CN114122766B - Connector with a plurality of connectors - Google Patents
Connector with a plurality of connectors Download PDFInfo
- Publication number
- CN114122766B CN114122766B CN202110954015.1A CN202110954015A CN114122766B CN 114122766 B CN114122766 B CN 114122766B CN 202110954015 A CN202110954015 A CN 202110954015A CN 114122766 B CN114122766 B CN 114122766B
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- CN
- China
- Prior art keywords
- circuit board
- positioning portion
- connector
- positioning
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 125000006850 spacer group Chemical group 0.000 claims description 32
- 238000003780 insertion Methods 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 10
- 238000002955 isolation Methods 0.000 description 39
- 239000004020 conductor Substances 0.000 description 13
- 238000005192 partition Methods 0.000 description 11
- 238000005452 bending Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention aims to improve the reliability of positioning relative to a circuit substrate. The connector (10) is provided with a housing (11). The case (11) has an opposing surface (33) that faces the circuit board (80), a1 st projection (40), and a2 nd projection (50). The 1 st projection (40) protrudes from the opposing surface. The 2 nd protrusion (50) protrudes from the opposing surface (33) at a distance from the 1 st protrusion (40). The 1 st projection (40) has a1 st positioning portion (40B) disposed in a1 st through hole (81) of the circuit board (80). The 2 nd protrusion (50) has a2 nd positioning portion (50) disposed in a2 nd through hole (82) of the circuit board (80). When the X direction and the Y direction orthogonal to the X direction are set to the plane direction parallel to the opposing plane, the 1 st positioning portion is longer in the X direction than in the Y direction, and the 2 nd positioning portion is longer in the Y direction than in the X direction.
Description
Technical Field
The present disclosure relates to connectors.
Background
Patent document 1 discloses a connector provided on a circuit board. The connector has two positioning pins (positioning protrusions) protruding downward, and is positioned with respect to the circuit board by inserting the positioning pins into the pin insertion holes of the circuit board. Further, a connector provided on a circuit board is also disclosed in patent document 2.
Prior art literature
Patent literature
Patent document 1: japanese unexamined patent publication No. 5-85099
Patent document 2: japanese patent application laid-open No. 2014-7092
Disclosure of Invention
Problems to be solved by the invention
In the two positioning pins of the connector disclosed in patent document 1, one of the two positioning pins has a circular cross section, and the other one has a shape that is longer in the front-rear direction than the width direction of the housing. Therefore, if a through hole long in the front-rear direction is formed in the circuit board and another square pin is inserted into the through hole, the positions where both side surfaces of the other square pin contact the inner side surfaces of the through hole in the width direction are stable. Therefore, positioning in the width direction can be performed with high accuracy. However, in the front-rear direction, the contact position is difficult to stabilize.
Accordingly, the present disclosure aims to improve reliability of positioning of a connector with respect to a circuit substrate.
Means for solving the problems
The connector of the present disclosure is provided to a circuit board, and the connector includes a housing having an opposing surface opposing the circuit board, a1 st protrusion protruding from the opposing surface, and a2 nd protrusion protruding from the opposing surface with a space from the 1 st protrusion, wherein the 1 st protrusion has a1 st positioning portion disposed in a1 st through hole of the circuit board, the 2 nd protrusion has a2 nd positioning portion disposed in a2 nd through hole of the circuit board, and when an X direction and a Y direction orthogonal to the X direction are set to a surface direction parallel to the opposing surface, the 1 st positioning portion has a shape longer in the X direction than the Y direction, and the 2 nd positioning portion has a shape longer in the Y direction than the X direction.
Effects of the invention
According to the present disclosure, the reliability of positioning of the connector with respect to the circuit substrate can be improved.
Drawings
Fig. 1 is an exploded perspective view of the connector of embodiment 1.
Fig. 2 is a perspective view of the housing.
Fig. 3 is a bottom view of the housing.
Fig. 4 is a right side view of the housing.
Fig. 5 is a left side view of the housing.
Fig. 6 is a bottom view of the circuit substrate.
Fig. 7 is a cross-sectional view of the connector provided on the circuit board, taken along line A-A of fig. 3.
Fig. 8 is a cross-sectional view of the connector provided on the circuit board, taken along line B-B of fig. 3.
Fig. 9 is a bottom view of a circuit substrate provided with a connector.
Fig. 10 is a bottom view conceptually showing a state in which the front view shape of the circuit substrate is curved.
Fig. 11 is a rear cross-sectional view conceptually showing a state in which the front shape of the circuit substrate is bent.
Fig. 12 is a bottom view conceptually showing a state in which the side view shape of the circuit substrate is curved.
Fig. 13 is a side cross-sectional view conceptually showing a state in which the side shape of the circuit substrate is bent.
Detailed Description
[ Description of embodiments of the present disclosure ]
First, embodiments of the present disclosure will be described.
The connector of the present disclosure is provided with a connector,
(1) The connector includes a housing having an opposing surface opposing the circuit board, a1 st projection projecting from the opposing surface, and a2 nd projection projecting from the opposing surface with a space from the 1 st projection, the 1 st projection having a1 st positioning portion disposed in a1 st through hole of the circuit board, the 2 nd projection having a2 nd positioning portion disposed in a2 nd through hole of the circuit board, wherein when an X direction and a Y direction orthogonal to the X direction are set for a surface direction parallel to the opposing surface, the 1 st positioning portion is longer in the X direction than in the Y direction, and the 2 nd positioning portion is longer in the Y direction than in the X direction.
The connector has a1 st positioning portion long in the X direction and a2 nd positioning portion long in the Y direction. Therefore, the reliability of the positioning in the Y direction can be improved by the 1 st positioning portion, and the reliability of the positioning in the X direction can be improved by the 2 nd positioning portion. Therefore, according to the connector, the reliability of positioning with respect to the circuit board can be improved.
(2) Preferably, the mounting member is provided with a mounting portion for mounting the housing on the circuit board, the mounting portion is mounted on the housing, the insertion portion protrudes to the same side as the 1 st protrusion and the 2 nd protrusion, and the insertion portion has a joint portion arranged in the joint hole of the circuit board.
Even if the circuit board is deformed by bending by heating or the like at the time of reflow soldering, the joint portion can be displaced in the joint hole according to the deformation of the circuit board. Therefore, a large stress is not applied to the joint.
(3) Preferably, the case has a spacer portion that forms a gap between the opposing surface and the circuit board in a state of being mounted on the circuit board.
According to this connector, a gap is formed between the opposing surface of the housing and the circuit board in a state where the housing is mounted on the circuit board. Therefore, even if the circuit board is deformed by bending by heating or the like at the time of reflow soldering, the circuit board is not in contact with the opposing surface of the case, and is not subjected to a reaction force from the opposing surface side. As a result, the force for deforming the circuit board can be suppressed from being transmitted from the opposing surface of the case to the 1 st projection and the 2 nd projection, and no unnecessary stress can be generated in the 1 st projection and the 2 nd projection.
[ Details of embodiments of the present disclosure ]
Specific examples of the present disclosure will be described below with reference to the drawings. The present invention is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.
< Embodiment 1>
Embodiment 1 exemplifies a connector 10 provided on a circuit board 80 (see fig. 7 and 8). In the following description, the vertical direction is defined as the direction shown in fig. 4, 5, 7, and 8. Regarding the front-rear direction, the lower side shown in fig. 3, 6, and 9 is referred to as the front side, the upper side is referred to as the rear side, the left side shown in fig. 4 and 8 is referred to as the front side, the right side is referred to as the rear side, the right side shown in fig. 5 is referred to as the front side, and the left side is referred to as the rear side. Regarding the left-right direction, the direction shown in fig. 7 is referred to as left-right direction, the right direction shown in fig. 3, 6, and 9 is referred to as left direction, and the left direction is referred to as right direction. That is, in the connector 10, the side connected to the circuit board 80 is the lower side, and the opposite side is the upper side. In the connector 10, the side connected to the counterpart connector is the front side, and the opposite side is the rear side. The direction intersecting (for example, orthogonal to) the up-down direction and the front-back direction is the right-left direction. The left-right direction corresponds to an example of the X direction, and the front-rear direction corresponds to an example of the Y direction.
As shown in fig. 1, the connector 10 includes a housing 11, a plurality of (five in the present embodiment) terminal modules 12, and a plurality of (two in the present embodiment) fitting members 13. A plurality of terminal modules 12 are mounted on the housing 11. The housing 11 is mounted on the circuit board 80 by the mounting member 13.
As shown in fig. 1 and 8, the terminal module 12 includes a plurality of (two in the present embodiment) terminal members 15, a dielectric 16, and an outer conductor 17. The terminal member 15 has an elongated L-shape. The terminal fitting 15 includes a terminal connecting portion 20, a terminal bending portion 21, and a board connecting portion 22. The terminal connection portion 20 is a portion connected to the opposite terminal fitting, and extends in the front-rear direction. The board connection portion 22 is a portion connected to the conductive portion of the circuit board 80, is connected to the rear end portion of the terminal connection portion 20 via the terminal bending portion 21, and extends downward.
The dielectric body 16 is made of synthetic resin, and has a plurality (two in the present embodiment) of 1 st fitting holes 25 as shown in fig. 1. The 1 st mounting hole 25 penetrates the dielectric 16 in the front-rear direction. The terminal fitting 15 is mounted on the dielectric body 16 by inserting the terminal connecting portion 20 into the 1 st mounting hole 25 of the dielectric body 16 from the rear.
The outer conductor 17 is formed by bending a conductive metal plate material or the like. As shown in fig. 1 and 8, the outer conductor 17 includes an outer conductor main body 27 and a plurality of (four in the present embodiment) grounding portions 28. The outer conductor body 27 is configured to surround the outer periphery of the terminal fitting 15. The outer conductor body 27 is open to the front and open to the bottom at the rear end. The ground portion 28 is a portion connected to the ground portion of the circuit board 80. The grounding portion 28 is continuous with the outer conductor main body 27 and protrudes downward. The terminal member 15 mounted on the dielectric 16 is disposed inside the outer conductor 17.
The case 11 is made of synthetic resin. As shown in fig. 1,2, 7 and 8, the housing 11 has a square tube portion 30, a rear wall portion 31 and a2 nd fitting hole 32. The square tube portion 30 has a square tube shape that is open to the front and long in the left-right direction. The rear wall 31 is disposed on the rear side of the square tube 30. The 2 nd mounting hole 32 is formed to penetrate the rear wall 31 in the front-rear direction, and communicates with the inner space of the square tube 30. The 2 nd fitting hole 32 is provided in the rear wall portion 31 in plural in the left-right direction. The terminal modules 12 are inserted into the respective 2 nd fitting holes 32 from the rear, and are fitted in a state in which the forward and backward movement is restricted.
The housing 11 has an opposing surface 33 that opposes the circuit board 80 in a state where the connector 10 is mounted on the circuit board 80. The facing surface 33 is a lower surface of the square tube portion 30. The facing surface 33 is disposed parallel to the surface of the circuit board 80. The facing surface 33 faces downward, and has a width in the lateral direction longer than a width in the front-rear direction.
As shown in fig. 2 to 5, the housing 11 has a1 st projection 40 and a2 nd projection 50. The 1 st projection 40 and the 2 nd projection 50 are plate-shaped. The 1 st projection 40 and the 2 nd projection 50 are the same shape, although facing different directions. Specifically, the 1 st projection 40 faces the plate surface in the front-rear direction, and the 2 nd projection 50 faces the plate surface in the left-right direction.
The 1 st projection 40 projects downward from the facing surface 33. The 1 st projection 40 has a 1 st base portion 40A, a 1 st positioning portion 40B, and a 1 st distal end portion 40C. The 1 st base 40A protrudes downward from the opposing surface 33, the 1 st positioning portion 40B protrudes downward from the lower end of the 1 st base 40A, and the 1 st distal end portion 40C protrudes downward from the lower end of the 1 st positioning portion 40B. Regarding the 1 st base 40A and the 1 st positioning portion 40B, the shape and the size in the up-down direction are constant, and the length in the left-right direction is longer than the length in the front-rear direction. The right and left ends of the 1 st distal end portion 40C are chamfered.
The 1 st base 40A and the 1 st positioning portion 40B have 1 st short side surfaces 42 on the left and right sides. The 1 st short side surface 42 has a curved surface shape in which a front-rear direction central portion extends outward in the left-right direction. The 1 st base 40A and the 1 st positioning portion 40B have 1 st long side surfaces 43 on both sides in the front-rear direction. The 1 st long side surface 43 is a plate surface and is planar. The width of the 1 st long side surface 43 in the lateral direction is larger than the width of the 1 st short side surface 42 in the front-rear direction.
The case 11 has a1 st short side surface side isolation portion 44 and a1 st long side surface side isolation portion 45. The 1 st short side surface side spacer 44 extends outward in the left-right direction from the 1 st short side surface 42 on the left and right sides of the 1 st base 40A. The 1 st short side surface side spacer 44 protrudes downward from the facing surface 33. The 1 st short side surface side spacer 44 is in a block shape. The lower surface of the 1 st short side spacer 44 is a portion to be carried on the surface of the circuit board 80. The inner end portion in the left-right direction of the lower surface of the 1 st short side surface side spacer 44 is continuous with the 1 st short side surface 42 via a curved surface. The front and rear side surfaces of the 1 st short side surface side spacer 44 are continuous with the 1 st long side surface 43 without steps. The left and right outer sides of the 1 st short side surface side spacer 44 are curved surfaces with the central portions in the front-rear direction extending outward in the left-right direction. The upper end portions of the left and right outer surfaces of the 1 st short-side surface side spacer 44 are continuous with the opposing surface 33 via a curved surface.
The 1 st long side surface side partition 45 is formed to protrude outward in the front-rear direction from the 1 st long side surface 43 on the front-rear sides of the 1 st base 40A. The 1 st long side surface side spacer 45 protrudes downward from the facing surface 33. The 1 st long side surface side isolation portion 45 is in a block shape. The lower surface of the 1 st long side surface side spacer 45 is a portion to be carried on the surface of the circuit board 80. The inner end portion in the front-rear direction of the lower surface of the 1 st long side surface side partition 45 is continuous with the 1 st long side surface 43 via a curved surface. The 1 st long side surface side spacer 45 is disposed on the left and right sides inward in the left and right direction of the 1 st short side surface 42 on the left and right sides, and is continuous with the 1 st long side surface 43. The front and rear outer sides of the 1 st long side surface side partition 45 are curved surfaces with the central portions in the left-right direction extending outward in the front-rear direction. The upper end portions of the front and rear outer side surfaces of the 1 st long side surface side spacer 45 are continuous with the opposing surface 33 via curved surfaces.
The 2 nd protrusion 50 protrudes downward from the facing surface 33. The 2 nd protrusion 50 has a 2 nd base portion 50A, a 2 nd positioning portion 50B, and a 2 nd tip end portion 50C. The 2 nd base 50A protrudes downward from the facing surface 33, the 2 nd positioning portion 50B protrudes downward from the lower end of the 2 nd base 50A, and the 2 nd distal end portion 50C protrudes downward from the lower end of the 2 nd positioning portion 50B. Regarding the 2 nd base 50A and the 2 nd positioning portion 50B, the shape and the size in the up-down direction are constant, and the length in the front-back direction is longer than the length in the left-right direction. The front and rear ends of the 2 nd distal end portion 50C are chamfered.
The 2 nd base 50A and the 2 nd positioning portion 50B have 2 nd short side surfaces 52 on the front and rear sides. The 2 nd short side surface 52 has a curved surface shape with a central portion extending outward in the front-rear direction. The 2 nd protrusion 50 has 2 nd long side surfaces 53 on both sides in the left-right direction. The 2 nd long side surface 53 is a plate surface and is planar. The width of the 2 nd long side surface 53 in the front-rear direction is larger than the width of the 2 nd short side surface 52 in the left-right direction.
The case 11 has a 2 nd short side surface side partition 54 and a 2 nd long side surface side partition 55. The 2 nd short side surface side partition 54 extends outward in the front-rear direction from the 2 nd short side surface 52 on the front-rear sides of the 2 nd base 50A. The 2 nd short side surface side spacer 54 protrudes downward from the facing surface 33. The 2 nd short side surface side spacer 54 is in a block shape. The lower surface of the 2 nd short side surface side spacer 54 is a portion to be carried on the surface of the circuit board 80. The inner end portion in the front-rear direction of the lower surface of the 2 nd short side surface side spacer 54 is continuous with the 2 nd short side surface 52 via a curved surface. The left and right side surfaces of the 2 nd short side surface side spacer 54 are continuous with the 2 nd long side surface 53 without steps. The front-rear outer side surface of the 2 nd short side surface side spacer 54 is curved with a central portion in the left-right direction extending outward in the front-rear direction. The upper end portions of the front and rear outer surfaces of the 2 nd short-side surface side spacer 54 are continuous with the facing surface 33 via a curved surface.
The 2 nd long side surface side partition 55 extends outward in the left-right direction from the 2 nd long side surface 53 on the left and right sides of the 2 nd base 50A. The 2 nd long side surface side spacer 55 protrudes downward from the facing surface 33. The 2 nd long side surface side spacer 55 is block-shaped. The lower surface of the 2 nd long side surface side spacer 55 is a portion to be carried on the surface of the circuit board 80. The inner side end portion in the left-right direction of the lower surface of the 2 nd long side surface side spacer 55 is continuous with the 2 nd long side surface 53 via a curved surface. The 2 nd long side surface side spacers 55 are disposed inward in the front-rear direction of the 2 nd short side surfaces 52 on the front-rear sides, and are continuous with the 2 nd long side surfaces 53. The left and right outer sides of the 2 nd long side surface side spacer 55 are curved surfaces extending outward in the left and right directions of the front-rear direction center portion. The upper end portions of the left and right outer surfaces of the 2 nd long-side surface side spacer 55 are continuous with the facing surface 33 via curved surfaces.
The housing 11 has a3 rd partition 57 and a 4 th partition 58. The 3 rd isolation portion 57 and the 4 th isolation portion 58 are portions carried on the circuit board 80. The 3 rd spacer 57 protrudes downward from the distal end portion of the facing surface 33, and is formed over the entire area of the facing surface 33 in the lateral direction. The 4 th spacer 58 protrudes downward from the facing surface 33 on the rear side of the 3 rd spacer 57, and extends in the left-right direction. The length of the 4 th isolation portion 58 in the lateral direction is shorter than the length of the 3 rd isolation portion 57 in the lateral direction. The 3 rd and 4 th spacers 57 and 58 are disposed between the facing surface 33 and the 1 st and 2 nd positioning portions 40B and 50B in the up-down direction.
The 1 st projection 40 and the 2 nd projection 50 are disposed apart from each other in the left-right direction. The 1 st projection 40 is disposed leftward from the center of the opposing surface 33 in the left-right direction, and the 2 nd projection 50 is disposed rightward from the center of the opposing surface 33 in the left-right direction. The 1 st projection 40 and the 2 nd projection 50 are disposed rearward of the 3 rd isolation portion 57 and forward of the 4 th isolation portion 58. The 1 st projection 40 and the 2 nd projection 50 are disposed laterally outward of the left and right ends of the 4 th partition 58.
As shown in fig. 2,4, 5 and 7, the housing 11 has a mounting portion 60. The mounting portions 60 are disposed on the left and right sides of the housing 11. The mounting portion 60 is provided in a pair of front and rear. The mounting portion 60 has a mounting groove 61. The mounting groove 61 is opened upward and inward in the front-rear direction in the pair of front-rear mounting portions 60. The fitting member 13 is fitted into the fitting groove 61.
As shown in fig. 2, 4 and 5, the housing 11 has a rib 62 and a connecting portion 63. The ribs 62 protrude outward in the left-right direction from the front end portions of the left and right side surfaces of the housing 11, and extend in the up-down direction. The lower ends of the ribs 62 are continuous with the left and right ends of the 3 rd partition 57. The coupling portion 63 couples the mounting portion 60 and the rib 62.
As shown in fig. 1, the fitting member 13 has a flat plate portion 70, a 1 st mounted portion 71, a 2 nd mounted portion 72, and a plurality of (three in the present embodiment) insertion portions 73. The flat plate portion 70 is long in the front-rear direction and the up-down direction with the left-right direction as the thickness direction. The 1 st mounted portion 71 protrudes forward and backward from the front and rear ends of the flat plate portion 70. The 1 st mounted portion 71 is formed slightly larger than the groove width of the corresponding portion in the mounting groove 61. The 2 nd attached portion 72 is disposed above the 1 st attached portion 71 and protrudes forward and backward from the front and rear ends of the flat plate portion 70. The 2 nd mounted portion 72 is formed slightly larger than the groove width of the corresponding portion in the mounting groove 61. The insertion portion 73 protrudes downward from the lower end of the flat plate portion 70. The insertion portion 73 has an engagement portion 74. The joint 74 is disposed in the joint hole 87 of the circuit board 80, and soldered to the circuit board 80.
As shown in fig. 6, the circuit board 80 has a1 st through hole 81 and a2 nd through hole 82. The 1 st positioning portion 40B is disposed in the 1 st through hole 81. The opening width of the 1 st through hole 81 in the left-right direction is larger than the opening width in the front-rear direction. The width of the opening of the 1 st through hole 81 in the lateral direction is formed larger than the width of the 1 st positioning portion 40B in the lateral direction so that a gap capable of displacing the 1 st positioning portion 40B is formed between the 1 st through hole and the 1 st positioning portion 40B. The opening width of the 1 st through hole 81 in the front-rear direction is formed to be the same as or slightly larger than the width of the 1 st positioning portion 40B in the front-rear direction.
The 2 nd positioning portion 50B is disposed in the 2 nd through hole 82. The opening width of the 2 nd through hole 82 in the front-rear direction is larger than the opening width in the left-right direction. The opening width of the 2 nd through hole 82 in the front-rear direction is formed larger than the width of the 2 nd positioning portion 50B in the front-rear direction so that a gap with the 2 nd positioning portion 50B is formed between the 2 nd positioning portion and the 2 nd positioning portion 50B. The opening width of the 2 nd through hole 82 in the lateral direction is formed to be the same as or slightly larger than the width of the 2 nd positioning portion 50B in the lateral direction.
The circuit board 80 has a 1 st short side inner surface 83, a 1 st long side inner surface 84, a 2 nd short side inner surface 85, and a 2 nd long side inner surface 86. The 1 st short side inner surface 83 forms the left and right sides of the inner peripheral surface of the 1 st through hole 81. The 1 st short side inner surface 83 has a curved surface shape with a front-rear direction central portion extending outward in the left-right direction. The 1 st long side inner surface 84 forms the front and rear sides of the inner peripheral surface of the 1 st through hole 81. The 1 st long side inner surface 84 is planar. The 2 nd short side inner surface 85 forms the front and rear sides of the inner peripheral surface of the 2 nd through hole 82. The 2 nd short side inner surface 85 has a curved surface shape with a central portion extending outward in the front-rear direction. The 2 nd long side inner surface 86 forms the left and right sides of the inner peripheral surface of the 2 nd through hole 82. The 2 nd long side inner surface 86 is planar.
The circuit substrate 80 has an engagement hole 87 and a hole 88. The engagement portion 74 is disposed in the engagement hole 87. The substrate connection portion 22 of the terminal fitting 15 and the grounding portion 28 of the outer conductor 17 are disposed in the hole 88.
Hereinafter, a method of assembling the connector 10 and a method of mounting the connector on the circuit board 80 will be described. First, the pair of terminal members 15 are fitted into the 1 st fitting hole 25 of the dielectric body 16. Then, the pair of terminal members 15 mounted on the dielectric body 16 are disposed inside the outer conductor 17. Thus, the terminal module 12 is manufactured. The terminal module 12 is fitted into the 2 nd fitting hole 32 of the housing 11. The 1 st mounted portion 71 and the 2 nd mounted portion 72 of the mounting member 13 are mounted on the mounting portion 60 of the housing 11. More specifically, the 1 st mounted portion 71 and the 2 nd mounted portion 72 are press-fitted into the mounting groove 61 of the mounting portion 60 from above. Thus, the connector 10 is manufactured.
Solder paste is applied to the joint holes 87 and 88 of the circuit board 80 in advance. The 1 st projection 40 is inserted into the 1 st through hole 81. The 2 nd protrusion 50 is inserted into the 2 nd penetration hole 82. The insertion portion 73 of the fitting member 13 is inserted into the engagement hole 87. As shown in fig. 7 and 8, the connector 10 is mounted on a circuit board 80. The connector 10 is carried on the circuit board 80 in the following state.
As shown in fig. 7 and 9, the 1 st positioning portion 40B is disposed at the center in the 1 st through hole 81. The 1 st short side surfaces 42 on the left and right sides of the 1 st positioning portion 40B are opposed to the 1 st short side inner surface 83, and the 1 st long side surfaces 43 on the front and rear sides are opposed to the 1 st long side inner surface 84. There is no gap or little if any gap between the 1 st positioning portion 40B and the 1 st long side inner surface 84 on the front and rear sides. Therefore, the 1 st positioning portion 40B performs positioning in the front-rear direction. A gap in which the 1 st positioning portion 40B is displaceable is formed between the 1 st positioning portion 40B and the 1 st short side inner surfaces 83 on the left and right sides. Hereinafter, the left gap among the gaps is referred to as a1 st space 91, and the right gap is referred to as a2 nd space 92. The width of the 1 st space 91 and the 2 nd space 92 in the left-right direction is larger than the width of the gap between the 1 st positioning portion 40B and the 1 st long side inner surface 84 on the front-rear side in the front-rear direction.
As shown in fig. 7 to 9, the 2 nd positioning portion 50B is disposed at the center in the 2 nd through hole 82. The 2 nd short side surfaces 52 on the front and rear sides of the 2 nd positioning portion 50B are respectively opposed to the 2 nd short side inner surfaces 85, and the 2 nd long side surfaces 53 on the left and right sides are respectively opposed to the 2 nd long side inner surfaces 86. There is no gap or little if any gap between the 2 nd positioning portion 50B and the 2 nd long side inner surfaces 86 on the left and right sides. Therefore, the positioning in the left-right direction is performed by the 2 nd positioning portion 50B. A gap in which the 2 nd positioning portion 50B can be displaced is formed between the 2 nd positioning portion 50B and the 2 nd short side inner surfaces 85 on the front and rear sides. Hereinafter, the gap on the front side of the gap is referred to as a3 rd space 93, and the gap on the rear side is referred to as a4 th space 94. The width of the 3 rd space 93 and the 4 th space 94 in the front-rear direction is larger than the width of the gap between the 2 nd positioning portion 50B and the 2 nd long side inner surfaces 86 on the left and right sides in the left-right direction.
The 1 st short side surface side isolation portion 44, the 1 st long side surface side isolation portion 45, the 2 nd short side surface side isolation portion 54, the 2 nd long side surface side isolation portion 55, the 3 rd isolation portion 57, and the 4 th isolation portion 58 of the connector 10 are carried on the circuit board 80. Thereby, a gap is formed between the facing surface 33 and the circuit board 80.
The connector 10 carried on the circuit substrate 80 is subjected to a reflow process. Thus, the connector 10 is soldered to the circuit board 80, and the board-with-connector 100 including the connector 10 and the circuit board 80 is manufactured (see fig. 7 and 8).
In the stage before the reflow process, the circuit board 80 is not fixed in the vertical direction with respect to the connector 10. Therefore, when the reflow process is performed on the circuit board 80, there is a possibility that the circuit board may warp in the up-down direction due to heating as shown in fig. 10 to 13. When the circuit board 80 is warped, the 1 st positioning portion 40B and the 2 nd positioning portion 50B may be deformed by an external force from the circuit board 80 that is bent and deformed. However, a1 st space 91 and a 2 nd space 92 are formed between the 1 st positioning portion 40B and the 1 st short side inner surfaces 83 on the left and right sides.
Even if the left and right central portions of the circuit board 80 are deformed so as to be bent upward as shown in fig. 10 and 11, the 1 st positioning portion 40B moves in the 1 st space 91 or the 2 nd space 92, so that it is possible to avoid receiving an external force in the left and right direction from the circuit board 80. In addition, even if an external force in the left-right direction from the circuit board 80 is applied to the 2 nd positioning portion 50B, the 2 nd long side surface 53 of the 2 nd positioning portion 50B and the 2 nd long side inner surface 86 are in contact in the front-rear long region, and thus the stress is dispersed.
As shown in fig. 12 and 13, even if the front-rear central portion of the circuit board 80 is deformed so as to be bent upward, the 2 nd positioning portion 50B moves in the 3 rd space 93 or the 4 th space 94, and thus, it is possible to avoid receiving an external force in the front-rear direction from the circuit board 80. Even if an external force is applied to the 1 st positioning portion 40B in the front-rear direction from the circuit board 80, the 1 st long side surface 43 of the 1 st positioning portion 40B and the 1 st long side inner surface 84 are in contact in the left-right long region, so that the stress is dispersed.
Further, gaps are formed between the opposing surface 33 and the circuit board 80 by the 1 st short-side surface-side isolation portion 44, the 1 st long-side surface-side isolation portion 45, the 2 nd short-side surface-side isolation portion 54, the 2 nd long-side surface-side isolation portion 55, the 3 rd isolation portion 57, and the 4 th isolation portion 58. Therefore, even if the circuit board 80 is deformed by bending due to overheating or the like at the time of reflow soldering, the circuit board can be prevented from being brought into contact with the opposing surface 33 of the case 11 and receiving a reaction force from the opposing surface 33. As a result, the force for deforming the circuit board 80 can be suppressed from being transmitted from the facing surface 33 of the housing 11 to the 1 st positioning portion 40B and the 2 nd positioning portion 50B, and no unnecessary stress can be generated in the 1 st positioning portion 40B and the 2 nd positioning portion 50B.
After the reflow process, the solder is cured, the joint 74 is fixed in the joint hole 87, and the substrate connection portion 22 and the ground portion 28 are fixed in the holes 88.
As described above, the connector 10 of embodiment 1 has the 1 st positioning portion 40B long in the left-right direction and the 2 nd positioning portion 50B long in the front-rear direction. Therefore, the reliability of positioning in the front-rear direction can be improved by the 1 st positioning portion 40B, and the reliability of positioning in the left-right direction can be improved by the 2 nd positioning portion 50B. Therefore, according to the connector 10, the reliability of positioning with respect to the circuit board 80 can be improved.
Even if the circuit board 80 is deformed by bending by heating or the like at the time of reflow soldering, the joint 74 can be displaced in the joint hole 87 according to the deformation of the circuit board 80. Therefore, a large stress is not applied to the joint 74.
The 1 st short side isolation portion 44, the 1 st long side isolation portion 45, the 2 nd short side isolation portion 54, the 2 nd long side isolation portion 55, the 3 rd isolation portion 57, and the 4 th isolation portion 58 of the connector 10 are carried on the circuit board. Therefore, a gap is formed between the opposing surface 33 of the case 11 and the circuit board 80. Even if the circuit board 80 is deformed by bending by heating or the like during reflow, the circuit board 80 is not in contact with the opposing surface 33 of the case 11, and is not subjected to a reaction force from the opposing surface 33 side. As a result, the force for deforming the circuit board 80 can be suppressed from being transmitted from the facing surface 33 of the housing 11 to the 1 st positioning portion 40B and the 2 nd positioning portion 50B, and no unnecessary stress can be generated in the 1 st positioning portion 40B and the 2 nd positioning portion 50B.
[ Other embodiments of the present disclosure ]
The presently disclosed embodiments are considered in all respects to be illustrative and not restrictive.
(1) In embodiment 1, the 1 st positioning portion extends in parallel in the left-right direction, and the 2 nd positioning portion extends in parallel in the front-rear direction. However, the 1 st positioning portion may be longer in the lateral direction as a whole than in the front-rear direction, and may be inclined with respect to the lateral direction. The 2 nd positioning portion may be longer in the front-rear direction than in the left-right direction as a whole, and may be inclined with respect to the front-rear direction.
(2) In embodiment 1, the left-right direction is the X direction, and the front-rear direction is the Y direction. However, the X direction may be any direction along a plane parallel to the facing plane, or may not be the left-right direction. The Y direction may be a direction along a plane parallel to the facing plane and orthogonal to the X direction, and may be other than the front-rear direction.
(3) In embodiment 1, a plurality of terminal modules can be mounted to the housing, but only one terminal module may be mounted.
(4) In embodiment 1, the terminal module is mounted on the housing, but the terminal component may be mounted directly on the housing without the dielectric and the outer conductor.
Symbol description
10: Connector with a plurality of connectors
11: Shell body
12: Terminal module
13: Fitting component
15: Terminal part
16: Dielectric body
17: Outer conductor
20: Terminal connecting part
21: Terminal bending part
22: Substrate connection part
25: 1 St fitting hole
27: Outer conductor body
28: Grounding part
30: Square tube part
31: Rear wall portion
32: No. 2 assembly hole
33: Opposed surface
40: 1 St protrusion
40A: 1 st base
40B: 1 st positioning part
40C: 1 st tip end
42: 1 St short side face
43: 1 St long side
44: 1 St short side isolation part (isolation part)
45: 1 St long side isolation part (isolation part)
50: Protrusion 2
50A: base 2
50B: 2 nd positioning part
50C: tip end portion 2
52: 2 Nd short side
53: 2 Nd long side
54: 2 Nd short side isolation part (isolation part)
55: 2 Nd long side isolation part (isolation part)
57: 3 Rd isolation part (isolation part)
58: 4 Th isolation part (isolation part)
60: Mounting part
61: Mounting groove
62: Ribs
63: Connecting part
70: Flat plate part
71: 1 St mounted part (mounted part)
72: 2 Nd mounted part (mounted part)
73: Insertion part
74: Joint part
80: Circuit substrate
81: 1 St through hole
82: 2 Nd through hole
83: Inner surface of 1 st short side
84: 1 St long side inner surface
85: Inner surface of the 2 nd short side
86: 2 Nd long side inner surface
87: Joint hole
88: Hole(s)
91: 1 St space
92: Space 2
93: 3 Rd space
94: Space 4
100: Connector with substrate
Claims (3)
1. A connector is arranged on a circuit substrate,
The connector is provided with a housing and is provided with a plurality of connectors,
The housing has an opposing surface opposing the circuit board, a1 st projection projecting from the opposing surface, and a 2 nd projection projecting from the opposing surface with a space from the 1 st projection,
The 1 st protruding part is provided with a1 st positioning part arranged in the 1 st through hole of the circuit substrate,
The 2 nd protrusion has a2 nd positioning portion disposed in the 2 nd through hole of the circuit board,
In the case where an X direction and a Y direction orthogonal to the X direction are set for a plane direction parallel to the opposing plane,
The 1 st positioning portion is longer in the X direction than in the Y direction,
The 2 nd positioning portion is longer in the Y direction than in the X direction.
2. The connector according to claim 1, wherein the connector is provided with a fitting member that fits the housing to the circuit substrate,
The mounting member has a mounted portion mounted to the housing and an insertion portion protruding to the same side as the 1 st projection and the 2 nd projection,
The insertion portion has a joint portion disposed in the joint hole of the circuit board.
3. The connector according to claim 1 or claim 2, wherein the housing has a spacer that forms a gap between the opposing surface and the circuit board in a state of being carried on the circuit board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020145370A JP2022040584A (en) | 2020-08-31 | 2020-08-31 | connector |
| JP2020-145370 | 2020-08-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114122766A CN114122766A (en) | 2022-03-01 |
| CN114122766B true CN114122766B (en) | 2024-06-11 |
Family
ID=80440926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110954015.1A Active CN114122766B (en) | 2020-08-31 | 2021-08-19 | Connector with a plurality of connectors |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2022040584A (en) |
| CN (1) | CN114122766B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022040584A (en) * | 2020-08-31 | 2022-03-11 | 住友電装株式会社 | connector |
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| Publication number | Publication date |
|---|---|
| JP2022040584A (en) | 2022-03-11 |
| CN114122766A (en) | 2022-03-01 |
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