CN109767999A - The detection method of wafer cassette and the detection system of wafer cassette - Google Patents
The detection method of wafer cassette and the detection system of wafer cassette Download PDFInfo
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- CN109767999A CN109767999A CN201811011009.7A CN201811011009A CN109767999A CN 109767999 A CN109767999 A CN 109767999A CN 201811011009 A CN201811011009 A CN 201811011009A CN 109767999 A CN109767999 A CN 109767999A
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- 238000001514 detection method Methods 0.000 title claims abstract description 329
- 238000012545 processing Methods 0.000 claims abstract description 150
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- 238000010586 diagram Methods 0.000 description 11
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Abstract
The present invention relates to a kind of detection method of wafer cassette and the detection systems of wafer cassette.The detection method of the wafer cassette comprising the steps of: detecting step: detecting predetermined position using multiple detection modules, and the testing result of multiple detection modules is converted to multiple detection numerical value using processing module；Two detection modules being disposed adjacent to each other, the part of detection range are overlapped.Judgment step: by processing module according to multiple detection numerical value, judge whether the predetermined position of wafer cassette is provided with auxiliary part；When the detection numerical value that processing module judgement is greater than half falls in the first predetermined value section, processing module then determines that the predetermined position of wafer cassette is provided with auxiliary part；When the detection numerical value that processing module judgement is greater than half falls in the second predetermined value section, processing module then determines that the predetermined position of wafer cassette is not provided with auxiliary part.
Description
Technical field
Whether the present invention relates to a kind of detection method and detection systems, especially a kind of to be arranged outside wafer cassette for detecting
There are the detection method of the wafer cassette of auxiliary part and the detection system of wafer cassette.
Background technique
Wafer in the production process, needs to move between different production websites, therefore, often wafer can be set to one
In wafer cassette, in order to which wafer is transported to specific production station.In order to facilitate the transport of wafer cassette, or facilitate related personnel
Operation to wafer cassette, relevant manufactures can be provided with outside wafer cassette dismountable auxiliary part (such as grip structure or
Relevant snap-in structure etc.), it is used whereby convenient for the associated mechanical arm at particular production station or personnel.Therefore in wafer cassette
In the various situations transported, whether predetermined position should be provided with auxiliary part in the wafer cassette that correctly judges, and become important
Project.In actual application, for judging the setting of the auxiliary part in wafer cassette, be mostly in the way of artificial into
The problem of going, being so easy to happen omission.
Summary of the invention
The main purpose of the present invention is to provide a kind of detection method of wafer cassette and the detection systems of wafer cassette, to change
Kind whether the predetermined position that wafer cassette is carried out in the way of artificial is the judgement for being provided with auxiliary part in the prior art, is held
Easily there is the problem of omission.
To achieve the goals above, the present invention provides a kind of detection method of wafer cassette, to a wafer cassette extremely
A few predetermined position is detected, and the predetermined position includes an auxiliary part, the detection method of the wafer cassette is arranged
Following steps: a detecting step: detecting the predetermined position using multiple detection modules, and utilizes a processing module will
The testing result of multiple detection modules is converted to multiple detection numerical value；Wherein, two detections being disposed adjacent to each other
The part of module, detection range is overlapped；One judgment step: by the processing module according to multiple testing numbers
Value, judges whether the predetermined position of the wafer cassette is provided with the auxiliary part；Wherein, when the processing module judges
When the detection numerical value greater than half falls in one first predetermined value section, the processing module then determines the predetermined position
It is provided with the auxiliary part；When the detection numerical value that processing module judgement is greater than half falls in one second predetermined value
When section, the processing module then determines that the predetermined position is not provided with the auxiliary part.
Preferably, in Yu Suoshu judgment step, when the detection numerical value that processing module judgement is greater than half is not fallen
At first predetermined value section or the second predetermined value section, the processing module then determines detection failure, institute
It states processing module and then selectively controls multiple detection modules and execute the detecting step again.
Preferably, in Yu Suoshu detecting step, multiple detection modules are generated after detecting the predetermined position by corresponding
Multiple detection signals after the processing module receives multiple detection signals, can be carried out a mark by multiple detection signals
Standardization operation, so that multiple detection signals are converted to multiple detection numerical value.
Preferably, in Yu Suoshu normalizing operation, the processing module be first multiple detection signals are converted to it is more
After a initial value, then according to one first numerical value and a second value, and using a standardization formula, the initial value is turned
It is changed to the detection numerical value, the standardization formula is as follows:
Preferably, also include an information acquiring step before Yu Suoshu detecting step: utilizing a data obtaining module, obtain
One predetermined information of the wafer cassette；In the judgment step, the processing module is according to the predetermined information and multiple institutes
Detection numerical value is stated, judges whether the predetermined position of the wafer cassette is provided with the auxiliary part.
To achieve the goals above, the present invention also provides a kind of detection systems of wafer cassette, to a wafer cassette
At least a predetermined position is detected, and the predetermined position is to be arranged an auxiliary part, the detection system packet of the wafer cassette
Contain: a microscope carrier, to carry the wafer cassette；Multiple detection modules can respectively detect the predetermined position, and
The part of the detection range for two detection modules being disposed adjacent to each other is overlapped；One processing module is electrically connected
Multiple detection modules, and multiple detection module institute testing results can be converted to multiple testing numbers by the processing module
Value, and the processing module can be according to multiple detection numerical value, to judge the predetermined position of the wafer cassette, if set
It is equipped with the auxiliary part；Wherein, make a reservation for when the detection numerical value that processing module judgement is greater than half falls in one first
When numerical intervals, then the corresponding predetermined position for determining the wafer cassette is provided with the auxiliary part to the processing module；
When the detection numerical value that processing module judgement is greater than half falls in one second predetermined value section, the processing module
Then the corresponding predetermined position for determining the wafer cassette is not provided with the auxiliary part.
Preferably, when the detection numerical value that processing module judgement is greater than half does not fall within first predetermined value
When section or the second predetermined value section, the processing module then determines at least one described detection module detection failure,
The processing module then selectively controls multiple detection modules and detects again to the predetermined position.
Preferably, the detection system of the wafer cassette also includes multiple auxiliary detection modules, each auxiliary detection
Module is electrically connected the processing module, and each auxiliary detection module can carry out another predetermined position of the wafer cassette
Detection；The processing module can judge the another pre- of the wafer cassette according to the testing result of each auxiliary detection module
Positioning sets whether be provided with the auxiliary part.
Preferably, the detection system of the wafer cassette also includes a data obtaining module, can obtain the wafer cassette
A predetermined information, and it is corresponding generate one and obtain information, the data obtaining module is electrically connected the processing module, the place
Reason module can receive the acquisition information, and according to the acquisition information and multiple detection modules to the predetermined position
Testing result, judges whether the predetermined position is provided with the auxiliary part.
Preferably, the processing module can search more stored by a storage element and prestore according to the acquisition information
Information, and the processing module can be according to wherein a prestored information and multiple detection modules to the pre-determined bit
The testing result set, judges whether the predetermined position is provided with the auxiliary part.
Preferably, multiple detection modules will correspond to the multiple detection signals of generation after detecting the predetermined position, described
After processing module receives multiple detection signals, multiple detection signals can be subjected to a normalizing operation, so that multiple
The detection signal is converted to multiple detection numerical value.
Preferably, in Yu Suoshu normalizing operation, the processing module be first multiple detection signals are converted to it is more
After a initial value, then according to one first numerical value and a second value, and using a standardization formula, the initial value is turned
It is changed to the detection numerical value, the standardization formula is as follows
Preferably, each detection module includes multiple transmitting units and multiple receiving units, and multiple transmittings are single
Member is set to the microscope carrier, multiple corresponding tops for being located at the predetermined position of the receiving unit, multiple receiving units
The light beam issued to receive multiple transmitting units；Wherein, multiple transmitting units along an axis at each interval side by side
Setting, multiple receiving units are arranged side by side at each interval along another axis.
To achieve the goals above, the present invention also provides a kind of detection methods of wafer cassette, to a wafer cassette
At least a predetermined position is detected, and the predetermined position is to be arranged an auxiliary part, the detection method packet of the wafer cassette
Containing following steps: providing the detection system of above-mentioned wafer cassette；Multiple detection modules pair are controlled using the processing module
The predetermined position is detected, and using the processing module is converted to the testing result of multiple detection modules multiple
Detect numerical value；Make the processing module according to multiple detection numerical value, judge the wafer cassette the predetermined position whether
It is provided with the auxiliary part；Wherein, when the detection numerical value that processing module judgement is greater than half falls in one first in advance
When determining numerical intervals, the processing module then determines that the predetermined position is provided with the auxiliary part；When the processing module
When the detection numerical value that judgement is greater than half falls in one second predetermined value section, the processing module then determines described predetermined
Position is not provided with the auxiliary part.
Beneficial effects of the present invention can be: the detection system of wafer cassette of the invention and the detection method of wafer cassette,
Can accurately judge whether wafer cassette predetermined position is provided with auxiliary part, though least a portion of detection module can not be correct
When detect, the detection system of wafer cassette of the invention and the detection method of wafer cassette can still correctly judge wafer cassette
Predetermined position whether be provided with auxiliary part.
Detailed description of the invention
Fig. 1,2 for wafer cassette of the invention detection system schematic diagram.
Fig. 3 is the detection system part top view of wafer cassette of the invention.
Fig. 4 A, Fig. 4 B, Fig. 4 C are the schematic diagram that wafer cassette is provided with different auxiliary parts.
Fig. 5 is the top view of Fig. 1.
Fig. 6 is the side view of Fig. 1.
Fig. 7 is the block diagram of the detection system of wafer cassette of the invention.
Fig. 8 is the schematic diagram of another embodiment of the detection system of wafer cassette of the invention.
Fig. 9 is the flow diagram of the detection method of wafer cassette of the invention.
Figure 10 is another flow diagram of the detection method of wafer cassette of the invention.
Specific embodiment
It is the schematic diagram of the detection system of wafer cassette of the invention also referring to Fig. 1 and Fig. 2.As shown in Figure 1, brilliant
The detection system 1 of circle box includes a microscope carrier 10,20, three groups of the support construction auxiliary detection module 40 of detection module 30, three
An and processing module 50.Microscope carrier 10 is to carry a wafer cassette B.Support construction 20 is arranged adjacent to microscope carrier 10, and support construction
20 can be according to demand, be arranged adjacent to each side that wafer cassette B is not in contact with microscope carrier 10.About detection module 30 and
The quantity of auxiliary detection module 40 is not limited with above-mentioned, can be changed according to demand.
In practical applications, it includes a top structure 201 and two pillar constructions 202, top that support construction 20, which can be,
It includes one first transverse structure 2011, one second transverse structure 2012 and a vertical structure 2013 that portion's structure 201, which can be,；The
One transverse structure 2011 and the second transverse structure 2012 can be and be arranged substantially parallel to each other, the both ends point of vertical structure 2013
The first transverse structure 2011 and the second transverse structure 2012 are not connected.First transverse structure 2011 is generally corresponding to be located at wafer cassette B
A right side predetermined position P1, the second transverse structure 2012 be generally corresponding to positioned at wafer cassette B a left side predetermined position P2 it is upper
Side, and vertical structure 2013 is then generally corresponding to the top of the top surface predetermined position P3 positioned at wafer cassette B.
Two pillar constructions 202 are separately connected the first transverse structure 2011 and the second transverse structure 2012, and two columns
Structure 202 is not provided in moving range when wafer cassette B is operated；Specifically, as shown in Figure 1, wafer cassette B by personnel or
When being that associated mechanical device is mobile, scope of activities positive X-direction substantially shown in the figure, positive Y direction and negative Y-axis side
To, and two pillar constructions 202 are preferably then the negative X-directions for being set to microscope carrier 10, in this way, two pillar constructions 202 will
It will not influence personnel or the mobile wafer cassette B of associated mechanical device.First transverse structure 2011 is provided with three groups of detection modules 30,
Each group detection module 30 is detected to the right side predetermined position P1 to wafer cassette B；Second transverse structure 2012 is provided with three
Group detection module 30, each group detection module 30 are detected to the left side predetermined position P2 to wafer cassette B；Vertical structure 2013
Setting be can be there are three detection module 40 is assisted, to detect the top surface predetermined position P3 of wafer cassette B.
Processing module 50 is electrically connected each group detection module 30 and three auxiliary detection modules 40, and processing module 50 can be accordingly
It receives each detection module 30 and each auxiliary detection module 40 detection right side predetermined position P1, left side predetermined position P2 and top surface is predetermined
Whether signal caused by the P3 of position judges right side predetermined position P1, left side predetermined position P2 and top surface predetermined position P3 accordingly
It is provided with auxiliary part B1, B2, B3.In practical applications, it is any to can be computer equipment, microprocessor etc. for processing module 50
It can handle signal, the device of information or equipment, it is without restriction in this.Whereby, it is assisted through each group detection module 30, three
The mutual cooperation of detection module 40 and processing module 50, the detection system 1 of wafer cassette can judge that the right side of wafer cassette B is predetermined accordingly
Whether position P1, left side predetermined position P2 and top surface predetermined position P3 are provided with auxiliary part B1, B2, B3.In practical applications,
Multiple detection modules 30 and multiple auxiliary detection modules 40 can be according to demand, not be in contact with microscope carrier 10 to wafer cassette B
Either side is detected, and above three predetermined position (P1, P2, P3) is not limited to.
Also referring to Fig. 1 to Fig. 3, each group detection module 30 can be the component using interrupter-type detection method, and citing comes
It says, it includes a receiving unit 31 and a transmitting unit 32 that each group detection module 30, which can be,；Each receiving unit 31 is to connect
It for example can be by the inductive component of light beam, such as various optical sensor (Photo Detector), each transmitting unit 32
The relevant transmitting unit of light emitting diode or capable of emitting laser light；Preferably, each transmitting unit 32 can be using luminous
Diode, range of exposures is wide compared to laser, therefore, can effectively promote the effect of detection.It is worth mentioning, in order to avoid
Each receiving unit 31 is influenced by the lighting source of place set by microscope carrier 10 (such as dust free room)；Preferably, it can be
Each transmitting unit 32 is set to be set to the upper surface 101 of microscope carrier 10, and each transmitting unit 32 is to the upper table far from microscope carrier 10
The direction in face 101 issues light beam, and the receiving plane of each receiving unit 31 is then in face of the upper surface 101 of microscope carrier 10.In this way, each
Receiving unit 31 will not directly receive the light beam issued from the lighting source, and each detection module 30 can be made to have
There is relatively preferred detection effect.
In different applications, to detect the detection module 30 in some predetermined position of wafer cassette B, it can be packet
Receiving unit 31 and transmitting unit 32 containing different number, wherein the quantity of receiving unit 31 is greater than 1 odd number.It lifts
For example, detection module 30 can be receiving unit 31 and four luminescence units 32 comprising there are three, and three receiving units 31 can
To be to correspond to according to its received light number of institute and generate the detection numerical value, processing module then can be to be connect according to odd number
It receives the detection numerical value that unit 31 is transmitted and carries out correlated judgment operation.
As shown in figure 3, to three groups of detection modules 30 for detecting right side predetermined position P1 or left side predetermined position P2, it can be with
It is the X-direction setting (not showing X-axis on figure) each other side by side and substantially in figure, and two detection modules 30 adjacent to each other
Detection range is to overlap, i.e., the wherein detection range R2 of one group of detection module 30, respectively with other two groups of detection modules
30 detection range R1, R3 is overlapped.As shown in Fig. 4 A, Fig. 4 B, Fig. 4 C, described auxiliary part B1, B1 ', B1 " for example can be with
Be there is the grip structure or snap-in structure of various external form, and each auxiliary part B1, B1 ', B1 " can be and set according to demand
It is placed in the specific position of wafer cassette B.
In different applications, respectively to detect the right side predetermined position P1 or left side predetermined position P2 of wafer cassette B
Three groups of detection modules 30 mode is arranged, can be according to auxiliary part B1, B2 of different external forms and its relative to crystalline substance
The setting position of circle box B is corresponding to be changed, and the present embodiment mode shown in figure is not limited to.Relatively, to detect wafer cassette B
Right side predetermined position P1 or left side predetermined position P2 detection module 30 quantity, be also possible to according to the auxiliary to be detected
The external form of component B1, B2 and its setting position, and correspond to change.
Also referring to Fig. 1, Fig. 2, Fig. 5 and Fig. 6, three auxiliary detection modules 40 can be and be set to support construction 20,
And three auxiliary detection modules 40 can be upper surface 101 of the corresponding surface for microscope carrier 10 to carry wafer cassette B.Also that is, carrying
When platform 10 carries wafer cassette B, three auxiliary detection modules 40 can to should the top surface predetermined position P3 to wafer cassette B examine
It surveys.In the particular embodiment, it includes any component to measure distance that each auxiliary detection module 40, which can be, such as
Ultrasonic measurement unit, whereby, processing module 50 can according to three assist that detection modules 40 be measured as a result, judgement is brilliant
The top surface predetermined position P3 of circle box B, if be provided with auxiliary part B3；For example, the top surface predetermined position P3 of wafer cassette B is true
When being provided with auxiliary part B3 in fact, the distance that at least two auxiliary detection modules 40 are measured should can be less than the top of wafer cassette B
The distance that each auxiliary detection module 40 when face predetermined position P3 is not provided with auxiliary part B3 measures.Three auxiliary detection modules
40 set-up mode can be and be changed according to actual demand, is not limited to mode shown in figure.Preferably, phase each other
The part of the detection range of two adjacent auxiliary detection modules 40 is overlapped.
Referring to Fig. 7, the block diagram of its detection system for being shown as wafer cassette of the invention.As shown, processing
Module 50 is electrically connected multiple detection modules 30 and multiple auxiliary detection modules 40.Processing module 50, which can correspond to, receives multiple detections
Module 30 and multiple auxiliary detection modules 40 to the corresponding position of wafer cassette B detected caused by detection signal 301,
401, and those detection 301 corresponding conversions of signal can be multiple detection numerical value 501 by processing module 50.
Then, processing module 50 can judge right side predetermined position P1, the left side of wafer cassette B according to multiple detection numerical value 501
Whether predetermined position P2, top surface predetermined position P3 are provided with auxiliary part B1, B2, B3.When the judgement of processing module 50 is greater than half
Detection numerical value 501 when falling in one first predetermined value section, processing module 50 then determines that predetermined position P1, P2, P3 are provided with
Auxiliary part B1, B2, B3；When the detection numerical value 501 that the judgement of processing module 50 is greater than half falls in one second predetermined value section
When, processing module 50 then determines that predetermined position P1, P2, P3 are not provided with auxiliary part B1, B2, B3.
Specifically, also referring to Fig. 1, Fig. 3 and Fig. 7, processing module 50 is received to detect right side predetermined position P1
30 pairs of three groups of detection modules right side predetermined position P1 detect, after three detection signals 301 of corresponding generation, processing mould
Block 50 generates three detection numerical value 501 for corresponding, and post-processing module 50 can then judge whether each detection numerical value 501 corresponds to and fall
In the first predetermined value section or the second predetermined value section.
If processing module 50 judges that more than two detection numerical value 501 fall in the first predetermined value section, processing module
50 can determine that corresponding detection module 30 detects that right side predetermined position P1 is provided with auxiliary part B1.
If processing module 50 judges that more than two detection numerical value 501 fall in the second predetermined value section, processing module
50 can be the corresponding detection module 30 of judgement and detect that right side predetermined position P1 is not provided with auxiliary part B1.
If processing module 50 judges that more than two detection numerical value 501 do not fall within the first predetermined value section or second in advance
Determine numerical intervals, then processing module 50, which will can be, determines the problem of detection failure occurs for corresponding detection module 30, and locates
Reason module 50, which then can be, selectively to be controlled multiple detection modules 30 and detects again to predetermined position P1, also that is, in reality
It in the application of border, can be according to demand, judge that more than two detection numerical value 501 do not fall within the first predetermined value in processing module 50
When section or the second predetermined value section, so that processing module 50 is controlled multiple detection modules 30 and predetermined position P1 is carried out again
Detection, or detect processing module 30 to predetermined position P1 again, and control alarm unit is corresponded to prompt to use
Family detection failure.If processing module 50 judges two of them, detection numerical value 501 respectively falls in the first predetermined value section and the
Two predetermined value sections, and another detection numerical value 501 does not fall within the first predetermined value section or the second predetermined value section,
Then processing module 50 determines the problem of detection failure occurs for corresponding detection module 30.
In other words, whether processing module 50 is provided with the predetermined position P1 of wafer cassette B the judgement side of auxiliary part B1
Formula mainly detects same predetermined position P1 using multiple detection modules 30, and in the detection mould for being more than half quantity
When block 30 all judges that predetermined position P1 is provided with auxiliary part B1, determine that predetermined position P1 is provided with auxiliary part B1；And
When the detection module 30 for being more than half quantity all judges that predetermined position P1 is not provided with auxiliary part B1, predetermined position is determined
P1 is not provided with auxiliary part B1；Predetermined position P1 setting is judged in the detection module 30 for being not above half quantity or is not set
When being equipped with auxiliary part B1, then this time detection failure is determined.Therefore the detection system of wafer cassette of the invention can be in small part
Detection module 30 fail situation under, still judge whether the predetermined position P1 of wafer cassette B is provided with auxiliary part B1.
In a preferred application, processing module 50 receives the multiple detection modules 30 detected to same predetermined position P1
After the detection signal 301 transmitted, processing module 50, which can be, first carries out a normalizing operation to multiple detection signals 301, then
Multiple detection signals 301 are converted into multiple detection numerical value 501.For example, in Yu Suoshu normalizing operation, processing module 50
It can be and multiple detection signals are first converted into multiple initial value (VX) after 502, then according to one first numerical value V1And one second number
Value V2, using a standardization formula, each initial value 502 is converted into detection numerical value (S) 501, the standardization formula is such as
Under:
Above-mentioned standard formula is expressed as follows with symbol:
Specifically, first numerical value can be related technical personnel and set really in the predetermined position P1 of wafer cassette B
In the case where setting auxiliary part B1, the detection signal 301 for receiving multiple detection modules 30 according to processing module 50 is set；And
The second value then can be related technical personnel and be not provided with auxiliary part B1's really in the predetermined position P1 of wafer cassette B
In the case of, the detection signal 301 for receiving multiple detection modules 30 according to processing module 50 is set.
In the case where the predetermined position P1 of wafer cassette B has setting auxiliary part B1 really, processing module 50 is by multiple inspections
It surveys signal and is converted to multiple initial value (VX) after 502, using a standardization formula, by each initial value (VX) 502 be converted to
Numerical value (S) 501 is detected, if detection numerical value is 1, first predetermined value section, which can correspond to, is set as 0.8~1.2；?
In the case that the predetermined position P1 of wafer cassette B is not provided with auxiliary part B1, processing module 50 is converted to multiple detection signals
Multiple initial value (VX) after 502, using a standardization formula, by each initial value (VX) 502 be converted to detection numerical value (S)
501, if detection numerical value is -1, second predetermined value section, which can correspond to, is set as -1.2~-0.8.
If processing module is by the received initial value V of instituteXAfter above-mentioned standard formula is calculated, obtained inspection
Survey numerical value S be between -1.2~-0.8, then processing module will determine corresponding detection module to the predetermined position of wafer cassette B it
Testing result is " predetermined position does not have auxiliary part ".If processing module is by the received initial value V of instituteXBy above-mentioned
After standardization formula is calculated, obtained detection numerical value S is between 0.8~1.2, then processing module will determine corresponding inspection
Surveying module is " predetermined position has auxiliary part " to the testing result in the predetermined position of wafer cassette B.
If processing module is by the received initial value V of instituteXAfter above-mentioned standard formula is calculated, obtained inspection
Survey numerical value S be between -0.8~0.8, then processing module will determine corresponding detection module to the predetermined position of wafer cassette B it
Testing result is " lack of resolution ", i.e., detection failure may occur for corresponding detection module.
If processing module is by the received initial value V of instituteXAfter above-mentioned standard formula is calculated, obtained inspection
Survey numerical value S is less than -1.2 or greater than 1.2, then processing module will determine corresponding detection module to the pre-determined bit of wafer cassette B
The testing result set is " the first numerical value (V1), second value (V2) define it is incorrect ", i.e., the in corresponding standardization formula
One numerical value (V1), second value (V2) mistake may be defined, and cause detection module that the problem of detection fails occurs.In such shape
Under state, related technical personnel will can receive the detection signal 301 of multiple detection modules 30 according to processing module 50 again, to first
Numerical value (V1) and second value (V2) reset.
In practical applications, processing module 50, which can also be, is electrically connected a data obtaining module 60 and a storage element
70.Data obtaining module 60 is to obtain a predetermined information stored in the information storage unit B4 for be set to wafer cassette B
B41.The information storage unit B4 for example can be the various electronic tag that can store data, chip or be printed with bar code
Label etc., it is without restriction in this；Relatively, data obtaining module 60 then corresponds to any electronic tag, chip can be read
Or it is printed with the device of the label of bar code, and data obtaining module 60 is stored to read in information storage unit B4
Predetermined information B41 generates an acquisition information 601 with corresponding, and the acquisition information 601 is other than including predetermined information B41, also
It can include other relevant informations, such as read access time, the relevant information of data obtaining module etc. according to demand.
Predetermined information B41 stored by information storage unit B4, such as can be the various data of wafer cassette B, especially
Whether each predetermined position P1, P2, P3 of wafer cassette B should be provided with the data of auxiliary part B1, B2, B3 and each pre-
The data such as type of auxiliary part B1, B2, B3 set by P1, P2, P3 are set in positioning.
Storage element 70 can be the data storage element independently of processing module 50 or be integrated in processing module 50,
It can be in storage element 70 and store more prestored informations 701, each prestored information 701 is, for example, various types of auxiliary
Help component, institute's corresponding first predetermined value section, the second predetermined value section, 7011 (V of the first numerical value1) and second value
7012(V2) etc..
After processing module 50 receives the acquisition information 601 of data obtaining module 60, each of wafer cassette B is obtained by that can correspond to
Whether a predetermined position P1, P2, P3 should be provided with auxiliary part B1, B2, B3 and its kenel of auxiliary part B1, B2, B3 etc.
Related data, and post-processing module 50 then can correspond in storage element 70 search corresponding prestored information 701, to utilize phase
Corresponding first predetermined value section, the second predetermined value section, 7011 (V of the first numerical value1) and 7012 (V of second value2) carry out
Subsequent detection judgement.
Multiple detection modules 30 detect the same predetermined position P1 or P2 of wafer cassette B, and processing module 50 is corresponding to be produced
In raw multiple detection numerical value 501, if being more than that more than half detection numerical value 501 does not fall within the first predetermined value section or the
When two predetermined value sections, processing module 50 can be the multiple detection modules 30 of control and carry out one-time detection again again；Work as processing
After the multiple detection modules 30 of 50 Repetitive controller of module are detected, when the above problem still occurs.Processing module 50 controls relevant
Alarm unit (e.g. warning lamp, warning sound player etc.) may be that detection module 30 damages, or may be to remind user
First predetermined value section, the second predetermined value section, 7011 (V of the first numerical value1) and 7012 (V of second value2) setting error
(e.g. storage element 70 stores the predetermined of the information storage unit B4 storage mistake of the prestored information 701 of mistake, wafer cassette B
Information B41 etc.).Multiple auxiliary detection modules 40 are electrically connected about processing module 50, are examined with receiving each auxiliary detection module 40
The top surface predetermined position P3 of wafer cassette B is surveyed, the detection signal 401 of corresponding generation is to carry out the predetermined position P3 of wafer cassette B
The no judgment mode for being provided with auxiliary part B3, and aforementioned processing module 50 are identical as the mutually matched mode of detection module 30,
It is repeated no more in this.
Referring to Fig. 8, the schematic diagram of another embodiment of its detection system for being shown as wafer cassette of the invention.Below only
Detecting the present embodiment is illustrated with previous embodiment maximum difference, remaining explanation please refers to previous embodiment, not in this
It repeats again.As shown in figure 8, the present embodiment and previous embodiment it is maximum the difference is that, the right side to detect wafer cassette B is pre-
Three groups of detection modules 30 of P1 are set in positioning, three receiving units 31 for being included can be the X-direction substantially in figure that
This compartment of terrain is arranged side by side, and three transmitting units 32 that three groups of detection modules 30 are included then can be the Y substantially in figure
Axis direction is arranged side by side at each interval, also that is, three receiving units 31 and three transmitting units 32 can be respectively along substantially
Orthogonal two axial lines are arranged side by side, and whereby, detection module 30 will can be made to have bigger detection range.Certainly, in difference
Application in, three receiving units 31 and three transmitting units 32 are also possible to be arranged side by side along Y-axis and X-direction respectively, no
It is confined to mode depicted in figure.About the quantity of receiving unit 31 and transmitting unit 32 also not to be limited as shown in the figure, and
The quantity of receiving unit 31 and transmitting unit 32 is not necessarily intended to identical.Three groups of detection modules 30 are only shown in figure, to wafer cassette B's
Right side predetermined position P1 is detected, and but not limited to this, the detection mould detected to the left side predetermined position P2 of wafer cassette B
Block 30, the receiving unit 31 and transmitting unit 32 for being included equally be also possible in scheme it is depicted in a manner of carry out arrangement and set
It sets.
Referring to Fig. 9, its flow diagram for the detection method of wafer cassette of the invention.The detection method of this wafer cassette
To be detected at least predetermined position to a wafer cassette, the predetermined position to be arranged an auxiliary part (such as
Grip structure above-mentioned or relevant snap-in structure etc.), the detection method of the wafer cassette comprises the steps of:
Detecting step S1: being detected using predetermined position of multiple detection modules to wafer cassette, and utilizes a processing mould
The testing result of multiple detection modules is converted to multiple detection numerical value by block；Wherein, two detection modules being disposed adjacent to each other,
The part of its detection range is overlapped；And
Judgment step S2: by processing module according to multiple detection numerical value, judge whether the predetermined position of wafer cassette is arranged
There is auxiliary part；Wherein, when the detection numerical value that processing module judgement is greater than half falls in one first predetermined value section, processing
Module then determines that the predetermined position of wafer cassette is provided with auxiliary part；When the detection numerical value that processing module judgement is greater than half is fallen in
When one second predetermined value section, processing module then determines that the predetermined position of wafer cassette is not provided with auxiliary part.
In practical applications, in the judgment step S2 of Yu Shangshu, when processing module judgement is greater than the detection numerical value of half not
When falling in the first predetermined value section or the second predetermined value section, processing module then can be judgement detection failure, handle mould
Block then can be the multiple detection modules of control and execute detecting step S1 again.Either processing module does not execute detecting step again
S1, but corresponding control alarm unit, to warn associated user detection failure.When processing module repeatedly controls detection module
After executing detecting step S1, processing module still judges that the detection numerical value greater than half does not fall within the first predetermined value section or second
When predetermined value section, processing module, which then can be, determines that problem may occur at least one detection module, and post-processing module
It can be according to demand, it is corresponding to control relevant alarm unit, to warn those detection modules of user that problem may occur.
In a preferred application, in Yu Shangshu detecting step S1, processing module turns the testing result of multiple detection modules
During being changed to multiple detection numerical value, processing module, which can be, first carries out a standardization to the testing result of multiple detection modules
Operation, then reconvert goes out multiple detection numerical value, and the normalizing operation is identical as previous embodiment, repeats no more in this.
Referring to Fig. 10, its flow diagram for another embodiment of the detection method of wafer cassette of the invention.Such as figure
Shown, the detection method of the wafer cassette of the detection method and previous embodiment of the wafer cassette of the present embodiment, maximum difference is,
Before executing detecting step S1, it can also comprise the steps of:
Information acquiring step S10: a data obtaining module is utilized, a predetermined information of wafer cassette is obtained.Then, in judgement
In step S2, processing module then be can be according to predetermined information and multiple detection numerical value, judge the predetermined position of wafer cassette
Whether auxiliary part is provided with.About data obtaining module and the relevant information processing mode of processing module, with aforementioned wafer cassette
Detection system embodiment it is identical, repeated no more in this.
It illustrates, the embodiment of the detection method of both of the aforesaid wafer cassette, preferably can be and utilize aforementioned crystalline substance
Justify the detection system of box to execute, but not limited to this.
Claims (14)
1. a kind of detection method of wafer cassette, which is characterized in that the detection method of the wafer cassette to a wafer cassette extremely
A few predetermined position is detected, and the predetermined position includes an auxiliary part, the detection method of the wafer cassette is arranged
Following steps:
One detecting step: detecting the predetermined position using multiple detection modules, and will be multiple using a processing module
The testing result of the detection module is converted to multiple detection numerical value；Wherein, two detection modules being disposed adjacent to each other,
The part of its detection range is overlapped；And
One judgment step: by the processing module according to multiple detection numerical value, judge the described predetermined of the wafer cassette
Whether position is provided with the auxiliary part；Wherein, when the detection numerical value that processing module judgement is greater than half is fallen in
When one first predetermined value section, the processing module then determines that the predetermined position is provided with the auxiliary part；When described
When the detection numerical value that processing module judgement is greater than half falls in one second predetermined value section, the processing module then determines
The predetermined position is not provided with the auxiliary part.
2. the detection method of wafer cassette according to claim 1, which is characterized in that in Yu Suoshu judgment step, when described
The detection numerical value that processing module judgement is greater than half does not fall within first predetermined value section or second predetermined number
When being worth section, the processing module then determines detection failure, and the processing module then selectively controls multiple detection modules again
It is secondary to execute the detecting step.
3. the detection method of wafer cassette according to claim 1, which is characterized in that in Yu Suoshu detecting step, Duo Gesuo
The multiple detection signals of generation will be corresponded to by stating after detection module detects the predetermined position, and the processing module receives multiple inspections
After surveying signal, can by one normalizing operation of multiple detection signals progress so that multiple detection signals be converted to it is multiple
The detection numerical value.
4. the detection method of wafer cassette according to claim 3, which is characterized in that described in Yu Suoshu normalizing operation
Processing module is after multiple detection signals are first converted to multiple initial values, then according to one first numerical value and one second number
Value, and using a standardization formula, the initial value is converted into the detection numerical value, the standardization formula is as follows:
5. the detection method of wafer cassette according to claim 1, which is characterized in that also include before Yu Suoshu detecting step
One information acquiring step: a data obtaining module is utilized, a predetermined information of the wafer cassette is obtained；In the judgment step
In, the processing module according to the predetermined information and
Multiple detection numerical value, judge whether the predetermined position of the wafer cassette is provided with the auxiliary part.
6. a kind of detection system of wafer cassette, which is characterized in that the detection system of the wafer cassette to a wafer cassette extremely
A few predetermined position is detected, and an auxiliary part is arranged, the detection system of the wafer cassette includes in the predetermined position:
One microscope carrier, to carry the wafer cassette；
Multiple detection modules can respectively detect the predetermined position, and two be disposed adjacent to each other the detection
The part of the detection range of module is overlapped；
One processing module is electrically connected multiple detection modules, and the processing module can be by multiple detection modules
Institute's testing result is converted to multiple detection numerical value, and the processing module can be according to multiple detection numerical value, described in judgement
The predetermined position of wafer cassette, if be provided with the auxiliary part；
Wherein, when the detection numerical value that processing module judgement is greater than half falls in one first predetermined value section, institute
Stating processing module, then the corresponding predetermined position for determining the wafer cassette is provided with the auxiliary part；When the processing module
When the detection numerical value that judgement is greater than half falls in one second predetermined value section, the processing module is then described in corresponding judgement
The predetermined position of wafer cassette is not provided with the auxiliary part.
7. the detection system of wafer cassette according to claim 6, which is characterized in that when processing module judgement is greater than one
When the half detection numerical value does not fall within first predetermined value section or the second predetermined value section, the processing mould
Block then determines at least one described detection module detection failure, and the processing module then selectively controls multiple detection moulds
Block again detects the predetermined position.
8. the detection system of wafer cassette according to claim 6, which is characterized in that the detection system of the wafer cassette is also wrapped
Containing multiple auxiliary detection modules, each auxiliary detection module is electrically connected the processing module, each auxiliary inspection
Another predetermined position of the wafer cassette can be detected by surveying module；The processing module can be detected according to each auxiliary
The testing result of module, judges whether another predetermined position of the wafer cassette is provided with the auxiliary part.
9. the detection system of wafer cassette according to claim 8, which is characterized in that the detection system of the wafer cassette is also wrapped
Containing a data obtaining module, a predetermined information of the wafer cassette can be obtained, and corresponding generation one obtains information, the letter
Breath obtains module and is electrically connected the processing module, and the processing module can receive the acquisition information, and according to the acquisition
It is described to judge whether the predetermined position is provided with to the testing result in the predetermined position for information and multiple detection modules
Auxiliary part.
10. the detection system of wafer cassette according to claim 9, which is characterized in that the processing module can be according to described in
Information is obtained, more prestored informations stored by a storage element are searched, and the processing module can be according to wherein described in one
Prestored information and multiple detection modules judge whether the predetermined position is arranged to the testing result in the predetermined position
There is the auxiliary part.
11. the detection system of wafer cassette according to claim 6, which is characterized in that multiple detection modules detect institute
The multiple detection signals of generation will be corresponded to after stating predetermined position, after the processing module receives multiple detection signals, energy will be more
A detection signal carries out a normalizing operation, so that multiple detection signals are converted to multiple detection numerical value.
12. the detection system of wafer cassette according to claim 11, which is characterized in that in Yu Suoshu normalizing operation, institute
Stating processing module is after multiple detection signals are first converted to multiple initial values, then according to one first numerical value and one second
Numerical value, and using a standardization formula, the initial value is converted into the detection numerical value, the standardization formula is as follows
13. the detection system of wafer cassette according to claim 6, which is characterized in that each detection module includes more
A transmitting unit and multiple receiving units, multiple transmitting units are set to the microscope carrier, and multiple receiving units are corresponding
Positioned at the top in the predetermined position, light beam that multiple receiving units are issued to receive multiple transmitting units；Wherein,
Multiple transmitting units are arranged side by side at each interval along an axis, and multiple receiving units are spaced each other along another axis
Ground is arranged side by side.
14. a kind of detection method of wafer cassette, which is characterized in that the detection method of the wafer cassette to a wafer cassette extremely
A few predetermined position is detected, and the predetermined position includes an auxiliary part, the detection method of the wafer cassette is arranged
Following steps:
A kind of detection system of wafer cassette according to claim 7 is provided；
Multiple detection modules are controlled using the processing module to detect the predetermined position, and utilize the processing
The testing result of multiple detection modules is converted to multiple detection numerical value by module；And
Make the processing module according to multiple detection numerical value, judges whether the predetermined position of the wafer cassette is provided with
The auxiliary part；Wherein, when the detection numerical value that processing module judgement is greater than half falls in one first predetermined value
When section, the processing module then determines that the predetermined position is provided with the auxiliary part；When processing module judgement is big
When the detection numerical value of half falls in one second predetermined value section, the processing module then determines that the predetermined position does not have
There is the setting auxiliary part.
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| TW106138999 | 2017-11-10 | ||
| TW106138999A TWI638415B (en) | 2017-11-10 | 2017-11-10 | A detection method of wafer shipping box and detection system of wafer shipping box |
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| CN114121737A (en) * | 2020-08-28 | 2022-03-01 | 中微半导体设备(上海)股份有限公司 | Wafer box device, machine table and wafer detection method |
| TWI773187B (en) * | 2021-03-12 | 2022-08-01 | 旭東機械工業股份有限公司 | Method and system for inspecting a wafer cassette |
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| JP2009014510A (en) * | 2007-07-04 | 2009-01-22 | Hitachi High-Technologies Corp | Inspection method and inspection apparatus |
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| KR100567763B1 (en) * | 2003-08-14 | 2006-04-05 | 동부아남반도체 주식회사 | Method and system for transporting wafer cassette |
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| CN109767999B (en) | 2021-03-02 |
| TWI638415B (en) | 2018-10-11 |
| TW201919135A (en) | 2019-05-16 |
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