer nozzle; 10. width of the outer layer nozzle.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application.
A method for manufacturing a 3D printed conformal circuit provided in the embodiment of the present application will now be described.
The preparation method of the 3D printing conformal circuit specifically comprises the following steps:
(1) coating the surface of the substrate 3 with an insulating material to form a first insulating layer 4;
the insulating material, forming the first insulating layer 4, is mainly composed of the following components in parts by weight: 3-8 parts of epoxy resin, 2-8 parts of phenolic resin, 3-8 parts of nitrile latex, 1-3 parts of polyvinylpyrrolidone and 3-8 parts of polyethylene glycol, and dissolving the epoxy resin, the phenolic resin, the nitrile latex and the polyethylene glycol into an acetone solution;
(2) adding the conductive layer printing ink 2 into the inner layer nozzle for inner layer printing; adding the bonding layer printing ink 1 into an outer layer nozzle for outer layer printing; setting a 3D printing program and printing parameters, printing to form a conductive layer 5 and a bonding layer 6 outside the insulating material, and wrapping the outer surface of the conductive layer 5 by the bonding layer 6;
fig. 1 is a schematic cross-sectional view of a printer nozzle according to the present invention. The inner layer nozzle and the outer layer nozzle are formed by separating an inner arc clapboard 8 of the printer nozzle, and the cross sectional area of the inner layer nozzle is smaller than that of the outer layer nozzle;
the conductive layer printing ink 2 mainly comprises the following components in parts by weight: 5-10 parts of graphene oxide, 10-20 parts of graphene, 5-10 parts of carbon nano tube, 10-20 parts of nano silver, 10-20 parts of nano copper, 1-3 parts of polyvinylpyrrolidone and 1-3 parts of polyacrylate, and adding the mixture into an aqueous solution to dissolve the mixture to prepare the nano-silver/polyvinyl pyrrolidone composite material;
the bonding layer printing ink 1 mainly comprises the following components in parts by weight: 5-10 parts of poly (butylene succinate), 5-10 parts of poly (ethylene succinate), 10-20 parts of polycaprolactone and 1-5 parts of polyethylene glycol, and adding dichloromethane to dissolve the materials to prepare the aqueous solution;
printing conducting layer 5 and tie coat 6 through the 3D printer, printing the insulating layer on the printed circuit surface again after the shaping, carry out double-deck cladding with 5 materials on the conducting layer, realized that conformal circuit adhesion is strong, electric conductivity is excellent, corrosion-resistant advantage.
(3) Adding the printing ink of the insulating layer into a nozzle of a printer, and printing a second insulating layer 7 outside the bonding layer 6 to obtain a 3D printed conformal circuit;
the insulating layer printing ink mainly comprises the following components in parts by weight: 5-10 parts of epoxy resin, 5-10 parts of phenolic resin, 5-10 parts of nitrile latex, 5-10 parts of polyvinylpyrrolidone and 5-10 parts of polyethylene glycol, and dissolving the epoxy resin, the phenolic resin, the nitrile latex and the polyethylene glycol into acetone solution.
Furthermore, in the embodiment, the insulating material, the conductive layer printing ink 2, the adhesive layer printing ink 1 and the insulating layer printing ink have viscosity of more than or equal to 1000cps by regulating and controlling the components, so that the uniform outflow in the extrusion process is realized.
Furthermore, in the present embodiment, in step (2), the width 9 of the inner layer nozzle is 50-150 μm, and the width 10 of the outer layer nozzle is 150-250 μm.
Further, in this embodiment, in step (1), the 3D printing program and the printing parameters are set, specifically, a three-dimensional model of the printing substrate 3 is first created by CT scanning, then a specific path of the printing circuit is created on the surface of the three-dimensional model, a code file is formed according to the printing path, and finally the code file is imported into the printer software.
The conformal circuit is prepared in a 3D printing mode, so that the problem that the surface of the conformal circuit is difficult to print in the printing process is solved, and the problems that the preparation process of the traditional processing method is complex, a large amount of water and electricity are consumed, and a large amount of wastewater and pollutants are generated are solved. The forming and manufacturing of the conformal circuit are simple, convenient, quick, safe, effective, green and environment-friendly.
In the face of the problems of safety and service life of the conformal circuit in extreme environments, the conformal circuit is completely covered by the multi-layer cladding structure. Firstly, a layer of insulating material with corrosion resistance, electric conduction resistance and strong isolation is spread on the surface of a substrate 3 to form a first insulating layer 4 so as to realize effective protection on the substrate 3 material. Subsequently, circuit printing is performed through a 3D printing technology, a semi-cladding type printing body is creatively established, the inner layer is printed with the conducting layer 5, and the outer layer is coated with the adhesive layer 6, so that the method has two advantages for establishment and use of a conformal circuit. Firstly, realized the printing width regulation and control to inlayer conducting layer 5, under the effect of outer tie coat 6, the conducting layer 5 of inlayer can't freely spread, has shortened the width of inlayer material, and corresponding increase the thickness of inlayer material, improved conformal circuit's transmission performance.
In order to further regulate and control the corrosion resistance and the service life of the conformal circuit, the secondary covering of the insulating layer is carried out after the circuit printing is finished, the uniform covering of the insulating layer on the surface of the circuit is realized by regulating and controlling the configuration and the extrusion performance of printing ink of the insulating layer, the micropores and partial defects of the bonding layer 6 material are filled, and the successful preparation of the high-performance conformal circuit is realized.
Detailed description of the preferred embodiment 1
A preparation method of a 3D printing conformal circuit specifically comprises the following steps:
(1) coating the surface of the substrate 3 with an insulating material to form a first insulating layer 4;
the insulating material, forming the first insulating layer 4, is mainly composed of the following components in parts by weight: 3 parts of epoxy resin, 2 parts of phenolic resin, 3 parts of nitrile latex, 1 part of polyvinylpyrrolidone and 3 parts of polyethylene glycol are dissolved in an acetone solution to prepare the emulsion;
(2) adding the conductive layer printing ink 2 into the inner layer nozzle for inner layer printing; adding the bonding layer printing ink 1 into an outer layer nozzle for outer layer printing; setting a 3D printing program and printing parameters, printing to form a conductive layer 5 and a bonding layer 6 outside the insulating material, and wrapping the outer surface of the conductive layer 5 by the bonding layer 6; the inner layer nozzle and the outer layer nozzle are formed by separating an inner arc clapboard 8 of the printer nozzle, and the cross section area of the inner layer nozzle is smaller than that of the outer layer nozzle;
the conductive layer printing ink 2 mainly comprises the following components in parts by weight: 5 parts of graphene oxide, 10 parts of graphene, 5 parts of carbon nano tube, 10 parts of nano silver, 10 parts of nano copper, 1 part of polyvinylpyrrolidone and 1 part of polyacrylate, and adding the mixture into an aqueous solution to dissolve the mixture to prepare the nano silver-based ink;
the bonding layer printing ink 1 mainly comprises the following components in parts by weight: 5 parts of polybutylene succinate, 5 parts of polyethylene succinate, 10 parts of polycaprolactone and 1 part of polyethylene glycol, and adding dichloromethane for dissolving to prepare the polyurethane adhesive;
printing conducting layer 5 and tie coat 6 through the 3D printer, printing the insulating layer on the printed circuit surface again after the shaping, carry out double-deck cladding with 5 materials on the conducting layer, realized that conformal circuit adhesion is strong, electric conductivity is excellent, corrosion-resistant advantage.
(3) Adding the printing ink of the insulating layer into a nozzle of a printer, and printing a second insulating layer 7 outside the bonding layer 6 to obtain a 3D printed conformal circuit;
the insulating layer printing ink mainly comprises the following components in parts by weight: 5 parts of epoxy resin, 5 parts of phenolic resin, 5 parts of nitrile latex, 5 parts of polyvinylpyrrolidone and 5 parts of polyethylene glycol are dissolved in acetone solution to prepare the adhesive.
The viscosity of the insulating material, the conductive layer printing ink 2, the adhesive layer printing ink 1 and the insulating layer printing ink is 1000 cps.
In the step (2), the width 9 of the inner layer nozzle is 50 μm, and the width 10 of the outer layer nozzle is 150 μm.
Adhesion test:
the adhesion between the printed circuit and the substrate 3 is characterized by using a universal material tester, and the adhesion between the printed circuit and the substrate 3 is measured by measuring the peel strength between the printed circuit and the substrate. The process is as follows, fix the prepared circuit board on the glass, paste one end of 3M sticky tape on the circuit, and press the sticky tape 60s with the finger, guarantee the abundant contact and the bonding of sticky tape, test through universal tester, regulate and control test speed and be 15mm/min, begin the test in room temperature environment, real-time recording stress-strain change relation, divide the stress that obtains by the sticky tape width, can obtain peel strength, the computational formula is as follows:
p is F/W, P is peel strength (N/m), F is peel force (N), and W is test width (m).
And (3) testing results: peel strength 3.9N.
And (3) resistivity testing: the resistivity of the circuit is tested by adopting a four-probe tester, and the used four-probe tester is a RET-9 type double-electric-test four-probe tester produced by Shenzhen excelling instrument and meter Limited.
And (3) testing results: resistivity of 8.98x10-5Ω·cm。
Specific example 2
(1) Coating the surface of the substrate 3 with an insulating material;
the insulating material, forming the first insulating layer 4, is mainly composed of the following components in parts by weight: 8 parts of epoxy resin, 8 parts of phenolic resin, 8 parts of nitrile latex, 3 parts of polyvinylpyrrolidone and 8 parts of polyethylene glycol, and dissolving the epoxy resin, the phenolic resin, the nitrile latex, the polyvinylpyrrolidone and the polyethylene glycol into an acetone solution to prepare the emulsion;
(2) adding the conductive layer printing ink 2 into the inner layer nozzle for inner layer printing; adding the bonding layer printing ink 1 into an outer layer nozzle for outer layer printing; setting a 3D printing program and printing parameters, printing to form a conductive layer 5 and a bonding layer 6 outside the insulating material, and wrapping the outer surface of the conductive layer 5 by the bonding layer 6; the inner layer nozzle and the outer layer nozzle are formed by separating an inner arc clapboard 8 of the printer nozzle, and the cross sectional area of the inner layer nozzle is smaller than that of the outer layer nozzle;
the conductive layer printing ink 2 mainly comprises the following components in parts by weight: 10 parts of graphene oxide, 20 parts of graphene, 10 parts of carbon nano tubes, 20 parts of nano silver, 20 parts of nano copper, 3 parts of polyvinylpyrrolidone and 3 parts of polyacrylate, and adding the mixture into an aqueous solution to dissolve the mixture to prepare the nano silver-based ink;
the bonding layer printing ink 1 mainly comprises the following components in parts by weight: 10 parts of polybutylene succinate, 10 parts of polyethylene succinate, 20 parts of polycaprolactone and 5 parts of polyethylene glycol, and adding dichloromethane for dissolving to prepare the polyurethane adhesive;
printing conducting layer 5 and tie coat 6 through the 3D printer, carrying out the insulating layer again and printing on the printed circuit surface after the shaping, carrying out double-deck cladding with 5 materials of conducting layer, realized that conformal circuit adhesion is strong, electric conductivity is excellent, corrosion resistant advantage.
(3) Adding the printing ink of the insulating layer into a nozzle of a printer, and printing a second insulating layer 7 outside the bonding layer 6 to obtain a 3D printed conformal circuit;
the insulating layer printing ink mainly comprises the following components in parts by weight: 10 parts of epoxy resin, 10 parts of phenolic resin, 10 parts of nitrile latex, 10 parts of polyvinylpyrrolidone and 10 parts of polyethylene glycol are dissolved in acetone solution to prepare the coating.
The viscosity of the insulating material, the conductive layer printing ink 2, the adhesive layer printing ink 1 and the insulating layer printing ink was 1100 cps.
In the step (2), the width 9 of the inner layer nozzle is 100 μm, and the width 10 of the outer layer nozzle is 200 μm.
Results of adhesion test: peel strength 10.9N.
And (3) resistivity test results: resistivity of 5.21x10-5Ω·cm。
Specific example 3
(1) Coating the surface of the substrate 3 with an insulating material;
the insulating material, forming the first insulating layer 4, is mainly composed of the following components in parts by weight: 5 parts of epoxy resin, 4 parts of phenolic resin, 5 parts of nitrile latex, 2 parts of polyvinylpyrrolidone and 6 parts of polyethylene glycol are dissolved in an acetone solution to prepare the emulsion;
(2) adding the conductive layer printing ink 2 into the inner layer nozzle for inner layer printing; adding the bonding layer printing ink 1 into an outer layer nozzle for outer layer printing; setting a 3D printing program and printing parameters, printing to form a conductive layer 5 and a bonding layer 6 outside the insulating material, and wrapping the outer surface of the conductive layer 5 by the bonding layer 6; the inner layer nozzle and the outer layer nozzle are formed by separating an inner arc clapboard 8 of the printer nozzle, and the cross sectional area of the inner layer nozzle is smaller than that of the outer layer nozzle;
the conductive layer printing ink 2 is prepared by adding 7 parts of graphene oxide, 15 parts of graphene, 8 parts of carbon nano tube, 12 parts of nano silver, 12 parts of nano copper, 2 parts of polyvinylpyrrolidone and 2 parts of polyacrylate in parts by weight into an aqueous solution for dissolving;
the bonding layer printing ink 1 mainly comprises the following components in parts by weight: 8 parts of poly (butylene succinate), 7 parts of poly (ethylene succinate), 7 parts of polycaprolactone and 4 parts of polyethylene glycol, and adding the mixture into dichloromethane for dissolving;
printing conducting layer 5 and tie coat 6 through the 3D printer, carrying out the insulating layer again and printing on the printed circuit surface after the shaping, carrying out double-deck cladding with 5 materials of conducting layer, realized that conformal circuit adhesion is strong, electric conductivity is excellent, corrosion resistant advantage.
(3) Adding the printing ink of the insulating layer into a nozzle of a printer, and printing a second insulating layer 7 outside the bonding layer 6 to obtain a 3D printed conformal circuit;
the insulating layer printing ink mainly comprises the following components in parts by weight: 8 parts of epoxy resin, 7 parts of phenolic resin, 8 parts of nitrile latex, 8 parts of polyvinylpyrrolidone and 9 parts of polyethylene glycol are dissolved in acetone solution to prepare the emulsion.
The viscosity of the insulating material, the conductive layer printing ink 2, the adhesive layer printing ink 1 and the insulating layer printing ink is 1200 cps.
In the step (2), the width 9 of the inner layer nozzle is 150 μm, and the width 10 of the outer layer nozzle is 250 μm.
Results of adhesion test: peel strength 5.4N.
And (3) resistivity test results: resistivity of 7.44x10-5Ω·cm。
Specific example 4
Unlike embodiment 1, step (1) was not performed.
Results of adhesion test: peel strength 1.5N.
Resistivity measurementTest results are as follows: resistivity of 9.56x10-5Ω·cm。
Specific example 5
Unlike embodiment 1, step (3) was not performed.
Results of adhesion testing: peel strength 2.1N.
And (3) resistivity test results: resistivity of 9.48x10-5Ω·cm。
And (4) analyzing results: the 3D printing conformal circuit prepared by the method has excellent adhesion performance, can resist larger destructive power, and has low resistivity and excellent conductivity. The coating of the bottommost layer and the outermost layer of the insulating layers (the first insulating layer 4 and the second insulating layer 7) on the circuit can effectively improve the adhesion performance of the conformal circuit, improve the bonding strength of the circuit and the substrate 3 and ensure the normal use of the circuit. By regulating the content of the printing ink, the resistivity of the conformal circuit can be greatly reduced by increasing the content of the nano silver and the nano copper, the conductivity of the conformal circuit is improved, and the service life of the conformal circuit is prolonged. A 3D printed conformal circuit with excellent conductive properties is obtained.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.

Claims (8)

1. A method for preparing a 3D printing conformal circuit is characterized by comprising the following steps:
(1) coating the surface of the substrate with an insulating material to form a first insulating layer;
(2) adding the printing ink of the conductive layer into the inner-layer nozzle, and adding the printing ink of the bonding layer into the outer-layer nozzle; setting a 3D printing program and printing parameters, and printing outside the insulating material to form a conducting layer and a bonding layer, wherein the bonding layer wraps the outer surface of the conducting layer;
the inner layer nozzle and the outer layer nozzle are formed by separating an inner arc clapboard of the printer nozzle, and the cross sectional area of the inner layer nozzle is smaller than that of the outer layer nozzle;
(3) and adding printing ink of the insulating layer into a printer nozzle, and printing a second insulating layer outside the bonding layer to obtain the 3D printed conformal circuit.
2. The method of making a 3D printed conformal circuit of claim 1, wherein: in the step (1), the insulating material, which forms the first insulating layer, mainly comprises the following components in parts by weight: 3-8 parts of epoxy resin, 2-8 parts of phenolic resin, 3-8 parts of nitrile latex, 1-3 parts of polyvinylpyrrolidone and 3-8 parts of polyethylene glycol, and dissolving the components in an acetone solution.
3. The method of making a 3D printed conformal circuit of claim 2, wherein: in the step (2), the conductive layer printing ink mainly comprises the following components in parts by weight: 5-10 parts of graphene oxide, 10-20 parts of graphene, 5-10 parts of carbon nano tube, 10-20 parts of nano silver, 10-20 parts of nano copper, 1-3 parts of polyvinylpyrrolidone and 1-3 parts of polyacrylate, and adding the mixture into an aqueous solution to dissolve the mixture to prepare the nano-silver/nano-copper/polyvinyl pyrrolidone composite material.
4. The method of making a 3D printed conformal circuit of claim 3, wherein: in the step (2), the bonding layer printing ink mainly comprises the following components in parts by weight: 5-10 parts of poly (butylene succinate), 5-10 parts of poly (ethylene succinate), 10-20 parts of polycaprolactone and 1-5 parts of polyethylene glycol, and adding dichloromethane to dissolve the components to prepare the aqueous solution.
5. The method of making a 3D printed conformal circuit of claim 4, wherein: in the step (3), the insulating layer printing ink mainly comprises the following components in parts by weight: 5-10 parts of epoxy resin, 5-10 parts of phenolic resin, 5-10 parts of nitrile latex, 5-10 parts of polyvinylpyrrolidone and 5-10 parts of polyethylene glycol, and dissolving the epoxy resin, the phenolic resin, the nitrile latex and the polyethylene glycol into acetone solution.
6. The method of making a 3D printed conformal circuit of claim 5, wherein: the viscosity of the insulating material, the conductive layer printing ink, the bonding layer printing ink and the insulating layer printing ink is more than or equal to 1000 cps.
7. The method of making a 3D printed conformal circuit of claim 1, wherein: in the step (2), the width of the inner layer nozzle is 50-150 μm, and the width of the outer layer nozzle is 150-250 μm.
8. The method of making a 3D printed conformal circuit of claim 1, wherein: in the step (1), the 3D printing program and the printing parameters are set such that a three-dimensional model of a printing substrate is first established by CT scanning, then a specific path of a printing circuit is established on the surface of the three-dimensional model, a code file is formed according to the printing path, and finally the code file is imported into printer software.
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Publication number Priority date Publication date Assignee Title
CN109803810A (en) * 2016-10-04 2019-05-24 昕诺飞控股有限公司 3D printing method and product
CN110798994A (en) * 2019-10-29 2020-02-14 西安瑞特三维科技有限公司 Device and method for preparing curved conformal multilayer printed board
CN112958765A (en) * 2021-02-25 2021-06-15 哈尔滨工业大学 Laser-assisted conformal 3D printing method for complex curved surface special-shaped structure

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Publication number Priority date Publication date Assignee Title
US20020129971A1 (en) * 2001-03-19 2002-09-19 Kolb Lowell E. Filler material and pretreatment of printed circuit board components to facilitate application of a conformal EMI shield

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Publication number Priority date Publication date Assignee Title
CN109803810A (en) * 2016-10-04 2019-05-24 昕诺飞控股有限公司 3D printing method and product
CN110798994A (en) * 2019-10-29 2020-02-14 西安瑞特三维科技有限公司 Device and method for preparing curved conformal multilayer printed board
CN112958765A (en) * 2021-02-25 2021-06-15 哈尔滨工业大学 Laser-assisted conformal 3D printing method for complex curved surface special-shaped structure

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