CN114122766A - Connector with a locking member - Google Patents
Connector with a locking member Download PDFInfo
- Publication number
- CN114122766A CN114122766A CN202110954015.1A CN202110954015A CN114122766A CN 114122766 A CN114122766 A CN 114122766A CN 202110954015 A CN202110954015 A CN 202110954015A CN 114122766 A CN114122766 A CN 114122766A
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- CN
- China
- Prior art keywords
- circuit board
- positioning
- connector
- long
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims abstract description 18
- 125000006850 spacer group Chemical group 0.000 claims description 25
- 238000003780 insertion Methods 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 10
- 238000005192 partition Methods 0.000 description 25
- 239000004020 conductor Substances 0.000 description 13
- 238000002955 isolation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
Abstract
The invention aims to improve the reliability of positioning relative to a circuit substrate. The connector (10) is provided with a housing (11). The case (11) has an opposing surface (33) that opposes the circuit board (80), a 1 st projection (40), and a 2 nd projection (50). The 1 st projection (40) projects from the opposite surface. The second protrusion (50) protrudes from the opposite surface (33) at a distance from the first protrusion (40). The 1 st projection (40) has a 1 st positioning portion (40B) disposed in a 1 st through hole (81) of the circuit board (80). The 2 nd projection (50) has a 2 nd positioning part (50) disposed in a 2 nd through hole (82) of the circuit board (80). When the X direction and the Y direction orthogonal to the X direction are set in the plane direction parallel to the facing surface, the 1 st positioning portion is longer than the Y direction in the X direction, and the 2 nd positioning portion is longer than the X direction in the Y direction.
Description
Technical Field
The present disclosure relates to connectors.
Background
Patent document 1 discloses a connector provided on a circuit board. The connector has two positioning pins (positioning projections) projecting downward, and is positioned with respect to the circuit board by inserting the positioning pins into pin insertion holes of the circuit board. Further, a connector provided on a circuit board is also disclosed in patent document 2.
Documents of the prior art
Patent document
Patent document 1: japanese Kokai publication Hei-5-85099
Patent document 2: japanese patent laid-open No. 2014-7092
Disclosure of Invention
Problems to be solved by the invention
In the connector disclosed in patent document 1, one of the two positioning pins has a circular cross section, and the other positioning pin has a shape longer than the housing in the width direction in the front-rear direction. Therefore, if a through-hole that is long in the front-rear direction is formed in the circuit board and the other pin is inserted into the through-hole, the position where the both side surfaces of the other pin contact the inner side surfaces of the through-hole is stable in the width direction. Therefore, the positioning in the width direction can be performed with high accuracy. However, the position of contact is difficult to stabilize in the front-rear direction.
Accordingly, the present disclosure aims to improve the reliability of the positioning of the connector with respect to the circuit substrate.
Means for solving the problems
A connector according to the present disclosure is provided on a circuit board, and includes a housing having an opposing surface opposing the circuit board, a 1 st projection projecting from the opposing surface, and a 2 nd projection projecting from the opposing surface with a space therebetween, the 1 st projection having a 1 st positioning portion disposed in a 1 st through hole of the circuit board, the 2 nd projection having a 2 nd positioning portion disposed in a 2 nd through hole of the circuit board, wherein when an X direction and a Y direction orthogonal to the X direction are set in a plane direction parallel to the opposing surface, the 1 st positioning portion is longer in the X direction than the Y direction, and the 2 nd positioning portion is longer in the Y direction than the X direction.
Effects of the invention
According to the present disclosure, the reliability of the positioning of the connector with respect to the circuit substrate can be improved.
Drawings
Fig. 1 is an exploded perspective view of a connector according to embodiment 1.
Fig. 2 is a perspective view of the housing.
Fig. 3 is a bottom view of the housing.
Fig. 4 is a right side view of the housing.
Fig. 5 is a left side view of the housing.
Fig. 6 is a bottom view of the circuit board.
Fig. 7 is a cross-sectional view of the connector provided on the circuit board taken along line a-a of fig. 3.
Fig. 8 is a cross-sectional view of the connector provided on the circuit board taken along line B-B of fig. 3.
Fig. 9 is a bottom view of the circuit board provided with the connector.
Fig. 10 is a bottom view conceptually showing a state in which a front view shape of the circuit board is bent.
Fig. 11 is a rear cross-sectional view conceptually showing a state in which a front shape of the circuit board is bent.
Fig. 12 is a bottom view conceptually showing a state in which a side view shape of the circuit substrate is bent.
Fig. 13 is a side cross-sectional view conceptually showing a state in which a side shape of the circuit substrate is curved.
Detailed Description
[ description of embodiments of the present disclosure ]
First, embodiments of the present disclosure will be described.
The connector of the present disclosure is provided with a connector,
(1) the connector is provided with a housing having an opposing surface opposing the circuit board, a 1 st projection projecting from the opposing surface, and a 2 nd projection projecting from the opposing surface with a space therebetween, wherein the 1 st projection has a 1 st positioning portion disposed in a 1 st through hole of the circuit board, the 2 nd projection has a 2 nd positioning portion disposed in a 2 nd through hole of the circuit board, and when an X direction and a Y direction orthogonal to the X direction are set in a plane direction parallel to the opposing surface, the 1 st positioning portion is longer in the X direction than the Y direction, and the 2 nd positioning portion is longer in the Y direction than the X direction.
The connector has a 1 st positioning part long in the X direction and a 2 nd positioning part long in the Y direction. Therefore, the reliability of positioning in the Y direction can be improved by the 1 st positioning unit, and the reliability of positioning in the X direction can be improved by the 2 nd positioning unit. Therefore, according to the connector, the reliability of positioning with respect to the circuit board can be improved.
(2) Preferably, the mounting member includes a mounted portion mounted to the case, and an insertion portion having a joining portion disposed in a joining hole of the circuit board, the insertion portion protruding toward the same side as the 1 st protruding portion and the 2 nd protruding portion.
Even if the circuit substrate is bent and deformed by heating or the like at the time of reflow soldering, the joint portion can be displaced within the joint hole in accordance with the deformation of the circuit substrate. Therefore, a large stress is not applied to the joint.
(3) Preferably, the housing has a spacer portion for forming a gap between the facing surface and the circuit board in a state of being mounted on the circuit board.
According to this connector, in a state where the housing is mounted on the circuit board, a gap is formed between the facing surface of the housing and the circuit board. Therefore, even if the circuit board is bent and deformed by heating during reflow, the circuit board does not come into contact with the opposing surface of the case and does not receive a reaction force from the opposing surface side. As a result, the force for deforming the circuit board can be prevented from being transmitted from the facing surface of the case to the 1 st and 2 nd projections, and unnecessary stress can be prevented from being generated in the 1 st and 2 nd projections.
[ details of embodiments of the present disclosure ]
Specific examples of the present disclosure will be described below with reference to the drawings. The present invention is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.
< embodiment 1>
Embodiment 1 exemplifies a connector 10 provided on a circuit board 80 (see fig. 7 and 8). In the following description, the vertical direction is the same as the directions shown in fig. 4, 5, 7, and 8. In the front-rear direction, the lower side shown in fig. 3, 6, and 9 is the front, the upper side is the rear, the left side shown in fig. 4 and 8 is the front, the right side is the rear, the right side shown in fig. 5 is the front, and the left side is the rear. The left-right direction is the left-right direction as it is in fig. 7, and the right direction is the left direction and the left direction is the right direction in fig. 3, 6, and 9. That is, in the connector 10, the side connected to the circuit board 80 is the lower side, and the opposite side is the upper side. In the connector 10, the side connected to the mating connector is the front side, and the opposite side is the rear side. The direction intersecting (e.g., orthogonal to) the vertical direction and the front-rear direction is the left-right direction. The left-right direction corresponds to an example of the X direction, and the front-back direction corresponds to an example of the Y direction.
As shown in fig. 1, the connector 10 includes a housing 11, a plurality of (five in the present embodiment) terminal modules 12, and a plurality of (two in the present embodiment) fitting members 13. A plurality of terminal modules 12 are mounted on the housing 11. The housing 11 is mounted on the circuit board 80 via the mounting member 13.
As shown in fig. 1 and 8, the terminal block 12 includes a plurality of (two in the present embodiment) terminal fittings 15, a dielectric body 16, and an outer conductor 17. The terminal fitting 15 has an elongated L-shape. The terminal component 15 includes a terminal connection portion 20, a terminal bending portion 21, and a substrate connection portion 22. The terminal connecting portion 20 is a portion to be connected to the counterpart terminal fitting, and extends in the front-rear direction. The substrate connection portion 22 is a portion connected to the conductive portion of the circuit substrate 80, is connected to the rear end portion of the terminal connection portion 20 via the terminal bending portion 21, and extends downward.
The dielectric member 16 is made of synthetic resin and has a plurality of (two in the present embodiment) 1 st mounting holes 25 as shown in fig. 1. The 1 st mounting hole 25 penetrates the dielectric body 16 in the front-rear direction. The terminal fitting 15 is mounted to the dielectric body 16 by inserting the terminal connecting portion 20 from the rear into the 1 st mounting hole 25 of the dielectric body 16.
The outer conductor 17 is formed by bending a conductive metal plate. As shown in fig. 1 and 8, the outer conductor 17 includes an outer conductor main body 27 and a plurality of (four in the present embodiment) ground portions 28. The outer conductor main body 27 is configured to surround the outer periphery of the terminal fitting 15. The outer conductor main body 27 is open forward and is open downward at the rear end. The ground portion 28 is a portion connected to a ground portion of the circuit board 80. The ground portion 28 is continuous with the outer conductor main body 27 and projects downward. The terminal fitting 15 mounted on the dielectric body 16 is disposed inside the outer conductor 17.
The housing 11 is made of synthetic resin. As shown in fig. 1, 2, 7, and 8, the housing 11 includes a square tube 30, a rear wall 31, and a 2 nd mounting hole 32. The square tube portion 30 is a square tube shape that opens forward and is long in the left-right direction. The rear wall portion 31 is disposed on the rear side of the square tube portion 30. The 2 nd fitting hole 32 penetrates the rear wall portion 31 in the front-rear direction, and communicates with the internal space of the square tubular portion 30. The 2 nd fitting hole 32 is provided in the rear wall portion 31 in plural in a left-right direction. The terminal modules 12 are inserted into the 2 nd fitting holes 32 from the rear, and are fitted in a state of being restricted from moving forward and backward.
The housing 11 has an opposing surface 33 that opposes the circuit board 80 in a state where the connector 10 is provided on the circuit board 80. The opposing surface 33 is the lower surface of the square tubular portion 30. The facing surface 33 is arranged parallel to the plate surface of the circuit board 80. The facing surface 33 faces downward, and the width in the left-right direction is longer than the width in the front-rear direction.
As shown in fig. 2 to 5, the housing 11 has a 1 st projection 40 and a 2 nd projection 50. The 1 st projection 40 and the 2 nd projection 50 are plate-shaped. The 1 st projection 40 and the 2 nd projection 50 have the same shape, although they are oriented in different directions. Specifically, the 1 st projection 40 faces the plate surface in the front and rear direction, and the 2 nd projection 50 faces the plate surface in the left and right direction.
The 1 st projection 40 projects downward from the facing surface 33. The 1 st projection 40 has a 1 st base portion 40A, a 1 st positioning portion 40B, and a 1 st tip portion 40C. The 1 st base portion 40A protrudes downward from the facing surface 33, the 1 st positioning portion 40B protrudes downward from the lower end of the 1 st base portion 40A, and the 1 st tip portion 40C protrudes downward from the lower end of the 1 st positioning portion 40B. The 1 st base portion 40A and the 1 st positioning portion 40B have a constant shape and size in the vertical direction, and have a length in the lateral direction longer than the length in the front-rear direction. The left and right ends of the 1 st tip portion 40C are chamfered.
The 1 st base portion 40A and the 1 st positioning portion 40B have 1 st short side surfaces 42 on both left and right sides. The 1 st minor face 42 is a curved face having a central portion in the front-rear direction extending outward in the left-right direction. The 1 st base portion 40A and the 1 st positioning portion 40B have 1 st long side surfaces 43 on both sides in the front-rear direction. The 1 st long side surface 43 is a plate surface and is planar. The 1 st long side surface 43 has a width in the left-right direction larger than the width of the 1 st short side surface 42 in the front-rear direction.
The case 11 has a 1 st short-side surface-side spacer 44 and a 1 st long-side surface-side spacer 45. The 1 st short-side surface-side partition 44 extends outward in the right-left direction from the 1 st short-side surfaces 42 on both right and left sides of the 1 st base 40A. The 1 st short-side surface-side partition 44 projects downward from the facing surface 33. The 1 st short-side surface-side separator 44 is block-shaped. The lower surface of the 1 st short-side surface-side spacer 44 is placed on the surface of the circuit board 80. The left-right direction inner end of the lower surface of the 1 st short-side surface-side partition 44 is continuous with the 1 st short-side surface 42 via a curved surface. The front and rear side surfaces of the 1 st short side surface-side partition 44 are continuous with the 1 st long side surface 43 without any step. The left and right outer sides of the 1 st short-side surface-side partition 44 are curved surfaces whose front and rear center portions extend outward in the left and right directions. The upper end portions of the left and right outer side surfaces of the 1 st short-side surface-side partition 44 are continuous with the facing surface 33 via a curved surface.
The 1 st long side surface side partition 45 extends outward in the front-rear direction from the 1 st long side surface 43 on both the front and rear sides of the 1 st base 40A. The 1 st long-side surface-side partition 45 projects downward from the facing surface 33. The 1 st long-side surface spacer 45 has a block shape. The lower surface of the 1 st long-side surface-side spacer 45 is placed on the surface of the circuit board 80. The front-rear direction inner end portion of the lower surface of the 1 st long-side surface-side partition 45 is continuous with the 1 st long-side surface 43 via a curved surface. The left and right side surfaces of the 1 st long-side surface-side separator 45 are disposed more inward in the left-right direction than the 1 st short-side surfaces 42 on the left and right sides, and are continuous with the 1 st long-side surface 43. The front and rear outer surfaces of the 1 st long-side surface spacer 45 are curved surfaces whose left and right center portions extend outward in the front and rear direction. The upper end of the front and rear outer side surfaces of the 1 st long-side surface-side partition 45 is continuous with the facing surface 33 via a curved surface.
The 2 nd protrusion 50 protrudes downward from the facing surface 33. The 2 nd projection 50 has a 2 nd base 50A, a 2 nd positioning portion 50B, and a 2 nd tip portion 50C. The 2 nd base portion 50A protrudes downward from the opposing surface 33, the 2 nd positioning portion 50B protrudes downward from the lower end of the 2 nd base portion 50A, and the 2 nd tip portion 50C protrudes downward from the lower end of the 2 nd positioning portion 50B. The 2 nd base part 50A and the 2 nd positioning part 50B have a constant shape and size in the vertical direction, and the length in the front-rear direction is longer than the length in the left-right direction. The front and rear ends of the 2 nd tip portion 50C are chamfered.
The 2 nd base portion 50A and the 2 nd positioning portion 50B have 2 nd short side surfaces 52 on both front and rear sides. The 2 nd short side surface 52 is a curved surface having a left-right direction central portion extending outward in the front-rear direction. The 2 nd protrusion 50 has the 2 nd long side surface 53 on both sides in the left-right direction. The 2 nd long side 53 is a plate surface and is planar. The width of the 2 nd long side surface 53 in the front-rear direction is larger than the width of the 2 nd short side surface 52 in the left-right direction.
The housing 11 has a 2 nd short-side surface-side partition 54 and a 2 nd long-side surface-side partition 55. The 2 nd short side surface side partition portion 54 extends outward in the front-rear direction from the 2 nd short side surfaces 52 on both the front and rear sides of the 2 nd base portion 50A. The 2 nd short-side surface-side partition portion 54 projects downward from the facing surface 33. The 2 nd short-side surface-side separator 54 has a block shape. The lower surface of the 2 nd short-side surface-side spacer 54 is placed on the surface of the circuit board 80. The lower surface of the 2 nd short-side-surface-side separator 54 has an inner end in the front-rear direction continuous with the 2 nd short-side surface 52 via a curved surface. The 2 nd shorter side surface side barrier 54 has both right and left side surfaces continuous with the 2 nd longer side surface 53 without a step. The front and rear outer surfaces of the 2 nd short-side surface spacer 54 are curved surfaces with the left and right center portions extending outward in the front and rear direction. The upper end of the front and rear outer surfaces of the 2 nd short-side surface-side partition 54 is continuous with the facing surface 33 via a curved surface.
The 2 nd long side surface side partition 55 extends outward in the right-left direction from the 2 nd long side surface 53 on both right and left sides of the 2 nd base 50A. The 2 nd long-side surface-side partition 55 projects downward from the facing surface 33. The 2 nd long-side surface-side separator 55 has a block shape. The lower surface of the 2 nd long-side surface-side spacer 55 is placed on the surface of the circuit board 80. The left-right direction inner end portion of the lower surface of the 2 nd long-side surface-side partition portion 55 is continuous with the 2 nd long side surface 53 via a curved surface. The front and rear side surfaces of the 2 nd long-side surface-side separator 55 are disposed more inward in the front-rear direction than the 2 nd short-side surfaces 52 on the front and rear sides, and are continuous with the 2 nd long-side surface 53. The right and left outer surfaces of the 2 nd long-side surface spacer 55 are curved surfaces extending outward in the right and left direction at the center in the front-rear direction. The upper end portions of the right and left outer side surfaces of the 2 nd long-side surface-side separator 55 are continuous with the facing surface 33 via a curved surface.
The housing 11 has a 3 rd partition 57 and a 4 th partition 58. The 3 rd isolation part 57 and the 4 th isolation part 58 are mounted on the circuit board 80. The 3 rd spacer 57 protrudes downward from the front end of the facing surface 33 and is formed over the entire region of the facing surface 33 in the left-right direction. The 4 th partition 58 protrudes downward from the facing surface 33 on the rear side of the 3 rd partition 57 and extends in the left-right direction. The length of the 4 th barrier 58 in the left-right direction is shorter than the length of the 3 rd barrier 57 in the left-right direction. The 3 rd and 4 th separators 57, 58 are disposed between the facing surface 33 and the 1 st and 2 nd positioners 40B, 50B in the vertical direction.
The 1 st projection 40 and the 2 nd projection 50 are disposed apart from each other in the left-right direction. The 1 st projection 40 is disposed leftward from the center of the opposed surface 33 in the left-right direction, and the 2 nd projection 50 is disposed rightward from the center of the opposed surface 33 in the left-right direction. The 1 st projection 40 and the 2 nd projection 50 are disposed rearward of the 3 rd partition 57 and forward of the 4 th partition 58. The 1 st projection 40 and the 2 nd projection 50 are disposed further outward in the left-right direction than both left and right ends of the 4 th partition 58.
As shown in fig. 2, 4, 5, and 7, the housing 11 has a mounting portion 60. The mounting portions 60 are disposed on both left and right sides of the housing 11. The mounting portions 60 are provided in a pair of front and rear. The mounting portion 60 has a mounting groove 61. The mounting grooves 61 open upward and inward in the front-rear direction in the front-rear pair of mounting portions 60. The fitting member 13 is mounted in the mounting groove 61.
As shown in fig. 2, 4, and 5, the housing 11 includes a rib 62 and a coupling portion 63. The ribs 62 protrude outward in the right-left direction from the front end portions of both right and left side surfaces of the housing 11 and extend in the vertical direction. The lower end of the rib 62 is continuous with both left and right ends of the 3 rd barrier portion 57. The coupling portion 63 couples the mounting portion 60 and the rib 62.
As shown in fig. 1, the attachment member 13 has a flat plate portion 70, a 1 st attached portion 71, a 2 nd attached portion 72, and a plurality of (three in the present embodiment) insertion portions 73. The flat plate portion 70 is long in the front-rear direction and the up-down direction with the left-right direction as the thickness direction. The 1 st attached portion 71 projects forward and backward from both front and rear ends of the flat plate portion 70. The 1 st mounted portion 71 is formed slightly larger than the groove width of the corresponding portion in the mounting groove 61. The 2 nd to-be-mounted portion 72 is disposed above the 1 st to-be-mounted portion 71 and projects forward and backward from both front and rear ends of the flat plate portion 70. The 2 nd mounted part 72 is formed slightly larger than the groove width of the corresponding part in the mounting groove 61. The insertion portion 73 protrudes downward from the lower end of the flat plate portion 70. The insertion portion 73 has an engagement portion 74. The joint portion 74 is disposed in the joint hole 87 of the circuit board 80 and soldered to the circuit board 80.
As shown in fig. 6, the circuit board 80 has a 1 st through hole 81 and a 2 nd through hole 82. The 1 st positioning portion 40B is disposed in the 1 st through hole 81. The opening width of the 1 st through hole 81 in the left-right direction is larger than the opening width in the front-rear direction. The opening width of the 1 st penetration hole 81 in the left-right direction is formed larger than the width of the 1 st positioning part 40B in the left-right direction so as to form a gap in which the 1 st positioning part 40B is displaceable with the 1 st positioning part 40B. The opening width of the 1 st through hole 81 in the front-rear direction is formed to be the same as or slightly larger than the width of the 1 st positioning portion 40B in the front-rear direction.
The 2 nd positioning portion 50B is disposed in the 2 nd through hole 82. The opening width of the 2 nd through hole 82 in the front-rear direction is larger than the opening width in the left-right direction. The opening width of the 2 nd through hole 82 in the front-rear direction is formed larger than the width of the 2 nd positioning portion 50B in the front-rear direction so as to form a gap in which the 2 nd positioning portion 50B is displaceable with the 2 nd positioning portion 50B. The opening width of the 2 nd through hole 82 in the left-right direction is formed to be the same as or slightly larger than the width of the 2 nd positioning portion 50B in the left-right direction.
The circuit board 80 has a 1 st-side inner surface 83, a 1 st-side inner surface 84, a 2 nd-side inner surface 85, and a 2 nd-side inner surface 86. The 1 st short-side inner surfaces 83 form the left and right sides of the inner peripheral surface of the 1 st through-hole 81. The 1 st short-side inner surface 83 is a curved surface having a central portion in the front-rear direction extending outward in the left-right direction. The 1 st long-side inner surfaces 84 form the front and rear sides of the inner peripheral surface of the 1 st through-hole 81. The 1 st long side inner surface 84 is planar. The 2 nd short side inner surfaces 85 constitute both front and rear sides of the inner peripheral surface of the 2 nd through hole 82. The 2 nd short side inner surface 85 is a curved surface having a left-right direction central portion extending outward in the front-rear direction. The 2 nd long-side inner surfaces 86 constitute both right and left sides of the inner peripheral surface of the 2 nd through hole 82. The 2 nd long side inner surface 86 is planar.
The circuit substrate 80 has a coupling hole 87 and a hole 88. The engaging portion 74 is disposed in the engaging hole 87. The substrate connection portion 22 of the terminal fitting 15 and the ground portion 28 of the outer conductor 17 are disposed in the hole 88.
Hereinafter, a method of assembling the connector 10 and a method of installing the connector on the circuit board 80 will be described. First, the pair of terminal fittings 15 are fitted to the 1 st fitting hole 25 of the dielectric body 16. Then, the pair of terminal fittings 15 mounted on the dielectric body 16 are arranged inside the outer conductor 17. The terminal module 12 is thus manufactured. The terminal module 12 is fitted to the 2 nd fitting hole 32 of the housing 11. The 1 st attached part 71 and the 2 nd attached part 72 of the mounting member 13 are attached to the attachment part 60 of the housing 11. More specifically, the 1 st attached part 71 and the 2 nd attached part 72 are press-fitted into the mounting groove 61 of the mounting part 60 from above. The connector 10 is thus manufactured.
Solder paste is applied to the coupling holes 87 and the holes 88 of the circuit board 80 in advance. The 1 st protrusion 40 is inserted into the 1 st through hole 81. The 2 nd protrusion 50 is inserted into the 2 nd through hole 82. The insertion portion 73 of the fitting member 13 is inserted into the engagement hole 87. As shown in fig. 7 and 8, the connector 10 is mounted on the circuit board 80. In a state where the connector 10 is mounted on the circuit board 80, the following state is achieved.
As shown in fig. 7 and 9, the 1 st positioning portion 40B is disposed at the center in the 1 st through hole 81. The 1 st short side surfaces 42 on both left and right sides of the 1 st positioning portion 40B face the 1 st short side inner surface 83, respectively, and the 1 st long side surfaces 43 on both front and rear sides face the 1 st long side inner surface 84, respectively. There is no gap, or even a slight gap, between the 1 st positioning portion 40B and the 1 st long-side inner surfaces 84 on both the front and rear sides. Therefore, the 1 st positioning portion 40B performs positioning in the front-rear direction. A gap in which the 1 st positioning portion 40B is displaceable is formed between the 1 st positioning portion 40B and the 1 st short-side inner surfaces 83 on both the left and right sides. Hereinafter, the left gap among the gaps is referred to as a 1 st space 91, and the right gap is referred to as a 2 nd space 92. The width of the 1 st space 91 and the 2 nd space 92 in the left-right direction is larger than the width of the gap between the 1 st positioning portion 40B and the 1 st long-side inner surface 84 on both the front and rear sides in the front-rear direction.
As shown in fig. 7 to 9, the 2 nd positioning portion 50B is disposed at the center in the 2 nd through hole 82. The 2 nd short side surfaces 52 on both the front and rear sides of the 2 nd positioning portion 50B face the 2 nd short side inner surface 85, respectively, and the 2 nd long side surfaces 53 on both the left and right sides face the 2 nd long side inner surface 86, respectively. There is no gap, or even a slight gap, between the 2 nd positioning portion 50B and the 2 nd long-side inner surfaces 86 on both the right and left sides. Therefore, the 2 nd positioning portion 50B performs positioning in the left-right direction. A gap in which the 2 nd positioning portion 50B is displaceable is formed between the 2 nd positioning portion 50B and the 2 nd shorter side inner surfaces 85 on both the front and rear sides. Hereinafter, the front gap among the gaps is referred to as a 3 rd space 93, and the rear gap is referred to as a 4 th space 94. The 3 rd and 4 th spaces 93 and 94 have a width in the front-rear direction larger than the width in the left-right direction of the gap between the 2 nd positioning portion 50B and the 2 nd long-side inner surfaces 86 on both the left and right sides.
The 1 st short-side surface-side spacer 44, the 1 st long-side surface-side spacer 45, the 2 nd short-side surface-side spacer 54, the 2 nd long-side surface-side spacer 55, the 3 rd spacer 57, and the 4 th spacer 58 of the connector 10 are mounted on the circuit board 80. Thereby, a gap is formed between the facing surface 33 and the circuit board 80.
The connector 10 mounted on the circuit board 80 is subjected to a reflow process. Thus, the connector 10 is soldered to the circuit board 80, and the board-to-board connector 100 including the connector 10 and the circuit board 80 is manufactured (see fig. 7 and 8).
At the stage before the reflow process, the circuit board 80 is not fixed to the connector 10 in the vertical direction. Therefore, when the circuit board 80 is subjected to the reflow process, the circuit board may be warped in the vertical direction by heating as shown in fig. 10 to 13. When the circuit board 80 is warped, the 1 st positioning portion 40B and the 2 nd positioning portion 50B may be deformed by an external force applied to the circuit board 80 that is deformed by bending. However, the 1 st space 91 and the 2 nd space 92 are formed between the 1 st positioning portion 40B and the 1 st short-side inner surface 83 on both the left and right sides.
Even if the left and right central portions of the circuit board 80 are deformed so as to bend upward as shown in fig. 10 and 11, the 1 st positioning portion 40B is displaced in the 1 st space 91 or the 2 nd space 92, and thus, the circuit board 80 can be prevented from receiving an external force in the left-right direction. Further, even if an external force is applied to the 2 nd positioning portion 50B in the left-right direction from the circuit board 80, the 2 nd long-side surface 53 and the 2 nd long-side inner surface 86 of the 2 nd positioning portion 50B come into contact in the front-rear long region, and thus the stress is dispersed.
As shown in fig. 12 and 13, even if the front and rear central portions of the circuit board 80 are deformed so as to bend upward, the 2 nd positioning portion 50B is displaced in the 3 rd space 93 or the 4 th space 94, and thus, the circuit board 80 can be prevented from receiving external force in the front and rear direction. Further, even if an external force is applied to the 1 st positioning portion 40B from the front-rear direction of the circuit board 80, the 1 st long-side surface 43 of the 1 st positioning portion 40B and the 1 st long-side inner surface 84 come into contact in a laterally long region, and therefore stress is dispersed.
Further, a gap is formed between the facing surface 33 and the circuit board 80 by the 1 st short-side surface-side separating portion 44, the 1 st long-side surface-side separating portion 45, the 2 nd short-side surface-side separating portion 54, the 2 nd long-side surface-side separating portion 55, the 3 rd separating portion 57, and the 4 th separating portion 58. Therefore, even if the circuit board 80 is bent and deformed by overheating or the like at the time of reflow soldering, it is possible to suppress the circuit board from contacting the opposing surface 33 of the housing 11 and receiving a reaction force from the opposing surface 33. As a result, the force that deforms the circuit board 80 can be prevented from being transmitted from the facing surface 33 of the housing 11 to the 1 st positioning portion 40B and the 2 nd positioning portion 50B, and unnecessary stress can be prevented from being generated in the 1 st positioning portion 40B and the 2 nd positioning portion 50B.
After the reflow process, the solder is solidified, the joint portion 74 is fixed in the joint hole 87, and the board connection portion 22 and the ground connection portion 28 are fixed in the holes 88.
As described above, the connector 10 of embodiment 1 has the 1 st positioning portion 40B long in the left-right direction and the 2 nd positioning portion 50B long in the front-rear direction. Therefore, the reliability of positioning in the front-rear direction can be improved by the 1 st positioning portion 40B, and the reliability of positioning in the left-right direction can be improved by the 2 nd positioning portion 50B. Therefore, according to the connector 10, the reliability of positioning with respect to the circuit board 80 can be improved.
Further, even if the circuit board 80 is bent and deformed by heating or the like at the time of reflow soldering, the joint portion 74 can be displaced within the joint hole 87 in accordance with the deformation of the circuit board 80. Therefore, a large stress is not applied to the joint 74.
The 1 st short-side surface-side spacer 44, the 1 st long-side surface-side spacer 45, the 2 nd short-side surface-side spacer 54, the 2 nd long-side surface-side spacer 55, the 3 rd spacer 57, and the 4 th spacer 58 of the connector 10 are mounted on a circuit board. Therefore, a gap is formed between the facing surface 33 of the housing 11 and the circuit board 80. Even if the circuit board 80 is bent by heating during reflow, the circuit board 80 is not in contact with the facing surface 33 of the housing 11 and does not receive a reaction force from the facing surface 33 side. As a result, the force that deforms the circuit board 80 can be prevented from being transmitted from the facing surface 33 of the housing 11 to the 1 st positioning portion 40B and the 2 nd positioning portion 50B, and unnecessary stress can be prevented from being generated in the 1 st positioning portion 40B and the 2 nd positioning portion 50B.
[ other embodiments of the present disclosure ]
The embodiments disclosed herein are illustrative in all respects, and should not be construed as being limiting.
(1) In embodiment 1 described above, the 1 st positioning portion extends in parallel in the left-right direction, and the 2 nd positioning portion extends in parallel in the front-rear direction. However, the 1 st positioning portion may be longer in the left-right direction than in the front-rear direction as a whole, and may be inclined with respect to the left-right direction. The 2 nd positioning portion may be longer in the front-rear direction than in the left-right direction as a whole, or may be inclined with respect to the front-rear direction.
(2) In embodiment 1, the left-right direction is defined as the X direction, and the front-rear direction is defined as the Y direction. However, the X direction may be any direction along a plane parallel to the facing surface, or may not be the left-right direction. The Y direction may be a direction along a plane parallel to the facing surface and orthogonal to the X direction, and may not be the front-back direction.
(3) In embodiment 1, a plurality of terminal modules can be mounted on the housing, but a configuration in which only one terminal module is mounted may be employed.
(4) In embodiment 1, the terminal module is mounted on the housing, but the terminal fitting may be directly mounted on the housing without the dielectric body and the outer conductor.
Description of the symbols
10: connector with a locking member
11: shell body
12: terminal module
13: assembly component
15: terminal fitting
16: dielectric body
17: outer conductor
20: terminal connection part
21: terminal bending part
22: substrate connecting part
25: 1 st Assembly hole
27: outer conductor body
28: ground part
30: square tube part
31: rear wall part
32: no. 2 fitting hole
33: opposed surfaces
40: projection part 1
40A: 1 st base part
40B: 1 st positioning part
40C: 1 st tip end part
42: 1 st short side surface
43: 1 st long side surface
44: no. 1 short side surface side separator (separator)
45: no. 1 Long side surface side separator (separator)
50: projection 2
50A: 2 nd base part
50B: 2 nd positioning part
50C: 2 nd tip part
52: 2 nd short side surface
53: 2 nd long side surface
54: no. 2 short side surface side separator (separator)
55: no. 2 Long side surface side separator (separator)
57: isolation part 3 (isolation part)
58: isolation part 4 (isolation part)
60: mounting part
61: mounting groove
62: ribs
63: connecting part
70: flat plate part
71: 1 st mounted part (mounted part)
72: no. 2 mounted part (mounted part)
73: insertion part
74: joint part
80: circuit board
81: 1 st through hole
82: 2 nd through hole
83: inner surface of No. 1 short side
84: 1 st long side inner surface
85: inner surface of No. 2 short side
86: inner surface of No. 2 long side
87: joint hole
88: hole(s)
91: 1 st space
92: 2 nd space
93: space No. 3
94: 4 th space
100: connector with substrate
Claims (3)
1. A connector is provided on a circuit board,
the connector is provided with a shell body,
the housing has an opposing surface opposing the circuit board, a 1 st projection projecting from the opposing surface, and a 2 nd projection projecting from the opposing surface with a space therebetween from the 1 st projection,
the 1 st projection has a 1 st positioning portion disposed in a 1 st through hole of the circuit board,
the 2 nd protrusion has a 2 nd positioning portion disposed in a 2 nd through hole of the circuit substrate,
when an X direction and a Y direction orthogonal to the X direction are set in a plane direction parallel to the facing surface,
the 1 st positioning part is longer in the X direction than in the Y direction,
the 2 nd positioning portion is longer in the Y direction than in the X direction.
2. The connector according to claim 1, wherein the connector is provided with a fitting member that fits the housing to the circuit substrate,
the fitting member has a mounted portion mounted to the housing and an insertion portion protruding to the same side as the 1 st protruding portion and the 2 nd protruding portion,
the insertion portion has a bonding portion disposed in a bonding hole of the circuit board.
3. The connector according to claim 1 or 2, wherein the housing has a spacer portion that forms a gap between the opposing surface and the circuit substrate in a state of being carried on the circuit substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-145370 | 2020-08-31 | ||
| JP2020145370A JP2022040584A (en) | 2020-08-31 | 2020-08-31 | connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114122766A true CN114122766A (en) | 2022-03-01 |
Family
ID=80440926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110954015.1A Pending CN114122766A (en) | 2020-08-31 | 2021-08-19 | Connector with a locking member |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2022040584A (en) |
| CN (1) | CN114122766A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022040584A (en) * | 2020-08-31 | 2022-03-11 | 住友電装株式会社 | connector |
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| WO2018221176A1 (en) * | 2017-06-02 | 2018-12-06 | 住友電装株式会社 | Substrate connector device |
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| JP2019102255A (en) * | 2017-12-01 | 2019-06-24 | 住友電装株式会社 | Connector for substrate |
| JP2020053140A (en) * | 2018-09-25 | 2020-04-02 | ヒロセ電機株式会社 | Electric connector for circuit board and method of manufacturing electric connector for circuit board |
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-
2020
- 2020-08-31 JP JP2020145370A patent/JP2022040584A/en active Pending
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2021
- 2021-08-19 CN CN202110954015.1A patent/CN114122766A/en active Pending
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| JP2000348799A (en) * | 1999-06-04 | 2000-12-15 | Yazaki Corp | Mounting structure of board-mounted connector |
| JP2004039370A (en) * | 2002-07-02 | 2004-02-05 | Moldec Kk | Assembly for attaching integrated circuit |
| JP2004227907A (en) * | 2003-01-22 | 2004-08-12 | Moldec Kk | Connector for integrated circuit and assembly of connector and circuit board |
| JP2004319229A (en) * | 2003-04-15 | 2004-11-11 | Jst Mfg Co Ltd | Reinforcing tab, and structure for connecting connector and electrical component equipped with reinforcing tab to substrate |
| JP2006100230A (en) * | 2004-09-29 | 2006-04-13 | Sumitomo Wiring Syst Ltd | Terminal fitting and connector for circuit board |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2022040584A (en) | 2022-03-11 |
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