CN114112580A - Method for preparing EBSD sample - Google Patents
Method for preparing EBSD sample Download PDFInfo
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- CN114112580A CN114112580A CN202111396024.XA CN202111396024A CN114112580A CN 114112580 A CN114112580 A CN 114112580A CN 202111396024 A CN202111396024 A CN 202111396024A CN 114112580 A CN114112580 A CN 114112580A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/2806—Means for preparing replicas of specimens, e.g. for microscopal analysis
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
- G01N23/203—Measuring back scattering
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/05—Investigating materials by wave or particle radiation by diffraction, scatter or reflection
- G01N2223/053—Investigating materials by wave or particle radiation by diffraction, scatter or reflection back scatter
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/05—Investigating materials by wave or particle radiation by diffraction, scatter or reflection
- G01N2223/056—Investigating materials by wave or particle radiation by diffraction, scatter or reflection diffraction
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- General Physics & Mathematics (AREA)
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- Crystallography & Structural Chemistry (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
The invention relates to the technical field of electron backscatter diffraction characterization), and discloses a method for preparing an EBSD sample. The method comprises the following steps: s1 providing a clip: the clamp body is a cylinder, a clamping hole is formed in the end face of the clamp inwards, the clamping hole is communicated with two screw holes formed in the side face of the clamp inwards symmetrically, and the screw holes are used for allowing fastening screws to penetrate through; s2, placing the sample in a clamping hole of a clamp, then tightening a fastening screw to fix the sample in the clamping hole, and controlling the surface to be polished of the sample to be parallel to the end face of the clamp; s3 transferring the clamp to an automatic grinding and polishing machine for mechanical grinding and polishing, transferring the clamp to a vibration polishing machine for vibration polishing, taking out the clamp, loosening the screw, taking out the sample, cleaning and drying. The method uses the fixture body to fix the sample instead of inlaying and polishing the sample, realizes that the sample can be easily taken down after automatic grinding and polishing, avoids polluting the surface of the sample when removing the inlaying material, and avoids damaging the probe due to too large size of the sample after inlaying.
Description
Technical Field
The invention relates to the technical field of electron back scattering diffraction characterization), in particular to a method for preparing an EBSD sample.
Background
The Electron Back Scattering Diffraction (EBSD) technique is an advanced method for analyzing the microstructure and structure of polycrystalline bodies, and the texture analysis has advantages of both XRD and TEM, and the information provided by EBSD includes not only quantitative information such as the shape, size and distribution of crystal grains, but also the content such as the orientation, phase distribution, type of grain boundary, strain distribution of crystal grains, and is an advanced detection and analysis means developed in recent years. The detection method has very important significance in scientific research and industrial detection. In recent years, a large number of researchers research the microstructure, texture and other information of different metal samples by calibrating EBSD, and the EBSD sampling of the metal samples is involved.
With the progress of the times, the automatic grinding and polishing machine and the vibratory polishing machine are widely applied due to saving of sample preparation cost and time, and after the automatic grinding and polishing is finished, the vibratory polishing can be adopted to further improve the surface smoothness, eliminate fine scratches and remove residual stress. However, when a small-sized metal sample is prepared by using an automatic grinding and polishing machine and a vibration polishing machine, the sample is required to be inlaid, the schematic diagram of the inlaid sample is shown in fig. 1, a sample 100 is inlaid in a cured resin 111, the conductivity of the sample is greatly reduced, the conductivity problem of the sample needs to be solved by using a conductive adhesive, and the vacuumizing time of an electron microscope is prolonged; in addition, the size of the inlaid sample is too large, and the inlaid sample has certain weight, so that the EBSD data calibration quality is reduced, a pole shoe and a probe of an electron microscope are easy to bump, and the inlaid sample is very dangerous. Therefore, the clamp matched with the grinding head of the automatic grinding and polishing machine and the grinding head of the vibration polishing machine is of great importance, so that the step of sample inlaying is omitted, free sampling and lofting are realized, a polished sample suitable for being placed on the EBSD inclined sample table can be obtained, and the time and the cost are greatly saved.
Disclosure of Invention
The invention aims to solve the problems of poor conductivity, overlarge sample size, easy damage to an electron microscope and the like caused by the mosaic sample in the prior art, and provides a method for preparing an EBSD sample.
In order to achieve the above object, the present invention provides a method for preparing an EBSD sample, comprising the steps of:
s1 providing a clip: the clamp body is of a cylindrical structure, a clamping hole is formed in the end face of the clamp inwards, the clamping hole is communicated with four screw holes formed in the side face of the clamp inwards, and the screw holes are used for allowing fastening screws to penetrate through;
s2, placing the sample in a clamping hole of a clamp, then tightening a fastening screw to fix the sample in the clamping hole, and controlling the surface to be polished of the sample to be parallel to the end face of the clamp;
s3, transferring the clamp with the sample in the step S2 to a grinding head hole of an automatic grinding and polishing machine for mechanical grinding and polishing, taking out the clamp after the mechanical grinding and polishing is finished, cleaning and drying the clamp, transferring the clamp to the grinding head hole of a vibration polishing machine for vibration polishing, taking out the clamp after the vibration polishing is finished, loosening screws, and taking out the sample for cleaning and drying.
Preferably, the two end faces of the clamp are both provided with inward clamping holes, and each clamping hole is communicated with two inward screw holes in the side face of the clamp.
Preferably, the shape of the clamping hole is square or circular.
Preferably, in step S2, before the sample is placed in the fixture, it is further ground by using sand paper.
Preferably, in step S3, after the mechanical polishing is finished, the jig is taken out and cleaned with alcohol and dried with cold air.
Preferably, in step S3, the jig is taken out after the vibration polishing is finished, the screws are loosened, the sample is taken out and washed with alcohol and dried with cold air.
Preferably, in step S3, the polishing solution used for the vibration polishing is obtained by mixing an OP-S polishing solution and hydrogen peroxide in a volume ratio of 4: 1.
Preferably, the sample is a titanium alloy sample.
Preferably, in step S3, the mechanical polishing is multi-pass mechanical polishing.
Preferably, in step S3, the shapes of the grinding head hole of the automatic grinding and polishing machine and the grinding head hole of the vibratory polishing machine are both circular.
In the invention, the traditional embedded polishing sample is replaced by fixing the sample by using the fixture body, and the size and the dimension of the fixture are matched with the grinding head of the automatic polishing machine and the vibration polishing machine, so that the sample can be easily taken down after the automatic polishing, the surface of the sample is prevented from being polluted when the embedded material is removed, the EBSD probe is prevented from being damaged due to the overlarge size of the sample after the embedded material is removed, the problems of poor conductivity and overlong vacuumizing time of the embedded material can be solved, and the time cost is greatly saved.
Drawings
FIG. 1 is a schematic representation of a sample after mounting;
FIG. 2 is a schematic view of a clamp according to the present invention;
FIG. 3 shows the calibration results of the sample obtained in example 1;
FIG. 4 shows the calibration results of the sample obtained in example 2;
FIG. 5 is the calibration results of the sample obtained in example 3;
fig. 6 is a calibration result of the sample obtained in comparative example 1.
Description of the reference numerals
1 clamping hole 2 screw hole
3 fastening screw 100 test specimen
111 cured resin
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
The endpoints of the ranges and any values disclosed herein are not limited to the precise range or value, and such ranges or values should be understood to encompass values close to those ranges or values. For ranges of values, between the endpoints of each of the ranges and the individual points, and between the individual points may be combined with each other to give one or more new ranges of values, and these ranges of values should be considered as specifically disclosed herein.
The invention provides a method of preparing an EBSD sample comprising the steps of:
s1 providing a clip: the clamp body is of a cylindrical structure, a clamping hole 1 is formed in the end face of the clamp inwards, the clamping hole 1 is communicated with four screw holes 2 formed in the side face of the clamp inwards, and the screw holes 2 are used for penetrating fastening screws 3;
s2, placing a sample in a clamping hole 1 of a clamp, then tightening a fastening screw 3 to fix the sample in the clamping hole 1, and controlling the surface to be polished of the sample to be parallel to the end face of the clamp;
s3, transferring the clamp with the sample in the step S2 to a grinding head hole of an automatic grinding and polishing machine for mechanical grinding and polishing, taking out the clamp after the mechanical grinding and polishing is finished, cleaning and drying the clamp, transferring the clamp to the grinding head hole of a vibration polishing machine for vibration polishing, taking out the clamp after the vibration polishing is finished, loosening screws, and taking out the sample for cleaning and drying.
In the invention, a clamping hole 1 of the clamp is used for placing a sample, a screw hole 2 is used for penetrating a fastening screw 3, and the screw 3 is used for generating fastening force so as to fix the sample. When the clamp is used, a sample to be polished is placed in the clamping hole 1, and then the four fastening screws 3 penetrating through the four symmetrically arranged screw holes 2 are screwed down, so that the sample can be fixed in the clamp.
In a preferred embodiment, two end faces of the clamp are provided with clamping holes 1 inwards, and each clamping hole 1 is communicated with four screw holes 2 inwards arranged on the side face of the clamp.
In the invention, the two end faces of the clamp are both provided with the clamping holes 1 inwards, and the clamping holes 1 can be set into different shapes, so that the clamp can be suitable for samples with various shapes when being communicated.
In a preferred embodiment, the shape of the clamping hole 1 is square or circular.
In a specific embodiment, the clamp is schematically illustrated in fig. 2, wherein fig. 2a and 2b are cross-sectional views and fig. 2c and 2d are top and bottom views, respectively. One end face of the clamp is inwards provided with a square clamping hole 1, the square clamping hole 1 is communicated with four inwards-arranged screw holes 2 on the side face of the clamp, the horizontal heights of the four screw holes are the same, and the four screw holes are uniformly distributed to divide the side face into four equal parts; a circular clamping hole 1 is formed in the other end face of the clamp, the circular clamping hole 1 is also communicated with the other four inward screw holes 2 in the side face of the clamp, the horizontal heights of the four screw holes are the same, and the four screw holes are evenly distributed to divide the side face into four equal parts.
In a preferred embodiment, the sample is further sanded using sand paper before being placed in the fixture in step S2. Further preferably, the sanding is performed with 400 mesh sandpaper.
In a preferred embodiment, in step S3, the mechanical polishing is finished, and the jig is taken out and cleaned with alcohol and dried with cold air.
In a preferred embodiment, in step S3, the jig is removed after the vibration polishing is finished, the screws are loosened, the sample is taken out and cleaned with alcohol and dried with cold air.
In a preferred embodiment, in step S3, the polishing solution used for vibration polishing is obtained by mixing OP-S polishing solution and hydrogen peroxide at a volume ratio of 4: 1.
In a preferred embodiment, the sample is a titanium alloy sample.
In a preferred embodiment, the clamp can be made of a suitable material according to the type of the sample to be polished, for example, when the sample to be polished is a titanium alloy, the clamp can be made of a titanium alloy material, so that damage to the surface of the sample to be polished due to different materials during polishing is avoided.
In a preferred embodiment, in step S3, the mechanical polishing is multi-pass mechanical polishing.
In a preferred embodiment, in step S3, the shape of the grinding head hole of the automatic grinding and polishing machine and the shape of the grinding head hole of the vibratory polishing machine are both circular.
The clamp can be used for an automatic grinding and polishing machine and a vibration polishing machine to carry out sample polishing treatment without embedding a sample, can be used for testing the sample by an electron back scattering technology, can also be used for preparing samples of a metallographic microscope and a scanning electron microscope, and has the advantages of simple manufacturing process and low cost.
The present invention will be described in detail below by way of examples, but the scope of the present invention is not limited thereto.
The model of the automatic polishing machine used in the following examples and comparative examples was Tegramin-25, and the model of the vibratory finishing machine was Vibromet 2.
Example 1
S1 providing a clip: the clamp body is of a cylindrical structure and is made of a titanium alloy material, a schematic diagram is shown in fig. 2, one end face of the clamp is inwards provided with a square clamping hole 1, the other end face of the clamp is inwards provided with a circular clamping hole 1, each clamping hole 1 is communicated with four screw holes 2 which are inwards symmetrically formed in the side face of the clamp and are uniformly distributed, and the screw holes 2 are used for penetrating fastening screws 3;
s2, placing a sample (TC 4 alloy with the size of 8mm multiplied by 5 mm) in a square clamping hole 1 of a clamp, then tightening 4 fastening screws 3 to fix the sample in the square clamping hole 1, and controlling the surface to be polished of the sample to be parallel to the end face of the clamp;
s3, transferring the clamp with the sample in the step S2 to a circular grinding head hole of an automatic grinding and polishing machine for 4 times of mechanical grinding and polishing, taking out the clamp after the mechanical grinding and polishing is finished, cleaning the clamp with alcohol and drying the clamp with cold air, transferring the clamp to a grinding head hole of a vibration polishing machine for vibration polishing, mixing OP-S polishing liquid and hydrogen peroxide according to a volume ratio of 4:1 to prepare 150mL of vibration polishing liquid, performing vibration polishing for 2 hours, taking out the clamp after the vibration polishing is finished, loosening screws, taking out the sample, cleaning the sample with alcohol and drying the sample with cold air.
Example 2
S1 providing a clip: the clamp body is of a cylindrical structure and is made of a titanium alloy material, a schematic diagram is shown in fig. 2, one end face of the clamp is inwards provided with a square clamping hole 1, the other end face of the clamp is inwards provided with a circular clamping hole 1, each clamping hole 1 is communicated with four screw holes 2 which are inwards symmetrically formed in the side face of the clamp and are uniformly distributed, and the screw holes 2 are used for penetrating fastening screws 3;
s2, placing a sample (TC 4 alloy with the size of 8mm multiplied by 6mm multiplied by 10 mm) in a square clamping hole 1 of a clamp, then tightening 4 fastening screws 3 to fix the sample in the square clamping hole 1, and controlling the surface to be polished of the sample to be parallel to the end face of the clamp;
s3, transferring the clamp with the sample in the step S2 to a circular grinding head hole of an automatic grinding and polishing machine for 4 times of mechanical grinding and polishing, taking out the clamp after the mechanical grinding and polishing is finished, cleaning the clamp by using alcohol and drying the clamp by using cold air, transferring the clamp to a grinding head hole of a vibration polishing machine for vibration polishing, mixing OP-S polishing solution and hydrogen peroxide according to the volume ratio of 4:1 to prepare 150mL of vibration polishing solution, performing vibration polishing for 2 hours, taking out the clamp after the vibration polishing is finished, loosening screws, taking out the sample, cleaning the sample by using alcohol and drying the sample by using cold air
Example 3
S1 providing a clip: the clamp body is of a cylindrical structure and is made of a titanium alloy material, a schematic diagram is shown in fig. 2, one end face of the clamp is inwards provided with a square clamping hole 1, the other end face of the clamp is inwards provided with a circular clamping hole 1, each clamping hole 1 is communicated with four screw holes 2 which are inwards symmetrically formed in the side face of the clamp and are uniformly distributed, and the screw holes 2 are used for penetrating fastening screws 3;
s2, placing a sample (TA 10 alloy with the size of 6mm multiplied by 2mm multiplied by 10 mm) in a square clamping hole 1 of a clamp, then tightening 4 fastening screws 3 to fix the sample in the square clamping hole 1, and controlling the surface to be polished of the sample to be parallel to the end face of the clamp;
s3, transferring the clamp with the sample in the step S2 to a circular grinding head hole of an automatic grinding and polishing machine for 4 times of mechanical grinding and polishing, taking out the clamp after the mechanical grinding and polishing is finished, cleaning the clamp with alcohol and drying the clamp with cold air, transferring the clamp to a grinding head hole of a vibration polishing machine for vibration polishing, mixing OP-S polishing liquid and hydrogen peroxide according to a volume ratio of 4:1 to prepare 150mL of vibration polishing liquid, performing vibration polishing for 2 hours, taking out the clamp after the vibration polishing is finished, loosening screws, taking out the sample, cleaning the sample with alcohol and drying the sample with cold air.
Comparative example 1
S1 sample inlaying: cutting TA10 alloy with the size of 6mm multiplied by 2mm multiplied by 10mm by a linear cutting mode, and inlaying a sample in a cylinder with the diameter of 25mm and the height of 15mm by a model number of Struers CitoPress;
s2, placing the embedded sample in a circular grinding head hole of an automatic grinding and polishing machine for 4 times of mechanical grinding and polishing, taking out a fixture after the mechanical grinding and polishing is finished, cleaning the fixture by using alcohol, drying the fixture by cold air, transferring the sample to the grinding head hole of a vibration polishing machine for vibration polishing, mixing OP-S polishing solution and hydrogen peroxide according to a volume ratio of 4:1 to prepare 150mL of vibration polishing solution, performing vibration polishing for 2 hours, taking out the sample after the vibration polishing is finished, and cleaning the sample by using alcohol and drying the sample by cold air.
Test example 1
When the sample obtained in the embodiment is tested, the sample can be directly placed on an inclined sample table, then the sample is placed in a Japanese field emission scanning electron microscope 7900, the sample is vacuumized for about 5 minutes to reach a vacuum degree, and then the sample can be directly calibrated; the inlaid sample obtained in the comparative example contains a large number of gaps in the inlaid material, so that the vacuumizing time is saved and the damage to an electron microscope is reduced, after the sample is pre-vacuumized for 30 minutes, the sample is too large and cannot be placed on a special inclined sample table, the sample can only be placed on a horizontal sample table and then placed in the electron microscope, the vacuumizing time is up to 25 minutes, and the sample is calibrated after the sample table is manually rotated for 70 degrees.
The results of the calibration of the sample of example 1 are shown in FIG. 3, with a calibration rate of 92%; the results of the calibration of the sample of example 2 are shown in FIG. 4, with a calibration rate of 95%; the results of the calibration of the sample of example 3 are shown in FIG. 5, with a calibration rate of 94%; the calibration results of the sample of comparative example 1 are shown in fig. 6, the calibration rate is 91%, and the upper tissue is compressed and the lower tissue is elongated and enlarged due to the oversize sample and drift in the calibration process, which are obviously observed to affect the data results.
The data show that the EBSD sample obtained by implementing the method can shorten the vacuumizing time, reduce the damage to an electron microscope and avoid the influence on the calibration of the sample due to the sample size or poor conductivity of the cured resin.
The preferred embodiments of the present invention have been described above in detail, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, many simple modifications can be made to the technical solution of the invention, including combinations of various technical features in any other suitable way, and these simple modifications and combinations should also be regarded as the disclosure of the invention, and all fall within the scope of the invention.
Claims (10)
1. A method of preparing an EBSD sample, comprising the steps of:
s1 providing a clip: the clamp body is of a cylindrical structure, a clamping hole (1) is formed in the end face of the clamp inwards, the clamping hole (1) is communicated with four screw holes (2) formed in the side face of the clamp inwards, and the screw holes (2) are used for penetrating fastening screws (3);
s2, placing the sample in a clamping hole (1) of a clamp, then tightening a fastening screw (3) to fix the sample in the clamping hole (1), and controlling the surface to be polished of the sample to be parallel to the end face of the clamp;
s3, transferring the clamp with the sample in the step S2 to a grinding head hole of an automatic grinding and polishing machine for mechanical grinding and polishing, taking out the clamp after the mechanical grinding and polishing is finished, cleaning and drying the clamp, transferring the clamp to the grinding head hole of a vibration polishing machine for vibration polishing, taking out the clamp after the vibration polishing is finished, loosening screws, and taking out the sample for cleaning and drying.
2. The method for preparing EBSD samples according to claim 1, wherein the two end faces of the clamp are both inwardly opened with clamping holes (1), and each clamping hole (1) is communicated with four screw holes (2) inwardly opened at the side face of the clamp.
3. The method for preparing an EBSD sample according to claim 1 or 2 wherein the clamping holes (2) are square or circular in shape.
4. The method for preparing EBSD samples according to claim 1 or 2, wherein in step S2, the samples are further sanded before being placed in the fixture.
5. The method for preparing an EBSD sample according to claim 1 or 2 wherein the jig is removed after the mechanical polishing is completed and cleaned with alcohol and dried with cold air in step S3.
6. The method for preparing an EBSD sample according to claim 1 or 5 wherein in step S3 the jig is removed after the completion of the vibratory finishing, the screws are loosened, the sample is removed and cleaned with alcohol and dried with cold air.
7. The method for preparing an EBSD sample of claim 1 wherein in step S3 the polishing solution used for vibratory polishing is formed by mixing OP-S polishing solution and hydrogen peroxide at a volume ratio of 4: 1.
8. The method of preparing an EBSD sample of claim 1 wherein the sample is a titanium alloy sample.
9. The method for preparing an EBSD sample of claim 1 wherein in step S3 the mechanical polishing is multi-pass mechanical polishing.
10. The method for preparing an EBSD sample of claim 1 wherein in step S3, the shapes of the grinding head hole of the automatic grinding and polishing machine and the grinding head hole of the vibratory polishing machine are both circular.
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CN202111396024.XA CN114112580A (en) | 2021-11-23 | 2021-11-23 | Method for preparing EBSD sample |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201399721Y (en) * | 2009-04-30 | 2010-02-10 | 重庆大学 | Mechanical grinding and polishing/vibrational polishing clamp |
CN207081596U (en) * | 2017-07-31 | 2018-03-09 | 中国科学院金属研究所 | Multiple Shape grinding and polishing fixture |
CN210650184U (en) * | 2019-08-23 | 2020-06-02 | 华中科技大学 | Exempt from to inlay anchor clamps suitable for grind and throw sample |
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2021
- 2021-11-23 CN CN202111396024.XA patent/CN114112580A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201399721Y (en) * | 2009-04-30 | 2010-02-10 | 重庆大学 | Mechanical grinding and polishing/vibrational polishing clamp |
CN207081596U (en) * | 2017-07-31 | 2018-03-09 | 中国科学院金属研究所 | Multiple Shape grinding and polishing fixture |
CN210650184U (en) * | 2019-08-23 | 2020-06-02 | 华中科技大学 | Exempt from to inlay anchor clamps suitable for grind and throw sample |
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