CN114111722A - Detection device, detection method of silicon wafer placement state and wafer library management system - Google Patents
Detection device, detection method of silicon wafer placement state and wafer library management system Download PDFInfo
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 97
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- 238000012545 processing Methods 0.000 claims description 7
- 238000007689 inspection Methods 0.000 claims description 4
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Abstract
The invention provides a detection device, a detection method of silicon wafer placement state and a wafer library management system. Therefore, even if strong light irradiates, adverse effects cannot be caused, on the contrary, the imaging quality can be higher due to the light irradiating, and the accuracy and the stability of silicon wafer detection can be further improved. Furthermore, in the detection device, the detection method for the silicon wafer placement state and the wafer library management system provided by the invention, only the wafer box needs to move in one direction of vertical movement, and compared with the movement in two directions in the prior art, the device can be simplified, and the detection stability is further improved.
Description
Technical Field
The invention relates to the technical field of integrated circuit manufacturing, in particular to a detection device, a detection method of a silicon wafer placement state and a chip library management system.
Background
The system for managing the chip library is applied to a plurality of semiconductor devices such as photoetching equipment and the like, and generally used as an external material interface of the equipment for preprocessing materials. The detection of the state of the silicon wafer in the wafer box is an important detection link in a wafer library management system, and the accuracy and stability of the detection directly influence the subsequent material management and whether the manipulator can successfully take the wafer.
The states of the silicon wafers in the wafer cassette are roughly classified into the following four types: no plate, normal plate, lamination and cross slot. At present, the adopted detection mode is that two laser diffuse reflection sensors are transmitted into a wafer cassette through the combined action of a scanning shaft and a vertical shaft in a wafer library management system, so that the state of a silicon wafer in the wafer cassette is obtained. However, the wafer box is made of transparent plastic materials and is easy to reflect light, and the sensor can receive signals without a silicon wafer. In addition, the sensor is easily interfered by external environment, for example, when a person walks on the outer side of the film box and is positioned in the light beam direction position of the sensor, the detection state of the sensor is influenced. If change for opaque film box, the sensor can appear the point of gathering and beat too big, can't distinguish the condition of normal piece and lamination.
Therefore, a new system, device and method for managing the wafer library are needed to solve the problems of inaccurate and unstable detection of the silicon wafer state in the wafer box.
Disclosure of Invention
The invention aims to provide a detection device, a detection method of a silicon wafer placement state and a wafer library management system, and aims to solve the problems that the detection of the silicon wafer state in a wafer box is inaccurate and unstable.
In order to solve the above technical problem, the present invention provides a detection device for detecting the placement state of a silicon wafer in a cassette, the detection device comprising: the image processing device comprises an illumination unit, a first driving unit and an image detection unit; the illumination unit and the image detection unit are arranged at intervals and are close to the outer side wall of the wafer box; the first driving unit is connected with the wafer box; wherein the content of the first and second substances,
the illumination unit is used for providing illumination to the inside of the box so as to enable at least the inner side wall of the box to be illuminated;
the first driving unit is used for driving the film box to move vertically;
the image detection unit is used for acquiring an image of the placement state of the silicon wafer in the wafer box at least at one position in the vertical movement process of the wafer box and judging the placement state of the silicon wafer in the wafer box according to the image.
Optionally, in the detection apparatus, the first driving unit includes a motor and a motion module; the motion module is connected the film box with the motor, motor drive the motion module motion, so that the motion module drives the film box carries out vertical motion.
Optionally, in the detection device, the motion module includes a lead screw.
Optionally, in the detection apparatus, the detection apparatus further includes a second driving unit; the illumination unit is arranged on the second driving unit, and the second driving unit can drive the illumination unit to move along a set track.
Optionally, in the detection device, the second driving unit is a sliding table cylinder; the sliding table cylinder comprises a base table, a guide rail arranged on the base table and a sliding block capable of sliding along the guide rail; the illumination unit is arranged on the sliding block, and the sliding block can drive the illumination unit to move along the guide rail.
Optionally, in the detection device, the illumination unit is a halogen lamp, a light emitting diode, or a fluorescent lamp.
Optionally, in the detection apparatus, the image detection unit includes an area-array camera and a lens disposed on the area-array camera; the image acquired by the area-array camera at a single time comprises images of a plurality of silicon wafers in the wafer box in the placing state.
Based on the same inventive concept, the invention also provides a method for detecting the placement state of the silicon wafer, which comprises the following steps:
the illumination unit provides illumination to the inside of the wafer box;
the first driving unit drives the film box to move vertically;
in the process of vertical movement of the wafer box, the image detection unit acquires an image of the wafer box at least one position and judges the placement state of the silicon wafer in the wafer box according to the image.
Optionally, in the method for detecting the placement state of the silicon wafer, the placement state of the silicon wafer in the wafer box includes a normal state, a wafer-free state, a lamination state and a cross-slot state.
Optionally, in the method for detecting a placement state of a silicon wafer, the method for detecting a placement state of a silicon wafer further includes: the image detection unit respectively acquires standard images of a silicon wafer in a normal state, a non-wafer state, a lamination state and a cross-slot state in the wafer cassette so as to form a database of the standard images.
Optionally, in the method for detecting the placement state of the silicon wafer, the image detection unit compares the acquired image with the standard image in the database to determine the placement state of the silicon wafer in the cassette.
Optionally, in the method for detecting a placement state of a silicon wafer, the image detection unit performs graying processing on the acquired image and the standard image in the database, and acquires a grayscale distribution value; and judging the placing state of the silicon wafer in the wafer box by comparing the image gray distribution value with the gray distribution value of the standard image.
Based on the same invention concept, the invention also provides a film cassette management system, which comprises a film cassette, a film cassette bearing frame and the detection device; wherein the content of the first and second substances,
the wafer box is used for bearing a silicon wafer;
the wafer box bearing frame comprises a base and a guide rail arranged on the base, and the wafer box can vertically move along the guide rail;
the detection device is used for detecting the placing state of the silicon wafers in the wafer box.
Optionally, in the film library management system, a plurality of partition plates are sequentially arranged on the inner side wall of the film box along the vertical direction, and a silicon wafer is placed between every two adjacent partition plates.
In summary, in the detection apparatus, the detection method of the silicon wafer placement state and the management system of the wafer library provided by the present invention, the illumination unit at least illuminates the inner side wall of the wafer box, the first driving unit drives the wafer box to move vertically, and meanwhile, the image detection unit obtains the image of the silicon wafer placement state in the wafer box at least at one position during the vertical movement of the wafer box, and determines the placement state of the silicon wafer in the wafer box according to the image. Therefore, even if strong light irradiates, adverse effects cannot be caused, on the contrary, the imaging quality can be higher due to the light irradiating, and the accuracy and the stability of silicon wafer detection can be further improved. Furthermore, in the detection device, the detection method for the silicon wafer placement state and the wafer library management system provided by the invention, only the wafer box needs to move in one direction of vertical movement, and compared with the movement in two directions in the prior art, the device can be simplified, and the detection stability is further improved.
Drawings
FIG. 1 is a schematic view of a silicon wafer in a wafer cassette according to an embodiment of the present invention in a non-wafer state;
FIG. 2 is a schematic diagram of a wafer cassette with silicon wafers in a normal sheet state according to an embodiment of the present invention;
FIG. 3 is a schematic view of a wafer cassette with stacked silicon wafers according to an embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating a state in which silicon wafers in a wafer cassette cross slots according to an embodiment of the present invention;
FIG. 5 is a top view of a detection device according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a library management system of the present invention;
wherein the reference numbers indicate:
100-an image detection unit; 101-area-array camera; 102-a lens; 200-a first drive unit; 201-a motor; 202-a motion module; 300-a sheet cassette; 301-a silicon wafer; 302-a separator; 400-an illumination unit; 500-a second drive unit; 600-carrying frame.
Detailed Description
The following describes a detection apparatus, a detection method of a silicon wafer placement state, and a wafer library management system according to the present invention in further detail with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention. Further, the structures illustrated in the drawings are often part of actual structures. In particular, the drawings may have different emphasis points and may sometimes be scaled differently.
As can be seen from the above, the states of the silicon wafers 301 in the wafer cassette 300 are roughly classified into the following four types (as shown in FIGS. 1 to 4): the non-wafer state, the normal wafer state, the lamination state and the cross-slot state, and the accurate detection of the state of the silicon wafer 301 is an important detection link in a wafer library management system.
Therefore, the present embodiment provides a detection apparatus for detecting the placement state of the silicon wafer 301 in the wafer cassette 300, please refer to fig. 5, the detection apparatus includes: an image detection unit 100, a first driving unit 200, and an illumination unit 400. The illumination unit 400 and the image detection unit 100 are arranged at intervals and close to the outer side wall of the cassette 300; the first driving unit 200 is connected to the cartridge 300. Wherein, the illumination unit 400 is used to provide illumination into the cartridge 300 so as to illuminate at least the inner sidewall of the cartridge 300. Alternatively, the lighting unit 400 may light only an inner sidewall of the cartridge 300 or the entire inside of the cartridge 300, etc. The first driving unit 200 is used for driving the film cartridge 300 to move vertically. The image detection unit 100 is configured to obtain an image of a placement state of the silicon wafer 301 in the wafer box 300 at least one position in a vertical movement process of the wafer box 300, and determine the placement state of the silicon wafer 301 in the wafer box 300 according to the image.
Further, the image detection unit 100 includes an area-array camera 101 and a lens 102 disposed on the area-array camera. The image acquired by the area-array camera 101 at a single time includes images of the placement states of the silicon wafers 301 in the wafer cassette 300. Alternatively, the placement state of the silicon wafer 301 in three spacers 302 may be acquired at a time, or the placement state of the silicon wafer 301 in four spacers 302 may be acquired at a time, or the like. The area-array camera is a camera capable of acquiring two-dimensional image information and processing the image information in time, and the information readable by the area-array camera may include a measurement area, a shape, a size, a position, and the like. The area-array camera used in this embodiment can not only acquire the image of the silicon chip box 300, but also process the image and extract the silicon chip information, thereby being capable of judging the placement state of the silicon chip 301 in the silicon chip box 300 more conveniently and rapidly.
The first driving unit 200 includes a motor 201 and a motion module 202. The motion module 202 comprises a lead screw, the lead screw can be connected with the wafer box 300 and the motor 201, and the lead screw can drive the wafer box 300 to move and also can play a role in motion transmission so as to drive the wafer box to move vertically. When the motor 201 is connected to a power supply to work, the motion module 202 can be driven to move and drive the film box 300 to move along the vertical direction, preferably to move at a constant speed along the vertical direction. The moving speed of the film cartridge 300 may be specifically influenced by the image capturing frequency and the single capturing range of the image detecting unit 100. For example, if the vertical distance of a single acquisition of the image detection unit 100 is 30 mm and an image is acquired every 1 second, the vertical movement speed of the cassette is 30 mm/s. In the prior art, the sensor is moved by the combined action of the scanning shaft and the vertical shaft, and the sensor enters into the film box or moves along the outside of the film box, so that the detection is carried out. The detection apparatus provided in this embodiment removes the scanning axis, and then uses the first driving unit 200 to drive the film box 300 to vertically move upward, and uses the area array camera to continuously collect images at each position while the film box 300 moves upward, so as to more clearly and stably obtain the placement state of the silicon wafer in the film box 300.
The sheet cassette 300 may be made of a transparent material or a colored material. The inside wall of the wafer box 300 is provided with a plurality of partition boards 302 along the vertical direction, and in a normal state, a silicon wafer 301 is placed between every two adjacent partition boards 302.
The lighting unit 400 is a cylindrical light emitter including, but not limited to, a halogen lamp, a light emitting diode, or a fluorescent lamp. Compared with other shapes, such as a ring shape, a sphere shape and the like, the columnar light emitter is easier to control the direction of the light beam, so that the light beam can be transmitted into the wafer box 300 to the maximum extent to illuminate the inner side wall of the wafer box, and the image detection unit 100 can acquire clearer images of the silicon wafer placement state between the partition plates 302 on the inner side wall of the wafer box.
Wherein, the illumination unit 400 and the image detection unit 100 are disposed at an interval and close to the outer sidewall of the cassette 300. Preferably, the illumination unit 400 and the image detection unit 100 are respectively disposed at opposite sides of the diameter of the silicon wafer 301, and the illumination direction of the illumination unit 400 points to the inside of the wafer box 300 and is close to the inner side wall of the wafer box 300. The shooting direction of the image detection unit 100 is directed to the cassette 300, preferably along the diameter direction of the silicon wafer 301.
In addition, the detection apparatus further includes a second driving unit 500. The illumination unit 400 is disposed on the second driving unit 500, and the second driving unit 500 can drive the illumination unit 400 to move along a set track. The set trajectory refers to a linear direction trajectory approaching or departing from the cartridge 300. Further, the second driving unit 500 is a sliding table cylinder. The sliding table cylinder 500 comprises a base table and a sliding block, and a guide rail is arranged on the base table. The slider can slide back and forth along a guide rail on the base, and the illumination unit 400 is disposed on the slider. Before image detection unit 100 gathers the image, the slider can drive illumination unit 100 follows the guide rail is to being close to the direction motion of film cartridge 300 for image detection unit 100 provides the illumination, makes the image that image detection unit 100 obtained is more clear accurate. After the detection is finished, the slider can drive the illumination unit 100 to move along the guide rail in the direction away from the film box 300.
Based on the same inventive concept, the present embodiment further provides a library management system, as shown in fig. 6, the library management system includes a cassette 300, a cassette carrying frame 600, and the detecting device. Wherein, the wafer box 300 is used for carrying a silicon wafer 301. Spool box 300 bears frame includes the base and sets up in guide rail on the base, the base is a tubular structure, spool box 300 set up in the tubular structure, follow tubular structure's lateral wall and perpendicular to be provided with at least one bar guide rail in the direction of tubular structure bottom, spool box 300 with the guide rail is connected. The cassette 300 is capable of vertical movement along the rails. When the first driving unit 200 works, the motor 201 drives the moving module 202 to transmit a force for doing work to the film cassette 300 vertically, so that the film cassette 300 can move vertically along the guide rail. The detection device is used for detecting the placing state of the silicon wafer 301 in the wafer box 300.
The chip library management system is connected with the whole material management system and is controlled by the same controller. The material management system mainly plays a role in the transportation, storage, classification management and the like of semiconductor materials. The chip library management system is mainly used as a subsystem for storing and managing the silicon chips 301 in a classified manner, and is matched with the physical management system to transmit the silicon chips 301. After the state of the silicon wafer 301 in the wafer box 300 is detected, the image detection unit 100 transmits the acquired state information of the silicon wafer 301 in the wafer box 300 to a material management system for further processing the silicon wafer in an abnormal placement state.
Based on the same inventive concept, this embodiment further provides a method for detecting the placement state of a silicon wafer, please refer to fig. 6, where the method for detecting the placement state of a silicon wafer includes:
the illumination unit 400 provides illumination to in the film box 300, the first driving unit 200 drives the film box 300 to make vertical motion, and in the process of making vertical motion of the film box 300, the image detection unit 100 acquires an image of the film box 300 in at least one position, and judges the placement state of the silicon wafer 301 in the film box 300 according to the image. The method specifically comprises the following steps:
when the film cartridge 300 is located at an initial position, for example, the top of the film cartridge 300 just reaches the detection range of the image detection unit 100, the second driving unit 500 is first started, in this embodiment, the second driving unit 500 drives the illumination unit 400 to be close to the film cartridge 300, and starts the illumination unit 400 to provide illumination for the image detection unit 100. Then, the first driving unit 200 drives the magazine 300 to move at a constant speed in the vertical direction. In the process of moving the cassette 300, the area-array camera 101 acquires images in the cassette 300 at different positions.
Further, in this embodiment, the distance between two adjacent partition boards 302 is 10 mm. As shown in fig. 6, in this embodiment, the film cassette 300 has 25 spacers 302 with a total of 24 spacer pitches, and the image of the film cassette 300 acquired by the area-array camera in one time in this embodiment is an image with a vertical distance of about 36.5 mm. I.e., an image of the cassette 300 at approximately 3 separator pitches can be acquired per shot. Therefore, in this embodiment, the image inspection unit 100 acquires 8 images of the silicon wafers 301 in the wafer cassette 300, i.e. the entire wafer cassette 300 can be inspected.
Therefore, in this embodiment, the first driving unit 200 drives the film cartridge 300 to ascend at a constant speed according to a set speed. Meanwhile, the image detecting unit 100 continuously obtains 8 images of the film cassette 300 in accordance with the ascending speed of the film cassette 300, that is, completes the detection of the whole film cassette 300. After the entire cassette is inspected, the image inspection unit 100 compares each image with a database to determine the placement status of the silicon wafer 301 in the cassette 300 represented by each image. The database is a standard image of a silicon wafer obtained by the detection device through multiple measurements, wherein the standard image is in a normal state, a wafer-free state, a lamination state and a cross-slot state in a wafer box (for example, a sample/test silicon wafer is in the sample/test wafer box). Further, the present embodiment provides two methods for comparing the image with the database, wherein one method is to directly see from the image whether the image belongs to the no-slice state, the normal slice state, the lamination state or the cross-slot state in the database; secondly, the image detection unit 100 performs graying processing on the acquired image and the standard image in the database, and acquires a grayscale distribution value. The placing state of the silicon wafer 301 in the wafer box 300 is judged by comparing the gray distribution value of the image with the gray distribution value of the standard image.
After the detection is completed, the first driving unit 200 drives the wafer cassette 300 to return to the initial position, and the second driving unit 500 drives the illumination unit 400 to return to the initial position, so as not to affect a subsequent manipulator to obtain the silicon wafer 301 or adjust the state of the silicon wafer 301.
In summary, the present embodiment provides a detection apparatus, a method for detecting a silicon wafer placement state, and a system for managing a library. The detection device comprises an image detection unit 100 and a first driving unit 200, wherein a wafer box 300 is driven to move vertically through the first driving unit 200, the image detection unit 100 obtains an image of the placement state of a silicon wafer 301 in the wafer box 300 at least one position in the vertical movement process of the wafer box 300, and the placement state of the silicon wafer in the wafer box 300 is judged through the image. Here, the placement state of the silicon wafer 301 in the cassette 300 is judged by the image acquired by the image detection unit 100. Therefore, even if strong light irradiates, adverse effects cannot be caused, on the contrary, the imaging quality can be higher due to the light irradiating, and the accuracy and the stability of silicon wafer detection can be further improved. Furthermore, in the detection device, the detection method for the placement state of the silicon wafer and the wafer library management system provided by the embodiment, only the wafer box needs to move in one direction of the vertical movement, and compared with the movement in two directions in the prior art, the setting of the scanning axis is cancelled, so that the equipment can be simplified, and the detection stability is further improved.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (14)
1. A detection device for detecting the placement state of a silicon wafer in a cassette, the detection device comprising: the image processing device comprises an illumination unit, a first driving unit and an image detection unit; the illumination unit and the image detection unit are arranged at intervals and are close to the outer side wall of the wafer box; the first driving unit is connected with the wafer box; wherein the content of the first and second substances,
the illumination unit is used for providing illumination to the inside of the box so as to enable at least the inner side wall of the box to be illuminated;
the first driving unit is used for driving the film box to move vertically;
the image detection unit is used for acquiring an image of the placement state of the silicon wafer in the wafer box at least at one position in the vertical movement process of the wafer box and judging the placement state of the silicon wafer in the wafer box according to the image.
2. The detection device of claim 1, wherein the first drive unit comprises a motor and a motion module; the motion module is connected the film box with the motor, motor drive the motion module motion, so that the motion module drives the film box carries out vertical motion.
3. The detection device of claim 2, wherein the motion module comprises a lead screw.
4. The sensing device of claim 1, further comprising a second drive unit; the illumination unit is arranged on the second driving unit, and the second driving unit can drive the illumination unit to move along a set track.
5. The detecting device according to claim 4, wherein the second driving unit is a slide table cylinder; the sliding table cylinder comprises a base table, a guide rail arranged on the base table and a sliding block capable of sliding along the guide rail; the illumination unit is arranged on the sliding block, and the sliding block can drive the illumination unit to move along the guide rail.
6. The detecting device according to claim 1, wherein the light unit is a halogen lamp, a light emitting diode, or a fluorescent lamp.
7. The inspection apparatus of claim 1, wherein the image inspection unit comprises an area-array camera and a lens disposed on the area-array camera; the image acquired by the area-array camera at a single time comprises images of a plurality of silicon wafers in the wafer box in the placing state.
8. A method for detecting a silicon wafer placement state, using the detecting apparatus according to any one of claims 1 to 7, comprising:
the illumination unit provides illumination to the inside of the wafer box;
the first driving unit drives the film box to move vertically;
in the process of vertical movement of the wafer box, the image detection unit acquires an image of the wafer box at least one position and judges the placement state of the silicon wafer in the wafer box according to the image.
9. The method for detecting the silicon wafer placement state according to claim 8, wherein the placement state of the silicon wafer in the cassette includes a normal state, a no-wafer state, a lamination state, and a cross-slot state.
10. The method for detecting the silicon wafer placement state according to claim 9, further comprising: the image detection unit respectively acquires standard images of a silicon wafer in a normal state, a non-wafer state, a lamination state and a cross-slot state in the wafer cassette so as to form a database of the standard images.
11. The method for detecting the silicon wafer placement state according to claim 10, wherein the image detection unit judges the placement state of the silicon wafer in the cassette by comparing the acquired image with the standard image in the database.
12. The method for detecting the placement state of a silicon wafer according to claim 10, wherein the image detection unit performs graying processing on the acquired image and the standard image in the database, and acquires a grayscale distribution value; and judging the placing state of the silicon wafer in the wafer box by comparing the image gray distribution value with the gray distribution value of the standard image.
13. A library management system comprising a cassette, a cassette carrying frame and a detecting apparatus according to any one of claims 1 to 7; wherein the content of the first and second substances,
the wafer box is used for bearing a silicon wafer;
the wafer box bearing frame comprises a base and a guide rail arranged on the base, and the wafer box can vertically move along the guide rail;
the detection device is used for detecting the placing state of the silicon wafers in the wafer box.
14. The library management system of claim 13, wherein a plurality of partitions are sequentially provided in a vertical direction on an inner sidewall of the cassette, and a silicon wafer is placed between two adjacent partitions.
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| CN115547900A (en) * | 2022-10-08 | 2022-12-30 | 合肥开悦半导体科技有限公司 | Intelligent silicon chip box with automatic leveling function |
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