CN114106509A - High-strength electromagnetic shielding phenolic molding plastic - Google Patents
High-strength electromagnetic shielding phenolic molding plastic Download PDFInfo
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- CN114106509A CN114106509A CN202111487547.5A CN202111487547A CN114106509A CN 114106509 A CN114106509 A CN 114106509A CN 202111487547 A CN202111487547 A CN 202111487547A CN 114106509 A CN114106509 A CN 114106509A
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- 238000000465 moulding Methods 0.000 title claims abstract description 25
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 239000004033 plastic Substances 0.000 title claims abstract description 6
- 229920003023 plastic Polymers 0.000 title claims abstract description 6
- 241000209094 Oryza Species 0.000 claims abstract description 23
- 235000007164 Oryza sativa Nutrition 0.000 claims abstract description 23
- 235000009566 rice Nutrition 0.000 claims abstract description 23
- 239000010903 husk Substances 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 9
- 239000005011 phenolic resin Substances 0.000 claims abstract description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000003086 colorant Substances 0.000 claims abstract description 6
- 239000012766 organic filler Substances 0.000 claims abstract description 6
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 5
- WTFXARWRTYJXII-UHFFFAOYSA-N iron(2+);iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[Fe+2].[Fe+3].[Fe+3] WTFXARWRTYJXII-UHFFFAOYSA-N 0.000 claims abstract description 4
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 51
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 38
- 238000006243 chemical reaction Methods 0.000 claims description 27
- 239000000706 filtrate Substances 0.000 claims description 27
- 238000001035 drying Methods 0.000 claims description 22
- 150000001875 compounds Chemical class 0.000 claims description 19
- 239000007864 aqueous solution Substances 0.000 claims description 13
- 230000035484 reaction time Effects 0.000 claims description 12
- 239000007787 solid Substances 0.000 claims description 8
- 238000005406 washing Methods 0.000 claims description 8
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 238000000967 suction filtration Methods 0.000 claims description 5
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical group C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 4
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 claims description 4
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 claims description 2
- 235000013539 calcium stearate Nutrition 0.000 claims description 2
- 239000008116 calcium stearate Substances 0.000 claims description 2
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims description 2
- 239000004312 hexamethylene tetramine Substances 0.000 claims description 2
- 235000019359 magnesium stearate Nutrition 0.000 claims description 2
- 229920003986 novolac Polymers 0.000 claims description 2
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 14
- 230000008901 benefit Effects 0.000 abstract description 4
- 239000002131 composite material Substances 0.000 abstract description 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000005416 organic matter Substances 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003677 Sheet moulding compound Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000011357 graphitized carbon fiber Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2272—Ferric oxide (Fe2O3)
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/04—Antistatic
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Materials Engineering (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A high-strength electromagnetic shielding phenolic molding plastic belongs to the technical field of thermosetting molding plastic. The composite material is prepared from the following raw materials in parts by weight: 20-30 parts of phenolic resin; 4-6 parts of a curing agent; 1-2 parts of a release agent; 2-5 parts of a coloring agent; 60-70 parts of organic filler. The advantages are that: the overall strength of the material is improved; the high filling of the organic nano biochar prepared from the rice husks can obviously enhance the conductivity of the material, obviously improve the electromagnetic shielding capability of the material and enhance the electromagnetic shielding capability of the material; the rice hull is a renewable resource, so that the economy is embodied, and the environmental protection is well realized; the use of the colorants black iron oxide and conductive carbon black having conductivity can stabilize the appearance color of the material and improve the electromagnetic shielding ability.
Description
Technical Field
The invention belongs to the technical field of thermosetting molding compounds, and particularly relates to a high-strength electromagnetic shielding phenolic molding compound.
Background
As known in the art, when an electric current flows through an electronic product, an electric field, a magnetic field, and an electromagnetic field with different frequencies and magnitudes (i.e., strengths) are generated. Such as televisions, air conditioners, refrigerators, induction cookers, washing machines, audio components, computers, electric blankets and even lamps, etc., mainly generate low-frequency electromagnetic fields during use; mobile phones, microwave ovens, WiFi, etc. may generate high frequency electromagnetic radiation, thereby causing electromagnetic wave pollution which is ubiquitous and affects human health, and restricting the expansion of its use to some extent, for example, it is difficult to meet the use requirements of high-end electronic devices, new energy electric vehicle battery cases, invisible materials, etc., so how to shield electromagnetic wave radiation well becomes a hotspot of research. It is advantageous to use a metal material having good conductivity such as copper, nickel, etc. to shield electromagnetic waves, but such a material has disadvantages of large specific gravity, poor workability, and susceptibility to corrosion. Although measures for shielding electromagnetic waves by using a filled conductive composite material such as carbon nanotubes, graphene, carbon fibers, and the like, which are commonly used at present, as a filler, have undeniable advantages, the measures have the aforementioned disadvantages that are difficult to overcome or even impossible to overcome due to high cost and dependence on non-renewable petroleum resources as raw materials.
In the published Chinese patent literature, it can be seen that technical information related to electromagnetic shielding molding compounds, such as CN102675848A recommends "an electromagnetic shielding carbon fiber reinforced sheet molding compound, its preparation method and application", the raw materials and the weight parts ratio thereof are: 60-100 parts of matrix resin (unsaturated polyester or vinyl resin), 30-100 parts of graphitized carbon fiber, 30-50 parts of low shrinkage agent, 2-10 parts of wave absorbing agent, 130-320 parts of inorganic mineral filler, 1-4 parts of curing agent, 1-5 parts of thickening agent and 2-10 parts of other components. For another example, CN108707325A provides "an anti-electromagnetic interference polyester molding compound, its preparation method and use", which comprises the following raw materials in parts by weight: 50-60 parts of polyester resin, 40-50 parts of low-shrinkage additive, 20-30 parts of glass fiber, 5-10 parts of superfine aluminum powder, 1-1.5 parts of initiator and 4-5 parts of release agent. Further, as introduced in CN109334190B, "an electromagnetic shielding sheet molding compound and a preparation method thereof" are provided, which comprise the following raw materials in parts by weight: 45-60 parts of unsaturated polyester resin, 30-40 parts of low shrinkage agent, 130 parts of filler 110-70 parts of glass fiber, 1.5-2 parts of thickening agent, 0.1-0.2 part of carbon nano tube, 0.1-0.5 part of vinyl silane coupling agent and 1-1.5 parts of initiator.
Common features of the electromagnetic shielding molding compound, which are not limited to the above examples, are: the selection of a plurality of raw materials easily causes the difficulty in grasping or controlling the elements of the preparation process to be increased, and the quality stability of the product is not enough; polyester resins are used as a binder, and the polyester resins are inferior to phenol resins in heat resistance, dimensional stability, and the like, and phenol resins have a remarkable advantage in processability as compared with metal materials, and particularly, can make the materials lighter. However, the phenolic molding compound product does not have the electromagnetic shielding function, so that if the phenolic molding compound has the electromagnetic shielding effect through reasonable combination of the raw materials, the phenolic molding compound is a positive benefit, and the technical scheme to be described below is generated in the background.
Disclosure of Invention
The invention aims to provide an electromagnetic shielding phenolic molding compound which has excellent electromagnetic shielding performance, is convenient to ensure good mechanical strength, is beneficial to embodying economy and low price, is beneficial to simplifying the preparation process and embodying high strength and is friendly to the environment.
The invention aims to solve the problem that the high-strength electromagnetic shielding phenolic molding plastic is prepared from the following raw materials in parts by weight:
in a specific embodiment of the invention, the phenolic resin is an acid-catalyzed graphite-modified phenolic novolac resin.
In another specific embodiment of the present invention, the curing agent is hexamethylenetetramine; the release agent is any one or a combination of magnesium stearate, calcium stearate and zinc stearate.
In yet another specific embodiment of the present invention, the colorant is black iron oxide and/or conductive carbon black.
In another specific embodiment of the present invention, the organic filler is organic nano biochar.
In still another specific embodiment of the present invention, the organic nano biochar is prepared by placing cleaned rice husks into an oven for drying, adding a prepared sulfuric acid aqueous solution, controlling a mass ratio of the sulfuric acid aqueous solution to the rice husks, placing into a water bath for reaction, controlling a water bath reaction temperature and controlling a water bath reaction time, removing residues and collecting a filtrate after the reaction is finished, adding deionized water into the filtrate until a concentration ratio of sulfuric acid to water in the filtrate is 1: 1-2 to obtain a diluted filtrate, introducing the diluted filtrate into a water bath pot for reaction, performing suction filtration after the reaction is finished to obtain a black solid, washing with water, and drying to obtain the organic nano biochar, wherein the particle size of the organic nano biochar is 100 nm.
In a more specific embodiment of the present invention, the drying temperature of the rice husk placed in the drying oven is 100-120 ℃, and the rice husk is dried until the moisture content is less than 0.7%.
In still another specific embodiment of the present invention, the mass ratio of the aqueous sulfuric acid solution to the rice husk is controlled to be 5-15: 1; the mass percentage concentration of the sulfuric acid aqueous solution is 0.65-0.75%, the water bath reaction temperature is controlled to be 80-90 ℃, and the water bath reaction time is controlled to be 30-60 min.
In still more specific embodiment of the present invention, the diluted filtrate is introduced into the bath for reaction at a reaction temperature of 90-95 ℃ for a reaction time of 300-420 min.
In yet another specific embodiment of the present invention, the device for drying after washing is an oven, and the drying temperature is 130-.
The technical scheme provided by the invention has the technical effects that: because the organic nano biochar with the grain diameter of 100nm prepared by rice husks is used as the organic filler, in the kneading process of the organic filler and the phenolic resin, the phenolic resin flows into the porous structure of the biochar to form a large amount of van der Waals force and mechanical engagement force, thereby improving the overall strength of the material; the high filling of the organic nano biochar prepared from the rice husks can obviously enhance the conductivity of the material and obviously improve the electromagnetic shielding capability of the material, because the biochar in the material is relatively compact due to the addition of a large amount of conductive biochar to form a tunnel effect, so that the electromagnetic shielding capability of the material can be enhanced; the rice hulls are renewable resources and replace non-renewable petrochemical fillers such as carbon nanotubes, graphene, carbon fibers and the like, so that the economy can be embodied, and the environment can be well protected; the use of the colorants black iron oxide and conductive carbon black having conductivity can stabilize the appearance color of the material and improve the electromagnetic shielding ability.
Detailed Description
Example 1:
the following mixture ratio is carried out according to the parts by weight:
the organic matter nano biochar in the embodiment is prepared by putting cleaned rice shells into an oven to be dried at the drying temperature of the oven of 100 ℃ until the water content is 0.7%, then adding a prepared sulfuric acid aqueous solution with the mass percentage concentration of 0.65% and controlling the mass ratio of the sulfuric acid aqueous solution to the rice shells to be 5: 1, putting the rice shells into a water bath to react, controlling the water bath reaction temperature to be 90 ℃, controlling the water bath reaction time to be 30min, removing residues and collecting filtrate after the reaction is finished, then adding deionized water into the filtrate until the concentration ratio of sulfuric acid to water in the filtrate is 1: 1 to obtain diluted filtrate, finally introducing the diluted filtrate into a water bath kettle to react, controlling the reaction temperature in the water bath kettle to be 90 ℃ and the reaction time in the water bath kettle to be 420min, after the reaction is finished, performing suction filtration through a sand core funnel to obtain black solid, then putting the black solid into a drying device serving as the oven to be dried at the drying temperature of 140 ℃ until the water content is 0.4% after the water washing is finished, obtaining the organic nano biochar with the particle size of 100 nm.
Example 2:
the following mixture ratio is carried out according to the parts by weight:
the organic matter nano biochar in the embodiment is prepared by putting cleaned rice husks into an oven to be dried at the drying temperature of 120 ℃ until the water content is 0.1%, then adding a prepared sulfuric acid aqueous solution with the mass percentage concentration of 0.75% and controlling the mass ratio of the sulfuric acid aqueous solution to the rice husks to be 15: 1, putting the rice husks into a water bath to react, controlling the water bath reaction temperature to be 80 ℃, controlling the water bath reaction time to be 60min, removing residues and collecting filtrate after the reaction is finished, then adding deionized water into the filtrate until the concentration ratio of sulfuric acid to water in the filtrate is 1: 2 to obtain diluted filtrate, finally introducing the diluted filtrate into a water bath kettle to react, controlling the reaction temperature in the water bath kettle to be 95 ℃ and the reaction time in the water bath kettle to be 300min, after the reaction is finished, performing suction filtration through a sand core funnel to obtain black solids, then putting the black solids into a drying device serving as an oven to be dried at 135 ℃ until the water content is 0.15% after water washing, obtaining the organic nano biochar with the particle size of 100 nm.
Example 3:
the following mixture ratio is carried out according to the parts by weight:
the organic matter nano biochar in the embodiment is prepared by putting cleaned rice shells into an oven to be dried at the drying temperature of 110 ℃ until the water content is 0.4%, then adding a prepared sulfuric acid aqueous solution with the mass percentage concentration of 0.7% and controlling the mass ratio of the sulfuric acid aqueous solution to the rice shells to be 10: 1, putting the rice shells into a water bath to react, controlling the water bath reaction temperature to be 85 ℃, controlling the water bath reaction time to be 45min, removing residues and collecting filtrate after the reaction is finished, then adding deionized water into the filtrate until the concentration ratio of sulfuric acid to water in the filtrate is 1: 1.5, obtaining diluted filtrate, finally introducing the diluted filtrate into the water bath to react, controlling the reaction temperature in the water bath to be 92 ℃ and the reaction time in the water bath to be 360min, after the reaction is finished, performing suction filtration through a sand core funnel to obtain a black solid, then putting the black solid into a drying device serving as an oven to be dried at the drying temperature of 130 ℃ until the water content is 0.3% after water washing, obtaining the organic nano biochar with the particle size of 100 nm.
The strength and electromagnetic shielding performance indexes of the high-strength electromagnetic shielding phenolic molding compound obtained in the above examples 1 to 3 are shown in the following table:
| test items | Example 1 | Example 2 | Example 3 |
| Tensile strength MPa | 42 | 44 | 45 |
| Bending strength MPa | 85 | 85 | 86 |
| Impact strength (gap) kJ/m of simply supported beam2 | 2.0 | 2.1 | 2.1 |
| Surface resistance omega/m2 | <10 | <8 | <7 |
| 300MHz electromagnetic shielding efficiency dB | >38 | >43 | >49 |
| 1500MHz electromagnetic shielding efficiency dB | >38 | >45 | >51 |
Claims (10)
1. The high-strength electromagnetic shielding phenolic molding plastic is characterized by comprising the following raw materials in parts by weight:
20-30 parts of phenolic resin;
4-6 parts of a curing agent;
1-2 parts of a release agent;
2-5 parts of a coloring agent;
60-70 parts of organic filler.
2. The high strength, electromagnetically shielding phenolic molding compound as claimed in claim 1, wherein said phenolic resin is an acid-catalyzed graphite-modified phenolic novolac resin.
3. The high strength electromagnetic shielding phenolic molding compound as claimed in claim 1, wherein the curing agent is hexamethylenetetramine; the release agent is any one or a combination of magnesium stearate, calcium stearate and zinc stearate.
4. The high strength electromagnetic shielding phenolic molding compound as claimed in claim 1, wherein said colorant is black iron oxide and/or conductive carbon black.
5. The high strength electromagnetic shielding phenolic molding compound as claimed in claim 1, wherein the organic filler is organic nano biochar.
6. The high-strength electromagnetic shielding phenolic molding compound as claimed in claim 5, wherein the organic nano biochar is prepared by placing cleaned rice husks into an oven for drying, adding a prepared sulfuric acid aqueous solution, controlling the mass ratio of the sulfuric acid aqueous solution to the rice husks, placing into a water bath for reaction, controlling the water bath reaction temperature and the water bath reaction time, removing residues and collecting filtrate after the reaction is finished, adding deionized water into the filtrate until the concentration ratio of sulfuric acid to water in the filtrate is 1: 1-2 to obtain a diluted filtrate, introducing the diluted filtrate into a water bath kettle for reaction, obtaining black solids by suction filtration after the reaction is finished, washing with water, and drying to obtain the organic nano biochar, wherein the particle size of the organic nano biochar is 100 nm.
7. The high-strength electromagnetic shielding phenolic molding compound as claimed in claim 6, wherein the drying temperature of the rice husk after being put into an oven for drying is 100-120 ℃, and the drying is carried out until the moisture content is less than 0.7%.
8. The high-strength electromagnetic shielding phenolic molding compound as claimed in claim 6, wherein the mass ratio of said sulfuric acid aqueous solution to said rice husks is controlled to be 5-15: 1; the mass percentage concentration of the sulfuric acid aqueous solution is 0.65-0.75%, the water bath reaction temperature is controlled to be 80-90 ℃, and the water bath reaction time is controlled to be 30-60 min.
9. The high-strength electromagnetic shielding phenolic molding compound as claimed in claim 6, wherein the reaction temperature of the diluted filtrate introduced into the bath kettle is 90-95 ℃ and the reaction time is 300-420 min.
10. The high-strength electromagnetic shielding phenolic molding compound as claimed in claim 6, wherein the device for drying after washing is an oven, and the drying temperature is 130 ℃ and 140 ℃, and the drying is carried out until the moisture content is less than 0.4%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111487547.5A CN114106509A (en) | 2021-12-08 | 2021-12-08 | High-strength electromagnetic shielding phenolic molding plastic |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111487547.5A CN114106509A (en) | 2021-12-08 | 2021-12-08 | High-strength electromagnetic shielding phenolic molding plastic |
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| CN114106509A true CN114106509A (en) | 2022-03-01 |
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| CN202111487547.5A Pending CN114106509A (en) | 2021-12-08 | 2021-12-08 | High-strength electromagnetic shielding phenolic molding plastic |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1443036A (en) * | 2003-03-25 | 2003-09-17 | 浙江林学院 | Electro magnetic shielding carbon base plate and its manufacturing method |
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